Semiconductor device and method for manufacturing semiconductor device

Abstract

Provided are a semiconductor device capable of maintaining external connection terminals vertical and a manufacturing method of the semiconductor device. In a cross region of a side surface of an external connection terminal (19) overlapping with a through-hole (22a), an inclined surface (19d1) inclined toward the external connection terminal (19) side with respect to a direction in which the through-hole (22a) is inserted through the external connection terminal (19) is provided. In a case where a contact member (17) is inclinedly mounted with respect to a main surface of a ceramic circuit substrate (14), the external connection terminal (19) is also inclined in conjunction therewith. Such an external connection terminal (19) is guided to be mounted with the upper cover plate (22) such that the external connection terminal (19) is vertical with respect to the main surface of the ceramic circuit substrate (14) by the inclined surface (19d1) of a guide portion (19d) if the external connection terminal (19) is inserted through the through-hole (22a) of the upper cover plate (22). Thus, the external connection terminal (19) protruding from the upper cover plate (22) of an outer case (20) can be mounted at a suitable position of a printed circuit substrate, and improvement in assembly can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor device and a manufacturing method of a semiconductor device. BACKGROUND

[0002] A semiconductor device includes a semiconductor chip such as an IGBT (Insulted Gate Bipolar Transistor), a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or the like. Such a semiconductor device is used as, for example, a power conversion device. Such a semiconductor device is provided with a substrate having an insulating board and a plurality of conductive boards formed on the front surface of the insulating board. Further, a semiconductor chip and an external connection terminal are arranged on the conductive boards, and a signal applied from the external connection terminal is input to the semiconductor chip via the conductive boards. Further, a main current is also input and output from the external connection terminal, and the main current is switched by the semiconductor chip via the conductive boards. When the external connection terminal is mounted to the conductive boards, a cylindrical contact member that is joined to the conductive boards by soldering is used. The external connection terminal is fitted to the contact member, and the external connection terminal is electrically connected to the conductive boards via the contact member. Further, the external connection terminal is inserted through a through-hole of an upper cover plate of an exterior case, and the exterior case is mounted to the substrate (for example, refer to Patent Document 1).

[0003] For such an external connection terminal that protrudes from the through-hole of the upper cover plate of the exterior case, a printed circuit board is further mounted. The external connection terminal is electrically connected to the printed circuit board. Therefore, the external connection terminal needs to be perpendicular with respect to the substrate.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT DOCUMENTS

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-187179 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, if the contact member is slightly inclined for some reason, the external connection terminal that is fitted to the contact member is also mounted to be inclined with respect to the substrate. Even if such an inclined external connection terminal is inserted through the through-hole of the upper cover plate of the exterior case and protrudes, the external connection terminal cannot be mounted to a proper position of the printed circuit board because of the inclination.

[0009] The present application has been achieved in view of such a situation, and an object thereof is to provide a semiconductor device and a manufacturing method of a semiconductor device that can hold an external connection terminal to be perpendicular.

[0010] Technical solution

[0011] According to an aspect of the present application, there is provided a semiconductor device including: a semiconductor chip; a substrate having a conductive plate on which the semiconductor chip is disposed on a front surface and an insulating plate on which the conductive plate is formed on a front surface; a cylindrical contact member disposed on the conductive plate via a bonding member; a rod-shaped external connection terminal having a lower end portion fitted into the contact member; and a flat plate-shaped upper cover plate having a through-hole passing through an inlet and an outlet, the inlet being on a back surface of the upper cover plate opposite to a main surface of the substrate, the outlet being on a front surface of the upper cover plate opposite to the back surface and opposite to the inlet, the external connection terminal being inserted into the through-hole, and the semiconductor device including an inclined surface inclined toward a center side of the external connection terminal from the inlet toward the outlet at least one of a cross region of a side surface of the external connection terminal overlapping with the through-hole or an inner wall surface of the through-hole.

[0012] Further, a semiconductor device manufacturing method of manufacturing such a semiconductor device is provided.

[0013] Technical effects

[0014] According to the disclosed technology, the verticality of the external connection terminal can be maintained, and the decline in assembly can be suppressed. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a sectional view of a semiconductor device of a first embodiment.

[0016] Figure 2 is a view for explaining a ceramic circuit substrate of the first embodiment.

[0017] Figure 3 is a view for explaining a contact member of the first embodiment.

[0018] Figure 4 is a view for explaining an external connection terminal of the first embodiment.

[0019] Figure 5 is a flowchart showing a manufacturing process of the semiconductor device of the first embodiment.

[0020] Figure 6 is a view for explaining a mounting process of a housing with respect to a ceramic circuit substrate of the first embodiment (1).

[0021] Figure 7 is a view for explaining a mounting process of a housing with respect to a ceramic circuit substrate of the first embodiment (2).

[0022] Figure 8is a view for explaining a mounting process of the housing of the first embodiment to the ceramic circuit board (Fig. 3).

[0023] Figure 9 is a view for explaining another external connection terminal of the first embodiment (Fig. 1).

[0024] Figure 10 is a view for explaining another external connection terminal of the first embodiment (Fig. 2).

[0025] Figure 11 is a sectional view of a semiconductor device of the second embodiment.

[0026] Figure 12 is a view for explaining a mounting process of the housing of the second embodiment to the ceramic circuit board (Fig. 1).

[0027] Figure 13 is a view for explaining a mounting process of the housing of the second embodiment to the ceramic circuit board (Fig. 2).

[0028] Figure 14 is a sectional view of a semiconductor device of the third embodiment.

[0029] Figure 15 is a view for explaining a mounting process of the housing of the third embodiment to the ceramic circuit board (Fig. 1).

[0030] Figure 16 is a view for explaining a mounting process of the housing of the third embodiment to the ceramic circuit board (Fig. 2).

[0031] Symbol explanation

[0032] 10, 10a, 10b semiconductor device, 11 insulating plate, 12 heat dissipation plate, 13 conductive plate, 14 ceramic circuit board, 15 semiconductor chip, 16 solder, 17 contact member, 17a, 19a body portion, 17b through hole, 17b1, 17b2 open end portion, 17c1, 17c2 flange, 18 bonding wire, 19, 29 external connection terminal, 19a1 side surface, 19b, 19c front end portion, 19d, 29d, 39d guide portion, 19d1, 29d1, 32d1, 39d1, 42d1 inclined surface, 19d2 outer surface, 20, 30, 40 outer case, 21 side wall, 22, 32, 42 upper cover plate, 22a, 32a, 42a insertion hole, 22b, 32b, 42b inlet, 22c, 32c, 42c outlet, 22d, 32d, 42d inner wall surface, 50 printed circuit board, 51 fitting hole DETAILED DESCRIPTION

[0033] Hereinafter, embodiments will be described with reference to the accompanying drawings. It should be noted that in the following description, "front" and "top surface" are used interchangeably. Figure 1 In the semiconductor device 10, the surface facing upwards is indicated. Similarly, "upper" is used in... Figure 1 In the semiconductor device 10, the upper side is indicated. "Back side" and "lower surface" are... Figure 1 In the semiconductor device 10, the side facing downwards is indicated. Similarly, "down" is... Figure 1 The direction indicated in the semiconductor device 10 is the lower side. The same directionality may be indicated in other figures as needed. The terms "front," "upper surface," "upper," "back side," "lower surface," "lower," and "side" are merely expressions to facilitate the determination of relative positional relationships and do not limit the technical concept of the invention. For example, "upper" and "lower" do not necessarily refer to the vertical direction relative to the ground. That is, the directions of "upper" and "lower" are not limited to the direction of gravity.

[0034] [First Implementation Method]

[0035] use Figures 1-4 The semiconductor device of the first embodiment is described. Figure 1 This is a cross-sectional view of the semiconductor device according to the first embodiment. Furthermore, Figure 2 This is a diagram illustrating the ceramic circuit board of the first embodiment. Figure 3 This is a diagram illustrating the contact component of the first embodiment. Figure 4 This is a diagram illustrating the external connection terminals of the first embodiment. It should be noted that... Figure 2 (A) represents a top view of the ceramic circuit board 14. Figure 2 (B) indicates Figure 2 A cross-sectional view at the single-dotted dashed line X-X in (A). Figure 3 (A) represents a top view of contact component 17. Figure 3 (B) indicates Figure 3 A cross-sectional view at the single-dotted dashed line X-X in (A). Figure 4 (A) represents a front view of the external connection terminal 19. Figure 4 (B) indicates Figure 4 A cross-sectional view at the single-dotted dashed line X-X in (A).

[0036] like Figure 1As shown, the semiconductor device 10 includes a ceramic circuit board 14, a semiconductor chip 15 disposed on the ceramic circuit board 14, and contact members 17. Furthermore, the semiconductor device 10 has an outer casing 20 for housing these components. Additionally, the semiconductor device 10 has an external connection terminal 19. The lower end of the external connection terminal 19 is pressed into the contact member 17, and a portion of its upper end extends out from the outer casing 20. Furthermore, the semiconductor device 10 has a printed circuit board 50 mounted on the external connection terminal 19 extending from the outer casing 20.

[0037] The ceramic circuit board 14 is plate-shaped, with its front side facing the inside of the semiconductor device 10 and its back side facing the outside of the semiconductor device 10 as its main surfaces. Furthermore, the ceramic circuit board 14 has an insulating plate 11, a heat sink 12 formed on the back side of the insulating plate 11, and a conductive plate 13 formed on the front side of the insulating plate 11. The semiconductor chip 15 is bonded to the conductive plate 13 via solder 16. Additionally, contact members 17 are bonded to the conductive plate 13 via solder 16. The conductive plate 13 of this ceramic circuit board 14 is electrically connected to the electrodes on the front side of the semiconductor chip 15, and the conductive plates 13 and the electrodes on the front side of the semiconductor chip 15 are electrically connected via bonding wires 18 and other wiring members. Therefore, the semiconductor chip 15 and the contact members 17 are electrically connected via bonding wires 18 and the conductive plate 13.

[0038] like Figure 2 As shown, this ceramic circuit board 14 has an insulating plate 11, a heat sink 12 formed on the back side of the insulating plate 11, and a conductive plate 13 formed on the front side of the insulating plate 11. The insulating plate 11 is made of a ceramic with high thermal conductivity, such as alumina, aluminum nitride, or silicon nitride. The heat sink 12 is made of a metal with high thermal conductivity, such as aluminum, iron, silver, copper, or an alloy containing at least one of these metals. The conductive plate 13 is made of a metal with high conductivity, such as copper or a copper alloy. It should be noted that the number and shape of the conductive plates 13 are just one example; other numbers and shapes are also possible. Furthermore, the circles depicted with dashed lines on the conductive plates 13 indicate the placement positions of the contact members 17. The rectangles depicted with dashed lines on the conductive plates 13 indicate the placement positions of the semiconductor chips 15. The placement positions of the contact members 17 and the semiconductor chips 15 are just one example and are not limited to this case. As a ceramic circuit board 14 having such a configuration, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazed) substrate can be used.

[0039] Further, on the back surface of the ceramic circuit board 14, although not shown, a base plate can be provided via solder or silver solder or the like. The base plate is composed of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these metals, which have excellent thermal conductivity. Further, in order to improve corrosion resistance, for example, a material such as nickel can be formed on the surface of the base plate by plating treatment or the like. Further, a cooler (not shown) can be installed on the back surface side of the heat sink 12 to improve heat dissipation. The cooler is composed of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these metals, which have excellent thermal conductivity. Further, as the cooler, a heat sink, a heat sink composed of a plurality of heat sinks, a cooling device based on water cooling, or the like can be applied. Further, the base plate can be composed integrally with such a cooler. In this case, it is composed of aluminum, iron, silver, copper, or an alloy containing at least one of these metals, which have excellent thermal conductivity. Further, in order to improve corrosion resistance, for example, a material such as nickel can be formed on the surface of the base plate integrated with the cooler by plating treatment or the like.

[0040] The semiconductor chip 15 includes a switching element such as an IGBT, a power MOSFET, or the like composed of silicon or silicon carbide. Such a semiconductor chip 15 has, for example, a drain electrode (or a collector electrode) as a main electrode on the back surface and a gate electrode and a source electrode (or an emitter electrode) as main electrodes on the front surface. Further, the semiconductor chip 15 includes, as needed, a diode such as an SBD (Schottky Barrier Diode), an FWD (Free Wheeling Diode), or the like. Such a semiconductor chip 15 has a cathode electrode as a main electrode on the back surface and an anode electrode as a main electrode on the front surface. Note that, as needed, an electronic component can be provided in addition to the semiconductor chip 15. Note that the electronic component is, for example, a resistor, a thermistor, a capacitor, a surge absorber, or the like.

[0041] As shown in FIG. 1, the semiconductor module 1 includes a heat sink 12, a ceramic circuit board 14, and a semiconductor chip 15. The semiconductor chip 15 is mounted on the ceramic circuit board 14 via a solder or the like. Figure 3As shown, the contact member 17 includes a body 17a and flanges 17c1 and 17c2. The body 17a has a cylindrical through hole 17b formed inside, and the flanges 17c1 and 17c2 are respectively provided at the open ends 17b1 and 17b2 of the body 17a. Although an example is shown here where flanges 17c1 and 17c2 are formed at both open ends 17b1 and 17b2, it is also possible for flanges to be formed only on one side. Such a contact member 17 is made of aluminum, iron, silver, copper, or an alloy containing at least one of these metals, which have excellent electrical conductivity. Furthermore, to improve corrosion resistance, for example, a metal such as nickel or gold can be formed on the surface of the contact member 17 through a plating process. Specifically, in addition to nickel and gold, nickel-phosphorus alloys, nickel-boron alloys, etc., are also used. Furthermore, gold can be laminated onto a nickel-phosphorus alloy. It should be noted that in the contact member 17 configured in this way, the inner diameter D at the opening ends 17b1 and 17b2 of the through hole 17b is preferably 0.3 mm or more and 5.0 mm or less, more preferably 0.6 mm or more and 2.5 mm or less. Furthermore, the height of the contact member 17 is preferably 1.0 mm or more and 7.0 mm or less, more preferably 2.0 mm or more and 5.0 mm or less.

[0042] The bonding wire 18 is made of a metal with excellent conductivity, such as aluminum or copper, or an alloy containing at least one of these metals. It should be noted that, in the case of the bonding wire 18 of the semiconductor device 10, it is made of copper or a copper alloy. Furthermore, its diameter is preferably 100 μm or more and 1 mm or less.

[0043] like Figure 4 As shown, the external connection terminal 19 has a body 19a, guide portions 19d formed at positions away from both ends of the body 19a, and tapered front ends 19b and 19c formed at both ends of the body 19a, respectively. Specifically, the body 19a is a prism-shaped structure formed by side surfaces 19a1, with a square cross-section. Furthermore, its four corners can be chamfered (C-shaped or R-shaped). In addition, the length L of one side of the side surface 19a1 of the cross-section of the external connection terminal 19 is 0.5 mm or more and 2.0 mm or less, and the length of the diagonal is 0.8 mm or more and 2.7 mm or less. That is, it is slightly longer than the inner diameter D of the contact member 17. Furthermore, the guide portions 19d are respectively installed in the intersection area C of the side surfaces 19a1 of the external connection terminal 19. The intersection area C is the area where the side surface 19a1 overlaps with the through hole 22a when the external connection terminal 19 is installed in the insertion hole 22a of the upper cover plate 22 of the outer casing 20. The guide portion 19d is wedge-shaped, having an inclined surface 19d1 and an outer surface 19d2. When the external connection terminal 19 is inserted into the insertion hole 22a of the upper cover plate 22 (see reference...), Figure 1), the inclined surface 19dl is inclined outward from the entrance 22b of the insertion hole 22a toward the center side of the external connection terminal 19 to the exit 22c. Therefore, when the external connection terminal 19 is inserted through the insertion hole 22a of the upper cover plate 22 (refer to Figure 1 ), the inclined surface 19dl is inclined to the external connection terminal 19 side with respect to the insertion direction of the insertion hole 22a by the external connection terminal 19. The outer surface 19d2 is parallel to the insertion direction of the external connection terminal 19. The body portion 19a, the guide portion 19d, and the front end portions 19b, 19c can be integrally formed. Such an external connection terminal 19 can be formed by press-molding a bar-shaped member. Further, the external connection terminal 19 is composed of aluminum, iron, silver, copper, or an alloy containing at least one of these metals, which has excellent electrical conductivity. Further, in order to improve corrosion resistance, the external connection terminal 19 can also have a metal such as nickel or tin formed on the surface by plating treatment or the like.

[0044] The exterior case 20 houses the front surface of the ceramic circuit board 14, the semiconductor chip 15, the contact member 17, and the lower end portion of the external connection terminal 19. The exterior case 20 has a side wall 21 and an upper cover plate 22. The side wall 21 is in a box shape that surrounds the periphery of the ceramic circuit board 14 in plan view. The back surface of the side wall 21 is attached to the peripheral portion of the ceramic circuit board 14 with an adhesive (not shown). The upper cover plate 22 is in a flat plate shape and is disposed so as to cover the opening portion of the side wall 21. The upper cover plate 22 is disposed so as to be horizontally opposed to the main surface of the ceramic circuit board 14. Further, the upper cover plate 22 is formed with a through-hole 22a that is formed at a position corresponding to the external connection terminal 19 in plan view when the exterior case 20 is disposed with respect to the ceramic circuit board 14. Further, the through-hole 22a is formed at a position corresponding to the contact member 17 in plan view. The through-hole 22a has an entrance 22b that penetrates the back surface of the upper cover plate 22 and an exit 22c that penetrates the front surface of the upper cover plate 22 on the opposite side of the back surface from the entrance 22b. The external connection terminal 19 is inserted into the through-hole 22a thus configured. Note that, in the first embodiment, the diameter of the entrance 22b and the exit 22c is the same, for example, 1.0 mm or more and 3.0 mm or less. The external connection terminal 19 that is inserted into the through-hole 22a of the upper cover plate 22 can come into contact with the inner wall surface 22d of the through-hole 22a. The frictional force between the external connection terminal 19 and the inner wall surface 22d of the through-hole 22a is smaller than the fitting force of the contact member 17 with respect to the external connection terminal 19. The side wall 21 and the upper cover plate 22 of the exterior case 20 can be formed in one body. The exterior case 20 is composed of a thermoplastic resin. The thermoplastic resin is, for example, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, or acrylonitrile butadiene styrene (ABS) resin, or the like. Further, in the exterior case 20, although not shown, encapsulation is preferably performed with an encapsulation resin. The encapsulation member can be, for example, silicone. Further, for example, a thermosetting resin such as an epoxy resin, a phenol resin, a maleimide resin, or the like, and a filler contained in the thermosetting resin.

[0045] Further, the printed circuit board 50 is formed with a fitting hole into which the external connection terminal 19 is fitted and has an insulating board and a circuit pattern formed on the front surface of the insulating board. In the printed circuit board 50, if the external connection terminal 19 is fitted, the external connection terminal 19 is electrically connected to the circuit pattern. The control current and the main current for input and output of such a printed circuit board 50 are conducted through the external connection terminal 19. Further, in the printed circuit board 50, as needed, a control IC (Integrated Circuit) or the like can be mounted to form a control circuit. Instead of or together with the control IC, electronic components such as a resistor, a thermistor, a capacitor, a surge absorber, or the like can be mounted.

[0046] Next, the useFigure 5 An example of a manufacturing method of such a semiconductor device 10 will be described. Figure 5 is a flowchart showing the manufacturing process of the semiconductor device of the first embodiment. Note that the following description of the manufacturing process of the semiconductor device will be given with reference to Figure 5 The processes shown in FIG. 8 can be performed using either manual work, a machine, or both.

[0047] [Step S10] The constituent components of the semiconductor device 10, such as the ceramic circuit substrate 14, the semiconductor chip 15, the contact member 17, the external connection terminal 19, and the like, are prepared.

[0048] [Step Sll] The contact member 17 is joined to the conductive plate 13 of the ceramic circuit substrate 14 at a predetermined position thereof via the solder 16. At this time, the semiconductor chip 15 is also joined to the conductive plate 13 of the ceramic circuit substrate 14 via the solder 16 at a predetermined position thereof. Note that the solder 16 is composed of, for example, a lead-free solder, and the lead-free solder has at least one of an alloy composed of tin-silver-copper, an alloy composed of tin-zinc-bismuth, an alloy composed of tin-copper, and an alloy composed of tin-silver-indium-bismuth as a main component. Further, an additive such as nickel, germanium, cobalt, or silicon can be contained.

[0049] [Step S12] The external connection terminal 19 is inserted from above (the front side of the inside of the semiconductor device 10 of the ceramic circuit substrate 14) into the contact member 17 joined to the ceramic circuit substrate 14 by Step Sll, and the lower end portion of the external connection terminal 19 is pressed into the contact member 17. Note that at this time, it is preferable that a gap be present between the lower end portion of the external connection terminal 19 and the ceramic circuit substrate 14 and the solder 16.

[0050] [Step S13] After the external connection terminal 19 is thus pressed into the contact member 17, the conductive plate 13 and the semiconductor chip 15 are appropriately connected by the bonding wire 18 in the ceramic circuit substrate 14. Note that after such wire bonding, a base plate can be mounted to the back surface of the ceramic circuit substrate 14 via a solder or a silver solder, or the like, as needed. Alternatively, a cooler (not shown) can be mounted to the back surface side of the heat dissipation plate 12 to improve the heat dissipation property. Note that Step S13 can be performed before Step S12.

[0051] [Step S14] The housing 20 is mounted to the ceramic circuit substrate 14 on which the external connection terminal 19 and the like have been mounted up to Step S13. As for this mounting process, further use Figures 6-8 will be described in detail. Figures 6-8 is a view for explaining the mounting process of the housing to the ceramic circuit substrate of the first embodiment. Note that the following description of the mounting process of the housing to the ceramic circuit substrate will be given with reference to Figures 6-8 is shown in Figure 1The left side of the cross-sectional view. It should be noted that, at this time, it is assumed that, for example, when the external connection terminal 19 is pressed into the contact member 17 in step S11 or after pressing, the contact member 17 or the external connection terminal 19 is slightly tilted due to the warping of the ceramic circuit board 14, the tilting of the welding fixture of the contact member 17, and the tilting when the external connection terminal 19 is inserted.

[0052] First, the outer casing 20 is configured such that the inlet 22b of the insertion hole 22a of the upper cover plate 22 of the outer casing 20 corresponds to the external connection terminal 19 (see reference). Figure 6 Next, the external connection terminal 19 is inserted into the inlet 22b of the upper cover plate 22, and then the outer casing 20 is lowered until the inlet 22b of the upper cover plate 22 abuts against the guide portion 19d of the external connection terminal 19 (see reference). Figure 7 It should be noted that at this time, because the external connection terminal 19 is tilted, the tilted surface 19d1 of the guide portion 19d abuts against the inlet 22b of the upper cover plate 22. Next, if the outer casing 20 is further lowered, the tilted surface 19d1 of the guide portion 19d of the external connection terminal 19 slides in the inlet 22b of the insertion hole 22a of the upper cover plate 22. Thus, the external connection terminal 19 is guided to be perpendicular to the ceramic circuit board 14. Then, the outer surface 19d2 of the guide portion 19d contacts the inner wall surface 22d of the insertion hole 22a of the upper cover plate 22, and the upper cover plate 22 is mounted on the external connection terminal 19 (see reference). Figure 8 It should be noted that in the first embodiment, the external connection terminal 19 is shown facing... Figure 6 The case of the right-hand tilt. Not limited to this case, the external connection terminal 19 is guided to be vertical regardless of its tilt direction. Thus, for the ceramic circuit board 14, the mounting housing 20 (see reference) Figure 1 It is then encapsulated by filling the interior with encapsulating resin.

[0053] The semiconductor device 10 described above has the semiconductor chip 15 and the ceramic circuit substrate 14 having the conductive plate 13 on which the semiconductor chip 15 is provided on the front surface and the insulating plate 11 on which the conductive plate 13 is formed on the front surface. Further, the semiconductor device 10 has the cylindrical contact member 17 provided on the conductive plate 13 via the solder 16 and the external connection terminal 19 which is a rod-shaped and is fitted (press-fitted) to the lower end portion of the contact member 17. Furthermore, the semiconductor device 10 has the flat upper cover plate 22 through which the external connection terminal 19 is inserted from the inlet 22b to the outlet 22c of the insertion hole 22a, the inlet 22b being on the back surface of the upper cover plate 22 opposite to the main surface of the ceramic circuit substrate 14, and the outlet 22c being on the front surface of the back surface of the upper cover plate 22 opposite to the inlet 22b. In this case, the intersection region C of the side surface 19al of the external connection terminal 19 overlapping with the insertion hole 22a is provided with the inclined surface 19dl inclined to the external connection terminal 19 side with respect to the insertion direction of the insertion hole 22a. In the case where the contact member 17 is installed inclined with respect to the main surface of the ceramic circuit substrate 14, the external connection terminal 19 is also inclined in conjunction therewith. Such an external connection terminal 19, if inserted through the insertion hole 22a of the upper cover plate 22, is guided to be installed perpendicular to the main surface of the ceramic circuit substrate 14 by the inclined surface 19dl of the guide portion 19d. Thus, it is possible to install the external connection terminal 19 protruding from the upper cover plate 22 of the outer case 20 to a suitable position of a printed circuit board, and it is possible to achieve improvement of assemblability. Further, if the outer case 20 is installed in this way, the external connection terminal 19 is supported at the lower end portion thereof by the contact member 17 and at the upper end portion side thereof by the upper cover plate 22. Therefore, even if the semiconductor device 10 is subjected to an impact or the like from the outside, it is possible to prevent inclination of the external connection terminal 19 and maintain perpendicularity of the external connection terminal 19 with respect to the ceramic circuit substrate 14. Therefore, when the external connection terminal 19 is installed to the fitting hole 51 of the printed circuit board 50, even if the external connection terminal 19 collides against the back surface or the like of the printed circuit board 50 other than the fitting hole 51, the external connection terminal 19 does not incline but maintains perpendicularity. Thus, workability of the work of installing the printed circuit board 50 is improved.

[0054] It should be noted that the use of Figure 9 and Figure 10 will be described below. Figure 9 and Figure 10 are diagrams for explaining other external connection terminals of the first embodiment. For example, in Figure 9The intersecting region C of the opposite side surface 19al of the external connection terminal 19 is provided with a guide portion 29d. The guide portion 29d is composed of an elastic member in a semicircular shape in side view. As such an elastic member, metal or the like can be used. The outer surface of the circular guide portion 29d functions as an inclined surface 29dl. In the case where the external connection terminal 19 is inclined with respect to the ceramic circuit board 14, the guide portion 29d also functions in the same way as the guide portion 19d of the external connection terminal 19.

[0055] Further, Figure 10 The external connection terminal 19 is provided with the guide portion 39d in such a manner that the guide portion 39d surrounds the intersecting region C of the side surface 19al overlapping the insertion hole 22a when the mounting upper cover plate 22 is mounted. The guide portion 39d is composed of a resin in a circular or elliptical shape in side view. The resin is, for example, a maleimide-modified epoxy resin, a maleimide-modified phenol resin, a maleimide resin, or the like. The outer surface of the guide portion 39d functions as an inclined surface 39dl. In the case where the external connection terminal 19 is inclined with respect to the ceramic circuit board 14, the guide portion 39d also functions in the same way as the guide portion 19d of the external connection terminal 19.

[0056] [Second Embodiment]

[0057] In the second embodiment, a maleimide-modified epoxy resin is used as the resin of the guide portion 39d. Figure 11 The insertion hole formed in the upper cover plate is different from that of the first embodiment. Figure 11 is a sectional view of a semiconductor device of the second embodiment. Note that the semiconductor device 10a of the second embodiment has the same configuration as the semiconductor device 10 of the first embodiment except for the mounting position of the guide portion 19d of the external connection terminal 19 and the upper cover plate 32 of the exterior case 30, and the description thereof is omitted.

[0058] The semiconductor device 10a is provided with the upper cover plate 32 instead of the upper cover plate 22 of the semiconductor device 10 of the first embodiment. The insertion hole 32a formed in the upper cover plate 32 is configured such that the area of the entrance 32b on the back surface is larger than the area of the exit 32c on the front surface. Also, the external connection terminal 19 is provided with the guide portion 19d having the inclined surface 19dl at the intersecting region C of the side surface 19al overlapping the insertion hole 32a, as in the first embodiment (see FIG. 6). Figure 4 Further, the inner wall surface 32d of the insertion hole 32a of the upper cover plate 32 is provided with the inclined surface 32dl inclined toward the external connection terminal 19 with respect to the insertion direction of the external connection terminal 19 into the insertion hole 32a. That is, the insertion hole 32a has a shape in which the diameter is reduced from the entrance 32b toward the exit 32c of the upper cover plate 32. Note that Figure 11The insertion hole 32a of the housing 30 indicates a case where the diameter is reduced from the entrance 32b toward the exit 32c and becomes the same diameter from the middle to the exit 32c. In the semiconductor device 10a having such a configuration, the external connection terminal 19 is inserted through the insertion hole 32a from the entrance 32b, and the inclined surface 19dl of the guide portion 19d comes into contact with the inclined surface 32dl of the insertion hole 32a. The manufacturing method of such a semiconductor device 10a can also be manufactured according to the steps S10 to S14 of the flowchart shown in FIG. 10. Figure 5 The details of the step S14 of the semiconductor device 10b will be described below using the flowchart shown in FIG. 11.

[0059] Therefore, the details of the step S14 of the semiconductor device 10b will be described below using the flowchart shown in FIG. 11. Figure 12 Figure 13 Figure 5 Figure 12 Figure 13 is a view for explaining the mounting process of the housing with respect to the ceramic circuit board in the second embodiment. In the second embodiment, the same processes as the steps S10 to S13 are also performed. Note that in the second embodiment, a case where the external connection terminal 19 that is fitted into the contact member 17 in the step S12 does not fit into the contact member 17 properly due to some reason and becomes different in height, for example, as shown in FIG. 12, is described. Note that at this time, in the external connection terminal 19 (the external connection terminal 19 on the right side in FIG. 12) that is higher in height than the other external connection terminals 19 at the position of the height of the tip end portion 19c, a gap exists between the (lower) tip end portion 19b of the external connection terminal 19 (the tip end portion 19b is omitted in FIG. 13) and the ceramic circuit board 14 and the solder 16. Figure 12 Figure 12 Figure 12

[0060] In the step S14, the housing 30 is mounted on the ceramic circuit board 14 on which the external connection terminal 19 and the like are mounted, as in the first embodiment. In this mounting process, first, the housing 30 is disposed so that the entrance 32b of the upper cover plate 32 of the housing 30 corresponds to the external connection terminal 19. Next, the housing 30 is lowered toward the ceramic circuit board 14, and the external connection terminal 19 is caused to enter the entrance 32b of the upper cover plate 32. Then, the inclined surface 19dl of the guide portion 19d of the external connection terminal 19 comes into contact with the inclined surface 32dl of the insertion hole 32a of the upper cover plate 32. In this state, if the housing 30 is further lowered toward the ceramic circuit board 14, the inclined surface 32dl of the insertion hole 32a of the upper cover plate 32 comes into contact with and overlaps the inclined surface 19dl of the guide portion 19d of the external connection terminal 19. From this state, the housing 30 (the upper cover plate 32) is further pressed toward the ceramic circuit board 14. Thus, the heights of the external connection terminals 19 that are fitted into the contact member 17 with different heights can be made uniform (see FIG. 14). Figure 13 ​​​​​​​). Further, the exterior case 30 is lowered toward the ceramic circuit substrate 14 side to mount the exterior case 30 to the ceramic circuit substrate 14 (refer to Figure 11

[0061] The semiconductor device 10a described above has the semiconductor chip 15 and the ceramic circuit substrate 14 having the conductive plate 13 on which the semiconductor chip 15 is provided on the front surface and the insulating plate 11 on which the conductive plate 13 is formed on the front surface. Further, the semiconductor device 10a has the cylindrical contact member 17 provided on the conductive plate 13 via the solder 16 and the rod-shaped external connection terminal 19 whose lower end portion is fitted to the contact member 17. Further, the semiconductor device 10a has the flat plate-shaped upper cover plate 32 in which the external connection terminal 19 is inserted through the insertion hole 32a that penetrates the inlet 32b and the outlet 32c from the inlet 32b to the outlet 32c, the inlet 32b being on the back surface of the upper cover plate 32 opposite to the main surface of the ceramic circuit substrate 14, and the outlet 32c being on the front surface of the back surface of the upper cover plate 32 opposite to the inlet 32b. In this case, the intersecting region C of the side surface 19al of the external connection terminal 19 overlapping the insertion hole 32a and the inner wall surface 32d of the insertion hole 32a have the inclined surfaces 19dl, 32dl, respectively, that are inclined to the external connection terminal 19 side with respect to the insertion direction of the external connection terminal 19 to the insertion hole 32a. If the external connection terminal 19 that is fitted to the contact member 17 and has different heights is inserted through the insertion hole 32a of the upper cover plate 32, the inclined surface 19dl of the guide portion 19d of the external connection terminal 19 is pressed by the inclined surface 32dl of the insertion hole 32a of the upper cover plate 32. Therefore, the external connection terminal 19 is pressed to the contact member 17 with the same height. Further, the inclined external connection terminal 19 can be guided to be perpendicular to the main surface of the ceramic circuit substrate 14 by the inclined surface 32dl of the insertion hole 32a of the upper cover plate 32 as in the first embodiment. Thus, the external connection terminal 19 can be pressed into the contact member 17 with a suitable fitting force, and the external connection terminal 19 that protrudes from the upper cover plate 32 of the exterior case 30 can be mounted to a suitable position of the printed circuit substrate, and improvement of the assembly can be achieved. Further, in this case, the external connection terminal 19 is also supported by the contact member 17 at the front end portion 19b thereof and by the upper cover plate 32 at the front end portion 19c thereof to maintain the perpendicularity of the external connection terminal 19 with respect to the ceramic circuit substrate 14. Therefore, the workability of the work of mounting the printed circuit substrate 50 to the external connection terminal 19 is improved.

[0062] ​It should be noted that the guide portion 19d of the external connection terminal 19 does not necessarily need the outer surface 19d2, and can be a wedge shape of a triangle including the inclined surface 19dl in side view. Furthermore, for such an external connection terminal 19, the inclined surface 32dl formed by the insertion hole 32a of the upper cover plate 32 can also be, for example, a shape directly connecting the inlet 32b and the outlet 32c like the inclined surface 42dl of the external connection terminal 29 of the third embodiment described later. Figure 14

[0063] [Third Embodiment]

[0064] In the third embodiment, unlike the first embodiment, the guide portion 19d is not formed in the external connection terminal 29, and the inclined surface 42dl is formed in the insertion hole 42a of the upper cover plate 42. With respect to this case, the Figure 14 will be described. Figure 14 is a cross-sectional view of the semiconductor device of the third embodiment. It should be noted that the semiconductor device 10b of the third embodiment has the same configuration as the semiconductor device 10 of the first embodiment except for the upper cover plate 42 of the package 40 and the external connection terminal 29, and the description thereof will be omitted.

[0065] The semiconductor device 10b is provided with the upper cover plate 42 in place of the upper cover plate 22 of the semiconductor device 10 of the first embodiment. The insertion hole 42a formed in the upper cover plate 42 is configured such that the area of the inlet 42b on the back surface is larger than the area of the outlet 42c on the front surface. Furthermore, the inner wall surface 42d of the insertion hole 42a is inclined toward the external connection terminal 29 side with respect to the direction of insertion of the external connection terminal 29 into the insertion hole 42a. Thus, the inner wall surface 42d of this case can also be referred to as the inclined surface 42dl. That is, the insertion hole 42a has a shape in which the diameter is reduced (diameter-reduced) from the inlet 42b toward the outlet 42c of the upper cover plate 42. The manufacturing method of such a semiconductor device 10b can also be manufactured in accordance with the steps S10 to S14 of the flowchart shown in Figure 5 .

[0066] Therefore, the details of the step S14 of the Figure 15 and Figure 16 in the third embodiment will be described below. Figure 5 Figure 15 and Figure 16 are diagrams for explaining the mounting process of the package with respect to the ceramic circuit substrate in the third embodiment. In the third embodiment, the same processes as the steps S10 to S13 are also performed. It should be noted that in the third embodiment, it is assumed that the contact member 17 is slightly inclined when the external connection terminal 29 is fitted in the contact member 17 in the step Sll or after being fitted.

[0067] ​​First, the outer case 40 is disposed so that the inlet 42b of the upper cover plate 42 of the outer case 40 corresponds to the external connection terminal 29. Next, the outer case 40 is lowered toward the ceramic circuit board 14 side so that the external connection terminal 29 enters the inlet 42b of the upper cover plate 42. Thus, the front end portion 19c of the external connection terminal 29 abuts against the inclined surface 42dl of the through-hole 42a of the upper cover plate 42 (see Figure 15 ). If the outer case 40 is further lowered from this state toward the ceramic circuit board 14 side, the front end portion 19c of the external connection terminal 29 is guided toward the outlet 42c along the inclined surface 42dl of the through-hole 42a of the upper cover plate 42. Thus, the external connection terminal 29 is inserted through the through-hole 42a while maintaining perpendicularity with respect to the main surface of the ceramic circuit board 14 (see Figure 16 ). The outer case 40 is further lowered toward the ceramic circuit board 14 side to mount the outer case 40 to the ceramic circuit board 14 (see Figure 14 ), and the inside is filled with a sealing resin to perform sealing.

[0068] The semiconductor device 10b described above has the semiconductor chip 15 and the ceramic circuit substrate 14 having the conductive plate 13 on which the semiconductor chip 15 is provided on the front surface and the insulating plate 11 on which the conductive plate 13 is formed on the front surface. Further, the semiconductor device 10b has the cylindrical contact member 17 provided on the conductive plate 13 via the solder 16 and the external connection terminal 29 which is a rod-shaped and whose lower end portion is fitted to the contact member 17. Furthermore, the semiconductor device 10b has the flat upper cover plate 42 through which the external connection terminal 29 is inserted from the inlet 42b to the outlet 42c of the insertion hole 42a which penetrates the inlet 42b and the outlet 42c, the inlet 42b being on the back surface of the upper cover plate 42 which opposes the main surface of the ceramic circuit substrate 14, and the outlet 42c being on the front surface of the back surface of the upper cover plate 42 which opposes the inlet 42b. In this case, the inner wall surface 42d of the insertion hole 42a of the upper cover plate 42 is provided with the inclined surface 42dl which is inclined to the external connection terminal 29 side with respect to the insertion direction of the external connection terminal 29 to the insertion hole 42a. In the case where the contact member 17 is installed inclined with respect to the main surface of the ceramic circuit substrate 14, the external connection terminal 29 is also inclined in conjunction therewith. Such an external connection terminal 29, if inserted to the insertion hole 42a of the upper cover plate 42, slides along the inclined surface 42dl of the insertion hole 42a and is maintained perpendicular to the main surface of the ceramic circuit substrate 14 to install the upper cover plate 42. Thus, it is possible to install the external connection terminal 29 which protrudes from the upper cover plate 42 of the package 40 to a suitable position of the printed circuit substrate, and it is possible to achieve improvement of the assembly. Further, in this case, the external connection terminal 29 is also supported by the contact member 17 at its lower end portion and by the upper cover plate 42 at its front end portion side to maintain the perpendicularity of the external connection terminal 29 with respect to the ceramic circuit substrate 14. Therefore, the workability of the work of installing the printed circuit substrate 50 to the external connection terminal 29 is improved.

Claims

1. A semiconductor device, characterized in that, have: Semiconductor chips; A substrate having a conductive plate and an insulating plate, wherein the semiconductor chip is disposed on the front side of the conductive plate, and the conductive plate is formed on the front side of the insulating plate; A cylindrical contact component is disposed on the conductive plate via a connecting member; A rod-shaped external connection terminal, the lower end of which is fitted into the contact component; as well as A flat top cover has a through-hole with an inlet and an outlet. The inlet is located on the back side of the top cover opposite to the main face of the substrate, and the outlet is located on the front side of the top cover opposite to the back side and opposite to the inlet. An external connection terminal is inserted into the through-hole. At least one of the intersection area on the side of the external connection terminal that overlaps with the through hole and the inner wall surface of the through hole has an inclined surface that slopes from the inlet toward the outlet toward the center side of the external connection terminal. The frictional force between the external connection terminal, which is inserted into the through hole of the upper cover plate, and the through hole is less than the engagement force of the contact component on the external connection terminal.

2. The semiconductor device according to claim 1, characterized in that, A guide portion with the inclined surface is provided in the intersection area.

3. The semiconductor device according to claim 2, characterized in that, The guide portion is wedge-shaped with the inclined surface, and a plurality of them are provided around the intersection area of ​​the external connection terminal.

4. The semiconductor device according to claim 2, characterized in that, The guide portion surrounds the intersection area of ​​the external connection terminal, is made of resin that is circular or elliptical when viewed from the side, and has the inclined surface on a portion of its outer surface.

5. The semiconductor device according to claim 2, characterized in that, The guide portion is composed of an elastic member that is semi-circular when viewed from the side, and has the inclined surface on a portion of its outer surface.

6. The semiconductor device according to claim 1, characterized in that, The inclined surfaces are respectively disposed on the inner wall surface of the intersection area and the insertion hole. The inclined surface of the intersection region overlaps with the inclined surface of the inner wall surface.

7. The semiconductor device according to claim 1, characterized in that, The inclined surface is disposed on the inner wall surface of the insertion hole. When viewed from the side, the diameter of the insertion hole decreases from the inlet toward the outlet.

8. A method for manufacturing a semiconductor device, characterized in that, include: The process of preparing a semiconductor chip, a substrate, a cylindrical contact component, a rod-shaped external connection terminal, and a flat top cover plate, wherein the substrate has a conductive plate and an insulating plate on the front side of the conductive plate, and the top cover plate has a through hole with an inlet and an outlet, the inlet being located on the back side of the top cover plate, and the outlet being located on the front side of the top cover plate opposite to the back side and opposite to the inlet. In the bonding process, the semiconductor chip is bonded to the conductive plate on the main surface of the substrate, and the contact member is bonded to the conductive plate by a bonding member. In the fitting process, the lower end of the external connection terminal is fitted into the contact member from the main surface side of the substrate; as well as In the installation process, the back side of the upper cover plate is placed opposite the main side of the substrate, the upper cover plate is covered from the main side of the substrate, and the external connection terminal is inserted from the inlet of the upper cover plate to the outlet to install the upper cover plate; At least one of the intersection area on the side of the external connection terminal that overlaps with the through hole and the inner wall surface of the through hole has an inclined surface that is inclined toward the external connection terminal side relative to the insertion direction of the external connection terminal through the through hole. The frictional force between the external connection terminal, which is inserted into the through hole of the upper cover plate, and the through hole is less than the engagement force of the contact component on the external connection terminal.

9. The method for manufacturing a semiconductor device according to claim 8, characterized in that, During the installation process, the external connection terminal is guided along the inclined surface from the inlet to the outlet and inserted through the through hole.

10. The method of manufacturing a semiconductor device according to claim 8 or 9, characterized in that, The inclined surfaces are respectively disposed on the inner wall surface of the intersection area and the insertion hole. In the installation process, the inclined surface of the intersection area is overlapped with the inclined surface of the inner wall surface, and the upper cover plate is installed by pressing it against the substrate.

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