Production device and production process of a multifunctional chip

Abstract

The present invention relates to the technical field of chip production, and discloses a production device and a production process for a multi-functional chip. The production process for the multi-functional chip is completed in cooperation with a production device for the multi-functional chip. The production device for the multi-functional chip includes a bottom plate, and a positioning mechanism and a U-shaped frame are arranged above the bottom plate, and the U-shaped frame is located above the positioning mechanism. In the production process for the multi-functional chip, through the provided threaded strip path, the threaded cylinder can move on the rotating shaft and drive the sliding column to move under the guidance of the connecting column, and then the connecting plate, the fixing column and the second rubber pad clamp the chip body under the action of the first spring, which can adapt to chips of different specifications and has high applicability. Through the provided rotating shaft, the chip body can be turned over under the guidance of the first bearing, so that the connecting column falls into other support frames and U-shaped frames.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and specifically provides a production process for a multi-functional chip and a production device for a multi-functional chip. Background Technique

[0002] A chip is an integrated circuit, also known as a microcircuit, microchip, or wafer. In electronics, a chip is a way to miniaturize a circuit, mainly including semiconductor devices, but also including passive components, etc., and is often fabricated on the surface of a semiconductor wafer. Integrated circuits have two main advantages over discrete transistors: cost and performance. The cost is low because the chip prints all components as a single unit through photolithography technology, rather than manufacturing only one transistor at a time. The performance is high because the components switch quickly and consume less energy because the components are small and close to each other.

[0003] There are many classification methods for integrated circuits. According to whether the circuit is analog or digital, they can be divided into: analog integrated circuits, digital integrated circuits, and mixed-signal integrated circuits (analog and digital on one chip). Digital integrated circuits can contain anything, with thousands to millions of logic gates, flip-flops, multiplexers, and other circuits on a few square millimeters. Integrated circuits can integrate analog and digital circuits on a single chip to make devices such as analog-to-digital converters and digital-to-analog converters. This type of circuit provides a smaller size and lower cost, but care must be taken with signal conflicts.

[0004] The complete process of chip manufacturing includes several links such as chip design, wafer manufacturing, package manufacturing, and testing. Among them, the wafer manufacturing process is particularly complex. During the production of chips, a clamping device is required to fix the chips. However, during the production and manufacturing of chips, the chips need to be flipped to process different surfaces of the chips. Currently, when flipping the chips, it is necessary to manually remove the chips from the clamping device, turn them over, and then reinstall them on the fixture. The operation process is relatively cumbersome, affecting the processing efficiency of the chips. Moreover, most of the existing fixtures can only clamp chips of a single size and are difficult to adapt to the production of chips of different specifications, resulting in low applicability of the device. In addition, the existing devices and operation methods usually easily cause damage to the chip body. Therefore, we propose a production process and device for a multi-functional chip. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a production device for a multi-functional chip and its production process, which have the advantages of quickly flipping the chips and being able to adapt to chips of different specifications, and solve the problems raised in the background technique.

[0006] To achieve the above object of quickly flipping the chip and being able to apply to chips of different specifications, the present invention provides the following technical solutions: A production process of a multi-functional chip, which is completed by cooperating with a production device of a multi-functional chip. The production device of the multi-functional chip includes a bottom plate. Above the bottom plate, there is a positioning mechanism and a U-shaped frame, and the U-shaped frame is located above the positioning mechanism. Inside the U-shaped frame, there are a flipping limiting mechanism, a supporting mechanism and a size adjusting mechanism. Both ends of the U-shaped frame are provided with two first grooves;

[0007] The production process of the multi-functional chip specifically includes the following steps:

[0008] S1. Quick positioning: First, move the U-shaped frame so that the U-shaped frame is quickly positioned under the magnetic force of the first magnet and the second magnet. By setting the first magnet and the second magnet, the U-shaped frame can be quickly moved, thereby quickly positioning the chip body, and further improving the convenience of processing the chip body inside the U-shaped frame;

[0009] S2. Clamping and fixing: According to the size of the chip body, rotate the threaded cylinder so that the threaded cylinder moves along the rotating shaft under the action of the threaded path, thereby driving the sliding column to move along with the threaded cylinder under the action of the second bearing. Move the threaded cylinder and the connecting plate to a rough position that conforms to the size of the chip body, and decide to move several support columns between the fixed column and the connecting plate. Then, squeeze the connecting plate so that the connecting plate squeezes the first spring. By setting the first spring, the chip body can be quickly clamped, which is convenient and fast. By placing the chip body between the connecting plate and the fixed column, the second rubber pad, the connecting plate and the fixed column limit and fix the chip body under the reset action of the first spring. By setting the second rubber pad, the chip body can be protected from being clamped and damaged. By setting the first spring, the chip body can be quickly clamped, which is convenient and fast, making the device have the effect of being able to adapt to chip bodies of different specifications;

[0010] S3. Flipping and fixing: After processing one side of the chip body, rotate the rotating shaft so that the rotating shaft drives the connecting column to move through the fixed column, thereby driving the sliding column and the connecting plate to move. Rotate the connecting column between another support frame and the U-shaped frame, so that the support frame supports the connecting column, and limit and fix the connecting column through the guide rod, the sleeve, the second spring and the clamping plate. By setting the second spring, the clamping plate can limit and fix the connecting column through the guide rod, avoiding the connecting column from moving easily. At the same time, the processed side of the chip body contacts the first rubber pad. By setting the first rubber pad and the support column, the chip body can be supported, making the chip body more stable during production and processing. The first rubber pad supports the chip body, so that the other side of the chip body can be processed;

[0011] S4. Finished product: The finished product of the chip body can be obtained by completing the processing of each side of the chip body.

[0012] Preferably, the positioning mechanism includes a first magnet, a second magnet and four positioning holes. The four positioning holes are respectively opened at the four corners of the bottom plate. The first magnet is fixedly embedded in the middle of the upper surface of the bottom plate. The second magnet is placed on the upper surface of the first magnet. The bottom surface of the U-shaped frame is fixedly connected to the upper surface of the second magnet.

[0013] Preferably, the size adjusting mechanism includes a rotating shaft. The rotating shaft is located inside the U-shaped frame. Both ends of the rotating shaft penetrate through the U-shaped frame and are rotatably connected to the U-shaped frame through two first bearings. A fixed column is fixedly connected to the outer surface of the rotating shaft. A threaded groove is provided in the middle of the outer surface of the rotating shaft. A threaded cylinder is provided outside the rotating shaft, and the rotating shaft is threadedly connected to the threaded cylinder through the threaded groove. The outer surface of the threaded cylinder is rotatably connected to a sliding column through a second bearing. A connecting plate is provided between the sliding column and the fixed column. One end of the connecting plate away from the fixed column is fixedly connected with two first springs, and the ends of the first springs away from the connecting plate are fixedly connected to the outer surface of the sliding column. A connecting column is fixedly connected to one side surface of the fixed column close to the sliding column. The outer surface of the connecting column away from the fixed column is provided with anti-slip lines. One end of the connecting column away from the fixed column sequentially penetrates through the connecting plate and the sliding column and extends to the outside of the U-shaped frame, and the connecting column is slidably connected to the sliding column and the connecting plate. A chip body is provided between the connecting plate and the fixed column.

[0014] Preferably, the flipping limiting mechanism includes two U-shaped frames and two support frames. The two support frames are both fixedly connected to the inner wall of the U-shaped frame. The two support frames are both adapted to the connecting column. The two U-shaped frames are both fixedly connected to the back surface of the U-shaped frame. A set of clamping plates is provided inside each U-shaped frame. Each set of clamping plates is adapted to the connecting column. Two guide rods are fixedly connected to the side surfaces of each set of clamping plates away from each other. Two sets of sleeves are fixedly connected to the inner walls of each U-shaped frame, and the guide rods are slidably connected inside the sleeves. A second spring is provided inside each sleeve, and the two ends of the second spring are respectively fixedly connected to one end of the guide rod and the inner wall of the sleeve.

[0015] Preferably, the support mechanism includes two guide shafts, four second grooves and support columns arranged at equal intervals. The four second grooves are respectively opened on the outer surfaces of the sliding column and the fixed column. Both ends of the two guide shafts are fixedly connected to the inner wall of the U-shaped frame. The two guide shafts both penetrate through the support columns and are slidably connected to the support columns. A first rubber pad is fixedly connected to the upper surface of each support column, and the bottom surface of the chip body is in contact with the upper surface of the first rubber pad.

[0016] Preferably, a rotating wheel is provided on the front surface of the U-shaped frame, and the rotating wheel is fixedly connected to the front surface of the rotating shaft. Second rubber pads are fixedly connected to the mutually approaching side surfaces of the connecting plate and the fixed column, and the outer surface of the chip body is in contact with the outer surface of the second rubber pad. A third rubber pad is fixedly connected to the bottom surface of the bottom plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. For the production process and production device of the multifunctional chip, through the provided threaded strip path, the threaded cylinder can move on the rotating shaft and drive the sliding column to move under the guidance of the connecting column. Then, the connecting plate, the fixed column, and the second rubber pad clamp the chip body under the action of the first spring, which can adapt to chips of different specifications and improve the applicability of the device.

[0019] 2. For the production process and production device of the multifunctional chip, by rotating the rotating shaft, the rotating shaft drives the connecting column to move through the fixed column, so that the sliding column and the connecting plate move accordingly. Rotate the connecting column between another support frame and the U-shaped frame, and the support frame supports the connecting column. At the same time, the processed side of the chip body contacts the first rubber pad, and the first rubber pad supports the chip body, so that the other side of the chip body can be processed.

[0020] 3. For the production process and production device of the multifunctional chip, by dropping the connecting column into another support frame and the U-shaped frame, and through the provided support frame that can support the connecting column, the clamping plate quickly clamps and fixes the guide rod under the action of the guide rod, the sleeve, and the second spring, simplifies the operation steps, and improves the efficiency of chip processing.

[0021] 4. For the production process and production device of the multifunctional chip, through the provided positioning holes, the bottom plate can be installed below the external chip processing mechanism, and through the provided first magnet and second magnet, the U-shaped frame can be further moved, thereby quickly positioning the U-shaped frame and facilitating the processing of the chip body inside the U-shaped frame.

[0022] 5. For the production process and production device of the multifunctional chip, through the provided support columns and the first rubber pad, the chip body can be supported, and through the provided guide shaft, the support columns can slide on the guide shaft, so that according to chips of different specifications, the support columns with suitable sizes and quantities for the chip body can be moved to the bottom of the chip body, making the production of the chip body more stable.

[0023] 6. For the production process and production device of the multifunctional chip, through the provided rotating wheel, it is convenient to rotate the rotating shaft. By using the provided second rubber pad, the chip body can be protected from being clamped and damaged. Brief Description of the Drawings

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the connection structure of the U-shaped frame and the rotating shaft in the right view direction of the present invention;

[0026] Figure 3 It is a schematic diagram of the connection structure of the U-shaped frame and the rotating shaft in the left view direction of the present invention;

[0027] Figure 4 For the present invention Figure 3 The enlarged schematic diagram of the structure at A in;

[0028] Figure 5 For the present invention Figure 3 The enlarged schematic diagram of the structure at B in;

[0029] Figure 6 It is a sectional view of the connection between the sleeve and the guide rod of the present invention;

[0030] Figure 7 It is a process flow chart of the production of the multifunctional chip of the present invention.

[0031] In the figure: 1, bottom plate; 2, positioning mechanism; 21, first magnet; 22, second magnet; 23, positioning hole; 3, flipping limit mechanism; 31, U-shaped frame; 32, support frame; 33, clamping plate; 34, guide rod; 35, sleeve; 36, second spring; 4, support mechanism; 41, guide shaft; 42, support column; 43, first rubber pad; 44, second groove; 5, size adjustment mechanism; 50, threaded path; 51, sliding column; 52, connecting plate; 53, fixed column; 54, connecting column; 55, first spring; 56, rotating shaft; 57, threaded cylinder; 58, first bearing; 59, second bearing; 6, second rubber pad; 7, U-shaped frame; 8, chip body; 9, rotating wheel; 10, third rubber pad; 11, first groove; 12, anti-slip pattern. Detailed Description of the Invention

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Embodiment

[0034] Please refer to Figure 1-7, a production device and production process of a multifunctional chip. The production device with the multifunctional chip includes a bottom plate 1. Above the bottom plate 1, there is a positioning mechanism 2 and a U-shaped frame 7, and the U-shaped frame 7 is located above the positioning mechanism 2. Inside the U-shaped frame 7, there are a flipping and limiting mechanism 3, a supporting mechanism 4 and a size adjusting mechanism 5. Two first grooves 11 are opened at both ends of the U-shaped frame 7;

[0035] The production process of the multifunctional chip specifically includes the following steps:

[0036] S1. Quick positioning: First, move the U-shaped frame 7 so that the U-shaped frame 7 is quickly positioned under the magnetic force of the first magnet 21 and the second magnet 22. By setting the first magnet 21 and the second magnet 22, the U-shaped frame 7 can be quickly moved, thereby quickly positioning the chip body 8, and further improving the convenience of processing the chip body 8 inside the U-shaped frame 7;

[0037] S2. Clamping and fixing: According to the size of the chip body 8, rotate the threaded cylinder 57 so that the threaded cylinder 57 moves along the rotating shaft 56 under the action of the threaded strip path 50, thereby driving the sliding column 51 to move along with the threaded cylinder 57 under the action of the second bearing 59. Move the threaded cylinder 57 and the connecting plate 52 to a general position that conforms to the size of the chip body 8, and determine to move several support columns 42 between the fixed column 53 and the connecting plate 52, and then squeeze the connecting plate 52 so that the connecting plate 52 squeezes the first spring 55. By setting the first spring 55, the chip body 8 can be quickly clamped, which is convenient and fast. By placing the chip body 8 between the connecting plate 52 and the fixed column 53, under the reset action of the first spring 55, the second rubber pad 6, the connecting plate 52 and the fixed column 53 limit and fix the chip body 8. By setting the second rubber pad 6, the chip body 8 can be protected to avoid being damaged by clamping. By setting the first spring 55, the chip body 8 can be quickly clamped, which is convenient and fast, making the device have the effect of being able to adapt to different specifications of the chip body 8;

[0038] S3. Flip and fix: After machining one side of the chip body 8, rotate the rotating shaft 56. The rotating shaft 56 drives the connecting column 54 to move through the fixing column 53, so that the sliding column 51 and the connecting plate 52 move accordingly. Rotate the connecting column 54 between the other support frame 32 and the U-shaped frame 31, so that the support frame 32 supports the connecting column 54, and limit and fix the connecting column 54 through the guide rod 34, the sleeve 35, the second spring 36 and the clamping plate 33. By providing the second spring 36, the clamping plate 33 can limit and fix the connecting column 54 through the guide rod 34, avoiding the easy movement of the connecting column 54. At the same time, the machined side of the chip body 8 contacts the first rubber pad 43. By providing the first rubber pad 43 and the support column 42, the chip body 8 can be supported, making the chip body 8 more stable during production and processing. The first rubber pad 43 supports the chip body 8, so that the other side of the chip body 8 can be machined;

[0039] S4. Finished product: The finished product of the chip body 8 can be obtained after machining each side of the chip body 8.

[0040] Preferably, the positioning mechanism 2 includes a first magnet 21, a second magnet 22 and four positioning holes 23. The four positioning holes 23 are respectively opened at the four corners of the bottom plate 1. The first magnet 21 is fixedly embedded in the middle of the upper surface of the bottom plate 1. The second magnet 22 is placed on the upper surface of the first magnet 21. The bottom surface of the U-shaped frame 7 is fixedly connected to the upper surface of the second magnet 22. By providing the first magnet 21 and the second magnet 22, the U-shaped frame 7 can be quickly moved, thereby quickly positioning the chip body 8.

[0041] Preferably, the size adjustment mechanism 5 includes a rotating shaft 56. The rotating shaft 56 is located inside the U-shaped frame 7. Both ends of the rotating shaft 56 penetrate through the U-shaped frame 7 and are rotatably connected to the U-shaped frame 7 through two first bearings 58. A fixed column 53 is fixedly connected to the outer surface of the rotating shaft 56. A threaded strip path 50 is provided in the middle of the outer surface of the rotating shaft 56. A threaded cylinder 57 is provided outside the rotating shaft 56, and the rotating shaft 56 is threadedly connected to the threaded cylinder 57 through the threaded strip path 50. The outer surface of the threaded cylinder 57 is rotatably connected to a sliding column 51 through a second bearing 59. A connecting plate 52 is provided between the sliding column 51 and the fixed column 53. Two first springs 55 are fixedly connected to one end of the connecting plate 52 away from the fixed column 53, and the ends of the first springs 55 away from the connecting plate 52 are fixedly connected to the outer surface of the sliding column 51. A connecting column 54 is fixedly connected to one side surface of the fixed column 53 close to the sliding column 51. Anti-slip lines 12 are provided on the outer surface of the connecting column 54 away from the fixed column 53. One end of the connecting column 54 away from the fixed column 53 penetrates through the connecting plate 52 and the sliding column 51 in sequence and extends to the outside of the U-shaped frame 7, and the connecting column 54 is slidably connected to the sliding column 51 and the connecting plate 52. A chip body 8 is provided between the connecting plate 52 and the fixed column 53. By providing the first springs 55, the chip body 8 can be quickly clamped, which is convenient and fast.

[0042] Preferably, the flipping limiting mechanism 3 includes two U-shaped frames 31 and two support frames 32. The two support frames 32 are both fixedly connected to the inner wall of the U-shaped frame 7. The two support frames 32 are both adapted to the connecting column 54. The two U-shaped frames 31 are both fixedly connected to the back surface of the U-shaped frame 7. A set of clamping plates 33 is provided inside each U-shaped frame 31. Each set of clamping plates 33 is adapted to the connecting column 54. Two guide rods 34 are fixedly connected to the side surfaces of each set of clamping plates 33 away from each other. Two sets of sleeves 35 are fixedly connected to the inner walls of each U-shaped frame 31, and the guide rods 34 are slidably connected to the inside of the sleeves 35. A second spring 36 is provided inside each sleeve 35, and the two ends of the second spring 36 are respectively fixedly connected to one end of the guide rod 34 and the inner wall of the sleeve 35. By providing the second spring 36, the clamping plates 33 can limit and fix the connecting column 54 through the guide rods 34, preventing the connecting column 54 from moving easily.

[0043] Preferably, the support mechanism 4 includes two guide shafts 41, four second grooves 44, and support columns 42 arranged at equal intervals. The four second grooves 44 are respectively opened on the outer surfaces of the sliding column 51 and the fixed column 53. Both ends of the two guide shafts 41 are fixedly connected to the inner wall of the U-shaped frame 7. The two guide shafts 41 penetrate through the support columns 42 and are slidably connected to the support columns 42. A first rubber pad 43 is fixedly connected to the upper surface of each support column 42, and the bottom surface of the chip body 8 is in contact with the upper surface of the first rubber pad 43. By providing the first rubber pads 43 and the support columns 42, the chip body 8 can be supported, making the chip body 8 more stable during production and processing.

[0044] Preferably, a rotating wheel 9 is provided on the front surface of the U-shaped frame 7, and the rotating wheel 9 is fixedly connected to the front surface of the rotating shaft 56. Second rubber pads 6 are fixedly connected to the mutually approaching side surfaces of the connecting plate 52 and the fixed column 53, and the outer surface of the chip body 8 is in contact with the outer surface of the second rubber pad 6. A third rubber pad 10 is fixedly connected to the bottom surface of the bottom plate 1. By providing the second rubber pad 6, the chip body 8 can be protected from being pinched.

[0045] Working principle: First, move the U-shaped frame 7 so that the U-shaped frame 7 is quickly positioned under the magnetic force of the first magnet 21 and the second magnet 22. By providing the first magnet 21 and the second magnet 22, the U-shaped frame 7 can be quickly moved, thereby quickly positioning the chip body 8, and further improving the convenience of processing the chip body 8 inside the U-shaped frame 7. Then, according to the size of the chip body 8, rotate the threaded cylinder 57 so that the threaded cylinder 57 moves along the rotating shaft 56 under the action of the threaded strip path 50, thereby driving the sliding column 51 to move along with the threaded cylinder 57 under the action of the second bearing 59. Move the threaded cylinder 57 and the connecting plate 52 to a rough position that conforms to the size of the chip body 8, and decide to move several support columns 42 between the fixed column 53 and the connecting plate 52. Then, squeeze the connecting plate 52 so that the connecting plate 52 squeezes the first spring 55. By providing the first spring 55, the chip body 8 can be quickly clamped, which is convenient and fast. Then, place the chip body 8 between the connecting plate 52 and the fixed column 53. Under the reset action of the first spring 55, the second rubber pad 6, the connecting plate 52 and the fixed column 53 limit and fix the chip body 8. By providing the second rubber pad 6, the chip body 8 can be protected from being pinched. By providing the first spring 55, the chip body 8 can be quickly clamped, which is convenient and fast, making the device have the effect of being able to adapt to different specifications of the chip body 8, and further improving the applicability of the device. After processing one side of the chip body 8, rotate the rotating shaft 56 so that the rotating shaft 56 drives the connecting column 54 to move through the fixed column 53, thereby driving the sliding column 51 and the connecting plate 52 to move accordingly. Rotate the connecting column 54 to between another support frame 32 and the U-shaped frame 31, so that the support frame 32 supports the connecting column 54, and limit and fix the connecting column 54 through the guide rod 34, the sleeve 35, the second spring 36 and the clamping plate 33. By providing the second spring 36, the clamping plate 33 can limit and fix the connecting column 54 through the guide rod 34, preventing the connecting column 54 from moving easily. At the same time, the processed side of the chip body 8 is in contact with the first rubber pad 43. By providing the first rubber pad 43 and the support column 42, the chip body 8 can be supported, making the chip body 8 more stable during production and processing, and the first rubber pad 43 supports the chip body 8, so that the other side of the chip body 8 can be processed in this way.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A production device for a multi-functional chip, comprising a bottom plate (1), characterized in that: Above the bottom plate (1), there is a positioning mechanism (2) and a U-shaped frame (7), and the U-shaped frame (7) is located above the positioning mechanism (2). Inside the U-shaped frame (7), there is a flipping limit mechanism (3), a support mechanism (4), and a size adjustment mechanism (5). At both ends of the U-shaped frame (7), two first grooves (11) are opened; the positioning mechanism (2) includes a first magnet (21), a second magnet (22), and four positioning holes (23). The four positioning holes (23) are respectively opened at the four corners of the bottom plate (1). The first magnet (21) is fixedly embedded in the middle of the upper surface of the bottom plate (1). The second magnet (22) is placed on the upper surface of the first magnet (21). The bottom surface of the U-shaped frame (7) is fixedly connected to the upper surface of the second magnet (22); the size adjustment mechanism (5) includes a rotating shaft (56). The rotating shaft (56) is located inside the U-shaped frame (7). Both ends of the rotating shaft (56) penetrate through the U-shaped frame (7) and are rotatably connected to the U-shaped frame (7) through two first bearings (58). The outer surface of the rotating shaft (56) is fixedly connected with a fixed column (53). In the middle of the outer surface of the rotating shaft (56), there is a threaded path (50). Outside the rotating shaft (56), there is a threaded cylinder (57), and the rotating shaft (56) is threadedly connected to the threaded cylinder (57) through the threaded path (50). The outer surface of the threaded cylinder (57) is rotatably connected with a sliding column (51) through a second bearing (59). Between the sliding column (51) and the fixed column (53), there is a connecting plate (52). One end of the connecting plate (52) away from the fixed column (53) is fixedly connected with two first springs (55), and the ends of the first springs (55) away from the connecting plate (52) are fixedly connected to the outer surface of the sliding column (51). One side of the fixed column (53) close to the sliding column (51) is fixedly connected with a connecting column (54). The outer surface of the connecting column (54) away from the fixed column (53) is provided with an anti-slip pattern (12). One end of the connecting column (54) away from the fixed column (53) sequentially penetrates through the connecting plate (52) and the sliding column (51) and extends to the outside of the U-shaped frame (7), and the connecting column (54) is slidably connected to the sliding column (51) and the connecting plate (52). Between the connecting plate (52) and the fixed column (53), there is a chip body (8);The flipping limit mechanism (3) includes two U-shaped frames (31) and two support frames (32). Both of the two support frames (32) are fixedly connected to the inner wall of the U-shaped frame (7). Both of the two support frames (32) are adapted to the connecting column (54). Both of the two U-shaped frames (31) are fixedly connected to the back of the U-shaped frame (7). A set of clamping plates (33) is arranged inside each of the U-shaped frames (31). Each set of the clamping plates (33) is adapted to the connecting column (54). Two guide rods (34) are fixedly connected to the mutually remote side surfaces of each set of the clamping plates (33). Two sets of sleeves (35) are fixedly connected to the inner walls of each of the U-shaped frames (31). The guide rods (34) are slidably connected to the inside of the sleeves (35). A second spring (36) is arranged inside each of the sleeves (35). The two ends of the second spring (36) are respectively fixedly connected to one end of the guide rod (34) and the inner wall of the sleeve (35).; 2. The production device of a multifunctional chip according to claim 1, characterized in that: The support mechanism (4) includes two guide shafts (41), four second grooves (44), and support columns (42) arranged at equal distances. The four second grooves (44) are respectively formed on the outer surfaces of the sliding column (51) and the fixed column (53). Both ends of the two guide shafts (41) are fixedly connected to the inner wall of the U-shaped frame (7). The two guide shafts (41) penetrate through the support columns (42) and are slidably connected to the support columns (42). A first rubber pad (43) is fixedly connected to the upper surface of each support column (42), and the bottom surface of the chip body (8) is in contact with the upper surface of the first rubber pad (43).

3. The production device of a multifunctional chip according to claim 2, characterized in that: A rotating wheel (9) is provided on the front surface of the U-shaped frame (7), and the rotating wheel (9) is fixedly connected to the front surface of the rotating shaft (56). Second rubber pads (6) are fixedly connected to the mutually adjacent side surfaces of the connecting plate (52) and the fixed column (53), and the outer surface of the chip body (8) is in contact with the outer surface of the second rubber pad (6). A third rubber pad (10) is fixedly connected to the bottom surface of the bottom plate (1).

4. A production process of a multi-functional chip, which is completed in cooperation with a production device of a multi-functional chip as described in claim 3, and is characterized in that, It includes the following steps: S1. Quick positioning: First, move the U-shaped frame (7) so that the U-shaped frame (7) is quickly positioned under the magnetic force of the first magnet (21) and the second magnet (22). S2. Clamping and fixing: According to the size of the chip body (8), rotate the threaded cylinder (57) so that the threaded cylinder (57) moves along the rotating shaft (56) under the action of the threaded strip path (50), thereby driving the sliding column (51) to move along with the threaded cylinder (57) under the action of the second bearing (59). Move the threaded cylinder (57) and the connecting plate (52) to a position that conforms to the size of the chip body (8), and determine to move the support column (42) between the fixed column (53) and the connecting plate (52). Then, squeeze the connecting plate (52) so that the connecting plate (52) squeezes the first spring (55). By placing the chip body (8) between the connecting plate (52) and the fixed column (53), the second rubber pad (6), the connecting plate (52), and the fixed column (53) limit and fix the chip body (8) under the reset action of the first spring (55). S3. Flipping and fixing: After processing one side of the chip body (8), rotate the rotating shaft (56) so that the rotating shaft (56) drives the connecting column (54) to move through the fixed column (53), thereby driving the sliding column (51) and the connecting plate (52) to move accordingly. Rotate the connecting column (54) between another support frame (32) and the U-shaped frame (31) so that the support frame (3) supports the connecting column (54), and limit and fix the connecting column (54) through the guide rod (34), the sleeve (35), the second spring (36), and the clamping plate (33). By providing the second spring (36), the clamping plate (33) can limit and fix the connecting column (54) through the guide rod (34). At the same time, the processed side of the chip body (8) is in contact with the first rubber pad (43). S4. Finished product: After completing the processing of each side of the chip body (8), the finished product of the chip body (8) can be obtained.

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