COB light source preparation method and COB light source

Abstract

The present invention discloses a COB light source preparation method and a COB light source, comprising: making a circuit layer and a peripheral pad on a substrate, performing light source windowing on the substrate according to the size of the light source chip to obtain a plurality of light source fixed windows, and setting a light source positioning point next to the outermost light source fixed window of the plurality of light source fixed windows; covering the surface of the substrate with high-white ink; performing nickel-palladium-gold deposition on the peripheral pad; fixing the light source chip to the light source fixed window, and electrically connecting the light source chip; identifying a plurality of light source positioning points and damming the light source chip; fixing the peripheral components to the peripheral pads of the substrate. The present invention can improve the light efficiency emitted by the light source chip by covering the substrate with high-white ink, and damming at the light source positioning point can make the light source chip emit light in one area.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lighting, and in particular to a COB light source preparation method and a COB light source. Background Art

[0002] At present, the linear COB light source module is a common light source. It is a new driving method different from the traditional switching power supply. It is a new driving method based on the characteristics of LED. The linear COB light source module directly encapsulates the LED chip on the substrate with linear driving components to realize the optoelectronic integration module, which is directly powered by AC mains.

[0003] However, ordinary COB light source modules have serious light source loss and low light output efficiency. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a COB light source, which can improve the light efficiency of the COB light source.

[0005] The present invention also provides a COB light source.

[0006] In a first aspect, an embodiment of the present invention provides a method for manufacturing a COB light source, comprising:

[0007] A circuit layer and a peripheral pad are manufactured on a substrate, a light source window is opened on the substrate according to the size of the light source chip to obtain a plurality of light source fixed windows, and a light source positioning point is set next to the outermost light source fixed window of the plurality of light source fixed windows;

[0008] Covering the surface of the substrate with high white ink;

[0009] Performing nickel-palladium-gold deposition treatment on the peripheral pad;

[0010] Fixing the light source chip to the light source fixing window, and electrically connecting the light source chip;

[0011] Identify a plurality of light source positioning points and perform damming of the light source chip;

[0012] The peripheral components are fixed on the peripheral pads of the substrate.

[0013] The method for manufacturing a COB light source in an embodiment of the present invention has at least the following beneficial effects: by covering the substrate with high-white ink, the light efficiency emitted by the light source chip can be improved, and by forming a dam at the light source positioning point, the light source chip can concentrate the light source in one area.

[0014] According to the method for manufacturing a COB light source in some other embodiments of the present invention, the light source chip is located at the center of the substrate.

[0015] According to the method for manufacturing a COB light source in some other embodiments of the present invention, the light source chip is located at the center of the substrate.

[0016] According to the manufacturing method of the COB light source in some other embodiments of the present invention, the ratio of the size of the light source chip to the size of the fixed window of the light source is in the range of 1:1.03 to 1:1.07.

[0017] According to some other embodiments of the COB light source manufacturing method of the present invention, fixing the light source chip to the light source fixing window and electrically connecting the light source chip includes:

[0018] Fixing the bottom of the light source chip on the light source fixing window by using a bonding adhesive;

[0019] Connecting the upper surface electrodes of the plurality of light source chips via gold wires;

[0020] The light source chip is segmented according to the circuit connection of the light source chip, and the negative electrode of the previous light source chip and the positive electrode of the next light source chip at the segment are welded to the same electrical connection pad.

[0021] According to some other embodiments of the present invention, the manufacturing method of the COB light source is to set a dam area according to the outermost fixed window of the light source, the light source positioning points are located on the same circumference of the dam area, and the identifying of multiple light source positioning points and performing damming includes:

[0022] Identifying the light source location point;

[0023] The interior of the dam area is filled with dam glue according to the light source positioning point.

[0024] According to some other embodiments of the COB light source manufacturing method of the present invention, the fixing of peripheral components on the peripheral pads of the substrate includes:

[0025] Applying solder paste on the peripheral pads;

[0026] Placing the peripheral components on the corresponding peripheral pads according to the welding matching information between the peripheral components and the peripheral pads;

[0027] A reflow soldering operation is performed on the peripheral components and the peripheral pads.

[0028] According to the method for manufacturing a COB light source in some other embodiments of the present invention, the thickness of the high white ink is 16-20 UM.

[0029] In a second aspect, an embodiment of the present invention provides a COB light source, comprising:

[0030] A substrate, on which a plurality of light source fixing windows and peripheral pads are provided;

[0031] A light source chip is arranged on the light source fixing window of the substrate;

[0032] Peripheral components are soldered to the peripheral pads;

[0033] Dam glue is arranged on the substrate and surrounds the plurality of light source fixing windows;

[0034] The high white ink layer is arranged on the substrate.

[0035] The COB light source of the embodiment of the present invention has at least the following beneficial effects: by covering the substrate with high white ink, the light efficiency of the light source chip can be improved, and the damming at the light source positioning point can make the light source chip emit light in one area.

[0036] According to some other COB light sources of the present invention, the light source fixing window and the light source chip are located at the center of the substrate.

[0037] According to some other embodiments of the COB light source of the present invention, the thickness of the high white ink layer is 16-20 UM.

[0038] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic flow chart of a specific embodiment of a method for manufacturing a COB light source in an embodiment of the present invention;

[0040] Figure 2 is a schematic flow chart of another specific embodiment of the method for manufacturing a COB light source in an embodiment of the present invention;

[0041] Figure 3 is a structural schematic diagram of a COB light source in a specific embodiment of a method for manufacturing a COB light source in an embodiment of the present invention;

[0042] Figure 4 is a schematic flow chart of another specific embodiment of the method for manufacturing a COB light source in an embodiment of the present invention;

[0043] Figure 5is a schematic flow chart of another specific embodiment of the method for manufacturing a COB light source in an embodiment of the present invention;

[0044] Figure 6 It is a schematic structural diagram of a specific embodiment of a COB light source in an embodiment of the present invention.

[0045] Reference numerals: 100, substrate; 110, light source fixing window; 120, peripheral pad; 200, light source chip; 300, peripheral components; 400, dam glue; 500, ink layer; 600, electrical connection pad. DETAILED DESCRIPTION

[0046] The following will be combined with the embodiments to clearly and completely describe the concept of the present invention and the technical effects produced, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0047] In the description of the present invention, if it involves a description of orientation, for example, the orientation or position relationship indicated by "upper", "lower", "front", "back", "left", "right", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. If a feature is referred to as being "set", "fixed", "connected", or "installed" on another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, connected, or installed on the other feature.

[0048] In the description of the embodiments of the present invention, if "several" is involved, it means more than one, if "multiple" is involved, it means more than two, if "greater than", "less than" or "exceed" is involved, it should be understood as not including the number itself, if "above", "below" or "within" is involved, it should be understood as including the number itself. If "first" or "second" is involved, it should be understood as being used to distinguish technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] AC linear high-voltage module is what we usually call "de-powering". In fact, it is not without power supply but a new driving method different from the traditional switching power supply. It is a new driving method based on the characteristics of LED. This driving method integrates the power supply and light source on a common aluminum substrate to realize an optoelectronic integrated module. It is directly powered by AC mains, but the existing COB light source has serious loss and low light output efficiency.

[0050] Based on this, the present application discloses a method for manufacturing a COB light source and a COB light source, which can improve light output efficiency and reduce light source loss.

[0051] First, refer to Figure 1 The embodiment of the present invention discloses a COB light source preparation method and a COB light source, comprising:

[0052] S100, manufacturing a circuit layer and peripheral pads on a substrate, performing light source windowing on the substrate according to the size of the light source chip to obtain a plurality of light source fixed windows, and setting a light source positioning point next to the outermost light source fixed window of the plurality of light source fixed windows;

[0053] S200, covering the surface of the substrate with high white ink;

[0054] S300, performing nickel-palladium-gold deposition treatment on the peripheral pads;

[0055] S400, fixing the light source chip to the light source fixing window, and electrically connecting the light source chip;

[0056] S500, identifying multiple light source positioning points and enclosing the light source chip;

[0057] S600, fixing peripheral components on peripheral pads of the substrate.

[0058] Among them, the substrate is a copper-clad single-sided aluminum substrate, and the substrate includes a circuit layer, an insulating layer and an aluminum plate, and then a circuit layer is made on the surface of the substrate to obtain a peripheral pad. According to the size of the light source chip, a window is opened on the substrate to obtain multiple light source fixed windows. Since the substrate has an insulating layer to prevent short circuit, it will cause damage to the components. Among them, opening a window on the substrate is to remove the insulating layer on the circuit layer so that the wires of the circuit layer are exposed and can be tinned. After obtaining the light source fixed window, high-white ink is used to cover the substrate, and the surface of the substrate except the circuit, peripheral pad and light source fixed window is covered with high-white ink. By covering with high-white ink, yellowing will not occur at high temperature, and the light source chip cooperates with high-white ink to emit light, thereby improving the light output efficiency of the light source chip. Then the peripheral pad is treated with nickel-palladium-gold, and the nickel-palladium-gold treatment is to plate gold, palladium and nickel on the peripheral pad and the light source fixed window to obtain a gold layer, a palladium layer and a nickel layer. Among them, the thickness of the nickel layer is greater than or equal to 160u", the thickness of the palladium layer is greater than or equal to 0.5u", and the thickness of the gold layer is greater than or equal to 2u". By performing nickel-palladium-gold treatment on the peripheral pads and the light source fixing windows, the solderability between the components and the pads can be increased, and the situation of additional welding and voids caused in the production process can be reduced. After completing the pad processing, the light source chip is fixed on the light source fixing window, and the light source chip is electrically connected to achieve the connection of the light source chip, and then the light source positioning point is identified and the light source chip is dammed. After the light source chip is dammed, the peripheral components are fixed on the peripheral pads to complete the production of the entire COB light source, so that the entire COB light source is easy to produce and the light output efficiency of the COB light source is improved.

[0059] In some embodiments, the thickness of the high white ink is 16-20 UM. By printing the high white ink on the substrate, the light output efficiency of the light source can be improved, and the thickness of the high white ink is set to 16-20 UM, so the high white ink does not turn yellow at a high temperature of 280°.

[0060] In some embodiments, the light source fixed window is located at the center of the substrate, and the light source chip is located at the center of the substrate. Since the light source chip generates a lot of heat when emitting light, arranging the light source chip at the center of the substrate increases the area of ​​heat conduction, enhances heat dissipation, and quickly transfers heat through the circuit layer on the substrate.

[0061] Among them, nickel-palladium-gold treatment of the peripheral pads can reduce thermal resistance and light decay, greatly extending the life of the COB light source.

[0062] In some embodiments, the ratio of the size of the light source chip to the size of the fixed light source window is in the range of 1:1.03 to 1:1.07. The fixed ratio of the size of the light source chip to the fixed light source window in the range of 1:1.03 to 1:1.07 can maximize the solid crystal surface of the light source chip and improve the surface of the emission area, so as to ensure the stability and light efficiency of the COB light source.

[0063] Because multiple light source fixed windows are set, multiple light source chips are also set. Light source positioning points are set on the outermost periphery of the multiple light source chips, and a dam area is set on the substrate on the same circumference as the light source positioning points. The width of the dam area is 0.8mm, and the distance between the dam area and the outermost light source chip is 0.3mm, which ensures the maximum radiation area of ​​the light source chip and ensures that the heat generated by the light source chip will not easily affect peripheral components.

[0064] In some embodiments, reference Figure 2 , step S400 includes:

[0065] S410, fixing the bottom of the light source chip on the light source fixing window by using a die-bonding adhesive;

[0066] S420, connecting the upper surface electrodes of the plurality of light source chips through gold wires;

[0067] S430, dividing the light source chip into sections according to the circuit connection of the light source chip, and welding the negative electrode of the previous light source chip and the positive electrode of the next light source chip at the section to the same electrical connection pad.

[0068] Among them, an electrical connection pad is set in the dam area, and the electrical connection pad is electrically connected to the peripheral pad. The bottom of the light source chip is fixed to the light source fixing window with a solid crystal glue, and then the upper surface electrodes of multiple light source chips are connected in series through gold wires. The connection between the light source chips is segmented according to the circuit setting, and then the negative electrode of the previous light source chip and the positive electrode of the next light source chip at each segment are welded to the same adjacent electrical connection pad. Through the segmented connection, the light source chips of different segments can be controlled separately to achieve brightness adjustment.

[0069] For example, refer to Figure 3A plurality of light source fixing windows are arranged on the substrate, and a plurality of light source chips are fixed on the light source windows, and the light source chips are connected by gold wires, and the plurality of light source chips are divided into two sections according to the circuit setting, and the first light source chip of the first section of the circuit is A1, the first light source chip of the second section of the circuit is A2, the first light source chip of the third section of the circuit is A3, and the last light source chip of the second section of the circuit is A4, and the adjacent electrical connection pads of A1 and A2 are B, and the adjacent electrical connection pads of A3 and A4 are C, then the positive electrode of A1 and the negative electrode of A2 are connected to B, and the positive electrode of A3 and the negative electrode of A4 are connected to C.

[0070] In some embodiments, reference Figure 4 , step S500 includes:

[0071] S510, identifying the light source location point;

[0072] S520, filling the dam area with dam glue according to the light source positioning point.

[0073] Since the light source positioning point and the dam area are located on the same circle, the dam area can be found by identifying the light source positioning point, and then the dam area is filled with dam glue, and the dam glue is epoxy resin powder glue, so that light sources with different color temperatures and display indexes can be made through epoxy numerical powder glue.

[0074] In some embodiments, reference Figure 5 , step S600 includes:

[0075] S610, apply solder paste on the peripheral pads;

[0076] S620, placing the peripheral components on the corresponding peripheral pads according to the welding matching information between the peripheral components and the peripheral pads;

[0077] S630, performing reflow soldering operation on peripheral components and peripheral pads.

[0078] When the light source chip is completely fixed in the light source fixed window and the dam is made, solder paste is applied to the peripheral pads, and then the peripheral components are placed on the corresponding peripheral pads according to the welding matching information of each peripheral component and the peripheral pad. The corresponding peripheral components are placed immediately after the solder paste is applied to the peripheral pads, and the solder paste is applied to the next peripheral pad after one peripheral component is completed to prevent the peripheral components from being unable to be welded after the solder paste solidifies. When all the peripheral components are welded to the corresponding peripheral pads, reflow soldering is performed on all peripheral pads and peripheral components. The reflow soldering operation is to melt the solder paste at a high temperature of 260°C and then solidify it, so that the peripheral components and the pads are tightly connected, and the peripheral components and the peripheral pads are electrically connected.

[0079] Reference below Figures 1 to 5The method for manufacturing a COB light source according to an embodiment of the present invention is described in detail with a specific embodiment. It is worth noting that the following description is only an exemplary description and is not a specific limitation of the present invention.

[0080] First, a circuit layer is made on the surface of a copper-clad single-sided aluminum substrate, and then windows are opened on the substrate according to the ratio between the light source chip and the light source fixed window at 1:1.03 to 1:1.05 to obtain multiple light source fixed windows, and a light source positioning point is set at the outermost periphery of the light source fixed window, and then a dam area is set at the same circumference of the light source positioning point. After the light source fixed window is completed, a layer of high white ink is covered on the substrate, and then the peripheral pads are nickel-plated, palladium-plated and gold-plated to reduce the false welding phenomenon of peripheral components and peripheral pads. Apply solid crystal glue to the bottom of the light source chip to fix the light source chip to the light source fixed window, and then connect the light source chips of the same section through gold wire, and weld the negative electrode of the previous light source chip at the segment and the positive electrode of the next light source chip to the adjacent same electrical connection pad. After the power chip is fixed, fill the dam area with epoxy resin powder glue to make light sources with different color temperatures and display indexes. Finally, apply solder paste on the peripheral pads, then place the peripheral components on the corresponding peripheral pads, and then use a 260°C reflow soldering operation to tightly connect the solder paste and the peripheral components, so that the peripheral components and the peripheral pads are electrically connected.

[0081] In summary, the production of the COB light source is simplified and the light efficiency of the COB light source is improved.

[0082] Second, refer to Figure 6 The embodiment of the present invention discloses a COB light source, and the COB light source is manufactured by the COB light source manufacturing method of the first aspect, and the COB light source includes: a substrate 100, a light source chip 200, peripheral components 300, a dam glue 400 and a high white ink layer 500, the substrate 100 is provided with a plurality of light source fixing windows 110 and peripheral pads 120; the light source chip 200 is arranged on the light source fixing window 110 of the substrate 100; the peripheral components 300 are welded on the peripheral pads 120; the dam glue 400 is arranged on the substrate 100, and is arranged next to the plurality of light source fixing windows 110; the high white ink layer 500 is arranged on the substrate 100.

[0083] The light source chip 200 is arranged at the light source fixing window 110, and then the dam glue 400 is arranged on the substrate 100 and surrounds the light source fixing window 110. The dam glue 400 is obtained by epoxy resin powder glue, which can ensure that the light source chip 200 emits light with different color temperatures and limits. The high white ink layer 500 is arranged on the substrate 100, wherein the high white ink layer 500 will not turn yellow due to high temperature, and the high white ink layer 500 can improve the light output efficiency of the light source chip 200.

[0084] In some embodiments, the substrate 100 includes: a circuit layer, an insulating layer and an aluminum plate. The light source fixing window 110 and the light source chip 200 are located at the center of the substrate 100. By arranging the light source fixing window 110 and the light source chip 200 at the center of the substrate 100, the heat dissipation area of ​​the light source chip 200 can be expanded so that the heat emitted by the light source chip 200 can be dissipated through the circuit layer.

[0085] In this embodiment, the substrate 100 is circular in shape, and the light source fixing window 110 and the light source chip 200 are located at the center of the substrate 100. The peripheral pad 120 is located at the periphery of the light source fixing pad, and the peripheral components 300 are soldered on the peripheral pad 120. By setting the peripheral components 300 to be soldered on the peripheral pad 120, the light source chip 200 and the peripheral components 300 are distinguished, so as to prevent the heat emitted by the light source chip 200 from affecting the peripheral components 300.

[0086] In some embodiments, an electrical connection pad 600 is provided at the same circumference of the dam glue 400, a plurality of light source chips 200 are connected by gold wire, and then the plurality of light source chips 200 are segmented, and the negative electrode of the previous light source chip 200 and the positive electrode of the next light source chip 200 at each segment are welded to the same adjacent electrical connection pad 600, and the electrical connection pad 600 is electrically connected to the peripheral pad 120, so that the light source chip 200 is electrically connected to the peripheral components 300.

[0087] In some embodiments, the thickness of the high white ink layer 500 is 16-20 UM. By setting the high white ink layer 500 with a thickness of 16-20 UM, the light efficiency of the light source chip 200 can be further improved.

[0088] Among them, a nickel layer, a palladium layer and a gold layer are arranged on the peripheral pad 120, and the thickness of the nickel layer is greater than and equal to 160u", the thickness of the palladium layer is greater than and equal to 0.5u", and the thickness of the gold layer is greater than and equal to 2u". The solderability between the components and the peripheral pad 120 is increased, and false soldering, voids, etc. caused by the COB light source during the production process are reduced.

[0089] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A method for manufacturing a COB light source, characterized in that: include: A circuit layer and a peripheral pad are manufactured on a substrate, a light source window is opened on the substrate according to the size of the light source chip to obtain a plurality of light source fixed windows, and a light source positioning point is set next to the light source fixed window at the outermost edge of the plurality of light source fixed windows; wherein the substrate is a copper-clad single-sided aluminum substrate, and the substrate includes a circuit layer, an insulating layer and an aluminum plate, a circuit layer is manufactured on the surface of the substrate to obtain the peripheral pad, and the light source fixed window is located at the center of the substrate; Covering the surface of the substrate with high white ink; Performing nickel-palladium-gold deposition treatment on the peripheral pad; Fixing the light source chip to the light source fixing window and electrically connecting the light source chip, wherein the light source chip is located at the center of the substrate; Identify a plurality of light source positioning points and perform damming of the light source chip; Fixing peripheral components on peripheral pads of the substrate; The method of fixing peripheral components on peripheral pads of the substrate includes: Applying solder paste on the peripheral pads; Placing the peripheral components on the corresponding peripheral pads according to the welding matching information between the peripheral components and the peripheral pads; A reflow soldering operation is performed on the peripheral components and the peripheral pads.

2. The method for manufacturing a COB light source according to claim 1, characterized in that: The ratio of the size of the light source chip to the size of the light source fixed window is in the range of 1:1.03 to 1:1.

07.

3. The method for manufacturing a COB light source according to any one of claims 1 to 2, characterized in that: The step of fixing the light source chip to the light source fixing window and electrically connecting the light source chip comprises: Fixing the bottom of the light source chip on the light source fixing window by using a bonding adhesive; Connecting the upper surface electrodes of the plurality of light source chips via gold wires; The light source chip is segmented according to the circuit connection of the light source chip, and the negative electrode of the previous light source chip and the positive electrode of the next light source chip at the segment are welded to the same electrical connection pad.

4. The method for manufacturing a COB light source according to any one of claims 1 to 2, characterized in that: The dam area is set according to the outermost fixed windows of the light source, the light source positioning points are located on the same circumference of the dam area, and the identifying of the plurality of light source positioning points and performing damming includes: Identifying the light source location point; The interior of the dam area is filled with dam glue according to the light source positioning point.

5. The method for manufacturing a COB light source according to claim 2, characterized in that: The thickness of the high white ink is 16-20 μm.

6. A COB light source, characterized in that: Obtained by the method for manufacturing a COB light source according to any one of claims 1 to 5, comprising: A substrate, on which a plurality of light source fixing windows and peripheral pads are provided; A light source chip is arranged on the light source fixing window of the substrate; Peripheral components are soldered to the peripheral pads; Dam glue is arranged on the substrate and surrounds the plurality of light source fixing windows; The high white ink layer is arranged on the substrate.

7. The COB light source according to claim 6, characterized in that: The light source fixing window and the light source chip are located at the center of the substrate.

8. The COB light source according to claim 6, characterized in that: The thickness of the high white ink layer is 16-20 μm.

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