Method for manufacturing light emitting device and light emitting device

Abstract

Provided is a light-emitting device that does not require a wiring substrate having wiring corresponding to the arrangement of a plurality of light-emitting elements. A method for manufacturing the light-emitting device includes: a groove forming step of forming a first groove spanning the first resin and the third resin, a second groove spanning the second resin and the third resin, and a third groove including a portion extending between the first groove and the second groove by removing a portion of a first resin having a first light-emitting structure having a first light-emitting element and a first resin, a portion of a second resin having a second light-emitting structure having a second light-emitting element and a second resin, and a portion of a third resin of a circuit element having a conductor portion covered by the third resin; a step of forming a first wiring including a plurality of independent portions by filling the first groove and the second groove with a first conductive material; and a step of forming a second wiring electrically separated from the first wiring by filling the third groove with a second conductive material.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light emitting device and a light emitting device. Background Art

[0002] Semiconductor light emitting elements represented by LEDs are widely used as light sources for lighting, etc. For example, a plurality of light emitting elements are arranged on a wiring substrate, etc., and these light emitting elements are electrically connected via wiring provided on the wiring substrate, thereby realizing a linear light source (see, for example, (Japanese) Patent Document 1).

[0003] Patent Document 1: (Japanese) Patent Publication No. 2016-110705 Summary of the invention

[0004] Technical problem to be solved by the invention

[0005] However, in the structure of a light source including a plurality of light emitting elements, wiring for connecting the plurality of light emitting elements to each other is provided on the wiring substrate side, and a wiring substrate having wiring corresponding to the arrangement is required for each column of the arrangement of the plurality of light emitting elements.

[0006] In a method for manufacturing a light emitting device according to an embodiment of the present disclosure, the method includes:

[0007] A groove forming step, which is a step of removing a portion of the first resin having a first light emitting element including a first electrode and a first resin covering the first electrode, a portion of the second resin having a second light emitting element including a second electrode and a second resin covering the second electrode, and a portion of the third resin of a circuit element having a conductor portion covered by the third resin, thereby forming a first groove spanning the first resin and the third resin, a second groove spanning the second resin and the third resin, and a third groove including a portion extending between the first groove and the second groove when viewed from above, wherein at least a portion of the first electrode and a portion of the conductor portion of the circuit element are exposed inside the first groove, at least a portion of the second electrode and another portion of the conductor portion of the circuit element are exposed inside the second groove, and the third groove is a groove formed in the third resin; a first wiring forming step, which is a step of forming a first wiring including a plurality of independent portions by filling the first groove and the second groove with a first conductive material; and a second wiring forming step, which is a step of forming a second wiring electrically separated from the first wiring by filling the third groove with a second conductive material.

[0008] A light emitting device according to another embodiment of the present disclosure comprises:

[0009] A first light-emitting element comprising a first electrode of a first polarity and a second electrode of a second polarity different from the first polarity;

[0010] A circuit element comprising a body portion, and a first terminal and a second terminal electrically connected to each other via the body portion;

[0011] a first wiring of the first polarity connecting the first electrode of the first light emitting element and the first terminal of the circuit element;

[0012] The second wiring of the second polarity is located in the same layer as the first wiring and includes a portion extending between the first terminal and the second terminal of the circuit element in a plan view;

[0013] The main body of the circuit element is arranged at a position spaced apart from an interface between the first wiring and the first electrode of the first light emitting element on a side opposite to the first wiring.

[0014] Effects of the Invention

[0015] According to at least any one of the embodiments of the present disclosure, it is not necessary to prepare a wiring substrate having wiring corresponding to the arrangement for each column of the arrangement of the plurality of light emitting elements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic perspective view showing an example of the appearance of a light emitting device according to an embodiment of the present disclosure as viewed from the bottom surface side.

[0017] Figure 2 It is a schematic representation of Figure 1 The light emitting device 200 shown is a cross-sectional view when the light emitting device 200 is cut perpendicularly to the ZX plane near the center of the light emitting device 200 .

[0018] Figure 3 is a flowchart showing an exemplary method for manufacturing a light emitting device according to another embodiment of the present disclosure.

[0019] Figure 4 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0020] Figure 5 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0021] Figure 6 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0022] Figure 7 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0023] Figure 8 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0024] Fig. 9 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing a light emitting device.

[0025] Fig.10 This is a schematic cross-sectional view for explaining a first modified example of the method for manufacturing a light emitting device.

[0026] Fig.11 This is a schematic cross-sectional view for explaining a first modified example of the method for manufacturing a light emitting device.

[0027] Fig.12 This is a schematic cross-sectional view for explaining a first modified example of the method for manufacturing a light emitting device.

[0028] Fig.13 is through Figure 10 to Figure 12 Schematic cross-sectional view of a light emitting device 200B obtained by the manufacturing method shown.

[0029] Fig.14 This is a schematic cross-sectional view for explaining a second modified example of the method for manufacturing a light emitting device.

[0030] Fig.15 This is a schematic cross-sectional view for explaining a second modified example of the method for manufacturing a light emitting device.

[0031] Fig.16 This is a schematic cross-sectional view for explaining a second modified example of the method for manufacturing a light emitting device.

[0032] Fig.17 is through Figure 14 to Figure 16 Schematic cross-sectional view of a light emitting device 200C obtained by the manufacturing method shown.

[0033] Fig.18 This is a schematic cross-sectional view showing an example of a jumper chip as a jumper element that can be applied to the embodiment of the present disclosure.

[0034] Fig.19 This is a schematic cross-sectional view for explaining a third modified example of the method for manufacturing a light emitting device.

[0035] Fig. 20 This is a schematic cross-sectional view for explaining a third modified example of the method for manufacturing a light emitting device.

[0036] Fig.21FIG. 2 shows another example of a jumper member that can be used as a jumper element and is disposed between light emitting structures.

[0037] Fig. 22 This is a schematic cross-sectional view for explaining a fourth modified example of the method for manufacturing a light emitting device.

[0038] Fig.23 This is a schematic cross-sectional view for explaining a fourth modified example of the method for manufacturing a light emitting device.

[0039] Fig.24 This is a schematic cross-sectional view for explaining a fourth modified example of the method for manufacturing a light emitting device.

[0040] Description of Reference Numerals

[0041] 20 conductive paste; 26 conductive layer; 27 conductor portion; 28 insulating portion; 100A first light emitting structure; 100B second light emitting structure; 110A first light emitting element; 110B second light emitting element; 111A first electrode of the first light emitting element; 111B first electrode of the second light emitting element; 112A second electrode of the first light emitting element; 112B second electrode of the second light emitting element; 120 covering portion; 130A first protective member; 130B second protective member; 160A, 160B reflective resin member; 200, 200B, 200C light emitting device; 210 first Wiring; 211 the first part of the first wiring; 212 the second part of the first wiring; 220 the second wiring; 220c the intersection of the second wiring; 250: jumper element; 250A, 250B, 250D jumper component; 251A, 251C, 251D first terminal; 251B first via hole; 252A, 252C, 252D second terminal; 252B second via hole; 255A, 255B, 255D the main body of the jumper component; 260A~260C reflective resin component; 500 laser etching device; G1 first groove; G2 second groove; G3 third groove. DETAILED DESCRIPTION

[0042] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following embodiments are merely illustrative, and the light-emitting device and the manufacturing method thereof of the present disclosure are not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, the order of the steps, etc. shown in the following embodiments are merely examples, and various modifications can be implemented as long as there is no technical contradiction.

[0043] The dimensions and shapes of the components shown in the drawings may be exaggerated for ease of understanding, and may not reflect the dimensions and shapes of actual light-emitting devices and manufacturing devices, and the size relationships between the components. In addition, in order to avoid making the drawings too complicated, some elements may be omitted.

[0044] In the following description, for components having substantially the same function, there are cases where the description is omitted by indicating them with common reference numerals. In the following description, there are cases where terms indicating specific directions or positions (for example, "up", "down", "left", "right" and other terms containing these terms) are used. However, these terms are only to make the relative directions or positions in the referenced drawings easy to understand. As long as the relationship between the relative directions or positions indicated by the terms such as "up" and "down" in the referenced drawings is the same, the drawings, actual products, manufacturing devices, etc. outside the present disclosure may not be configured in the same manner as the referenced drawings. In the present disclosure, as long as it is not specifically mentioned, "parallel" includes two straight lines, two sides, two faces, etc. in the range of 0°±5°. In addition, in the present disclosure, "vertical" or "orthogonal" includes two straight lines, two sides, two faces, etc. in the range of 90°±5°, as long as it is not specifically mentioned.

[0045] (Embodiment of Light Emitting Device)

[0046] Figure 1 Detailed Description of the Invention An exemplary light emitting device according to an embodiment of the present disclosure is shown. Figure 1 The light emitting device 200 shown in the figure includes a first light emitting structure 100A including a first light emitting element, a second light emitting structure 100B including a second light emitting element, and a cover 120 covering these light emitting structures. Figure 1 In FIG. 2 , the light emitting device 200 is depicted in a state where the lower surface 200 b faces upward. Figure 1 Arrows indicating the X direction, Y direction, and Z direction that are orthogonal to each other are also shown. Figure 1 In the illustrated structure, the first light emitting structure 100A and the second light emitting structure 100B are arranged along Figure 1 The light emitting device 200 is configured in the X direction in the figure, and the light emitting device 200 as a whole has a rectangular parallelepiped shape that is longer in the X direction than in the Y direction. Here, the long side of the rectangular shape of the lower surface 200b of the light emitting device 200 is parallel to the X direction of the figure, and the short side of the rectangular shape is parallel to the Y direction of the figure. Later, in other figures of the present disclosure, arrows indicating the X direction, the Y direction, and the Z direction are also shown.

[0047] As described later, the cover 120 is formed of a light-reflective material. The light emitted from the first light-emitting element in the first light-emitting structure 100A and the light emitted from the second light-emitting element in the second light-emitting structure 100B are taken out from the upper surface 200a side located on the opposite side to the lower surface 200b. As described in detail later, the first light-emitting structure 100A and the second light-emitting structure 100B have a first light-transmitting protective component 130A and a second protective component 130B on one side of the upper surface 200a located on the opposite side to the lower surface 200b of the light-emitting device 200. The light from the first light-emitting element 110A in the first light-emitting structure 100A and the light from the second light-emitting element 110B in the second light-emitting structure 100B are taken out to the outside of the light-emitting device 200 via the first protective component 130A and the second protective component 130B, respectively. It should be noted that the term "light-transmitting" in this specification is interpreted as including diffusivity relative to the incident light, and is not limited to "transparent". For example, "light-transmitting property" means having a transmittance of 60% or more, preferably 70% or more, with respect to incident light.

[0048] In this example, the first light emitting structure 100A has a first electrode 111A and a second electrode 112A located on the lower surface 200b side of the light emitting device 200. Similarly, the second light emitting structure 100B has a first electrode 111B and a second electrode 112B located on the lower surface 200b side of the light emitting device 200. Details of the first light emitting structure 100A and the second light emitting structure 100B will be described later.

[0049] like Figure 1 As shown, the light emitting device 200 has a first wiring 210 and a second wiring 220 on the lower surface 200b side. Figure 1 In the illustrated structure, the first wiring 210 includes a first portion 211 connected to the first electrode 111A of the first light emitting structure 100A and a second portion 212 connected to the first electrode 111B of the second light emitting structure 100B.

[0050] The first portion 211 of the first wiring 210 is located inside a first groove G1 provided on the lower surface of the cover 120 (the surface located on the opposite side to the upper surface 200a of the light emitting device 200), and its surface exposed to the outside is substantially consistent with the lower surface of the cover 120. Similarly, a second groove G2 is further provided on the lower surface of the cover 120, and the second portion 212 of the first wiring 210 is located inside the second groove G2. The surface of the second portion 212 is also substantially consistent with the lower surface of the cover 120.

[0051] The first groove G1 includes a portion overlapping with the first electrode 111A of the first light-emitting structure 100A when viewed from above. In other words, a portion of the first electrode 111A is exposed inside the first groove G1. The first electrode 111A is electrically connected to the first portion 211 of the first wiring 210 by having a portion thereof exposed inside the first groove G1. On the other hand, the second groove G2 includes a portion overlapping with the first electrode 111B of the second light-emitting structure 100B when viewed from above. The first electrode 111B is electrically connected to the second portion 212 of the first wiring 210 by having a portion thereof inside the second groove G2.

[0052] The first electrode 111A connected to the first portion 211 of the first wiring 210 is, for example, the positive electrode of the first light-emitting element in the first light-emitting structure 100A. Similarly, the first electrode 111B connected to the second portion 212 of the first wiring 210 is, for example, the positive electrode of the second light-emitting element in the second light-emitting structure 100B. The first portion 211 and the second portion 212 of the first wiring 210 are two portions of the first wiring 210 that are separated in space and electrically independent. Here, the first portion 211 and the second portion 212 are electrically connected to each other via the jumper element 250 arranged inside the cover 120. That is, it can be said that the first wiring 210 is a wiring of the first polarity that supplies current to the first light-emitting element 110A in the first light-emitting structure 100A and the second light-emitting element 110B in the second light-emitting structure 100B. In this specification, the "polarity" of the wiring is determined not by the conductivity of the wiring itself, but by the polarity of the electrode of the light-emitting element connected to the wiring.

[0053] As described in detail below with reference to the cross-sectional view, the jumper element 250 includes a first terminal, a second terminal, and a body portion that electrically connects the first terminal and the second terminal to each other. Here, the first groove G1 includes a portion that overlaps with the first terminal of the jumper element 250 when viewed from above, and the second groove G2 includes a portion that overlaps with the second terminal of the jumper element 250 when viewed from above. A portion of the first terminal of the jumper element 250 and a portion of the second terminal are exposed inside the first groove G1 and inside the second groove G2.

[0054] That is, the first terminal of the jumper element 250 is connected to, for example, the first portion 211 of the first wiring 210, and the second terminal of the jumper element 250 is connected to the second portion 212 of the first wiring 210. Therefore, the first portion 211 of the first wiring 210 electrically connects, for example, the positive electrode of the first light-emitting element and the first terminal of the jumper element 250, and the second portion 212 of the first wiring 210 electrically connects the positive electrode of the second light-emitting element and the second terminal of the jumper element 250. It should be noted that in this specification, the term "jumper element" is interpreted as widely including an element having such a first terminal, a second terminal, and a main body, and is not limited to a "jumper chip" sold on the market.

[0055] On the other hand, in this example, the second wiring 220 electrically connects the cathode of the first light emitting element, the second electrode 112A, and the cathode of the second light emitting element, the second electrode 112B. That is, the second wiring 220 has a second polarity different from the first polarity of the first wiring 210.

[0056] The second wiring 220 is located in the same layer as the first wiring 210. That is, the second wiring 220 is located inside the third groove G3 provided on the lower surface of the cover 120. Like the first wiring 210, the surface of the second wiring 220 exposed to the outside typically coincides with the lower surface 200b of the light emitting device 200.

[0057] like Figure 1 As shown, in this example, the third groove G3 includes a portion extending between the first groove G1 and the second groove G2 in addition to a portion overlapping with the second electrode 112A of the first light-emitting element and a portion overlapping with the second electrode 112B of the second light-emitting element in a plan view. Figure 1 As shown in the dotted oval, the second wiring 220 has a cross section 220c extending between the first terminal and the second terminal of the jumper element 250 in a plan view. As described later, the main body of the jumper element 250 that electrically connects the first terminal and the second terminal is located farther from the lower surface 200b of the light emitting device 200 than the first wiring 210. Therefore, an insulating portion such as the cover 120 exists between the cross section 220c of the second wiring 220 and the main body of the jumper element 250, and they do not contact each other. In this way, the second wiring 220 is electrically separated from the jumper element 250 and the first wiring 210.

[0058] exist Figure 1 In the illustrated structure, the first wiring 210 and the second wiring 220 have a terminal portion 210e and a terminal portion 220e formed by extending to the vicinity of the outer edge of the light-emitting device 200. These terminal portions 210e, 220e are connected to an external power source such as a driving circuit via a bonding component such as solder. By connecting the power source to the terminal portions 210e, 220e of the light-emitting device 200, the first light-emitting element in the first light-emitting structure 100A and the second light-emitting element in the second light-emitting structure 100B can be driven together. The terminal portions 210e, 220e can be connected to the wiring on the positive side and the wiring on the negative side of the wiring provided on the wiring substrate, respectively, via a bonding component such as solder. In this case, by connecting the power source to the wiring substrate, the first light-emitting element in the first light-emitting structure 100A and the second light-emitting element in the second light-emitting structure 100B can be driven together.

[0059] Figure 2An example of a cross section when the light emitting device 200 is cut perpendicularly to the lower surface 200 b and passes through the position of the jumper element 250 is schematically shown. Figure 2 The cross section shown corresponds to a cross section obtained when the light emitting device 200 is cut perpendicularly to the ZX plane near the center of the light emitting device 200 .

[0060] As reference Figure 1 As described above, the light emitting device 200 includes the first light emitting structure 100A, the second light emitting structure 100B, and the jumper element 250 which are arranged inside the cover 120 . Figure 2 The cross-section of the cross-section member 250A shown in FIG. 1 is an example of the cross-section element 250 described above.

[0061] The first light emitting structure 100A includes a first light emitting element 110A having a first electrode 111A and a second electrode 112A. The first light emitting element 110A is a light emitting semiconductor element such as an LED, and includes a semiconductor laminate structure 115A including the first electrode 111A and the second electrode 112A.

[0062] On the upper surface side of the first light emitting element 110A (ie, the upper surface 200a side of the light emitting device 200), for example, a first protective member 130A and a wavelength conversion member 140A are disposed. Figure 2 As schematically shown in FIG. 1 , the upper surface of the first protective component 130A located above the first light emitting element 110A is consistent with the upper surface 200a of the light emitting device 200. The wavelength conversion component 140A is located between the first light emitting element 110A and the first protective component 130A. Figure 2 In the example shown, the first light emitting element 110A is covered with a reflective resin member 160A.

[0063] In this embodiment, the second light-emitting structure 100B has a structure substantially similar to that of the first light-emitting structure 100A. That is, the second light-emitting structure 100B includes a second light-emitting element 110B, a second protective component 130B, a wavelength conversion component 140B, and a reflective resin component 160B covering the second light-emitting element 110B. The upper surface of the second protective component 130B located above the second light-emitting element 110B is consistent with the upper surface 200a of the light-emitting device 200. Similar to the first light-emitting element 110A, the second light-emitting element 110B includes a first electrode 111B, a second electrode 112B, and a semiconductor stacked structure 115B.

[0064] The first light emitting structure 100A and the second light emitting structure 100B each have a structure that can be used as a light source emitting white light even if they are alone. The first light emitting structure 100A and the second light emitting structure 100B may be light sources with the same structure or light sources with partially different structures.

[0065] The jumper component 250A includes a first terminal 251A, a second terminal 252A, and a main body 255A to which these terminals are connected. The first terminal 251A is connected to the first electrode 111A of the first light-emitting element 110A via the first portion 211 of the first wiring 210, and the second terminal 252A is connected to the first electrode 111B of the second light-emitting element 110B via the second portion 212 of the first wiring 210. The main body 255A of the jumper component 250A includes at least a conductor portion that electrically connects the first terminal 251A and the second terminal 252A to each other. That is, the first electrode 111A of the first light-emitting element 110A and the first electrode 111B of the second light-emitting element 110B are electrically connected to each other via the first wiring 210 and the jumper component 250A.

[0066] like Figure 2 As shown, in cross-section, the intersection 220c of the second wiring 220 is located between the first portion 211 and the second portion 212 of the first wiring 210. The main body 255A of the jumper 250A is located at a position spaced apart from the first wiring 210 on the opposite side from the interface between the first wiring 210 and the electrode of the light-emitting element (e.g., the interface between the first portion 211 and the first electrode 111A of the first light-emitting element 110A). In other words, the main body 255A of the jumper 250A is located at a position lower than the interface between the first wiring 210 and the electrode of the light-emitting element, and does not directly contact the second wiring 220.

[0067] As by Figure 1 and Figure 2 As can be understood, a portion of the first wiring 210 located between the first electrode 111A of the first light emitting element 110A and the first terminal 251A of the jumper 250A (a portion of the first portion 211 in this example) extends in the X direction (first direction) in the drawing. Similarly, a portion of the first wiring 210 located between the first electrode 111B of the second light emitting element 110B and the second terminal 252A of the jumper 250A (a portion of the second portion 212 in this example) also extends in the X direction in the drawing. On the other hand, a portion of the second wiring 220 located between the first terminal 251A and the second terminal 252A of the jumper 250A (the intersection 220c in this example) extends in a second direction different from the first direction (the Y direction in this example in the drawing).

[0068] exist Figure 2In the illustrated structure, the bridging member 250A is covered by the reflective resin member 260A. In addition, in this example, a resin layer 270A is disposed on the lower surface 200b side of the light emitting device 200. The reflective resin member 160A of the first light emitting structure 100A, the reflective resin member 160B of the second light emitting structure 100B, the reflective resin member 260A surrounding the bridging member 250A, and the resin layer 270A located on the lower surface 200b side of the light emitting device 200 constitute the covering portion 120 that covers the first light emitting element 110A, the second light emitting element 110B, and the bridging member 250A as a whole.

[0069] As described later, the first wiring 210 and the second wiring 220 are formed inside grooves formed in the cover 120 covering the first light emitting element 110A and the like. These grooves are formed, for example, by patterning a resin layer located on the lower surface 200b side of the light emitting device 200. Alternatively, they are formed by removing a portion of a resin member that integrally covers the first light emitting element 110A, the second light emitting element 110B, and the jumper element.

[0070] As described above, according to the embodiments of the present disclosure, it is possible to avoid complication of the process, and the intersection between the wiring on the positive side and the wiring on the negative side is formed on the light-emitting device side. Therefore, it is possible to easily set the intersection between the wirings with different polarities without the need for a multilayer substrate or the like. In addition, the wirings that connect the light-emitting elements to each other are formed on the light-emitting device side, so it is basically unnecessary to change the design of the wiring substrate that supports the light-emitting device according to the number or arrangement of the light-emitting structures. Therefore, it is basically unnecessary to have a wiring substrate with wirings corresponding to the number or arrangement of the light-emitting structures, and the manufacturing cost can be reduced.

[0071] As can be easily understood from the above description, the number and arrangement of the light-emitting structure and the jumper elements are basically arbitrary and are not limited to the above examples. Therefore, according to the application, a high degree of freedom can be obtained in the design of the arrangement of the light-emitting elements, the connection between the light-emitting elements, etc. For example, a light-emitting device including a plurality of light-emitting elements operated by passive matrix driving can be obtained at a low cost.

[0072] Furthermore, for example, a groove is formed by scanning a laser beam, and a conductive material is arranged inside the groove to form the first wiring 210 and the second wiring 220, so that a high degree of freedom can be obtained in the design of the wiring. In addition, it is relatively easy to increase the thickness of the wiring by changing the shape of the groove, so that a wiring with a large flatness ratio can be formed, and the increase in wiring resistance can be suppressed, and the light-emitting elements can be arranged at a high density in the light-emitting device. By arranging the light-emitting elements at a high density, the light-emitting device can be miniaturized.

[0073] Hereinafter, each component of the light emitting device 200 will be described in more detail.

[0074] [Light-emitting element]

[0075] A typical example of the first light emitting element 110A and the second light emitting element 110B is an LED. The first light emitting element 110A includes a semiconductor stacking structure 115A, and the second light emitting element 110B includes a semiconductor stacking structure 115B. The semiconductor stacking structure 115A and the semiconductor stacking structure 115B generally include an active layer and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the active layer. The semiconductor stacking structure may include a nitride semiconductor (In x AlyGa 1-x-y N, 0≦x, 0≦y, x+y≦1). It should be noted that the structure of the first light-emitting element 110A and the structure of the second light-emitting element 110B may be different from each other or the same. Here, the first light-emitting element 110A and the second light-emitting element 110B basically have a common structure, and the first light-emitting element 110A and the second light-emitting element 110B are both LEDs that emit blue light.

[0076] The semiconductor stacked structure 115A may further include a support substrate such as sapphire or gallium nitride that supports a plurality of semiconductor layers including an n-type semiconductor layer and a p-type semiconductor layer. In this case, the main surface of the support substrate that is located on the opposite side to the main surface on which the plurality of semiconductor layers are formed constitutes the upper surface of the semiconductor stacked structure 115A, and the upper surface of the semiconductor stacked structure 115A coincides with the upper surface of the first light emitting element 110A.

[0077] The first electrode 111A and the second electrode 112A of the first light-emitting element 110A are provided on the side opposite to the upper surface of the semiconductor stack structure 115A. The first electrode 111A and the second electrode 112A have the function of supplying a predetermined current to the semiconductor stack structure 115A. The first electrode 111A and the second electrode 112A are, for example, Cu electrodes. Similarly, the first electrode 111B and the second electrode 112B of the second light-emitting element 110B may also be Cu electrodes located on the opposite side to the upper surface of the semiconductor stack structure 115B.

[0078] The lower surface of the first electrode 111A and the second electrode 112A of the first light emitting element 110A substantially coincides with the lower surface of the reflective resin member 160A covering the semiconductor stacked structure 115A. Figure 2In the illustrated structure, at least a portion of the first electrode 111A and at least a portion of the second electrode 112A are exposed inside the first groove G1 and inside the third groove G3, respectively, on the lower surface 200b side of the light emitting device 200. Similarly, here, the lower surfaces of the first electrode 111B and the second electrode 112B of the second light emitting element 110B are substantially aligned with the lower surface of the reflective resin member 160B covering the semiconductor stacked structure 115B. As a result, at least a portion of the first electrode 111B and at least a portion of the second electrode 112B are exposed inside the second groove G2 and inside the third groove G3, respectively.

[0079] [Protective parts]

[0080] The first protective member 130A and the second protective member 130B are plate-shaped members located above the upper surfaces of the first light-emitting element 110A and the second light-emitting element 110B in the light-emitting device 200. The first protective member 130A and the second protective member 130B have a lower surface located on the light-emitting element (the first light-emitting element 110A or the second light-emitting element 110B) side, an upper surface located on the upper surface 200a side of the light-emitting device 200, and a side surface located between these surfaces. The side surfaces of the first protective member 130A and the side surfaces of the second protective member 130B are covered by the cover 120, and the upper surface of the first protective member 130A and the upper surface of the second protective member 130B constitute a light-emitting region in the upper surface 200a of the light-emitting device 200 where light from the light-emitting element is extracted.

[0081] Examples of materials for the first protective member 130A and the second protective member 130B include silicone resin, modified silicone resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, trimethylpentene resin or polynorbornene resin, or a resin composition containing two or more of these resins. The material used to form the first protective member 130A and the material used to form the second protective member 130B may be the same or different. By dispersing a material having a different refractive index from that of the base material in the material of the protective member, light diffusivity may be imparted to the protective member. The first protective member 130A and / or the second protective member 130B may be a layer formed of glass.

[0082] The first protection member 130A and the second protection member 130B are bonded to the upper surface of the first light emitting element 110A and the upper surface of the second light emitting element 110B, respectively, by, for example, a light-transmitting adhesive. Figure 2 Although not shown in the figure for convenience, the cured adhesive may have a portion covering the side surface of the light emitting element body (the semiconductor stacked structure 115A or the semiconductor stacked structure 115B).

[0083] [Wavelength conversion component]

[0084] The wavelength conversion component 140A and the wavelength conversion component 140B are components in which phosphor particles are dispersed in a matrix material such as resin. Figure 2 As shown, the wavelength conversion component 140A is located between the first light emitting element 110A and the first protective component 130A, and the wavelength conversion component 140B is located between the second light emitting element 110B and the second protective component 130B. Figure 2 In the illustrated structure, the wavelength conversion member 140A has a side surface that matches the side surface of the first protective member 130A, and the wavelength conversion member 140B has a side surface that matches the side surface of the second protective member 130B. These side surfaces are also covered by the cover 120 .

[0085] The wavelength conversion components 140A and 140B absorb at least a portion of the light emitted from the light emitting element, and emit light of a wavelength different from the wavelength of the light from the light emitting element. For example, the wavelength conversion components 140A and 140B convert the wavelengths of a portion of the blue light from the first light emitting element 110A and a portion of the blue light from the second light emitting element 110B, respectively, to emit yellow light. According to such a structure, the blue light that has passed through the wavelength conversion component is mixed with the yellow light emitted from the wavelength conversion component to emit white light.

[0086] As the base material of the wavelength conversion component 140A and the wavelength conversion component 140B, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea-formaldehyde resin, phenolic resin, acrylic resin, polyurethane resin or fluorine resin, or a resin containing two or more of these resins can be used. As the phosphor dispersed in the base material, a well-known material can be used. Examples of phosphors are YAG-based phosphors, fluoride-based phosphors, nitride phosphors, etc. YAG-based phosphors are examples of wavelength conversion components that convert blue light into yellow light, and KSF-based phosphors, which are one type of fluoride-based phosphors, and CASN phosphors and SCASN phosphors, which are nitride-based phosphors, are examples of wavelength conversion components that convert blue light into red light. β-Sialon phosphor, which is another type of nitride phosphor, is an example of a wavelength conversion component that converts blue light into green light. The phosphor can be a quantum dot phosphor.

[0087] It should be noted that the phosphor dispersed in the base material of the wavelength conversion component 140A may be different from the phosphor dispersed in the base material of the wavelength conversion component 140B. That is, in the embodiment of the present disclosure, it is not necessary for the wavelength of the light emitted from the first light-emitting structure 100A in the light-emitting device 200 to be consistent with the wavelength of the light emitted from the second light-emitting structure 100B.

[0088] [Jumper Components]

[0089] The jumper element 250 is a circuit element having the function of electrically connecting the wirings having the same polarity in the light emitting device 200 to each other. Figure 2 The illustrated jumper 250A electrically connects a first portion 211 of the first wiring 210 connected to the first electrode 111A of the first light emitting element 110A and a second portion 212 of the first wiring 210 connected to the first electrode 111B of the second light emitting element 110B to each other.

[0090] As the jumper element 250, any structure can be used as long as it includes a component that can ensure electrical insulation between the wiring of the first polarity and the wiring of the second polarity different from the first polarity and can form a conductor portion that intersects therebetween, not limited to the jumper element 250A described above. The jumper element 250A as an example of the jumper element 250 includes a main body 255A, a first terminal 251A, and a second terminal 252A, which together constitute a conductor portion that intersects the wiring of the first polarity and the wiring of the second polarity.

[0091] For example, a commercially available jumper chip (also called a zero-ohm resistor) can be used as the jumper element 250 instead of the jumper component 250A. Generally, the jumper chip has a conductive layer provided on one or both sides of an insulating substrate such as ceramic and glass epoxy, and has a structure in which the surface of the conductive layer is covered with an insulating layer except for the end of the substrate. The portion of the conductive layer not covered by the insulating layer is provided with a terminal portion formed by plating or the like. Some specific examples of the jumper element 250 will be described below.

[0092] [Reflective resin parts]

[0093] The reflective resin component 160A is a component that surrounds the side surface of the semiconductor laminate structure 115A of the first light-emitting element 110A in the first light-emitting structure 100A and covers the first light-emitting element 110A. The reflective resin component 160A has a reflectivity of 60% or more with respect to the light of the emission peak wavelength of the first light-emitting element 110A. Similarly, the reflective resin component 160B covers the second light-emitting element 110B in the second light-emitting structure 100B and exhibits a reflectivity of 60% or more with respect to the light of the emission peak wavelength of the second light-emitting element 110B. The reflective resin component 160A and the reflective resin component 160B exhibit a reflectivity of 70% or more, preferably 80% or more with respect to the light of the emission peak wavelength of the light-emitting element (the first light-emitting element 110A or the second light-emitting element 110B).

[0094] As the material of the reflective resin component 160A and the reflective resin component 160B, for example, a resin composition in which a light reflective filler is dispersed can be used. As the base material of the reflective resin component 160A and the reflective resin component 160B, silicone resin, phenolic resin, epoxy resin, BT resin, polyphthalamide (PPA), etc. can be used. As the light reflective filler, metal particles or particles of inorganic or organic materials having a higher refractive index than the base material can be used. Examples of light reflective fillers are particles of titanium dioxide, silicon oxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, or various rare earth oxide particles such as yttrium oxide and gadolinium oxide. From the viewpoint of obtaining high reflectivity, it is advantageous for the reflective resin component 160A and the reflective resin component 160B to have a white color. As the material of the reflective resin member 160A and the reflective resin member 160B, glass fiber reinforced resin or ceramics such as aluminum nitride, alumina, or zirconia may be used.

[0095] exist Figure 2 In the illustrated structure, the reflective resin member 160A covers the lower surface of the semiconductor layered structure 115A of the first light-emitting element 110A except the area where the first electrode 111A and the second electrode 112A are arranged. In addition, the reflective resin member 160B covers the lower surface of the semiconductor layered structure 115B of the second light-emitting element 110B except the area where the first electrode 111B and the second electrode 112B are arranged (in the Figure 2 By covering the area of ​​the lower surface of the semiconductor laminate structure of the light-emitting element except the area where the first electrode and the second electrode are arranged with the reflective resin member (reflective resin member 160A, reflective resin member 160B), the light emitted from the light-emitting element to the lower surface 200b side of the light-emitting device 200 can be reflected to the upper surface 200a side of the light-emitting device 200 by the reflective resin member. Therefore, it is possible to suppress the leakage of light from the lower surface 200b side of the light-emitting device 200 and improve the light extraction efficiency.

[0096] [Covering part]

[0097] The cover 120 as a whole covers the first light emitting structure 100A and the second light emitting structure 100B as well as the jumper element 250. The first groove G1, the second groove G2 and the third groove G3 are provided on the lower surface side of the cover 120, that is, the lower surface 200b side of the light emitting device 200.

[0098] Typically, the cover 120 is formed of the same material as the reflective resin member 160A covering the first light emitting element 110A and the reflective resin member 160B covering the second light emitting element 110B. That is, typically, the cover 120 is formed of a resin composition in which a light reflective filler is dispersed, and has light reflectivity. It should be noted that the material used to form the cover 120 does not need to be strictly controlled by the material of the reflective resin member 160A or the reflective resin member 160B. The material of the cover 120 and the material of the reflective resin member 160A or the reflective resin member 160B may be different in terms of the base material, the type or content of the light reflective filler, etc.

[0099] The cover 120 is similar to the reflective resin member 160A and the reflective resin member 160B in that it has light reflectivity, so the cover 120 can be regarded as a structure including the reflective resin member 160A and the reflective resin member 160B in a part thereof. From this point of view, the cover 120 includes a portion covering the first light emitting element 110A and a portion covering the second light emitting element 110B. In addition, the cover 120 also includes a portion covering other portions, in other words, a portion covering the jumper element 250. If the portion covering the first light emitting element 110A, the portion covering the second light emitting element 110B, and the portion covering the jumper element 250 are respectively referred to as the first resin, the second resin, and the third resin, the first groove G1 is formed so as to straddle the first resin and the third resin, and the second groove G2 is formed so as to straddle the second resin and the third resin. The portion of the third groove G3 where the intersection 220c is arranged is formed in the third resin in the cover 120.

[0100] As described in detail below with reference to the accompanying drawings, the first groove G1, the second groove G2, and the third groove G3 can be formed by laser scanning. When laser scanning is applied to the formation of these grooves, if a material that absorbs laser light is dispersed in the cover 120, the laser light can be effectively absorbed by the cover 120 and a portion of the surface of the cover 120 can be removed efficiently.

[0101] A typical example of a material that absorbs laser light is a coloring material. For example, when a UV laser having a central wavelength in the ultraviolet range is used in the formation of the first groove G1, the second groove G2, and the third groove G3, fillers such as titanium dioxide, carbon, barium sulfate, and zinc oxide are dispersed in the cover 120 as materials that absorb laser light. When a laser source called a green laser that outputs a laser having a wavelength of 532 nm is used in the formation of the first groove G1, the second groove G2, and the third groove G3, carbon, nickel oxide, iron (III) oxide, etc. can be used as the filler, and when an IR laser having a central wavelength in the infrared region is used, carbon, calcium sulfate, magnesium silicate, aluminum oxide, tungsten composite oxide, etc. can be used as the filler.

[0102] If the cover 120 is formed of foamed plastic, each of the cover 120 includes cells having a plurality of pores, and fine concavities and convexities are naturally formed at the bottom of the groove. Therefore, it is expected that the anchoring effect between the cover 120 and the first wiring 210 and the second wiring 220 described later will be improved.

[0103] [First wiring and second wiring]

[0104] The first wiring 210 and the second wiring 220 are conductive structures located inside the groove formed on the lower surface 200b of the light emitting device 200. Figure 1 and Figure 2 As shown, the first wiring 210 includes a first portion 211 and a second portion 212, and the first portion 211 and the second portion 212 are respectively located inside the first groove G1 and the second groove G2. On the other hand, the second wiring 220 is arranged inside the third groove G3 formed separately from the first groove G1 and the second groove G2. Figure 1 As shown, the first portion 211 and the second portion 212 of the first wiring 210 have shapes that match the shapes of the first groove G1 and the second groove G2 when viewed from above, and the second wiring 220 also has a shape that matches the shape of the third groove G3 when viewed from above. It should be noted that Figure 1 The shapes of the first wiring 210 and the second wiring 220 shown are merely examples, and the shapes of the first groove G1 , the second groove G2 , and the third groove G3 in a plan view are basically arbitrary.

[0105] exist Figure 2 In the figure, the interface between the first wiring 210 and the bottom of the first groove G1, the interface between the first wiring 210 and the bottom of the second groove G2, and the interface between the second wiring 220 and the bottom of the third groove G3 are depicted as flat surfaces. However, it is not necessary for the bottom surface of the first wiring 210 and the bottom surface of the second wiring 220 to be flat surfaces in the embodiment of the present disclosure. For example, when the first groove G1, the second groove G2, and the third groove G3 are formed on the cover 120 by irradiation of laser, the surfaces of these grooves have concavoconvexity.

[0106] According to an embodiment of the present disclosure, the first groove G1, the second groove G2, and the third groove G3 are filled with a conductive material such as a conductive paste by printing, so that the first wiring 210 and the second wiring 220 can be efficiently formed. If the surfaces of the first groove G1, the second groove G2, and the third groove G3 have concavoconvexity, the inside of the concave portion formed in the cover 120 is also filled with a conductive material. Therefore, the first wiring 210 and the second wiring 220 can have a concavoconvex bottom surface that follows the concavoconvex shape of the first groove G1, the second groove G2, and the third groove G3. By making the shape of the bottom surface of the first wiring 210 and the second wiring 220 a shape that matches the concavoconvex shape of the surface of the groove formed on the cover 120, a greater anchoring effect can be generated. That is, the effect of suppressing the first wiring 210 or the second wiring 220 from peeling off from the light emitting device 200 can be obtained. As described later, the bottom surface of the first groove G1, the second groove G2, and the third groove G3 can be formed by a structure such as a plurality of grooves.

[0107] It should be noted that the first groove G1, the second groove G2, and the third groove G3 have a depth of, for example, 5 μm or more and 50 μm or less. Accordingly, the first wiring 210 and the second wiring 220 can also have a thickness in the range of about 5 μm or more and 50 μm or less.

[0108] (Embodiment of Method for Manufacturing Light Emitting Device)

[0109] Hereinafter, a method for manufacturing a light emitting device according to an embodiment of the present disclosure will be described. Figure 3 is a flow chart showing an exemplary method of manufacturing a light emitting device. Figure 3 The manufacturing method illustrated includes: a process of forming a first groove, a second groove, and a third groove by removing a portion of a first resin covering a first light-emitting element, a portion of a second resin covering a second light-emitting element, and a portion of a third resin covering a circuit element having a conductor portion (step S1); a process of forming a first wiring by filling the first groove and the second groove with a first conductive material (step S2); and a process of forming a second wiring by filling the third groove with a second conductive material (step S3). The details of each process are described below.

[0110] (Groove Forming Process)

[0111] First, a first light emitting structure 100A including a first light emitting element 110A in part thereof, a second light emitting structure 100B including a second light emitting element 110B in part thereof, and a jumper element 250 are prepared. The first light emitting structure 100A and / or the second light emitting structure 100B may be prepared by manufacturing or by purchasing. As described above, the first light emitting structure 100A and the second light emitting structure 100B may each have a structure that can be used as a light source even in a single body. For example, a light source sold on the market under the name of an LED package or the like may be used for the first light emitting structure 100A and the second light emitting structure 100B.

[0112] As the jumper element 250, a circuit element having two ends arranged at a distance from each other, that is, two ends that can each function as a terminal and a main body that electrically connects the two ends is widely used. Figure 2 The illustrated jumper member 250A is provided as an example of the use of the jumper element 250 .

[0113] Next, a support having an upper surface is prepared (support preparation step). Figure 4 As shown in FIG. 4 , a support body 400 having a flat upper surface 400a is prepared. As the support body 400, for example, a heat-resistant adhesive tape supported by an annular frame or the like can be used.

[0114] Next, the first light emitting structure 100A, the second light emitting structure 100B, and the bridging component 250A are arranged on the support (element arrangement step). For simplicity, here, an example is shown in which the first light emitting structure 100A, the bridging component 250A, and the second light emitting structure 100B are arranged one-dimensionally in sequence along the X direction of the drawing. However, the number and arrangement of the elements arranged on the support are not limited to this example. For example, three or more light emitting structures may be arranged two-dimensionally on the support. In this case, the number and arrangement of the bridging elements may be determined according to the number and arrangement of the light emitting structures.

[0115] At this time, if Figure 4 As schematically shown, the first light emitting structure 100A is temporarily fixed on the upper surface 400a of the support 400 in a manner that the first electrode 111A and the second electrode 112A face the side opposite to the support 400. The second light emitting structure 100B is similarly fixed in a manner that the first electrode 111B and the second electrode 112B (at Figure 4The first light emitting structure 100A is temporarily fixed to the upper surface 400a of the support body 400 in a state of facing the side opposite to the support body 400 (not shown). Here, the first light emitting structure 100A includes a laminate of the first protective component 130A and the wavelength conversion component 140A, and the second light emitting structure 100B includes a laminate of the second protective component 130B and the wavelength conversion component 140B. Therefore, the first light emitting element 110A and the second light emitting element 110B are located above the upper surface 400a of the support body 400.

[0116] In this example, the lower surfaces of the first electrode 111A and the second electrode 112A of the first light emitting structure 100A are exposed from the reflective resin member 160A, and the lower surfaces of the first electrode 111B and the second electrode 112B of the second light emitting structure 100B are also exposed from the reflective resin member 160B. When the first light emitting element 110A and the second light emitting element 110B are arranged above the support 400, the lower surfaces of the first electrode 111A and the second electrode 112A of the first light emitting element 110A and the lower surfaces of the first electrode 111B and the second electrode 112B of the second light emitting element 110B are at substantially the same height relative to the upper surface 400a of the support 400.

[0117] In this specification, the term "light-emitting structure" is used in common with respect to a structure including a light-emitting element having an electrode provided on a portion thereof, regardless of whether the electrode of the light-emitting element is covered by the resin covering the light-emitting element or exposed from the resin covering the light-emitting element. In the embodiments of the present disclosure, it is not necessary for the lower surface of the electrode to be exposed from the reflective resin member covering the light-emitting element in a state arranged on a support.

[0118] like Figure 4 As shown in FIG. 1 , the jumper member 250A is also arranged on the upper surface 400a of the support body 400 in such a manner that the first terminal 251A and the second terminal 252A face the side opposite to the support body 400. Here, the jumper member 250A is temporarily fixed to the support body 400 in a state where the support member 280 is located between the upper surface 400a of the support body 400 and the jumper member 250A. That is, here, before the jumper member 250A is arranged, a step of arranging the support member 280 on the upper surface 400a of the support body 400 (support member arrangement step) is performed.

[0119] In most cases, the height of the jumper element is not consistent with the height of the light emitting structure. For example, the jumper chip sold on the market is generally thinner than the light emitting structure provided in the form of a package including a wavelength conversion component in addition to the light emitting element. By placing a support member 280 of appropriate thickness between the support body 400 and the jumper member 250A, such as Figure 4As shown by the dashed line in the middle, the positions of the lower surfaces of the first terminal 251A and the second terminal 252A can be aligned with the first electrode 111A and the second electrode 112A and the first electrode 111B and the second electrode 112B (in Figure 4 The position of the lower surface of (not shown in the figure) is roughly the same.

[0120] As the support member 280, any member having a height corresponding to the difference between the height of the light emitting structure and the height of the bridging member 250A can be used as appropriate. Typically, the support member 280 is insulating, but a conductive member may be used as the support member 280. Examples of the support member 280 include a resin sheet, a resin block, a metal plate, and the like. The bridging member 250A is fixed to the support member 280 by, for example, an adhesive.

[0121] Then, if Figure 5 As shown, the region between the first light emitting structure 100A and the bridging member 250A and the region between the second light emitting structure 100B and the bridging member 250A on the upper surface 400a of the support 400 are filled with the resin material. Then, by curing the resin material, a resin layer 120T covering the first light emitting structure 100A, the second light emitting structure 100B and the bridging member 250A can be obtained.

[0122] exist Figure 5 In the illustrated structure, the resin layer 120T covers the entire first light emitting structure 100A, the entire second light emitting structure 100B, and the entire bridging member 250A (covering step) except for the portion in contact with the support 400 or the support member 280. Thus, the first light emitting structure 100A, the second light emitting structure 100B, and the bridging member 250 can be integrated on the support 400.

[0123] As the material of the resin layer 120T, the same material as the material of the reflective resin component 160A or the reflective resin component 160B can be used. The process of forming the resin layer 120T can be performed by using transfer molding, spray coating, compression molding, etc. It should be noted that, when the resin layer 120T is formed by the same material as the reflective resin component 160A and the reflective resin component 160B, from the cross-section, there may be a case where no obvious boundary can be seen between the first light-emitting structure 100A and the resin layer 120T, and between the second light-emitting structure 100B and the resin layer 120T. In addition, when the material of the resin layer 120T is made the same as the material of the supporting component 280, there may also be a case where no obvious boundary can be seen between the supporting component 280 and the resin layer 120T. Below, an example of forming the resin layer 120T by the same material as the material of the supporting component 280 is described.

[0124] Then, if Figure 6 As schematically shown in FIG. 1 , as necessary, a portion of the resin layer 120T is removed from the side opposite to the support 400 by grinding or the like, thereby reducing the thickness of the resin layer 120T. Here, by removing a portion of the resin layer 120T, the lower surface of the first electrode 111A and the second electrode 112A of the first light-emitting structure 100A, the first electrode 111B and the second electrode 112B of the second light-emitting structure 100B (at the bottom) can be made thinner. Figure 6 The lower surface of the first and second terminals 251A and 252A of the jumper 250A are exposed from the resin layer 120T. In addition, as described later, in the embodiment of the present disclosure, it is not necessary for the lower surfaces of the first and second electrodes 111A and 112A, the first and second electrodes 111B and 112B, and the first and second terminals 251A and 252A to be exposed from the resin layer 120T.

[0125] Furthermore, by removing a portion of the resin layer 120T, a reflective resin member 260A covering at least the bridging member 250A is formed on the support body 400 (third resin forming step). Figure 2 A portion of the reflective resin member 260A described above.

[0126] Here, after a portion of the resin layer 120T is removed, as shown in FIG. Figure 7 As shown, a resin layer 270S is arranged on the surface of the structure on the support body 400. As the resin layer 270S, for example, a resin tape having an adhesive layer can be used. After the resin tape is attached to the grinded surface of the resin layer 120T, the adhesive layer of the resin tape is cured by heating, ultraviolet irradiation, etc. Alternatively, a resin tape having a predetermined thickness can be arranged on the structure on the support body 400 by an adhesive, etc., to form the resin layer 270S. Typically, the thickness of the resin layer 270S is in the range of 5 μm or more and 100 μm or less.

[0127] exist Figure 7 In the illustrated structure, the resin layer 270S is a single resin component that is continuous throughout the first light-emitting structure 100A, the second light-emitting structure 100B, and the reflective resin component 260A. Here, "single" does not mean that the resin layer 270S is limited to a single layer, and the resin layer 270S can be provided in the form of a laminated sheet. The resin layer 270S can be a light-transmitting sheet, or a sheet that is, for example, white by dispersing a pigment or the like.

[0128] Next, a first groove, a second groove, and a third groove are formed by removing a portion of the resin layer 270S. Figure 3 Here, Figure 8 As schematically shown in FIG. 2 , a portion of the resin layer 270S is removed by irradiation with laser light.

[0129] For laser irradiation, a known laser etching device can be used. Figure 8 , an example of using a laser etching device 500 including a laser source 510 and a current mirror 520 is shown. The number of current mirrors in the laser etching device 500 may be two or more. Examples of the laser source 510 are CO2 laser, Nd:YAG laser, Nd:YVO4 laser, argon ion laser, etc. Alternatively, a green laser may be used as the laser source 510. The laser etching device 500 may be a device having a fiber laser. Furthermore, by utilizing a high harmonic generator such as SHG, THG, etc., the second high harmonic, the third high harmonic, etc. may be obtained to process the resin layer 270S.

[0130] By scanning the surface of the resin layer 270S with the laser beam LB, a desired area in the resin layer 270S can be selectively removed. The portion of the resin layer 270S covering the first light emitting structure 100A, the portion covering the second light emitting structure 100B, and the portion covering the bridging member 250A are respectively referred to as the first resin, the second resin, and the third resin. Here, at least a portion of the first resin, a portion of the second resin, and a portion of the third resin in the resin layer 270S are removed. Figure 8 As shown, a resin layer 270A having a first groove G1, a second groove G2, and a third groove G3 can be formed on the side of the structure on the support body 400 opposite to the support body 400. By forming the resin layer 270A, a cover 120 that covers the first light emitting element 110A, the second light emitting element 110B, and the jumper element 250 can be obtained. In this example, the cover 120 can be said to be a light reflective structure including the reflective resin member 160A, the reflective resin member 160B, and the reflective resin member 260A in part.

[0131] In the process of forming the first groove G1, the second groove G2, and the third groove G3, the portion of the first resin located on the first electrode 111A, the portion of the second resin located on the first electrode 111B, and the portion of the third resin located on the first terminal 251A and the portion located on the second terminal 252A are removed. That is, laser light is irradiated in such a manner that at least a portion of the first electrode 111A and at least a portion of the second electrode 112A of the first light-emitting element 110A, at least a portion of the first electrode 111B and at least a portion of the second electrode 112B of the second light-emitting element 110B, and at least a portion of the first terminal 251A and at least a portion of the second terminal 252A of the jumper member 250A are exposed. At this time, a portion of the surface of the electrode of the light-emitting element and / or a portion of the surface of the terminal of the jumper element may be removed together with a portion of the resin layer 270S.

[0132] When the first groove G1, the second groove G2, and the third groove G3 are formed by laser irradiation, for example, the laser beam may be repeatedly scanned in one direction in the XY plane of the drawing. By such irradiation, a plurality of fine grooves extending in the scanning direction may be formed. The first groove G1, the second groove G2, and the third groove G3 may be formed by arranging these fine grooves in a direction different from the scanning direction.

[0133] By overlapping a portion of the laser spots, for example, by irradiating the laser pulses in directions different from both the X direction and the Y direction in the drawing, the first groove G1, the second groove G2, and the third groove G3 can be formed. Of course, the scanning direction of the laser beam is arbitrary, and the scanning direction of the laser beam can be consistent with the X direction or the Y direction. An example of the laser irradiation conditions is as follows.

[0134] Laser peak wavelength: 532nm

[0135] Laser output: 2.4W

[0136] Pulse width: 100 nanoseconds

[0137] Number of cycles: 50Khz

[0138] Feed speed: 200mm / s

[0139] Focal length: 0μm

[0140] Micro groove pitch: 15μm or 30μm

[0141] The extending directions of the first groove G1, the second groove G2, and the third groove G3 are not restricted by the scanning direction of the laser beam. That is, a high degree of freedom can be obtained in the design of the shapes of the first groove G1, the second groove G2, and the third groove G3 and the wiring formed inside these grooves when viewed from above. In addition, by forming the first groove G1, the second groove G2, and the third groove G3 in the form of a collection of fine grooves, fine concavo-convex shapes are formed at the bottom of these grooves, as a result, a stronger anchoring effect can be presented between the cover 120 and the first wiring 210 and the second wiring 220 described later.

[0142] After multiple laser scans along one direction, the bottom of the first groove G1, the second groove G2 and the third groove G3 can be further irradiated with laser in different irradiation patterns. For example, after the first laser scan along one direction, a second laser scan along a different direction can be further performed to form a plurality of fine grooves intersecting with the plurality of fine grooves formed by the first laser scan. Alternatively, laser irradiation can be performed in a dot pattern after the first laser scan. Thus, a plurality of relatively deep recesses, such as dot-shaped recesses, can be formed at the bottom of the first groove G1, the second groove G2 and the third groove G3. Here, "different irradiation patterns" in this specification is not limited to actions in which the trajectory of movement of the laser point is different, and can be interpreted as actions that make the trajectory of movement of the laser point (or the trajectory of relative movement of the laser head relative to the workbench) the same between the first laser irradiation process and the second laser irradiation process, and make the output of the laser, pulse interval, etc. different from each other. By performing further laser irradiation with a second irradiation pattern different from the first irradiation pattern, the anchoring effect can be improved.

[0143] It should be noted that in the embodiment of the present disclosure, before the first groove G1, the second groove G2, and the third groove G3 are formed, the electrodes of the light-emitting element (the first electrodes 111A, 111B, the second electrodes 112A, 112B) and the terminals of the jumper element (the first terminal 251A and the second terminal 252A) are not necessarily required to be exposed to the outside. For example, the electrodes of the light-emitting element and the terminals of the jumper element may be covered by a white resin layer or the like before laser irradiation. As long as the positions of the electrodes of the light-emitting element and the terminals of the jumper element can be detected by image recognition or the like, the resin layer 270S may be, for example, a white resin sheet or the like.

[0144] like Figure 8 As shown, the first groove G1 is provided across the first resin and the third resin, and the second groove G2 is provided across the second resin and the third resin. At least a portion of the third groove G3 is formed in the third resin, including a portion extending between the first groove G1 and the second groove G2 when viewed from above. Figure 8As shown, at least a portion of the first electrode 111A of the first light emitting structure 100A and at least a portion of the first terminal 251A of the jumper component 250A are exposed in the first groove G1. Also, at least a portion of the first electrode 111B of the second light emitting structure 100B and at least a portion of the second terminal 252A of the jumper component 250A are exposed in the second groove G2.

[0145] (First Wiring Forming Step)

[0146] Next, the first groove G1 and the second groove G2 are filled with the first conductive material to form a first wiring ( Figure 3 Step S2). Here, Fig. 9 As schematically shown in FIG. 1 , an example is shown in which the conductive paste 20 as the first conductive material is arranged inside the first groove G1 and the second groove G2 by printing using a squeegee 390 .

[0147] As the conductive paste 20, a material in which particles of Au, Ag, Cu, etc. are dispersed in a matrix material such as epoxy resin can be used. For example, a known Au paste, Ag paste, or Cu paste can be used as the conductive paste 20. The conductive paste 20 may contain a solvent. Instead of the conductive paste 20, an alloy material containing copper powder in a Sn-Bi solder may be used as the conductive material.

[0148] The conductive paste 20 is applied to the inside of the first groove G1 and / or the second groove G2, or to the resin layer 270A, such as Fig. 9 The scraper 390 is moved on the surface of the resin layer 270A as indicated by the thick arrow MV. At this time, part of the conductive paste 20 enters the first groove G1 and the second groove G2. That is, the first groove G1 and the second groove G2 are filled with the conductive paste 20.

[0149] Then, the conductive paste 20 disposed inside the first groove G1 and the second groove G2 is cured by heating or light irradiation. Figure 2 As shown in the example, the first wiring 210 including the first portion 211 having a shape matching the shape of the first groove G1 and the second portion 212 having a shape matching the shape of the second groove G2 in a plan view can be formed by the conductive paste 20. In this example, by curing the conductive paste 20, the first portion 211 of the first wiring 210 is formed inside the first groove G1, and the second portion 212 of the first wiring 210 is formed inside the second groove G2.

[0150] (Second Wiring Forming Step)

[0151] In this example, the second conductive material is filled into the third groove G3 in parallel with the first conductive material being filled into the first groove G1 and the second groove G2 by printing using a scraper 390. Here, the conductive paste 20 that is the same as the first conductive material is used as the second conductive material. By curing the conductive paste 20 that is the second conductive material arranged in the third groove G3, the second wiring 220 ( Figure 3 It should be noted that there is no particular limitation on the order of filling the first groove G1 and the second groove G2 with the first conductive material and filling the third groove G3 with the second conductive material.

[0152] The second wiring 220 is spatially separated by the resin layer 270A, thereby being electrically separated from the first wiring 210. In addition, here, an example of using the same conductive paste 20 as the second conductive material and the first conductive material is described. However, it is obvious that a material different from the first conductive material can also be used as the second conductive material. Using the same material as the second conductive material and the first conductive material can make it easy to perform the first wiring forming process and the second wiring forming process at the same time. By performing the first wiring forming process and the second wiring forming process at the same time, the light-emitting device 200 can be manufactured more efficiently.

[0153] It should be noted that the method of applying the conductive paste 20 is not limited to the method using a scraper, and may also be various printing methods such as spin coating, dip coating, screen printing, offset printing, flexographic printing, gravure printing, micro-contact printing, inkjet, nozzle printing, and aerosol jet. Of course, the conductive paste 20 may also be applied to the first groove G1, the second groove G2, and the third groove G3 by methods other than printing.

[0154] In this example, the conductive paste 20 is applied to the inside of the first groove G1, the second groove G2, and the third groove G3 by printing using a scraper 390. The portion of the applied conductive paste 20 that is higher than the surface of the resin layer 270A is removed by the movement of the scraper 390. Therefore, the position of the surface of the first wiring 210 and the surface of the second wiring 220 is basically consistent with the surface of the resin layer 270A, in other words, the position of the lower surface of the covering portion 120. Moreover, an additional grinding process can be performed after the conductive paste 20 is cured as needed. For example, the surface of the cured conductive paste 20 and the surface of the resin layer 270A can be ground using a grinding stone. By grinding, the grinding surface, i.e., the surface of the first wiring 210 and the surface of the second wiring 220, can be made consistent with the lower surface 200b of the light-emitting device 200. Furthermore, the residue of the conductive paste 20 attached to the surface of the resin layer 270A can be removed. A copper plating layer or a nickel-gold plating layer can be formed on the cured conductive paste 20 as needed. Through the above process, a conductive paste 20 having the same surface as the conductive paste 20 can be obtained. Figure 1-2 The lighting device 200 shown is constructed in the same manner.

[0155] (Variation of the method for manufacturing a light emitting device)

[0156] A modified example of the method for manufacturing a light emitting device is described below. In the above example, a resin layer 120T is formed to integrally cover the first light emitting element 110A, the second light emitting element 110B, and the jumper 250A. After the electrodes (first electrodes 111A, 111B, second electrodes 112A, 112B) of the light emitting element and the terminals (first terminals 251A and second terminals 252A) of the jumper are exposed by polishing or the like, a resin layer 270S is arranged to cover these electrodes and terminals. However, as described below, it is not necessary to further arrange a resin layer 270S on the resin layer 120T in the embodiment of the present disclosure.

[0157] Fig.10 The manufacturing process in a modified example is schematically shown. In the example described here, the process before forming the resin layer 120T can be basically the same as the above example. Figure 6 In the example described above, a portion of the resin layer 120T is removed from the side opposite to the support body 400 by grinding or the like. Fig.10The electrodes of the light-emitting element (first electrodes 111A, 112A, second electrodes 112A, 112B) and the terminals of the jumper (first terminal 251A and second terminal 252A) shown may be covered by the resin layer 120T. In other words, a portion of the resin layer 120T remains on the electrodes of the light-emitting element and the terminals of the jumper. The distance from the surface of the electrode of the light-emitting element or the surface of the terminal of the jumper to the surface of the resin layer 120T after grinding (grinding surface) may be, for example, in the range of 5 μm or more and 100 μm or less.

[0158] Then, for example, with reference Figure 8 In the example described, a portion of the resin layer 120T is removed from the side opposite to the support 400 by laser irradiation. Here, the portion of the resin layer 120T covering the first light emitting structure 100A, the portion covering the second light emitting structure 100B, and the remaining portion are respectively referred to as the first resin, the second resin, and the third resin. Fig.11 As shown, for example, a laser etching device 500 is used to remove a portion of the first resin, a portion of the second resin, and a portion of the third resin by scanning with a laser beam LB. Figure 8 In the example shown in the figure, the first groove G1, the second groove G2 and the third groove G3 are formed on the side opposite to the support body 400, and the same Figure 1 At least a portion of the first electrode 111A of the first light emitting structure 100A and at least a portion of the first terminal 251A of the jumper component 250A are exposed in the first groove G1, and at least a portion of the first electrode 111B of the second light emitting structure 100B and at least a portion of the second terminal 252A of the jumper component 250A are exposed in the second groove G2. Figure 8 The examples shown are the same.

[0159] Here, by removing a portion of the third resin, a reflective resin member 260B covering at least the bridging member 250A is formed on the support body 400. The reflective resin member 260B has a third groove G3 on the surface located on the opposite side from the support body 400. In other words, the reflective resin member 260B includes a portion located in the -Z direction in the drawing relative to the surface of the terminals of the bridging element (the first terminal 251A and the second terminal 252A in this example). And, in this example, as shown in FIG. Fig.11As schematically shown in FIG. 1 , a portion of the material of the resin layer 120T includes a portion located in the -Z direction in the drawing relative to the surface of the electrode of the light-emitting element. For example, focusing on the first resin covering the first light-emitting structure 100A, the first resin includes a portion located in the -Z direction in the drawing relative to the surface of the first electrode 111A and the second electrode 112A of the first light-emitting element 110A. In the case where the material of the resin layer 120T is the same as the material of the reflective resin component 160A, there is a case where a clear boundary cannot be confirmed between the portion of the first resin located in the -Z direction in the drawing relative to the surface of the first electrode 111A and the second electrode 112A and the reflective resin component 160A. In such a case, the portion of the first resin located in the -Z direction in the drawing relative to the surface of the first electrode 111A and the second electrode 112A can be regarded as a portion of the reflective resin component 160A. Similarly, the portion of the second resin located in the -Z direction in the drawing relative to the surface of the first electrode 111B and the second electrode 112B of the second light-emitting element 110B can be regarded as a portion of the reflective resin component 160B.

[0160] Next, with reference Fig. 9 The examples described are the same as Fig.12 As shown, the conductive paste 20 is placed inside the first and second grooves G1 and G2 by printing, for example. At this time, the first conductive material can be placed inside the first and second grooves G1 and G2 and the second conductive material can be placed inside the third groove G3 at the same time.

[0161] Thereafter, the conductive paste 20 disposed inside the first groove G1, the second groove G2, and the third groove G3 is cured by heating or light irradiation, thereby forming a first wiring 210 having a shape matching the shape of the first groove G1 and the second groove G2 in a plan view and a second wiring 220 having a shape matching the shape of the third groove G3 in a plan view by the conductive paste 20. After the conductive paste 20 is cured, the surface of the cured conductive paste 20 may be polished, a plating layer may be formed on the surface of the cured conductive paste 20, etc. as needed.

[0162] By separating from the support body 400, Fig.13 The light emitting device 200B shown. Fig.13 In the illustrated structure, the cover 120 includes, in part, a reflective resin member 160A covering the first light emitting element 110A, a reflective resin member 260B covering the bridge member 250A, and a reflective resin member 160B covering the second light emitting element 110B.

[0163] Fig.14 Another modified example of the method for manufacturing a light emitting device is schematically shown. Figure 4Compared with the examples described in Fig.14 In the example shown, as the bridging element 250, a bridging component 250B including a main body 255B is disposed between the first light emitting structure 100A and the second light emitting structure 100B. Here, the main body 255B is a component having conductivity at least on the surface opposite to the support 400. The main body 255B may be a conductive component such as a metal plate. Fig.14 As shown by the middle dotted line, in this example, the surface of the main body 255B on the opposite side of the support body 400 (hereinafter referred to as the "lower surface 250b") is located lower than the lower surfaces of the first light-emitting structure 100A and the second light-emitting structure 100B.

[0164] After the first light emitting structure 100A, the second light emitting structure 100B, and the bridging member 250B are arranged on the support 400, a resin material is applied to the support 400 so as to cover the entirety of the light emitting structure 100A, the second light emitting structure 100B, and the bridging member 250B. By curing the resin material, Fig.15 As shown in FIG. 1 , a resin layer 120T is formed in such a manner as to cover the entirety of the bridge member 250B. The thickness of the resin layer 120T is reduced to a predetermined height by grinding or the like as required. By this process, the entire bridge member 250B is covered with the material of the resin layer 120T (covering process). Fig.10 In the example described above, the electrodes of the light emitting element (the first electrodes 111A and 112A, and the second electrodes 112A and 112B) are covered with the resin layer 120T.

[0165] Next, the above-mentioned groove forming process is performed. Here, Fig.16 As schematically shown, the surface of the resin layer 120T is scanned by the laser beam LB to form the first groove G1, the second groove G2, and the third groove G3. At this time, the first groove G1 and the second groove G2 are formed in a shape in which at least a portion of each overlaps with the bridging member 250B in a plan view. In addition, at this time, for example, in parallel with the formation of the first groove G1, the second groove G2, and the third groove G3, the first hole 120s and the second hole 120t reaching the main body 255B of the bridging member 250B are formed in the resin layer 120T (hole forming step).

[0166] The first hole 120s is provided at a position overlapping with the end of the lower surface 250b of the bridging member 250B in a plan view, while the second hole 120t is provided at a position closer to the first electrode 111B of the second light emitting element 110B than the first hole 120s. In addition, the formation of the first hole 120s and the second hole 120t may be performed in parallel with the formation of the first groove G1, the second groove G2, and the third groove G3, or may be performed after the formation of the first groove G1 and the second groove G2. In the latter case, the first hole 120s and the second hole 120t are located inside the first groove G1 and the second groove G2. By forming the first hole 120s and the second hole 120t, a reflective resin member 260C covering the bridging member 250B is formed from a part of the resin layer 120T, and as a result, a covering portion 120 covering the first light emitting element 110A, the second light emitting element 110B, and the bridging member 250B is formed on the support body 400. In this example, the reflective resin member 260C includes a supporting member 280 in a part thereof.

[0167] Next, the first wiring forming step and the second wiring forming step are performed. For example, the first groove G1, the second groove G2, and the third groove G3 are filled with the conductive paste 20 using the scraper 390. Fig.17 As schematically shown, the inside of the first hole 120s and the inside of the second hole 120t may be filled with the conductive paste 20 .

[0168] Thereafter, the conductive paste 20 is cured. The first wiring 210 is formed inside the first groove G1 and the second groove G2, and the second wiring 220 is formed inside the third groove G3 by curing the conductive paste 20. At this time, the portion of the conductive paste 20 located inside the first hole 120s is cured, thereby forming the first via 251B inside the first hole 120s, and the portion of the conductive paste 20 located inside the second hole 120t is cured, thereby forming the second via 252B inside the second hole 120t (via forming step).

[0169] like Fig.17 As shown, the first via 251B occupies the interior of the first hole 120s, and the second via 252B occupies the interior of the second hole 120t. The first via 251B and the second via 252B are connected to the jumper 250B and function as the first terminal and the second terminal of the jumper 250B, respectively. These first terminals and the second terminals are electrically connected to each other via the body 255B. That is, by forming the first via 251B and the second via 252B, a jumper element having the first via 251B and the second via 252B as terminals can be formed inside the cover 120.

[0170] It is not necessary to perform the formation of the first via hole 251B and the second via hole 252B in parallel with the formation of the first wiring 210. For example, after the first hole 120s and the second hole 120t are formed, the first via hole 251B and the second via hole 252B may be formed by printing, sputtering, etc., and then the first wiring 210 may be formed. By forming the terminal of the jumper element after forming the cover 120, it is possible to form the intersection of the wiring using a common member such as a metal plate, without using a jumper member.

[0171] The subsequent steps are the same as those in the previous example and thus the description is omitted. Fig.17 The light emitting device 200C shown in FIG. 1 includes, in part, a reflective resin member 160A covering the first light emitting element 110A, a reflective resin member 260C covering the bridge member 250B, and a reflective resin member 160B covering the second light emitting element 110B.

[0172] As can be understood from the above examples, in the manufacturing method of the embodiment of the present disclosure, as a jumper element, a circuit element having a main body including a conductive portion and a terminal connected to the conductive portion and arranged separately from each other can be widely used. For example, a Zener diode as a protection element can be used as a jumper element. Alternatively, as described below, a so-called jumper chip can be used to form a crossover between the first wiring 210 and the second wiring 220.

[0173] Fig.18 An example of a jumper chip as a jumper element is shown. Fig.18 The jumper chip 250C shown includes a plate-shaped base 25 formed of ceramics such as alumina, a conductive layer 26 provided on one main surface of the base, and a first terminal 251C and a second terminal 252C arranged at the end of the base 25. As shown in the figure, the first terminal 251C is located at one end of the base 25, and the second terminal 252C is located at the end of the base 25 opposite to the first terminal 251C. The first terminal 251C and the second terminal 252C are respectively formed on the base 25 from the upper surface 25a to the lower surface 25b of the base 25 in a manner covering the side surface 25c of the base 25, and are electrically connected to the conductive layer 26 provided on the lower surface 25b of the base 25. Fig.18 In the illustrated structure, the conductive layer 26 is selectively formed on the lower surface 25 b of the two main surfaces of the base 25 , but a structure in which the conductive layer 26 is provided on both surfaces of the base 25 may also be employed.

[0174] For example, the above-mentioned bridging member 250A may be replaced by Fig.18However, in general, the jumper chips sold on the market have a smaller thickness than light-emitting structures such as LED packages. Fig.19 As shown in the example, the jumper chips 250C can be bonded to a thickness adjustment sheet 280C such as a resin sheet having a predetermined thickness, and the sheet 280C can be cut into units of jumper chips 250C. It should be noted that, here, the lower surface 25b of the base 25 is directed toward the side opposite to the sheet 280C by an adhesive or the like (in the Fig.19 (not shown) the jumper chip 250C is fixed to the sheet 280C.

[0175] After the jumper chip 250C is fixed to the sheet 280C, the sheet 280C is cut into a predetermined size so that each sheet contains the jumper chip 250C. Fig.19 The sheet 280C is cut at the position indicated by the thick broken line. By fixing the jumper chip 250C to the resin sheet in advance, the arrangement of the jumper chip 250C on the support body 400 becomes easy.

[0176] After the sheet 280C is cut, Fig. 20 As shown, the jumper chip 250C fixed to the resin sheet is arranged on the support body 400 together with the first light emitting structure 100A and the second light emitting structure 100B. Here, the resin sheet supporting the jumper chip 250C realizes the function of the above-mentioned support member 280. The subsequent steps can be, for example, the same as those described in reference to Figures 5 to 9 By placing a resin sheet between the jumper chip 250C and the support body 400, as shown in FIG. Fig. 20 As shown by the middle dotted line, the positions of the surfaces of the first terminal 251C and the second terminal 252C can be roughly aligned with the positions of the surfaces of the electrodes of the light emitting element (the first electrodes 111A, 111B and the second electrodes 112A, 112B).

[0177] According to such a process, after the first light emitting element 110A, the second light emitting element 110B, and the jumper chip 250C are covered with the resin layer 120T, the thickness of the resin layer 120T is reduced, and the surfaces of the first terminal 251C and the second terminal 252C are easily exposed from the resin layer 120T together with the electrodes of the light emitting elements. That is, the electrical connection between the first wiring 210 and the jumper chip 250C can be obtained more reliably.

[0178] By using a jumper chip generally available on the market, it is possible to obtain the advantage of being able to form a crossover between the first wiring 210 and the second wiring 220 with an inexpensive component. It is also possible to use a surface-insulated Zener diode or varistor, or a functional component for dealing with electromagnetic interference (EMI), such as an LC filter, as the jumper chip 250C. By applying such a functional component to a jumper element in the light-emitting device 200, electrostatic breakdown of the light-emitting element can be avoided.

[0179] It should be noted that in this example, during the laser irradiation, depending on the laser irradiation conditions, the base 25 of the jumper chip 250C may be irradiated with the laser when a portion of the resin layer 120T is removed. However, the base 25 of the jumper chip 250C is made of ceramic or the like, and under irradiation conditions to the extent that the resin can be removed, for example, even if exposed to laser irradiation, the electrical connection between the first terminal 251C and the second terminal 252C is hardly damaged.

[0180] Of course, instead of using an inexpensive general-purpose component, a jumper component corresponding to the wiring design or the like may be prepared in advance by manufacturing as the jumper component 250 to be arranged between the light-emitting structures. Fig.21 Another example of a jumper member that can be used as the jumper member 250 is shown.

[0181] Fig.21 The illustrated jumper 250D includes a conductor portion 27 formed of metal or the like and an insulating portion 28 covering the conductor portion 27. The insulating portion 28 is formed of, for example, a light-reflective resin composition similar to the material of the reflective resin portion 160A and the reflective resin portion 160B. The conductor portion 27 includes two portions that are bent inside the insulating portion 28 and extend from the upper surface 250a to the lower surface 250b of the jumper 250D. The two respective portions are exposed from the lower surface 250b of the jumper 250D. Here, the portions of the conductor portion 27 that extend from the upper surface 250a to the lower surface 250b of the jumper 250D are referred to as first terminals 251D and second terminals 252D. The conductor portion 27 of the jumper 250D includes a main body portion 255D that connects the first terminal 251D and the second terminal 252D.

[0182] Fig. 22An exemplary method for manufacturing a light emitting device using a bridging member 250D is schematically shown. As in the examples described above, after the first light emitting element 110A, the second light emitting element 110B, and the bridging member 250D are prepared, they are arranged on the support 400. At this time, the bridging member 250D is temporarily fixed to the support 400 so that the upper surface 250a of the bridging member 250D faces the upper surface 400a of the support 400. According to this embodiment, the distance from the upper surface 250a of the bridging member 250D to the main body 255D of the conductor part 27 can be arbitrarily adjusted, and when the first light emitting element 110A, the second light emitting element 110B, and the bridging member 250D are arranged on the support 400, the position of the lower surface 250b of the bridging member 250D can be roughly aligned with the position of the lower surface of the light emitting structure (here, the first light emitting structure 100A and the second light emitting structure 100B). In other words, without the support member 280 , the positions of the surfaces of the first terminal 251D and the second terminal 252D can be substantially aligned with the positions of the surfaces of the electrodes of the light emitting element (the first electrodes 111A, 111B and the second electrodes 112A, 112B).

[0183] After the first light emitting element 110A, the second light emitting element 110B and the bridging member 250D are arranged on the support body 400, Figure 5 , Figure 6 In the example described above, the resin layer 120T covering them is formed in the same manner, and the thickness of the resin layer 120T is reduced by grinding, for example, until the electrodes of the light-emitting element are exposed from the ground surface. At this time, since the positions of the surfaces of the first terminal 251D and the second terminal 252D are roughly the same as the positions of the surfaces of the electrodes of the light-emitting element, Fig.23 As shown, the surfaces of the first terminal 251D and the second terminal 252D are also exposed from the ground surface. The ground resin layer 120T includes a reflective resin member 260C covering the bridge member 250D in a part thereof.

[0184] The following steps can be compared with the reference Figure 7 to Figure 9 For example, a resin layer 270S is disposed on the grinding surface of the resin layer 120T, and a portion of the resin layer 270S is removed by laser irradiation or the like, thereby forming the first groove G1, the second groove G2, and the third groove G3. Fig.24 As shown, a portion of the surface of the first electrode 111A of the first light-emitting element 110A and a portion of the surface of the first terminal 251D of the jumper component 250D are exposed inside the first groove G1, and a portion of the surface of the first electrode 111B of the second light-emitting element 110B and a portion of the surface of the second terminal 252D of the jumper component 250D are exposed inside the second groove G2.

[0185] Thereafter, the first groove G1, the second groove G2, and the third groove G3 are filled with a conductive material to form the first wiring 210 and the second wiring 220. Thus, the first electrode 111A of the first light emitting element 110A and the first electrode 111B of the second light emitting element 110B are electrically connected to each other via the first wiring 210 and the conductor portion 27 of the jumper 250D.

[0186] Here, the distance from the lower surface 250b of the bridging member 250D to the main body 255D of the conductor portion 27 ( Fig.21 It is beneficial for the distance (indicated by the double-headed arrow Ht) to be greater than 50 μm. Fig.24 It can be understood that the portion of the third groove G3 extending between the first groove G1 and the second groove G2 is formed at a position overlapping with the main body 255D of the jumper 250D in a plan view. Therefore, in the process of removing a portion of the resin layer 270S, a portion of the insulating portion 28 of the jumper 250D can be removed. If the distance from the lower surface 250b of the jumper 250D to the main body 255D of the conductor portion 27 is 50 μm or more, even in such a case, the possibility that the bottom of the third groove G3 reaches the main body 255D of the jumper 250D can be reduced. In other words, it is easy to avoid short circuit between the first wiring 210 and the second wiring 220.

[0187] Thus, according to the embodiment of the present disclosure, a high degree of freedom can be obtained in the design of wiring by using a jumper element of a desired shape, and high adaptability can be obtained with respect to changes in the number or arrangement of, for example, light-emitting structures. Therefore, it is basically unnecessary to prepare a wiring substrate having wiring corresponding to each arrangement of a plurality of light-emitting elements. Therefore, the manufacturing cost of the light-emitting device can be reduced. In addition, in the existing structure in which a plurality of light-emitting elements having positive and negative electrodes are arranged on a wiring substrate, as the number of light-emitting elements mounted increases, the wiring on the wiring substrate increases, and thus a large space is required on the wiring substrate. In contrast, according to the embodiment of the present disclosure, it is easier to form a wiring pattern including a cross between positive-side wiring and negative-side wiring on the light-emitting device side instead of on the wiring substrate side, so it is easier to gather terminals for connection to an external power supply at one location of the light-emitting device or wiring substrate. The above-mentioned embodiments are merely illustrative, and various combinations can be implemented as long as there is a technical contradiction.

[0188] Industrial Applicability

[0189] According to the embodiments of the present disclosure, a substrate having a complex wiring pattern is basically required, and a light emitting device that is relatively easy to install can be provided. The embodiments of the present disclosure can be widely applied to various lighting light sources, vehicle-mounted light sources, backlight light sources, etc.

Claims

1. A method for manufacturing a light emitting device, characterized in that: Include: a groove forming step of removing a portion of a first resin covering a first light emitting structure, a portion of a second resin covering a second light emitting structure, and a portion of a third resin covering a circuit element, thereby forming a first groove spanning the first resin and the third resin, a second groove spanning the second resin and the third resin, and a third groove including a portion extending between the first groove and the second groove in a plan view, wherein the first light emitting structure includes a first light emitting element including a first electrode, the second light emitting structure includes a second light emitting element including a second electrode, the circuit element includes a conductor portion, at least a portion of the first electrode and a portion of the conductor portion of the circuit element are exposed inside the first groove, at least a portion of the second electrode and another portion of the conductor portion of the circuit element are exposed inside the second groove, and the third groove is a groove formed in the third resin; A first wiring forming step of filling the first groove and the second groove with a first conductive material to form a first wiring, wherein the first wiring includes a plurality of independent parts; a second wiring forming step of filling the interior of the third groove with a second conductive material to form a second wiring electrically separated from the first wiring; a support body preparation step of preparing a support body having an upper surface before the groove forming step; An element configuration step, between the support body preparation step and the groove forming step, configuring the first light-emitting element and the second light-emitting element on the upper surface side of the support body with the first electrode and the second electrode facing the side opposite to the support body, and configuring the conductor portion of the circuit element on the upper surface side of the support body and between the first light-emitting element and the second light-emitting element.

2. The method for manufacturing a light emitting device according to claim 1, The first wiring forming step and the second wiring forming step are performed together.

3. The method for manufacturing a light emitting device according to claim 1, There is further a third resin forming step, in which, between the element configuration step and the groove forming step, after the upper surface of the support body, the area between the first light-emitting element and the circuit element, and the area between the second light-emitting element and the circuit element are filled with a resin material, the resin material is cured to form the third resin.

4. The method for manufacturing a light emitting device according to any one of claims 1 to 3, The conductor portion of the circuit element includes a first terminal and a second terminal, The portion of the conductor portion exposed inside the first groove in the groove forming step is at least a portion of the surface of the first terminal, and the other portion of the conductor portion exposed inside the second groove in the groove forming step is at least a portion of the surface of the second terminal.

5. The method for manufacturing a light emitting device according to claim 3, The third resin forming step includes a step of covering the entire conductor portion of the circuit element with the third resin; The groove forming step further includes forming a first hole reaching the part of the conductor part of the circuit element and a second hole reaching the other part of the conductor part in the third resin. The first wiring forming step includes a step of forming a via hole inside each of the first hole and the second hole.

6. The method for manufacturing a light emitting device according to any one of claims 1 to 3, The element arrangement step includes a step of aligning the heights of a surface of the first electrode, a surface of the second electrode, the part, and the other part of the conductor part by interposing a support member between the upper surface of the support body and the conductor part of the circuit element.

7. A method for manufacturing a light-emitting device according to claim 1 or 2, The first resin, the second resin, and the third resin are each part of a single resin layer.

8. The method for manufacturing a light emitting device according to any one of claims 1 to 3, The first wiring forming step comprises: a step of disposing a first conductive paste as the first conductive material inside the first groove and the second groove by printing; a step of curing the first conductive paste.

9. The method for manufacturing a light emitting device according to any one of claims 1 to 3, The second wiring forming step comprises: a step of disposing a second conductive paste as the second conductive material inside the third groove by printing; a step of curing the second conductive paste.

10. The method for manufacturing a light emitting device according to any one of claims 1 to 3, The groove forming step includes a step of removing the portion of the first resin, the portion of the second resin, and the portion of the third resin by irradiating with laser light.

11. A light emitting device, characterized in that: have: A first light-emitting element comprising a first electrode of a first polarity and a second electrode of a second polarity different from the first polarity; A circuit element comprising a body portion, and a first terminal and a second terminal electrically connected to each other via the body portion; a first wiring of the first polarity connecting the first electrode of the first light emitting element and the first terminal of the circuit element; The second wiring of the second polarity is located in the same layer as the first wiring and includes a portion extending between the first terminal and the second terminal of the circuit element in a plan view; a second light-emitting element comprising a third electrode of the first polarity and a fourth electrode of the second polarity; The main body of the circuit element is arranged at a position spaced apart from an interface between the first wiring and the first electrode of the first light emitting element on a side opposite to the first wiring.

12. The light emitting device according to claim 11, further comprising a covering portion that covers both the first light emitting element and the circuit element, The first wiring includes a first portion and a second portion respectively arranged inside a first groove and inside a second groove provided on the first terminal and the second terminal side of the circuit element in the covering portion, The second wiring is arranged inside a third groove provided between the first groove and the second groove in the covering portion.

13. The light emitting device according to claim 11 or 12, A portion of the first wiring located between the first electrode of the first light emitting element and the first terminal of the circuit element in a plan view extends in a first direction, A portion of the second wiring located between the first terminal and the second terminal of the circuit element in a plan view extends in a second direction intersecting the first direction.

14. The light emitting device according to claim 12, The first groove, the second groove, and the third groove have a depth of 5 μm or more and 50 μm or less.

15. The light emitting device according to claim 12 or 14, The first portion connects the first electrode of the first light emitting element and the first terminal of the circuit element. The second portion connects the third electrode of the second light emitting element and the second terminal of the circuit element.

16. The light emitting device according to claim 15, The second wiring further includes a portion connecting the second electrode of the first light-emitting element and the fourth electrode of the second light-emitting element.

17. The light emitting device according to claim 11 or 12, Further possesses: a first protection component, located above the first light emitting element; The first wavelength conversion component is located between the first light emitting element and the first protective component.

18. The light emitting device according to claim 11 or 16, Further possesses: a second protection component, located above the second light emitting element; The second wavelength conversion component is located between the second light emitting element and the second protective component.

19. The light emitting device according to claim 17, The first protective member includes a light diffusion material.

20. The light emitting device according to claim 11 or 12, The first wiring and the second wiring have a thickness of 5 μm or more and 50 μm or less.

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