Dispensing systems and methods including on-line remixing of thermal management and / or EMI mitigation materials

Abstract

Dispensing systems and methods including on-line remixing of thermal management and / or EMI mitigation materials. Exemplary embodiments of systems and methods for dispensing thermal management and / or EMI mitigation materials are disclosed. The systems and methods include on-line remixing prior to dispensing the thermal management and / or EMI mitigation materials. In exemplary embodiments, a system is provided that includes an on-line remixer configured to be operable to: receive the thermal management and / or EMI mitigation material including one or more functional fillers supplied into the matrix; and remix the one or more functional fillers including filler sedimentation (if any) within the matrix prior to dispensing the thermal management and / or EMI mitigation material. The remixing can reduce the filler sedimentation (if any) within the matrix, resulting in improved viscosity and flow rate of the thermal management and / or EMI mitigation material.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to systems and methods for dispensing thermal management and / or EMI mitigation materials. The systems and methods include in-line remixing prior to dispensing the thermal management and / or EMI mitigation materials. BACKGROUND

[0002] This section provides background information related to the present disclosure which is not necessarily prior art.

[0003] Electronic components (e.g., semiconductors, integrated circuit packages, transistors, etc.) typically have a pre-designed temperature at which the electronic components operate best. Ideally, the pre-designed temperature is approximately the temperature of the surrounding air. However, operation of the electronic components generates heat. If the heat is not removed, the electronic components can operate at a temperature significantly higher than their normal or desired operating temperature. Such excessively high temperatures can adversely affect the operational characteristics of the electronic components and associated devices.

[0004] To avoid or at least reduce adverse operational characteristics due to heat generation, heat should be removed, for example, by conducting heat from the operating electronic components to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During conduction, heat can be transferred from the operating electronic components to the heat sink by direct surface contact between the electronic components and the heat sink, and / or by contact of the electronic components with the surface of the heat sink via an intermediate medium or thermal interface material (TIM). Thermal interface materials can be used to fill gaps between heat transfer surfaces in order to improve heat transfer efficiency as compared to gaps filled with air, which is a relatively poor thermal conductor.

[0005] Additionally, a common problem in the operation of electronic devices is the generation of electromagnetic radiation within the electronic circuitry of the device. This radiation can cause electromagnetic interference (EMI) or radio frequency interference (RFI), which can interfere with the operation of other electronic devices within a certain proximity. Without adequate shielding, EMI / RFI interference can cause important signals to be degraded or lost entirely, rendering the electronic device inefficient or unusable.

[0006] A common solution is to ameliorate the effects of EMI / RFI by using shields that are capable of absorbing and / or reflecting and / or redirecting EMI energy. These shields are often used to localize the EMI / RFI within its source and to isolate other devices from proximity to the EMI / RFI source.

[0007] The term "EMI" as used herein shall be taken to generally include and refer to both EMI emissions and RFI emissions, and the term "electromagnetic" shall be taken to generally include and refer to both electromagnetic and radio frequency from both external and internal sources. Thus, the term shielding (as used herein) broadly includes and refers to mitigating (or limiting) EMI and / or RFI, such as by absorbing, reflecting, blocking, and / or redirecting energy or some combination thereof, so that it no longer, for example, violates government regulations and / or interferes with the internal functionality of an electrical component system. SUMMARY

[0008] This section provides a general summary of the disclosure, but is not a comprehensive disclosure of its full scope or all of its features.

[0009] Exemplary embodiments of systems and methods for dispensing thermal management and / or EMI mitigation materials are disclosed. The systems and methods include in-line remixing prior to dispensing the thermal management and / or EMI mitigation materials.

[0010] In exemplary embodiments, a system is provided that includes an in-line remixing device configured to be operable to: receive the thermal management and / or EMI mitigation material including one or more functional fillers supplied into the matrix; and remix the one or more functional fillers including filler sedimentation (if any) within the matrix prior to dispensing the thermal management and / or EMI mitigation material. The remixing can reduce the filler sedimentation (if any) within the matrix, thereby resulting in improved viscosity and flow rate of the thermal management and / or EMI mitigation material.

[0011] Other aspects of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended merely as illustrative and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0012] The drawings described herein are for illustrative purposes only of selected embodiments and are not intended to limit the scope of the present disclosure.

[0013] Figure 1 A system for dispensing thermal management and / or EMI mitigation materials is exemplified in accordance with exemplary embodiments, wherein the system includes an in-line remixing device. DETAILED DESCRIPTION

[0014] Example embodiments will be described more fully hereinafter with reference to the accompanying drawings.

[0015] Composite materials including fillers within a matrix can be used in various applications, such as dispensable thermal interface materials (TIMs) and in-place-forming (FIP) products. However, as recognized herein, settling of the fillers within the matrix can present challenges and hinder the composite material from having a long shelf life. If the composite material is not dispensed until after a long period of time, the fillers can settle within the matrix. For example, the fillers can settle within the matrix during storage and / or transportation of the composite material.

[0016] Filler settling can result in oil / filler separation and changes in flow rate / viscosity over time (e.g., after storage, etc.), which in turn can result in poor dispensing performance of the composite material. The occurrence of changes in flow rate / viscosity over time can hinder and severely limit the use of the composite material. The changes in viscosity / flow rate are primarily due to physical settling of the heavier fillers in the lighter polymer matrix.

[0017] Conventional dispensing equipment adjusts the dispensing pressure to account for the changes in viscosity / flow rate due to filler settling. However, with such conventional dispensing equipment, the dispensing pressure needs to be adjusted frequently. Moreover, if the oil / filler separation is significantly excessive or extreme, the filler loading in the dispensed material can vary greatly. A small variation in filler loading or filler density within the dispensed material can negatively impact the functional properties (e.g., thermal conductivity, electrical conductivity, dielectric absorption, electromagnetic wave absorption, etc.) of the dispensed material.

[0018] In view of the above, exemplary embodiments including systems and methods of remixing (e.g., uniformly remixing, etc.) fillers within a matrix that include filler settling are developed and / or disclosed herein. After remixing the fillers within the matrix (e.g., via a screw extruder, a screw kneader, other inline remixer, etc.), the viscosity / flow rate of the material can thereby be improved and / or restored to its initial viscosity / flow rate. For example, the viscosity / flow rate of the remixed material can be approximately the same as the initial viscosity / flow rate of the material when the fillers were initially mixed within the matrix to make the material and before any filler settling occurred during the long shelf life. Advantageously, the remixing can thereby enable the dispensable material to have a longer shelf life before being dispensed.

[0019] Exemplary embodiments of the systems and methods disclosed herein can be used with various thermal management and / or EMI mitigation materials, such as one-part dispensable materials (e.g., one-part thermal putty, etc.), two-part dispensable materials (e.g., two-part in-place-curing dispensable thermal interface materials (TIMs), etc.), dispensable TIMs, dispensable EMI shielding materials, dispensable EMI absorbing materials, dispensable thermally-conductive EMI absorbers or hybrid thermal / EMI absorbers, dispensable materials with high filler loading and / or high viscosity / flow rates, other dispensable materials, and the like. Accordingly, aspects of the present disclosure should not be limited to remixing any single type of dispensable material.

[0020] In exemplary embodiments, the systems / methods include remixing a dispensable material via an inline remixer (e.g., a screw extruder, a screw kneader, other remixer, etc.) prior to dispensing the dispensable material. The dispensable material can have a high filler loading and / or a high viscosity / flow rate. The dispensable material can include a one-part or two-part dispensable thermal management and / or EMI mitigation material, such as a one-part thermal putty, a two-part in-place-curing TIM, etc. The remixing of the dispensable material is performed upstream of a material dispenser and occurs prior to feeding, conveying, or supplying (e.g., pumping via a high pressure pump, etc.) the dispensable material to the material dispenser. The remixing of the dispensable material can improve or maintain the viscosity / flow rate of the dispensable material. For example, the viscosity / flow rate of the dispensable material can change (e.g., degrade, etc.) over time due to filler settling occurring within a matrix of the dispensable material. In this case, the remixing of the dispensable material can change (e.g., improve, restore, etc.) the viscosity / flow rate of the dispensable material to be substantially the same as the initial viscosity / flow rate of the dispensable material prior to the filler settling occurring. Alternatively, for example, the remixing of the dispensable material can maintain the viscosity / flow rate of the dispensable material by preventing or avoiding filler settling.

[0021] In some example embodiments, the dispensable material includes a one-part dispensable material (e.g., a one-part thermal paste, etc.). In such example embodiments, the system / method includes re-mixing the one-part dispensable material via an inline re-mixer (e.g., a screw extruder, a screw kneader, other re-mixing device, etc.) prior to dispensing the one-part dispensable material. Thus, the re-mixing of the one-part dispensable material is performed upstream of the dispenser, and occurs prior to feeding, conveying, or supplying (e.g., pumping via a high pressure pump, etc.) the one-part dispensable material to the material dispenser or applicator. The re-mixing of the one-part dispensable material can improve or maintain the viscosity / flow rate of the one-part dispensable material. For example, the viscosity / flow rate of the one-part dispensable material can change (e.g., degrade, etc.) over time due to filler settling occurring within the matrix. In such instances, the re-mixing of the one-part dispensable material can change (e.g., improve, restore, etc.) the viscosity / flow rate of the one-part dispensable material to be approximately the same as the initial viscosity / flow rate of the one-part dispensable material prior to the filler settling occurring. Alternatively, for example, the re-mixing of the one-part dispensable material can maintain the viscosity / flow rate of the one-part dispensable material by preventing or avoiding filler settling.

[0022] In other example embodiments, the dispensable material includes a two-part dispensable material (e.g., a two-part in-situ curing dispensable TIM, etc.). In such example embodiments, the system / method includes re-mixing the two-part dispensable material via an inline re-mixer (e.g., a screw extruder, a screw kneader, other re-mixing device, etc.) prior to dispensing the two-part dispensable material. The re-mixing of the two-part dispensable material is performed upstream of the static re-mixer and the material dispenser. Thus, the re-mixing occurs prior to feeding, conveying, or supplying (e.g., pumping via a high pressure pump, etc.) the two-part dispensable material to the static mixer or the material dispenser. The re-mixing of the two-part dispensable material can improve or maintain the viscosity / flow rate of the two-part dispensable material. For example, the viscosity / flow rate of the two-part dispensable material can change (e.g., degrade, etc.) over time due to filler settling occurring within the matrix. In such instances, the re-mixing of the two-part dispensable material can change (e.g., improve, restore, etc.) the viscosity / flow rate of the two-part dispensable material to be approximately the same as the initial viscosity / flow rate of the two-part dispensable material prior to the filler settling occurring. Alternatively, for example, the re-mixing of the two-part dispensable material can maintain the viscosity / flow rate of the two-part dispensable material by preventing or avoiding filler settling.

[0023] Figure 1A system 100 for dispensing thermal management and / or EMI mitigation materials is illustrated in accordance with example implementations of one or more aspects of the present disclosure. As shown, the system 100 includes an inline re-mixer 104 (broadly, a re-mixer). The inline re-mixer 104 can include a screw extruder 108, a screw kneader 112, etc.

[0024] The inline re-mixer 104 can be configured to receive a thermal management and / or EMI mitigation material including one or more functional fillers supplied into the matrix. The inline re-mixer 104 can also be configured to re-mix the one or more functional fillers including filler sedimentation (if any) within the matrix prior to dispensing the thermal management and / or EMI mitigation material. The re-mixing can reduce (e.g., eliminate, etc.) the filler sedimentation (if any) within the matrix, thereby enabling improved viscosity and flow rate of the thermal management and / or EMI mitigation material.

[0025] The system 100 also includes a pump 116 (e.g., a high pressure pump, etc.) and a dispenser or platform 120 (broadly, a dispenser). The inline re-mixer 104 is positioned upstream of the pump 116 to feed re-mixed material from the inline re-mixer 104 to the pump 116. The pump 116 is configured to operate to pump or supply the re-mixed material to the dispenser or platform 120.

[0026] The dispenser or platform 120 is configured to dispense (e.g., via a nozzle, etc.) the re-mixed material onto a surface, such as a board level shield, a printed circuit board, an electrical assembly, a heat source, a heat removal / dissipation structure or assembly (e.g., a heat sink, a heat spreader, a heat pipe, a device housing or object, etc.), etc. For example, the dispenser 120 can dispense the re-mixed thermal management and / or EMI mitigation material opposite, against, and / or adjacent to one or more heat sources and one or more heat removal / dissipation structures, such that the dispensed thermal management and / or EMI mitigation material is used to define or establish at least a portion of a thermal conduction path along which heat can be conducted, typically between the one or more heat sources and the one or more heat removal / dissipation structures. Alternatively, for example, the dispenser 120 can dispense the re-mixed thermal management and / or EMI mitigation material opposite, against, and / or adjacent to one or more device assemblies, such that the dispensed thermal management and / or EMI mitigation material is used to provide EMI mitigation to the one or more device assemblies.

[0027] In example embodiments, systems and methods are configured to remix and distribute a thermal management and / or EMI mitigation material including a matrix (e.g., a polymeric matrix, etc.) and one or more functional fillers within the matrix. The one or more functional fillers can include thermally conductive fillers, electrically conductive fillers, dielectrically absorbing fillers, and / or electromagnetic wave absorbing fillers, etc.

[0028] The one or more functional fillers can include thermally conductive particles, electrically conductive particles, dielectrically absorbing particles, electromagnetic wave absorbing particles, and / or particles having two or more of thermally conductive, electrically conductive, and electromagnetic wave absorbing. For example, the one or more functional fillers can include thermally conductive particles including one or more of zinc oxide, boron nitride, aluminum oxide, aluminum, silicon nitride, aluminum nitride, iron, metal oxides, graphite, silver, copper, ceramic, and / or combinations of these. The one or more functional fillers can include fillers made from iron, ferrite, etc. The fillers can be dielectric absorbers (e.g., carbon black, silicon carbide, etc.). The one or more functional fillers can include EMI absorbing particles that can include one or more of silicon carbide, carbonyl iron, aluminum oxide, manganese zinc ferrite, magnetic flakes, an alloy containing about 85% iron, 9.5% silicon, and 5.5% aluminum, an alloy containing about 20% iron and 80% nickel, siliconized iron, iron-chromium compounds, metallic silver, magnetic alloys, magnetic powders, magnetic particles, nickel-based alloys and powders, chromium alloys, MagniF (ferrite magnetite oxide), and / or combinations of these. The one or more functional fillers can include different grades of the same functional filler particles or different grades of different types of functional filler particles.

[0029] In some example embodiments, the thermal management and / or EMI mitigation material can be used for thermal management purposes and EMI attenuation. For example, the thermal management and / or EMI mitigation material can include a thermally conductive microwave absorber including functional fillers including silicon carbide, carbonyl iron powder, and aluminum oxide. Alternatively, the thermal management and / or EMI mitigation material can include a thermally conductive microwave absorber including functional fillers including silicon carbide, carbonyl iron powder, aluminum oxide, manganese zinc ferrite, and magnetic flakes. Alternatively, the functional fillers can include aluminum oxide, silicon carbide, carbon black, MagniF (ferrite magnetite oxide), etc.

[0030] In some example embodiments, the functional filler can comprise a substantial portion of the total volume of the thermal management and / or EMI mitigation material. For example, the functional filler can be packed into the matrix in a volume percentage (vol%) of about 85 vol% to about 98 vol% (e.g., about 90 vol%, about 98 vol%, greater than 85 vol%, etc.) and / or a weight percentage of at least about 90 wt% or higher. The volume percentages and weight percentages provided in this paragraph are merely exemplary, as other example embodiments can include a higher or lower volume percentage and / or weight percentage of the functional filler.

[0031] The size of the functional filler can vary, such as a particle size of about 0.01 mm to about 1.0 mm (e.g., 0.05 mm to 0.5 mm, 0.07 mm to 0.15 mm, etc.). The shape of the functional filler can also vary, such as round, spherical, flaky, rod-like, etc.

[0032] In some example embodiments, the system can dispense the thermal management and / or EMI mitigation material to define a portion of a conductive heat transfer path, such as from a heat source to a heat rejection / dissipation structure or component (e.g., a heat sink, heat spreader, heat pipe, device housing or enclosure, etc.) that can transfer heat. Generally, the heat source can include any component or device (e.g., an integrated circuit, other PCB component, etc.) that has a higher temperature than the one-piece curable dispensable thermal management and / or EMI mitigation material or otherwise provides or transfers heat to the one-piece curable dispensable thermal management and / or EMI mitigation material, regardless of whether the heat is generated by the heat source or merely transferred through or via the heat source. Accordingly, aspects of the present disclosure should not be limited to any particular use with any single type of heat source, electronic device, heat rejection / dissipation structure, etc.

[0033] Accordingly, example embodiments of systems and methods for dispensing thermal management and / or EMI mitigation material are disclosed. The systems and methods include on-line remixing prior to dispensing the thermal management and / or EMI mitigation material.

[0034] In example embodiments, a system is provided that includes an on-line remixing device configured to be operable to: receive the thermal management and / or EMI mitigation material including one or more functional fillers supplied into the matrix; and remix the one or more functional fillers including any filler sediment (if any) within the matrix prior to dispensing the thermal management and / or EMI mitigation material. The remixing can reduce the filler sediment (if any) within the matrix, thereby resulting in improved viscosity and flow rate of the thermal management and / or EMI mitigation material.

[0035] The inline remixer can include a screw extruder or a screw kneader. The inline remixer can be configured to operate to uniformly remix the one or more functional fillers, including any fillers settling, within the matrix to improve and / or restore the viscosity and flow rate of the thermal management and / or EMI mitigation material after the remixing to be approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to any filler settling. The system can include a dispenser downstream of the inline remixer. The dispenser can be configured to operate to dispense the thermal management and / or EMI mitigation material after the one or more functional fillers, including filler settling (if any), are remixed within the matrix via the inline remixer. The system can include a pump fluidly connected to the inline remixer and the dispenser. The thermal management and / or EMI mitigation material can include at least approximately 90% by weight of the one or more functional fillers within the matrix. The thermal management and / or EMI mitigation material can include a one-part or two-part dispensable thermal management and / or EMI mitigation material. The one or more functional fillers can include one or more of the following particles: thermally conductive particles; electrically conductive particles; dielectrically absorbing particles; electromagnetic wave absorbing particles; and particles having two or more of thermally conductive, electrically conductive, dielectrically absorbing, and electromagnetic wave absorbing. The thermal management and / or EMI mitigation material can include a one-part dispensable thermal paste or a two-part in-place-curing dispensable thermal interface material.

[0036] In example implementations, a method is provided that includes the steps of receiving the thermal management and / or EMI mitigation material including the one or more functional fillers supplied into the matrix; and remixing the one or more functional fillers, including filler settling (if any), within the matrix prior to dispensing the thermal management and / or EMI mitigation material. The remixing can reduce (e.g., eliminate, etc.) the filler settling (if any) within the matrix, resulting in improved viscosity and flow rate of the thermal management and / or EMI mitigation material.

[0037] The method can include the step of waiting for an amount of time sufficient for at least a portion of the one or more functional fillers to settle within the matrix. The method can include the step of remixing the at least a portion of the one or more functional fillers that settled within the matrix, thereby reducing filler settling within the matrix and improving the viscosity and flow rate of the thermal management and / or EMI mitigation material. The method can include the step of using a screw extruder or a screw kneader to remix the one or more functional fillers, including filler settling (if any), within the matrix.

[0038] The method can include the step of re-mixing the one or more functional fillers, including any filler sediment, uniformly within the matrix to improve and / or restore the viscosity and flow rate of the thermal management and / or EMI mitigation material after the re-mixing to be approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to any filler sedimentation.

[0039] The method can include the step of dispensing the thermal management and / or EMI mitigation material after re-mixing the one or more functional fillers, including filler sediment, if any, within the matrix.

[0040] The method can include the steps of allowing at least a portion of the one or more functional fillers to sediment within the matrix; re-mixing the at least a portion of the one or more functional fillers that sedimented within the matrix to reduce the filler sedimentation within the matrix and to improve the viscosity and flow rate of the thermal management and / or EMI mitigation material to be approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to the filler sedimentation; and dispensing the thermal management and / or EMI mitigation material having the improved viscosity and improved flow rate that is approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to the filler sedimentation after the re-mixing.

[0041] The method can include the steps of initially mixing the one or more functional fillers within the matrix to provide the thermal management and / or EMI mitigation material; and allowing at least a portion of the one or more functional fillers to sediment within the matrix after the initial mixing such that the filler sedimentation changes the original viscosity and original flow rate of the thermal management and / or EMI mitigation material. The method can include the steps of re-mixing the at least a portion of the one or more functional fillers that sedimented within the matrix to reduce the filler sedimentation within the matrix and to improve the viscosity and flow rate of the thermal management and / or EMI mitigation material to be approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material.

[0042] The method can include the step of waiting for at least a predetermined period of time during which at least a portion of the one or more functional fillers precipitates within the matrix. After waiting for the predetermined period of time, the method can include the step of then remixing the at least a portion of the one or more functional fillers that precipitates within the matrix prior to dispensing the thermal management and / or EMI mitigation material having an improved viscosity and an improved flow rate that is approximately the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material.

[0043] In this example method, the thermal management and / or EMI mitigation material can include at least about 90% by weight of the one or more functional fillers within the matrix. The thermal management and / or EMI mitigation material can include a one-part or two-part dispensable thermal management and / or EMI mitigation material. The one or more functional fillers can include one or more of the following particles: thermally conductive particles; electrically conductive particles; dielectrically absorbing particles; electromagnetic wave absorbing particles; and particles having two or more of thermally conductive, electrically conductive, dielectrically absorbing, and electromagnetic wave absorbing. The thermal management and / or EMI mitigation material can include a one-part dispensable thermal paste or a two-part in-place-curing dispensable thermal interface material.

[0044] The method can include the step of, after the remixing, dispensing the thermal management and / or EMI mitigation material against, immediately adjacent to, and / or adjacent to one or more heat sources and one or more heat rejection / dissipation structures to cause the dispensed thermal management and / or EMI mitigation material to define or establish at least a portion of a thermally conductive path, generally between the one or more heat sources and the one or more heat rejection / dissipation structures, along which heat can be transferred.

[0045] The method can include the step of, after the remixing, dispensing the thermal management and / or EMI mitigation material against, immediately adjacent to, and / or adjacent to one or more device components to cause the dispensed thermal management and / or EMI mitigation material to provide EMI mitigation to the one or more device components.

[0046] The example implementations are provided so that this disclosure will be thorough, and will fully convey the scope to those who come to this disclosure. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of the present disclosure. One skilled in the relevant art will recognize that the example implementations can be practiced without resorting to the details that have been presented herein. The example implementations are not limited to the specific details set forth, and can be practiced with other components, devices, and methods. In some example implementations, well-known processes, well-known structures, and well-known

[0047] The specific dimensions, specific materials, and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the disclosure. The disclosure herein of particular values and particular ranges of values for a given parameter are not intended to be limiting and are only provided for the purpose of exemplification. Moreover, it is contemplated that any two specifically recited values for a parameter can give rise to a range of values for the parameter between the two values (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing a range of values for the parameter from the first value to the second value). For example, if parameter X is exemplified herein as having a value of A, and is also exemplified as having a value of Z, it is contemplated that parameter X can have a range of values from about A to about Z. Similarly, it is contemplated that the disclosure of two or more ranges of values for a parameter, whether these ranges are nested, overlapping or distinct, comprises all possible combinations of the ranges disclosed using the endpoints of the ranges. For example, if parameter X is exemplified herein as having a value in the range of 1-10 or 2-9 or 3-8, it is also contemplated that parameter X can have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0048] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. For example, when a phrase such as "can include," "can include," or the like is used herein, at least one example embodiment includes or can include such feature. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to include having, including, containing, comprising, and the like, and are not intended to be limiting. The terms "including," "comprising," and "having" are intended to be inclusive and not restrictive. The method steps, processes, and operations described herein are not necessarily to be performed in the particular order described, unless specifically required or indicated. It is also contemplated that additional or alternative steps can be employed.

[0049] When a component or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another component or layer, it can be directly on, engaged, connected or coupled to the other component or layer, or intervening components or layers can be present. In contrast, when a component is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another component or layer, there are no intervening components or layers present. Other words used to describe the relationship between components should be interpreted in the like fashion (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any one or more of the associated listed items, and all combinations of such items.

[0050] The term "about" when applied to a value indicates that slight inaccuracies in the calculation or measurement are permitted (value close to exact; about near or reasonably near; nearly). Otherwise, if for some reason the inaccuracy provided by "about" is not understood in this ordinary sense in the art, then "about" as used herein indicates at least that a variation can occur from the value as a result of measurement or ordinary methods of employing such parameter. For example, the terms "approximately," "about," and "substantially" can be used herein to mean within manufacturing tolerances. Or for example, the term "about" as used herein in connection with a quantity is meant to encompass a variation of ±10% or ±5%, unless otherwise specified. The term "about" also encompasses amounts that differ due to differing equilibration conditions of the compositions resulting from the particular initial mixture. Whether or not modified by the term "about," the claims include equivalents of the amounts.

[0051] Although the terms first, second, third, etc. can be used herein to describe various components, elements, regions, layers and / or sections, these components, elements, regions, layers and / or sections should not be limited by these terms. These terms can be only used to distinguish one component, element, region, layer or section from another region, layer or section. Terms such as "first", "second", and other numerical terms as used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first component, element, region, layer or section discussed below could be termed a second component, element, region, layer or section without departing from the teachings of the example embodiments.

[0052] For ease of description, spatial relative terms, such as "inner", "outer", "beneath", "below", "lower", "above", "upper", and the like, can be used herein to describe the relationship of one component or feature to another component or feature as illustrated in the figures. The spatial relative terms can be intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, a component described as "below" or "beneath" other components or features would then be oriented "above" the other components or features. Thus, the example term "below" can encompass both the orientations above and below. The device can also be oriented in other manners (rotated 90 degrees or at other orientations) and the spatial relative descriptions used herein interpreted accordingly.

[0053] The implementations described above are provided to illustrate and describe. They are not intended to exhaust or limit the disclosure. The various components of a particular implementation, intended or stated uses, or features are generally not limited to that particular implementation, but are instead interchangeable and can be used in selected implementations (even if not specifically shown or described). The implementations can also vary in many ways. These variations should not be considered as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

1. A method of dispensing a thermal management and / or EMI mitigation material comprising one or more functional fillers within a matrix, the method comprising the steps of: receiving the thermal management and / or EMI mitigation material comprising the one or more functional fillers being supplied into the matrix; and in the event of filler sedimentation, remixing the one or more functional fillers comprising filler sedimentation within the matrix prior to dispensing the thermal management and / or EMI mitigation material, whereby in the event of filler sedimentation, the remixing reduces the filler sedimentation within the matrix, thereby enabling improved viscosity and flow rate of the thermal management and / or EMI mitigation material, the method further comprising: causing at least a portion of the one or more functional fillers to sediment within the matrix; remixing the at least a portion of the one or more functional fillers sedimented within the matrix, thereby reducing filler sedimentation within the matrix and enabling the viscosity and flow rate of the thermal management and / or EMI mitigation material to be improved to be the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to the filler sedimentation; and after the remixing, dispensing the thermal management and / or EMI mitigation material having the improved viscosity and improved flow rate that is the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to the filler sedimentation, wherein the thermal management and / or EMI mitigation material comprises a one-part dispensable thermal paste or a two-part in-place-curing dispensable thermal interface material, wherein the remixing occurs prior to the thermal management and / or EMI mitigation material being fed, conveyed or supplied to a material dispenser, such that the thermal management and / or EMI mitigation material has a longer shelf life prior to being dispensed.

2. The method of claim 1, wherein: the method comprises the step of waiting for an amount of time sufficient for at least a portion of the one or more functional fillers to sediment within the matrix; and the step of remixing comprises remixing the at least a portion of the one or more functional fillers sedimented within the matrix, thereby reducing filler sedimentation within the matrix and improving the viscosity and flow rate of the thermal management and / or EMI mitigation material.

3. The method of claim 1, wherein, the step of remixing comprises using a screw extruder or screw kneader to remix the one or more functional fillers comprising filler sedimentation within the matrix, in the event of filler sedimentation.

4. The method of claim 1, wherein, the step of remixing comprises uniformly remixing the one or more functional fillers comprising any filler sedimentation within the matrix, such that the viscosity and flow rate of the thermal management and / or EMI mitigation material is improved and / or restored to be the same as the original viscosity and original flow rate of the thermal management and / or EMI mitigation material prior to any filler sedimentation, after the remixing.

5. The method of claim 1, wherein, the method comprises the steps of: initially mixing the one or more functional fillers within the matrix, thereby providing the thermal management and / or EMI mitigation material; and after the initial mixing, allowing at least a portion of the one or more functional fillers to settle within the matrix, whereby the filler settling changes the initial viscosity and the initial flow rate of the thermal management and / or EMI mitigation material; and wherein the step of remixing includes remixing the at least a portion of the one or more functional fillers that settled within the matrix, whereby the filler settling within the matrix is reduced and the viscosity and flow rate of the thermal management and / or EMI mitigation material are improved to the same as the initial viscosity and the initial flow rate of the thermal management and / or EMI mitigation material.

6. The method of claim 1 or 5, wherein: the step of allowing at least a portion of the one or more functional fillers to settle within the matrix includes waiting at least a predetermined period of time during which the at least a portion of the one or more functional fillers settles within the matrix; and after waiting for the predetermined period of time, before dispensing the thermal management and / or EMI mitigation material having the improved viscosity and the improved flow rate that are the same as the initial viscosity and the initial flow rate of the thermal management and / or EMI mitigation material, then remixing the at least a portion of the one or more functional fillers that settled within the matrix.

7. The method of any one of claims 1 to 5, wherein, the thermal management and / or EMI mitigation material includes the one or more functional fillers in an amount of at least 90% by weight within the matrix.

8. The method of any one of claims 1 to 5, wherein, the one or more functional fillers include one or more of the following particles: thermally conductive particles; electrically conductive particles; dielectrically absorbing particles; electromagnetic wave absorbing particles; and particles having two or more of thermally conductive, electrically conductive, dielectrically absorbing, and electromagnetic wave absorbing. particles having two or more of thermally conductive, electrically conductive, dielectrically absorbing, and electromagnetic wave absorbing.

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