An optical module

Abstract

The embodiment of the present application shows an optical module, which includes: the optical module includes: a laser chip, a second laser pin and a first laser pin and a microstrip resistor, and the microstrip resistor includes a first microstrip resistor and / or a second microstrip resistor. The laser chip, the microstrip resistor, the first laser pin, and the second laser pin form a closed power-on loop. The optical module shown in the present application connects the laser chip and the microstrip resistor in series. After the microstrip resistor is connected in series, the resistance of the corresponding power-on loop increases; the resistance increases, the corresponding quality factor decreases, the wider the corresponding passband, and the corresponding optical module has a wider application range. Further, when the sum of the impedance value of the microstrip resistor connected to the positive and negative ends of the laser chip and the impedance value of the real part of the laser chip is equal to the impedance value of the single end of the power-on loop where the laser chip is located. At this time, the laser chip can obtain the maximum output power.

Description

Technical Field

[0001] The embodiments of the present application relate to optical communication technology, and more specifically, to an optical module. Background Art

[0002] As the demand for communication bandwidth in the field of optical fiber communication becomes higher and higher, global optical communication is in a period of rapid development. In the field of high-speed data communication, in order to ensure that data can be transmitted over long distances and at high speed, optical modules are usually used in this field to realize the transmission and reception of light of different wavelengths.

[0003] Existing optical modules usually refer to integrated modules for photoelectric conversion, and optical modules are usually packaged structures. The optical module is prepared into a packaged structure to avoid the failure of optoelectronic devices due to the action of oxygen and water vapor in a non-airtight environment, wherein the optoelectronic devices include: laser chips, backlight detectors and other optoelectronic devices. At present, the common packaging form for optoelectronic devices is to package the optoelectronic devices in a package cavity formed by a tube seat and a tube cap. The specific packaging process is: first, the laser chip is mounted on the substrate surface of the base, and the laser chip is connected to the pins of the base by gold wire bonding. The pins form a power-on circuit with the laser chip and provide input signals to the laser chip as required. Then, the optoelectronic device is packaged in the package cavity formed by the tube seat and the tube cap, and finally a packaged optical module is formed.

[0004] In actual applications, due to the presence of capacitance, inductance and reactance of the laser chip in the power-on circuit, when the input signal frequency is low or high, the amplification factor of the power-on circuit will decrease. Therefore, the power-on circuit of the laser chip is only used to amplify the input signal within a certain frequency range, and the corresponding laser chip is only suitable for input signals within a certain frequency range. Summary of the invention

[0005] Based on the above technical problems, the purpose of this application is to provide an optical module.

[0006] The embodiment of the present application shows an optical module, comprising: a circuit board having a circuit and electrical components connected by the circuit;

[0007] A tube holder, used to carry components;

[0008] A support plate, carried by the tube seat;

[0009] A first laser pin, which passes through the upper and lower surfaces of the tube holder and has one end electrically connected to the circuit board;

[0010] A second laser pin, which passes through the upper and lower surfaces of the tube holder and has one end electrically connected to the circuit board;

[0011] A substrate, supported by the support plate, having a microstrip resistor on its surface;

[0012] A laser chip, wherein the positive electrode on the top surface is electrically connected to the first laser pin through the microstrip resistor, and the negative electrode on the bottom surface is electrically connected to the second laser pin;

[0013] Or the positive electrode of the top surface is electrically connected to the first laser pin, and the negative electrode of the bottom surface is electrically connected to the second laser pin through the microstrip resistor.

[0014] The embodiment of the present application shows an optical module, which includes: a tube seat for carrying a device, a circuit board, a circuit board having a circuit and an electrical component connected by the circuit, a laser chip, a second laser pin and a first laser pin and a microstrip resistor, and a substrate carried by the tube seat, with a microstrip resistor on the surface. Among them, the laser chip, the microstrip resistor, the first laser pin, and the second laser pin form a closed power-on loop. The second laser pin and the first laser pin provide electrical energy to the laser chip through the power-on loop so that the laser chip can achieve the corresponding function. In the power-on loop where the laser chip is located, due to the presence of capacitance, inductance and reactance, when the input signal frequency is low or high, the value of the power-on loop amplification factor will decrease. Therefore, the power-on loop of the laser chip is only used to amplify the input signal within a certain specific frequency range, and the corresponding laser chip is only suitable for the input signal within a certain specific frequency range. When the input signal frequency is low or high, the amplification factor value of the power-on loop will decrease, and the output information of the corresponding laser chip will be attenuated. Usually I 输出 / I 输入 To indicate the amplification factor of the signal by the energized circuit. 输出 / I 输入 The frequency range of not less than 0.707 is called the passband of the power-on circuit. In the frequency range outside the passband, the signal attenuation is serious and therefore cannot be used as the input signal of the optical module. In the power-on circuit formed by the laser chip and the microstrip resistor, the passband of the power-on circuit where the laser chip is located is inversely proportional to the quality factor Q of the power-on circuit. The smaller the quality factor, the wider the corresponding passband. The optical module shown in real time in this application connects the laser chip and the microstrip resistor in series. After the microstrip resistor is connected in series, the resistance of the corresponding power-on circuit increases; as the resistance increases, the corresponding quality factor Q decreases, the corresponding passband is wider, and the frequency applicable range of the corresponding optical module increases.

[0015] Furthermore, the sum of the impedance value of the microstrip resistor connected to the positive and negative ends of the laser chip and the impedance value of the real part of the laser chip is equal to the impedance value of a single end of the power-on loop in which the laser chip is located. At this time, the laser chip can obtain maximum output power. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the connection relationship of optical communication terminals;

[0018] Figure 2 is a schematic diagram of the structure of an optical network unit;

[0019] Figure 3 A schematic diagram of the structure of an optical module provided by an embodiment of the present invention;

[0020] Figure 4 Provides a schematic diagram of the decomposed structure of an optical module for an embodiment of the present invention;

[0021] Figure 5 A three-dimensional diagram of the connection relationship between the optical transceiver assembly and the circuit board is provided for an embodiment of the present invention;

[0022] Figure 6 A top view of the connection relationship between the optical transceiver assembly and the circuit board is provided for an embodiment of the present invention;

[0023] Figure 7 Provides a schematic diagram of the decomposed structure of a light emitting component for an embodiment of the present invention;

[0024] Figure 8 A schematic diagram of a base structure provided in an embodiment of the present invention;

[0025] Fig. 9 A schematic diagram of a base structure is provided for an embodiment of the present invention;

[0026] Fig.10 A schematic diagram of a base structure is provided for an embodiment of the present invention;

[0027] Fig.11 A schematic diagram of a base structure is provided for an embodiment of the present invention;

[0028] Fig.12 A schematic diagram of a base structure is provided for an embodiment of the present invention;

[0029] Fig.13 I is the power circuit of a laser chip 输出 / I 输入 -Frequency response curve;

[0030] Fig.14 I for laser chips and optical modules 输出 / I输入 -Frequency response curve.

[0031] Legend:

[0032] 100-optical network unit, 101-optical fiber, 102-optical module interface, 103-network cable, 104-network cable interface, 105-second circuit board, 106-cage, 107-heat sink, 200-optical module, 201-upper shell, 202-lower shell, 203-unlocking handle, 300-first circuit board, 400-optical transceiver device, 401-optical receiving submodule, 402-optical transmitting submodule, 4021-optical fiber adapter assembly, 4022-adjusting sleeve, 4023-sealed pipe body, 4024-pipe cap, 4025-base, 1-pipe seat , 2-support plate, 3-substrate, 31-first metal plate, 32-second metal plate, 33-third metal plate, 34-fourth metal plate, 4-laser chip, 5-backlight detector, 6-first microstrip resistor, 7-heat sink, 8-emitter pin, 8a-electrode pin, 8a1-first laser pin, 8a2-first backlight pin, 8a3-second backlight pin, 8a4-second laser pin, 8b-ground pin, 8c-insulating sleeve, 9-second microstrip resistor, 500-flexible circuit board, 501-first flexible circuit board, 502-second flexible circuit board. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] One of the core links of fiber-optic communication is the conversion of photoelectric signals. Fiber-optic communication uses optical signals carrying information to transmit in optical fibers / waveguides. The passive transmission characteristics of light in optical fibers can achieve low-cost and low-loss information transmission. Computers and other information processing devices use electrical signals, which requires the mutual conversion of electrical signals and optical signals during signal transmission.

[0035] Optical modules realize the above-mentioned photoelectric conversion function in the field of optical fiber communication technology. The mutual conversion between optical signals and electrical signals is the core function of optical modules. Optical modules realize electrical connection with external host computers through gold fingers on the circuit board. The main electrical connections include power supply, I2C signal, transmission data signal and grounding. The electrical connection method realized by gold fingers has become the standard method in the optical module industry. Based on this, circuit boards are an essential technical feature in most optical modules.

[0036] Figure 1 Figure 1 is a schematic diagram of the connection relationship of optical communication terminals. Figure 1 As shown, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101 and a network cable 103;

[0037] One end of the optical fiber is connected to the remote server, and one end of the network cable is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

[0038] The optical port of the optical module 200 is connected to the optical fiber 101, and a bidirectional optical signal connection is established with the optical fiber; the electrical port of the optical module 200 is connected to the optical network unit 100, and a bidirectional electrical signal connection is established with the optical network unit; the optical module realizes the mutual conversion between optical signals and electrical signals, thereby realizing the establishment of a connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input into the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of optical and electrical signals, and does not have the function of processing data. In the above-mentioned optical-electrical conversion process, the information does not change.

[0039] The optical network unit has an optical module interface 102, which is used to access the optical module and establish a bidirectional electrical signal connection with the optical module; the optical network unit has a network cable interface 104, which is used to access the network cable and establish a bidirectional electrical signal connection with the network cable; a connection is established between the optical module and the network cable through the optical network unit. Specifically, the optical network unit transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. The optical network unit acts as a host computer of the optical module to monitor the operation of the optical module.

[0040] At this point, the remote server establishes a two-way signal transmission channel with the local information processing device through optical fibers, optical modules, optical network units and network cables.

[0041] Common information processing equipment includes routers, switches, and electronic computers. The optical network unit is the host computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module. Other common optical module host computers include optical line terminals.

[0042] Figure 2 Figure 1 is a schematic diagram of the structure of an optical network unit. Figure 2 As shown, a second circuit board 105 is provided in the optical network unit 100, and a cage 106 is arranged on the surface of the second circuit board 105; an electrical connector is arranged in the cage 106 for accessing the electrical port of the optical module such as the gold finger; a heat sink 107 is arranged on the cage 106, and the heat sink 107 has a protruding structure such as fins for increasing the heat dissipation area.

[0043] The optical module 200 is inserted into the optical network unit. Specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

[0044] The cage 106 is located on the circuit board, and wraps the electrical connector on the circuit board in the cage; the optical module is inserted into the cage, and the cage fixes the optical module. The heat generated by the optical module is conducted to the cage through the optical module housing, and finally diffused through the heat sink 107 on the cage.

[0045] Figure 3 A schematic diagram of an optical module structure provided by an embodiment of the present invention, Figure 4 The present invention provides an optical module decomposition structure diagram. Figure 3 , Figure 4 As shown, the optical module 200 provided in the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a first circuit board 300 and an optical transceiver device 400;

[0046] The upper shell 201 and the lower shell 202 form a package cavity with two openings, which can be openings at both ends (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204, which is used to insert into a host computer such as an optical network unit, and the other opening is an optical port 205, which is used for external optical fiber access to connect to the internal optical fiber. Optoelectronic devices such as the first circuit board 300 and the optical transceiver device 400 are located in the package cavity.

[0047] The upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation. The upper shell and the lower shell are assembled in a combined manner to facilitate the installation of components such as circuit boards into the shell. The shell of the optical module is generally not made into an integrated structure. In this way, when assembling components such as circuit boards, the positioning components, heat dissipation and electromagnetic shielding structures cannot be installed, which is not conducive to production automation.

[0048] The unlocking handle 203 is located on the outer wall of the cavity / lower shell 202. Pulling the end of the unlocking handle can make the unlocking handle move relative to the outer wall surface. When the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer. By pulling the unlocking handle to release the engagement relationship between the optical module and the upper computer, the optical module can be pulled out of the cage of the upper computer.

[0049] See also Figure 5 , Figure 5A three-dimensional diagram of the connection relationship between the optical transceiver assembly and the circuit board provided in the present application. The optical transceiver device 400 generally includes an optical receiving submodule 401 and an optical transmitting submodule 402. Generally, the optical receiving submodule 401 is connected to the first circuit board 300 through the receiving end pin; the optical transmitting submodule 402 is connected to the first circuit board 300 through the transmitting end pin. After the optical receiving submodule 401 receives the optical signal from the corresponding optical fiber adapter, it converts the optical signal into an electrical signal, and then transmits the electrical signal to the second circuit board 105 (also referred to as the host computer) through the first circuit board 300. The second circuit board 105 performs a series of processing on the received electrical signal. After receiving the electrical signal, the optical transmitting submodule 402 converts the electrical signal into an optical signal, which is then emitted by the optical fiber adapter corresponding to the optical transmitting module, thereby realizing the conversion of the optical and electrical signals. During the signal transmission process, since the receiving end pins or the transmitting end pins are exposed to the air, serious impedance mismatch will be caused. Based on the above problem, the technical solution shown in the embodiment of the present application is that the optical receiving submodule 401 and the optical transmitting submodule 402 can be connected to the first circuit board 300 through a flexible circuit board 500.

[0050] Figure 6 FIG. 1 is a top view of the connection relationship between the optical transceiver assembly and the circuit board in a feasible embodiment. Figure 6 In the illustrated embodiment, the light receiving submodule 401 is connected to the first circuit board 300 via a first flexible circuit board 501, and the light transmitting submodule 402 is connected to the first circuit board 300 via a second flexible circuit board 502. Figure 6 In the illustrated embodiment, the optical receiving submodule 401 and the optical transmitting submodule 402 are respectively connected to the first circuit board via flexible circuit boards. This connection method effectively avoids problems such as serious impedance mismatch caused by long pins exposed in the air, resulting in signal distortion.

[0051] The light emitting submodule 402 is provided with optoelectronic devices such as laser chips, backlight detectors, etc. In order to avoid the failure of the optoelectronic devices due to the effects of oxygen and water vapor in a non-airtight environment, the light emitting submodule 402 is usually prepared into a packaging structure. Figure 7 The exploded schematic diagram of the light emitting submodule of the packaging structure shows that the light emitting submodule 402 includes: a fiber adapter assembly 4021, an adjustment sleeve 4022, a sealing tube body 4023, a tube cap 4024, and a base 4025.

[0052] The structure of the base 4025 can be found in Figure 8 The base 4025 includes: a tube base 1, a support plate 2, a substrate 3, an optoelectronic device and a plurality of pins 8. The tube base 1 is vertically arranged with the support plate 2. One surface of the support plate 2 is fixedly connected with one surface of the substrate 3, and the other surface of the substrate 3 is used to encapsulate the optoelectronic device. Figure 8 The optoelectronic device packaged on the optoelectronic device substrate is a laser chip. In actual application, the optoelectronic device can also be a light receiving chip. Figure 8 The laser chip is connected to the pins by gold wire bonding, and the pins are used to realize the electrical connection between the laser chip and the outside.

[0053] The substrate 3 sealed by the tube cap 4024 and the base 4025 is packaged into a sealed cavity for carrying the substrate 3 and the laser chip. The tube cap 4024 is connected to the optical fiber adapter assembly 4021 by using a sealing welding tube body 4023. Optionally, an adjustment sleeve 4022 can be provided between the sealing welding tube body 4023 and the optical fiber adapter assembly 4021, and the adjustment sleeve 4022 is used to adjust the position of the optical fiber adapter assembly 4021.

[0054] In actual applications, since the frequency band curve of the laser chip itself may resonate in a certain frequency range, the problem of insufficient bandwidth may occur when the laser chip operates in the corresponding frequency range.

[0055] Based on the above technical problems, the structure of the base 4025 provided in the embodiment of the present application can be referred to Figure 9-11 . The base 4025 includes: a tube seat 1, a support plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a transmitting end pin 8, a first microstrip resistor 6 and / or a second microstrip resistor. The tube seat 1 is arranged vertically with the support plate 2; the support plate 2 has a first bonding surface (not marked in the figure); the substrate 3 has a second bonding surface (not marked in the figure) and a first packaging surface (not marked in the figure) arranged opposite to each other, and the second bonding surface is attached to the first bonding surface; the cathode of the laser chip 4 is packaged on the first packaging surface (not marked in the figure); the backlight detector 5 is attached to the surface of the tube seat 1, and the light receiving surface of the backlight detector 5 faces the rear light emitting surface of the laser chip 4.

[0056] The microstrip resistor is a strip resistor with a rectangular surface. The two opposite sides of the rectangle are the access electrodes of the microstrip resistor, and the length of the access electrode represents the width of the microstrip resistor.

[0057] The tube base 1 can be made of tungsten copper, copper, silver alloy, gold or ceramic or other materials with good thermal conductivity. The tube base 1 is roughly cylindrical, and has a circular bearing surface and a bottom surface opposite to the bearing surface.

[0058] One of the plurality of pins 8 is a ground pin 8b; the rest are electrode pins 8a. The ground pin 8b is disposed on a surface (bottom surface) opposite to the tube holder 1; the electrode pin 8a penetrates the tube holder 1. If the tube holder 1 is made of metal, the tube holder 1 and the electrode pin 8a are connected via a glass material insulating sleeve 8c to achieve electrical isolation between the tube holder 1 and the electrode pin 8a.

[0059] The support plate 2 can be made of tungsten copper, copper, silver alloy, gold or ceramic or other materials with good thermal conductivity. Preferably, the support plate 2 is made of tungsten copper. The support plate 2 runs through the bearing surface and the bottom surface of the tube seat 1. The support plate 2 and the tube seat 1 can be integrally formed or separately provided. The support plate 2 is roughly a column, specifically, a quadrangular prism or a semi-cylinder. In the process of practical application, any column structure that can play the role of supporting the substrate 3 can be used as the support plate 2. The support plate 2 is arranged on one side of the center of the tube seat 1, and the support plate 2 has a first bonding surface perpendicular to the bearing surface, and the first bonding surface is parallel to the central axis of the tube seat 1.

[0060] In the embodiment of the present application, the substrate 3 may be a ceramic substrate 3 with good thermal conductivity. The material of the ceramic substrate 3 may be aluminum nitride or aluminum oxide, etc. The substrate 3 has a second bonding surface and a first packaging surface that are relatively arranged, the second bonding surface is used to bond with the first bonding surface of the support plate 2, and the first packaging surface is used to mount the laser chip 4. In the embodiment of the present application, the substrate 3 is bonded to the support plate 2. On the one hand, the support plate 2 can play a role in supporting the substrate 3. On the other hand, the heat generated during the operation of the optoelectronic device can be transferred to the support plate 2 through the substrate 3 to achieve the effect of increasing the heat dissipation surface, keeping the temperature of the substrate 3 basically constant, so that the temperature of the optoelectronic device packaged in the substrate 3 is basically constant.

[0061] The laser chip 4 is packaged on the first packaging surface of the substrate 3. The laser chip 4 can be fixed to the first packaging surface of the substrate 3 by solder or conductive glue. The laser chip 4 mainly includes a semiconductor laser diode, which is used to emit laser.

[0062] The backlight detector 5 is packaged on the bearing surface of the tube holder 1, and the light receiving surface of the backlight detector 5 is opposite to the rear light emitting surface of the semiconductor laser diode. The backlight detector 5 can be a side-illuminated InGaAs / InP detector or a front-illuminated InGaAs / InP detector. The backlight detector 5 is used to sense the power of the laser emitted by the semiconductor laser diode, so that the magnitude of the current applied to the semiconductor laser diode can be controlled according to the detection result of the backlight detector 5.

[0063] In a feasible embodiment, the backlight detector 5 is connected to the bearing surface of the tube base 1 through the heat sink 7. Fig. 9 , the light emission submodule 402 also includes a heat sink 7 for supporting the backlight detector 5; the heat sink 7 has a third bonding surface (not marked in the figure) and a second packaging surface (not marked in the figure); the second packaging surface is tilted relative to the third bonding surface; the third bonding surface is mounted on the bearing surface, and the cathode of the backlight detector 5 is packaged on the second packaging surface. On the one hand, the heat sink 7 dissipates the heat of the backlight detector 5 mounted thereon, so that the temperature of the backlight detector 5 is kept constant. On the other hand, the second packaging surface of the heat sink 7 is tilted relative to the third bonding surface to reduce the influence of reflected light on the semiconductor laser diode.

[0064] In this embodiment, the tube cap 4024 is used to cooperate with the base 4025 to seal the bearing surface of the tube seat 1 and the optoelectronic devices installed on the substrate 3. The shape of the tube cap 4024 corresponds to the shape of the tube seat 1. The tube cap 4024 is tightly combined with the bearing surface of the tube seat 1 to seal the bearing surface and the optoelectronic devices installed on the substrate 3. An optical window is formed at one end of the tube cap 4024 away from the bearing surface, and the optical window is used to transmit the signal light emitted by the laser chip 4. The tube cap 4024 can be a flat window tube cap 4024, or a tube cap 4024 with a spherical lens or a non-spherical lens. Different types of tube caps 4024 are selected according to different coupling optical paths and usage requirements.

[0065] Among them, the first microstrip resistor 6 and / or the second microstrip resistor 9 are connected in series to the laser chip, the first laser pin 8a1, and the second laser pin 8a4 to form a power-on circuit. The connection relationship of the first microstrip resistor 6 and / or the second microstrip resistor 9 is described in detail below in conjunction with specific embodiments.

[0066] Embodiment 1:

[0067] Fig. 9 FIG. 4 is a schematic diagram of the structure of the base 4025 shown in a preferred embodiment. Fig. 9 The base 4025 is shown to include: a tube seat 1, a support plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a first microstrip resistor 6, a heat sink 7 and 5 pins 8, one of which is a ground pin 8b; the rest are electrode pins 8a. The electrode pins 8a are respectively a first laser pin 8a1, a first backlight pin 8a2, a second backlight pin 8a3, and a second laser pin 8a4. The first packaging surface of the substrate 3 has a first metal plate 31, a second metal plate 32 and a fourth metal plate 34 that are isolated from each other.

[0068] The ground pin 8b is disposed on the bottom surface of the tube holder 1 and is electrically connected to the tube holder 1. The ground pin 8b is electrically connected to the tube holder 1 to play a protective role.

[0069] Among them, the negative electrode of the laser chip 4 is fixed to one end of the first metal plate 31 by solder or conductive glue, and the other end of the first metal plate 31 is fitted with the second laser pin 8a4; the electrical connection between the negative electrode of the laser chip 4 and the second laser pin 8a4 is realized through the first metal plate 31; the positive electrode of the laser chip 4 is electrically connected to one end of the second metal plate 32 through at least one gold wire, the other end of the second metal plate 32 is electrically connected to one end of the first microstrip resistor 6, the other end of the first microstrip resistor 6 is electrically connected to one end of the fourth metal plate 34, and the other end of the fourth metal plate 34 is fitted with the first laser pin 8a1, and the electrical connection between the positive electrode of the laser chip 4, the first microstrip resistor 6 and the first laser pin 8a1 is realized through the second metal plate 32 and the fourth metal plate 34.

[0070] Fig. 9 The microstrip resistor shown is rectangular, and the two long sides are used for conductive connection with the metal plate, and the length of the long sides is the width of the microstrip resistor. The side of the metal plate connected to the microstrip resistor, its side length represents the width of the metal plate.

[0071] In a feasible embodiment, the first microstrip resistor 6, the second metal plate 32, and the fourth metal plate 34 are of equal width, that is, the side of the second metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor, and the side of the fourth metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor. The second metal plate, the first microstrip resistor and the fourth metal plate are electrically connected, and current flows among the three. The equal width ensures that the conduction width in the current path does not change, and the current can enter the microstrip resistor from the entire side of the microstrip resistor, which is beneficial to reduce current attenuation.

[0072] The rear light emitting surface of the laser chip 4 faces the light receiving surface of the backlight detector 5, and the backlight detector 5 is fixed to the carrying surface through the heat sink 7. Specifically, the heat sink 7 has a third bonding surface and a second packaging surface; the second packaging surface is inclined relative to the third bonding surface; the third bonding surface is mounted on the carrying surface, the cathode of the backlight detector 5 is mounted on the second packaging surface, and the second packaging surface is connected to the second backlight pin 8a3 through at least one gold wire; the cathode of the backlight detector 5 can be connected to the second backlight pin 8a3 through the second packaging surface. The anode of the backlight detector 5 is connected to the first backlight pin 8a2 through at least one gold wire.

[0073] Through the above connection method, the radio frequency signal and the electrical signal can be transmitted to the electronic components inside the optical transmission component through the pins to realize the function of the optical transmission component. At the same time, through the positive electrode of the laser chip 4 and the first microstrip resistor 6, the optical module has good high-frequency performance.

[0074] Embodiment 2:

[0075] Fig.10 FIG. 4 is a schematic diagram of the structure of the base 4025 shown in a preferred embodiment. Fig.10 The base 4025 is shown to include: a tube seat 1, a support plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a second microstrip resistor 9, a heat sink 7 and 5 pins 8, one of which is a ground pin 8b; the rest are electrode pins 8a. The electrode pins 8a are respectively a first laser pin 8a1, a first backlight pin 8a2, a second backlight pin 8a3, and a second laser pin 8a4. The first packaging surface of the substrate 3 has a first metal plate 31, a second metal plate 32 and a third metal plate 33 that are isolated from each other.

[0076] The ground pin 8b is disposed on the bottom surface of the tube holder 1 and is electrically connected to the tube holder 1. The ground pin 8b is electrically connected to the tube holder to play a protective role.

[0077] The cathode of the laser chip 4 is attached to one end of the first metal plate 31, the other end of the first metal plate 31 is electrically connected to one end of the second microstrip resistor 9, the other end of the second microstrip resistor 9 is electrically connected to one end of the third metal plate 33, the other end of the third metal plate 33 is attached to the second laser pin 8a4, and the cathode of the laser chip 4, the second microstrip resistor 9 and the second laser pin 8a4 are electrically connected through the first metal plate 31 and the third metal plate 33;

[0078] The positive electrode of the laser chip 4 is electrically connected to one end of the second metal plate 32 through at least one gold wire, and the other end of the second metal plate 32 is bonded to the first laser pin 8a1, so that the electrical connection between the positive electrode of the laser chip 4 and the first laser pin 8a1 is achieved through the second metal plate 32.

[0079] In a feasible embodiment, the second microstrip resistor 9, the first metal plate 31, and the third metal plate 33 are of equal width, that is, the side of the first metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor, and the side of the third metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor. The first metal plate, the first microstrip resistor and the third metal plate are electrically connected, and current flows among the three. The equal width ensures that the conduction width in the current path does not change, and the current can enter the microstrip resistor from the entire side of the microstrip resistor, which is beneficial to reduce current attenuation.

[0080] The rear light emitting surface of the laser chip 4 faces the light receiving surface of the backlight detector 5, and the backlight detector 5 is fixed to the carrying surface through the heat sink 7. Specifically, the heat sink 7 has a third bonding surface (not shown in the figure) and a second packaging surface; the second packaging surface is tilted relative to the third bonding surface; the third bonding surface is mounted on the carrying surface, the cathode of the backlight detector 5 is mounted on the second packaging surface, and the second packaging surface is connected to the second backlight 8a3 through at least one gold wire; the cathode of the backlight detector 5 can be connected to the second backlight pin 8a3 through the second packaging surface. The anode of the backlight detector 5 is connected to the first backlight pin 8a2 through at least one gold wire.

[0081] Through the above connection method, the radio frequency signal and the electrical signal can be transmitted to the electronic components inside the optical transmission component through the pins to realize the function of the optical transmission component. At the same time, through the negative electrode of the laser chip 4 and the second microstrip resistor 9, the optical module has better high-frequency performance.

[0082] Embodiment 3:

[0083] Fig.11 and Fig.12 FIG. 4 is a schematic diagram of the structure of the base 4025 shown in a preferred embodiment. Fig.11 and 12 The base 4025 is shown to include: a tube seat 1, a support plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a first microstrip resistor 6, a second microstrip resistor 9, a heat sink 7 and 5 pins 8, one of which is a ground pin 8b; the rest are electrode pins 8a. The electrode pins 8a are respectively a first laser pin 8a1, a first backlight pin 8a2, a second backlight pin 8a3, and a second laser pin 8a4. The first packaging surface of the substrate 3 has a first metal plate 31, a second metal plate 32, a third metal plate 33 and a fourth metal plate 34 that are isolated from each other.

[0084] The grounding pin 8b is disposed on the bottom surface of the tube holder 1 of the carrier board and is electrically connected to the tube holder 1. The grounding pin 8b is electrically connected to the tube holder to play a protective role.

[0085] The cathode of the laser chip 4 is attached to one end of the first metal plate 31, the other end of the first metal plate 31 is electrically connected to one end of the second microstrip resistor 9, the other end of the second microstrip resistor 9 is electrically connected to one end of the third metal plate 33, the other end of the third metal plate 33 is attached to the second laser pin 8a4, and the cathode of the laser chip 4, the second microstrip resistor and the second laser pin 8a4 are electrically connected through the first metal plate 31 and the third metal plate 33;

[0086] The positive electrode of the laser chip 4 is electrically connected to one end of the second metal plate 32 through at least one gold wire, the other end of the second metal plate 32 is electrically connected to one end of the first microstrip resistor 6, the other end of the first microstrip resistor 6 is electrically connected to one end of the fourth metal plate 34, and the other end of the fourth metal plate 34 is arranged in contact with the first laser pin 8a1. Through the second metal plate 32 and the fourth metal plate 34, the positive electrode of the laser chip 4, the first microstrip resistor and the first laser pin 8a1 are electrically connected.

[0087] In a feasible embodiment, the second microstrip resistor 9, the width of the first metal plate 31, and the third metal plate 33 are of equal width; the first microstrip resistor 6, the width of the second metal plate 32, and the fourth metal plate 34 are of equal width, that is, the side of the second metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor, and the side of the fourth metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor; that is, the side of the first metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor, and the side of the third metal plate connected to the first microstrip resistor has the same length as the first microstrip resistor, and the first metal plate, the first microstrip resistor and the third metal plate are electrically connected; the second metal plate, the first microstrip resistor and the fourth metal plate are electrically connected, and the equal widths ensure that the conduction width in the current path does not change, and the current can enter the microstrip resistor from the entire side of the microstrip resistor, which is beneficial to reducing current attenuation.

[0088] The rear light emitting surface of the laser chip 4 faces the light receiving surface of the backlight detector 5, and the backlight detector 5 is fixed to the carrying surface through the heat sink 7. Specifically, the heat sink 7 has a third bonding surface and a second packaging surface; the second packaging surface is inclined relative to the third bonding surface; the third bonding surface is mounted on the carrying surface, the cathode of the backlight detector 5 is mounted on the second packaging surface, and the second packaging surface is connected to the second backlight pin 8a3 through at least one gold wire; the cathode of the backlight detector 5 can be connected to the second backlight pin 8a3 through the second packaging surface. The anode of the backlight detector 5 is connected to the first backlight pin 8a2 through at least one gold wire.

[0089] Through the above connection method, the radio frequency signal and the electrical signal can be transmitted to each electronic component inside the optical transmission component through each pin to realize the function of the optical transmission component. At the same time, through the negative electrode of the laser chip 4 and the second microstrip resistor 9, the positive electrode of the laser chip 4 and the first microstrip resistor 6, the optical module has better high-frequency performance.

[0090] Optionally, the sum of the impedance value of the microstrip resistor connected to the positive and negative ends of the laser chip 4 and the impedance value of the real part of the laser chip 4 is equal to the impedance value of a single end of the power-on loop where the laser chip 4 is located.

[0091] Connecting the laser chip 4 in series with the microstrip resistor can increase the quality factor of the power circuit in which the laser chip 4 is located, and the corresponding passband range of the power circuit is increased, thereby achieving the purpose of improving the optical module and expanding the applicable frequency of the optical module.

[0092] Specifically, in the technical solution shown in the embodiment of the present application, during the packaging of the optical module, the laser chip is connected in series with the microstrip resistor. The laser chip (the laser chip has capacitance and reactance) and the microstrip resistor form an RLC (resistance-reactance-capacitance) power-on circuit. The power-on circuit has the ability to amplify input signals of different frequencies. However, due to the presence of capacitance, inductance and reactance in the power-on circuit, when the input signal frequency is low or high, the value of the amplification factor will decrease, and the value of the amplification factor can be expressed by the output current I 输出 With input current I 输入 For example, using a fixed I 输入 The electrical signal excites the laser chip, gradually changes the frequency of the electrical signal during the experiment, and records the I 输出 Then, based on I 输出 with I 输入 The current gain (I 输出 / I 输入 ). Finally, based on I 输出 / I输入 The corresponding relationship with the input electrical signal frequency is constructed 输出 / I 输入 -Frequency response curve. Fig.13 I is the power circuit of a laser chip 输出 / I 输入 -Frequency response curve. Fig.13 It can be seen from the figure that when the input signal frequency is low or high, the amplification factor of the energized circuit will decrease. 输出 / I 输入 The frequency range in which the ratio is not less than 0.707 is called the passband of the energized circuit and is represented by BW (transmission bands). Fig.13 The frequency range corresponding to (a~b) GHz is called the passband. In the frequency range outside the passband, the signal attenuation is serious and therefore cannot be used as the input signal of the optical module.

[0093] It is known that the passband of the power-on circuit in which the laser chip is located is inversely proportional to the quality factor Q of the power-on circuit. The smaller the quality factor, the wider the corresponding passband.

[0094] In an energized circuit:

[0095]

[0096] Where Q is the quality factor, L is the reactance in the power circuit, C is the capacitance in the power circuit, and R is the total resistance in the power circuit. In the power circuit, L and C are constant, so Q is determined by the total resistance in the power circuit. The larger the total resistance, the smaller the corresponding quality factor and the wider the corresponding passband. Accordingly, the larger the total resistance of the power circuit is encapsulated in the optical module, the wider the applicable frequency range of the optical module.

[0097] The following is a description of the frequency of the optical module shown in the embodiment of the present application, in combination with specific experimental data. A separate laser chip power circuit (the power circuit where the laser chip is located in the optical module shown in the prior art) and a laser chip power circuit connected to a microstrip resistor (the power circuit where the laser chip is located in the optical module shown in the embodiment of the present application) I 输出 / I 输入 -Frequency response curve Response curve comparison chart can be found in Fig.14 . Fig.14 The dotted line is the I of the power circuit of the individual laser chip. 输出 / I 输入 -Frequency response curve, the solid line is the I of the laser chip power circuit connected to the microstrip resistor 输出 / I 输入-Frequency response curve. It can be seen that the passband of the power-on circuit of the single laser chip is (a~b) GHz, and the passband of the power-on circuit of the laser chip connected to the microstrip resistor is (a1~b1) GHz; (a1~b1) GHz and (a~b) GHz obviously increase the frequency range of the input signal, which can prove that the applicable frequency range of the optical module shown in the embodiment of the present application is increased.

[0098] In the process of visible light module packaging, connecting the laser chip in series with a microstrip resistor can correspondingly improve the passband of the optical module product. Moreover, within a certain range, the larger the series resistor, the smaller the corresponding quality factor and the wider the corresponding passband. However, it does not mean that the larger the resistance of the series resistor, the better the performance of the corresponding optical module.

[0099] Generally, the performance of an optical module can be measured by the output power of the laser chip. Under the condition of constant input power, the greater the output power of the laser chip, the better the response performance of the corresponding optical module. Therefore, in the actual application of the optical module, under the condition of the same excitation signal, it is hoped that the laser chip has a larger output power. The output power of the laser chip is related to the impedance value of the microstrip resistor in the power-on circuit where the laser chip is located. When the impedance value of the microstrip resistor plus the impedance value of the real part of the laser chip is equal to the impedance value of the single end of the power-on circuit where the laser chip is located, the output power of the laser machine can reach the maximum.

[0100] Specifically, since the voltage source in the actual power-on circuit always has internal resistance, we can make an actual voltage source equivalent to a model of an ideal voltage source connected in series with a microstrip resistor r1. Connect the laser chip to the above circuit, then the impedance value of the single end of the power-on circuit where the laser chip is located is r2, where r2=0.5r1. Assuming that the impedance value of the laser chip is R1, the impedance value of the connected microstrip resistor is R2, and the load microstrip resistor in the circuit is R3, then R3=R1+R2. In the above circuit, the electromotive force of the voltage source is U, and the single-ended internal resistance is r2. It can be calculated that the current flowing through the laser chip is: I=U / (R3+r2). It can be seen that the smaller the load microstrip resistor R3, the greater the output current. Calculate the output power of the microstrip resistor R3 (the laser chip and microstrip resistor can be considered as a whole):

[0101] P=I*I*R3=[U / (R3+r2)]*[U / (R3+r2)]*R3;

[0102] =U*U*R3 / (R3*R3+2*R3*r2+r2*r2)=U*U*R3 / [(R3-r2)*(R3-r2)+4*R3*r2];

[0103] =U*U / {[(R3-r2)*(R3-r2) / R3]+4*r2}.

[0104] For a given signal source, its internal resistance r is fixed, and the real impedance value of the laser chip is also fixed. It can be seen from the output power calculation formula that when R3=r2, that is, the impedance value of the microstrip resistor plus the real impedance value of the laser chip is equal to the impedance value of the single end of the power-on circuit where the laser chip is located, the laser chip can obtain the maximum output power.

[0105] The embodiment of the present application shows an optical module, which includes: a support plate, a laser chip, a microstrip resistor, a ground pin, a second laser pin and a first laser pin. The negative electrode of the laser chip is electrically connected to the second laser pin, the positive electrode of the laser chip is electrically connected to one end of the microstrip resistor, and the other end of the microstrip resistor is electrically connected to the first laser pin; through the above connection method, the laser chip, the microstrip resistor, the first laser pin, and the second laser pin form a closed power-on loop. The optical module shown in the present application connects the laser chip and the microstrip resistor in series. After the microstrip resistor is connected in series, the resistance of the corresponding power-on loop increases; as the resistance increases, the corresponding quality factor Q decreases, the corresponding passband is wider, and the application range of the corresponding optical module increases.

[0106] Furthermore, the impedance value of the connected microstrip resistor will affect the output power of the laser chip. Usually, the impedance value of the microstrip resistor plus the real impedance value of the laser chip is equal to the impedance value of the single end of the power-on circuit in which the laser chip is located. At this time, the laser chip can obtain the maximum output power.

[0107] It should be understood that the terms "first", "second", "third", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, for example, they can be implemented according to an order other than those given in the diagrams or descriptions of the embodiments of this application.

[0108] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board having a circuit and electrical components connected by the circuit; A tube holder, used to carry components; A first laser pin, which passes through the upper and lower surfaces of the tube holder and has one end electrically connected to the circuit board; A second laser pin, which passes through the upper and lower surfaces of the tube holder and has one end electrically connected to the circuit board; A substrate, supported by the tube holder, having a first metal plate, a second metal plate, a third metal plate and a fourth metal plate insulated from each other on the surface; The first metal plate is connected to the third metal plate via a second microstrip resistor, and the second metal plate is connected to the fourth metal plate via a first microstrip resistor; The third metal plate is electrically connected to the second laser pin, and the fourth metal plate is electrically connected to the first laser pin; The laser chip has a positive electrode on the top surface electrically connected to the second metal plate through wire bonding, and a negative electrode on the bottom surface is arranged on the surface of the first metal plate to achieve electrical connection; the second microstrip resistor, the first metal plate and the third metal plate have the same width; The first microstrip resistor, the second metal plate and the fourth metal plate have the same width.

2. The optical module according to claim 1, characterized in that: The sum of the impedance value of the microstrip resistor connected to the positive and negative ends of the laser chip and the impedance value of the real part of the laser chip is equal to the impedance value of a single end of the power-on loop where the laser chip is located.

3. The optical module according to claim 1, characterized in that: The second microstrip resistor, the first metal plate and the third metal plate have the same width; The first microstrip resistor, the second metal plate and the fourth metal plate have the same width.

4. The optical module according to claim 1, characterized in that: The first microstrip resistor, the second metal plate and the fourth metal plate have the same width.

5. The optical module according to claim 1, characterized in that: The second microstrip resistor, the first metal plate and the third metal plate have the same width.

6. The optical module according to claim 1, characterized in that: Also includes: Backlight detector; The backlight detector is arranged on the bearing surface of the tube seat, and the light receiving surface of the backlight detector faces the rear light emitting surface of the laser chip.

7. The optical module according to claim 6, characterized in that: Also includes: a heat sink for supporting the backlit detector; The backlight detector is arranged on the bearing surface of the tube holder through the heat sink; The heat sink has a third bonding surface and a second packaging surface; the second packaging surface is inclined relative to the third bonding surface; The third bonding surface is bonded to the bearing surface of the tube seat; The negative electrode of the backlight detector is mounted on the second packaging surface.

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