Dehydration tank and cleaning equipment

Abstract

This invention provides a liquid removal tank and a cleaning device. The liquid removal tank includes: a tank body capable of accommodating a silicon wafer carrier, with a drain pipe at the bottom of the tank body; and a liquid removal assembly, at least partially disposed within the tank body, for removing liquid from the bottom of the silicon wafer carrier placed within the tank. The technical solution of this invention can effectively remove liquid adhering to the bottom of the silicon wafer carrier, preventing liquid residue on the bottom of the silicon wafer carrier. This ensures that no drying blind spots are created when the silicon wafer carrier undergoes the liquid removal operation, thereby preventing impact on subsequent processing steps and improving the quality of silicon wafer products.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cleaning equipment technology, and more specifically, to a liquid removal tank and a cleaning device. Background Technology

[0002] Crystalline silicon solar cells are one of the most commonly used components in the photovoltaic industry. During the manufacturing process, silicon wafers undergo various processing steps. Among these, alkaline polishing and texturing processes require surface treatment with chemical solutions. After surface treatment, the wafers are moved along with a carrier to a drying tank for drying. Existing cleaning equipment has drying blind spots in the drying tank, failing to effectively remove the solution from the bottom of the carrier. This results in residual liquid remaining at the bottom of the carrier after drying. During the movement of the silicon wafers with the carrier, this residual liquid easily comes into contact with the wafers, affecting the drying effect and impacting subsequent processing steps, ultimately affecting the quality of the finished silicon wafer product. Summary of the Invention

[0003] According to embodiments of the present invention, it is intended to at least improve one of the technical problems existing in the prior art or related art.

[0004] Therefore, one object of the present invention is to provide a liquid removal tank.

[0005] Another object of the present invention is to provide a cleaning device.

[0006] To achieve the above objectives, an embodiment of the first aspect of the present invention provides a liquid removal tank, comprising: a tank body capable of accommodating a silicon wafer carrier, and a drain pipe provided at the bottom of the tank body; and a liquid removal assembly, at least a portion of which is disposed within the tank body for removing liquid from the bottom of the silicon wafer carrier placed within the tank body.

[0007] According to an embodiment of the first aspect of the present invention, the liquid removal tank includes a tank body and a liquid removal assembly. The tank body serves as the base of the liquid removal tank and can accommodate multiple silicon wafer carriers. At least a portion of the liquid removal assembly is disposed within the tank body for removing liquid from the bottom of the silicon wafer carriers placed within the tank body. Compared to the natural flow of liquid, the liquid at the bottom of the silicon wafer carriers is caused to fall due to the external action of the liquid removal assembly, resulting in higher liquid removal efficiency. A drain pipe is provided at the bottom of the tank body for discharging the liquid within the tank body to the outside.

[0008] The liquid removal tank in this solution can effectively remove liquid adhering to the bottom of the silicon wafer carrier, preventing liquid residue on the bottom of the silicon wafer carrier. This ensures that no drying blind spots are created when drying the silicon wafer carrier after liquid removal, thereby preventing any impact on subsequent processing and improving the quality of silicon wafer products.

[0009] In addition, the liquid removal tank in the above-described technical solution provided by the embodiments of the present invention may also have the following additional technical features:

[0010] In the above technical solution, at least part of the liquid removal component causes the liquid at the bottom of the silicon wafer carrier to fall through the negative pressure.

[0011] In this technical solution, at least part of the liquid removal component can generate negative pressure to drive the liquid at the bottom of the silicon wafer carrier to fall faster by utilizing the negative pressure acting on the silicon wafer carrier. Compared with the usual liquid removal method, the liquid removal component that can generate negative pressure has high liquid removal efficiency.

[0012] In the above technical solution, the liquid removal component includes: a support structure, which is disposed in the tank and connected to the side wall of the tank, and the support structure can provide support for the silicon wafer carrier; absorbent cotton, which is disposed on the support structure and is used to absorb the liquid at the bottom of the silicon wafer carrier; and a negative pressure driving device, which is disposed outside the tank and is used to create negative pressure inside the tank.

[0013] In this technical solution, the liquid removal assembly includes a support structure, absorbent cotton, a first ventilation duct, and a negative pressure driving device. A support structure is installed on the side wall of the tank to support the silicon wafer carrier. Absorbent cotton is installed on the support structure, corresponding to the silicon wafer carrier, to absorb liquid from the bottom of the silicon wafer carrier, thus achieving liquid removal. The support structure can be plate-shaped, grid-shaped, mesh-like, or other shapes; a mesh-like support structure also helps the absorbent cotton drain water. A negative pressure driving device connected to the tank creates negative pressure within the tank, promoting airflow and accelerating the descent of liquid from the silicon wafer carrier. The negative pressure driving device includes, but is not limited to, a fan, a vacuum pump, and a vacuum generator.

[0014] Furthermore, a first ventilation duct can be provided within the tank. Both ends of the first ventilation duct are connected to the sidewalls of the tank via fixing clips to support it. The first ventilation duct has multiple moisture-absorbing ports spaced apart along its length. One end of the first ventilation duct is connected to a negative pressure drive device via a pipe, so that when the negative pressure drive device operates, negative pressure is generated at the moisture-absorbing port, accelerating the airflow within the tank and causing the liquid adhering to the bottom of the silicon wafer carrier to detach more quickly. Nozzles can also be provided at the moisture-absorbing ports for liquid removal. The number of first ventilation ducts can be one or more; the first ventilation duct can be a straight pipe or a U-shaped pipe. When the first ventilation duct is a straight pipe, one end is connected to the negative pressure drive device, and the other end is closed. When the first ventilation duct is a U-shaped pipe, both ends are connected to the negative pressure drive device simultaneously. In addition, the first ventilation duct can also be connected to a ventilation device via a pipe, so that the ventilation device blows air into the first ventilation duct to promote airflow and accelerate the descent of liquid from the silicon wafer carrier.

[0015] In the above technical solution, the liquid removal assembly includes: a support structure disposed in the tank and connected to the side wall of the tank, the support structure providing support for the silicon wafer carrier; a liquid collection box connected to the support structure, the top of the liquid collection box having a first air intake, the first air intake being arranged along the extension direction of the bottom rod of the silicon wafer carrier, the top plates on both sides of the first air intake being inclined downward to adapt to the bottom rod of the silicon wafer carrier, the bottom of the liquid collection box having a second air intake; and a negative pressure driving device, one end of which is connected to the second air intake via a pipeline, the negative pressure driving device generating negative pressure in the liquid collection box to collect the liquid at the bottom of the silicon wafer carrier, the other end of which is connected to a drain pipeline via a pipeline.

[0016] In this technical solution, the liquid removal assembly includes a support structure, a liquid collection box, and a negative pressure driving device. The support structure, located on the side wall of the tank, supports the silicon wafer carrier and also supports the liquid collection box. The liquid collection box passes through the support structure and connects to the filter screen. The top of the liquid collection box is positioned above the support structure and corresponds to the bottom rod of the silicon wafer carrier. A first suction port extending along the bottom rod of the silicon wafer carrier is located at the top of the liquid collection box. The bottom of the liquid collection box is located below the support structure and has a second suction port, which is connected to the negative pressure driving device via a pipe. The negative pressure driving device generates negative pressure in the liquid collection box and accelerates the airflow at the bottom of the silicon wafer carrier through the first suction port, causing the liquid adhering to the bottom of the silicon wafer carrier to fall more rapidly. In this design, the top plates on both sides of the first suction port at the top of the liquid collection box slope downwards, so that the top shape of the liquid collection box matches the bottom rod of the silicon wafer carrier. This helps to reduce the gap between the outer surface of the bottom rod and the suction port, improving the uniformity of liquid removal. The number of liquid collection boxes corresponds to the number of silicon wafer carriers, with each liquid collection box corresponding to one bottom rod of the silicon wafer carrier.

[0017] In the above technical solution, the liquid removal component also includes: a negative pressure pipeline located below the tank and connected to the tank through a through hole on the bottom wall of the tank. The end of the negative pressure pipeline away from the tank is connected to a negative pressure driving device. The negative pressure pipeline can generate negative pressure under the action of the negative pressure driving device to accelerate the liquid at the bottom of the silicon wafer carrier to fall.

[0018] In this technical solution, a through hole is provided at the bottom of the tank. A negative pressure pipeline connected to the tank is installed below the tank and is connected to a negative pressure driving device. Under the action of the negative pressure driving device, a negative pressure is generated in the negative pressure pipeline, thereby accelerating the airflow in the tank and accelerating the liquid falling from the bottom of the silicon wafer carrier, thus improving the liquid removal efficiency. The number of negative pressure pipelines can be one or more.

[0019] In the above technical solution, the liquid removal component includes: a support structure, which is disposed in the tank and connected to the side wall of the tank, and the support structure can provide support for the silicon wafer carrier; and absorbent cotton, which is disposed on the support structure and is used to absorb the liquid at the bottom of the silicon wafer carrier.

[0020] In this technical solution, the liquid removal assembly includes a support structure and absorbent cotton. The support structure is installed on the sidewall of the tank to support the silicon wafer carrier; absorbent cotton is installed on the support structure, corresponding to the silicon wafer carrier, so that the absorbent cotton absorbs the liquid at the bottom of the silicon wafer carrier, thus achieving liquid removal. The absorbent cotton has a large coverage area, fast liquid removal speed, simple structure, and low cost. The support structure can be plate-shaped, grid-shaped, mesh-shaped, or other shapes; the mesh-shaped support structure also serves to drain water from the absorbent cotton.

[0021] In the above technical solution, the liquid removal component also includes: a spray pipe, which is located in the tank and connected to the side wall of the tank. The spray pipe is provided with multiple spray holes for spraying water onto the absorbent cotton so that the absorbent cotton maintains the humidity required for liquid removal.

[0022] In this technical solution, when absorbent cotton is provided, a spray pipe with multiple spray holes is installed within the tank to spray water onto the absorbent cotton when its humidity is too low, thus maintaining suitable humidity and improving its absorbency. The spray pipe is connected to the side wall of the tank via fixing clips; the side wall of the tank has through holes through which the spray pipe passes and connects to an external water source pipe to supply water to the spray pipe. Waste liquid generated by spraying can be discharged externally through a drain pipe.

[0023] In the above technical solution, the drain pipe is provided with a drain suction port, which is connected to the negative pressure drive device through a pipe; the drain pipe is provided with an inverted siphon section to use the liquid in the inverted siphon section to seal the drain pipe; wherein, the drain suction port is located between the inverted siphon section and the tank body.

[0024] In this technical solution, a drain suction port is installed in the drain pipe, and the drain suction port is connected to a negative pressure drive device through a pipe. The negative pressure generated by the negative pressure drive device accelerates the flow of liquid at the bottom of the tank into the drain pipe, thereby speeding up the draining process. The inverted siphon section can retain some liquid to form a water seal in the drain pipe, preventing waste gas from flowing back into the tank.

[0025] According to an embodiment of a second aspect of the present invention, a cleaning apparatus is provided, comprising: a frame; a process tank disposed on the frame, the process tank being capable of containing process liquid for surface processing of silicon wafers; a descaling tank as described in any of the embodiments of the first aspect above, disposed on the frame, for descaling the bottom of a silicon wafer carrier on which silicon wafers are loaded; and a drying tank disposed on the frame, the drying tank being provided with a drying device for drying the silicon wafers and silicon wafer carrier after the descaling operation has been completed.

[0026] According to a second aspect of the present invention, the cleaning equipment includes a frame, a process tank, a descaling tank as described in any of the embodiments of the first aspect, and a drying tank. The frame supports and mounts the process tank, the descaling tank, and the drying tank. The process tank can contain process liquid for surface processing of silicon wafers. The silicon wafers are placed on a wafer carrier for easy movement. After surface processing, the silicon wafers are moved with the wafer carrier to the descaling tank to descale the bottom of the wafer carrier, preventing residual process liquid from adhering to the bottom of the wafer carrier when it enters the drying tank. The drying tank is equipped with a drying device. After the wafer carrier completes the descaling operation, the silicon wafers are moved with the wafer carrier to the drying tank for drying to remove any remaining liquid on the silicon wafers and the wafer carrier, facilitating subsequent processing operations.

[0027] It should be noted that the number of process tanks, dehydration tanks, and drying tanks can each be one or more. Arranging the process tanks, dehydration tanks, and drying tanks in the above order can reduce the length of the silicon wafer and wafer carrier movement path, thus improving processing efficiency. Furthermore, the process tanks can be used for alkaline polishing, texturing, or other surface processing techniques.

[0028] Furthermore, the cleaning equipment in this solution also has all the beneficial effects of the liquid removal tank in any of the first aspect embodiments described above, which will not be repeated here.

[0029] In the above technical solution, the cleaning equipment also includes: a transfer device, which is correspondingly set with the frame and is used to move the silicon wafer carrier loaded with silicon wafers; and a controller, which is electrically connected to the transfer device to control the transfer device to move the silicon wafer carrier loaded with silicon wafers.

[0030] In this technical solution, a transfer device corresponding to the frame is set up to move the silicon wafer carrier loaded with silicon wafers, thereby reducing manual operation and improving processing efficiency. A controller electrically connected to the transfer device controls its operation, enabling the device to move the silicon wafer carrier according to the process procedure, thus achieving automated operation. The transfer device includes, but is not limited to, a robotic arm, a robotic hand, or an industrial robot.

[0031] Additional aspects and advantages of the embodiments of the present invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0032] The above and / or additional aspects and advantages of the embodiments of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0033] Figure 1 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0034] Figure 2 A schematic diagram of a silicon wafer carrier according to an embodiment of the present invention is shown;

[0035] Figure 3 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0036] Figure 4 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0037] Figure 5 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0038] Figure 6 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0039] Figure 7 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0040] Figure 8 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0041] Figure 9 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0042] Figure 10 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0043] Figure 11 An assembly schematic diagram of a liquid collection box according to an embodiment of the present invention is shown;

[0044] Figure 12 An assembly schematic diagram of a liquid collection box according to an embodiment of the present invention is shown;

[0045] Figure 13 An assembly schematic diagram of a liquid collection box according to an embodiment of the present invention is shown;

[0046] Figure 14 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0047] Figure 15 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0048] Figure 16 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0049] Figure 17 A schematic diagram of a liquid removal tank according to an embodiment of the present invention is shown;

[0050] Figure 18 A schematic block diagram of a cleaning apparatus according to an embodiment of the present invention is shown;

[0051] Figure 19 A schematic block diagram of a cleaning apparatus according to an embodiment of the present invention is shown.

[0052] in, Figures 1 to 19 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0053] 1. Liquid removal tank; 11. Tank body; 111. Side wall; 112. Bottom wall; 113. Through hole; 114. Fixing clip; 13. Liquid removal assembly; 131. First ventilation duct; 1311. Moisture absorption port; 133. Negative pressure duct; 134. Support structure; 1341. Support base; 1342. Filter screen; 135. Liquid collection box; 1351. First air intake; 1352. Second air intake; 1361. Third ventilation duct; 1362. Side air intake hood. 1363 Suction chamber, 137 Absorbent cotton, 138 Spray pipe, 1381 Spray hole, 1382 Water inlet, 139 Negative pressure drive device, 14 Drain pipe, 141 Drain suction port, 142 Inverted siphon section, 15 Connector, 2 Silicon wafer carrier, 21 Bottom rod, 22 End plate, 23 Silicon wafer, 3 Cleaning equipment, 31 Frame, 32 Process tank, 33 Drying tank, 331 Drying device, 34 Transfer device. Detailed Implementation

[0054] To better understand the above-described objectives, features, and advantages of the embodiments according to the present invention, the embodiments according to the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation details. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0055] Many specific details are set forth in the following description in order to provide a full understanding of the embodiments of the present invention. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0056] The following reference Figures 1 to 19 Describes a liquid removal tank and cleaning equipment according to some embodiments of the present invention.

[0057] Example 1

[0058] This embodiment provides a liquid removal tank 1, including a tank body 11 and a liquid removal component 13, for performing liquid removal operation on the bottom of a silicon wafer carrier 2 loaded with silicon wafers 23.

[0059] like Figure 1 and Figure 2 As shown, the tank 11 is the base of the dewatering tank 1 and can accommodate multiple silicon wafer carriers 2. The bottom wall 112 of the tank 11 has a through hole 113, which is connected to a drain pipe 14 for discharging liquid. At least part of the dewatering assembly 13 is disposed in the tank 11 so that when the silicon wafer carrier 2 is placed in the tank 11, the liquid at the bottom of the silicon wafer carrier 2 is removed by the dewatering assembly 13. Compared with the case where the liquid falls naturally, the dewatering assembly 13 can effectively promote the dewatering operation.

[0060] The liquid removal tank 1 in this embodiment can effectively remove the liquid adhering to the bottom of the silicon wafer carrier 2, preventing liquid residue on the bottom of the silicon wafer carrier 2. This ensures that no drying blind zone will be generated when the silicon wafer carrier 2 undergoes the drying operation after the liquid removal operation is completed, thereby preventing any impact on subsequent processing and improving the quality of silicon wafer products.

[0061] Example 2

[0062] This embodiment provides a liquid removal tank 1, including a tank body 11 and a liquid removal component 13, for performing liquid removal operation on the bottom of a silicon wafer carrier 2 loaded with silicon wafers 23.

[0063] like Figures 1 to 3 As shown, the tank 11 is the base of the dewatering tank 1 and can accommodate multiple silicon wafer carriers 2. The bottom wall 112 of the tank 11 has through holes 113 connected to a drain pipe 14 for discharging liquid. At least a portion of the dewatering assembly 13 is disposed within the tank 11, corresponding to the silicon wafer carriers when they are placed inside the tank 11. At least a portion of the dewatering assembly 13 can generate negative pressure, which accelerates the airflow within the tank 11 during the dewatering operation, accelerating the liquid fall from the bottom of the silicon wafer carriers 2. This results in higher dewatering efficiency compared to the natural falling of liquid.

[0064] The liquid removal tank 1 in this embodiment can effectively remove the liquid adhering to the bottom of the silicon wafer carrier 2, preventing liquid residue on the bottom of the silicon wafer carrier 2. This ensures that no drying blind zone will be generated when the silicon wafer carrier 2 undergoes the drying operation after the liquid removal operation is completed, thereby preventing any impact on subsequent processing and improving the quality of silicon wafer products.

[0065] Example 3

[0066] This embodiment provides a liquid removal tank 1, which includes a tank body 11 and a liquid removal component 13.

[0067] like Figure 3 As shown, the liquid removal assembly 13 specifically includes a support structure 134, absorbent cotton 137, and a negative pressure drive device 139. Specifically, the support structure 134 is provided on the side wall 111 inside the tank 11 to support the silicon wafer carrier 2, ensuring stability during the liquid removal operation. The support structure 134 is equipped with absorbent cotton 137, which is correspondingly positioned to the silicon wafer carrier 2, allowing direct contact between the absorbent cotton 137 and the bottom of the silicon wafer carrier 2 to absorb liquid from the bottom, thus achieving liquid removal. The shape of the support structure 134 includes, but is not limited to, a plate-like shape, a grid-like shape, or a mesh-like shape. When the negative pressure drive device 139 operates, it creates a negative pressure inside the tank 11, using airflow to accelerate the liquid's descent from the silicon wafer carrier 2.

[0068] Example 4

[0069] This embodiment provides a liquid removal tank 1, which is a further improvement on the third embodiment.

[0070] like Figure 3 As shown, the liquid removal assembly 13 also includes two first ventilation pipes 131, both of which are straight pipes. Each first ventilation pipe 131 extends along the length of the silicon wafer carrier 2 and is connected to the side wall 111 of the tank 11 via a fixing clip 114 to support the first ventilation pipe 131. The two first ventilation pipes 131 are spaced apart in the height direction. One end of each first ventilation pipe 131 is connected to the negative pressure drive device 139 via a pipe, and the other end is closed. Each first ventilation pipe 131 is provided with multiple moisture absorption ports 1311 spaced apart along its length direction. When the negative pressure drive device 139 is working, a negative pressure is generated at the moisture absorption ports 1311, which accelerates the airflow in the tank 11, causing the liquid adhering to the bottom of the silicon wafer carrier 2 to detach more quickly, thus achieving the liquid removal function. Nozzles may also be provided at the moisture absorption ports 1311 for liquid removal. The negative pressure drive device 139 includes, but is not limited to, a fan, a vacuum pump, and a vacuum generator.

[0071] Furthermore, the support structure 134 includes a support base 1341 and a filter screen 1342. Multiple support bases 1341 are spaced apart from each other and connected to the inner wall of the tank 11 via connectors 15. The filter screen 1342 is placed on the multiple support bases 1341 to support the silicon wafer carrier 2. Absorbent cotton 137 is placed on the filter screen 1342 to absorb liquid from the bottom of the silicon wafer carrier 2; the mesh on the filter screen 1342 allows the absorbent cotton 137 to drain water. In this case, the absorbent cotton 137 can completely cover the upper surface of the filter screen 1342 to expand the liquid absorption range. Alternatively, the absorbent cotton 137 can only cover part of the filter screen 1342, i.e., the absorbent cotton 137 is correspondingly positioned to the silicon wafer carrier 2. When there are multiple silicon wafer carriers 2, multiple absorbent cotton 137s can be provided to remove liquid from the bottom of each silicon wafer carrier 2 separately. In addition, the support 1341 can also be a continuous structure provided along the side wall 111 of the groove 11.

[0072] It should be noted that the number of first ventilation ducts 131 can be one or other numbers; the first ventilation duct 131 can also be a U-shaped pipe, in which case both ports of the first ventilation duct 131 are connected to the negative pressure drive device 139 at the same time to enhance the suction effect.

[0073] In another implementation of this embodiment, the first ventilation duct 131 can also be connected to a positive pressure drive device. The positive pressure drive device (e.g., a blower) blows air into the first ventilation duct 131 to create positive pressure in the first ventilation duct 131 and promotes the airflow movement in the tank 11, thereby accelerating the liquid falling on the silicon wafer carrier 2.

[0074] Example 5

[0075] This embodiment provides a liquid removal tank 1, which is a further improvement on the third embodiment.

[0076] like Figure 4 As shown, the liquid removal assembly 13 also includes a negative pressure pipeline 133. The negative pressure pipeline 133 is located below the tank 11. The bottom wall 112 of the tank 11 has a through hole 113 that mates with the negative pressure pipeline 133. The negative pressure pipeline 133 communicates with the tank 11 through this through hole 113, and the end of the negative pressure pipeline 133 away from the tank 11 is connected to the negative pressure drive device 139. When the negative pressure drive device 139 is working, a negative pressure is generated in the negative pressure pipeline 133, thereby accelerating the airflow within the tank 11 and causing the liquid at the bottom of the silicon wafer carrier 2 to fall more rapidly, further improving the liquid removal efficiency. The number of negative pressure pipelines 133 can be as follows: Figure 3 The structural form shown can, of course, be one or other quantities.

[0077] Furthermore, such as Figure 4As shown, the drain pipe 14 is equipped with a drain suction port 141, which is connected to a negative pressure drive device 139 via a pipe. The negative pressure generated by the negative pressure drive device 139 accelerates the flow of liquid from the bottom of the tank 11 into the drain pipe 14, thereby speeding up the draining process. The drain pipe 14 is equipped with an inverted siphon section 142, which uses the liquid remaining in the inverted siphon section 142 to seal the drain pipe 14 and prevent waste gas from flowing back into the tank 11. The drain suction port 141 is located between the inverted siphon section 142 and the tank 11, allowing waste gas in the drain pipe 14 to flow back under negative pressure.

[0078] Example 6

[0079] This embodiment provides a liquid removal tank 1, which is a further improvement on the fourth embodiment.

[0080] like Figure 5 As shown, the dehydration assembly 13 also includes a spray pipe 138, which is located inside the tank 11 and connected to the side wall 111 of the tank 11 via a fixing clip 114. The spray pipe 138 has multiple spray holes 1381. One end of the spray pipe 138 extends outward through the side wall 111 of the tank 11, and the end of the spray pipe 138 outside the tank 11 has a water inlet 1382 for connecting to a water source. After the silicon wafer carrier 2 completes dehydration and is removed from the dehydration tank 1, water is sprayed onto the absorbent cotton 137 through the spray pipe 138 to maintain the required humidity for dehydration. Excess waste liquid generated during the spraying process can be discharged through the drain pipe 14.

[0081] Furthermore, the drain pipe 14 is equipped with a drain suction port 141, which is connected to a negative pressure drive device 139 via a pipe. The negative pressure generated by the negative pressure drive device 139 accelerates the flow of liquid from the bottom of the tank 11 into the drain pipe 14, thereby speeding up the draining process. The drain pipe 14 is also equipped with an inverted siphon section 142, which uses the liquid remaining in the inverted siphon section 142 to seal the drain pipe 14 and prevent waste gas from flowing back into the tank 11. The drain suction port 141 is located between the inverted siphon section 142 and the tank 11, allowing waste gas in the drain pipe 14 to flow back under negative pressure.

[0082] Example 7

[0083] This embodiment provides a liquid removal tank 1, which is a further improvement on the third embodiment.

[0084] like Figure 6 and Figure 7As shown, the liquid removal assembly 13 also includes a negative pressure pipeline 133 and a spray pipeline 138. The negative pressure pipeline 133 is located below the tank 11. The bottom wall 112 of the tank 11 has a through hole 113 that can cooperate with the negative pressure pipeline 133. The negative pressure pipeline 133 is connected to the tank 11 through the through hole 113. The end of the negative pressure pipeline 133 away from the tank 11 is connected to the negative pressure driving device 139. When the negative pressure driving device 139 is working, a negative pressure is generated in the negative pressure pipeline 133, thereby accelerating the airflow in the tank 11 and causing the liquid at the bottom of the silicon wafer carrier 2 to fall more rapidly, which can further improve the liquid removal efficiency. The number of negative pressure pipelines 133 can be as follows: Figure 3 The structural form shown can, of course, be one or other quantities.

[0085] A spray pipe 138 is located inside the tank 11 and connected to the side wall 111 of the tank 11 via a fixing clip 114. The spray pipe 138 has multiple spray holes 1381. One end of the spray pipe 138 extends outward through the side wall 111 of the tank 11, and the end of the spray pipe 138 outside the tank 11 has a water inlet 1382 for connecting to a water source pipe. After the silicon wafer carrier 2 completes the dehydration process and is removed from the dehydration tank 1, water is sprayed onto the absorbent cotton 137 through the spray pipe 138 to maintain the required humidity for dehydration. Excess waste liquid generated during the spraying process can be discharged through the drain pipe 14.

[0086] Example 8

[0087] This embodiment provides a liquid removal tank 1, which is a further improvement on the third embodiment.

[0088] like Figure 8 As shown, the liquid removal assembly 13 also includes a third ventilation duct 1361, which is located outside the tank 11 and communicates with the inside of the tank 11. Specifically, one end of the third ventilation duct 1361 is connected to the negative pressure drive device 139; a side suction hood 1362 is provided between the third ventilation duct 1361 and the side wall 111 of the tank 11, and the side suction hood 1362 has a funnel-like structure; the open end of the side suction hood 1362 communicates with the side wall 111 of the tank 11, and the other end of the side suction hood 1362 is connected to the third ventilation duct 1361 to increase the coverage area of ​​the third ventilation duct 1361. A suction chamber 1363 communicating with the side suction hood 1362 is provided inside the tank 11. When the negative pressure device is working, negative pressure is generated in the third ventilation duct 1361, which guides the airflow in the tank 11 through the suction cavity 1363, promotes airflow movement, and accelerates the liquid falling on the silicon wafer carrier 2 to further enhance the liquid removal effect.

[0089] In another implementation of this embodiment, the third ventilation duct 1361 can also be connected to a positive pressure drive device. The positive pressure drive device (e.g., a blower) blows air into the third ventilation duct 1361 to create positive pressure in the third ventilation duct 1361 and promotes the airflow movement in the tank 11, thereby accelerating the liquid falling on the silicon wafer carrier 2.

[0090] Example 9

[0091] This embodiment provides a liquid removal tank 1, which is a further improvement on embodiment two. For example... Figure 1 , Figures 9 to 13 As shown, the liquid removal assembly 13 includes a support structure 134, a liquid collection box 135, and a negative pressure drive device 139.

[0092] Multiple liquid collection boxes 135 are disposed within the tank 11 and are used to collect liquid from the bottom of the silicon wafer carrier 2. Specifically, the support structure 134 includes support bases 1341 and filter plates 1342. Multiple support bases 1341 are provided at intervals and are connected to the inner wall of the tank 11 via connectors 15. The filter plates 1342 are placed on the multiple support bases 1341 and are used to support the silicon wafer carrier 2. The liquid collection box 135 passes through the filter screen plate 1342 along the height direction and forms a nested connection with the filter screen plate 1342; the top of the liquid collection box 135 is located above the filter screen plate 1342, and each liquid collection box 135 is correspondingly arranged with a bottom rod 21 of the silicon wafer carrier 2; the top of each liquid collection box 135 is provided with a first air intake 1351 extending along the length direction of the bottom rod 21 of the silicon wafer carrier 2, and the first air intake 1351 faces the bottom rod 21 of the silicon wafer carrier 2; the bottom of each liquid collection box 135 has a funnel-shaped structure, the bottom end of the liquid collection box 135 is located below the filter screen plate 1342, and is provided with a second air intake 1352, which is connected to the negative pressure drive device 139 through a pipeline. When the negative pressure drive device 139 is working, it generates negative pressure in the liquid collection box 135 and accelerates the airflow at the bottom of the silicon wafer carrier 2 through the first air intake 1351, causing the liquid attached to the bottom rod 21 of the silicon wafer carrier 2 to fall faster; the other end of the negative pressure drive device 139 is connected to the drain pipe 14 through a pipeline so that the liquid collected in the liquid collection box 135 is discharged through the drain pipe 14.

[0093] like Figure 11 As shown, at the top of the liquid collection box 135, the top plates on both sides of the first air intake 1351 gradually slope downward from the outside to the inside, so that the top of the liquid collection box 135 forms a funnel-shaped structure to match the bottom rod 21 of the silicon wafer carrier 2. This can reduce the distance between the outer surface of the bottom rod 21 and the air intake, making the airflow acting on the bottom rod 21 more uniform and improving the liquid removal effect.

[0094] Example 10

[0095] This embodiment provides a liquid removal tank 1, which is a further improvement on the basis of embodiment nine.

[0096] like Figure 14 As shown, the liquid removal assembly also includes two first ventilation ducts 131, both of which are straight pipes. Each first ventilation duct 131 extends along the length of the silicon wafer carrier 2 and is connected to the side wall 111 of the tank 11 via a fixing clip 114 to support the first ventilation duct 131. The two first ventilation ducts 131 are spaced apart in the height direction. One end of each first ventilation duct 131 is connected to a negative pressure drive device 139 via a pipe, and the other end is closed. Each first ventilation duct 131 is provided with multiple moisture absorption ports 1311 spaced apart along its length. When the negative pressure drive device 139 is working, a negative pressure is generated at the moisture absorption ports 1311, which accelerates the airflow in the tank 11, causing the liquid adhering to the bottom of the silicon wafer carrier 2 to detach more quickly, thus achieving the liquid removal function. Nozzles may also be provided at the moisture absorption ports 1311 for liquid removal. The negative pressure drive device 139 includes, but is not limited to, a fan, a vacuum pump, and a vacuum generator.

[0097] It should be noted that the number of first ventilation ducts 131 can be one or other numbers; the first ventilation duct 131 can also be a U-shaped pipe, in which case both ports of the first ventilation duct 131 are connected to the negative pressure drive device 139 at the same time to enhance the suction effect.

[0098] In another implementation of this embodiment, the first ventilation duct 131 can also be connected to a positive pressure drive device. The positive pressure drive device (e.g., a blower) blows air into the first ventilation duct 131 to create positive pressure in the first ventilation duct 131 and promotes the airflow movement in the tank 11, thereby accelerating the liquid falling on the silicon wafer carrier 2.

[0099] Example 11

[0100] This embodiment provides a liquid removal tank 1, which is a further improvement on the basis of embodiment nine.

[0101] like Figure 15As shown, the liquid removal assembly 13 also includes a negative pressure pipeline 133. The negative pressure pipeline 133 is located below the tank 11. The bottom wall 112 of the tank 11 has a through hole 113 that mates with the negative pressure pipeline 133. The negative pressure pipeline 133 communicates with the tank 11 through this through hole 113, and the end of the negative pressure pipeline 133 away from the tank 11 is connected to the negative pressure drive device 139. When the negative pressure drive device 139 is working, a negative pressure is generated in the negative pressure pipeline 133, thereby accelerating the airflow within the tank 11 and causing the liquid at the bottom of the silicon wafer carrier 2 to fall more rapidly. This allows liquid that has not entered the collection box 135 to be discharged through the negative pressure pipeline 133, further improving the liquid removal efficiency.

[0102] Example 12

[0103] This embodiment provides a liquid removal tank 1, which is a further improvement on embodiment nine. For example... Figure 1 and Figure 16 As shown, the liquid removal assembly 13 also includes a third ventilation duct 1361, a side suction hood 1362, and a suction chamber 1363.

[0104] The third ventilation duct 1361 is located outside the tank 11 and connects to the inside of the tank 11. Specifically, one end of the third ventilation duct 1361 is connected to the negative pressure drive device 139; a side suction hood 1362 is provided between the third ventilation duct 1361 and the side wall 111 of the tank 11, and the side suction hood 1362 has a funnel-like structure; the open end of the side suction hood 1362 is connected to the side wall 111 of the tank 11, and the other end of the side suction hood 1362 is connected to the third ventilation duct 1361 to increase the coverage area of ​​the third ventilation duct 1361. A suction chamber 1363 connected to the side suction hood 1362 is provided inside the tank 11. When the negative pressure device is working, a negative pressure is generated in the third ventilation duct 1361, which guides the airflow in the tank 11 through the suction chamber 1363, promoting the airflow into the third ventilation duct 1361 and further enhancing the liquid removal effect. In addition, the third ventilation duct 1361 can also be connected to a positive pressure drive device. The positive pressure drive device (e.g., a blower) blows air into the third ventilation duct 1361 to create positive pressure in the third ventilation duct 1361 and promotes airflow movement in the tank 11, thereby accelerating the liquid drop on the silicon wafer carrier 2.

[0105] Furthermore, the drain pipe 14 is equipped with a drain suction port 141, which is connected to a negative pressure drive device 139 via a pipe. The negative pressure generated by the negative pressure drive device 139 accelerates the flow of liquid from the bottom of the tank 11 into the drain pipe 14, thereby speeding up the draining process. The drain pipe 14 is also equipped with an inverted siphon section 142, which uses the liquid remaining in the inverted siphon section 142 to seal the drain pipe 14 and prevent waste gas from flowing back into the tank 11. The drain suction port 141 is located between the inverted siphon section 142 and the tank 11, allowing waste gas in the drain pipe 14 to flow back under negative pressure.

[0106] It should be noted that, in another implementation of this embodiment, a liquid collection box 135 and absorbent cotton 137 can also be provided in the tank 11 simultaneously to further enhance the liquid removal effect. For example, the absorbent cotton 137 can be correspondingly arranged with the bottom rod 21 of the silicon wafer carrier 2, and the liquid collection box 135 can be correspondingly arranged with the bottom of the end plate 22 of the silicon wafer carrier 2, or the absorbent cotton 137 can be correspondingly arranged with the bottom of the end plate 22 of the silicon wafer carrier 2, and the liquid collection box 135 can be correspondingly arranged with the bottom rod 21 of the silicon wafer carrier 2, so as to remove liquid from the bottom rod 21 and the bottom of the end plate 22 of the silicon wafer carrier 2 respectively.

[0107] Example 13

[0108] This embodiment provides a liquid removal tank 1, which is a further improvement on the first embodiment. For example... Figure 1 and Figure 17 As shown, the liquid removal component 13 includes a support structure 134 and absorbent cotton 137.

[0109] A support structure 134 is provided on the side wall 111 inside the tank 11 to support the silicon wafer carrier 2, thus keeping the silicon wafer carrier 2 stable during the liquid removal operation. The support structure 134 is equipped with absorbent cotton 137, which directly contacts the bottom wall 112 of the silicon wafer carrier 2 to absorb liquid from the bottom of the silicon wafer carrier 2, achieving liquid removal. The absorbent cotton 137 has a large coverage area, fast liquid removal speed, simple structure, and low cost.

[0110] Specifically, the support structure 134 includes support bases 1341 and filter plates 1342. Multiple support bases 1341 are spaced apart and connected to the inner wall of the tank 11 via connectors 15. The filter plates 1342 are placed on the multiple support bases 1341 to support the silicon wafer carriers 2. Absorbent cotton 137 is placed on the filter plates 1342 to absorb liquid from the bottom of the silicon wafer carriers 2; the mesh on the filter plates 1342 allows the absorbent cotton 137 to drain water. In this case, the absorbent cotton 137 can completely cover the upper surface of the filter plates 1342 to expand the liquid absorption area. Alternatively, the absorbent cotton 137 can only cover part of the filter plates 1342, i.e., the absorbent cotton 137 is positioned correspondingly to the silicon wafer carriers 2. When there are multiple silicon wafer carriers 2, multiple absorbent cotton 137s can be provided to remove liquid from the bottom of each silicon wafer carrier 2. In addition, the support 1341 can also be a continuous structure provided along the side wall 111 of the groove 11.

[0111] Furthermore, the liquid removal assembly 13 also includes a spray pipe 138, which is located inside the tank 11 and connected to the side wall 111 of the tank 11. The spray pipe 138 has multiple spray holes 1381. One end of the spray pipe 138 extends outward through the side wall 111 of the tank 11, and the end of the spray pipe 138 outside the tank 11 has a water inlet 1382 for connecting to a water source. After the silicon wafer carrier 2 completes liquid removal and is removed from the liquid removal tank 1, water is sprayed onto the absorbent cotton 137 through the spray pipe 138 to maintain the required humidity for liquid removal. Excess waste liquid generated during the spraying process can be discharged through the drain pipe 14.

[0112] Example 14

[0113] This embodiment provides a cleaning device 3, such as... Figure 1 , Figure 2 and Figure 18 As shown, it includes a frame 31, a process tank 32, a liquid removal tank 1 in any of the above embodiments, and a drying tank 33.

[0114] The frame 31 serves as the base of the cleaning equipment 3, supporting and mounting the process tank 32, the descaling tank 1, and the drying tank 33. The process tank 32 can hold process liquids for various surface treatments of the silicon wafer 23. During processing, the silicon wafer 23 is placed on the silicon wafer carrier 2 for easy movement. The descaling tank 1 removes liquid from the bottom of the silicon wafer carrier 2, and the drying tank 33 is equipped with a drying device 331 for thoroughly drying the silicon wafer carrier 2. After surface treatment, the silicon wafer 23 moves with the silicon wafer carrier 2 to the descaling tank 1, where the descaling assembly 13 removes liquid from the bottom of the silicon wafer carrier 2 to prevent residual process liquid from adhering to the bottom when the silicon wafer carrier 2 enters the drying tank 33. After descaling, the silicon wafer 23 and the silicon wafer carrier 2 enter the drying tank 33 for drying to remove any remaining liquid from the silicon wafer 23 and the silicon wafer carrier 2, facilitating subsequent processing operations.

[0115] It should be noted that the number of process tank 32, dehydration tank 1, and drying tank 33 can be one or more. The sequential arrangement of process tank 32, dehydration tank 1, and drying tank 33 reduces the length of the movement path between silicon wafer 23 and silicon wafer carrier 2, thus improving processing efficiency. Furthermore, process tank 32 can be used for alkaline polishing, texturing, or other surface processing techniques.

[0116] Furthermore, the cleaning device 3 in this solution also has all the beneficial effects of the liquid removal tank 1 in any of the above embodiments, which will not be repeated here.

[0117] Example 15

[0118] This embodiment provides a cleaning device 3, which is a further improvement on the basis of embodiment nine.

[0119] like Figure 1 , Figure 2 and Figure 19 As shown, the cleaning equipment 3 also includes a transfer device 34 and a controller. The transfer device 34 is equipped with a corresponding device to the frame 31, so that during the processing, the silicon wafer carrier 2 carrying the silicon wafer 23 can be moved by the transfer device 34, which can reduce manual operation and improve processing efficiency. The controller has a built-in process program and is electrically connected to the transfer device 34 to control the transfer device 34, so that the transfer device 34 can move the silicon wafer carrier 2 according to the process program to realize automated operation. The transfer device 34 includes, but is not limited to, a robotic arm, a robotic hand, or an industrial robot.

[0120] In one specific implementation of this embodiment, one or more process tanks 32 in the existing cleaning equipment can be modified into the dehydration tank 1 in any of the above embodiments, without increasing the number of tanks in the original cleaning equipment. During the processing, the transfer device 34, under the control of the controller, moves the silicon wafer carrier 2 loaded with silicon wafers 23 according to the process program. First, various surface treatments are performed in the process tank 32, then the silicon wafer carrier 2 is moved to the dehydration tank 1 for dehydration, and then the silicon wafer carrier 2 is moved to the drying tank 33 for drying. The drying time of the original cleaning equipment is t1, the process time in the dehydration tank 1 of the modified cleaning equipment 3 is t2, and the drying time in the drying tank 33 is t3, and t1 = t2 + t3, that is, the total drying time remains the same after modification, but the dehydration and drying effects are better.

[0121] In one specific embodiment of this invention, a liquid removal tank and a cleaning device are provided. The carrier, used to hold silicon wafers, consists of rods and two end plates on both sides. The main technical problem addressed by the proposed solution in this embodiment is: removing the solution from the bottom rods of the carrier and the solution from the end plates on both sides of the carrier.

[0122] (1) Technical Solution 1

[0123] The liquid removal tank is equipped with both a water suction device and a negative pressure device.

[0124] The desiccation tank includes a spray pipe, a negative pressure device, a water absorption device, and a screen plate. The screen plate is installed on a support plate inside the tank, and its structure is adapted to the bottom of the carrier. The support plate is installed on the inner side wall of the tank through support members. The screen plate has mesh openings. Water-absorbing cotton is installed on the screen plate. Specifically, the water-absorbing cotton completely covers the screen plate. The negative pressure pipe is provided with a moisture absorption port. The negative pressure device includes a negative pressure pipe and pipe connectors. At least one negative pressure pipe is provided in the desiccation tank. The negative pressure pipe can be a U-shaped pipe, i.e., the pipe is connected to the air intake at both ends, or a pipe that is closed at one end and connected to the air intake at the other end. The spray pipe and the negative pressure pipe can be fixed to the inner side wall of the tank by positioning clips. Through holes can be opened in the inner side wall and bottom plate of the tank for installing the spray pipe and the negative pressure pipe. A waste liquid discharge port is opened at the bottom of the tank.

[0125] As the carrier moves closer to the dehydration tank with the movement of the robotic arm, the robotic arm stops moving once the bottom of the carrier contacts the absorbent cotton. At this time, the robotic arm does not disengage and remains for a few seconds. Simultaneously, the negative pressure pipeline drive device in the tank (which can be a fan, vacuum pump, vacuum generator, etc., as long as the product can generate negative pressure) is activated to suck away some of the moisture. After a certain processing time, the negative pressure suction stops, and the carrier moves with the robotic arm, detaches from the absorbent cotton, and enters the dehydration tank for the next drying process.

[0126] After the robotic arm removes the carrier, the spray pipes at the top of the tank are turned on and spray for a few seconds to ensure the humidity of the acid-resistant washing water surface before stopping. Excess waste liquid can be discharged through the waste liquid discharge port.

[0127] By installing absorbent cotton, the solution on the bottom rods and the bottom of the end plates of the vehicle can be effectively removed. By installing a negative pressure device, the moisture in the dehumidification tank can be further removed.

[0128] (2) Technical Solution Two

[0129] In technical solution one, the negative pressure device is removed while the other structures remain unchanged. The solution at the bottom of the carrier is removed by placing absorbent cotton at the bottom.

[0130] (3) Technical Solution Three

[0131] The liquid removal tank includes a negative pressure device, a support base, and a mesh plate. The negative pressure device includes a negative pressure device mounted on the support plate at the bottom of the tank and a negative pressure device mounted on the side plate of the tank. The support plate is mounted on the inner side wall of the tank via support members. The negative pressure device on the support plate at the bottom of the tank includes a suction box and suction pipes. The support base is located at the bottom of the tank and is used to place the carrier. Specifically, the suction box can be mounted on the mesh plate, and the periphery of the mesh plate can be mounted on the support base. The suction box has a first suction port and a second suction port. The first suction port is located above the mesh plate, near the bottom rod of the carrier. The second air intake is located below the mesh plate and is used to connect to the air intake drive device (this can be a fan, vacuum pump, vacuum generator, etc., any product that can generate negative pressure). The first air intake is arranged along the length of the bottom rod of the carrier. At the same time, a negative pressure device is set on the side plate of the tank to remove some of the moisture in the tank. The negative pressure device on the side plate of the tank can be set in the same way as in technical solution one, or by setting an air intake area in the tank, with the air intake pipe connected to the air intake area, and the air intake area connected to an external air intake device. A drain outlet is set at the bottom of the tank and connected to an external drain pipe.

[0132] As the robotic arm moves, the carrier approaches the liquid removal tank and can be placed on the support base. The mesh plate is set on the support base, and the suction box is set on the mesh plate. Therefore, the suction box is close to the bottom rod of the carrier but does not contact the bottom rod of the carrier. In particular, the first suction port is set at a certain angle near the end of the bottom rod of the carrier to match the rod, so as to remove the solution on the bottom rod of the carrier more effectively.

[0133] The suction box is used to remove solution from the bottom rods of the carrier. To remove solution from the bottom of the carrier's end plate, a negative pressure suction device can be installed on the end plate support. The negative pressure suction box drives the airflow under the carrier, which accelerates the drainage of liquids attached to the carrier and materials.

[0134] In both technical solutions one and two, the moisture absorption ports on the negative pressure pipelines located on the side plate of the tank can also be installed using nozzles to remove moisture from the tank. Using a desiccant tank with a negative pressure device can improve the yield and efficiency of the customer's products. This avoids the drawbacks of existing equipment that has two drying modes: one drying tank has a high temperature and high efficiency but is difficult to maintain and has low cleanliness; the other drying tank has a low temperature and relatively low drying efficiency but high cleanliness.

[0135] The waste outlet at the bottom of the above-mentioned liquid removal tank is connected to the waste discharge pipeline, and the other end of the waste discharge pipeline is connected to the external waste discharge pipeline. An inverted siphon is installed on the waste discharge pipeline to form a water seal and prevent the waste gas stored in the external waste discharge pipeline from flowing back into the liquid removal tank and affecting the process effect.

[0136] Specifically, a negative pressure suction port is installed on the waste discharge pipeline. Specifically, a negative pressure suction port can be installed at the bottom of the tank shown. The negative pressure suction port is connected to a suction drive device (which can be a fan, vacuum pump, vacuum generator, etc., any product that can generate negative pressure). Its function is to guide the solution on the carrier containing silicon wafers to flow downwards along the direction of gravity, thereby enhancing the liquid removal effect.

[0137] The technical solutions for removing the solution from the bottom of the vehicle are not limited to the specific contents listed in this embodiment. They can include various combinations. For example, in technical solutions one and two, absorbent cotton is used to remove moisture from the bottom rods and end plates of the vehicle. In technical solution three, a negative pressure device (i.e., a suction box) is set at the bottom of the tank to remove moisture from the bottom rods and end plates of the vehicle. In one solution, absorbent cotton is used to remove moisture from the bottom rods of the vehicle, and a suction box is used to remove moisture from the bottom of the end plates of the vehicle. Alternatively, in another solution, a suction box is used to remove moisture from the bottom rods of the vehicle, and absorbent cotton is used to remove moisture from the bottom of the end plates of the vehicle.

[0138] A cleaning device includes a process tank, a descaling tank, a drying tank, a transfer device, and a main body. Silicon wafers to be processed are placed on a carrier. A solution is introduced into the process tank to process the surface of the silicon wafers. The transfer device can be a robotic arm. The device enables the transfer of the carrier containing the silicon wafers between tanks, i.e., from one process tank to another. Since the carrier containing the silicon wafers will retain solution after processing in the process tank, the descaling tank and drying tank are provided to dry the carrier containing the silicon wafers, effectively removing the solution from the surface of the silicon wafers and the carrier.

[0139] The technical solutions of some embodiments of the present invention have been described in detail above with reference to the accompanying drawings. They can effectively remove liquid adhering to the bottom of the silicon wafer carrier, prevent liquid residue on the bottom of the silicon wafer carrier, so that no drying blind zone will be generated when the silicon wafer carrier after liquid removal is dried, thereby preventing the impact on subsequent processing processes and improving the quality of silicon wafer products.

[0140] In embodiments of the present invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise expressly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in embodiments of the present invention according to the specific circumstances.

[0141] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the technical solutions of this application.

[0142] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0143] The above are merely preferred embodiments of the present invention and are not intended to limit the technical solutions of this application. For those skilled in the art, the technical solutions of this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the technical solutions of this application should be included within the protection scope of this application.

Claims

1. A liquid removal tank (1), characterized in that, include: The tank (11) is capable of accommodating the silicon wafer carrier (2), and the bottom of the tank (11) is provided with a drain pipe (14) for discharging the liquid in the tank (11) to the outside. Liquid removal assembly (13), at least part of the liquid removal assembly (13) is disposed in the tank (11) for removing liquid from the bottom of the silicon wafer carrier (2) placed in the tank (11); At least part of the liquid removal assembly (13) causes the liquid at the bottom of the silicon wafer carrier (2) to fall through the negative pressure. The liquid removal assembly (13) includes: A support structure (134) is disposed inside the groove (11) and connected to the side wall (111) of the groove (11). The support structure (134) can provide support for the silicon wafer carrier (2). A liquid collection box (135) is connected to the support structure (134). The top of the liquid collection box (135) is provided with a first air intake (1351). The first air intake (1351) is arranged along the extension direction of the bottom rod (21) of the silicon wafer carrier (2). The top plates on both sides of the first air intake (1351) are inclined downward to match the bottom rod (21) of the silicon wafer carrier (2). The bottom of the liquid collection box (135) is provided with a second air intake (1352). Absorbent cotton (137) is disposed on the support structure (134). The absorbent cotton (137) is in contact with the bottom wall of the silicon wafer carrier (2) and is used to absorb the liquid at the bottom of the silicon wafer carrier (2). A negative pressure drive device (139) is provided outside the tank (11) to create a negative pressure inside the tank (11). One end of the negative pressure drive device (139) is connected to the second air intake (1352) through a pipe. The negative pressure drive device (139) can generate a negative pressure in the liquid collection box (135) to collect the liquid at the bottom of the silicon wafer carrier (2). The other end of the negative pressure drive device (139) is connected to the drain pipe (14) through a pipe. The support structure (134) includes a support base (1341) and a filter plate (1342). The support base (1341) is a continuous structure arranged along the side wall of the groove (11). The filter plate (1342) is placed on the support base (1341) to support the silicon wafer carrier (2). The absorbent cotton (137) is disposed on the filter screen plate (1342); The liquid removal assembly (13) also includes: The first ventilation duct (131) extends along the length of the silicon wafer carrier (2) and is connected to the side wall (111) of the tank (11) by means of a fixing clip (114). One end of the first ventilation duct (131) is connected to the negative pressure drive device (139) through a pipe, and the other end is closed. The first ventilation duct (131) is provided with a plurality of moisture absorption ports (1311) spaced apart along the length. The third ventilation duct (1361) is located outside the trough (11) and communicates with the inside of the trough (11). One end of the third ventilation duct (1361) is connected to the negative pressure drive device (139). A side suction hood (1362) is provided between the third ventilation duct (1361) and the side wall (111) of the trough (11). The side suction hood (1362) has a similar trumpet-shaped structure. The open end of the side suction hood (1362) communicates with the side wall (111) of the trough (11). The other end of the side suction hood (1362) is connected to the third ventilation duct (1361) to increase the coverage area of ​​the third ventilation duct (1361). A suction cavity (1363) communicating with the side suction hood (1362) is provided inside the trough (11). A spray pipe (138) is provided inside the tank (11). The spray pipe (138) is connected to the side wall (111) of the tank (11). The spray pipe (138) is provided with a plurality of spray holes (1381) for spraying water onto the absorbent cotton (137) so that the absorbent cotton (137) maintains the humidity required for liquid removal. The drain pipe (14) is provided with a drain suction port (141), and the drain suction port (141) is connected to the negative pressure drive device (139) through the pipe. The drain pipe (14) is provided with an inverted siphon section (142) so as to use the liquid in the inverted siphon section (142) to seal the drain pipe (14); The drain air inlet (141) is located between the inverted siphon section (142) and the tank (11).

2. The liquid removal tank (1) according to claim 1, characterized in that, The liquid removal assembly (13) also includes: A negative pressure pipeline (133) is located below the tank (11) and is connected to the tank (11) through a through hole (113) on the bottom wall (112) of the tank (11). The end of the negative pressure pipeline (133) away from the tank (11) is connected to the negative pressure driving device (139). The negative pressure pipeline (133) can generate negative pressure under the action of the negative pressure driving device (139) so that the liquid at the bottom of the silicon wafer carrier (2) falls faster.

3. A cleaning device (3), characterized in that, include: Frame (31); A process tank (32) is provided on the frame (31). The process tank (32) can contain process liquid and is used to perform surface processing on silicon wafers (23). The liquid removal tank (1) as described in claim 1 or 2 is provided on the frame (31) for performing liquid removal operation on the bottom of the silicon wafer carrier (2) on which the silicon wafer (23) is loaded; A drying tank (33) is provided on the frame (31). A drying device (331) is provided in the drying tank (33) for drying the silicon wafer (23) and the silicon wafer carrier (2) after the liquid removal operation is completed.

4. The cleaning equipment (3) according to claim 3, characterized in that, Also includes: A moving device (34) is provided corresponding to the frame (31) for moving the silicon wafer carrier (2) that carries the silicon wafer (23). The controller is electrically connected to the transfer device (34) to control the transfer device (34) to move the silicon wafer carrier (2) loaded with the silicon wafer (23).

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