Heat sink structure

Abstract

The present application provides a heat sink structure, comprising: a plurality of heat dissipation fins, a base; the plurality of heat dissipation fins have a combined end and a free end, and a cavity is filled with a working fluid between the combined end and the free end; the upper and lower sides of the base have a combined side and a heated side, and the combined end of the plurality of heat dissipation fins is integrally combined on the combined side by injection molding, so as to eliminate the thermal resistance after the combination of different parts.

Description

Technical Field

[0001] This invention relates to a heat sink structure, and more particularly to a heat sink structure that integrates the base and heat sink fins into one unit by means of encapsulation to prevent thermal resistance. Background Technology

[0002] Currently, conventional die-cast heat sinks have limited heat dissipation capabilities in 5G products and equipment (such as communication chassis and equipment), and their large size and weight make them unsuitable for outdoor installation and maintenance. Therefore, to further improve heat dissipation and reduce weight, high-efficiency heat sinks have emerged. The connection between these heat sinks and the base is mostly achieved through epoxy resin bonding or riveting. However, since 5G products and equipment are mostly used outdoors, epoxy resin bonding poses a risk of aging and is not a perfect solution, thus it is rarely used. Riveting is currently the main method for connecting high-efficiency heat sinks to the base in the market. However, due to the natural contact gap between the two metal surfaces, the air in the gap inevitably leads to high thermal resistance. Although high-efficiency heat sinks provide considerable heat dissipation, the heat cannot be completely conducted from the heat-generating element to the heat sink fins due to this gap.

[0003] The high-efficiency heat sink fins have internal chambers, which are selectively filled with working liquids or gases. Because the chambers are in a vacuum state, the working liquids or gases with low boiling points can evaporate and vaporize earlier, thereby improving the heat transfer efficiency of the heat sink fins.

[0004] Because high-efficiency heat dissipation fins contain working fluid or gas in their internal chambers, special care must be taken when combining them with the base to ensure that the vacuum tightness of the internal chambers is not compromised. Furthermore, if heat processing is to be performed, care must be taken to ensure that the working fluid in the chambers does not evaporate due to heat, thereby losing its heat exchange function.

[0005] The primary goal is to ensure a secure connection between the high-efficiency heat dissipation fins and the base without any gaps. Summary of the Invention

[0006] Therefore, in order to effectively solve the above problems, the main objective of this invention is to provide a heat sink structure in which there is no thermal resistance between the base and the heat sink fins.

[0007] To achieve the above objectives, the present invention provides a heat sink structure comprising: a plurality of heat dissipation fins and a base;

[0008] The plurality of heat dissipation fins have a connecting end and a free end. The interior of the fins has a chamber between the connecting end and the free end and is filled with a working fluid. The base has a connecting side and a heated side on its upper and lower sides, respectively. The connecting side is integrally connected to the connecting end of the plurality of heat dissipation fins.

[0009] The aforementioned joint side protrusion has multiple joint portions, which cover the outside of the joint end, so that the multiple heat dissipation fins are firmly integrated with the base.

[0010] The working fluid mentioned above is either a gas or a liquid.

[0011] The aforementioned plurality of heat dissipation fins and the base may be made of the same or different materials.

[0012] The aforementioned plurality of heat dissipation fins and the base are first bonded together by an integral encapsulation method, and then the plurality of heat dissipation fins are filled with water and vacuumed.

[0013] The plurality of heat dissipation fins and the base are first bonded together by an integral encapsulation method. The plurality of heat dissipation fins are then filled with water and vacuumed. This not only maintains the stability of the working liquid or gas in the internal chamber of the plurality of heat dissipation fins to prevent evaporation, but also solves the problem of thermal resistance between the base and the heat dissipation fins. Attached Figure Description

[0014] Figure 1 This is an exploded perspective view of the first embodiment of the heat sink structure of the present invention;

[0015] Figure 2 This is a combined cross-sectional view of the first embodiment of the heat sink structure of the present invention.

[0016] Figure reference numerals: 1. Heat sink structure; 11. Heat dissipation fins; 111. Joint end; 112. Free end; 113. Chamber; 12. Base; 121. Joint side; 1211. Heated side; 2. Working fluid. Detailed Implementation

[0017] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0018] Please see Figure 1 , Figure 2 This is a perspective exploded and combined sectional view of the first embodiment of the heat sink structure of the present invention. The heat sink structure 1 includes: a plurality of heat sink fins 11 and a base 12.

[0019] The plurality of heat dissipation fins 11 have a joint end 111 and a free end 112 at each end. There is a vacuum chamber 113 between the joint end 111 and the free end 112 of the heat dissipation fins. The chamber 113 is filled with a working fluid 2, which may be a gas or a liquid.

[0020] The base 12 has a connecting side 121 and a heated side 122 on its upper and lower sides, respectively. The heated side 122 is in contact with at least one heat source. The connecting side 121 corresponds to the connecting end 111 of the plurality of heat dissipation fins 11 and is connected to the connecting end 111 by means of encapsulation. That is, the connecting side 121 protrudes a plurality of connecting portions 1211, which cover the outside of the connecting end 111. The connecting end 111 can be in the shape of an inverted T, an L, or any other geometric shape. This embodiment uses an inverted T shape as an illustrative embodiment, but it is not intended to be limited. The connecting portion 1211 completely covers the outside of the inverted T-shaped connecting end 111 by means of encapsulation, so that the plurality of heat dissipation fins 11 are firmly and seamlessly connected to the base 12. The design of the connecting end 111 can prevent the heat dissipation fins 11 from being pulled out and detached from the connecting portion 1211 of the base 12.

[0021] The plurality of heat dissipation fins 11 and the base 12 are made of the same or different materials, such as copper, aluminum, stainless steel, or any combination thereof. The plurality of heat dissipation fins 11 and the base 12 are first joined together by an integral injection method. After the integral injection is joined, the plurality of heat dissipation fins 11 are then filled with water and vacuumed.

[0022] The purpose of pre-applying the base 12 and the plurality of heat dissipation fins 11 together is to prevent the working fluid 2 inside the heat dissipation fins 11 from evaporating due to high temperature during the application of the base 12 and the heat dissipation fins 11 together, which would cause the internal vapor-liquid circulation heat exchange to fail. Therefore, after the application of the two together is completed, the heat dissipation fins 11 are filled with working fluid 2 and vacuumed, and finally sealed.

[0023] This invention mainly provides a heat dissipation fin 11 with high thermal conductivity. The heat dissipation fin 11 has a cavity 113 inside, which is filled with a working fluid 2 (liquid or gas). Before filling with the working fluid 2, the heat dissipation fin 11 and the base 12 are first bonded together by an integral encapsulation method. This allows the heat dissipation fin 11 and the base 12 to be bonded together without gaps, thus avoiding the generation of thermal resistance. After the integral encapsulation is completed, the cavity 113 of the heat dissipation fin 11 is filled with the working fluid 2 and vacuumed. This avoids the situation where the high temperature destroys the working fluid 2 inside the cavity and causes it to evaporate and vaporize during the integral encapsulation operation of the heat dissipation fin 11 and the base 12.

Claims

1. A heat spreader structure, characterized by, Comprising: a plurality of heat dissipation fins having a bonding end and a free end, the bonding end and the free end having a cavity therebetween, the cavity being filled with a working fluid; a base, the upper and lower sides of the base having a bonding side and a heated side respectively, the heated side being in contact with a heat source, the bonding side integrally injecting the bonding end of the plurality of heat dissipation fins; the plurality of heat dissipation fins and the base are combined by integrally injecting, the plurality of heat dissipation fins being filled with the working fluid and being vacuumized, so that the working fluid in the plurality of heat dissipation fins of the heat dissipation structure is prevented from evaporating.

2. The heat spreader structure of claim 1, wherein, the bonding side protrudes a plurality of bonding portions, the plurality of bonding portions covering the outside of the bonding end, so that the plurality of heat dissipation fins are stably combined with the base.

3. The heat spreader structure of claim 1, wherein, the working fluid is gas or liquid.

4. The heat spreader structure of claim 1, wherein, the plurality of heat dissipation fins and the base are made of the same material or different materials.

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