Automatic dispensing nozzle device and material pasting equipment

By designing an automatic material dispensing suction head device, and utilizing a combination of a vacuum suction head and an elastic material dispensing pressure head, the automatic separation and suction of materials in rows is achieved. This resolves the contradiction between efficiency and cost in fully automated material bonding processing, resulting in a high-efficiency, low-cost bonding effect.

CN112591459BActive Publication Date: 2025-10-28SHENZHEN HUIKE PRECISION IND
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Patent Information

Application Number
CN202011524365.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-22
Publication Date
2025-10-28
Estimated Expiration
2040-12-22

AI Technical Summary

Technical Problem

In existing technologies, it is difficult to balance high efficiency and low cost in fully automated material bonding processes for connected materials. Manual breaking leads to low efficiency, while the separation of individual materials generates waste, resulting in high costs.

Method used

Design an automatic material dispensing suction head device that combines a vacuum suction head and an elastic dispensing pressure head. The elastic dispensing pressure head first presses down on the adjacent material, while the vacuum suction head picks up the target material, thus achieving automatic separation of the target material from the adjacent material.

Benefits of technology

It has achieved fully automated material bonding processing for connected materials, improved bonding efficiency, reduced material costs, and resolved the contradiction between efficiency and cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses an automatic material dispensing suction head device and a material application equipment, suitable for picking up target material from a row of materials. The target material has an adjacent material on each side. The automatic material dispensing suction head device includes a suction head base, a vacuum suction head, and two elastic dispensing pressure heads. The vacuum suction head is located at the bottom of the suction head base; the two elastic dispensing pressure heads are located on the suction head base and on either side of the vacuum suction head. Each elastic dispensing pressure head has a pressure surface at its bottom; the height of the pressure surface is lower than the height of the vacuum suction head. When the vacuum suction head adsorbs onto the target material, the pressure surfaces on the two elastic dispensing pressure heads elastically press against the two adjacent materials. According to the embodiments of this invention, the automatic material dispensing suction head device can automatically pick up materials from a row without manual breaking and dispensing, achieving fully automated material application processing with high efficiency and low material cost.
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Description

Technical Field

[0001] This invention relates to a material application equipment, and more particularly to an automatic material dispensing suction head device and a material application equipment. Background Technology

[0002] In the manufacturing of electronic products, the mounting of auxiliary materials is often involved, such as mounting some metal sheets. In the process of mounting auxiliary materials, the mounting processing method is different depending on the form of the auxiliary materials (blocked materials and single materials), and the efficiency of the mounting processing is also different.

[0003] Reference Figure 6 As shown, for the row of materials 40, each material is connected in a row in sequence, and there is a break line H40 between two adjacent materials 401. During feeding, they can be manually broken to form individual materials 401, and then the individual materials 401 are used for feeding. Since the processing of this row of materials 40 is formed by processing the break line H40 on a whole piece of raw material, there is basically no waste, which makes the utilization rate of raw materials high and the material cost low. However, this row of materials 40 needs to be manually broken during feeding, so it is difficult to achieve fully automated material bonding processing and reduces the material bonding efficiency.

[0004] Reference Figure 7 As shown, for individual material 41, the individual material 41 can be directly picked up and fed by a robotic arm to achieve fully automated material bonding processing. Therefore, the material bonding efficiency is high. However, when processing this individual material 41, the whole raw material is divided into pieces. A lot of waste material 411 is generated when dividing the raw material, which leads to low raw material utilization and high material cost. The high material cost will seriously hinder the automated production conversion and lose the fundamental meaning of automation in saving manpower and costs. Summary of the Invention

[0005] The present invention aims to at least partially solve one of the technical problems in the related art. Therefore, the object of the present invention is to provide an automatic dispensing suction head device and a material application equipment.

[0006] To achieve the above objectives, an automatic dispensing suction head device according to an embodiment of the present invention is suitable for sucking up target material from a row of materials, wherein the target material has an adjacent material on each side, and the automatic dispensing suction head device includes:

[0007] Suction head base;

[0008] A vacuum suction head, wherein the vacuum suction head is disposed at the bottom of the suction head base;

[0009] Two elastic dispensing pressure heads are disposed on the suction head seat and located on both sides of the vacuum suction head, and each elastic dispensing pressure head has a pressure surface at its bottom;

[0010] The height of the pressure surface is lower than that of the vacuum suction head. When the vacuum suction head is adsorbed onto the target material, the pressure surfaces of the two elastic dispensing pressure heads elastically press against the two adjacent materials respectively.

[0011] According to the automatic dispensing suction head device provided in the embodiment of the present invention, two elastic dispensing pressure blocks are respectively located on both sides of the vacuum suction head, and the pressure surface of the elastic dispensing pressure blocks is lower than that of the vacuum suction head. When the suction head seat moves downward, the elastic dispensing pressure blocks first contact the two adjacent materials below, and as the suction head seat continues to descend, the elastic dispensing pressure blocks are compressed and thus maintain elastic pressure on the adjacent materials. Subsequently, the vacuum suction head contacts and adsorbs the target material. In this way, while the two elastic dispensing pressure blocks press down the adjacent materials on both sides of the target material, the vacuum suction head moves upward. At the same time, the vacuum suction head pulls the target material upward, while the elastic force provided by the two elastic dispensing heads acts downward on the two adjacent materials, causing the two adjacent materials to move downward. This achieves the separation of the target material from the adjacent materials and the suction of the target material. Thus, the automatic dispensing suction head device of this application can automatically pick up materials in rows without the need for manual breaking and dispensing, realizing fully automated material bonding processing. This solves the contradiction between bonding efficiency and material cost in related technologies, achieving the effect of high bonding efficiency and low material cost.

[0012] In addition, the automatic feeding suction head device according to the above embodiments of the present invention may also have the following additional technical features:

[0013] According to one embodiment of the present invention, the elastic dispensing head includes:

[0014] A pressure head is provided on the suction head seat and can slide vertically, and the pressure surface is located at the bottom of the pressure head;

[0015] An elastic component is disposed between the pressure head and the suction head seat to provide an elastic force so that the pressure head can float elastically in the vertical direction.

[0016] According to one embodiment of the present invention, the vacuum suction head includes:

[0017] A vacuum suction cup, wherein the vacuum suction cup is located at the bottom of the suction head base, and the bottom of the vacuum suction cup has an adsorption surface and an adsorption hole penetrating to the adsorption surface;

[0018] The suction head holder is equipped with a vacuum connector that communicates with the suction hole for connecting a vacuum pumping device.

[0019] According to one embodiment of the present invention, the vacuum suction head further includes:

[0020] A buffer head, which is made of elastic material, is located at the bottom of the suction head base, and the vacuum chassis is located at the bottom of the buffer head;

[0021] The buffer head has a vacuum channel that connects the vacuum connector and the adsorption hole.

[0022] According to one embodiment of the present invention, the bottom of the suction head holder is provided with a socket hole, and the buffer suction head includes:

[0023] The base has an adapter hole at its bottom;

[0024] The first sleeve portion is connected to the top of the base portion, and the sleeve portion is fitted with the sleeve hole to form a seal;

[0025] The top of the vacuum suction cup has an upwardly protruding second sleeve portion, which engages with the adapter hole to form a seal, and the vacuum channel extends between the base and the first sleeve portion.

[0026] According to one embodiment of the present invention, a first stepped surface is formed between the first socket portion and the base portion, and the first stepped surface abuts against the bottom of the suction head seat.

[0027] According to one embodiment of the present invention, there are two vacuum suction cups arranged side by side, and a limiting platform is provided on the bottom surface of the base;

[0028] The limiting platform is positioned higher than the vacuum suction cup. When the vacuum suction cup contacts the target material and compresses it a predetermined distance, the limiting platform abuts against the target material to limit further compression of the vacuum suction cup.

[0029] According to one embodiment of the present invention, the suction head holder is provided with two sliding holes, the two sliding holes are respectively located on both sides of the vacuum suction head, and the sidewall of the sliding hole has a second stepped surface;

[0030] The top of the pressure head has an upwardly protruding sliding part, which slides in conjunction with the sliding hole, and the side of the sliding part has a shoulder, which stops above the second step surface.

[0031] According to one embodiment of the present invention, the suction head base is provided with a positioning stop, the positioning stop includes a support arm and a stop block, the lower end of the support arm is fixed on the suction head base, the stop block fixes the upper end of the support arm, and the stop block is provided with a guide hole;

[0032] The elastic component includes a guide rod and a spring. The lower end of the guide rod is fixedly connected to the pressure head, and the upper end of the guide rod is slidably engaged with the guide hole. The spring is sleeved on the guide rod, with one end of the spring abutting against the pressure head and the other end of the spring abutting against the stop block.

[0033] On the other hand, the material application equipment according to an embodiment of the present invention has an automatic material dispensing suction head device as described above.

[0034] The bonding equipment provided according to the embodiments of the present invention has the above-described automatic dispensing suction head device, thus enabling fully automated bonding processing with high bonding efficiency and low material cost.

[0035] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the automatic material dispensing suction head device according to an embodiment of the present invention;

[0038] Figure 2 This is an exploded view of the automatic material dispensing suction head device according to an embodiment of the present invention;

[0039] Figure 3 This is a front view of the automatic material dispensing suction head device according to an embodiment of the present invention;

[0040] Figure 4 yes Figure 3 Sectional view at point AA;

[0041] Figure 5 This is a partial exploded view of the automatic material dispensing suction head device according to an embodiment of the present invention;

[0042] Figure 6 This is a structural diagram of the connected materials;

[0043] Figure 7 This is a schematic diagram of the structure formed by dividing and molding individual materials.

[0044] Figure label:

[0045] 10. Suction head base;

[0046] H101, socket hole;

[0047] H102, sliding hole;

[0048] S10, the second step surface;

[0049] 11. Positioning stop;

[0050] 111. Outrigger;

[0051] 112. Stop;

[0052] 12. Vacuum connector;

[0053] 20. Vacuum suction head;

[0054] 201. Vacuum suction cup;

[0055] 2011, Second Socket;

[0056] H2O, adsorption pores;

[0057] S20, adsorption surface;

[0058] H21, Vacuum Channel;

[0059] H201, adapter hole;

[0060] 202. Buffer head;

[0061] 2021, Base;

[0062] 2022, First Connection Part;

[0063] S202, First step surface;

[0064] 2023, Limiting platform;

[0065] 30. Flexible material distribution head;

[0066] 301. Pressure head;

[0067] 3011, Sliding part;

[0068] 3012, shoulder guard;

[0069] 302. Flexible components;

[0070] 3021, Guide rod;

[0071] 3022, Spring.

[0072] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0073] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0074] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," and "radial," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0075] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0076] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0077] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0078] The automatic dispensing suction head device and the material application equipment of the present invention will now be described in detail with reference to the accompanying drawings.

[0079] Reference Figures 1 to 5 As shown, the automatic feeding suction head device provided according to an embodiment of the present invention is suitable for sucking up target material from a row of materials, wherein the target material has an adjacent material on each side, for example... Figure 6 In the process of connecting materials, if one material 401 is taken as the target material, then the materials 401 on both sides of the target material 401 are adjacent materials. The automatic material dispensing suction head device includes a suction head seat 10, a vacuum suction head 20 and two elastic material dispensing pressure heads 30.

[0080] Specifically, the suction head holder 10 can be installed on a robotic arm, and the robotic arm can drive the suction head holder 10 to move, thereby realizing the transfer of materials after the automatic material dispensing suction head device picks them up.

[0081] The vacuum suction head 20 is located at the bottom of the suction head base 10. When the robotic arm drives the suction head base 10 to move, the vacuum suction head 20 can move with the suction head base 10. The vacuum suction head 20 can be connected to a vacuum pumping device. The vacuum pumping device is used to evacuate the vacuum suction head 20, so that when the vacuum suction head 20 comes into contact with the target material, a negative pressure adsorption effect is formed inside the vacuum suction head 20, thereby adsorbing the target material.

[0082] Two elastic dispensing heads 30 are disposed on the suction head seat 10 and located on both sides of the vacuum suction head 20. Each elastic dispensing head 30 has a pressure surface at its bottom. The height of the pressure surface is lower than that of the vacuum suction head 20. When the vacuum suction head 20 adsorbs onto the target material, the pressure surfaces on the two elastic dispensing heads 30 elastically press against the two adjacent materials.

[0083] In other words, the two elastic material dispensing heads 30 are located on both sides of the vacuum suction head 20. The elastic material dispensing heads 30 are elastic and can be compressed. The pressure surface at the bottom of the elastic material dispensing heads 30 is lower than the position of the vacuum suction head 20 in the vertical direction. During the material picking process, the elastic material dispensing heads 30 can be used to press down the adjacent materials on both sides of the target material on the row of materials, and then the vacuum suction head 20 can be used to pick up the target material to achieve the separation of the target material from the adjacent materials.

[0084] In practical applications, the materials are arranged in rows on a workbench, and the automatic dispensing suction head device is located above the workbench. During material handling, a robotic arm drives the suction head base 10 downwards, followed by the elastic dispensing pressure head 30 and the vacuum suction head 20. Because the elastic dispensing pressure head 30 is positioned lower than the vacuum suction head 20, it will first contact the adjacent material. As the suction head base 10 continues to descend, the elastic dispensing pressure head 30 is compressed by the upward reaction force of the adjacent material. In this compressed state, the elastic dispensing pressure head 30 maintains its elasticity against the adjacent material. As the suction head base 10 continues to descend, the vacuum suction head 20 and the target material... The target material comes into contact with and is adsorbed. Subsequently, the robotic arm can drive the suction head seat 10 to move upward in the opposite direction. At this time, on the one hand, the vacuum suction head 20 drives the target material upward through adsorption. On the other hand, as the elastic dispensing pressure head 30 moves upward, it gradually releases its elasticity. The pressure surface at the bottom of the elastic dispensing pressure head 30 generates a downward pushing force on the adjacent material, thereby keeping the adjacent material on the worktable. Finally, as the vacuum suction head 20 moves upward, it forces the target material to separate from the adjacent material. The vacuum suction head 20 can then pick up the target material and transfer it to the required position by the drive of the robotic arm to achieve automatic feeding.

[0085] According to the automatic dispensing suction head device provided in the embodiment of the present invention, two elastic dispensing pressure blocks are respectively located on both sides of the vacuum suction head 20, and the pressure surface of the elastic dispensing pressure head 30 is lower than that of the vacuum suction head 20. When the suction head seat 10 moves downward, the elastic dispensing pressure head 30 first contacts the two adjacent materials below, and as the suction head seat 10 continues to descend, the elastic dispensing pressure head 30 is compressed and thus maintains elastic pressure against the adjacent materials. Subsequently, the vacuum suction head 20 contacts and adsorbs the target material. In this way, when the two elastic dispensing pressure heads 30 press down the adjacent materials on both sides of the target material, the vacuum... When the suction head 20 moves upward, the vacuum suction head 20 pulls the target material upward, while the elastic force provided by the two elastic dispensing heads 30 acts downward on the two adjacent materials, causing the two adjacent materials to move downward. This achieves the separation of the target material from the adjacent materials and the suction of the target material. Thus, the automatic dispensing suction head device of this application can automatically pick up materials in rows without the need for manual breaking and dispensing, realizing fully automated material bonding processing. This solves the contradiction between bonding efficiency and material cost in related technologies, achieving the effect of high bonding efficiency and low material cost.

[0086] Reference Figures 1 to 5 As shown, in one embodiment of the present invention, the elastic dispensing pressure head 30 includes a pressure head 301 and an elastic component 302. The pressure head 301 is disposed on the suction head seat 10 and is slidable vertically, and the pressure surface is located at the bottom of the pressure head 301. The elastic component 302 is disposed between the pressure head 301 and the suction head seat 10 to provide an elastic force so that the pressure head 301 can float elastically in the vertical direction.

[0087] When the robotic arm drives the suction head 10 to move downward, the pressure surface at the bottom of the pressure head 301 comes into contact with the adjacent material on the worktable. As the robotic arm continues to drive the suction head 10 downward, relative sliding occurs between the pressure head 301 and the suction head 10. The elastic component 302 located between the pressure head 301 and the suction head 10 is compressed. The elastic effect provided by the elastic component 302 causes the pressure surface of the pressure head 301 to elastically press against the adjacent material, thereby compressing the adjacent material.

[0088] In this embodiment, the pressure head 301 is slidably connected to the suction head seat 10, ensuring that the pressure head 301 can slide relative to the suction head seat 10 in the vertical direction to compress the elastic component 302, thereby providing an elastic pressing effect and ensuring reliable material compression.

[0089] Reference Figures 2 to 5As shown, in one embodiment of the present invention, the vacuum suction head 20 includes a vacuum suction cup 201, wherein the vacuum suction cup 201 is located at the bottom of the suction head base 10, and the bottom of the vacuum suction cup 201 has an adsorption surface S20 and an adsorption hole H20 penetrating to the adsorption surface S20. The suction head base 10 is provided with a vacuum connector 12 communicating with the adsorption hole H20 for connecting a vacuum pumping device.

[0090] When the pressure surface at the bottom of the pressure head 301 comes into contact with the adjacent material on the worktable, as the suction head seat 10 continues to move downward, the vacuum suction head 20 can come into contact with the target material on the worktable. Then, the vacuum suction head 20 is evacuated by the vacuum pumping equipment, and a negative pressure is formed inside the vacuum suction head 20. The target material can be adsorbed by using this negative pressure.

[0091] In this embodiment, a vacuum suction cup 201 is used to contact and adsorb the target material. Tests have shown that the vacuum suction cup 201 has a strong adsorption effect on the target material and is in elastic contact, which can improve the separation rate of the target material from the adjacent material.

[0092] Reference Figures 2 to 5 As shown, in one embodiment of the present invention, the vacuum suction head 20 further includes a buffer head 202, which is made of an elastic material. The buffer head 202 is disposed at the bottom of the suction head base 10, and the vacuum base is disposed at the bottom of the buffer head 202. The buffer head 202 has a vacuum channel H21 that connects the vacuum connector 12 and the adsorption hole H20. The vacuum pumping device can connect to the adsorption hole H20 on the vacuum suction cup 201 through the vacuum connector 12 and the vacuum channel H21, thereby evacuating the adsorption hole H20.

[0093] In other words, the buffer head 202 is installed at the bottom of the suction head base 10, and the vacuum suction cup 201 is installed at the bottom of the buffer head 202. Since the buffer head 202 is made of an elastic material, such as conductive sponge, which is flexible and elastic, when the suction head base 10 descends, after the vacuum suction cup 201 comes into contact with the target material, the elastic buffering effect of the buffer head 202 can reduce the impact of the vacuum suction head 20 on the target material, prevent damage to the target material, and ensure that the vacuum suction cup 201 can tightly and reliably adsorb the target material. After testing, the vacuum suction head 20, which is composed of the combination of the buffer head 202 and the vacuum suction cup 201, has a significantly improved separation rate for separating the target material from adjacent materials, ensuring a separation rate of over 98%.

[0094] Reference Figures 4 to 5As shown, in one embodiment of the present invention, the bottom of the suction head base 10 is provided with a socket H101. The buffer suction head includes a base 2021 and a first socket 2022. The bottom of the base 2021 is provided with an adapter hole H201. The first socket 2022 is connected to the top of the base 2021. Preferably, the first socket 2022 and the base 2021 are integrally formed, and the first socket 2022 is sleeved with the socket H101 to form a seal.

[0095] The top of the vacuum suction cup 201 has an upwardly protruding second sleeve portion 2011, which is fitted with the adapter hole H201 and forms a seal. The vacuum channel H21 extends between the base 2021 and the first sleeve portion 2022. Preferably, the second sleeve portion 2011 and the vacuum suction cup 201 are integrally formed.

[0096] In other words, the buffer head 202 is mainly composed of a base 2021 and a first sleeve 2022. The top of the vacuum suction cup 201 has a second sleeve 2011. The buffer head 202 is sleeved with the sleeve hole H101 at the bottom of the suction head seat 10 through the first sleeve 2022 to form a sealed connection. The vacuum suction cup 201 is sleeved with the adapter hole H201 on the base 2021 of the buffer head 202 through the second sleeve 2011 to form a sealed connection. This facilitates the assembly and sealing connection between the buffer head 202 and the suction head seat 10, as well as between the vacuum suction cup 201 and the buffer head 202.

[0097] Reference Figures 4 to 5 As shown, in one embodiment of the present invention, a first stepped surface S202 is formed between the first socket 2022 and the base 2021, and the first stepped surface S202 abuts against the bottom of the suction head seat 10.

[0098] During assembly, after the first socket 2022 is fitted into the socket hole H101 of the suction head base 10, the base 2021 is pushed upward until the first stepped surface S202 abuts against the bottom of the suction head base 10, making assembly convenient. Furthermore, since the first stepped surface S202 is formed between the first socket 2022 and the base 2021, when the suction head base 10 descends and the vacuum suction cup 201 contacts the target material on the worktable, the base 2021 can be compressed as the suction head base 10 continues to descend, providing elastic cushioning. Moreover, the cross-sectional area of ​​the base 2021 is larger than that of the suction cup, thus ensuring that the vacuum suction cup 201 is subjected to balanced force, resulting in more stable and reliable adsorption of the target material.

[0099] Reference Figure 2 and Figure 5As shown, in one embodiment of the present invention, there are two vacuum suction cups 201, which are arranged side by side, and the bottom surface of the base 2021 is provided with a limiting platform 2023.

[0100] The height of the limiting platform 2023 is higher than that of the vacuum suction cup 201. When the vacuum suction cup 201 contacts the target material and compresses it by a predetermined distance, the limiting platform 2023 abuts against the target material to limit the further compression of the vacuum suction cup 201.

[0101] In this embodiment, on the one hand, by using two parallel vacuum suction cups 201, it can be ensured that when adsorbing the target material, both vacuum suction cups 201 maintain a symmetrical position adsorbed on the target material, thereby making the force acting on the target material greater and more balanced. Tests have shown that this can significantly improve the separation rate. On the other hand, after the vacuum suction cup 201 comes into contact with the target material, as the suction head seat 10 continues to descend, the vacuum suction cup 201 is compressed. When it is compressed to a certain extent, the limiting stage 2023 abuts against the target material. At this time, by utilizing the abutting effect of the limiting stage 2023 against the target material, the space for further compression of the vacuum suction cup 201 can be reduced, ensuring that the vacuum suction cup 201 can be compressed to a suitable degree (the adsorption surface S20 just completely adheres to the target material to form a seal), preventing over-compression and the problem of difficulty in forming a vacuum. Furthermore, after the limiting stage 2023 abuts against the target material, the suction head seat 10 continues to descend, which can compress the base 2021 of the buffer head 202, through which the base 2021 plays a buffering role.

[0102] Reference Figure 5 As shown, in one embodiment of the present invention, the suction head seat 10 is provided with two sliding holes H102, the two sliding holes H102 are respectively located on both sides of the vacuum suction head 20, and the sidewall of the sliding hole H102 has a second stepped surface S10.

[0103] The top of the pressure head 301 has an upwardly protruding sliding part 3011, which slides in conjunction with the sliding hole H102, and the side of the sliding part 3011 has a shoulder part 3012, which stops above the second step surface S10.

[0104] In other words, the pressure head 301 slides relative to the suction head seat 10 in a vertical direction by sliding the top sliding part 3011 with the sliding hole H102. In addition, the stop action between the shoulder part 3012 on the pressure head 301 and the second step surface S10 in the sliding hole H102 can ensure that the pressure head 301 will not separate from the suction head seat 10, making the sliding assembly between them reliable.

[0105] Reference Figures 1 to 4 As shown, in one embodiment of the present invention, the suction head base 10 is provided with a positioning stop 11. The positioning stop 11 includes a support arm 111 and a stop block 112. The lower end of the support arm 111 is fixed on the suction head base 10, and the stop block 112 fixes the upper end of the support arm 111. The stop block 112 is provided with a guide hole.

[0106] The elastic component 302 includes a guide rod 3021 and a spring 3022. The lower end of the guide rod 3021 is fixedly connected to the pressure head 301, and the upper end of the guide rod 3021 is slidably engaged with the guide hole. The spring 3022 is sleeved on the guide rod 3021, and one end of the spring 3022 abuts against the pressure head 301, while the other end of the spring 3022 abuts against the stop block 112.

[0107] When the pressure surface of the pressure head 301 contacts the adjacent material on the worktable, as the suction head seat 10 continues to descend, the suction head seat 10 and the pressure head 301 slide relative to each other. The stop block 112 and the suction head seat 10 move downwards synchronously, and the distance between the stop block 112 and the pressure head 301 decreases. As a result, the spring 3022 between the stop block 112 and the pressure head 301 can be compressed. In this way, the spring 3022 can provide an elastic force and act on the pressure head 301, so that the pressure head 301 elastically presses against the adjacent material. In addition, the guiding effect of the guide rod 3021 can ensure that the stop block 112 moves up and down smoothly and reliably, thereby allowing the spring 3022 to be reliably compressed.

[0108] The material application equipment according to an embodiment of the present invention has an automatic material dispensing suction head device as described above.

[0109] The bonding equipment provided according to the embodiments of the present invention has the above-described automatic dispensing suction head device, thus enabling fully automated bonding processing with high bonding efficiency and low material cost.

[0110] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0111] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An automatic material dispensing suction head device, suitable for sucking up target material from a row of materials, wherein the target material has an adjacent material on each side, characterized in that, The automatic dispensing suction head device includes: Suction head base; A vacuum suction head, wherein the vacuum suction head is disposed at the bottom of the suction head base; Two elastic dispensing pressure heads are disposed on the suction head seat and located on both sides of the vacuum suction head, and each elastic dispensing pressure head has a pressure surface at its bottom; Wherein, the height of the pressure surface is lower than the height of the vacuum suction head, and when the vacuum suction head is adsorbed onto the target material, the pressure surfaces on the two elastic dispensing pressure heads elastically press against the two adjacent materials respectively; The vacuum suction head includes: A vacuum suction cup, wherein the vacuum suction cup is located at the bottom of the suction head base, and the bottom of the vacuum suction cup has an adsorption surface and an adsorption hole penetrating to the adsorption surface; The suction head holder is provided with a vacuum connector that communicates with the suction hole for connecting a vacuum pumping device; The vacuum suction head also includes: A buffer head, which is made of elastic material, is located at the bottom of the suction head base, and the vacuum suction cup is located at the bottom of the buffer head; The buffer head has a vacuum channel that connects the vacuum connector and the adsorption hole; The bottom of the suction head holder is provided with a socket hole, and the buffer head includes: The base has an adapter hole at its bottom; A first sleeve portion is connected to the top of the base portion, and the first sleeve portion is fitted with the sleeve hole to form a seal; The top of the vacuum suction cup has an upwardly protruding second sleeve portion, which engages with the adapter hole and forms a seal, and the vacuum channel extends between the base and the first sleeve portion; There are two vacuum suction cups arranged side by side, and a limiting platform is provided on the bottom surface of the base. The height of the limiting platform is higher than that of the vacuum suction cup. When the vacuum suction cup contacts the target material and compresses it a predetermined distance, the limiting platform abuts against the target material to limit the vacuum suction cup from further compression. The elastic dispensing head includes: A pressure head is provided on the suction head seat and can slide vertically, and the pressure surface is located at the bottom of the pressure head; An elastic component is disposed between the pressure head and the suction head seat to provide an elastic force so that the pressure head can float elastically in the vertical direction.

2. The automatic material dispensing suction head device according to claim 1, characterized in that, A first stepped surface is formed between the first socket and the base, and the first stepped surface abuts against the bottom of the suction head seat.

3. The automatic material dispensing suction head device according to claim 2, characterized in that, The suction head holder is provided with two sliding holes, which are located on both sides of the vacuum suction head, and the sidewall of the sliding hole has a second stepped surface; The top of the pressure head has an upwardly protruding sliding part, which slides in conjunction with the sliding hole, and the side of the sliding part has a shoulder, which stops above the second step surface.

4. The automatic material dispensing suction head device according to claim 3, characterized in that, The suction head base is provided with a positioning stop, which includes a support arm and a stop block. The lower end of the support arm is fixed on the suction head base, and the stop block fixes the upper end of the support arm. The stop block is provided with a guide hole. The elastic component includes a guide rod and a spring. The lower end of the guide rod is fixedly connected to the pressure head, and the upper end of the guide rod is slidably engaged with the guide hole. The spring is sleeved on the guide rod, with one end of the spring abutting against the pressure head and the other end of the spring abutting against the stop block.

5. A material application device, characterized in that, It has an automatic dispensing suction head device as described in any one of claims 1 to 4.

Citation Information

Patent Citations

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