A high-power light source packaging structure and a manufacturing method thereof

Abstract

The present application relates to the technical field of semiconductor light sources, and provides a high-power light source packaging structure and a manufacturing method thereof. The high-power light source packaging structure includes a substrate, a metal block device, a light-emitting chip, and a packaging cover; the metal block device has a main block and a mounting block, and a plurality of mounting surfaces are provided on the peripheral side of the mounting block. Each light-emitting chip is fixed on each mounting surface, and the light-emitting directions of each light-emitting chip are the same; the packaging cover is arranged on the substrate and covers the metal block device and the plurality of light-emitting chips. The packaging cover has a light-transmitting member, and the light-transmitting member is located on the light-emitting path of each light-emitting chip. A first conductive sheet and a second conductive sheet are spaced on the lower surface of the substrate, and both the first conductive sheet and the second conductive sheet are electrically connected to the metal block device. By providing a metal block device with a plurality of mounting surfaces on the substrate, a plurality of light-emitting chips can be arranged simultaneously to improve the power, and the metal block device can also improve the heat dissipation effect, so that the high-power light source packaging structure has the advantages of high power and good heat dissipation effect.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor light sources. More specifically, it relates to a high-power light source packaging structure and a manufacturing method thereof. Background Art

[0002] A light emitting diode (LED) is a solid-state semiconductor device that can convert electrical energy into visible light. LED light sources are widely used because of their advantages such as using a low-voltage power supply, low energy consumption, long service life, and high stability. For example, in miniature products such as micro projectors or micro car lights, high-power LED light sources or high-power laser light sources are used. Among them, high-power LED light sources require large-size light-emitting chips, and the radiation power can only reach 5-8W. Moreover, in miniature products, the space is small, and it is inconvenient and costly to dissipate heat from high-power LED light sources, or the heat dissipation effect is not good, which affects the service life of miniature products. The laser light source uses a TO-CAN package with a power of 3-5W. On the one hand, the power is small. On the other hand, the TO-CAN package is a plug-in device, and its heat dissipation method can only dissipate heat by soldering the positive and negative leads to the circuit board after plugging them in. The heat dissipation area is small. At the same time, if the leads are not accurately docked during plugging, it is easy to cause bending and other phenomena, which affects the assembly efficiency. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a high-power light source packaging structure to solve the technical problems of poor heat dissipation effect and small power of the light source package in the prior art for miniature products.

[0004] To achieve the above purpose, the technical solution adopted in this application is: to provide a high-power light source packaging structure, including:

[0005] A substrate;

[0006] A metal block device disposed on the upper surface of the substrate. The metal block device has a main block and a mounting block. The mounting block is fixed on one side of the main block, and a plurality of mounting surfaces are provided on the periphery of the mounting block;

[0007] A plurality of light-emitting chips, each of the light-emitting chips is fixed on each of the mounting surfaces and electrically connected to the metal block device, and the light-emitting directions of each of the light-emitting chips are the same; and,

[0008] A packaging cover disposed on the substrate and covering the metal block device and the plurality of light-emitting chips. The packaging cover has a light-transmitting member. The light-transmitting member is located on the light-emitting path of each of the light-emitting chips. A first conductive sheet and a second conductive sheet are spaced apart on the lower surface of the substrate. Both the first conductive sheet and the second conductive sheet are electrically connected to the metal block device.

[0009] In one embodiment, the metal block device is a copper block device.

[0010] In one embodiment, the main block is disposed on the substrate, and the substrate is a ceramic substrate.

[0011] In one embodiment, the mounting block is a regular prism.

[0012] In one embodiment, the encapsulation cover is a metal cover or a glass cover.

[0013] In one embodiment, the encapsulation cover is a rectangular cover, the encapsulation cover includes four side plates and a top plate that are connected to each other and enclose a cavity, and the light-transmitting member is one of the four side plates.

[0014] In one embodiment, the light-transmitting member includes a convex lens, and the convex lens is located on the light-emitting path of each of the light-emitting chips.

[0015] In one embodiment, the metal block device has metal pole pieces, a plurality of the light-emitting chips are electrically connected to the metal pole pieces, the metal pole pieces extend to the bottom surface of the main block, a third conductive sheet and a fourth conductive sheet that are electrically connected to the metal pole pieces are provided on the upper surface of the substrate, the third conductive sheet is electrically connected to the first conductive sheet, and the fourth conductive sheet is electrically connected to the second conductive sheet.

[0016] In one embodiment, an installation groove for installing the encapsulation cover is provided on the upper surface of the substrate.

[0017] Another object of the present application is to provide a manufacturing method for a high-power light source packaging structure, including the following steps:

[0018] S1. Fabricate the encapsulation cover, the substrate, and the metal block device; a light-transmitting member is provided on the encapsulation cover, a first conductive sheet and a second conductive sheet are provided on the substrate, and a plurality of installation surfaces are provided on the metal block device;

[0019] S2. Fix a plurality of light-emitting chips on each of the installation surfaces and electrically connect them to the metal block device, and make the light-emitting directions of the light-emitting chips the same;

[0020] S3. Fix the metal block device on the substrate and electrically connect the metal block device to both the first conductive sheet and the second conductive sheet;

[0021] S4. Fix the encapsulation cover on the substrate to cover the metal block device and the plurality of light-emitting chips, and make the light-transmitting member located on the light-emitting path of each of the light-emitting chips.

[0022] The beneficial effects of a high-power light source packaging structure and its manufacturing method provided by this application are as follows: By setting a metal block device on the substrate, and there are multiple mounting surfaces on the mounting block of the metal block device, so that multiple light-emitting chips with the same light-emitting direction can be set simultaneously to increase the power. At the same time, the metal block device can also improve the heat dissipation effect. The first conductive sheet and the second conductive sheet arranged on the lower surface of the substrate can realize the automatic fitting and welding of the high-power light source packaging structure on the circuit board through the surface mount technology process, improving the assembly quality and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a schematic diagram of the oblique top-down exploded structure of the high-power light source packaging structure provided by the embodiment of this application;

[0025] Figure 2 It is a schematic diagram of the oblique bottom-up exploded structure of the high-power light source packaging structure provided by the embodiment of this application;

[0026] Figure 3 It is a schematic diagram of the structure of the metal block device, the light-emitting chip and the substrate in the high-power light source packaging structure provided by the embodiment of this application;

[0027] Figure 4 It is a schematic diagram of the side view structure of the high-power light source packaging structure provided by the embodiment of this application where the mounting block is an equilateral triangle;

[0028] Figure 5 It is a schematic diagram of the side view structure of the high-power light source packaging structure provided by the embodiment of this application where the mounting block is a square;

[0029] Figure 6 It is a schematic diagram of the side view structure of the high-power light source packaging structure provided by the embodiment of this application where the mounting block is a regular pentagon;

[0030] Figure 7 It is a schematic diagram of the process flow of the manufacturing method of the high-power light source packaging structure provided by the embodiment of this application.

[0031] Among them, the reference numerals in the drawings are as follows:

[0032] 1. Substrate; 11. First conductive sheet; 12. Second conductive sheet; 13. Third conductive sheet; 14. Fourth conductive sheet; 15. Mounting groove; 2. Metal block device; 21. Main body block; 22. Mounting block; 221. Mounting surface; 23. Metal pole piece; 3. Light-emitting chip; 31. Light-emitting surface; 4. Encapsulation cover; 41. Translucent member; 42. Side plate; 43. Top plate. Detailed implementation manners

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0037] As Figures 1 - 3 shown, a high-power light source packaging structure provided by an embodiment of the present application will now be described. The high-power light source packaging structure includes a substrate 1, a metal block device 2, a plurality of light-emitting chips 3, and an encapsulation cover 4. Among them, the metal block device 2 is disposed on the upper surface of the substrate 1. Specifically, the metal block device 2 includes a main body block 21 and a mounting block 22. The main body block 21 is disposed on the substrate 1, the mounting block 22 is disposed on one side of the main body block 21, and a plurality of mounting surfaces 221 are provided on the periphery of the mounting block 22. Among them, the main body block 21 and the mounting block 22 are integrally formed or welded, and the main body block 21 is welded to the substrate 1.

[0038] Among them, the lower surface of the substrate 1 is provided with a first conductive sheet 11 and a second conductive sheet 12 that are both electrically connected to the metal block device 2 at intervals. The first conductive sheet 11 and the second conductive sheet 12 are respectively used for welding to the positive electrode pad and the negative electrode pad on the circuit board. The number of the multiple mounting surfaces 221 on the mounting block 22 is the same as the number of the multiple light-emitting chips 3. One light-emitting chip 3 is electrically connected and fixed on each mounting surface 221. Each light-emitting chip 3 is electrically connected to the metal block device 2. The light-emitting surfaces 31 of the light-emitting chips 3 are located on the same side of the metal block device 2 so that the light-emitting directions of the light-emitting chips 3 are the same. The light-emitting chip 3 can be an LED light source or a laser light source.

[0039] Among them, the encapsulation cover 4 is fixed on the upper surface of the substrate 1 and is used to cover the metal block device 2 and the multiple light-emitting chips 3 to protect the metal block device 2 and the light-emitting chips 3. The encapsulation cover 4 has a light-transmitting member 41. The light-transmitting member 41 is located on the light-emitting path of each light-emitting chip 3. The light-transmitting member 41 is used for the light of the light-emitting chip 3 to emit out of the encapsulation cover 4 to play a lighting role.

[0040] The high-power light source packaging structure provided by the embodiment of the present application, by arranging the metal block device 2 on the substrate 1, the mounting block 22 of the metal block device 2 has multiple mounting surfaces 221, so that multiple light-emitting chips 3 with the same light-emitting direction can be arranged at the same time to improve the power of the light source packaging structure. At the same time, the metal block device 2 can also improve the heat dissipation effect, making the high-power light source packaging structure have the advantages of large power and good heat dissipation effect. The first conductive sheet 11 and the second conductive sheet 12 arranged on the lower surface of the substrate 1 can realize the automatic bonding and welding of the high-power light source packaging structure on the circuit board through the Surface Mounted Technology (SMT) process, realizing the automatic assembly of the high-power packaging structure, thereby improving the production efficiency and assembly quality.

[0041] In this embodiment, the metal block device 2 is a copper block device, and the copper block device has the advantages of good electrical conductivity and good heat dissipation. In other embodiments, the metal block device 2 is an aluminum block device. As Figures 1 - 3 shown, metal pole pieces 23 are arranged on the metal block device 2. Each light-emitting chip 3 is electrically connected and fixed to the metal pole piece 23. The metal pole piece 23 extends from the mounting surface 221 to the bottom surface of the main body block 21. The metal pole piece 23 located on the bottom surface of the main body block 21 is used for electrically connecting to the first conductive sheet 11 and the second conductive sheet 12. Therefore, the role of the metal pole piece 23 is to electrically connect each light-emitting chip 3 to the first conductive sheet 11 and the second conductive sheet 12. The metal pole piece 23 is a copper sheet to ensure electrical conductivity.

[0042] As Figures 4 - 6 shown, in this embodiment, the mounting block 22 is a regular prism, and the side surface of the regular prism is the mounting surface 221. As Figure 4As shown, the mounting block 22 is a regular triangular prism. The regular triangular prism has three side faces, and the three side faces are three mounting surfaces 221. At this time, there are three of the plurality of light-emitting chips 3. As Figure 5 shown, the mounting block 22 is a regular quadrangular prism. The regular quadrangular prism has four mounting surfaces 221. At this time, there are four of the plurality of light-emitting chips 3. As Figure 6 shown, the mounting block 22 is a regular pentagonal prism. The regular pentagonal prism has five mounting surfaces 221. At this time, there are five of the plurality of light-emitting chips 3. Of course, the regular prism can also be a regular hexagonal prism, a regular octagonal prism, etc. The structure can be selected according to the usage amount of the light-emitting chips 3. In this embodiment, the light-emitting chips 3 can be one or a combination of edge-emitting laser light-emitting chips, red light-emitting chips, green light-emitting chips, blue light-emitting chips, or infrared light-emitting chips, so that the high-power light source packaging structure can emit light of various colors or functions. One side of the light-emitting chip 3 attached to the mounting surface 221 is provided with a positive electrode, and the side of the light-emitting chip 3 away from the positive electrode is provided with a negative electrode. The end face of the light-emitting chip 3 close to the light-transmitting member 41 is the light-emitting surface 31. The negative electrode is electrically connected to the metal electrode piece 23 through a gold wire, and the positive electrode is electrically connected to the metal electrode piece 23 by means of conductive adhesive bonding, soldering, or eutectic.

[0043] As Figures 1 - 3 shown, in this embodiment, the encapsulation cover 4 is a metal cover. The metal cover has the advantages of good heat dissipation effect and high structural strength, and can provide good protection and heat dissipation for the metal block device 2 and the light-emitting chips 3. Among them, the metal cover is made of aluminum material or steel material. In other embodiments, the encapsulation cover 4 is a glass cover, and the glass cover is made of K7 glass material or K9 glass material.

[0044] Specifically, the encapsulation cover 4 is a rectangular body cover, which has the advantage of simple manufacturing. The encapsulation cover 4 includes four side plates 42 and a top plate 43 that are connected to each other and enclose a cavity. The four side plates 42 and the top plate 43 are fixedly connected by stamping, welding, or bonding.

[0045] In one embodiment, the light-transmitting member is one of the four side plates 42. This serves as the light-transmitting member of the entire side plate 42. For example, it is made of a light-transmitting glass material and is joined to the adjacent side plate 42 and the top plate 43. Further, the light-transmitting member serving as the side plate includes a lens, and the lens is integrally formed on the light-transmitting member. The lens is located on the light-emitting path of each light-emitting chip 3 to adjust the light shape of the light emitted by the light-emitting chip 3.

[0046] As Figure 2As shown, in one embodiment, the light-transmitting member 41 is installed on the side plate 42. The light-transmitting member 41 is a lens, and the lens can be a convex lens, a concave lens, or a Nipkow lens. The lens is located on the light-emitting path of each light-emitting chip 3. The function of the lens is to adjust the light shape of the light emitted by the light-emitting chip 3, so that the light emitted by the high-power light source packaging structure can achieve different usage effects. In this embodiment, the light-transmitting member 41 is made of a glass material, specifically a fused quartz glass material. In this embodiment, a copper layer or a tin layer is provided on the surface of the light-transmitting member 41 for connecting to the side plate 42, so that the light-transmitting member 41 and the side plate 42 can be eutectically fixed, or the light-transmitting member 41 is fixed on the side plate 42 by an adhesive method. The side plate 42 is provided with a mounting hole for installing the light-transmitting member 41.

[0047] As Figures 1 - 3 shown, in this embodiment, a third conductive sheet 13 and a fourth conductive sheet 14 that are both electrically connected to the metal block device 2 are provided on the upper surface of the substrate 1. The third conductive sheet 13 is electrically connected to the first conductive sheet 11, and the fourth conductive sheet 14 is electrically connected to the second conductive sheet 12. Specifically, the third conductive sheet 13 and the fourth conductive sheet 14 are respectively electrically connected to the metal pole piece 23. Among them, the first conductive sheet 11, the second conductive sheet 12, the third conductive sheet 13, and the fourth conductive sheet 14 are all embedded in the substrate 1 when the substrate 1 is formed.

[0048] As Figure 1 and Figure 3 shown, a mounting groove 15 for installing the encapsulation cover 4 is provided on the upper surface of the substrate 1. One end of the encapsulation cover 4 is inserted into the mounting groove 15 and then fixedly connected to the substrate 1 by metal welding or glue bonding.

[0049] In this embodiment, the substrate 1 is any one of a ceramic substrate, a silicon carbide substrate, and a graphene substrate.

[0050] As Figure 7 shown, this embodiment also provides a manufacturing method for a high-power light source packaging structure. The manufacturing method is used to manufacture the high-power light source packaging structure described above. The manufacturing method specifically includes the following steps:

[0051] S1. Manufacture the encapsulation cover 4, the substrate 1, and the metal block device 2; among them, the encapsulation cover 4 is provided with a light-transmitting member 41, the substrate 1 is provided with a first conductive sheet 11 and a second conductive sheet 12, and the metal block device 2 is provided with a plurality of mounting surfaces 221;

[0052] S2. Fix and install the plurality of light-emitting chips 3 on the respective mounting surfaces 221 of the metal block device 2 and electrically connect them to the metal block device 2, and make the light-emitting directions of the respective light-emitting chips 3 the same;

[0053] S3. Fix the metal block device 2 on the substrate 1, and electrically connect the metal block device 2 to the first conductive sheet 11 and the second conductive sheet 12 evenly.

[0054] S4. Fix the encapsulation cover 4 on the substrate 1 to cover the metal block device 2 and the multiple light-emitting chips 3, and make the light-transmitting member 41 located on the light-emitting path of each light-emitting chip 3.

[0055] In the above step S1, the encapsulation cover 4 and the light-transmitting member 41 are fixed by eutectic or adhesive means. The light-transmitting member 41 is of a lens structure. The first conductive sheet 11 and the second metal conductive sheet are located on the lower surface of the substrate 1. A third conductive sheet 13 and a fourth conductive sheet 14 are provided on the upper surface of the substrate 1. Metal pole pieces 23 are arranged on the metal block device 2. The metal block device 2 includes a main body block 21 and a mounting block 22 integrally formed on one side of the main body block 21. Each mounting surface 221 is the peripheral side surface of the mounting block 22.

[0056] In the above step S2, the positive electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by means of conductive adhesive bonding, soldering or eutectic, and the negative electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by means of welding gold wires. The light-emitting side of the light-emitting chip 3 is located on the same side of the metal block device 2 to ensure the same light-emitting direction.

[0057] In the above step S3, the metal block device 2 is fixed on the substrate 1 by welding, so that the third conductive sheet 13 and the fourth conductive sheet 14 are respectively electrically connected to the metal pole pieces 23 on the metal block device 2. Its welding process includes eutectic process, solder paste and flux eutectic process.

[0058] In the above step S4, during the manufacturing process of the substrate 1, a mounting groove 15 is formed on the upper surface of the substrate 1. One end of the encapsulation cover 4 is inserted into the mounting groove 15 and then fixed on the substrate 1 by means of metal welding or dotting adhesive bonding.

[0059] The high-power light source packaging structure of the embodiment of the present application has the advantages of good heat dissipation effect and high power. At the same time, it can be automatically bonded and welded on the circuit board through the SMT process, realizing automation and improving the assembly quality and production efficiency.

[0060] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high-power light source packaging structure, characterized in that, Comprising: Substrate; A metal block device disposed on the upper surface of the substrate, the metal block device having a main body block and a mounting block, the mounting block being fixed to one side of the main body block, and at least two mounting surfaces being provided on the periphery of the mounting block; A plurality of light-emitting chips, each of the light-emitting chips being fixed to each of the mounting surfaces and electrically connected to the metal block device, the light-emitting directions of each of the light-emitting chips being the same, and the number of the mounting surfaces being the same as the number of the light-emitting chips; And, A packaging cover disposed on the substrate and covering the metal block device and the plurality of light-emitting chips, the packaging cover having a light-transmitting member, the light-transmitting member being located on the light-emitting path of each of the light-emitting chips, a first conductive sheet and a second conductive sheet being spaced apart on the lower surface of the substrate, both the first conductive sheet and the second conductive sheet being electrically connected to the metal block device, the first conductive sheet and the second conductive sheet being respectively used for connecting to a positive electrode pad and a negative electrode pad on a circuit board, and the light-transmitting member including one of a convex lens, a concave lens and a Nephel lens; The metal block device has metal pole pieces, each of the light-emitting chips being electrically connected and fixed to the metal pole pieces, the metal pole pieces extending from the mounting surfaces to the bottom surface of the main body block, a third conductive sheet and a fourth conductive sheet being provided on the upper surface of the substrate and both being electrically connected to the metal pole pieces, the third conductive sheet being electrically connected to the first conductive sheet, and the fourth conductive sheet being electrically connected to the second conductive sheet.

2. The high-power light source packaging structure according to claim 1, wherein The metal block device is a copper block device.

3. The high-power light source packaging structure according to claim 1, characterized in that, The main body block is disposed on the substrate, and the substrate is a ceramic substrate.

4. The high-power light source packaging structure according to claim 1, characterized in that, The mounting block is a regular prism.

5. The high-power light source packaging structure according to claim 1, characterized in that The packaging cover is a metal cover or a glass cover.

6. The high-power light source packaging structure according to claim 5, wherein The packaging cover is a rectangular body cover, the packaging cover including four side plates and a top plate that are connected to each other and enclose a cavity, and the light-transmitting member is one of the four side plates.

7. The high-power light source packaging structure according to claim 1, characterized in that The light-transmitting member is a convex lens, and the convex lens is located on the light-emitting path of each of the light-emitting chips.

8. The high-power light source packaging structure according to claim 1, characterized in that, A mounting groove for mounting the packaging cover is provided on the upper surface of the substrate.

9. A manufacturing method of a high-power light source packaging structure, characterized in that, Including the following steps: S1. Fabricate the packaging cover, the substrate and the metal block device; the packaging cover is provided with a light-transmitting member, the substrate is provided with a first conductive sheet and a second conductive sheet, the metal block device has a main body block and a mounting block, the mounting block is fixed to one side of the main body block, and at least two mounting surfaces are provided on the periphery of the mounting block, and the light-transmitting member includes one of a convex lens, a concave lens and a Nephel lens; S2. Fix a plurality of light-emitting chips to each of the mounting surfaces respectively and electrically connect them to the metal block device, and make the light-emitting directions of each of the light-emitting chips the same, and the number of the mounting surfaces is the same as the number of the light-emitting chips; S3. Fix the metal block device on the substrate, and electrically connect the metal block device to both the first conductive sheet and the second conductive sheet. The first conductive sheet and the second conductive sheet are respectively used to connect to the positive pad and the negative pad on the circuit board. Wherein, the metal block device has metal pole pieces, and each of the light-emitting chips is electrically connected and fixed on the metal pole pieces. The metal pole pieces extend from the mounting surface to the bottom surface of the main body block. The upper surface of the substrate is provided with a third conductive sheet and a fourth conductive sheet that are electrically connected to the metal pole pieces. The third conductive sheet is electrically connected to the first conductive sheet, and the fourth conductive sheet is electrically connected to the second conductive sheet; S4. Fix the encapsulation cover on the substrate to cover the metal block device and the plurality of light-emitting chips, and make the light-transmitting member located on the light-emitting path of each light-emitting chip.

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