Trimming machine for chip electronic components

Abstract

The application discloses a kind of cutting edge machines of chip electronic component in the technical field of chip electronic component cutting equipment, including rack table, top is horizontal work platform, its top edge is covered with a protection cabinet, the protection cabinet is also equipped with alarm and controller, the protection cabinet front is equipped with operating opening, the controller is arranged in the just above operating opening, sliding base, fixed in the rack table top, wherein axis and the central axis of the rack table overlap, sliding rail is equipped on it, can not stop machine to add cutting raw material, also can be through improved suction cup, can be flat and stable suction and translation to thinner chip electronic component, and chip electronic component will not be deformed due to suction force, and through cleaning device, chip electronic component can be cleaned up in time with the corner material cut off, ensure that next time cutting again will not affect the normal work of blade.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cutting equipment for chip electronic components, in particular to a trimming machine for chip electronic components. BACKGROUND

[0002] In the process of automatic production and processing, material supply equipment is usually needed to improve processing efficiency. For example, in the cutting process of chip electronic components, in order to improve production efficiency, a feeding device is usually used to supply materials instead of manual feeding. The trimming machine is used to cut off the edge material of the smaller electronic components cut by the slitting machine, expose the side electrode, and the electrode is the recording point of the image capture of the cutting machine. It is also a very important comparison parameter when cutting, and is also an important monitoring standard for whether it is qualified. The existing cutting machine has the following shortcomings:

[0003] Firstly, for chip electronic components in the semiconductor industry, in the process of processing and manufacturing, the whole piece of electronic component is usually sucked and moved to the workbench by a vacuum suction device, and then cut into a piece of single chip electronic component. Because the chip electronic component is very thin and soft, the suction nozzle or suction disc is easy to deform the chip electronic component during vacuum suction, forming an upward bulge or bump at the contact position of the suction nozzle or suction disc, which affects the quality of the chip electronic component;

[0004] Secondly, in the process of cutting chip electronic components by the blade, the trimming machine will cut off the edges of the chip electronic components during cutting, leaving only the chip electronic components that are neat and meet the size requirements. However, the cut-off corners of the chip electronic components are not needed, and these corner materials will remain on the cutting table, which will affect the next cutting and block the detection line of sight, so that the trimming machine cannot accurately monitor the electrode on the side of the electronic component, so that the device cannot accurately determine the cutting point. Moreover, the cut-off waste corner material will affect the cutting angle of the cutting blade, resulting in that the cutting precision of the chip electronic component cannot be guaranteed.

[0005] Therefore, the present application designs a trimming machine for chip electronic components to solve the above problems. SUMMARY

[0006] The purpose of the present application is to provide a trimming machine for chip electronic components, which can add cutting raw materials without stopping the machine, and can use an improved suction disc to stably suck and translate the thin chip electronic components, and the chip electronic components will not be deformed due to suction force. Moreover, the cutting corner material of the chip electronic components can be cleaned in time by the cleaning device, so as to ensure that the blade can work normally during the next cutting.

[0007] The present application is implemented as follows: a trimming machine for chip electronic components, comprising:

[0008] The machine frame has a horizontal work platform on top, and a protective cabinet is installed on the top edge of the cabinet. The protective cabinet is equipped with an alarm and a controller. The front of the protective cabinet has an operating opening, and the controller is located directly above the operating opening.

[0009] A sliding base is fixed to the top of the frame platform, wherein the axis of the base overlaps with the central axis of the frame platform, and a slide rail is provided thereon;

[0010] A cutting table is mounted on the slide rail that can rotate horizontally.

[0011] A support frame is fixedly mounted above a sliding base. The sliding base is also laterally fixed with a slide rail beam, on which a translation motor is installed.

[0012] A cutting device, which can be lifted and mounted on a support frame, is suspended directly above the cutting table, and is located on the side near the front of the machine frame.

[0013] The waste hopper is a square funnel-shaped structure with its top opening located near the edge of the front of the frame platform and its bottom opening located inside the frame platform, directly below one end of the front of the sliding base.

[0014] Both the raw material rack and the finished product rack are mounted on the top of one side of the front of the machine frame, and the bottom of both the raw material rack and the finished product rack are mounted on the machine frame via vertically arranged cylinders.

[0015] The raw material rack and the finished product rack have the same structure, and are equipped with a limiting plate for holding the chip electronic components; the raw material rack and the finished product rack are symmetrically arranged on the left and right sides of the sliding base;

[0016] There are at least two CCD detectors, which are respectively mounted on the left and right sides of the cutting table and are positioned directly opposite the cutting area of ​​the cutting table.

[0017] The feeding suction cup and the finished product suction cup are suspended on the slide rail beam by a motor that moves up and down. They are both driven laterally on the slide rail beam by a translation motor. They are respectively set directly above the raw material rack and the finished product rack, and the working positions of the raw material rack and the finished product rack overlap with the projected positions of the raw material rack, the cutting table and the finished product rack, respectively. The feeding suction cup and the finished product suction cup have the same structure.

[0018] The feeding suction cup comprises a cover plate, a suction cup, a suction cup adjustment plate, a suction plate, and a connecting buffer frame. The connecting buffer frame is mounted on the slide rail beam and can be raised and lowered by a cylinder. The cover plate is installed at the bottom of the connecting buffer frame by a spring. The suction plate is locked and fixed to the bottom of the cover plate. The suction cup adjustment plate is installed below the suction plate and can be adjusted by an adjusting screw. The suction cup adjustment plate is not connected to the suction plate. Multiple suction cups are evenly fixed at the bottom of the suction plate. The bottom end of each suction cup extends through the suction cup adjustment plate and the top of each suction cup is sealed and connected to an external negative pressure device on the suction plate.

[0019] The sweeping device includes a sweeping roller, a sweeping motor, a lifting frame, and a lifting cylinder. The sweeping roller is horizontally mounted on the rotating shaft of the sweeping motor. The sweeping motor is mounted on the lifting frame. The lifting frame is hoisted on a support frame and can be raised and lowered by the lifting cylinder.

[0020] The cleaning device is located on one side of the back of the support frame, and the cleaning device and the cutting device do not interfere with each other;

[0021] The controller is communicatively connected to the alarm, CCD detector, cleaning device, cutting table, cutting device, feeding suction cup, raw material rack, finished product rack, and finished product suction cup.

[0022] Furthermore, the bottom of the suction cup is a silicone suction plate surface, which is connected to an external negative pressure device through a buffer elastic sleeve. The diameter of the suction plate surface of each suction cup does not exceed 15mm, and multiple micro-suction holes are opened on the suction plate surface of each suction cup. Each micro-suction hole is connected to an external negative pressure device through a suction cup suction tube.

[0023] Furthermore, the buffer elastic sleeve is a tubular rubber elastic joint, and the diameter of the micro-suction hole does not exceed 1mm.

[0024] Furthermore, the controller is a PLC controller.

[0025] Furthermore, the cleaning roller is a roller-shaped soft brush;

[0026] When the lifting cylinder extends, the cleaning roller is in close contact with the cutting table;

[0027] When the lifting cylinder retracts, the cleaning roller separates from the cutting table.

[0028] Furthermore, the cutting device includes a lifting motor, a cutting limit block, a connecting frame, and a blade. The blade is mounted on the lifting screw of the lifting motor via the connecting frame. The lifting motor is fixed on the support frame. The bottom of the connecting frame is also elastically fitted with a cutting limit block, which is clamped on the front and rear sides of the blade without contact.

[0029] Furthermore, the top of the cutting table is a flat surface with a horizontal orientation, and it is provided with a plurality of suction holes, each of which has a diameter of no more than 1 mm and is connected to an external vacuum device.

[0030] Furthermore, when the raw material rack and finished product rack are lowered to the top of the machine frame, the height difference between the raw material rack and the finished product rack and the cutting table is not less than 25cm.

[0031] The beneficial effects of the present invention are as follows: 1. The present invention adds a cleaning device, which can move up and down through a lifting cylinder, so that it can fit closely to the cutting table or be separated from the cutting table, thus facilitating the cleaning of the cutting table and ensuring that the cutting table is clean every time it is cut, thus ensuring cutting accuracy. In addition, when the device is cleaning, it can roll the cut-off scraps into the waste funnel, so that they do not accumulate on the machine frame and do not affect the normal operation of other devices.

[0032] 2. The suction cup of this device is different from ordinary suction cups. It can not only stably pick up and move chip electronic components, but also generate multiple small and uniform suction forces through multiple micro suction holes. This can avoid the deformation of electronic components by large suction forces and concave suction cups, thus avoiding the scrapping of electronic components.

[0033] 3. This device can detect whether the cut of electronic components meets production requirements in a timely manner through the cooperation of CCD detector and cutting device. It can issue a warning in a timely manner through the alarm and handle the situation in time to prevent unqualified products from entering the market. The CCD detector of this device can also check whether the cutting blade is intact in a timely manner, thereby ensuring the cutting accuracy.

[0034] 4. The raw material rack and finished product rack of this device can be raised and lowered on the machine frame, away from the cutting edge and cutting table, and away from the moving slide rails to avoid danger. Therefore, this device can put in raw materials and take out finished products without stopping the machine. The raw material rack and finished product rack of this device are fixed, which can ensure that the raw materials are put in the accurate position, improve the cutting accuracy and the accuracy of the material suction cup. Attached Figure Description

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] Figure 1 This is a schematic diagram of the overall external front structure of the present invention;

[0037] Figure 2 This is a schematic diagram of the overall external rear structure of the present invention;

[0038] Figure 3 This is an overall external front view of the present invention;

[0039] Figure 4 This is a schematic diagram of the front structure of the present invention;

[0040] Figure 5 This is a schematic diagram of the rear structure inside the present invention;

[0041] Figure 6 This is a schematic diagram showing the positional relationship between the sliding base and the waste funnel of the present invention;

[0042] Figure 7 This is a schematic diagram showing the positional relationship between the support frame and the cutting table of the present invention;

[0043] Figure 8 This is a schematic diagram of the cutting device structure of the present invention;

[0044] Figure 9 This is a schematic diagram of the cleaning device of the present invention;

[0045] Figure 10 This is a schematic diagram showing the installation relationship between the cutting table and the sliding base of the present invention;

[0046] Figure 11 This is a schematic diagram of the feeding suction cup structure of the present invention;

[0047] Figure 12 This is a bottom view of the feeding suction cup of the present invention;

[0048] Figure 13 This is an exploded view of the feeding suction cup of the present invention;

[0049] Figure 14 This is a schematic diagram of a single suction cup structure of the present invention;

[0050] Figure 15 This is a schematic diagram of the top structure of the feeding suction cup of the present invention;

[0051] Figure 16 This is a schematic diagram of the bottom structure of the feeding suction cup of the present invention.

[0052] The attached diagram lists the components represented by each number as follows:

[0053] 1-Frame, 11-Protective Cabinet, 12-Alarm, 13-Operating Opening, 14-Controller, 2-Feeding Suction Cup, 21-Raw Material Rack, 22-Cover Plate, 221-Adjusting Screw, 23-Suction Cup, 231-Micro Suction Hole, 232-Buffer Elastic Tube, 24-Suction Cup Adjustment Plate, 241-Suction Plate, 25-Connecting Buffer Frame, 3-Sliding Base, 31-Cutting Table, 311-Steering Motor, 312-Slide Table, 3 2-Slide rail, 33-Waste hopper, 34-Cutting device, 341-Lifting motor, 342-Cutting limit block, 343-Connecting frame, 344-Clamping plate, 345-Blade, 4-Cleaning device, 41-Cleaning roller, 42-Cleaning motor, 43-Lifting frame, 44-Lifting cylinder, 5-Finished product suction cup, 51-Finished product rack, 6-Support frame, 61-Slide rail beam, 62-Beam motor, 7-CCD detector. Detailed Implementation

[0054] Please see Figures 1 to 16 As shown, the present invention provides a technical solution: a chipping machine for surface-mount electronic components, comprising:

[0055] The machine frame 1 has a horizontal working platform on top, and a protective cabinet 11 is covered by the top edge of the machine frame. The protective cabinet 11 is also equipped with an alarm 12 and a controller 14. The front of the protective cabinet 11 has an operation opening 13, and the controller 14 is located directly above the operation opening 13.

[0056] A sliding base 3 is fixed on the top of the frame platform 1, wherein the axis of the base overlaps with the central axis of the frame platform 1, and a slide rail 32 is provided on it;

[0057] A cutting table 31 is slidably mounted on the slide rail 32, which can rotate horizontally.

[0058] The support frame 6 is fixedly mounted above the sliding base 3. The sliding base 3 is also laterally fixed with a slide rail beam 61, and a translation motor 62 is installed on the slide rail beam 61.

[0059] The cutting device 34 is liftable and can be mounted on the support frame 6. The cutting device 34 is suspended directly above the cutting table 31 and is located on the side close to the front of the machine frame 1.

[0060] The waste hopper 33 is a square funnel-shaped structure with its top opening near the front edge of the frame 1 and its bottom opening inside the frame 1, located directly below one end of the front of the sliding base 3.

[0061] The raw material rack 21 and the finished product rack 51 are both mounted on the top of one side of the front of the machine frame 1. The bottom of the raw material rack 21 and the finished product rack 51 are mounted on the machine frame 1 by vertically arranged cylinders.

[0062] The raw material rack 21 and the finished product rack 51 have the same structure and are equipped with a limiting plate for mounting chip electronic components; the raw material rack 21 and the finished product rack 51 are symmetrically arranged on the left and right sides of the sliding base 3.

[0063] There are at least two CCD detectors 7, which are respectively mounted on the left and right sides of the cutting table 31, and are positioned directly opposite the cutting area of ​​the cutting table 31.

[0064] The feeding suction cup 2 and the finished product suction cup 5 are suspended on the slide rail beam 61 by a motor that moves up and down. They are both driven laterally on the slide rail beam 61 by a translation motor 62. They are respectively set directly above the raw material rack 21 and the finished product rack 51. The working positions of the raw material rack 21 and the finished product rack 51 overlap with the projected positions of the raw material rack 21, the cutting table 31 and the finished product rack 51, respectively. The feeding suction cup 2 and the finished product suction cup 5 have the same structure.

[0065] The feeding suction cup 2 comprises a cover plate 22, a suction cup 23, a suction cup adjusting plate 24, a suction plate 241, and a connecting buffer frame 25. The connecting buffer frame 25 is mounted on the slide rail beam 61 and can be raised and lowered by a cylinder. The cover plate 22 is installed at the bottom of the connecting buffer frame 25 by a spring. The suction plate 241 is locked and fixed at the bottom of the cover plate 22. The suction cup adjusting plate 24 is installed below the suction plate 241 and can be adjusted by adjusting the spacing of the suction plate 241. The suction cup adjusting plate 24 is not connected to the suction plate 241. Multiple suction cups 23 are evenly fixed at the bottom of the suction plate 241. The bottom end of each suction cup 23 extends through the suction cup adjusting plate 24 and the top of each suction cup 23 is sealed and connected to an external negative pressure device on the suction plate 241.

[0066] The cleaning device 4 includes a cleaning roller 41, a cleaning motor 42, a lifting frame 43 and a lifting cylinder 44. The cleaning roller 41 is horizontally mounted on the rotating shaft of the cleaning motor. The cleaning motor 42 is mounted on the lifting frame 43. The lifting frame 43 is hoisted on the support frame 6 and can be raised and lowered by the lifting cylinder 44.

[0067] The cleaning device 4 is located on one side of the back of the support frame 6, and the cleaning device 4 and the cutting device 34 do not interfere with each other.

[0068] The controller 14 is communicatively connected to the alarm 12, CCD detector 7, cleaning device 4, cutting table 31, cutting device 34, feeding suction cup 2, raw material rack 21, finished product rack 51, and finished product suction cup 5. It can add cutting materials without stopping the machine. The improved suction cup 23 can also pick up and move thin sheet electronic components flat and stably without deforming the sheet electronic components due to suction. The cleaning device 4 can clean up the scraps cut off by the sheet electronic components in time, ensuring that the normal operation of the blade will not be affected during the next cut.

[0069] The bottom of the suction cup 23 is a silicone suction plate surface. The suction plate surface is connected to an external negative pressure device through a buffer elastic sleeve 232. The diameter of the suction plate surface of each suction cup 23 does not exceed 15mm. Multiple micro suction holes 231 are opened on the suction plate surface of each suction cup 23. Each micro suction hole 231 is connected to an external negative pressure device through the suction tube of the suction cup 23. The elastic buffer elastic sleeve 232 enables stable suction and movement of electronic components and the loading suction cup 2 even if they are not completely parallel to each other. The micro suction holes 231 enable more uniform suction.

[0070] The buffer elastic sleeve 232 is a tubular rubber elastic joint, and the diameter of the micro suction hole 231 is no more than 1 mm. Such a small suction hole can uniformly and stably pick up electronic components, and can prevent electronic components from being deformed by the large suction cup surface.

[0071] Controller 17 is a PLC controller, a commonly used controller that is easy to set up, program, and operate;

[0072] The cleaning roller 41 is a roller-shaped soft brush;

[0073] When the lifting cylinder 44 extends, the cleaning roller 41 is in close contact with the cutting table 31;

[0074] When the lifting cylinder 44 retracts, the cleaning roller 41 separates from the cutting table 31. This structure allows the cleaning roller 41 to easily clean the scraps without sweeping the finished product off.

[0075] The cutting device 34 includes a lifting motor 341, a cutting limit block 342, a connecting frame 343, and a blade 344. The blade 344 is mounted on the lifting screw of the lifting motor 341 via the connecting frame 343. The lifting motor 341 is fixed on the support frame 6. The cutting limit block 342 is also elastically installed at the bottom of the connecting frame 343. The cutting limit block 342 is clamped on the front and rear sides of the blade 344 without contact. This structure enables the cutting device 34 to accurately cut electronic components.

[0076] The top of the cutting table 31 is a flat surface with a horizontal orientation. It has multiple suction holes, each with a diameter of no more than 1 mm. Each suction hole is connected to an external vacuum device, which enables precise cutting through the flat cutting table 31 and allows the cutting table 31 to stably pick up, move, and cut electronic components.

[0077] When the raw material rack 21 and the finished product rack 51 are lowered to the top of the machine frame 1, the height difference between the raw material rack 21 and the finished product rack 51 and the cutting table 31 is not less than 25cm. The large height difference allows the cutting device 34 to conveniently place electronic components directly when it is in a resting state, and also to collect the finished products after cutting without having to stop the machine.

[0078] In a specific embodiment of the present invention:

[0079] The present invention provides a cutting machine for chip electronic components, and the technical problem solved by the present invention is:

[0080] 1. To ensure cutting accuracy, the cutting blades for electronic components are generally very thin (345), making them prone to wear and impact damage that can cause nicks. Current edge trimming machines cannot monitor the quality of the cut electronic components in real time, resulting in a low product yield. They also cannot carefully inspect the cutting blades, making it uncertain whether the blades maintain high-precision cutting performance during long-term, high-frequency cutting.

[0081] 2. The high frequency of cutting results in a lot of scrap material falling off, which tends to accumulate on the cutting table 31, making it impossible for subsequent cutting to proceed normally. The current methods are either to use air to blow it off or to clean it up manually in a timely manner. Each electronic component needs to be cut with at least 4 edges neatly, so there is a lot of scrap material. Air blowing will scatter this cut material onto the equipment, which may get stuck in the moving parts and cause the equipment to jam. As for manual cleaning, it is difficult to grasp the accurate cleaning time during normal equipment operation, which can easily affect the normal operation of the equipment.

[0082] 3. Currently, the suction and clamping devices of edge cutting machines are basically suctioned by negative pressure. The sheet electronic components have low hardness and poor toughness, and are easy to deform and be damaged. If the negative pressure of the current suction device is too large, it is easy to cause deformation of the part of the electronic component being sucked, resulting in scrap. If the suction is too small, it cannot stably transport the electronic component to the accurate position, and slight slippage is easy to occur, resulting in inaccurate cutting position.

[0083] The technical effects achieved are as follows: 1. The present invention adds a cleaning device 4, which can move up and down through the lifting cylinder 44, so that it can fit tightly against the cutting table 31, or it can be separated from the cutting table 31, so as to facilitate the cleaning of the cutting table 31, thereby ensuring that the cutting table 31 is clean every time it is cut, ensuring cutting accuracy. In addition, when the device is cleaning, it can roll the cut-off scraps into the waste funnel 33, so that they do not accumulate on the machine frame 1 and do not affect the normal operation of other devices.

[0084] 2. The suction cup 23 of this device is different from ordinary suction cups 23. It can not only stably pick up and move chip electronic components, but also generate multiple small and uniform suction forces through multiple micro suction holes 231. This can avoid the large suction force and the concave suction cup 23 from deforming the electronic components and preventing the electronic components from being scrapped. Because the suction cup 23 of this device is equipped with a buffer elastic tube 232 at the bottom, when this device picks up the entire electronic component, it is allowed that the electronic component is not completely on a completely horizontal surface and can be tilted to a certain extent. The feeding suction cup 2 and the finished product suction cup 5 of this device can also stably pick up and place the electronic components. In contrast, when two rigid flat suction cups cooperate with each other, there cannot be any tilt at the slightest angle, otherwise the two suction cups will collide and be damaged, and the placement position coordinates cannot be guaranteed to be accurate. This device does not have the problem of being completely horizontal.

[0085] 3. This device can detect in a timely manner whether the cut of electronic components meets the production requirements through the cooperation of CCD detector 7 and cutting device 34. It can issue a warning in a timely manner through the alarm and handle the situation in time to prevent unqualified products from entering the market. The CCD detector 7 of this device can also check in a timely manner whether the cutting blade is intact, thereby ensuring the cutting accuracy.

[0086] 4. The raw material rack and finished product rack of this device can be raised and lowered on the machine frame, away from the cutting edge and cutting table, and away from the moving slide rails to avoid danger. Therefore, this device can put in raw materials and take out finished products without stopping the machine. The raw material rack and finished product rack of this device are fixed, which can ensure that the raw materials are put in the accurate position, improve the cutting accuracy and the accuracy of the material suction cup.

[0087] The technical solution in this invention is to solve the above problems, and the overall idea is as follows:

[0088] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0089] In the manufacturing and installation of this invention, a flat workbench is first constructed as the frame platform 1. A protective cabinet 11 is then mounted on it, and an alarm 12 and a controller 14 are installed on the protective cabinet 11. An operating opening 13 is made on one side of the frame platform, which is then designated as the front. Figure 1 As shown;

[0090] The raw material rack 21, finished product rack 51, feeding suction cup 2, finished product suction cup 5, cutting device 34, cleaning device 4, sliding base 3 and cutting table 31 of this device are all installed on the top of the machine frame 1 and are inside the protective cabinet 11.

[0091] First, a sliding base 3 is installed on the top of the frame platform 1. The sliding base 3 is a long strip-shaped platform located on the central axis of the top of the frame platform 1, connecting the front and rear sides of the frame platform 1. The central axis of the frame platform 1 overlaps vertically with the central axis of the sliding base 3. Then, a slide rail 32 is installed on the top of the sliding base 3, connecting the front and rear ends of the sliding base 3. The center line of the slide rail 32 overlaps with the center line of the sliding base 3. A slide table 312 is installed inside the slide rail 32. The slide table 312 passes through the slide rail 32. The servo motor drives the slide back and forth. A steering motor 311 is installed on the top of the slide table 312. The rotation axis of the steering motor 311 is perpendicular to the frame 1 and faces upwards. The cutting table 31 is rotatably mounted on the rotation axis 311. Only the central circular platform on the top of the cutting table 31 can rotate, while the surrounding quadrilateral frame is an extension of the protective frame of the slide table 312. In other words, the cutting table 31 is embedded in the protective frame on the top of the slide table 312 without contact. Figure 10 As shown, this structure allows the cutting table 31 to rotate horizontally along the vertical axis on the slide table 312, and it can also move horizontally on the slide rail 32 together with the slide table 312. Furthermore, the cutting table 31 is protected by the slide table 312 and is not easily bumped into other devices.

[0092] Two holes are symmetrically made on the frame base 1 on both sides of the sliding base 3, and the holes should be made on the side closer to the front of the frame base 1, such as... Figure 4 As shown, the raw material rack 21 and finished product rack 51 are respectively installed in the holes on both sides through lifting cylinders, so that the raw material rack 21 and finished product rack 51 can be raised and lowered. It needs to be set up stably to ensure that the maximum height difference between the cutting table 31 and the raw material rack 21 and finished product rack 51 is not less than 25cm, and the optimal value is 35cm. That is, when the raw material rack 21 and finished product rack 51 are lowered to the lowest position, the vertical height difference between the raw material rack 21 and finished product rack 51 and the cutting table 31 is 35cm. A support frame 6 and a slide rail beam 61 are set up on the machine frame 1 to form the structure of the gantry machining center. The loading suction cup 2 and the finished product suction cup 5 are installed on the slide rail beam 61. The loading suction cup 2 and the finished product suction cup 5 are driven by the beam motor 62 as the translation drive, and the motor is also a servo drive.

[0093] A waste hopper 33 is opened on the frame platform 1 at the front end of the sliding base 3, ensuring that the top opening of the waste hopper 33 is connected to the front end of the sliding base 3, while the raw material rack 21 and the finished product rack 51 are not flush with the waste hopper 33, and the edges of the raw material rack 21 and the finished product rack 51 closest to the front side of the frame platform 1 are flush with the front end of the sliding base 3.

[0094] The feeding suction cup 2 and the finished suction cup 5 have the same structure. The feeding suction cup 2 is suspended on the slide rail beam 61 by the connecting buffer frame 25, and is also driven to move horizontally on the slide rail beam 61 by the beam motor 62. The feeding suction cup 2 is formed by the cover plate 22, the suction plate 241, and the suction cup adjustment plate 24 being stacked from top to bottom. The suction cup adjustment plate 24 is directly installed on the cover plate 22 by the adjusting screw 221. In this way, the distance between the suction cup adjustment plate 24 and the cover plate 22 can be adjusted by adjusting the screw 221. The suction cup 23 is inserted through the suction cup adjustment plate 24 in the vertical direction. There are multiple suction cups, which are evenly installed on the suction plate 241. The suction cup 23 is not fixed on the suction cup adjustment plate 24. This structure allows the suction cup adjustment plate 24 to be adjusted and the length of the suction cup extending out of the suction cup adjustment plate 24 to be changed, thereby adjusting the suction and pressing distance of the suction cup 23.

[0095] The bottom of the suction cup 23 is connected to the negative pressure device at the top via a buffer elastic tube 232, so that the suction cup 23 can be elastically buffered when it is pressed down. Multiple micro suction holes 231 are opened on the suction surface of the suction cup 23. The diameter of the suction surface of the suction cup 23 is generally between 1cm and 2cm, and the diameter of the micro suction hole 231 is 1mm. Through the micro suction hole 231, the electronic components are not deformed and the electronic components can be picked up evenly and powerfully.

[0096] A cutting device 34 and a cleaning device 4 are suspended on the support frame 6. The cleaning device 4 is located on the back side of the support frame 6, while the cutting device 34 is located on the front side of the support frame 6, ensuring that the cleaning device 4 can sweep away all the scraps cut off by the cutting device 34.

[0097] The cutting device 34 is hoisted on the support frame 6 by a lifting motor 341. The entire cutting device 34 is set directly above the cutting table 31 and on the support frame 6 on the side close to the front of the machine frame 1. The blade 345 is clamped on the connecting frame 343 by a clamping plate 344. The connecting frame 343 is hoisted on the support frame 6 by a lifting motor 341. A cutting limit block 342 is also hoisted on the connecting frame 343 by a spring. The cutting limit block 342 blocks the blade 345 at a certain protruding position to prevent excessive cutting and can also press the electronic components.

[0098] The cleaning roller 41 of the cleaning device 4 is horizontally mounted and installed on the rotating shaft of the cleaning motor 42. The cleaning roller 41 also rotates horizontally. The cleaning motor 42 is mounted on the lifting frame 43. The lifting frame 43 moves up and down on the support frame 6 through the lifting cylinder 44. This allows the cleaning roller 41 to be lowered to roll and clean the cutting table 31 during cleaning. When not cleaning, the cleaning roller 41 is raised so that it does not contact the cutting table 31. The cleaning roller 41 is a soft brush roller, which will not scratch the top surface of the cutting table 31, ensuring the flatness of the electronic components, and can also clean the cut scraps into the waste funnel 33 in time.

[0099] Two CCD detectors 7 need to be installed on the support frame 6, and they should be aligned with the cutting position from the left and right sides of the cutting table 31. This can monitor whether the blade 345 has any gaps or wear, and also monitor whether the cut of the electronic component is complete.

[0100] All of the above devices are pre-programmed and controlled by the PLC controller 14.

[0101] In use, multiple electronic components are first neatly stacked into a pile and placed on the raw material rack 21. The machine is then turned on, raising the raw material rack 21 to its highest position, at which point it is level with the cutting table 31. The cutting table 31 then slides along the slide rail 32 of the sliding base 3 to the front of the machine frame 1, i.e., the side closest to the raw material rack 21. The loading suction cup 2 then moves to directly above the raw material rack 21. The loading suction cup 2 is mounted on the slide rail beam 61 via a lifting servo motor. The finished product... The suction cup 5 and the feeding suction cup 2 have the same structure, are adjacent to each other and do not contact each other. Then the feeding suction cup 2 extends downward and uses the negative pressure of the micro suction hole 231 on the suction cup 23 to pick up the electronic component. The feeding suction cup 2 retracts and rises, and then moves horizontally to the top of the cutting table 31 by the crossbeam motor 62. The feeding suction cup 2 extends again and places the electronic component in the set position on the cutting table 31. The feeding suction cup 2 immediately returns to the top of the raw material rack 21, while the finished product suction cup 5 moves to the top of the raw material receiving work position before the cutting table 31.

[0102] Then the cutting table 31 slides on the slide rail 32 of the sliding base 3 towards the back of the frame table 1, and slides to below the cutting device 34. The lifting motor 341 descends, the connecting frame 343 descends together, and the clamping plate 344 and the blade 345 cut downward together to cut the electronic component. The cutting limit block 342 pre-presses the electronic component, and the cutting blade 345 cuts into the gap between the cutting limit blocks 342. The cutting limit block 342 is connected to the connecting frame 343 by a spring. The spring also plays a buffering role. The gap can guide the cutting. The size of the gap can limit the cutting depth of the oblique blade 345. When the blade cuts to a certain depth, the thickness of the blade 345 is more than the gap between the cutting limit blocks 342, and it can no longer cut downward.

[0103] After cutting, the lifting motor 341 controls the blade 345 to rise, and the steering motor 311 controls the cutting table 31 to rotate axially to the other side of the electronic component for cutting. Since the scraps are only on the side of the electronic component, they will not affect each other when cutting the same electronic component. After cutting all four sides of an electronic component.

[0104] The cutting table 31 moves forward on the slide rail 32, and then the finished product suction cup 5 picks up the electronic component. At this time, the lifting cylinder 44 controls the cleaning roller 41 to move downward, and the cleaning motor 42 drives the cleaning roller 41 to rotate. The rotation direction is fixed, and the cut-off scraps are swept into the waste funnel 33. At the same time, the feeding suction cup 2 will also pick up a new piece of electronic component material. Then the finished product suction cup 5 and the feeding suction cup 2 move to the left together. The feeding suction cup 2 moves to the top of the cutting table 31, and the finished product suction cup 5 moves to the top of the finished product rack 51. Then the finished product suction cup 5 and the feeding suction cup 2 extend downward together. The finished product suction cup 5 puts the cut electronic component into the finished product rack 51, while the feeding suction cup 2 places the new electronic component material on the cutting table 31. The cutting table 31 has a flat suction cup that picks up the electronic component and performs a new round of cutting operations.

[0105] During the cutting process, the CCD detector 7 can monitor the cutting blade 345 in real time and also monitor the cutting seam of the electronic components. Once a problem is detected, the alarm 12 will be activated to notify personnel for repair. At the same time, the cleaning device 4 will be controlled to sweep the damaged electronic components into the waste funnel 33.

[0106] The longitudinal, front, and rear sides of this device are as follows: Figure 1 and Figure 4 As shown, the side with the operating opening 13 is the front side, which is the side of the machine frame 1 where the raw material rack 21 and the finished product rack 51 are close together. The opposite side is the back side, which is the other end of the sliding base 3. The opposite horizontal sides are the left and right sides. The straight line where the slide rail beam 61 is located connects the left and right sides of the machine frame 1.

[0107] Furthermore, in the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0108] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A cutting machine for surface-mount electronic components, characterized in that, include: The machine frame (1) has a horizontal working platform on top, and a protective cabinet (11) is covered on the top edge. The protective cabinet (11) is also equipped with an alarm (12) and a controller (14). The protective cabinet (11) has an operation opening (13) on the front, and the controller (14) is located directly above the operation opening (13). A sliding base (3) is fixed on the top of the frame platform (1), wherein the axis of the base overlaps with the central axis of the frame platform (1), and a slide rail (32) is provided on it. A cutting table (31) is slidably mounted on the slide rail (32) and can rotate horizontally. The support frame (6) is fixedly mounted above the sliding base (3). The sliding base (3) is also horizontally fixed with a slide rail beam (61), and a translation motor (62) is installed on the slide rail beam (61). The cutting device (34) can be lifted and installed on the support frame (6) by a lifting motor (341). The cutting device (34) is suspended directly above the cutting table (31). The cutting device (34) is located on the side close to the front of the machine frame (1). The cutting device (34) includes a lifting motor (341), a cutting limit block (342), a connecting frame (343), and a blade (344). The blade (344) is mounted on the lifting screw of the lifting motor (341) via the connecting frame (343). The lifting motor (341) is fixed on the support frame (6). The bottom of the connecting frame (343) is also elastically fitted with the cutting limit block (342). The cutting limit block (342) is clamped on the front and rear sides of the blade (344) without contact. The waste hopper (33) is a square funnel-shaped structure. Its top opening is opened near the front edge of the frame (1), and its bottom opening is located inside the frame (1) and directly below one end of the front of the sliding base (3). The raw material rack (21) and the finished product rack (51) are both mounted on the top of the front side of the machine frame (1), and the bottom of the raw material rack (21) and the finished product rack (51) are mounted on the machine frame (1) by vertically arranged cylinders; The raw material rack (21) and the finished product rack (51) have the same structure and are provided with a limiting plate for mounting chip electronic components; the raw material rack (21) and the finished product rack (51) are symmetrically arranged on the left and right sides of the sliding base (3); There are at least two CCD detectors (7), which are respectively mounted on the left and right sides of the cutting table (31) and are positioned directly opposite the cutting point of the cutting table (31). The feeding suction cup (2) and the finished product suction cup (5) are suspended on the slide rail beam (61) by a motor that moves up and down. They are both driven laterally on the slide rail beam (61) by a translation motor (62). They are respectively set directly above the raw material rack (21) and the finished product rack (51). The working positions of the raw material rack (21) and the finished product rack (51) overlap with the projected positions of the raw material rack (21), the cutting table (31) and the finished product rack (51). The feeding suction cup (2) and the finished product suction cup (5) have the same structure. The feeding suction cup (2) comprises a cover plate (22), a suction cup (23), a suction cup adjustment plate (24), a suction plate (241), and a connecting buffer frame (25). The connecting buffer frame (25) is mounted on the slide rail beam (61) by means of a cylinder. The cover plate (22) is mounted on the bottom of the connecting buffer frame (25) by means of a spring. The suction plate (241) is locked and fixed to the bottom of the cover plate (22). The suction cup adjustment plate (24) is mounted below the suction plate (241) by means of an adjusting screw (221) with adjustable spacing. The suction cup adjustment plate (24) is not connected to the suction plate (241). Multiple suction cups (23) are evenly fixedly mounted on the bottom of the suction plate (241). The bottom end of each suction cup (23) extends through the suction cup adjustment plate (24) and protrudes below it. The top of each suction cup (23) is sealed and connected to an external negative pressure device on the suction plate (241). The cleaning device (4) includes a cleaning roller (41), a cleaning motor (42), a lifting frame (43) and a lifting cylinder (44). The cleaning roller (41) is horizontally mounted on the rotating shaft of the cleaning motor. The cleaning motor (42) is mounted on the lifting frame (43). The lifting frame (43) is hoisted on the support frame (6) by the lifting cylinder (44). The cleaning device (4) is located on the back side of the support frame (6), and the cleaning device (4) and the cutting device (34) do not interfere with each other; The controller (14) is communicatively connected to the alarm (12), CCD detector (7), cleaning device (4), cutting table (31), cutting device (34), feeding suction cup (2), raw material rack (21), finished product rack (51) and finished product suction cup (5); The controller is a PLC controller.

2. The edge-cutting machine for a surface-mount electronic component according to claim 1, characterized in that: The bottom of the suction cup (23) is a silicone suction plate surface. The suction plate surface is connected to an external negative pressure device through a buffer elastic sleeve (232). The diameter of the suction plate surface of each suction cup (23) does not exceed 15mm. Multiple micro suction holes (231) are opened on the suction plate surface of each suction cup (23). Each micro suction hole (231) is connected to an external negative pressure device through the suction tube of the suction cup (23).

3. The edge-cutting machine for a surface-mount electronic component according to claim 2, characterized in that: The buffer elastic sleeve (232) is a tubular rubber elastic joint, and the diameter of the micro suction hole (231) does not exceed 1 mm.

4. The edge-cutting machine for a surface-mount electronic component according to claim 1, characterized in that: The cleaning roller (41) is a roller-shaped soft brush; When the lifting cylinder (44) extends, the cleaning roller (41) fits tightly against the cutting table (31); When the lifting cylinder (44) retracts, the cleaning roller (41) separates from the cutting table (31).

5. The edge-cutting machine for a surface-mount electronic component according to claim 1, characterized in that: The top of the cutting table (31) is a flat surface set horizontally, and it is provided with a plurality of suction holes. The diameter of each suction hole is no more than 1 mm, and each suction hole is connected to an external vacuum device.

6. The edge-cutting machine for a surface-mount electronic component according to claim 1, characterized in that: When the raw material rack (21) and finished product rack (51) are lowered to the top of the machine frame (1), the height difference between the raw material rack (21) and finished product rack (51) and the cutting table (31) is not less than 25cm.

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