Light emitting device and manufacturing method

Abstract

The present invention discloses a light-emitting device and a manufacturing method, wherein the light-emitting device comprises a light-emitting element, a substrate, a light conversion layer, a light reflection layer and a light transmission layer; the light reflection layer is laid on one side of the substrate, a dividing groove is provided on the light reflection layer, and the inner and outer sides of the dividing groove are respectively an inner area and an outer area; the light-emitting element is embedded in the inner area and fixedly connected to the substrate; the light conversion layer comprises a first light conversion layer and a second light conversion layer, the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers the inner area and a side away from the substrate; the light transmission layer comprises a first light transmission layer and a second light transmission layer, the first light transmission layer is arranged in the dividing groove and covers a side of the first light conversion layer away from the substrate, and the second light transmission layer is arranged on a side of the light reflection layer away from the substrate and covers the light reflection layer, the first light transmission layer and the second light conversion layer. The dividing groove structure is provided to limit the shape of the light conversion layer, and can ensure the uniformity and shape consistency of the light conversion layer.

Description

Technical Field

[0001] The present invention belongs to the technical field of light emitting diodes, and in particular relates to a light emitting device and a manufacturing method thereof. Background Art

[0002] As a new generation of lighting tools, light-emitting diodes have great advantages over other lighting technologies in terms of energy saving and environmental protection. However, there is still a lot of room for improvement in terms of technology and process.

[0003] Patent CN107546301A discloses a light-emitting device, the manufacturing process is as follows: S1: arranging light-emitting elements on a substrate; S2: covering the upper surface of the substrate and the light-emitting elements with a layer of fluorescent glue; S3: covering the upper surface of the fluorescent glue between the light-emitting elements with a layer of light-reflecting layer; S4: after mold packaging, covering the upper surface of the light-emitting element with a layer of arc-shaped light-transmitting layer; S5: cutting to obtain a single light-emitting device. Although the light-emitting device obtained by this method has a simple process and low cost, it has poor uniformity of light output and poor process controllability.

[0004] Patent CN109273579A discloses a light-emitting device, the manufacturing process is as follows: S1: attach the whole fluorescent film to the upper surface of the high-temperature film; S2: attach the light-emitting element evenly to the upper surface of the fluorescent film; S3: cover the light-emitting element with a layer of arc-shaped transparent glue; S4: cut along the light-emitting elements to obtain a single light-emitting element with a fluorescent film; S5: fix the light-emitting element with a fluorescent film on the substrate, and cover a light-reflecting layer between adjacent light-emitting elements; S6: cut along the light-emitting elements to obtain a single light-emitting device. Although the light-emitting device obtained by this method has uniform light output, the process is difficult and the cost is high. Summary of the invention

[0005] In order to overcome the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a light-emitting device, aiming to solve the existing problems of difficult manufacturing process and uneven light output.

[0006] In order to achieve the purpose, the technical solution adopted by the present invention is as follows:

[0007] A light-emitting device comprises a light-emitting element, a substrate, a light conversion layer, a light reflection layer and a light transmission layer;

[0008] The light reflecting layer is laid on one side of the substrate, and a dividing groove connected end to end is opened on the side of the light reflecting layer away from the substrate, and the inner and outer sides of the dividing groove are respectively an inner area and an outer area;

[0009] The light emitting element is embedded in the inner area and fixedly connected to the substrate;

[0010] The light conversion layer comprises a first light conversion layer and a second light conversion layer, wherein the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers a side of the inner area away from the substrate;

[0011] The light-transmitting layer includes a first light-transmitting layer and a second light-transmitting layer, wherein the first light-transmitting layer is arranged in the dividing groove and covers the side of the first light conversion layer away from the substrate, and the second light-transmitting layer is arranged on the side of the light-reflecting layer away from the substrate and covers the light-reflecting layer, the first light-transmitting layer, and the second light conversion layer.

[0012] Furthermore, the shape of the dividing groove includes one of a circle, a square, and a polygon, wherein the polygon is a regular polygon or an irregular polygon.

[0013] Furthermore, the light emitting element includes at least one of a face-up chip, a flip-chip chip, and a vertical chip.

[0014] Furthermore, the width of the dividing groove is not greater than 0.5 mm.

[0015] Furthermore, an upper surface of the first light-transmitting layer and an upper surface of the light-reflecting layer are in the same plane.

[0016] Furthermore, the material of the light transmission layer is light refractive glue, the material of the light reflection layer is light reflective glue, and the material of the light conversion layer is fluorescent glue.

[0017] The present invention also discloses a method for manufacturing a light emitting device, comprising the following steps:

[0018] S1: With the upper surface of the substrate as the front side, the light-emitting elements are fixed on the upper surface of the substrate in an M*N unit array, and each unit includes at least one light-emitting element;

[0019] S2: Laying a layer of light reflecting glue between adjacent units to form a light reflecting layer;

[0020] S3: on the upper surface of the light reflecting layer, using laser to form corresponding end-to-end connected dividing grooves with each of the units as the center, wherein the dividing grooves surround the corresponding units;

[0021] S4: covering the upper surface of the light reflecting layer with a mask so that only the upper surface of the unit and the upper surface of the light reflecting layer in the area surrounded by the dividing grooves are exposed, covering the upper surface of the mask, the exposed upper surface of the unit and the exposed upper surface of the light reflecting layer in the area surrounded by the dividing grooves with a light conversion layer, and removing the mask;

[0022] S5: performing molding packaging using a mold to cover the upper surface of the light conversion layer and the upper surface of the light reflection layer with a circular arc light transmission layer;

[0023] S6: Cutting to obtain a single light-emitting device.

[0024] Further, in step S1: the M is greater than or equal to 1, and the N is greater than or equal to 1.

[0025] Furthermore, in step S4: the mask is provided with holes corresponding to the unit positions.

[0026] Furthermore, the shape of the hole groove is consistent with the shape of the dividing groove, the inner ring size of the hole groove is larger than the inner ring size of the dividing groove, and the outer ring size of the hole groove is smaller than the outer ring size of the dividing groove.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The light-emitting device and manufacturing method proposed in the present invention set a segmentation groove structure connected end to end, which limits the shape of the light conversion layer and can ensure the uniformity and shape consistency of the light conversion layer; at the same time, in the manufacturing method, the process complexity brought by the patch process is avoided. In the traditional process flow, the segmentation groove structure is formed by laser processing, which can ensure the smoothness of the process without increasing the process complexity; in the process of manufacturing the light-emitting device, when the upper surface of the mask, the exposed upper surface of the unit and the exposed upper surface of the light reflecting layer in the area surrounded by the segmentation groove are covered with a layer of light conversion layer, the fluorescent glue of the excess light conversion layer will flow into the segmentation groove, thereby ensuring the uniformity and shape consistency of the light conversion layer on the light-emitting surface of the entire light-emitting device, and when the position of the mask relative to the light-emitting element is offset, the position offset of the light conversion layer relative to the light-emitting element can be reduced, thereby improving the light uniformity of the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0030] Figure 1 is a structural cross-sectional view of the light emitting device in Embodiment 1 of the present invention;

[0031] Figure 2 is a structural schematic diagram of the manufacturing process S1 of the light emitting device in Embodiment 2 of the present invention;

[0032] Figure 3is a structural schematic diagram of the manufacturing process S2 of the light emitting device in Embodiment 2 of the present invention;

[0033] Figure 4 is a structural schematic diagram of the manufacturing process S3 of the light emitting device in Embodiment 2 of the present invention;

[0034] Figure 5 is a structural schematic diagram of the manufacturing process S4 of the light emitting device in Embodiment 2 of the present invention;

[0035] Figure 6 It is a structural cross-sectional view of the manufacturing process S4 of the light-emitting device in Example 2 of the present invention.

[0036] Figure 7 It is a flow chart of the production method of the present invention.

[0037] Description of reference numerals:

[0038] 1-light emitting element, 2-substrate, 3-dividing groove, 4-light reflecting layer, 5-first light conversion layer, 6-second light conversion layer, 7-first light transmission layer, 8-second light transmission layer, 9-mask. DETAILED DESCRIPTION

[0039] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0041] Reference Figures 1 to 7 , an embodiment of the present invention provides a light emitting device,

[0042] It includes a light emitting element 1, a substrate 2, a light conversion layer, a light reflecting layer 4 and a light transmitting layer;

[0043] The light reflecting layer 4 is laid on one surface of the substrate 2, and a dividing groove 3 connected end to end is opened on the surface of the light reflecting layer 4 away from the substrate 2, and the inner and outer sides of the dividing groove 3 are respectively an inner area and an outer area;

[0044] The light emitting element 1 is embedded in the inner area and fixedly connected to the substrate 2;

[0045] The light conversion layer comprises a first light conversion layer 5 and a second light conversion layer 6, wherein the first light conversion layer 5 is arranged in the dividing groove 3, and the second light conversion layer 6 covers a side of the inner area away from the substrate 2;

[0046] The light-transmitting layer includes a first light-transmitting layer 7 and a second light-transmitting layer 8. The first light-transmitting layer 7 is arranged in the dividing groove 3 and covers the side of the first light conversion layer 5 facing away from the substrate 2. The second light-transmitting layer 8 is arranged on the side of the light-reflecting layer 4 facing away from the substrate 2 and covers the light-reflecting layer 4, the first light-transmitting layer 7, and the second light conversion layer 6.

[0047] Furthermore, the shape of the dividing groove 3 includes one of a circle, a square, and a polygon, wherein the polygon is a regular polygon or an irregular polygon.

[0048] Furthermore, the light emitting element 1 includes at least one of a face-up chip, a flip-chip chip, and a vertical chip.

[0049] Furthermore, the width of the dividing groove 3 is not greater than 0.5 mm.

[0050] Furthermore, the upper surface of the first light-transmitting layer 7 and the upper surface of the light-reflecting layer 4 are in the same plane.

[0051] Furthermore, the material of the light transmission layer is light refractive glue, the material of the light reflection layer 4 is light reflection glue, and the material of the light conversion layer is fluorescent glue.

[0052] The present invention also discloses a method for manufacturing a light emitting device, comprising the following steps:

[0053] S1: With the upper surface of the substrate as the front, the light emitting elements are fixed on the upper surface of the substrate in an M*N unit array, where M and N are natural numbers, which may be equal or unequal, such as Figure 2 In the embodiment, M=2, N=2, and may also be 2*3, 2*4, 6*5, etc., and each of the units includes one light-emitting element;

[0054] S2: Laying a layer of light reflecting glue between adjacent units to form a light reflecting layer;

[0055] S3: on the upper surface of the light reflecting layer, using laser to form corresponding end-to-end connected dividing grooves with each of the units as the center, wherein the dividing grooves surround the corresponding units;

[0056] S4: Covering the upper surface of the light reflecting layer with a mask 9, leaving only the upper surface of the unit and the upper surface of the light reflecting layer in the area surrounded by the dividing groove bare, spraying fluorescent glue on the upper surface of the mask, the exposed upper surface of the unit and the exposed upper surface of the light reflecting layer in the area surrounded by the dividing groove, forming a second light conversion layer, at this time, the excess fluorescent glue will flow into the dividing groove to form a first light conversion layer, and removing the mask;

[0057] S5: performing molding packaging using a mold to cover the upper surface of the light conversion layer and the upper surface of the light reflection layer with a circular arc light transmission layer;

[0058] S6: Cutting to obtain a single light-emitting device.

[0059] Furthermore, in step S4: the mask is provided with holes corresponding to the unit positions.

[0060] Furthermore, the shape of the hole groove is consistent with the shape of the dividing groove, the inner ring size of the hole groove is larger than the inner ring size of the dividing groove, and the outer ring size of the hole groove is smaller than the outer ring size of the dividing groove.

[0061] In summary, compared with the prior art, the present application has the following advantages:

[0062] 1. The end-to-end connected dividing groove structure provided in the present invention restricts the shape of the light conversion layer, thereby ensuring the uniformity and shape consistency of the light conversion layer.

[0063] 2. The manufacturing method of the present invention avoids the process complexity caused by the patch process. In the traditional process flow, the dividing groove structure is formed by laser processing, which can ensure the smoothness of the process without increasing the process complexity.

[0064] 3. In the process of manufacturing the light-emitting device, when covering the upper surface of the mask, the exposed upper surface of the unit and the exposed upper surface of the light-reflecting layer in the area surrounded by the dividing groove with a layer of light conversion layer, excess fluorescent glue of the light conversion layer will flow into the dividing groove, thereby ensuring the uniformity and shape consistency of the light conversion layer on the light-emitting surface of the entire light-emitting device.

[0065] 4. In the process of manufacturing a light-emitting device, when the position of the mask relative to the light-emitting element is offset, the segmentation groove structure can reduce the degree of positional offset of the light conversion layer relative to the light-emitting element and improve the light uniformity of the light-emitting device.

[0066] It should be noted that other contents of the light-emitting device and the manufacturing method disclosed in the present invention can be found in the prior art and will not be described in detail here.

[0067] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A light emitting device, characterized in that: It includes a light-emitting element, a substrate, a light conversion layer, a light reflection layer and a light transmission layer; The light reflecting layer is laid on one side of the substrate, and a dividing groove connected end to end is opened on the side of the light reflecting layer away from the substrate, and the inner and outer sides of the dividing groove are respectively an inner area and an outer area; The light emitting element is embedded in the inner area and fixedly connected to the substrate; The light conversion layer comprises a first light conversion layer and a second light conversion layer, wherein the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers a side of the inner area away from the substrate; The light-transmitting layer includes a first light-transmitting layer and a second light-transmitting layer, wherein the first light-transmitting layer is arranged in the dividing groove and covers the side of the first light conversion layer away from the substrate, and the second light-transmitting layer is arranged on the side of the light-reflecting layer away from the substrate and covers the light-reflecting layer, the first light-transmitting layer, and the second light conversion layer.

2. The light emitting device according to claim 1, characterized in that: The shape of the dividing groove includes one of a circle and a polygon, wherein the polygon is a regular polygon or an irregular polygon.

3. The light emitting device according to claim 1, characterized in that: The light emitting element comprises at least one of a face-up chip, a flip-chip chip, and a vertical chip.

4. The light emitting device according to claim 1, characterized in that: The width of the dividing groove is no greater than 0.5 mm.

5. The light emitting device according to claim 1, characterized in that: An upper surface of the first light-transmitting layer and an upper surface of the light-reflecting layer are in the same plane.

6. The light emitting device according to claim 1, characterized in that: The material of the light transmission layer is light refraction glue, the material of the light reflection layer is light reflection glue, and the material of the light conversion layer is fluorescent glue.

7. A method for manufacturing a light emitting device according to claim 1, characterized in that: The following steps are involved: S1: With the upper surface of the substrate as the front side, the light-emitting elements are fixed on the upper surface of the substrate in an M*N unit array, and each unit includes at least one light-emitting element; S2: Laying a layer of light reflecting glue between adjacent units to form a light reflecting layer; S3: on the upper surface of the light reflecting layer, using laser to form corresponding end-to-end connected dividing grooves with each of the units as the center, wherein the dividing grooves surround the corresponding units; S4: covering the upper surface of the light reflecting layer with a mask so that only the upper surface of the unit and the upper surface of the light reflecting layer in the area surrounded by the dividing grooves are exposed, covering the upper surface of the mask, the exposed upper surface of the unit and the exposed upper surface of the light reflecting layer in the area surrounded by the dividing grooves with a light conversion layer, and removing the mask; S5: performing molding packaging using a mold to cover the upper surface of the light conversion layer and the upper surface of the light reflection layer with a circular arc light transmission layer; S6: Cutting to obtain a single light-emitting device.

8. The method for manufacturing a light emitting device according to claim 7, characterized in that: In step S1: the M is greater than or equal to 1, and the N is greater than or equal to 1.

9. The method for manufacturing a light emitting device according to claim 7, characterized in that: In step S4: the mask is provided with holes corresponding to the unit positions.

10. The method for manufacturing a light emitting device according to claim 9, characterized in that: The shape of the hole groove is consistent with the shape of the dividing groove, the inner ring size of the hole groove is larger than the inner ring size of the dividing groove, and the outer ring size of the hole groove is smaller than the outer ring size of the dividing groove.

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