An interlaced jet microchannel heat spreader

Abstract

The present application relates to a kind of staggered jet microchannel heat sink, including cover layer, manifold layer, jet layer and microchannel layer stacked in turn, cover layer is equipped with fluid inlet and fluid outlet, manifold layer is used to shunt the fluid of fluid inlet, jet layer is equipped with array distribution jet orifice and backflow hole, jet orifice and backflow hole staggered distribution, microchannel layer is equipped with heat dissipation groove, heat dissipation groove is equipped with array distribution columnar needle fin, and form needle fin microchannel, the axial direction of columnar needle fin and the jet direction of jet orifice are parallel to each other;Fluid emitted by jet orifice is boiled and carries out transverse flow in needle fin microchannel and absorbs heat, based on the staggered distribution of jet orifice and backflow hole, the transverse flow fluid in needle fin microchannel presents staggered counterflow, and flows to fluid outlet by backflow hole.Compared with prior art, the present application improves the temperature uniformity of heat dissipation object, effectively suppresses the generation of local hot spot and greatly improves heat exchange efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to an interlaced jet microchannel heat dissipation device. Background Technology

[0002] As the performance of electronic devices continues to improve and their structures become increasingly compact, the heat generated during operation increases exponentially, reaching up to 10... 7 W / cm 2 The accumulation of heat can lead to a decrease in the performance and stability of electronic components. Therefore, how to efficiently remove heat from electronic components has become a key research issue. Microchannel heat exchangers, with their advantages of high heat transfer efficiency and compact structure, hold promise for providing a solution to the high heat flux heat dissipation problem of electronic devices.

[0003] For example, the invention disclosed in CN109524376A discloses a multi-branch jet microchannel chip liquid cooling heat dissipation device, including a coolant inlet pipe, a coolant outlet pipe, and a multi-branch jet microchannel cavity. The coolant inlet pipe and the coolant outlet pipe are installed on the multi-branch jet microchannel cavity. The multi-branch jet microchannel cavity is a tight whole formed by sequentially stacking and bonding an inlet / outlet layer, a recovery layer, a recovery hole layer, a jet nozzle layer, and a microchannel layer. The coolant inlet pipe is set on the inlet / outlet layer and is connected to the jet nozzle layer. The coolant enters the microchannel layer through the jet nozzle layer. The coolant outlet pipe is set on the inlet / outlet layer and is connected to the recovery layer. The coolant that absorbs heat is discharged from the microchannel layer through the jet nozzle layer, the recovery hole layer, and the recovery layer in sequence from the coolant outlet pipe.

[0004] However, most of the existing microchannel cooling solutions mentioned above adopt the traditional parallel microchannel structure for surface heat sources. This structure cannot solve the problem of high-intensity point heat source distribution in wide bandgap power devices. Furthermore, due to the layout where the main channel is perpendicular to the heat flow direction, the flow-heat synergy within the channel is poor, which can easily trigger unstable phase transitions and lead to serious problems such as premature critical boiling. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art, which uses a parallel microchannel structure, cannot solve the problem of high-intensity point heat source distribution in wide bandgap power devices, and the main channel is perpendicular to the heat flow direction, resulting in poor flow-heat coordination in the channel and easy triggering of unstable phase transitions, thus causing premature critical boiling crisis. Therefore, this invention provides an interlaced jet microchannel heat dissipation device.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] An interleaved jet microchannel heat dissipation device includes a cover plate layer, a manifold layer, a jet layer, and a microchannel layer stacked sequentially. The cover plate layer has a fluid inlet and a fluid outlet, and the manifold layer is used to divert the fluid from the fluid inlet.

[0008] The jet layer is provided with an array of jet holes and return holes, which are staggered. The microchannel layer is provided with heat dissipation grooves, and the heat dissipation grooves are provided with an array of columnar needle wings, which form needle wing microchannels. The axial direction of the columnar needle wings is parallel to the jet direction of the jet holes.

[0009] The fluid ejected from the jet orifice absorbs heat and boils within the needle-fin microchannel, then flows laterally. Based on the staggered distribution of the jet orifice and the return orifice, the laterally flowing fluid within the needle-fin microchannel exhibits staggered countercurrent flow and flows to the fluid outlet through the return orifice.

[0010] Preferably, the columnar needles are arranged in a rectangular array within the heat dissipation groove, and the columnar needles are cylindrical structures with each columnar needle evenly distributed.

[0011] Preferably, the spacing between adjacent columnar needles is equal to the diameter of the columnar needle.

[0012] Preferably, the height of the columnar needle fins is equal to the depth of the heat dissipation groove, and the diameter of the columnar needle fins ranges from 50 to 100 micrometers.

[0013] Preferably, the manifold layer is provided with a return port and an inlet collection groove. The return port is connected to the fluid outlet, and the inlet collection groove is connected to the fluid inlet. The inlet collection groove is provided with a diversion hole, which corresponds one-to-one with the jet hole on the jet layer, and is used to divert the fluid.

[0014] Preferably, the jet layer is provided with an outlet collecting groove, the jet hole and the return hole are located in the outlet collecting groove, and the outlet collecting groove is connected to the return port.

[0015] Preferably, the reflux hole is formed by opening a through hole at the bottom of the outlet collection channel, and the jet hole is formed by a guide pipe that penetrates the jet layer, with the upper surface of the guide pipe flush with the upper surface of the jet layer.

[0016] Preferably, the jet holes and return holes are arranged in a rectangular array, with the jet holes and return holes alternating in the same column or row.

[0017] Preferably, the cover plate layer and the jet layer are made of glass, the manifold layer is made of PDMS, and the microchannel layer is made of silicon. The cover plate layer, the manifold layer, the jet layer, and the microchannel layer are bonded sequentially from top to bottom.

[0018] Preferably, the manifold layer is connected to the cover plate layer and the jet layer respectively by plasma bonding process, and the microchannel layer is connected to the jet layer by anodic bonding process.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] 1. This design incorporates heat dissipation grooves on the microchannel layer, within which are arrayed columnar needles. The axis of these needles is parallel to the jet direction, allowing the cooling fluid to undergo a transverse flow process within the microchannels after being vertically injected into the heat sink. This ensures sufficient fluid boiling, overcoming the problem of insufficient boiling in conventional jet structures compared to jet impact in parallel channels. Furthermore, the staggered arrangement of jet and return orifices creates a staggered counter-flow characteristic within the microchannels, improving temperature uniformity and effectively suppressing the formation of localized hot spots. The combined structure of the jet layer and the microchannel layer effectively enhances the heat dissipation efficiency of the radiator.

[0021] 2. This solution adopts a needle-fin microchannel structure. Compared with conventional straight microchannels, it utilizes the layout of the fluid path and heat flow direction in the jet structure to effectively enhance the flow-heat synergy within the microchannel and significantly improve heat exchange efficiency. Attached Figure Description

[0022] Figure 1 A schematic diagram of the structure of the staggered jet microchannel heat dissipation device provided by the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the cover plate layer provided by the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the manifold layer provided by the present invention;

[0025] Figure 4 A schematic diagram of the jet layer provided by the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the microchannel layer provided by the present invention;

[0027] Figure 6 A schematic diagram of the distribution structure of the jet orifice and the return orifice provided by the present invention;

[0028] Figure 7 A comparison diagram showing the distribution principles of jet and heat flow directions of the needle-wing microchannel (b) and the straight microchannel (a) provided by this invention.

[0029] In the diagram: 1. Cover plate layer, 2. Manifold layer, 3. Jet layer, 4. Microchannel layer, 5. Fluid inlet, 6. Fluid outlet, 7. Inlet manifold, 8. Diverter hole, 9. Return port, 10. Jet hole, 11. Return hole, 12. Outlet manifold, 13. Needle-fin microchannel, 14. Bottom of radiator, 15. Heat dissipation groove, 16. Columnar needle fin. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed during use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] Example 1

[0037] like Figures 1 to 5 As shown, this embodiment provides an interleaved jet microchannel heat dissipation device, including a cover plate layer 1, a manifold layer 2, a jet layer 3 and a microchannel layer 4 stacked sequentially. The cover plate layer 1 is provided with a fluid inlet 5 and a fluid outlet 6, and the manifold layer 2 is used to divert the fluid in the fluid inlet 5.

[0038] The jet layer 3 is provided with an array of jet holes 10 and return holes 11, which are staggered. The microchannel layer 4 is provided with a heat dissipation groove 15, and the heat dissipation groove 15 is provided with an array of columnar needle wings 16, which form a needle wing microchannel 13. The axial direction of the columnar needle wings 16 is parallel to the jet direction of the jet holes 10.

[0039] The fluid ejected from the jet hole 10 absorbs heat and boils in the needle-fin microchannel 13 and flows laterally. Based on the staggered distribution of the jet hole 10 and the return hole 11, the laterally flowing fluid in the needle-fin microchannel 13 exhibits staggered countercurrent flow and flows to the fluid outlet 6 through the return hole 11.

[0040] By incorporating heat dissipation grooves on the microchannel layer and arranging arrayed columnar needles within these grooves, with the axis of the needles parallel to the jet direction, the cooling fluid undergoes a transverse flow process within the microchannels after being vertically injected into the heat sink. This allows for sufficient fluid boiling development, overcoming the problem of insufficient boiling in conventional jet structures compared to jet impact in parallel channels. Furthermore, the staggered arrangement of jet and return orifices creates a staggered counter-flow characteristic within the microchannels, improving the temperature uniformity of the heat dissipation object and effectively suppressing the formation of localized hot spots. The combined structure of the jet layer and the microchannel layer effectively enhances the heat dissipation efficiency of the radiator.

[0041] Preferred implementation methods, such as Figure 5 As shown, the columnar pin fins 16 are arranged in a rectangular array within the heat dissipation groove 15. The columnar pin fins 16 have a cylindrical structure and are evenly distributed. The spacing between adjacent columnar pin fins 16 is equal to the diameter of the columnar pin fin.

[0042] In this embodiment, the height of the columnar needle fin 16 is equal to the depth of the heat dissipation groove 15, and the diameter of the columnar needle fin 16 ranges from 50 to 100 micrometers.

[0043] The columnar fins 16 are designed as cylindrical structures, so that the spacing between adjacent columnar fins 16 is the same as their own diameter. The resulting needle-fin microchannels are more uniform. When the fluid ejected from the jet hole 10 enters the needle-fin microchannels 13, it can flow laterally uniformly, improving the heat dissipation uniformity.

[0044] In this embodiment, the manifold layer 2 is provided with a return port 9 and an inlet collection groove 7. The return port 9 is connected to the fluid outlet 6, and the inlet collection groove 7 is connected to the fluid inlet 5. The inlet collection groove 7 is provided with a diversion hole 8, which corresponds one-to-one with the jet hole 10 on the jet layer 3, and is used to divert the fluid.

[0045] Furthermore, the jet layer 3 is provided with an outlet collecting groove 12, and the jet hole 10 and the return hole 11 are located in the outlet collecting groove 12. The outlet collecting groove 12 is connected to the return port 9.

[0046] In this embodiment, the return hole 11 is formed by opening a through hole at the bottom of the outlet collection channel 12, and the jet hole 10 is formed by a guide pipe that penetrates the jet layer 3, with the upper surface of the guide pipe flush with the upper surface of the jet layer.

[0047] The length of the jet orifice 10 is matched with the depth of the outlet collection groove 12, and it is directly connected to the diversion hole 8 of the manifold layer 2 to inject fluid into the microchannel. The port of the return hole 11 is located at the bottom of the outlet collection groove 12. The heat-absorbing fluid in the microchannel enters the outlet collection groove 12 through the return hole 11, and then returns through the return port 9 and the fluid outlet 6.

[0048] like Figure 6 As shown, in this embodiment, the jet holes 10 and return holes 11 are arranged in a rectangular array, with the jet holes 10 and return holes 11 alternating in the same column or row. By arranging the jet holes and return holes alternately, the crossflow in the microchannel exhibits a staggered counterflow characteristic, which improves the temperature uniformity of the heat dissipation object and effectively suppresses the generation of local hot spots.

[0049] In this embodiment, the cover plate layer 1 and the jet layer 3 are made of glass, the manifold layer 2 is made of PDMS, and the microchannel layer 4 is made of silicon. The cover plate layer 1, the manifold layer 2, the jet layer 3, and the microchannel layer 4 are bonded sequentially from top to bottom.

[0050] Furthermore, the manifold layer 2 is connected to the cover plate layer 1 and the jet layer 3 respectively by plasma bonding process, and the microchannel layer 4 is connected to the jet layer 3 by anodic bonding process.

[0051] Working Principle: The heat is carried away by heat conduction between the bottom of the radiator and the heat source, as well as by thermal convection of the cooling fluid within the radiator. During operation, the bottom of the radiator contacts the heat-generating components (such as chips) of the electronic device, absorbing heat and continuously supplying coolant to the radiator. After entering the radiator through the cover plate layer, the cooling fluid first reaches the manifold layer, flows through the distribution holes of the manifold layer into the jet holes of the jet layer, and is then injected into the microchannel layer. In the needle-fin channels of the microchannel layer, the fluid absorbs heat and boils, changing from a single phase to a gas-liquid two-phase state. It then flows back to the jet layer through the return holes and converges at the outlet, finally exiting the radiator. The flow path of the fluid in the microchannel layer is constrained by the jet holes and return holes. Due to the staggered arrangement of adjacent rows of jet holes and return holes, the fluid in the needle-fin channels exhibits a staggered counter-current characteristic, thereby improving heat transfer performance.

[0052] In conjunction with the preferred embodiments described above, this embodiment also provides more specific implementation methods, such as... Figure 1-6 As shown, an interlaced jet microchannel radiator relies on heat conduction between the bottom of the radiator and the heat source, as well as thermal convection of the cooling fluid inside the radiator, to remove heat from the heat source. It mainly consists of four layers, from top to bottom: a cover layer 1, a manifold layer 2, a jet layer 3, and a microchannel layer 4. The cover layer 1 is the fluid inlet and outlet of the entire radiator; the manifold layer 2 acts as a distributor for the cooling fluid entering the radiator; the jet layer 3 receives the coolant flowing from the manifold layer, allowing it to be vertically injected into the microchannel layer 4, and also collects the coolant returning from the microchannel layer 4, allowing it to flow out of the radiator through the main outlet; the microchannel layer is the core heat exchange unit of the entire radiator, absorbing heat through heat conduction between its bottom and the heat source, and transferring the absorbed heat to the cooling fluid, thus achieving heat dissipation from the heat source.

[0053] Specifically, the radiator is 24mm long, 18mm wide, and 5.6mm thick. The cover plate layer is 1mm thick, the manifold layer is 2.5mm thick, the jet layer is 1.6mm thick, and the microchannel layer is 1mm thick. The cover plate layer 1 has two 3.5mm diameter through holes, 12.1mm apart. The manifold layer 2 has a groove 9.6mm long, 7.2mm wide, and 0.8mm deep, with a portion of the groove containing diversion holes to define the jet path. The jet layer 3 has a groove 9.9mm long, 7.8mm wide, and 0.8mm deep, with a portion of the groove containing jet holes and return holes. The jet holes, running through the entire jet layer, are used to collect the cooling fluid from the manifold layer and inject it into the microchannel layer; the remaining holes are return holes used to collect the hot fluid from the microchannel layer. The microchannel layer has a groove with a length of 7.2 mm, a width of 3.9 mm, and a depth of 0.3 mm. The groove contains micropillars with a diameter of 80 μm, a spacing of 80 μm, and a height of 0.3 mm.

[0054] In this structure, the cover layer 1 and jet layer 3 are made of glass, the manifold layer 2 is made of PDMS, and the microchannel layer 4 is made of silicon. The cover layer 1, manifold layer 2, jet layer 3, and microchannel layer 4 are bonded sequentially from top to bottom. The glass and PDMS are bonded using a plasma bonding process, and the glass and silicon wafer are bonded using an anodic bonding process.

[0055] During use, the bottom 14 of the heat sink comes into contact with the heat-generating components (such as chips) of the electronic device to absorb heat from the heat source and continuously supply coolant to the heat sink. After entering the heat sink through the fluid inlet 5 of the cover plate layer 1, the cooling fluid first reaches the inlet manifold layer 2's inlet collector 7, flows through the branch holes 8 of the manifold layer 2 into the jet holes 10 of the jet layer 3, and is injected into the microchannel layer 4 through the jet holes 10. In the needle-fin microchannels 13 of the microchannel layer 4, it absorbs heat and boils, changing from a single phase to a gas-liquid two-phase state. Then, it flows back to the jet layer 3 through the return holes 11 and converges at the outlet collector 12, finally exiting the heat sink through the fluid outlets 9 and 6 in sequence. The flow path of the fluid in the microchannel layer 4 is constrained by the jet holes 10 and the return holes 11. Due to the staggered arrangement of adjacent rows of jet holes 10 and return holes 11, the fluid exhibits a certain flow pattern within the needle-fin microchannels 13. Figure 6 The staggered countercurrent flow characteristic shown improves heat transfer performance.

[0056] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A staggered jet microchannel heat dissipation device, comprising a cover plate layer (1), a manifold layer (2), a jet layer (3), and a microchannel layer (4) stacked sequentially, wherein the cover plate layer (1) is provided with a fluid inlet (5) and a fluid outlet (6), and the manifold layer (2) is used to divert the fluid from the fluid inlet (5), characterized in that, The jet layer (3) is provided with an array of jet holes (10) and return holes (11), which are staggered. The microchannel layer (4) is provided with a heat dissipation groove (15), and the heat dissipation groove (15) is provided with an array of columnar needle wings (16), which form a needle wing microchannel (13). The axial direction of the columnar needle wings (16) is parallel to the jet direction of the jet holes (10). The fluid ejected from the jet hole (10) absorbs heat and boils in the needle-fin microchannel (13) and flows laterally. Based on the staggered distribution of the jet hole (10) and the return hole (11), the fluid flowing laterally in the needle-fin microchannel (13) exhibits staggered countercurrent flow and flows to the fluid outlet (6) through the return hole (11). The manifold layer (2) is provided with a return port (9) and an inlet collection groove (7). The return port (9) is connected to the fluid outlet (6), and the inlet collection groove (7) is connected to the fluid inlet (5). The inlet collection groove (7) is provided with a diversion hole (8). The diversion hole (8) corresponds one-to-one with the jet hole (10) on the jet layer (3) and is used to divert the fluid. The jet layer (3) is provided with an outlet collection groove (12), the jet hole (10) and the return hole (11) are located in the outlet collection groove (12), and the outlet collection groove (12) is connected to the return port (9). The return hole (11) is formed by opening a through hole at the bottom of the outlet collection channel (12), and the jet hole (10) is formed by a guide pipe that penetrates the jet layer (3), with the upper surface of the guide pipe flush with the upper surface of the jet layer.

2. The staggered jet microchannel heat spreader of claim 1, wherein, The columnar needle wings (16) are arranged in a rectangular array within the heat dissipation groove (15). The columnar needle wings (16) are cylindrical structures, and each columnar needle wing (16) is evenly distributed.

3. The staggered jet microchannel heat dissipation device according to claim 2, characterized in that, The spacing between adjacent columnar needle wings (16) is equal to the diameter of the columnar needle wings.

4. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that, The height of the columnar needle fin (16) is equal to the depth of the heat dissipation groove (15), and the diameter of the columnar needle fin (16) ranges from 50 to 100 micrometers.

5. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that, The jet holes (10) and return holes (11) are arranged in a rectangular array, with the jet holes (10) and return holes (11) alternating in the same column or row.

6. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that, The cover plate layer (1) and the jet layer (3) are made of glass, the manifold layer (2) is made of PDMS, and the microchannel layer (4) is made of silicon. The cover plate layer (1), the manifold layer (2), the jet layer (3) and the microchannel layer (4) are bonded sequentially from top to bottom.

7. The staggered jet microchannel heat dissipation device according to claim 6, characterized in that, The manifold layer (2) is connected to the cover plate layer (1) and the jet layer (3) by plasma bonding process, and the microchannel layer (4) is connected to the jet layer (3) by anodic bonding process.

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