A liftable temporary cooler

Abstract

The present invention specifically discloses a liftable temporary storage cooler, which includes a frame and a flap mechanism. The flap mechanism is arranged inside the frame. The flap mechanism includes a conveyor belt and several plate placing parts for storing PCB boards. The conveyor belt is wound up and down along the height direction of the frame inside the frame. The plate placing parts make lifting movements inside the frame through the conveyor belt. A buffer mechanism is arranged at the top of the frame. The buffer mechanism is used to provide a buffering force for the PCB board that flips by its own weight. The frame is an airtight cavity. An air-conditioning return air system is arranged inside the frame, which can avoid the PCB board from being easily scratched and rebounded when flipping, shorten the floor area of the equipment in the horizontal direction, save the planar space, avoid local expansion and contraction deformation of the PCB board surface during the cooling process, realize the integration of the cooling process and the temporary storage process of the PCB board, reduce the production time of the PCB board, increase the processing time of the cooling process of the PCB board, and ensure the cooling effect of the PCB board.

Description

Technical Field

[0001] The present invention relates to the field of coolers, and more particularly to a liftable temporary storage cooler. Background Art

[0002] During the production process of PCB boards, it is necessary to cool and temporarily store the PCB boards after lamination, outer layer exposure, and solder mask exposure. The traditional methods have the following problems:

[0003] 1) The equipment is relatively long and occupies a large area.

[0004] 2) During the turning process, the PCB board flips under its own weight, and it is easy to cause scratching and rebound.

[0005] 3) The cooling effect is not good. Traditionally, a fan is used to blow, which easily causes local expansion and contraction deformation of the board surface during the cooling process. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a liftable temporary storage cooler, which can avoid scratching and rebound of the PCB board when it flips, shorten the floor area of the equipment in the horizontal direction, save the planar space, avoid local expansion and contraction deformation of the board surface of the PCB board during the cooling process, integrate the cooling process and the temporary storage process of the PCB board, reduce the production time of the PCB board, increase the processing time of the cooling process of the PCB board, and ensure the cooling effect of the PCB board.

[0007] The above problems to be solved by the present invention are achieved through the following technical solutions:

[0008] A liftable temporary storage cooler includes a frame and a turning plate mechanism. The turning plate mechanism is arranged inside the frame. The turning plate mechanism includes a transmission belt and several plate placing parts for storing PCB boards. The transmission belt is wound up and down along the height direction of the frame inside the frame. The plate placing parts move up and down inside the frame through the transmission belt. A buffer mechanism is arranged at the top of the frame. The buffer mechanism is used to provide a buffer force for the PCB board that flips under its own weight. The frame is a closed cavity, and an air-conditioning return air system is arranged inside the frame.

[0009] Further, the buffer mechanism includes a first movable rod and a second movable rod. The first movable rod is used to control the up and down movement of the second movable rod in the height direction of the frame. The second movable rod is rotatably connected to the side end of the first movable rod. The second movable rod is used to support the PCB board that flips under its own weight.

[0010] Further, the buffer mechanism further includes a first cylinder, a second cylinder and a connecting rod. The first movable rod is connected to the connecting rod through the first cylinder. The second movable rod is rotatably connected to the first movable rod through the second cylinder. The connecting rod is used to slidably connect the buffer mechanism to the frame.

[0011] Further, the flap mechanism further includes a driving part and a braking mechanism. The driving part includes an upper drive and a lower drive. The upper drive and the lower drive are respectively arranged at the upper and lower parts inside the conveyor belt. The braking mechanism is arranged on the driving rod of the lower drive or the driving rod of the upper drive.

[0012] Further, the flap mechanism is provided with at least one set of the plate placing parts; one set of the plate placing parts is provided with two or three carbon fiber rods.

[0013] Further, the bottoms of the carbon fiber rods in the same group are connected through anti-slip blocks.

[0014] Further, an anti-jamming plate structure is further included. The anti-jamming plate structure is arranged at the top of the plate placing part. The top of the plate placing part is fixed to the conveyor belt.

[0015] Further, a transmission part is further included. The transmission part includes a first transmission part and a second transmission part. The first transmission part is used to convey the PCB board to the plate placing part. The second transmission part is used to convey the PCB on the plate placing part out of the frame.

[0016] Further, the first transmission part is provided with at least two first transmission rods. The plate placing parts are distributed between the two first transmission rods. The second transmission part is provided with at least two second transmission rods. The plate placing parts are distributed between the two second transmission rods.

[0017] Further, an air inlet for cold air is arranged at the top of the frame. The inlet temperature of the air inlet is A±B°C, where A is the average temperature inside the cavity of the frame and B is the error temperature. The temperature range of A is 10 to 30°C, and the value range of B is 1 to 3°C.

[0018] Beneficial effects: After adopting the liftable temporary storage cooler of the present invention, due to the provision of the flap mechanism, the plate placing part of the flap mechanism is used to store the PCB board, and then the conveyor belt of the flap mechanism is used to drive the PCB board to climb along the height direction of the frame. Then, the buffer mechanism is used to buffer and support the flipped PCB board, so that the PCB board can be flipped smoothly and then move down along the height direction of the frame through the conveyor belt, avoiding the PCB board from being easily scratched and rebounding when flipping under the action of its own weight. And the transportation direction of the liftable temporary storage cooler is changed to the vertical lifting transportation type, shortening the floor area in the horizontal direction of the equipment and saving the plane space.

[0019] Since the frame is a closed cavity structure and an air-conditioning rewarming system is provided inside the frame to implement the cooling process of the PCB board, local expansion and contraction deformation of the PCB board surface during the cooling process can be avoided. Combining with the turning plate structure, the integration of the cooling process and the temporary storage process of the PCB board is realized, reducing the production time of the PCB board. And combining with the transmission belt of the turning plate mechanism, the processing time of the cooling process of the PCB board is increased to ensure the cooling effect of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is the structural diagram of the device with a frame of a liftable temporary storage cooler according to the present invention;

[0021] Figure 2 is the structural diagram of the device without a frame of a liftable temporary storage cooler according to the present invention;

[0022] Figure 3 is Figure 2 the partial enlarged view of X in

[0023] Figure 4 is Figure 2 the partial enlarged view of Y in

[0024] Figure 5 is Figure 1 the top view of

[0025] Figure 6 is the structural diagram of the buffer mechanism of a liftable temporary storage cooler according to the present invention;

[0026] Figure 7 is the partial view of the transmission belt of a liftable temporary storage cooler according to the present invention;

[0027] In the figure: frame 1, air inlet 11,

[0028] turning plate mechanism 2, transmission belt 21, fixing block 211, fixing rod 212, mounting hole 213, card slot 214, plate placing part 22, carbon fiber rod 221, anti-slip block 222, driving part 23, upper drive 231, lower drive 232, gear 233, plate placing part 224 at the current working station, plate placing part 225 at the previous working station,

[0029] buffer mechanism 3, first movable rod 31, second movable rod 32, buffer pad 321, first cylinder 33, second cylinder 34, connecting rod 35,

[0030] brake mechanism 4,

[0031] anti-card board structure 5, connecting plate 51, baffle 52, inclination angle α,

[0032] transmission part 6, first transmission part 61, first transmission rod 611, second transmission part 62, second transmission rod 621. Detailed implementation mode

[0033] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, but the embodiments do not limit the present invention in any form.

[0034] Embodiment 1:

[0035] Refer to Figure 1-7 , a liftable temporary storage cooler, including a frame 1 and a flap mechanism 2. The flap mechanism 2 is arranged inside the frame 1. The flap mechanism 2 includes a transmission belt 21 and several plate placement parts 22 for storing PCB boards. The transmission belt 21 is wound up and down along the height direction of the frame 1 inside the frame 1. The plate placement parts 22 move up and down inside the frame 1 through the transmission belt 21. A buffer mechanism 3 is arranged at the top of the frame 1. The buffer mechanism 3 is used to provide a buffer force for the PCB board that flips by its own weight. The frame 1 is an airtight cavity. An air-conditioning return air system is arranged inside the frame 1 to prevent the PCB board from being easily scratched and rebounded when flipping under its own weight, and change the transportation direction of the liftable temporary storage cooler to a vertical lifting transportation type, shortening the floor area in the horizontal direction of the equipment, saving plane space, realizing the cooling process of the PCB board, avoiding local expansion and contraction deformation of the PCB board surface during the temperature reduction process, realizing the integration of the cooling process and the temporary storage process of the PCB board, reducing the production time of the PCB board, increasing the processing time of the cooling process of the PCB board, and ensuring the cooling effect of the PCB board.

[0036] Refer to Figure 1-3 , 5-6, the buffer mechanism 3 includes a first movable rod 31 and a second movable rod 32. The first movable rod 31 is used to control the up and down movement of the second movable rod 32 in the height direction of the frame 1, control the vertical position of the second movable rod 32, and realize the descent of the second movable rod 32 along with the descent of the PCB board. After the flipping action of the previous PCB board is completed, the first movable rod 31 controls the second movable rod 32 to rise and return to position for the flipping of the next PCB board, and also ensures that the second movable rod 32 can contact the PCB board. The second movable rod 32 is rotatably connected to the side end of the first movable rod 31. The second movable rod 32 is used to support the PCB board that flips by its own weight, so that the inclination angle of the second movable rod 32 is close to the inclination angle of the PCB board during downward transportation, ensuring the buffer effect. A buffer pad 321 is arranged on the second movable rod 32. The buffer pad 321 is used to reduce the friction between the second movable rod 32 and the PCB board and improve the buffer effect, reducing the scratching and rebound deviation of the PCB board.

[0037] Refer to Figure 1-3, 5 - 6, the buffer mechanism 3 further includes a first cylinder 33, a second cylinder 34 and a connecting rod 35. The first movable rod 31 is connected to the connecting rod 35 through the first cylinder 33. The second movable rod 32 is rotatably connected to the first movable rod 31 through the second cylinder 34. The connecting rod 35 is used to slidably connect the buffer mechanism 3 to the frame 1. The first cylinder 33 realizes the rising and falling of the left end of the first movable rod 31, ensuring that the second movable rod 32 can contact the PCB board, so as to realize the rising and falling of the second movable rod 32 connected to the right end of the first movable rod 31. The second cylinder 34 realizes the rotation of the second movable rod 32 on the right end of the first movable rod 31.

[0038] See Figure 1-2 , 5, the flap mechanism 2 further includes a driving part 23 and a braking mechanism 4. The driving part 23 includes an upper drive 231 and a lower drive 232. The upper drive 231 and the lower drive 232 are respectively arranged at the upper and lower parts inside the conveyor belt 21. The braking mechanism 4 is arranged on the driving rod of the lower drive 232. The driving part 23 is used to provide a rotational force to the conveyor belt 21. The upper drive 231 and the lower drive 232 cooperate to realize the rising and falling of the plate placing part 22 driven by the conveyor belt 21. By the lower drive 232 linking the conveyor belt 21, it prevents the conveyor belt 21 from transmitting and rebounding and moving, playing the functions of braking, speed maintaining, high-frequency operation and positioning of the conveyor belt 21. The number of the lower drives 232 is two, and the set horizontal heights of the two lower drives 232 are the same; the lower drive 232 is a cylinder-type motor, the upper drive 231 is a cylinder-type motor, and the braking mechanism 4 is a flange single-plate electromagnetic brake.

[0039] See Figure 1-5 , the flap mechanism 2 is provided with at least one group of the plate placing parts 22; one group of the plate placing parts 22 is provided with two carbon fiber rods 221 to ensure the stable placement of the PCB board; the flap mechanism 2 is provided with two groups of plate placing parts 22 to increase the placement capacity of the PCB board.

[0040] The flap part is provided with a board feeding inductor for the PCB board, and the board feeding inductor is communicatively connected to the driving part 23, which is convenient to realize that the operating speed of the driving part 23 is similar to the board feeding speed, and avoid redundant board feeding.

[0041] See Figure 5, one of the buffer mechanisms 3 corresponds to one or two PCB - placing parts 22, and the PCB is placed on one or two PCB - placing parts 22; when the PCB is placed on one PCB - placing part 22 and one of the buffer mechanisms 3 corresponds to one PCB - placing part 22, then one of the buffer mechanisms 3 buffers and dampens the PCB of one station, and one buffer mechanism 3 only buffers and dampens the PCB of one station; when the PCB is placed on one PCB - placing part 22 and one of the buffer mechanisms 3 corresponds to two PCB - placing parts 22, then one buffer mechanism 3 buffers and dampens the PCBs of two stations, and the buffer mechanism 3 is slid on the frame 1 by using the connecting rod 35 to change the buffer - damping object of the buffer mechanism 3; when the PCB is placed on two PCB - placing parts 22 and one of the buffer mechanisms 3 corresponds to one PCB - placing part 22, then two buffer mechanisms 3 buffer and dampen the PCB of one station, improving the buffer - damping effect of the PCB; when the PCB is placed on two PCB - placing parts 22 and one of the buffer mechanisms 3 corresponds to two PCB - placing parts 22, then one of the buffer mechanisms 3 buffers and dampens the PCB of one station, and the buffer mechanism 3 is arranged between the two PCB - placing parts 22 so that the buffer mechanism 3 buffers and decompresses the PCB in the middle of the PCB, ensuring the balance and stability of the PCB.

[0042] See Figure 1-3 , for the carbon fiber rods 221 in the same group, the bottom ends are connected by anti - slip blocks 222 to prevent the PCB from sliding out from the bottom end of the PCB - placing part 22.

[0043] See Figure 1-4 , it further includes an anti - jamming plate structure 5. The anti - jamming plate structure 5 is arranged at the top end of the PCB - placing part 22. The top end of the PCB - placing part 22 is fixed to the conveyor belt 21. The anti - jamming plate structure 5 includes a connecting plate 51 and a baffle plate 52. The connecting plate 51 is connected to the carbon fiber rod 221 of the PCB - placing part 22. The connecting plate 51 is fixed to the top end of the carbon fiber rod 221. The top end of the carbon fiber rod 221 is fixed on the conveyor belt 21. The baffle plate 52 is connected to the connecting plate 51. The baffle plates 52 are distributed between each PCB - placing part 22. There is an inclination angle α between the baffle plate 52 and the carbon fiber rod 221, and the value range of the inclination angle α is 30 - 90°, which can prevent the problem of jamming plates.

[0044] See Figure 1-2 、5, it further includes a transmission part 6. The transmission part 6 includes a first transmission part 61 and a second transmission part 62. The first transmission part 61 is used to transport the PCB to the PCB - placing part 22, and the second transmission part 62 is used to transport the PCB on the PCB - placing part 22 out of the frame 1, realizing the automatic entry and exit of the PCB from the frame 1 and automatically transporting it onto the PCB - placing part 22 or transporting it out of the frame 1 from the PCB - placing part 22.

[0045] See Figure 1-2, 5, the first transmission part 61 is provided with at least two first transmission rods 611, the plate placing part 22 is distributed between the two first transmission rods 611, the second transmission part 62 is provided with at least two second transmission rods 621, and the plate placing part 22 is distributed between the two second transmission rods 621.

[0046] See Figure 1 , an air inlet 11 for cold air is provided at the top of the frame 1, the inlet temperature of the air inlet 11 is A ± B °C, where A is the average temperature inside the cavity of the frame 1, B is the error temperature, the temperature range of A is 10 to 30 °C, the value range of B is 1 to 3 °C, the preferred temperature of A is 20 °C, and the preferred temperature of B is 2 °C, that is, the preferred inlet temperature of the air inlet 11 is 20 ± 2 °C, so as to ensure that the temperature inside the cavity of the frame 1 remains constant, thereby ensuring that the PCB board is in a constant temperature state during the cooling process, and reducing the risk of deformation and the like of the PCB board during the cooling process.

[0047] See Figure 1-2 , 4, 7, the transmission belt 21 is in a chain-like structure, the transmission belt 21 includes fixing blocks 211 and fixing rods 212, the fixing blocks 211 are connected and fixed by the fixing rods 212, an installation hole 213 is provided on the upper surface of the fixing block 211, the diameter of the installation hole 213 is equal to the diameter of the carbon fiber rod 221, a clamping groove 214 is formed on the lower surface of the fixing block 211 through the fixing rod 212, and the clamping groove 214 is adapted to the gears 233 of the lower drive 232 and the upper drive 231, ensuring that the transmission belt 21 can be clamped every time it moves one step, and preventing the transmission belt 21 from jumping during the movement.

[0048] The thickness of the PCB board is 0.4 to 4.0 mm, the width is 400 to 650 mm, and the flipping angle of the PCB board at the top of the transmission belt 21 is 18°.

[0049] Working principle:

[0050] See Figure 1-7 , the PCB board enters the liftable temporary storage cooler through the first transmission part 61 and is transported onto the plate placing part 22. Every time a PCB board enters, the driving part 23 drives the transmission belt 21 to advance one step diameter, driving the PCB board to rise or fall. After the transmission belt 21 rises, the PCB board is supported by the plate placing part 22 and transported upward. When the PCB board rises to the top, the PCB board topples forward from the current plate placing part 22 to the previous plate placing part 22 under the action of its own weight, and relies on the buffer mechanism 3 to drive the PCB board to gradually lean on the previous plate placing part 22. The PCB board descends downward under the transmission of the plate placing part 22 and is then transmitted out of the frame 1 by the second transmission part 62.

[0051] See Figure 1-3, 5 - 6. The operating principle of the buffer mechanism 3 is as follows: During the transmission of the PCB board at the top of the conveyor belt 21, the PCB board tilts forward from the board - placing part 224 at the current station to the board - placing part 225 at the previous station. Under the action of the buffer mechanism 3, the PCB board first touches the buffer pad 321 on the second movable rod 32. The buffer pad 321 plays the role of buffering and stopping the board, avoiding the PCB board from rebounding and being scratched. After the PCB board stays on the buffer pad 321 for a delay time of 1 - 2 s, the first cylinder 33 controls the rise of the left end of the first movable rod 31, and then the second movable rod 32 connected to the right end of the first movable rod 31 moves downward. The second movable rod 32 is straightened under the action of the second cylinder 34, so that the PCB board safely lands on the carbon fiber rod 221.

[0052] Embodiment 2:

[0053] The difference between this embodiment and Embodiment 1 is as follows:

[0054] The braking mechanism 4 is arranged on the driving rod of the upper drive 231; each set of the board - placing parts 22 is provided with three carbon fiber rods 221 to enhance the placement stability.

[0055] The above shows and describes the basic principles, main features and advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above - mentioned exemplary embodiments, and without departing from the spirit or basic features of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non - restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0056] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A liftable temporary storage cooler, comprising a frame and a flap mechanism, characterized in that, The flap mechanism is arranged inside the frame. The flap mechanism includes a conveyor belt and several plate placing parts for storing PCB boards. The conveyor belt is wound around the inside of the frame up and down along the height direction of the frame. The plate placing parts move up and down inside the frame through the conveyor belt. A buffer mechanism is arranged at the top of the frame. The buffer mechanism is used to provide a buffering force for the PCB board that flips by its own weight. The frame is an airtight cavity, and an air-conditioning return air system is arranged inside the frame; The buffer mechanism includes a first movable rod and a second movable rod. The first movable rod is used to control the up and down movement of the second movable rod in the height direction of the frame. The second movable rod is rotatably connected to the side end of the first movable rod. The second movable rod is used to support the PCB board that flips by its own weight; The buffer mechanism further includes a first air cylinder, a second air cylinder and a connecting rod. The first movable rod is connected to the connecting rod through the first air cylinder. The second movable rod is rotatably connected to the first movable rod through the second air cylinder. The connecting rod is used to slidably connect the buffer mechanism with the frame; The flap mechanism further includes a driving part and a braking mechanism. The driving part includes an upper drive and a lower drive. The upper drive and the lower drive are respectively arranged at the upper and lower parts inside the conveyor belt. The braking mechanism is arranged on the driving rod of the lower drive or the driving rod of the upper drive.

2. The liftable temporary cooler according to claim 1, characterized in that, The flap mechanism is provided with at least one group of the plate placing parts; one group of the plate placing parts is provided with two or three carbon fiber rods.

3. The liftable temporary cooler according to claim 2, characterized in that, The bottom ends of the carbon fiber rods in the same group are connected through anti-slip blocks.

4. The liftable temporary cooler according to claim 1, wherein, It further includes an anti-jamming plate structure. The anti-jamming plate structure is arranged at the top end of the plate placing part. The top end of the plate placing part is fixed to the conveyor belt.

5. The liftable temporary cooler according to claim 1, wherein It further includes a transmission part. The transmission part includes a first transmission part and a second transmission part. The first transmission part is used to convey the PCB board onto the plate placing part. The second transmission part is used to convey the PCB on the plate placing part out of the frame.

6. The liftable temporary cooler according to claim 5, wherein, The first transmission part is provided with at least two first transmission rods. The plate placing parts are distributed between the two first transmission rods. The second transmission part is provided with at least two second transmission rods. The plate placing parts are distributed between the two second transmission rods.

7. A liftable temporary cooler according to claim 1, characterized in that, An air inlet for cold air is arranged at the top of the frame. The inlet temperature of the air inlet is A±B℃, where A is the average temperature inside the cavity of the frame and B is the error temperature. The temperature value range of A is 10~30℃, and the value range of B is 1~3℃.

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