Detection system and detection method

By setting through holes and corresponding detection units on the carrier device, simultaneous detection of the front and back sides of the wafer is achieved, solving the problems of long detection time and low efficiency, and improving detection efficiency.

CN112635343BActive Publication Date: 2025-10-31SKYVERSE TECH CO LTD
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Patent Information

Application Number
CN202011312617.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-11-20
Publication Date
2025-10-31
Estimated Expiration
2040-11-20

AI Technical Summary

Technical Problem

In existing technologies, wafer inspection requires separate inspection of the front and back sides, resulting in long inspection times and low efficiency. Furthermore, the inspection information from the front and back sides needs to be correlated and linked in the later stages.

Method used

The method involves creating a through hole in the support device and setting up a first detection unit and a second detection unit that are opposite to the two sides of the workpiece to be inspected. This allows the second detection unit to inspect the second surface of the workpiece to be inspected through the through hole, while the first detection unit can inspect the area corresponding to the first surface.

Benefits of technology

This allows for simultaneous inspection of both sides of the workpiece, improving inspection efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The detection system of this application includes a carrier device and a detection device. The carrier device carries the workpiece to be inspected and has a through hole. The workpiece to be inspected includes a first inspection surface and a second inspection surface facing away from each other. The detection device includes a first detection unit and a second detection unit, which are disposed on opposite sides of the carrier device. The first detection unit faces the first inspection surface, and the second detection unit faces the second inspection surface. The second detection unit is used to detect the first inspection area corresponding to the through hole in the second inspection surface, and the first detection unit is used to detect the second inspection area in the first inspection surface. The first and second inspection areas are positionally corresponding. The detection system and method can simultaneously detect the first and second inspection surfaces, resulting in high detection efficiency.
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Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a testing system and testing method. Background Technology

[0002] After the wafer circuit layer is fabricated, the silicon wafer needs to be thinned and polished on the back side, then an adhesive film is applied, baked, and laser-marked on the adhesive film. Due to process limitations, the front side of the wafer may have defects such as short circuits or open circuits, while the adhesive film on the back side may have defects such as bubbles, wrinkles, or cracks. Therefore, both the front and back sides need to be inspected. Currently, wafer inspection generally involves inspecting the front side first, then flipping the wafer to inspect the back side. This process is time-consuming, and the inspection information from the front and back sides needs to be correlated and linked later, resulting in low inspection efficiency. Summary of the Invention

[0003] In view of this, embodiments of this application provide a detection system and a detection method.

[0004] The detection system of this application includes a support device and a detection device. The support device is used to support the workpiece to be inspected and has a through hole. The workpiece to be inspected includes a first inspection surface and a second inspection surface facing away from each other. The detection device includes a first detection unit and a second detection unit, which are disposed on opposite sides of the support device. The first detection unit is opposite to the first inspection surface, and the second detection unit is opposite to the second inspection surface. The second detection unit is used to detect a first inspection area in the second inspection surface corresponding to the through hole, and the first detection unit is used to detect a second inspection area in the first inspection surface. The first inspection area and the second inspection area are positioned correspondingly.

[0005] The detection method of this application is used to detect a first inspection surface and a second inspection surface opposite to each other of a test piece. The detection method includes: installing the test piece on the support device, the support device having a through hole; performing detection processing on a first inspection area in the second inspection surface corresponding to the through hole through a second detection unit; and performing detection processing on a second inspection area in the first inspection surface corresponding to the position on the second inspection surface through a first detection unit.

[0006] The detection system and method of this application, by opening a through hole in the carrier device and setting a first detection unit and a second detection unit that are respectively opposite to the two sides of the workpiece to be tested, enable the second detection unit to detect the first inspection area corresponding to the through hole in the second inspection surface of the workpiece to be tested through the through hole, while the first detection unit can detect the second inspection area corresponding to the first inspection area. This allows for simultaneous detection of both sides of the workpiece to be tested at one time, resulting in high detection efficiency.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of the structure of the detection system according to some embodiments of this application;

[0010] Figure 2 This is a plan view of the detection system according to some embodiments of this application;

[0011] Figure 3 This is a three-dimensional assembly schematic diagram of the support device according to certain embodiments of this application;

[0012] Figure 4 This is an exploded perspective view of the support device according to certain embodiments of this application;

[0013] Figure 5 This is an enlarged schematic diagram of the air path of the bearing device in some embodiments of this application;

[0014] Figure 6 This is a schematic diagram of the bearing area of ​​the bearing surface in certain embodiments of this application; and

[0015] Figures 7 to 10 This is a flowchart illustrating the detection method of some embodiments of this application. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0017] Please see Figure 1 and Figure 2 The detection system 1000 of this application includes a support device 100 and a detection device 200. The support device 100 is used to support the workpiece 800 to be inspected. The support device 100 is provided with a through hole 16. The workpiece 800 to be inspected includes a first inspection surface 810 and a second inspection surface 820 facing away from each other. The detection device 200 includes a first detection unit 210 and a second detection unit 220. The first detection unit 210 and the second detection unit 220 are disposed on opposite sides of the support device 100. The first detection unit 210 is opposite to the first inspection surface 810, and the second detection unit 220 is opposite to the second inspection surface 820. The second detection unit 220 is used to detect the first inspection area 821 in the second inspection surface 820 corresponding to the through hole 16. The first detection unit 210 is used to detect the second inspection area 811 in the first inspection surface 810. The first inspection area 821 and the second inspection area 811 are positioned corresponding to each other.

[0018] The detection system 1000 of this application provides a through hole 16 on the support device 100 and provides a first detection unit 210 and a second detection unit 220 that are respectively opposite to the two sides of the workpiece 800 to be tested. This allows the second detection unit 220 to detect the first inspection area 821 corresponding to the through hole 16 in the second inspection surface 820 of the workpiece 800 to be tested, while the first detection unit 210 can detect the second inspection area 811 corresponding to the first inspection area 821. This enables simultaneous detection of both sides of the workpiece 800 to be tested at one time, resulting in high detection efficiency.

[0019] Please see Figure 1 and Figure 2 The detection system 1000 of this application includes a base 300, a moving device 400, a supporting device 100, a detection device 200, and a feeding device (not shown).

[0020] The carrier device 100, the detection device 200, and the moving device 400 are all mounted on the base 300. The feeding device is used to place the workpiece 800 to be inspected onto the carrier device 100. The detection device 200 is used to inspect the workpiece 800 placed on the carrier device 100. Both the carrier device 100 and the detection device 200 are mounted on the moving device 400. The moving device 400 is used to move the carrier device 100 and / or the detection device 200 to change the relative position of the detection device 200 and the carrier device 100, thereby enabling the detection device 200 to detect different areas of the workpiece 800 to be inspected.

[0021] The component to be inspected 800 includes a first inspection surface 810 and a second inspection surface 820 facing away from each other. For example, the component to be inspected 800 can be a wafer. The first inspection surface 810 is the surface of the wafer with a pattern formed by multiple grains. The first inspection surface 810 may have many defects, such as scratches, short circuits, open circuits, dirt, etc. The second inspection surface 820 is used to attach an adhesive film and then perform laser marking. The defects of the second inspection surface 820 are mainly defects of the adhesive film, such as bubbles, foreign matter, wrinkles, cracks, etc., and the defects of the adhesive film will affect the laser marking effect.

[0022] The base 300 includes a substrate 310, a moving stage 320, and a support frame 330. Both the moving stage 320 and the support frame 330 are disposed on the substrate 310.

[0023] The substrate 310 is rectangular. The upper surface 311 of the substrate 310 is used to support the moving stage 320 and the support frame 330, and the lower surface 312 of the substrate 310 can be placed stably on the ground. The substrate 310 can also be other suitable shapes, such as frustum or cylinder, as long as it can be placed stably on a flat ground and can support the moving stage 320 and the support frame 330. There are no restrictions on this.

[0024] The movable stage 320 includes a first movable stage 321 and a second movable stage 322, which are located at both ends of the support device 100 to stably support the support device 100. The first movable stage 321, the second movable stage 322, the upper surface 311 of the substrate 310, and the support device 100 form an installation space 710.

[0025] The support frame 330 includes a support column 331 and a support platform 332, with the support platform 332 disposed on the support column 331.

[0026] The number of support columns 331 can be one or more, for example, one, two, or three. In this embodiment, there are two support columns 331 to support the two ends of the support platform 332 respectively, thereby achieving stable support for the support platform 332. The height of the support column 331 can be determined according to the detection parameters of the detection device 200, such as the detection distance and field of view of the detection device 200, so that the detection device 200 can accurately detect the object to be detected 800.

[0027] The support platform 332 can be fixed on the support column 331. For example, the support platform 332 and the support column 331 can be fixedly connected together by means of screwing, snapping or other methods.

[0028] The mobile device 400 includes a first moving member 410 and a second moving member 420.

[0029] The first moving member 410 is disposed on the moving stage 320. The first moving member 410 is used to support the supporting device 100 (i.e., the supporting device 100 is disposed on the first moving member 410). The first moving member 410 can move the supporting device 100 so that the supporting device 100 moves on the moving surface 720 parallel to the supporting surface 12 of the supporting device 100, thereby changing the relative position of the object to be detected 800 and the detection device 200 (i.e., the phase position of the projection of the supporting device 100 on the moving surface 720 and the projection of the detection device 200 on the moving surface 720). Both the supporting surface 12 and the moving surface 720 are parallel to the upper surface 311 of the substrate 310.

[0030] The second movable member 420 carries the detection device 200 (i.e., the detection device 200 is disposed on the second movable member 420). The second movable member 420 can move the detection device 200 along the optical axis O of the detection device 200 to change the relative position of the object to be detected 800 and the detection device 200 (i.e., the relative distance between the object to be detected 800 and the detection device 200 on the optical axis O of the detection device 200).

[0031] In one embodiment, the optical axis O of the detection device 200 is perpendicular to the upper surface 311 of the substrate 310. In this case, the detection device 200 is directly facing the bearing surface 12, and its proximity to the bearing surface 12 improves the detection effect on the workpiece 800. In another embodiment, the optical axis O of the detection device 200 is not perpendicular to the upper surface 311 of the substrate 310; that is, the optical axis O of the detection device 200 and the upper surface 311 of the substrate 310 form a certain angle (e.g., 30 degrees, 45 degrees, 60 degrees, etc.), which increases the field of view of the detection device 200 in capturing images of the workpiece 800. In this embodiment, the optical axis O of the detection device 200 is perpendicular to the upper surface 311 of the substrate 310.

[0032] The second moving part 420 includes a first moving sub-part 421 and a second moving sub-part 422.

[0033] The first moving sub-component 421 is disposed on the support platform 332. The first moving sub-component 421 is used to mount the first detection unit 210. The first moving sub-component 421 can drive the first detection unit 210 to move along the first optical axis O1. For example, the first detection unit 210 moves along the first optical axis O1 towards the substrate 310, or the first detection unit 210 moves along the first optical axis O1 away from the substrate 310, thereby changing the distance between the first detection unit 210 and the object to be inspected 800 on the first optical axis O1, so that the first detection unit 210 completes focusing. As the distance between the first detection unit 210 and the first surface to be inspected 810 increases, the field of view of the first detection unit 210 covers the first surface to be inspected 810. By moving the second detection unit 220 along the first optical axis O1, the field of view of the first detection unit 210 can just cover the second area to be inspected 821, thereby improving the detection effect of the first surface to be inspected 810 of the object to be inspected 800.

[0034] The second moving sub-component 422 is disposed on the upper surface 311 of the substrate 310 and located within the mounting space 710. The second moving sub-component 422 is used to mount the second detection unit 220. The second moving sub-component 422 can drive the second detection unit 220 to move along the second optical axis O2. For example, the second detection unit 220 can move along the second optical axis O2 towards the substrate 310 or move along the second optical axis O2 away from the substrate 310, thereby changing the distance between the second detection unit 220 and the object to be inspected 800 on the second optical axis O2, so that the second detection unit 220 can achieve focusing processing. As the distance between the second detection unit 220 and the second surface to be inspected 820 increases, the field of view of the second detection unit 220 covers the second surface to be inspected 820. By moving the second detection unit 220 along the second optical axis O2, the field of view of the second detection unit 220 can be made to just cover the first inspection area 811, improving the detection effect of the second surface to be inspected 820 of the object to be inspected 800.

[0035] In another embodiment, a mounting groove 313 is also formed on the upper surface 311 of the substrate 310. The mounting groove 313 is recessed from the upper surface 311 of the substrate 310 in a direction away from the support device 100. The second moving sub-component 422 is disposed in the mounting groove 313, which communicates with the mounting space 710. Compared to the second moving sub-component 422 being disposed on the upper surface 311 of the substrate 310, the second detection unit 220 is closer to the second inspection surface 820. Compared to the smaller distance required for focusing and adjusting the field of view, it has a larger adjustment distance, thereby achieving a wider range of focusing processing and field of view adjustment, thus improving the focusing effect and the adjustment range of the field of view.

[0036] The first moving component 410 includes a third moving sub-component 411, a fourth moving sub-component 412, and a moving plate 413. The third moving sub-component 411 and the fourth moving sub-component 412 are disposed at both ends of the moving plate 413 to support the moving plate 413 (i.e., the moving plate 413 is disposed on the third moving sub-component 411 and the fourth moving sub-component 412). The third moving sub-component 411 and the fourth moving sub-component 412 cooperate to move the position of the moving plate 413 on the moving surface 720.

[0037] The third moving sub-component 411 is disposed on the first moving stage 321, and the fourth moving sub-component 412 is disposed on the second moving stage 322. Both the third moving sub-component 411 and the fourth moving sub-component 412 are capable of moving on the moving surface 720. For example, the third moving sub-component 411 and the fourth moving sub-component 412 can cooperate through mechanical transmission to drive the moving stage 320 to move on the moving surface 720, so that the detection device 200 can detect all the areas to be inspected of the workpiece 800 (such as the first inspection area 821 and the second inspection area 811).

[0038] The movable plate 413 includes a top surface 414 and a bottom surface 415 facing away from each other. The supporting device 100 is disposed on the top surface 414, and the third movable sub-component 411 and the fourth movable sub-component 412 are disposed on the bottom surface 415. The top surface 414 of the movable plate 413 has a supporting groove (not shown in the figure). The shape of the supporting device 100 matches that of the supporting groove (e.g., if the supporting device 100 is cylindrical, then the supporting groove is also cylindrical, and the inner diameter of the supporting groove is equal to the outer diameter of the supporting device 100) so that the supporting device 100 is firmly fixed in the supporting groove.

[0039] Please see Figure 3 and Figure 4 The carrier device 100 can be used to carry various test pieces 800, such as display screen panels, mobile phone front covers, mobile phone back covers, VR glasses, AR glasses, smartwatch covers, glass, wood, iron plates, and housings of any device (e.g., mobile phone cases), etc., which require processing or testing. The carrier device 100 of this application can also be used to carry semiconductor material test pieces 800 to facilitate semiconductor material processing, such as for wafer surface defect detection, optical film thickness detection, wafer surface etching, wafer dicing, etc.

[0040] This application provides a carrier device 100. The carrier device 100 includes a carrier member 10, a pressing assembly 20, and a driving member 30. The carrier member 10 includes a bearing surface 12 and an air passage 13 disposed on the carrier member 10. The bearing surface 12 includes a first region 121 and a second region 122 surrounding the first region 121. The air passage 13 is used to draw air to adsorb the test piece 800 into the first region 121. The pressing assembly 20 is used to press the test piece 800 into the second region 122. The driving member 30 is connected to the pressing assembly 20 and is used to drive the pressing assembly 20 to move relative to the carrier member 10 to selectively press or release the test piece 800.

[0041] When fixing the test piece 800 onto the carrier device 100, the driving member 30 first drives the pressing assembly 20 to move away from the carrier 10. The carrier 10 includes a bearing surface 12 and an air passage 13 disposed within the carrier 10. The bearing surface 12 includes a first region 121 and a second region 122 surrounding the first region 121. The air passage 13 is used to extract air to adsorb the test piece 800 into the first region 121. Then, the test piece 800 is placed onto the bearing surface 12. Next, the driving member 30 drives the pressing assembly 20 to move closer to the carrier 10, so that the test piece 800 is pressed into the second region 122. Finally, air is extracted from the air passage 13 to adsorb the test piece 800 into the first region 121. In this way, the carrier device 100 can press the test piece 800 onto the bearing surface 12 of the carrier 10, flattening the warped surface of the test piece 800, so that the test piece 800 can be smoothly adsorbed onto the carrier 10.

[0042] The clamping assembly 20 is used to press the test piece 800 into the second region 122. Typically, the center of the test piece 800, placed on the carrier 10, is aligned with the center 15 of the carrier 10. The edge region of the test piece 800 is often an area that does not require processing. Contact between the clamping assembly 20 and the unprocessed area of ​​the test piece 800 will not affect the processing of the test piece 800. Therefore, when the test piece 800 is placed at a preset position on the carrier 10, the unprocessed area of ​​the edge of the test piece 800 is located in the second region 122 of the carrier 10. The clamping assembly 20 can press the edge of the test piece 800 into the second region 122 to fix the test piece 800.

[0043] Thinner test pieces 800 are prone to warping, reducing the contact area between them and the bearing surface 12, making it difficult for them to adhere to the bearing surface 12. Warping often occurs at the edges of the test piece 800. The pressing component 20 can flatten the warped areas of the test piece 800 in the second region 122, allowing it to adhere smoothly to the bearing surface 12. Even if warping does not occur at the edges of the test piece 800, the pressing component 20 can still cause some elastic deformation in the test piece 800 in the second region 122, making it flatter and increasing the contact area with the bearing surface 12, thus allowing it to adhere smoothly to the bearing surface 12.

[0044] When the air passage 13 draws air, it generates a sufficiently large adsorption force on the bearing surface 12, which can, to a certain extent, draw the warped test piece 800 to flatten it through adsorption. For example, the warped part of the test piece 800 that protrudes away from the bearing piece 10 is adsorbed onto the bearing surface 12, making the surface of the test piece 800 in contact with the bearing surface 12 flat.

[0045] The driving component 30 can be either electrically driven or pneumatically driven, and there is no limitation herein. The driving component 30 can drive the clamping assembly 20 to move away from the carrier 10 relative to the carrier 10, so as to make room for the test piece 800 to be loaded into the carrier 10. The driving component 30 can also drive the clamping assembly 20 to move towards the carrier 10 relative to the carrier 10, so as to press the test piece 800 onto the carrier 10.

[0046] When the test piece 800 is not placed, the driving member 30 can drive the pressing assembly 20 to move away from the support member 10 to make room for placing the test piece 800 on the support surface 12. After the test piece 800 is placed on the support surface 12, the driving member 30 can drive the pressing assembly 20 to move closer to the support member 10, so that the pressing assembly 20 presses the test piece 800, specifically, so that the test piece 800 is pressed into the second region 122. After the test piece 800 is pressed by the pressing assembly 20, air can be evacuated from the air passage 13 to adsorb the test piece 800 into the first region 121, so as to avoid the surface of the unpressed test piece 800 being warped, which would prevent the test piece 800 from being successfully adsorbed into the first region 121.

[0047] In the carrier device 100 and the fixing of the test piece 800 using the carrier device 100 in the embodiments of this application, the carrier 10 can carry and adsorb the test piece 800, so that the test piece 800 does not shift. The pressing assembly 20 can press the test piece 800 into the second region 122, so that the surface of the test piece 800 in contact with the carrier surface 12 is flatter, for example, pressing the warped surface of the test piece 800 to flatten it, thereby increasing the contact area between the test piece 800 and the carrier surface 12, so that the test piece 800 can be smoothly adsorbed on the carrier 10 and avoid warping.

[0048] The carrier 10 includes a carrier surface 12, which is used to support the device to be tested 800. The carrier surface 12 can be of any shape, such as circular, elliptical, rectangular, polygonal, etc., which are not listed here. Different shaped carrier surfaces 12 can adapt to and adsorb different shaped devices to be tested 800. For example, when the device to be tested 800 is a wafer, the wafer is usually processed into a circle, so the carrier surface 12 can be set to be circular in order to better support and adsorb the wafer.

[0049] The carrier 10 is provided with an air passage 13, which is used to draw air to adsorb the object to be tested 800 into the first region 121. (See also...) Figure 4 and Figure 5 In some embodiments, the air passage 13 includes a plurality of grooves 131 disposed in the first region 121 and air holes 132 communicating with the grooves 131. The air holes 132 are used to communicate with an air extraction unit (not shown). The air extraction unit is used to extract air from the air holes 132 so that the carrier 10 can adsorb the test piece 800. Specifically, the air holes 132 connect the grooves 131 and the air extraction unit. When the air extraction unit extracts air from the air holes 132, an adsorption force is generated at the air holes 132 and the grooves 131, which can adsorb the test piece 800 at the air holes 132 and the grooves 131 in the first region 121.

[0050] Specifically, the grooves 131 can be multiple concentric rings distributed around the center of the bearing surface 12 in the first region 121, with the distance between each ring being the same, so that the grooves 131 are evenly distributed in the first region 121, thereby generating a uniform adsorption force in the first region 121. The denser the concentric rings of the grooves 131 are distributed, the more of the test piece 800 can be adsorbed, the greater the adsorption force, and the more conducive it is to fixing the test piece 800 flatly on the bearing 10.

[0051] In some embodiments, the air passage 13 may further include an air channel 133 disposed on the side of the carrier 10, and the air hole 132 communicates with the suction unit through the air channel 133. Distributing the air channel 133 on the side of the carrier 10 allows the suction unit to be positioned on the side of the carrier 10 and in communication with the air channel 133, thus avoiding obstruction of the test piece 800 by placing the suction unit above or below the carrier 10, thereby affecting the processing of the test piece 800.

[0052] In some further embodiments, the air passage 13 may also include an air channel 133 disposed on the side of the support member 10 and a connecting groove 134 disposed in the first region 121 and communicating with the recess 131. The air channel 133 communicates with the air hole 132, and the air hole 132 communicates with the air extraction unit through the air channel 133. For example, as Figure 5 As shown, the connecting groove 134 passes through and intersects with multiple grooves 131. Multiple air holes 132 are sequentially arranged at the bottom of the connecting groove 134 to allow air to pass through and connect the connecting groove 134 and the grooves 131. When the air extraction unit extracts air from the air holes 132, negative pressure can be generated at both the connecting groove 134 and the grooves 131 that are connected to the air holes 132, further improving the adsorption capacity of the carrier 10 for the test piece 800.

[0053] Please see Figure 4 In some embodiments, the carrier 10 may be provided with a plurality of first through holes 161. The first through holes 161 are located in the first region 121 and are used to expose the portion of the surface of the test piece 800 that contacts the carrier surface 12 when the test piece 800 is placed on the carrier 10 for processing. Specifically, both the first inspection surface 810 and the second inspection surface 820 of the test piece 800 placed on the carrier 10 can be processed. The portion of the test piece 800 facing the pressure ring 21 (the first inspection surface 810) that is not blocked by the pressure ring 21 can be directly detected by the first detection unit 210. The portion of the test piece 800 facing the carrier 10 (the second inspection surface 820) is blocked by the carrier 10. Therefore, a plurality of first through holes 161 may be provided on the carrier 10 so that the second detection unit 220 can detect the first inspection area 821 exposed by the test piece 800 through the first through holes 161.

[0054] In some embodiments, the first through holes 161 are evenly distributed relative to the center 15 of the support member 10, so that the detection device 200 can detect the exposed portions (i.e., multiple first inspection areas 821) of the second inspection surface 820 evenly distributed relative to the center 15 of the support member 10. Considering efficiency factors, the detection device 200 may not need to detect the entire second inspection surface 820 of the inspection member 800, but may instead perform sampling inspection of the second inspection surface 820 to reflect the inspection status of the second inspection surface 820 based on the detection results of the multiple second inspection areas 821 of the inspection member 800. Typically, the areas on the second inspection surface 820 that are sampled and tested are evenly distributed relative to the center of the back side so that the test results of multiple second inspection areas 821 can reflect the test situation of the entire second inspection surface 820. Therefore, a plurality of first through holes 161 are provided on the carrier 10, evenly distributed relative to the center 15 of the carrier 10, so that when the center of the inspection component 800 coincides with the center 15 of the carrier 10, the position of the first through hole 161 can correspond to the second inspection area 821 on the back side, thereby enabling the second detection unit 220 to detect the first inspection area 821 exposed from the first through hole 161.

[0055] Please see Figure 4 In some embodiments, the support member 10 may include a body 18 and a support portion 11. The support portion 11 is disposed on a first side of the body 18, and the support surface 12 is located on the side of the support portion 11 away from the body 18. A plurality of first through holes 161 penetrate the body 18 and the support portion 11. The support portion 11 is provided with an opening 171 penetrating the side wall 17 of the support portion 11. The center 123 of the support surface 12 is the center 15 of the support member 10.

[0056] When placing the workpiece 800 to be tested on the bearing surface 12, a feeding device (not shown in the figure) such as a robotic arm or mechanical clamp can be used to hold the workpiece 800 and place it from the side of the bearing portion 11, so that the center of the workpiece 800 gradually approaches the center 123 of the bearing surface 12, until the center of the workpiece 800 coincides with the center 123 of the bearing surface 12. Then, the workpiece 800 is placed down, and the feeding device is withdrawn from the side of the bearing portion 11. The bearing portion 11 is provided with an opening 171 that penetrates the side wall 17 of the bearing portion 11, so that the feeding device can extend into the opening 171 to hold the workpiece 800 to be tested and place it from the side of the bearing surface 12, so that the center of the workpiece 800 coincides with the center 123 of the bearing surface 12, and the feeding device can be withdrawn from the bearing portion 11 through the opening 171. If there is no opening 171 through the side wall 17 of the bearing part 11, the feeding device is prone to interference with the bearing part 11 during the process of clamping the test piece 800 and placing it on the bearing surface 12, causing scratches. At the same time, it is difficult to ensure that the test piece 800 can be placed in place, that is, it is difficult to ensure that the center of the test piece 800 coincides with the center 123 of the bearing surface 12.

[0057] Furthermore, in one embodiment, the opening 171 can extend from the side wall 17 to the center 123 of the bearing surface 12. In this case, the extension stroke of the feeding device is large, which can further ensure that the feeding device can place the test piece 800 in place, that is, ensure that the center of the test piece 800 coincides with the center 123 of the bearing surface 12.

[0058] Please see Figure 4 In some embodiments, the body 18 is provided with a plurality of second through holes 162, which correspond to the opening 171 and are used to expose a plurality of first inspection areas 821 of the second inspection surface 820 when the inspection piece 800 is placed on the carrier 10.

[0059] Please refer to the following: Figure 4 and Figure 6 The number of first regions 121 and second regions 122 is the same, and can be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which will not be listed here. When there is only one first region 121 and one second region 122, the bearing surface 12 is only used to support one size of the workpiece 800 to be inspected for processing. When there are multiple first regions 121 and multiple second regions 122 (greater than or equal to 2), the multiple first regions 121 and multiple second regions 122 are arranged alternately, and multiple bearing regions 124 can be formed radiating from the center 15 of the bearing member 10 to each second region 122. The multiple bearing regions 124 can support different sizes of workpieces 800 to be inspected, and each bearing region 124 corresponds to supporting one size of workpiece 800 to be inspected. At this time, the number of bearing regions 124 is the same as the number of first regions 121 or second regions 122. The carrier 10 is provided with an air passage 13 at the position corresponding to each first region 121, so that different carrier regions 124 can adsorb the test piece 800 onto the first region 121 of the corresponding carrier region 124.

[0060] In the embodiments of this application, such as Figure 4 and Figure 6As shown, there are two first regions 121 and two second regions 122. These regions, arranged alternately in a radial direction radiating outwards from the center 15 of the carrier 10, are air passages 13 at their respective positions. The first and second regions 121 together form a carrier region 124a, which carries a first-sized test piece 800. The first, second, and third regions 121 together form a carrier region 124b, which can carry both first-sized and second-sized test pieces 800. The second size is larger than the first size; for example, the first size is 8 inches and the second size is 12 inches.

[0061] Please see Figure 3 and Figure 4 In some embodiments, the clamping assembly 20 includes a clamping ring 21 corresponding to the second region 122, and the clamping ring 21 is connected to the drive member 30. The drive member 30 is used to drive the clamping ring 21 to move relative to the carrier member 10 so as to clamp the test piece 800 to the second region 122.

[0062] The pressure ring 21 corresponds to the second region 122. For example, if the second region 122 is a circular ring, then the pressure ring 21 is a circular ring corresponding to the second region 122. The second region 122 can also be an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc., and correspondingly, the pressure ring 21 is an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc., corresponding to the second region 122, without limitation. When the driving member 30 drives the pressure ring 21 to move relative to the bearing member 10 towards the bearing member 10 to press the test piece 800, the pressure applied to the test piece 800 by the pressure ring 21 can be evenly distributed relative to the center of the pressure ring 21, so as to prevent stress concentration at a certain point when pressing the test piece 800, which would cause damage to that point of the test piece 800. The driving member 30 drives the pressure ring 21 to apply pressure evenly distributed relative to the center of the pressure ring 21 to the test piece 800, which also helps to flatten the surface of the test piece 800, thereby increasing the contact area between the test piece 800 and the bearing surface 12. This prevents the pressure applied by the driving member 30 to the pressure ring 21 to the test piece 800 from being uneven relative to the center of the pressure ring 21, which could cause one side of the test piece 800 to lift up.

[0063] In one embodiment, the pressure ring 21 may be made of a metal material. The metal pressure ring 21 possesses a certain strength, is not easily deformed or damaged under the drive of the drive member 30, and has a long service life. The metal pressure ring 21 also has a certain weight; when the pressure ring 21 presses against the test piece 800, the weight of the metal pressure ring 21 itself can apply pressure to the test piece 800, allowing the drive member 30 to press the metal pressure ring 21 against the test piece 800 without applying too much driving force.

[0064] In another embodiment, the pressure ring 21 can be made of a non-metallic material. A non-metallic pressure ring 21 is less prone to static electricity generation, preventing damage to the test piece 800 caused by static electricity. For example, if the test piece 800 is a wafer, circuitry may be present on the wafer surface. If static electricity is generated on the pressure ring 21, it can easily damage the wafer when the pressure ring 21 comes into contact with it. Furthermore, the non-metallic pressure ring 21 is lighter, making it easier for the drive member 30 to move the pressure ring 21 relative to the carrier member 10.

[0065] Please see Figure 3 and Figure 4 In some embodiments, the clamping assembly 20 may further include a clamping block 23, which is mounted on the first surface 213 of the clamping ring 21 and is used to clamp the test piece 800 in the second region 122.

[0066] In one embodiment, the number of pressure blocks 23 is one, and it is annular, corresponding to the second region 122. For example, if the second region 122 is an annular ring, then the pressure block 23 is an annular ring corresponding to the second region 122. When the second region 122 is an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc., the corresponding pressure block 23 is also an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc., and there is no limitation here. The pressure applied to the test piece 800 by the annular pressure block 23 can be evenly distributed relative to the center of the pressure ring 21 to prevent stress concentration when pressing the test piece 800, which could lead to damage to the test piece 800.

[0067] In another embodiment, the pressure block 23 comprises multiple blocks, which are evenly spaced around the center of the pressure ring 21 to prevent stress concentration when pressing the test piece 800, thus preventing damage to the test piece 800. The number of pressure blocks 23 can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here. Compared to a single ring-shaped pressure block 23, multiple pressure blocks 23 can save some material. For example, if there are 2 pressure blocks 23, and the included angle between the two lines connecting the two pressure blocks 23 to the center of the pressure ring 21 is 180°, compared to a single ring-shaped pressure block 23, the size of each of the two pressure blocks 23 can be made into a quarter-ring, a fifth-ring, a twelfth-ring, a twenty-fourth-ring, etc., which are not listed here, in order to save material. Compared to a single ring-shaped pressure block 23, multiple pressure blocks 23 can reduce the contact area with the workpiece 800 to be tested. When the area to be processed of the workpiece 800 is close to the second area 122 of the bearing surface 12, the placement of the workpiece 800 can be adjusted so that the pressure block 23 avoids the area to be processed of the workpiece 800, thereby preventing the pressure block 23 from damaging the area to be processed of the workpiece 800.

[0068] In some embodiments, the pressure block 23 can be detachably installed on the pressure ring 21 by means of threaded connection, snap-fit ​​connection, hinge connection, etc., so that a certain number of pressure blocks 23 can be installed on the first surface 213 of the pressure ring 21 as needed. For example, if there is a warping on each of the opposite sides of the test piece 800, two pressure blocks 23 can be installed on the first surface 213 of the pressure ring 21 at the position corresponding to each warping, that is, a total of four pressure blocks 23 can be installed on the first surface 213 of the pressure ring 21 to flatten the warping.

[0069] In some embodiments, the pressure block 23 can be non-removably mounted on the pressure ring 21 by means of welding, bonding, riveting, etc., so that the pressure block 23 is securely mounted on the pressure ring 21 and is not easy to fall off. Moreover, the pressure block 23, which is non-removably mounted on the pressure ring 21, is not easy to shift or wobble relative to the pressure ring 21, so as to avoid the inability to flatten the warped part of the workpiece 800 under test due to the pressure block 23 shifting or wobble relative to the pressure ring 21.

[0070] In one embodiment, the pressure block 23 may be made of metal. The metal pressure block 23 possesses a certain strength, is not easily deformed or damaged under the drive of the drive member 30, and has a long service life. The metal pressure block 23 also has a certain weight; when the pressure block 23 presses against the workpiece 800, the weight of the metal pressure block 23 itself can apply pressure to the workpiece 800, allowing the drive member 30 to press the metal pressure block 23 firmly without applying too much driving force.

[0071] In another embodiment, the pressure block 23 can be made of a non-metallic material. The non-metallic material pressure block 23 is less prone to static electricity generation, preventing damage to the test piece 800 caused by static electricity. For example, if the test piece 800 is a wafer, circuitry may be present on the wafer surface. If static electricity is generated on the pressure block 23, it can easily damage the wafer when the pressure block 23 comes into contact with it. Furthermore, the non-metallic material pressure block 23 is lighter, making it easier for the drive member 30 to move the pressure block 23 relative to the support member 10.

[0072] Please see Figure 3 and Figure 4 In some embodiments, the clamping assembly 20 may further include a pressure plate 25. The pressure plate 25 is mounted on the second surface 215 of the pressure ring 21 and is used to connect the pressure ring 21 and the drive member 30. The drive member 30 can drive the pressure plate 25 to move relative to the support member 10 to move the pressure ring 21.

[0073] The pressure plate 25 connects the pressure ring 21 and the driving component 30, allowing for more flexible positioning of the driving component 30. For example, without the pressure plate 25, the driving component 30 is directly connected to the pressure ring 21. In this case, the driving force direction of the driving component 30 needs to be consistent with the direction of movement of the pressure ring 21 relative to the support member 10 to drive the pressure ring 21 to move relative to the support member 10. This necessitates that the driving component 30 be positioned as follows: Figure 3 The pressure ring 21 is shown above or below the pressure ring 21. Since the component to be tested 800 is placed below the pressure ring 21, the position of the drive member 30 is limited to above the pressure ring 21, which is very inflexible and may obstruct the component to be tested 800, making it difficult for the detection device 200 to detect the first surface to be tested 810. The pressure plate 25 connects the pressure ring 21 and the drive member 30, allowing the drive force of the drive member 30 to drive the pressure ring 21 to move relative to the support member 10 without having to be in the same direction as the movement of the pressure ring 21 relative to the support member 10. This allows the position of the drive member 30 to be flexibly set, for example, by placing the drive member 30 on the body 18 away from the component to be tested 800, thus avoiding the drive member 30 obstructing the component to be tested 800 and making it difficult for the detection device 200 to perform the detection of the component to be tested 800.

[0074] In some embodiments, the pressure plate 25 can be detachably mounted on the pressure ring 21 by means of threaded connection, snap-fit ​​connection, hinge connection, etc., so as to facilitate the removal of the pressure ring 21 or the pressure plate 25 for maintenance or replacement.

[0075] In some embodiments, the pressure plate 25 can be non-removably mounted on the pressure ring 21 by means of welding, bonding, riveting, etc., so that the pressure plate 25 is securely mounted on the pressure ring 21 and is not easy to fall off. Moreover, the pressure plate 25, which is non-removably mounted on the pressure ring 21, is not easy to shift or wobble relative to the pressure ring 21, so as to avoid the inability to flatten the warped part of the workpiece 800 under test due to the pressure plate 25 shifting or wobble relative to the pressure ring 21.

[0076] In some embodiments, multiple pressure plates 25 may be included, and correspondingly, multiple driving members 30 may be included. Each driving member 30 is connected to one pressure plate 25, and the pressure plates 25 are symmetrically distributed about the center of the pressure ring 21. For example, the number of pressure plates 25 can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, etc., which are not listed here. Correspondingly, the number of driving members 30 can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., as long as the number of driving members 30 is the same as the number of pressure plates 25, which are not listed here.

[0077] The pressure plates 25, which are symmetrically distributed around the center of the pressure ring 21, can drive the pressure ring 21 to move symmetrically relative to the carrier 10 in all directions. That is, they can drive the pressure ring 21 to remain horizontal when it is close to or away from the carrier 10, so as to avoid the pressure ring 21 not being horizontal when it moves relative to the carrier 10 and thus failing to flatten the surface of the test piece 800.

[0078] Please see Figure 3 and Figure 4 In some embodiments, the supporting device 100 may further include a first detector 40. The first detector 40 is disposed on the pressure ring 21 and is used to emit a detection signal and output a detection result based on the reflected detection signal. The detection result includes whether the supporting surface 12 supports the component to be tested 800, and whether the component to be tested 800 is placed in a preset position when the supporting surface 12 supports the component to be tested 800. The first detector 40 may be a light signal detector, a sound wave signal detector, etc. For example, the first detector 40 can be used to emit at least one of light signals or sound waves, and can detect the reflected light signals or sound waves.

[0079] In some embodiments, the pressure ring 21 may be provided with a mounting portion 211, the second region 122 is provided with a through hole 14 corresponding to the mounting portion 211, the first detector 40 is installed in the mounting portion 211 and sends a detection signal toward the through hole 14, and outputs the detection result based on the reflected detection signal.

[0080] In some embodiments, there may be one first detector 40, and correspondingly, there may also be one mounting portion 211 and one through hole 14. In this case, the first detector 40 emits a detection signal. If the first detector 40 can detect the reflected detection signal and the reflected detection signal is greater than a first threshold, it indicates that the bearing surface 12 carries the object to be tested 800, and the reflected detection signal is reflected back by the object to be tested 800. If the first detector 40 fails to detect the reflected detection signal or detects a reflected detection signal less than the first threshold (the signal passes directly through the through hole 14 or is only slightly reflected back by the sidewall of the through hole 14), it indicates that the bearing surface 12 does not carry the object to be tested 800. When the first detector 40 detects a reflected detection signal and the intensity of the detection signal exceeds the second threshold, it indicates that the test piece 800 is placed at a preset position on the bearing surface 12. For example, at the preset position, the center of the test piece 800 coincides with the center 15 of the bearing piece 10. When the first detector 40 detects a reflected detection signal, but the intensity of the detection signal is less than the second threshold and greater than the first threshold, it indicates that the test piece 800 has failed to be placed at the preset position on the bearing surface 12.

[0081] In some embodiments, the first detector 40 may include multiple detectors, such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which will not be listed here. Multiple first detectors 40 are evenly distributed around the center of the pressure ring 21. Correspondingly, there are also multiple mounting portions 211, which are evenly distributed around the center of the pressure ring 21, so that the first detectors 40 mounted in the mounting portions 211 can be evenly distributed around the center of the pressure ring 21. Simultaneously, the second region 122 is also provided with multiple through holes 14, each through hole 14 corresponding to one first detector 40 and one mounting portion 211. At this time, multiple first detectors 40 emit detection signals. If any first detector 40 can detect the reflected detection signal and the detected reflected detection signal is greater than a first threshold, it indicates that the bearing surface 12 carries the object to be tested 800, and the reflected detection signal is reflected back from the object to be tested 800. If none of the first detectors 40 detect the reflected detection signal, or if the detected reflected detection signal is less than the first threshold (the signal passes directly through the through hole 14 or is only reflected back by a small amount of the sidewall of the through hole 14), it indicates that the bearing surface 12 does not bear the object to be tested 800. When a preset first number (including all) of the first detectors 40 detect the reflected detection signal, and the intensity of the corresponding first number of detection signals exceeds the second threshold, it indicates that the object to be tested 800 is placed at a preset position on the bearing surface 12. For example, at the preset position, the center of the object to be tested 800 coincides with the center 15 of the bearing member 10. When any one of the first detectors 40 detects the reflected detection signal, and the intensity of the detection signal is greater than the first threshold but less than the second threshold, it indicates that the object to be tested 800 is not placed at the preset position on the bearing surface 12, that is, the center of the object to be tested 800 does not coincide with the center 15 of the bearing member 10. The first detectors 40, which are evenly distributed around the centers of multiple pressure rings 21, can detect whether the center of the component 800 to be tested coincides with the center 15 of the support component 10, so that the detection result of the component 800 to be tested is accurate and reliable. The more first detectors 40 evenly distributed around the centers of the pressure rings 21, the more preset positions can be detected, and the more accurate the detection result of whether the center of the component 800 to be tested coincides with the center 15 of the support component 10 is.

[0082] The clamping components 20 may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here. The number of clamping components 20 corresponds to the number of bearing areas 124. When there are multiple clamping components 20, each clamping component 20 corresponds to one bearing area 124. In the embodiments of this application, as... Figure 4 and Figure 6As shown, there are two clamping components 20. One clamping component 20 corresponds to the bearing area 124a, and the size of the pressure ring 21 in this clamping component 20 corresponds to the size of the first second area 122, so as to clamp the test piece 800 placed on the bearing area 124a into the second area 122 in the bearing area 124a. The other clamping component 20 corresponds to the bearing area 124b, and the size of the pressure ring 21 in this clamping component 20 corresponds to the size of the second second area 122, so as to clamp the test piece 800 placed on the bearing area 124b into the second area 122 in the bearing area 124b.

[0083] The detection device 200 includes a first detection unit 210 and a second detection unit 220. The first detection unit 210 and the second detection unit 220 are respectively disposed on both sides of the support device 100. The first detection unit 210 is opposite to the first surface to be inspected 810, and the second detection unit 220 is opposite to the second surface to be inspected 820.

[0084] The first detection unit 210 and the second detection unit 220 can both be imaging devices with imaging functions, such as cameras. Of course, depending on the required detection results, the first detection unit 210 and the second detection unit 220 can also be other functional devices. For example, when detecting the flatness of the workpiece 800, the first detection unit 210 and the second detection unit 220 can be distance detection devices. By detecting multiple distance values ​​of different areas of the workpiece 800, the greater the difference between the multiple distance values, the more uneven the workpiece 800 is. Thus, by replacing different first detection units 210 and second detection units 220, different detection requirements can be achieved.

[0085] The first detection unit 210 is mounted on the first movable sub-component 421 on the support platform 332. The first detection unit 210 captures a detection image of the first surface to be inspected 810 to perform detection processing on the first surface to be inspected 810 based on the detection image. The first detection unit 210 can capture a complete image of the first surface to be inspected 810, thereby completing the detection of the entire first surface to be inspected 810 in one go; the first detection unit 210 can also capture images multiple times, moving the support device 100 via the first movable component 410, so that the first detection unit 210 obtains a detection image of a second inspection area 811 of the first surface to be inspected 810 in each capture. Since the second inspection area 811 is a part of the first surface to be inspected 810, and the resolution of the first detection unit 210 remains constant, the detection image obtained by the first detection unit 210 from the second inspection area 811 contains more detail than capturing a complete image of the first surface to be inspected 810, thus more accurately completing the detection of the entire first surface to be inspected 810. For example, by comparing the detected image with a preset defect image template, defects on the second surface to be inspected 820 can be detected, and the type of defect can be determined according to the defect image template that matches the defect (e.g., if the defect image template that matches the defect is a short circuit image template, then the defect is a short circuit), thereby accurately detecting the defect.

[0086] The second detection unit 220 is disposed on the second movable sub-component 422 located within the mounting slot 313. The second detection unit 220 detects the second surface to be inspected 820 by photographing the through hole 16 (e.g., ...). Figure 4 The detection images of the first inspection area 821 corresponding to the first through hole 161 and the second through hole 162 shown are used to perform detection processing on the first inspection area 821 based on the detection images. The second detection unit 220 can capture a complete image of the second inspection surface 820, thereby completing the detection of multiple first inspection areas 821 of the entire first inspection surface 810 at one time; the second detection unit 220 can also capture images multiple times, and the first moving member 410 moves the supporting device 100 so that the second detection unit 220 obtains a detection image of a first inspection area 821 each time it captures an image. Since the first inspection area 821 is part of the second inspection surface 820, and the resolution of the second detection unit 220 is constant, the detection image obtained by the second detection unit 220 from the second inspection area 811 can contain more details than the complete image of the second inspection surface 820. This allows for a more accurate detection of the entire second inspection surface 820. For example, by comparing the detection image with a preset defect image template, defects in the second inspection surface 820 can be detected. Based on the defect image template that matches the defect, the type of defect can be determined (e.g., if the defect image template that matches the defect is a bubble image template, then the defect is a bubble), thereby accurately detecting the defect.

[0087] To simultaneously inspect the first inspection surface 810 and the second inspection surface 820, the first optical axis O1 and the second optical axis O2 can be aligned. When the first moving member 410 moves the supporting device 100, the positions of the second inspection area 811 detected by the first detection unit 210 and the first inspection area 821 detected by the second detection unit 220 correspond. In this way, the inspection of the first inspection surface 810 and the second inspection surface 820 can be achieved simultaneously.

[0088] Please gather. Figure 3 and 4 The feeding device (not shown) can be a separate device for placing the test piece 800 on the bearing surface 12. To ensure accurate placement of the workpiece 800, the detection system 1000 is further equipped with a second detector 730 and a positioning unit 60. The second detector 730 is mounted on the feeding device, while the positioning unit 60 is mounted on the main body 18. The second detector 730 includes a transmitting part 731 and a receiving part 732 arranged opposite to each other. The second detector 730 has a positioning groove 733 located between the transmitting part 731 and the receiving part 732. The transmitting part 731 is used to transmit detection signals (such as pulse light, infrared light, sound waves, radio waves, etc.) to the receiving part 732. When the positioning unit 60 is positioned within the positioning groove 733, the signal transmitted by the second detector 730 is blocked by the positioning unit 60, and the receiving part 732 cannot receive the detection signal. At this time, it can be determined that the feeding device and the opening 171 are aligned. When the feeding device places the workpiece 800 on the bearing surface 12, the central axis of the workpiece 800 coincides with the central axis of the bearing surface 12, thereby accurately placing the workpiece 800.

[0089] Please combine Figure 1 , Figure 2 and Figure 7 The detection method of this application is used to detect the first inspection surface 810 and the second inspection surface 820 opposite to each other of the inspection piece 800, and includes the following steps:

[0090] 011: Install the part to be tested 800 onto the carrier device 100, the carrier device 100 is provided with a through hole 16;

[0091] 012: The first inspection area 821 corresponding to the through hole 16 in the second inspection surface 820 is inspected by the second inspection unit 220; and

[0092] 013: The first detection unit 210 performs detection processing on the second inspection area 811 in the first inspection surface 810, which corresponds to the position of the first inspection area 821.

[0093] Specifically, during testing, the loading device first mounts the workpiece 800 to be tested onto the bearing surface 12 of the bearing device 100. Then, the second detection unit 220 detects the first inspection area 821 in the second inspection surface 820 corresponding to the through hole 16. Since the first optical axis O1 of the first detection unit 210 and the second optical axis O2 of the second detection unit 220 coincide (i.e., the first optical axis O1, the second optical axis O2, and the optical axis O of the detection device 200 coincide), the first detection unit 210 can simultaneously detect the second inspection area 811 in the first inspection surface 810 corresponding to the position of the first inspection area 821. Here, "positional correspondence" means that the line connecting the centers of the first inspection area 821 and the second inspection area 811 is perpendicular to the optical axis O. In this way, while detecting the second inspection surface 820, the first inspection surface 810 can be detected simultaneously, thereby improving the detection efficiency.

[0094] Please combine Figure 1 , Figure 2 and Figure 8 Step 012 includes the following steps:

[0095] 0121: Move the support device 100 to align the second detection unit 220 with the first inspection area 821;

[0096] 0122: Move the second detection unit 220 so that the second detection unit 220 focuses on the first inspection area 821;

[0097] 0123: The first image is acquired through the second detection unit 220; and

[0098] 0124: Based on the first image, analyze the type of defect and the first location information of the defect in the first inspection area 821.

[0099] Specifically, when inspecting the first inspection area 821 of the second inspection surface 820, in order to improve the inspection accuracy, this embodiment only inspects one first inspection area 821 at a time, and through multiple inspections, it achieves the inspection of all first inspection areas 821.

[0100] The first moving member 410 moves the moving support device 100 on the moving surface 720 so that the second detection unit 220 and a first inspection area 821 are aligned. Alignment means that the optical axis O passes through the center of the first inspection area 821, so that the first inspection area 821 captured by the image is evenly distributed near the center of the first image, reducing the influence of field curvature and distortion of the first image edge on the imaging quality of the first inspection area 821, improving the quality of the first inspection area 821, and thus improving the detection accuracy of the first inspection area 821.

[0101] When aligning to capture the first image, the second moving sub-component 422 moves the second detection unit 220 so that the second detection unit 220 moves along the optical axis O of the second detection unit 220, thereby achieving focus on the first inspection area 821, so that the first inspection area 821 is located on the imaging surface of the second detection unit 220 with clear imaging, and the field of view of the second detection unit 220 just covers the first inspection area 821 (if the field of view of the second detection unit 220 is rectangular and the first inspection area 821 is circular, then the first inspection area 821 is the inscribed circle of the field of view). While improving the imaging quality, it ensures that a first image contains a complete first inspection area 821 to improve detection efficiency.

[0102] After aligning and capturing the first image corresponding to the current first inspection area 821, the first moving member 410 moves the carrier device 100 again so that the second detection unit 220 aligns with other first inspection areas 821 and acquires the first image. Of course, the sizes of different through holes 16 can be the same or different. When the sizes of different through holes 16 are the same, the sizes of different first inspection areas 821 are also the same. Since the second inspection surface 820 is perpendicular to the optical axis O, the distance between each first inspection area 821 and the second detection unit 220 is the same after alignment. At this time, only the focus and field of view of the first aligned first inspection area 821 need to be adjusted to complete the focus and field of view adjustment of all first inspection areas 821. When the sizes of different through holes 16 are different, the field of view needs to be readjusted and the focus refocused so that the first inspection area 821 is just covered by the field of view of the second detection unit 220, and the first inspection area 821 is located on the imaging surface of the second detection unit 220 with clear imaging.

[0103] When detecting the first image, detection can be performed on each first image captured, or all first images can be detected after they have all been acquired. In this embodiment, detection is performed on each first image captured, with capturing and detection occurring simultaneously, thereby improving detection efficiency.

[0104] The detection system 1000 may also include a processing device 500, such as a processing circuit or a processing chip. The processing device 500 may be disposed on the base 300. After acquiring the first image, the processing device 500 performs defect detection on the first image. For example, it compares the first image with a preset defect image template to detect the type of defect in the first image and determines the first position information of the defect based on the position of the defect in the first image.

[0105] Since the position of the through hole 16 in the carrier is fixed, after the test piece 800 is placed and pressed on the carrier surface 12, the position of the center of the first test area 821 corresponding to the through hole 16 in the second test surface 821 is also fixed. Then, based on the relative position of the defect with respect to the center of the first test area 821 in the first image, the first position information of the defect in the second test surface 820 can be determined. The first position information can be the position coordinates of the first coordinate system with the center of the second test surface 820 as the origin.

[0106] Please combine Figure 1 , Figure 2 and Figure 9 Step 013 includes the following steps:

[0107] 0131: The second image is acquired through the first detection unit 210;

[0108] 0132: Obtain the second location information corresponding to the first location information based on the first location information and the second image;

[0109] 0133: Output the detection results based on the second location information and the type of defect.

[0110] Specifically, when the second detection unit 220 acquires the first image, the first detection unit 210 simultaneously acquires the second image. At this time, the shooting area corresponding to the second image is the second inspection area 811. Since the first optical axis O1 and the second optical axis O2 coincide, the positions of the first inspection area 821 and the second inspection area 811 correspond. Based on the first position information of the defect, the second position information corresponding to the first position information in the second image can be determined. The second coordinate system with the center of the first inspection surface 810 as the origin corresponds to the first coordinate system. The horizontal and vertical axes of the two are parallel. At this time, the position coordinates corresponding to the first position information are the position coordinates corresponding to the second position information. Then, based on the position coordinates of the second position information, the grain corresponding to the position coordinates can be accurately located in the second image, thereby determining the position of the grain in the entire grain pattern on the first inspection surface 810.

[0111] To determine the position of a grain within the entire grain pattern, a third image of the entire first inspection surface 810 can be acquired first, thus obtaining the arrangement of the entire grain pattern. For example, the grain pattern may be arranged in a 100*100 matrix. Based on the position of the second inspection area 811 within the entire first inspection surface 810, the position of the second image in the third image can be determined, thereby determining the position of the grain corresponding to the defect within the entire grain pattern (e.g., the grain corresponding to the defect is in row 25, column 15 of the grain pattern). This associates the grain position with the corresponding defect, and outputs the detection result based on the grain position and the type of defect.

[0112] In other embodiments, after determining the position of the grain, the grain can be inspected according to the second image to detect whether there are defects such as short circuits, open circuits, scratches, dirt, etc., and the position of the grain, the defects of the grain itself (i.e., the defects in the first inspection surface 810) and the defects of the backing film corresponding to the grain (i.e., the defects in the first inspection area 821 of the second inspection surface 820 corresponding to the grain) are output as the detection results.

[0113] Please combine Figure 1 , Figure 2 and Figure 10 After the component to be tested 800 is installed on the carrier device 100, the testing method further includes:

[0114] 014: The test piece 800 is detected by multiple first detectors to obtain multiple detection results;

[0115] 015: If any test result indicates that the bearing surface 12 of the bearing device 100 does not bear the test piece 800 or the test piece 800 is not placed in the preset position, it is determined that the test piece 800 is in an eccentric state.

[0116] Specifically, the multiple through holes 14 corresponding to the multiple first detectors 40 are all located in the same circle (hereinafter referred to as the positioning circle). The center of the positioning circle coincides with the center 123 of the bearing surface 12, and the multiple through holes 14 are tangent to the positioning circle. When the test piece 800 is installed and pressed against the bearing surface 12, if the test piece 800 is aligned with the bearing surface 12, the test piece 800 just covers the positioning circle.

[0117] After the test piece 800 is installed and pressed onto the bearing surface 12, the first detector 40 performs in-situ detection to obtain the detection result, which includes whether the bearing surface 12 does not bear the test piece 800 or whether the test piece 800 is not placed in the preset position.

[0118] When the bearing surface 12 does not bear the object to be tested 800, the object to be tested 800 cannot block the light path of the first detector 40. After the first detector 40 emits a detection signal (taking the detection signal as light as an example for explanation), all the light rays are emitted from the through hole 14. The first detector 40 cannot receive the reflected light rays or only receives a very small portion of the light rays reflected from the side wall of the through hole 14. When the first detector 40 does not receive the reflected light rays (i.e., the detection signal is 0) or the detection signal is less than the first threshold, the processing device 500 can determine that the bearing surface 12 does not bear the object to be tested 800. The first threshold can be determined based on the detection signal received when the object to be tested 800 is not placed. When the test piece 800 is not placed in the preset position (the preset position is the position where the test piece 800 just covers the positioning circle), the emitted light from the first detector 40 may be partially reflected by the test piece 800 and partially emitted from the through hole 14. That is to say, the test piece 800 only partially blocks the through hole 14. At this time, the intensity of the reflected light received by the first detector 40 is smaller than that when the test piece 800 completely blocks the through hole 14 in the preset position. Therefore, when the intensity of the reflected light received by the first detector 40 is less than the second threshold (that is, the intensity of the reflected light when the test piece 800 completely blocks the through hole 14 in the preset position) and greater than the first threshold, the processing device 500 determines that the test piece 800 is not placed in the preset position.

[0119] After acquiring three detection results from multiple first detectors 40 (specifically three), the processing device 500 can determine that the component 800 does not cover the positioning circle if any detection result indicates that the bearing surface 12 does not support the component 800 or the component 800 is not placed in the preset position. In this case, the component 800 and the bearing surface 12 are misaligned (i.e., the line connecting the center of the component 800 and the center 123 of the bearing surface 12 is not parallel to the optical axis O), and the component 800 is in an off-center state. This allows for accurate determination of whether the component 800 and the bearing surface 12 are aligned, improving the accuracy of subsequent detection of the component 800.

[0120] When the test piece 800 is in an eccentric state, the clamping component 20 cancels the clamping of the test piece 800, and the feeding device can remove the test piece 800 and place it again. If the test piece 800 and the bearing surface 12 cannot be aligned after multiple placements, it will indicate that the test piece 800 cannot be tested.

[0121] In the description of this specification, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0122] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code of a program comprising one or more steps for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0123] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A detection system, characterized in that, include: A carrier device is used to carry a test piece, the test piece including a first test surface and a second test surface facing away from each other. The carrier device includes a carrier member, the carrier member including a carrier surface for carrying the test piece and an air passage provided on the carrier member. The carrier surface includes a first region and a second region surrounding the first region. The air passage is used to draw air to adsorb the test piece onto the first region. The portion of the carrier member corresponding to the first region is provided with a plurality of through holes. and The detection device includes a first detection unit and a second detection unit, which are disposed on opposite sides of the support device. The first detection unit is opposite to the first surface to be inspected, and the second detection unit is opposite to the second surface to be inspected. The second detection unit is used to detect a first area to be inspected in the second surface to be inspected corresponding to the through hole, and the first detection unit is used to detect a second area to be inspected in the first surface to be inspected. The first area to be inspected and the second area to be inspected are positioned correspondingly. The optical axis of the first detection unit is perpendicular to the support surface, the optical axis of the second detection unit is perpendicular to the support surface, and the optical axes of the first detection unit and the second detection unit overlap.

2. The detection system according to claim 1, characterized in that, The diameter of the through hole ranges from [10 mm to 40 mm]; and / or, There are multiple through holes, and the multiple through holes are evenly distributed relative to the center of the support member.

3. The detection system according to claim 1, characterized in that, The supporting device includes: A clamping assembly, wherein the clamping assembly is used to clamp the test piece against the second region; and A driving component, connected to the clamping assembly, is used to drive the clamping assembly to move relative to the carrier to selectively clamp or release the object to be tested.

4. The detection system according to claim 3, characterized in that, The clamping assembly includes: A pressure ring corresponding to the second region, the pressure ring being connected to the driving member, the driving member being used to drive the pressure ring to move relative to the carrier member, so as to press the test piece into the second region; A pressure block is installed on the first side of the pressure ring to press the workpiece to be tested against the second region, the first side being opposite to the bearing surface; the pressure block is annular and corresponds to the second region; or the pressure block comprises multiple blocks, which are evenly distributed around the center of the pressure ring.

5. The detection system according to claim 4, characterized in that, The supporting device further includes: A first detector is disposed on the pressure ring. The first detector is used to emit a detection signal and output a detection result based on the reflected detection signal. The detection result includes whether the bearing surface carries the object to be tested, and whether the object to be tested is placed in a preset position when the bearing surface carries the object to be tested.

6. The detection system according to claim 3, characterized in that, The air passage includes multiple grooves disposed in the first region and air holes communicating with the grooves, the air holes being used to communicate with the air extraction unit; or The air passage includes multiple grooves disposed in the first region, a connecting groove communicating with the grooves, and an air hole. The grooves are connected to the air extraction unit through the connecting groove and the air hole.

7. The detection system according to claim 3, characterized in that, The carrier also includes: The subject; and The support portion is disposed on a first side of the main body, and the bearing surface is located on the side of the support portion away from the main body. The driving member is mounted on the main body. The support portion is provided with an opening penetrating the side wall of the support portion, and the first side is the side where the first detection unit is located.

8. The detection system according to claim 7, characterized in that, The detection system further includes a feeding device, a second detector, and a detection positioner. The second detector is disposed on the feeding device, and the detection positioner is disposed on the main body. The second detector cooperates with the detection positioner and is used together to detect whether the opening is aligned with the feeding device. The feeding device is used to place the part to be tested on the bearing surface when it is aligned with the opening.

9. The detection system according to any one of claims 3-8, characterized in that, Both the first region and the second region include multiple regions, and the multiple first regions and multiple second regions are alternately arranged. Multiple bearing regions are formed radiating from the center of the bearing member to each second region. The multiple bearing regions can bear the test pieces of different sizes.

10. The detection system according to claim 1, characterized in that, The detection system further includes a base and a moving device. The moving device is disposed on the base, and the bearing device and the detection device are disposed on the moving device. The moving device is used to move the bearing device and / or the detection device to change the relative position of the object to be detected and the detection device.

11. The detection system according to claim 10, characterized in that, The moving device includes a first moving member and a second moving member. The carrying device is disposed on the first moving member, and the detection device is disposed on the second moving member. The first moving member is used to control the carrying device to move on a moving surface parallel to the carrying surface of the carrying device, so as to change the horizontal relative position between the object to be detected and the detection device. The second moving member is used to control the detection device to move along the optical axis of the detection device, so as to change the relative position between the object to be detected and the detection device.

12. The detection system according to claim 11, characterized in that, The second moving component includes a first moving sub-component and a second moving sub-component. The first moving sub-component and the second moving sub-component are respectively used to mount the first detection unit and the second detection unit. The first moving sub-component is used to control the first detection unit to move along the optical axis of the first detection unit to change the relative position of the object to be detected and the first detection unit. The second moving sub-component is used to control the second detection unit to move along the optical axis of the second detection unit to change the relative position of the object to be detected and the second detection unit.

13. The detection system according to claim 12, characterized in that, The base includes: A substrate, wherein the second movable sub-component is disposed on the substrate; A movable stage, wherein the movable stage is disposed on the substrate, and the first movable member is disposed on the movable stage; and A support frame is disposed on the base plate, and the first movable sub-component is disposed on the support frame.

14. The detection system according to claim 13, characterized in that, The movable stage includes a first movable stage and a second movable stage. The first movable component includes a third movable sub-component, a fourth movable sub-component, and a movable plate. The third movable sub-component is disposed on the first movable stage, and the fourth movable sub-component is disposed on the second movable stage. The movable plate is disposed on the third and fourth movable sub-components. The third and fourth movable sub-components cooperate to change the position of the movable plate on the movable surface. The movable plate includes a top surface and a bottom surface facing away from each other. The supporting device is disposed on the top surface. The first movable stage and the second movable stage are located at both ends of the supporting device. The first movable stage, the second movable stage, the bottom surface, and the substrate form an installation space. The second movable sub-component is disposed on the substrate and located within the installation space.

15. The detection system according to claim 14, characterized in that, The upper surface of the substrate is provided with a mounting groove, and the second movable sub-component is at least partially disposed in the mounting groove and located within the mounting space.

16. A detection method, characterized in that, The method, used in the detection system according to any one of claims 1-15, comprises: The component to be tested is mounted on the carrier device, and the carrier device is provided with a through hole; The second detection unit performs detection processing on the first inspection area corresponding to the through hole in the second inspection surface; and The first detection unit performs detection processing on the second inspection area in the first inspection surface, which corresponds to the position of the first inspection area.

17. The detection method according to claim 16, characterized in that, The step of detecting the first inspection area corresponding to the through hole in the second inspection surface through the second detection unit includes: Move the support device to align the second detection unit with the first area to be inspected; Move the second detection unit to focus on the first area to be detected; The first image is acquired through the second detection unit; and Based on the first image, the type of defect and the first location information of the defect in the first area to be inspected are analyzed.

18. The detection method according to claim 17, characterized in that, The step of detecting the second inspection area on the first inspection surface corresponding to the position on the second inspection surface using the first detection unit includes: The second image is obtained through the first detection unit; Based on the first location information and the second image, obtain second location information corresponding to the first location information; and The detection result is output based on the second location information and the type of the defect.

19. The detection method according to claim 16, characterized in that, After installing the component to be tested onto the carrier device, the method further includes: The object to be detected is detected by multiple first detectors to obtain multiple detection results; and If any of the detection results indicate that the bearing surface of the bearing device does not bear the object to be tested or the object to be tested is not placed in the preset position, the object to be tested is determined to be in an eccentric state.

Citation Information

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