Intelligent power module and manufacturing method of intelligent power module

Abstract

This invention relates to an intelligent power module (IPM) and a method for manufacturing the IPM. The IPM comprises two layers: a first heat sink substrate and a second heat sink substrate, with a mounting space between them. Electronic components are mounted within this mounting space. The first and second heat sink substrates are connected by a flexible thin-film circuit layer, thus forming a stacked structure. Electronic components can be mounted on both layers, effectively increasing the circuit density and reducing the surface area of ​​the IPM, thereby achieving miniaturization and cost reduction. Because the first and second heat sink substrates adopt an integrated heat sink and substrate structure, unlike the separate substrate and heat sink structures in existing technologies, the step of mounting the substrate and heat sink can be eliminated, thereby improving the production efficiency of the IPM module.

Description

Technical Field

[0001] This invention relates to an intelligent power module and a method for manufacturing the intelligent power module, belonging to the field of power semiconductor device technology. Background Technology

[0002] In IPM (Intelligent Power Module), the IC driver control circuit, switching transistor sampling amplification circuit, and PFC current protection circuit are all located on the same board as the inverter circuit composed of low-voltage control circuit and high-voltage power devices. During operation, the high-voltage power devices are prone to interference with the low-voltage control circuit. At the same time, existing IPM intelligent power modules only integrate a single IPM module, and the integration of multiple IPM intelligent power modules has not yet been realized. In the face of market competition for miniaturization and low cost, higher requirements are placed on the high integration and high heat dissipation technology of IPM intelligent power modules. Summary of the Invention

[0003] The technical problem that this invention aims to solve is that the high-voltage power devices inside existing IPM modules easily interfere with the low-voltage control circuit during operation, and the cost is relatively high because the modules inside the IPM module only contain one module circuit.

[0004] Specifically, this invention discloses an intelligent power module, comprising:

[0005] A first heat sink substrate and a second heat sink substrate are arranged opposite each other, wherein the first heat sink substrate includes a first heat dissipation part disposed on the outer side and a first mounting surface for mounting power devices is formed on the bottom surface of the first heat dissipation part, and the second heat sink substrate includes a second heat dissipation part disposed on the outer side and a second mounting surface for mounting power devices is formed on the bottom surface of the second heat dissipation part.

[0006] The device includes multiple electronic components, which are mounted on a first mounting surface and a second mounting surface.

[0007] A flexible thin-film circuit layer is disposed at one end on the same side of the first heat sink substrate and the second heat sink substrate to electrically connect the first heat sink substrate and the second heat sink substrate.

[0008] Multiple pins are configured and electrically connected to the other end of the same side of the first heat sink substrate and the second heat sink substrate.

[0009] The package at least covers and fills the space between the first and second mounting surfaces, with the pins exposed from the package.

[0010] Optionally, the first heat sink substrate includes a first heat dissipation part, a first insulating layer and a first circuit layer connected in sequence, wherein the surface of the first circuit layer forms a first mounting surface, and the second heat sink substrate includes a second heat dissipation part, a second insulating layer and a second circuit layer connected in sequence, and a second mounting surface is disposed on the second circuit layer, wherein the surface of the second circuit layer forms a second mounting surface.

[0011] Optionally, the circuit layer is formed by etching copper foil onto the insulating layer; or by printing a paste-like conductive medium onto the insulating layer, wherein the conductive medium is one of graphene, solder paste, or silver paste.

[0012] Optionally, the thin-film circuit layer includes an insulating thin-film layer on the surface and a conductive dielectric layer located in the middle of the insulating thin-film layer. The thin-film circuit layer is made based on flexible copper clad laminate technology or ribbon cable technology; the conductive dielectric layer and the circuit layer are integrally formed.

[0013] Optionally, the first heat dissipation part is provided with a first extension at the other end of the pin that is connected to the first mounting surface, and the second heat dissipation part is provided with a second extension at the other end of the pin that is connected to the second mounting surface. The first extension and the second extension are respectively provided with a first groove and a second groove, and the first groove and the second groove form a receiving space for accommodating the thin film circuit layer.

[0014] Optionally, the bottom surface of the first extension and the bottom surface of the second extension abut against each other; the first heat dissipation part protrudes inward to form a first protrusion, and a first mounting surface is disposed on the surface of the first protrusion; the second heat dissipation part protrudes inward to form a second protrusion, and a second mounting surface is disposed on the surface of the second protrusion.

[0015] Optionally, the package extends toward both ends of the first and second heat sink substrates to seal the receiving space and the curved portion of the sealing pins, respectively.

[0016] Optionally, the first mounting surface and the second mounting surface are respectively 0.1-0.5mm higher than the bottom surface of the first groove and the bottom surface of the second groove.

[0017] Optionally, the IPM module also includes multiple jumpers electrically connecting multiple electronic components; and / or multiple jumpers electrically connecting electronic components to a first mounting surface; and / or multiple jumpers electrically connecting electronic components to a second mounting surface.

[0018] The present invention also proposes a manufacturing method for the above-described intelligent power module, characterized in that the manufacturing method includes the following steps:

[0019] The first heat sink substrate, the second heat sink substrate, and the thin film circuit layer are disposed in the carrier;

[0020] Pins and multiple electronic components, including power devices, are arranged on the first and second mounting surfaces;

[0021] The jumper wires are electrically connected to the first mounting surface and the thin film circuit layer, and to the second mounting surface and the thin film circuit layer, respectively, to form the first semi-finished product;

[0022] The thin film circuit layer of the first semi-finished product is bent to form the second semi-finished product, such that the first mounting surface and the second mounting surface face each other inward, and the second semi-finished product is placed in the encapsulation mold;

[0023] The encapsulation mold is potted to form an encapsulation body, and a second semi-finished product containing the encapsulation body forms a third semi-finished product, wherein the encapsulation body is located between a first mounting surface and a second mounting surface, and the encapsulation body extends outward on both sides of the first mounting surface and the second mounting surface to seal the receiving space and the curved portion of the sealing pin, respectively.

[0024] The intelligent power module of this invention comprises a first heat sink substrate and a second heat sink substrate, with an upper and lower layer. A mounting space is formed between the first and second heat sink substrates. A first mounting surface and a second mounting surface for mounting electronic components are disposed within this mounting space, allowing electronic components mounted on these surfaces to also be mounted within the mounting space. The first and second heat sink substrates are connected by a flexible thin-film circuit layer, thus forming a stacked structure for the IPM module. Electronic components can be mounted on both layers, effectively increasing the circuit density of the IPM module and reducing its surface area, thereby achieving miniaturization and cost reduction. Because the first and second heat sink substrates adopt an integrated heat sink and substrate structure, unlike the separate substrate and heat sink structure in existing technologies, the installation steps for the substrate and heat sink can be eliminated, improving the production efficiency of the IPM module. Furthermore, the upper and lower layer structure allows the high-voltage power device circuitry and the low-voltage control circuitry to be disposed on separate layers, achieving electrical separation between them and reducing interference from the high-voltage power device to the low-voltage control circuitry, thereby improving the operational stability and reliability of the IPM module. Attached Figure Description

[0025] Figure 1 This is a simplified structural diagram of a semi-finished IPM module according to an embodiment of the present invention;

[0026] Figure 2 This is a cross-sectional view of the IPM module according to an embodiment of the present invention;

[0027] Figure 3 This is a flowchart illustrating the IPM module manufacturing method according to an embodiment of the present invention.

[0028] Figure label:

[0029] IPM module 100, first heat sink substrate 10, first mounting surface 11, first heat dissipation part 12, first protrusion 12A, first heat dissipation fin 12B, first extension 13, first groove 13A, second heat sink substrate 20, second mounting surface 21, second heat dissipation part 22, second protrusion 22A, second heat dissipation fin 22B, second extension 23, second groove 23A, package 30, electronic component 50, jumper wire 60, pin 70, bending part 71, thin film circuit layer 80. Detailed Implementation

[0030] It should be noted that, provided there is no structural or functional conflict, the embodiments and features described in these embodiments can be combined with each other. The present invention will now be described in detail with reference to examples.

[0031] This invention proposes an intelligent power module, namely an IPM module 100. For example... Figures 1 to 2 As shown, the IPM module 100 of this embodiment of the invention comprises a first heat sink substrate 10 and a second heat sink substrate 20 disposed opposite to each other, multiple electronic components 50 including power devices, a flexible thin-film circuit layer 80, multiple pins 70, and a package 30. The first heat sink substrate 10 includes a first heat dissipation portion 12 disposed on the outer side, and a first mounting surface 11 for mounting power devices is formed on the bottom surface of the first heat dissipation portion 12. The second heat sink substrate 20 includes a second heat dissipation portion 22 disposed on the outer side, and a second mounting surface 21 for mounting power devices is formed on the bottom surface of the second heat dissipation portion 22. The first heat sink substrate 10 and the second heat sink substrate 20 differ from the substrate structures in the prior art by integrally forming the mounting surface with the heat sink, instead of the prior art's separate substrate and heat sink design. This effectively saves manufacturing steps and improves the manufacturing efficiency of the IPM module 100.

[0032] A thin-film circuit layer 80 is disposed on one end of the same side of the first heat sink substrate 10 and the second heat sink substrate 20 to electrically connect the first heat sink substrate 10 and the second heat sink substrate 20; a plurality of pins 70 are disposed and electrically connected to the other end of the same side of the first heat sink substrate 10 and the second heat sink substrate 20; the package body 30 at least covers and fills the space between the first mounting surface 11 and the second mounting surface 21, and the pins 70 are exposed from the package body 30.

[0033] Unlike existing IPM modules 100 with a single-layer substrate, the IPM module 100 of this embodiment includes a first heat sink substrate 10 and a second heat sink substrate 20, with a mounting space between them. A first mounting surface 11 and a second mounting surface 21 for mounting electronic components 50 are disposed within this mounting space, allowing electronic components 50 mounted on these surfaces to also be mounted within the space. The first heat sink substrate 10 and the second heat sink substrate 20 are connected by a flexible thin-film circuit layer 80, thus forming a stacked structure for the IPM module 100. Both layers can mount electronic components 50, effectively increasing the circuit density and reducing the surface area of ​​the IPM module 100, thereby achieving miniaturization and cost reduction. Since the first heat sink substrate 10 and the second heat sink substrate 20 adopt an integrated heat sink and substrate structure, unlike the separate substrate and heat sink structure in the prior art, the step of mounting the substrate and heat sink can be eliminated, thereby improving the production efficiency of the IPM module. Furthermore, the two-layer structure allows the high-voltage power device circuitry and the low-voltage control circuitry to be placed on two separate layers, thereby achieving electrical distance between them, reducing interference from the high-voltage power devicery to the low-voltage control circuitry, and thus improving the working stability and reliability of the IPM module 100.

[0034] In some embodiments of the present invention, such as Figure 1 and Figure 2As shown, the first heat sink substrate 10 includes a first heat dissipation part 12, a first insulating layer (not shown), and a first circuit layer (not shown) connected in sequence. A first mounting surface 11 is formed on the surface of the first circuit layer. The first heat sink substrate 10 also includes a second heat dissipation part 22, a second insulating layer (not shown), and a second circuit layer (not shown) connected in sequence. A second mounting surface 21 is disposed on the second circuit layer, and a second mounting surface 21 is formed on the surface of the second circuit layer. Because the substrate heat sink adopts an integrated structure of heat sink and substrate, the metal heat dissipation layer of the substrate in the prior art can be omitted. The metal heat dissipation layer and the heat dissipation part are integrated. The first heat dissipation part 12 and the second heat dissipation part 22 can be made of thermally conductive metal materials such as aluminum and copper, such as aluminum of materials like 1100 and 5052, mainly to achieve heat conduction and dissipation. An insulating layer is connected to the surface of the first heat dissipation part 12 and the second heat dissipation part 22. Its thickness is relatively thin, generally between 50µm and 150µm, with 110µm being commonly used. The circuit layer is made of metals such as copper and is insulated from the metal heat dissipation layer. The circuit layer includes circuit lines formed by etched copper foil, and its thickness is relatively thin, such as around 70µm; alternatively, the circuit layer can be formed by printing a paste-like conductive medium, such as graphene, solder paste, or silver paste. Mounting positions for electronic components are provided on the circuit layer to mount electronic components 50 and pins 70. The package 30 is mainly formed of injection molding material, which can be resin.

[0035] In one embodiment of the present invention, the thin-film circuit layer 80 is fabricated based on a flexible copper-clad laminate process or a cabling process. For example... Figure 1 and Figure 2 The thin-film circuit layer 80 electrically connects the circuit layers of the first heat sink substrate 10 and the second heat sink substrate 20. It is a flexible structure that can be bent, similar to the ribbon cable process of the connecting circuit board of a mobile phone display. By setting the thin-film circuit layer 80 as a flexible structure, a short-distance electrical connection can be achieved on one side of the first heat sink substrate 10 and the second heat sink substrate 20 when they are stacked on top of each other.

[0036] Furthermore, the thin-film circuit layer 80 specifically includes an insulating thin-film layer (not shown in the figure) located on the surface and a conductive dielectric layer (not shown in the figure) located within the insulating thin-film layer. The conductive dielectric layer can be integrally formed with the insulating layers of the first heat sink substrate 10 and the second heat sink substrate 20, thereby facilitating production. During the processing and manufacturing of the first heat sink substrate 10, the second heat sink substrate 20, and the thin-film circuit layer 80, as follows... Figure 1As shown, the insulating layers of the first heat sink substrate 10 and the second heat sink substrate 20, as well as the insulating thin film layer of the thin film circuit layer 80, can be manufactured simultaneously. The conductive medium is simultaneously formed on the insulating layer or non-metallic heat dissipation layer and insulating thin film layer of the first heat sink substrate 10 and the second heat sink substrate 20 through processes such as printing. In this way, the circuit layer of the first heat sink substrate 10 and the second heat sink substrate 20 and the conductive medium layer of the thin film circuit layer 80 are formed simultaneously and integrally connected. This facilitates the processing and manufacturing process and improves the production efficiency of the entire semi-finished product.

[0037] The thin film circuit layer 80 is installed on one side of the two heat sink substrates, which effectively reduces the installation space occupied by the first heat sink substrate 10, the second heat sink substrate 20 and the semi-finished product formed by the thin film circuit layer 80.

[0038] Furthermore, in one embodiment of the present invention, a plurality of jumpers 60 are also provided on the circuit layer to electrically connect a plurality of electronic components 50, and / or the plurality of jumpers 60 electrically connect the electronic components 50 to the first mounting surface 11, and / or the plurality of jumpers 60 electrically connect the electronic components 50 to the second mounting surface 21. The jumpers 60 are made of metallic materials, such as aluminum, copper, gold, silver, etc., which have good soldering and electrical conductivity. The connection of the jumpers 60 can be achieved by keys and machine-bound wires.

[0039] Specifically, these jumpers 60 can connect electronic components 50 to each other on a heat sink substrate, connect electronic components 50 to a circuit layer, or be used as a cross-line connection to the circuit layer; these jumpers 60 can also connect electronic components 50 to each other on a thin-film circuit layer 80, connect electronic components 50 to a conductive dielectric layer, or be used as a cross-line connection to the conductive dielectric layer; these jumpers 60 can also connect the heat sink substrate and the thin-film circuit layer 80, such as connecting electronic components 50 on the heat sink substrate to the conductive dielectric layer on the thin-film circuit layer 80, connecting the circuit layer on the heat sink substrate to the electronic components 50 on the thin-film circuit layer 80, or connecting the circuit layer on the heat sink substrate to the conductive dielectric layer on the thin-film circuit layer 80.

[0040] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the first heat dissipation part 12 has a first extension 13 connected to the first mounting surface 11 at the other end opposite to the pin 70, and the second heat dissipation part 22 has a second extension 23 connected to the second mounting surface 21 at the other end opposite to the pin 70. The first extension 13 and the second extension 23 are respectively provided with a first groove 13A and a second groove 23A, which form a receiving space for accommodating the thin film circuit layer 80. Figure 2As shown, the first extension 13 and the second extension 23 are respectively disposed on the other side of the first heat sink 12 and the second heat sink 22 on the mounting pin 70 side. Figure 2 On the right side of the middle, and grooves are respectively cut inward to form a first groove 13A and a second groove 23A. The shape and size of the first groove 13A and the second groove 23A are preferably as follows: Figure 2 The two are the same, and when they are arranged opposite each other, they form a space that can accommodate the curved thin film circuit layer 80. Moreover, the first extension 13 and the second extension 23 further increase the heat dissipation area of ​​the first heat dissipation part 12 and the second heat dissipation part 22, thereby improving their heat dissipation efficiency for the power device.

[0041] Furthermore, such as Figure 1 and Figure 2 As shown, the bottom surfaces of the first extension 13 and the second extension 23 abut against each other, so that the first extension 13 and the second extension 23 are arranged side by side in contact with each other based on the same shape and size, thereby making the first groove 13A and the second groove 23A spliced ​​together to form a closed receiving space on one side. Further, the package 30 extends towards both ends of the first heat sink substrate and the second heat sink substrate to seal the receiving space and the bent portion 71 of the sealing pin 70, respectively. While better accommodating the thin film circuit layer 80, the receiving space also allows the package 30 to form an extended mounting portion that mates with the receiving space when sealing the thin film circuit layer 80 after extending into the receiving space, making the fixed connection between the first heat sink 12 and the second heat sink 22 and the package 30 more reliable.

[0042] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the first heat dissipation part 12 protrudes inward to form a first protrusion 12A, and a first mounting surface 11 is disposed on the surface of the first protrusion 12A. The second heat dissipation part 22 protrudes inward to form a second protrusion 22A, and a second mounting surface 21 is disposed on the surface of the second protrusion 22A. One side of the first protrusion 12A and the second protrusion 22A respectively forms the sidewall of the first groove 13A and the second groove 23A, such that the first mounting surface 11 and the second mounting surface 21 are preferably 0.1-0.5 mm, such as 0.2 mm, above the bottom surface of the first groove 13A and the bottom surface of the second groove 23A, respectively. This allows the package 30 to form a suitable shape within the mounting space between the first heat sink substrate 10 and the second heat sink substrate 20, with corresponding grooves formed at the top and bottom, and extending at both ends. The upper and lower grooves of the package 30 correspond to and cooperate with the first protrusion 12A and the second protrusion 22A, thereby facilitating a more reliable connection between the package 30, the first heat sink substrate 10, and the second heat sink.

[0043] In one embodiment of the present invention, the first heat dissipation part 12 and the second heat dissipation part 22 are plate-shaped, and their outer surfaces are respectively provided with a first heat dissipation fin 12B and a second heat dissipation fin. For example... Figure 2 As shown, by setting multiple parallel heat dissipation fins 22B on the outer surface, the heat dissipation capacity of the first heat dissipation part 12 and the second heat dissipation part 22 can be effectively improved. By setting the structure of sheet-like heat dissipation fins, heat can be quickly absorbed and discharged through the air slot in the middle.

[0044] The present invention also proposes a method for manufacturing the IPM module 100 mentioned in the above embodiments, such as... Figure 3 As shown, the manufacturing method includes the following steps:

[0045] Step S100: Place the first heat sink substrate, the second heat sink substrate, and the thin film circuit layer in the carrier;

[0046] Step S200: Arrange the pins and multiple electronic components including power devices on the first mounting surface and the second mounting surface;

[0047] Step S300: Electrically connect the jumper wires to the first mounting surface and the thin film circuit layer, and the second mounting surface and the thin film circuit layer respectively to form the first semi-finished product;

[0048] Step S400: Bend the thin film circuit layer of the first semi-finished product to form the second semi-finished product, so that the first mounting surface and the second mounting surface face each other inward, and place the second semi-finished product in the encapsulation mold;

[0049] Step S500: Apply glue to the encapsulation mold to form an encapsulation body. The second semi-finished product containing the encapsulation body forms a third semi-finished product. The encapsulation body is located between the first mounting surface and the second mounting surface. The encapsulation body extends outward on both sides of the first mounting surface and the second mounting surface to seal the accommodating space and the curved portion of the sealing pin, respectively.

[0050] In step S100, such as Figure 1 As shown, the first heat sink substrate 10, the second heat sink substrate 20 and the thin film circuit layer 80 can be placed flat in a specially made carrier (not shown in the figure). The carrier can be made of materials that can withstand high temperatures of 200°C or higher, such as aluminum, synthetic stone, ceramics, and PPS.

[0051] It is worth noting that in step S100, before placing the aforementioned substrate and thin-film circuit layer 80 in the carrier, multiple steps may be included to form the first heat sink substrate 10 and the second heat sink substrate 20. For example, an aluminum metal heat sink may be fabricated first, and a plane of appropriate size according to the circuit layout design may be formed on one side of the metal heat sink, such as by a router, using high-speed steel as the router cutter, a motor with a speed of 5000 rpm, and the router cutter perpendicular to the aluminum plane; alternatively, the plane may be formed by stamping, with an insulating layer attached to this plane, and then copper foil pressed onto the surface of the insulating layer. The copper foil may then be etched to partially remove it, forming a circuit layer. This circuit layer includes circuit lines and pads located near the side of the metal heat sink layer, or it may be formed by printing with a paste-like conductive medium. The surfaces of the circuit layers on the first heat sink substrate 10 and the second heat sink substrate 20 respectively form a first mounting surface 11 and a second mounting surface 21.

[0052] When forming the first heat sink substrate 10 and the second heat sink substrate 20, a thin-film circuit layer 80 can also be formed simultaneously. Specifically, an insulating thin film layer can be formed first, and then a conductive dielectric layer can be printed on the insulating thin film layer using a printing process. It is worth noting that the circuit layers of the first heat sink substrate 10 and the second heat sink substrate 20 can also be formed by printing the conductive dielectric layer using a printing process, and the circuit layers and conductive dielectric layers of the first heat sink substrate 10 and the second heat sink substrate 20 can be printed and formed integrally at the same time, thereby saving steps. Of course, separate independent circuit layers and conductive dielectric layers can also be formed.

[0053] In step S200, the electronic components 50 and pins 70 protecting the power device are mounted on the circuit layer by soldering or applying silver paste. The electronic components 50 can be mounted on the mounting position of the circuit layer by an automatic die bonding device, and then these electronic components 50 and pins 70 are soldered to the mounting position by a reflow oven.

[0054] In step S300, the first circuit layer of the first heat sink substrate 10 and the thin film circuit layer 80 can be electrically connected by jumper wire 60 using a wire bonding device, and the second circuit layer of the second heat sink substrate 20 can be electrically connected to the thin film circuit layer 80 using jumper wire 60, thereby realizing the electrical connection between the first heat sink substrate 10 and the second heat sink substrate 20 by the thin film circuit layer 80. This ultimately forms the first semi-finished product.

[0055] In step S400, as Figure 2As shown, the thin-film circuit layer 80 of the first semi-finished product is bent so that the first heat sink substrate 10 and the second heat sink substrate 20 are stacked vertically, with the first mounting surface 11 and the second mounting surface 21 facing inwards, and the first heat dissipation part 12 and the second heat dissipation part 22 disposed on the upper and lower outer sides. The thin-film circuit layer 80 is bent and disposed on the same side of the first heat sink substrate 10 and the second heat sink substrate 20, and the pins 70 are disposed on the other side of the first heat sink substrate 10 and the second heat sink substrate 20, thereby forming the second semi-finished product. The second semi-finished product is then placed in a packaging mold (not shown in the figure), and the interior of the packaging mold forms a mold cavity for injection molding.

[0056] In step S500, a thermoplastic material, such as resin, is injected into the mold cavity until the entire cavity is filled. The temperature inside the cavity during resin injection is generally around 180°C. After cooling, the thermoplastic material forms an encapsulation layer, completely covering the sides of the first heat sink substrate 10 and the second heat sink substrate 20 where the electronic components 50 and pins 70 are mounted. The encapsulation layer extends outwards from both sides of the first mounting surface 11 and the second mounting surface 21 to seal the mounting space and the bent portions of the pins, respectively. This ultimately forms the third semi-finished product.

[0057] Furthermore, the pins of the third semi-finished product can be cut and shaped at 70°, and the electrical performance of the product can be tested by an electrical parameter testing machine to complete the manufacturing process of the IPM module.

[0058] The intelligent power module manufacturing method of the present invention involves placing a first heat sink substrate 10, a second heat sink substrate 20, and a thin film circuit layer 80 in a carrier, and arranging a plurality of electronic components 50 and pins 70, including power devices, on a first mounting surface 11 and a second mounting surface 21. Then, jumpers 60 are electrically connected to the first mounting surface 11 and the thin film circuit layer 80 and the second mounting surface 21 and the thin film circuit layer 80 respectively to form a first semi-finished product. The thin film circuit layer 80 of the first semi-finished product is bent to form a second semi-finished product, such that the first mounting surface 11 and the second mounting surface 21 face inward. The second semi-finished product is placed in a packaging mold, and the packaging mold is potted to form a package body 30 to form a third semi-finished product. The package body 30 is located between the first mounting surface 11 and the second mounting surface 21, and extends outward on both sides of the first mounting surface 11 and the second mounting surface 21 to seal the mounting space and the bent portion of the pins respectively. This allows the IPM module 100 to form a stacked structure, with electronic components 50 mounted on both layers. This effectively increases the circuit density of the module and reduces the surface area of ​​the IPM module 100, thus enabling miniaturization and cost reduction. Since the first heat sink substrate 10 and the second heat sink substrate 20 adopt an integrated heat sink and substrate structure, unlike the separate substrate and heat sink structures in existing technologies, the installation steps for the substrate and heat sink can be eliminated, thereby improving the production efficiency of the IPM module. Furthermore, the two-layer structure allows the high-voltage power device circuitry and the low-voltage control circuitry to be located on separate layers, achieving electrical separation between them and reducing interference from the high-voltage power devices to the low-voltage control circuitry. This improves the operational stability and reliability of the IPM module 100.

[0059] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0061] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0062] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0063] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A smart power module, characterized in that, include: A first heat sink substrate and a second heat sink substrate are arranged opposite each other, wherein the first heat sink substrate includes a first heat dissipation part disposed on the outer side and a first mounting surface for mounting power devices is formed on the bottom surface of the first heat dissipation part, and the second heat sink substrate includes a second heat dissipation part disposed on the outer side and a second mounting surface for mounting power devices is formed on the bottom surface of the second heat dissipation part. A plurality of electronic components including power devices are mounted on a first mounting surface and a second mounting surface; A flexible thin-film circuit layer is disposed at one end on the same side of the first heat sink substrate and the second heat sink substrate to electrically connect the first heat sink substrate and the second heat sink substrate. Multiple pins are configured and electrically connected to the other end of the same side of the first heat sink substrate and the second heat sink substrate. A package that at least covers and fills the space between the first mounting surface and the second mounting surface, with the pins exposed from the package; The first heat sink substrate includes a first heat dissipation part, a first insulating layer and a first circuit layer connected in sequence, wherein the surface of the first circuit layer forms the first mounting surface; the second heat sink substrate includes a second heat dissipation part, a second insulating layer and a second circuit layer connected in sequence, and a second mounting surface is disposed on the second circuit layer, wherein the surface of the second circuit layer forms the second mounting surface. The circuit layer is formed by etching copper foil onto an insulating layer; or by printing a paste-like conductive medium onto the insulating layer, wherein the conductive medium is one of graphene, solder paste, or silver paste. The thin-film circuit layer includes an insulating thin-film layer on the surface and a conductive dielectric layer located in the middle of the insulating thin-film layer. The thin-film circuit layer is made based on flexible copper clad laminate technology or ribbon cable technology. The conductive dielectric layer is integrally formed with the circuit layer. The first heat dissipation part has a first extension at the other end of the pin that is connected to the first mounting surface, and the second heat dissipation part has a second extension at the other end of the pin that is connected to the second mounting surface. The first extension and the second extension are respectively provided with a first groove and a second groove, and the first groove and the second groove form a receiving space for accommodating the thin film circuit layer. The bottom surfaces of the first extension and the second extension abut against each other; the first heat dissipation portion protrudes inward to form a first protrusion, and the first mounting surface is disposed on the surface of the first protrusion; the second heat dissipation portion protrudes inward to form a second protrusion, and the second mounting surface is disposed on the surface of the second protrusion; The package extends toward both ends of the first and second heat sink substrates to seal the receiving space and the bent portion of the pins, respectively.

2. The intelligent power module according to claim 1, characterized in that, The first mounting surface and the second mounting surface are respectively 0.1-0.5mm higher than the bottom surface of the first groove and the bottom surface of the second groove.

3. The intelligent power module according to claim 1, characterized in that, It also includes multiple jumpers that are electrically connected to the multiple electronic components; and / or the multiple jumpers are electrically connected to the electronic components and the first mounting surface; and / or the multiple jumpers are electrically connected to the electronic components and the second mounting surface.

4. A method for manufacturing an intelligent power module according to any one of claims 1 to 3, characterized in that, The manufacturing method includes the following steps: The first heat sink substrate, the second heat sink substrate, and the thin film circuit layer are disposed in the carrier; Pins and multiple electronic components including power devices are configured on the first and second mounting surfaces; The jumper wires are electrically connected to the first mounting surface and the thin film circuit layer, as well as the second mounting surface and the thin film circuit layer, to form the first semi-finished product. The thin film circuit layer of the first semi-finished product is bent to form the second semi-finished product, such that the first mounting surface and the second mounting surface face each other inward, and the second semi-finished product is placed in the packaging mold. The encapsulation mold is potted to form an encapsulation body, and a second semi-finished product containing the encapsulation body forms a third semi-finished product, wherein the encapsulation body is located between the first mounting surface and the second mounting surface, and the encapsulation body extends outward on both sides of the first mounting surface and the second mounting surface to seal the receiving space and the bent portion of the pin, respectively.

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