Electronic packaging and method of manufacturing the same

Abstract

An electronic package and a method for manufacturing the same include disposing at least one substrate structure having a second antenna portion on a carrier structure having a first antenna portion, and then stacking an antenna structure having a first antenna body and a second antenna body on the carrier structure via a plurality of support members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion, thereby being disposed on the carrier structure via the substrate structure to generate 5G millimeter waves of other frequencies, so that the antenna structure can generate different antenna signals as required.

Description

Technical Field

[0001] The invention relates to an electronic package, and in particular to an electronic package with an antenna structure and a manufacturing method thereof. Background Art

[0002] Nowadays, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to receive or send various wireless signals. In order to meet the portability and Internet access convenience of consumer electronic products (such as watching multimedia content), the manufacturing and design of wireless communication modules are developed towards the requirements of lightness, thinness, shortness and smallness. Among them, patch antennas are widely used in wireless communication modules of electronic products due to their small size, light weight and easy manufacturing.

[0003] As the image quality of current multimedia content improves, the file data volume becomes larger, so the bandwidth of wireless transmission also needs to be increased, resulting in the fifth generation of wireless transmission (5G). In addition, due to the higher transmission frequency of 5G, the requirements for its related wireless communication modules are also higher.

[0004] The application of 5G is a trend of full commercialization in the future. Its application frequency range is approximately in the high-frequency band between 1GHz and 1000GHz. Its commercial application model is 5G in combination with 4G LTE, and a cellular base station is set up outdoors to cooperate with the small base station installed indoors. Therefore, 5G mobile communications will use a large number of antennas in the base station to meet the large-capacity, fast transmission and low latency of the 5G system.

[0005] Figure 1 FIG. 1 is a three-dimensional schematic diagram of an existing wireless communication module 1. Figure 1 As shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a packaging material 13. The substrate 10 is a circuit board and is rectangular. The electronic component 11 is disposed on the substrate 10 and is electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 is electrically connected to the electronic component 11 via the wire 121. The packaging material 13 covers the electronic component 11 and part of the wire 121.

[0006] Taking smartphones as an example, the 5G frequency band can be divided into 3.5Ghz~6Ghz, 28Ghz, 39Ghz, 60Ghz, 71Ghz~73Ghz, etc., and the 5G system requires more antenna configurations to improve signal quality and transmission speed due to signal quality and transmission speed requirements.

[0007] However, in the existing wireless communication module 1, the antenna structure 12 is planar, and the length and width of the substrate 10 are fixed, resulting in limited circuit wiring space (number of layers), thereby limiting the function of the antenna structure 12, causing the wireless communication module 1 to be unable to provide the electrical functions required to operate the 5G system, and it is difficult to meet the antenna operation requirements of the 5G system.

[0008] In addition, if a layout area is added on the surface of the substrate 10 to form an antenna body 120 of multiple frequencies, the width of the substrate 10 will increase, making it difficult to reduce the width of the wireless communication module 1, resulting in the wireless communication module 1 being unable to meet the miniaturization requirements.

[0009] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention

[0010] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof, wherein the antenna structure can generate different antenna signals according to requirements.

[0011] The electronic package of the present invention comprises: a supporting structure having a first antenna portion; at least one substrate structure arranged on the supporting structure, wherein the substrate structure has a second antenna portion; and an antenna structure stacked on the supporting structure via a plurality of supporting members to cover the first antenna portion and the second antenna portion, wherein the antenna structure has a first antenna body corresponding to the first antenna portion and a second antenna body corresponding to the second antenna portion.

[0012] The present invention also provides a method for manufacturing an electronic package, comprising: placing at least one substrate structure having a second antenna portion on a supporting structure having a first antenna portion; and stacking an antenna structure on the supporting structure via a plurality of supporting members so that the antenna structure covers the first antenna portion and the second antenna portion, wherein the antenna structure has a first antenna body corresponding to the first antenna portion and a second antenna body corresponding to the second antenna portion.

[0013] In the aforementioned electronic package and its manufacturing method, a first air gap is formed between the antenna structure and the supporting structure. For example, the signal frequency between the first antenna body and the first antenna portion corresponds to the height of the first air gap; or, the first air gap is located between the first antenna portion and the first antenna body. Alternatively, a second air gap is formed between the antenna structure and the substrate structure, and the height of the second air gap is less than the height of the first air gap, so that the signal frequency between the second antenna body and the second antenna portion is greater than the signal frequency between the first antenna body and the first antenna portion.

[0014] In the aforementioned electronic package and its manufacturing method, an air gap is formed between the antenna structure and the substrate structure. For example, the signal frequency between the second antenna body and the second antenna portion corresponds to the height of the air gap; or, the air gap is located between the second antenna portion and the second antenna body.

[0015] In the aforementioned electronic package and its manufacturing method, a plurality of the substrate structures are disposed on the supporting structure. For example, a plurality of air gaps are formed between the antenna structure and each of the substrate structures. Further, the heights of the plurality of air gaps are different, and the smaller the height of the plurality of air gaps, the higher the signal frequency between the second antenna body and the second antenna portion corresponding to the smaller height of the air gaps.

[0016] The aforementioned electronic package and its manufacturing method also include configuring electronic components on the supporting structure.

[0017] From the above, it can be seen that in the electronic package and its manufacturing method of the present invention, at least one substrate structure with a second antenna portion is mainly arranged on a supporting structure with a first antenna portion to generate 5G millimeter waves of other frequencies, so that the antenna structure connected to the supporting structure can generate different antenna signals as required to enable the electronic component to transmit the 5G millimeter wave of the required frequency. Therefore, compared with the prior art, the electronic package of the present invention can enhance the function of the antenna structure, so that the electronic package can provide the electrical functions required for operating the 5G system, so as to meet the antenna operation requirements of the 5G system.

[0018] In addition, the substrate structure is placed on the supporting structure, so there is no need to increase the layout area on the supporting structure, so that the manufacturing method of the present invention can produce antennas of various frequencies under a predetermined supporting structure size, thereby enabling the electronic package to meet the needs of miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a cross-sectional schematic diagram of an existing wireless communication module.

[0020] FIG. 2A to FIG. 2B It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0021] Figure 3 and Figure 4 It is a cross-sectional schematic diagram of another embodiment of the electronic package of the present invention.

[0022] Description of Reference Numerals

[0023] 1 Wireless communication module

[0024] 10 substrate

[0025] 11 Electronic components

[0026] 12,2b Antenna structure

[0027] 120 Antenna body

[0028] 121 Wire

[0029] 13 Packaging materials

[0030] 2,3,4 Electronic packaging

[0031] 2a Encapsulation module

[0032] 20 Load-bearing structure

[0033] 20a First side

[0034] 20b Second side

[0035] 200 First antenna unit

[0036] 201 Insulator

[0037] 202 Line Layer

[0038] 21,41 Electronic components

[0039] 21a Action surface

[0040] 21b Non-active surface

[0041] 210 Conductive bump

[0042] 22,32 Substrate structure

[0043] 220,320 Second antenna unit

[0044] 23 Support

[0045] 24 base

[0046] 24a First antenna body

[0047] 24b, 34b Second antenna body

[0048] 29 Conductive element

[0049] h1,h2,h3 height

[0050] t1 First air gap

[0051] t2,t3 Second air gap

[0052] A. Action Area

[0053] B placement area. DETAILED DESCRIPTION

[0054] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0055] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0056] FIG. 2A to FIG. 2B It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention.

[0057] like Figure 2A As shown, a carrier structure 20 is provided with an electronic component 21, and an active area A and a placement area B separated from each other are defined on the surface of the carrier structure 20, wherein the active area A has a first antenna portion 200. Then, at least one substrate structure 22 is disposed on the placement area B of the carrier structure 20 to form a packaging module 2a, wherein the substrate structure 22 has a second antenna portion 220.

[0058] In the present embodiment, the supporting structure 20 has a first side 20a and a second side 20b opposite to each other, and the supporting structure 20 is, for example, a substrate having a core layer and a circuit portion or a coreless substrate having a circuit portion, which has an insulator 201 and a circuit layer 202 combined on the insulator 201, and the circuit layer 202 is, for example, a fan-out type redistribution layer (RDL), which includes the first antenna portion 200. Specifically, the material forming the circuit layer 202 is, for example, copper, and the material forming the insulator 201 is, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. It should be understood that the supporting structure can also be other supporting units that can be used to carry electronic components such as chips, such as a lead frame or a silicon interposer.

[0059] interposer), but not limited to the above.

[0060] In addition, the electronic component 21 is disposed on the second side 20b of the supporting structure 20, and the electronic component 21 is an active component, a passive component or a combination of the two, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. For example, the electronic component 21 is an active component, such as a semiconductor chip with a function of transmitting 5G millimeter waves (mmWave), which has a relative active surface 21a and an inactive surface 21b, and the active surface 21a is disposed on the circuit layer 202 in a flip chip manner through a plurality of conductive bumps 210 such as solder materials and electrically connected to the circuit layer 202 (and the first antenna unit 200), so that the first antenna unit 200 can receive and transmit the required millimeter waves; or, the electronic component 21 can be electrically connected to the circuit layer 202 in a wire bonding manner through a plurality of welding wires (not shown). However, the method of electrically connecting the electronic component to the supporting structure is not limited to the above.

[0061] In addition, the substrate structure 22 is disposed on the first side 20a of the carrier structure 20 and electrically connected to the circuit layer 202 of the carrier structure 20, so that the electronic component 21 can be electrically connected to the substrate structure 22 through the carrier structure 20, and the substrate structure 22 is, for example, a substrate having a core layer and a circuit portion or a coreless substrate having a circuit portion, which has an insulator and a circuit layer combined with the insulator, and the circuit layer is, for example, a fan-out type redistribution layer (RDL) and includes the second antenna portion 220. Specifically, the material forming the circuit layer is, for example, copper, and the material forming the insulator is, for example, a dielectric material such as poly(p-oxadiazole) (PBO), polyimide (PI), prepreg (PP), etc.

[0062] In addition, a plurality of conductive elements 29 such as solder balls may be disposed on the second side 20 b of the supporting structure 20 , so that the conductive elements 29 can be disposed on a circuit board (not shown).

[0063] like Figure 2B As shown, an antenna structure 2b is stacked on the first side 20a of the supporting structure 20 via a plurality of supporting members 23 so that the antenna structure 2b covers the active area A and the substrate structure 22 to form the electronic package 2 of the present invention.

[0064] In this embodiment, the antenna structure 2b is in the form of an antenna plate, which includes a base 24 and a circuit portion (not shown) combined with the base 24, a first antenna body 24a and a second antenna body 24b, wherein the first antenna body 24a corresponds to the first antenna portion 200, and the second antenna body 24b corresponds to the second antenna portion 220. Specifically, the first antenna body 24a and the first antenna portion 200 transmit signals in a coupled manner. For example, the first antenna body 24a and the first antenna portion 200 can generate radiation energy by alternating voltage, alternating current or radiation change, and the radiation energy is an electromagnetic field, so that the first antenna body 24a and the first antenna portion 200 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the first antenna body 24a and the first antenna portion 200. Similarly, the second antenna body 24b and the second antenna portion 220 also transmit signals in a coupled manner.

[0065] In addition, a first air gap t1 is formed between the antenna structure 2b and the first side 20a of the supporting structure 20, and a second air gap t2 is formed between the antenna structure 2b and the substrate structure 22. Specifically, the first air gap t1 is located between the first antenna portion 200 and the first antenna body 24a, and the second air gap t2 is located between the second antenna portion 220 and the second antenna body 24b, so that the height h2 of the second air gap t2 is smaller than the height h1 of the first air gap t1. In addition, in other embodiments, such as Figure 3 As shown, the number of the substrate structures 22, 32 can be configured as required, and a plurality of second air gaps t2, t3 are formed between the antenna structure 2b and each of the substrate structures 22, 32. For example, the heights h2, h3 of each of the second air gaps t2, t3 can be different.

[0066] In addition, since air is the best low-loss medium, its dielectric constant (Dk) is 1, and its dielectric loss (Df) is zero, the air gap is formed to improve the antenna performance of the electronic package 2 corresponding to the 5G communication function. For example, the signal frequency between the first antenna body 24a and the first antenna part 200 corresponds to the height h1 of the first air gap t1, and the signal frequency between the second antenna body 24b and the second antenna part 220, 320 corresponds to the height h1, h2 of the second air gap t2, t3. Specifically, based on the principle that the smaller the height of the air gap is, the larger the corresponding antenna signal frequency is, the signal frequency between the second antenna body 24b and the second antenna portion 220, 320 (such as 39 GHz or 60 GHz) is greater than the signal frequency between the first antenna body 24a and the first antenna portion 200 (such as 28 GHz), and the smaller the heights h2, h3 of the plurality of second air gaps t2, t3 are (h3<h2), the higher the corresponding signal frequency between the second antenna body 24a and the second antenna portion 220, 320 is (60 GHz corresponding to the second antenna portion 320>39 GHz corresponding to the first antenna portion 220).

[0067] In addition, the support member 23 is electrically connected to the circuit layer 202 of the supporting structure 20 and the circuit portion of the antenna structure 2b. Specifically, the support member 23 is a solder ball, a copper core ball, a metal member (such as a column, block or needle) made of copper or gold, or other appropriate components.

[0068] The manufacturing method of the present invention is designed to place the substrate structure 22, 32 on the supporting structure 20 to adjust the height h2, h3 of the second air gap t2, t3, so as to generate 5G millimeter waves of other frequencies, so that the antenna structure 2b can generate different antenna signals as required (i.e., the signal between the first antenna body 24a and the first antenna part 200, the signal between the second antenna body 24b and the second antenna part 220, or the signal between another second antenna body 34b and another second antenna part 320), so as to enable the RF chip (i.e., the electronic component 21) to transmit the 5G millimeter wave of the required frequency. Specifically, the electronic component 21 transmits a 5G millimeter wave signal with a frequency of 28 GHz via the first antenna portion 200; or, the electronic component 21 transmits a 5G millimeter wave signal with a frequency of 39 GHz via the second antenna portion 220 of the substrate structure 22; or, the electronic component 21 transmits a 5G millimeter wave signal with a frequency of 60 GHz via the second antenna portion 320 of another substrate structure 32.

[0069] Therefore, compared to the prior art, when mass-producing the electronic packages 2, 3, the present invention, through the design of the packaging module 2a including antenna parts of multiple frequencies (the first antenna part 200 and the second antenna part 220, 320), only needs to electrically connect the antenna structure 2b with different antenna types (the pattern form of the first antenna body 24a and the second antenna body 24b, 34b varies according to the RF requirements or the thickness d of the base 24 varies according to the RF requirements) to the same type of packaging module 2a, so as to produce RF products of various frequencies, without the need to make the RF chip of each frequency into an independent packaging module (that is, the prior art needs to open at least three production lines with different processes to produce three types of RF modules), thereby reducing the number of production lines to reduce production costs, and increasing production speed to improve production capacity.

[0070] In addition, the present invention stacks the substrate structure 22 on the supporting structure 20, so there is no need to increase the layout area on the supporting structure 20, so that the manufacturing method of the present invention can produce antennas of various frequencies (i.e., millimeter wave antennas) under a predetermined supporting structure 20 size, thereby enabling the electronic package 2, 3 to meet the needs of miniaturization.

[0071] On the other hand, a single electronic component 21 can transmit a single signal or multiple signals as required; or Figure 4 The electronic package 4 shown may be configured with a plurality of electronic components 21 , 41 to correspondingly control the first antenna portion 200 and the second antenna portion 220 , 320 .

[0072] The present invention further provides an electronic package 2, 3, 4, comprising: a supporting structure 20, at least one substrate structure 22, 32 and an antenna structure 2b.

[0073] The supporting structure 20 is defined on its surface as an active area A and a placement area B that are separated from each other, wherein the active area A has a first antenna portion 200 .

[0074] The substrate structures 22 , 32 are disposed on the placement area B of the supporting structure 20 , wherein the substrate structure 22 has a second antenna portion 220 , 320 .

[0075] The antenna structure 2b is stacked on the supporting structure 20 via a plurality of supporting members 23 to cover the active area A and the substrate structures 22, 32, wherein the antenna structure 2b has a first antenna body 24a corresponding to the first antenna portion 200 and a second antenna body 24b, 34b corresponding to the second antenna portion 220, 320.

[0076] In one embodiment, a first air gap t1 is formed between the antenna structure 2b and the supporting structure 20. For example, the signal frequency between the first antenna body 24a and the first antenna portion 200 corresponds to the height h1 of the first air gap t1. Alternatively, the first air gap t1 is located between the first antenna portion 200 and the first antenna body 24a. Alternatively, a second air gap t2, t3 is formed between the antenna structure 2b and the substrate structure 22, 32, and the height h2, h3 of the second air gap t2, t3 is less than the height h1 of the first air gap t1, so that the signal frequency between the second antenna body 24b and the second antenna portion 220, 320 is greater than the signal frequency between the first antenna body 24a and the first antenna portion 200.

[0077] In one embodiment, a second air gap t2, t3 is formed between the antenna structure 2b and the substrate structure 22, 32. For example, the signal frequency between the second antenna body 24b and the second antenna portion 220, 320 corresponds to the height h2, h3 of the second air gap t2, t3. Alternatively, the second air gap t2, t3 is located between the second antenna portion 220, 320 and the second antenna body 24b, 34b.

[0078] In one embodiment, a plurality of the substrate structures 22, 32 are disposed on the placement area B of the support structure 20. For example, a plurality of second air gaps t2, t3 are formed between the antenna structure 2b and each of the substrate structures 22, 32. Further, the heights h2, h3 of the plurality of second air gaps t2, t3 are different, and the smaller the height h3 of the plurality of second air gaps t2, t3, the higher the signal frequency between the second antenna body 24b and the second antenna portion 320.

[0079] In one embodiment, the electronic packages 2 , 3 , 4 further include at least one electronic component 21 , 41 disposed on the supporting structure 20 .

[0080] In summary, the electronic package and the method for manufacturing the same of the present invention, by placing a substrate structure capable of generating different radio frequencies on a single supporting structure, can produce radio frequency products with various frequencies by simply stacking the antenna structure on the supporting structure during mass production, without the need to separately make the radio frequency chip of each frequency into an independent package. Therefore, the electronic package of the present invention can provide the electrical functions required for running the 5G system, so as to meet the requirements of antenna operation of various frequencies of the 5G system.

[0081] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: a carrying structure having a first antenna portion; At least one substrate structure, which is disposed on the surface of the supporting structure and has a second antenna portion; as well as An antenna structure is stacked on the supporting structure via a plurality of supporting members to cover the first antenna portion and the second antenna portion, wherein the antenna structure has a first antenna body corresponding to the first antenna portion and a second antenna body corresponding to the second antenna portion, a first air gap and a second air gap are respectively formed between the antenna structure and the supporting structure and between the antenna structure and the substrate structure, and the height of the second air gap is smaller than the height of the first air gap.

2. The electronic package according to claim 1, characterized in that: A frequency of a signal between the first antenna body and the first antenna portion corresponds to a height of the first air gap.

3. The electronic package according to claim 1, characterized in that: The first air gap is located between the first antenna portion and the first antenna body.

4. The electronic package according to claim 1, characterized in that: The frequency of a signal between the second antenna body and the second antenna portion is greater than the frequency of a signal between the first antenna body and the first antenna portion.

5. The electronic package according to claim 1, characterized in that: An air gap is formed between the antenna structure and the substrate structure.

6. The electronic package according to claim 5, characterized in that: The frequency of a signal between the second antenna body and the second antenna portion corresponds to the height of the air gap.

7. The electronic package according to claim 5, characterized in that: The air gap is located between the second antenna portion and the second antenna body.

8. The electronic package according to claim 1, characterized in that: A plurality of the substrate structures are arranged on the supporting structure.

9. The electronic package according to claim 8, characterized in that: A plurality of air gaps are formed between the antenna structure and each of the substrate structures.

10. The electronic package according to claim 9, characterized in that: The plurality of air gaps have different heights.

11. The electronic package according to claim 10, characterized in that: The smaller the height of the air gaps is, the higher the signal frequency between the second antenna body and the second antenna portion is.

12. The electronic package according to claim 1, characterized in that: The electronic package also includes an electronic component configured on the supporting structure.

13. A method for manufacturing an electronic package, characterized in that: include: Disposing at least one substrate structure having a second antenna portion on a surface of a supporting structure having a first antenna portion; as well as The antenna structure is stacked on the supporting structure via a plurality of supporting members so that the antenna structure covers the first antenna portion and the second antenna portion, wherein the antenna structure has a first antenna body corresponding to the first antenna portion and a second antenna body corresponding to the second antenna portion, and a first air gap and a second air gap are respectively formed between the antenna structure and the supporting structure and between the antenna structure and the substrate structure, and the height of the second air gap is smaller than the height of the first air gap.

14. The method for manufacturing an electronic package according to claim 13, characterized in that: A frequency of a signal between the first antenna body and the first antenna portion corresponds to a height of the first air gap.

15. The method for manufacturing an electronic package according to claim 13, characterized in that: The first air gap is located between the first antenna portion and the first antenna body.

16. The method for manufacturing an electronic package according to claim 13, characterized in that: The frequency of a signal between the second antenna body and the second antenna portion is greater than the frequency of a signal between the first antenna body and the first antenna portion.

17. The method for manufacturing an electronic package according to claim 13, characterized in that: An air gap is formed between the antenna structure and the substrate structure.

18. The method for manufacturing an electronic package according to claim 17, characterized in that: The frequency of a signal between the second antenna body and the second antenna portion corresponds to the height of the air gap.

19. The method for manufacturing an electronic package according to claim 17, characterized in that: The air gap is located between the second antenna portion and the second antenna body.

20. The method for manufacturing an electronic package according to claim 13, characterized in that: A plurality of the substrate structures are arranged on the supporting structure.

21. The method for manufacturing an electronic package according to claim 20, characterized in that: A plurality of air gaps are formed between the antenna structure and each of the substrate structures.

22. The method for manufacturing an electronic package according to claim 21, characterized in that: The plurality of air gaps have different heights.

23. The method for manufacturing an electronic package according to claim 22, characterized in that: The smaller the height of the air gaps is, the higher the signal frequency between the second antenna body and the second antenna portion is.

24. The method for manufacturing an electronic package according to claim 13, characterized in that: The manufacturing method also includes configuring electronic components on the supporting structure.

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