Immersion liquid cooling system

Abstract

According to embodiments of the present disclosure, an immersion liquid cooling system is provided, comprising: an immersion tank for containing a cooling liquid and electronic equipment to be cooled, the electronic equipment to be cooled being at least partially immersed in the cooling liquid, and a gas cavity being formed in the immersion tank above a liquid surface of the cooling liquid; a heat exchange unit for cooling the cooling liquid by using an external cold source; and a bubble generating device comprising a gas pump, a gas suction pipe, a gas discharge pipe, and a bubble discharge passage, the gas pump being connected to the gas suction pipe and the gas discharge pipe to suck gas via the gas suction pipe and discharge gas via the gas discharge pipe, a gas suction port of the gas suction pipe being arranged in the gas cavity, the gas discharge pipe being connected to the bubble discharge passage, the bubble discharge passage being arranged below the electronic equipment to be cooled, and the bubble discharge passage comprising a plurality of gas injection holes for injecting gas bubbles towards the electronic equipment to be cooled.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to the field of electronic device cooling technology, and more specifically, to an immersion liquid cooling system. Background Technology

[0002] Data center energy consumption is increasing daily. Traditional air-cooling solutions are inefficient and consume large amounts of energy, making them increasingly unable to meet the cooling capacity and economic feasibility requirements of data centers. Liquid cooling solutions, due to their high heat dissipation efficiency, have become an important technological direction for data center construction.

[0003] Currently, the more mature liquid cooling solutions include cold plate liquid cooling and immersion liquid cooling, with immersion liquid cooling further divided into single-phase immersion liquid cooling and two-phase immersion liquid cooling. Immersion liquid cooling immerses electronic devices in coolant, and the heat generated by the electronic devices is carried away by the coolant. This heat dissipation method has high heat dissipation efficiency and is more likely to achieve a low power usage efficiency (PUE). In addition, the fanless design of immersion liquid cooling can also save a lot of energy consumption.

[0004] In two-phase immersion liquid cooling systems, heat generated by electronic devices is dissipated by the latent heat of phase change in the coolant, thus supporting the heat dissipation requirements of high-power-density devices. However, because the coolant required for two-phase immersion liquid cooling systems needs to be highly volatile and the system operates at high pressure, coolant loss becomes the main source of cost. To prevent coolant evaporation, the design of two-phase immersion liquid cooling systems is complex and technically challenging.

[0005] Single-phase immersion liquid cooling solutions rely solely on heat exchange between the coolant and the heat-generating components for heat dissipation. Therefore, single-phase immersion liquid cooling systems are generally simpler to design and are currently widely used in the industry.

[0006] However, conventional immersion liquid cooling solutions are prone to creating localized hot spots and encountering heat dissipation bottlenecks, so the heat exchange efficiency needs to be further improved. Summary of the Invention

[0007] The purpose of this disclosure is to provide an immersion liquid cooling system that at least partially solves the above-mentioned problems and other potential problems.

[0008] In one aspect of this disclosure, an immersion liquid cooling system is provided, comprising: an immersion chamber for containing a coolant and an electronic device to be cooled, the electronic device being at least partially immersed in the coolant, and an air chamber formed in the immersion chamber above the surface of the coolant; a heat exchange unit for cooling the coolant using an external cold source; and a bubble generating device including an air pump, an intake pipe, an exhaust pipe, and a bubble discharge channel, the air pump being connected to the intake pipe and the exhaust pipe for drawing in air via the intake pipe and venting air via the exhaust pipe, the intake port of the intake pipe being disposed in the air chamber, the exhaust pipe being connected to the bubble discharge channel being disposed below the electronic device to be cooled, and the bubble discharge channel including a plurality of jet holes for ejecting bubbles toward the electronic device to be cooled.

[0009] In some embodiments, the heat exchange unit is disposed between the electronic device to be cooled and the bubble discharge channel, the plurality of jet holes are arranged to face the heat exchange unit, and the heat exchange unit is connected to the external cold source via an external cold supply pipe and an external cold return pipe.

[0010] In some embodiments, the plurality of jet holes includes multiple sets of jet holes spaced apart from each other.

[0011] In some embodiments, the air pump is disposed in the immersion chamber.

[0012] In some embodiments, the air pump is submerged in the coolant.

[0013] In some embodiments, the air pump is disposed adjacent to the side wall of the immersion chamber, and the intake pipe and the exhaust pipe are disposed vertically adjacent to the side wall of the immersion chamber.

[0014] In some embodiments, the air pump is disposed outside the immersion chamber.

[0015] In some embodiments, at least one of the intake pipe and the exhaust pipe is provided with a component for adsorbing or condensing the vapor of the coolant.

[0016] In some embodiments, the immersion liquid cooling system is a single-phase immersion liquid cooling system or a two-phase immersion liquid cooling system.

[0017] In some embodiments, the immersion liquid cooling system further includes one or more air ducts disposed in the immersion chamber, wherein the air inlet of the one or more air ducts corresponds to a corresponding air jet on the bubble discharge channel, and the air outlet of the one or more air ducts is disposed below a corresponding high-power device in the electronic device to be cooled.

[0018] In some embodiments, at least one of the one or more air ducts includes an air inlet and at least two air outlets.

[0019] In some embodiments, the inlet end of the one or more air ducts at least partially surrounds the corresponding jet hole on the bubble discharge channel.

[0020] In embodiments according to this disclosure, an air pump draws air from the air chamber at the top of the submerged housing via an intake pipe, and then ejects the gas through an exhaust pipe from the jet nozzle on the bubble discharge channel. Since the gas density is lower than that of the coolant, the ejected gas forms bubbles under the influence of natural buoyancy, creating a pseudo-boiling effect in the coolant. The bubbles pass through the coolant and return to the air chamber, thus forming an internal gas circulation path. In this way, the pseudo-boiling effect, which consumes relatively little energy, can enhance the overall temperature uniformity of the coolant. Simultaneously, the turbulence caused by the large number of bubbles around the heat-generating devices is enhanced, thus increasing the local heat transfer coefficient. This overcomes the local heat dissipation bottleneck of high-power devices.

[0021] It should be understood that the content described in this section is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0022] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0023] Figure 1 and Figure 2 A schematic diagram of a conventional immersion liquid cooling system is shown.

[0024] Figure 3 A schematic diagram of an immersion liquid cooling system according to an embodiment of the present disclosure is shown;

[0025] Figure 4 A schematic diagram of an immersion liquid cooling system according to another embodiment of the present disclosure is shown; and

[0026] Figure 5 A schematic diagram of the structure of an air duct according to an embodiment of the present disclosure is shown. Detailed Implementation

[0027] Preferred embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0028] The term "comprising" and its variations as used herein signify open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "at least partially based on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc., may refer to different or the same objects.

[0029] As mentioned above, conventional immersion liquid cooling solutions are prone to creating localized hot spots, encountering heat dissipation bottlenecks, and therefore their heat exchange efficiency needs further improvement. The following will combine... Figure 1 and Figure 2 This describes an exemplary structure and operating principle of a conventional immersion liquid cooling system.

[0030] Figure 1 A schematic diagram of a single-phase immersion liquid cooling system is shown. Figure 1 As shown, the immersion chamber 11 is filled with coolant, and the electronic device 10 is located inside the immersion chamber 11 and submerged in the coolant. The coolant level 13 is higher than the top of the electronic device 10, meaning the electronic device 10 is completely submerged in the coolant. The immersion chamber 11 may be equipped with a cover 12, which allows for convenient operation of the electronic device 10, such as plugging and unplugging. An external heat exchange unit 25 is connected to the immersion chamber 11 via a coolant supply pipe 21 and a coolant return pipe 22. A pump (not shown) built into the heat exchange unit 25 injects cooled coolant into the bottom flow channel 14 of the immersion chamber 11 via the coolant supply pipe 21. The coolant flows towards the electronic device 10 through spray holes 15 on the bottom flow channel 14. After flowing evenly from bottom to top through the electronic device 10, the coolant carries away heat, and the heated coolant returns to the heat exchange unit 25 via the coolant return pipe 22. The heat exchange unit 25 can be connected to an external cold source (not shown) via an external cold supply pipe 23 and an external cold return pipe 24. In this way, the heat exchange unit 25 can use the cooling provided by the external cold source to cool the coolant returning via the coolant return pipe 22, thereby exchanging the heat dissipated by the electronic device 10 with the external cold circulation, and finally dissipating it to the external cold source.

[0031] Figure 2 A schematic diagram of another single-phase immersion liquid cooling system is shown. Figure 1 The immersion liquid cooling system shown is different. Figure 2 The heat exchange unit 25 in the single-phase immersion liquid cooling system shown is disposed in the immersion chamber 11. The immersion chamber 11 has a side flow channel 16 and a bottom flow channel 14. The heat exchange unit 25 is disposed in the side flow channel 16 and is used to cool the coolant in the side flow channel 16. A circulation pump 26 is disposed below the heat exchange unit 25 and is used to drive the coolant in the side flow channel 16 to flow into the bottom flow channel 14. The coolant flows towards the electronic device 10 through the spray holes 15 provided on the bottom flow channel 14. After the coolant flows evenly from bottom to top through the electronic device 10, it carries away heat, and the heated coolant returns to the side flow channel 16, where it is then cooled by the heat exchange unit 25. The heat exchange unit 25 can be connected to an external cold source through an external cold supply pipe 23 and an external cold return pipe 24. In this way, the heat exchange unit 25 can use the cooling provided by the external cold source to cool the coolant returning to the side flow channel 16, thereby exchanging the heat dissipated by the electronic device 10 with the external cooling cycle, and finally dissipating it to the external cold source.

[0032] Single-phase immersion liquid cooling systems are simple in structure and highly reliable, making them the most widely used type of immersion liquid cooling system in the industry. However, as... Figure 1 and Figure 2 The conventional single-phase immersion liquid cooling system shown has the following disadvantages.

[0033] In conventional single-phase immersion liquid cooling systems, the overall flow velocity of the coolant is low, and the non-uniformity of the flow easily leads to localized hot spots. Even when the coolant flows uniformly, the coolant flow velocity near heat-generating and non-heat-generating devices is almost the same. The coolant flow on the surface of most heat-generating devices is laminar, and its heat transfer coefficient is not high. Furthermore, it is difficult to increase the coolant flow velocity in the immersion chamber 11 by designing flow channels within the electronic equipment 10 or adding moving parts (such as fans, pumps, etc.). Therefore, when the power density of the heat-generating devices is high, heat dissipation bottlenecks are easily encountered.

[0034] Furthermore, in conventional single-phase immersion liquid cooling systems, simply increasing the overall flow rate of the coolant within the immersion tank 11 by increasing the pump's driving force to enhance the heat dissipation capacity of individual heat-generating components is not very effective in increasing the localized heat dissipation capacity of the components. Moreover, this method comes at a significant cost. Specifically, the pump's power increases exponentially with its head, and this approach becomes impractical beyond a certain flow rate. Additionally, when the overall coolant flow rate increases, for systems like... Figure 2 For the single-phase immersion liquid cooling system built into the heat exchange unit 25 shown, the side flow channels 16 and bottom flow channels 14 reserved in the immersion box 11 also need to be enlarged accordingly, and for Figure 1For the single-phase immersion liquid cooling system with the heat exchange unit 25 externally mounted as shown, the piping design needs to be enlarged, which will greatly reduce the space utilization of the immersion tank 11, increase the volume of ineffective coolant utilization, and increase the overall cost of the single-phase immersion liquid cooling system.

[0035] Furthermore, in conventional single-phase immersion liquid cooling systems, the most common approach to enhancing local heat transfer performance is to design a heat dissipation device on the heat-generating components. This could be achieved using a copper heat sink, or a more expensive two-dimensional (2D) or even three-dimensional (3D) vapor chamber to improve the local heat transfer capability of the heat-generating components. However, as the power density of heat-generating components further increases, single-phase immersion liquid cooling solutions will also encounter heat dissipation bottlenecks.

[0036] Furthermore, in conventional single-phase immersion liquid cooling systems, the coolant flows as a whole within the immersion tank 11 driven by a pump, making the architecture highly dependent on the heat exchange unit 25. Whether the heat exchange unit 25 is built-in or external, the pump in the heat exchange unit 25 needs to have high redundancy, making it difficult to achieve consistency with other forms of liquid cooling (such as cold plate liquid cooling) in data center architectures.

[0037] In two-phase immersion liquid cooling systems, the heat generated by high-power-density devices causes localized boiling of the coolant nearby, allowing the heat generated by the devices to be carried away by the latent heat of phase change in the coolant. The evaporated coolant can be cooled again by heat exchange coils located at the top of the immersion tank or by a condenser located outside the immersion tank, thus condensing back into a liquid state. In two-phase immersion liquid cooling systems, apart from localized boiling, the coolant does not flow in any other way. This phase change liquid cooling method also encounters heat dissipation bottlenecks. For example, due to the limited area and relatively smooth surface of the heat-generating devices, large bubbles are generated when the coolant boils, resulting in relatively high local thermal resistance and low heat exchange efficiency. To improve the boiling heat transfer capacity of the device surface, the industry often uses powder sintering or special materials to enhance the boiling effect on the heat dissipation surface, making the boiling more intense, thereby reducing large bubbles to small bubbles and avoiding the thermal resistance and boiling effect loss caused by excessively large bubbles on the heat dissipation surface and bubbles that do not detach for a long time. However, since boiling in a two-phase immersion liquid cooling system mainly occurs locally, the flow of the coolant is very poor, and it is difficult to make the coolant flow by adding a pump. As a result, the temperature distribution of the coolant is uneven and the heat exchange efficiency is low.

[0038] The embodiments of this disclosure provide an immersion liquid cooling system to at least partially solve the above-mentioned problems. The following will be combined with... Figures 3 to 5 To describe the principles of this disclosure.

[0039] Figure 3A schematic diagram of an immersion liquid cooling system according to an embodiment of the present disclosure is shown. Figure 3 As shown, the immersion liquid cooling system described herein is a single-phase immersion liquid cooling system, which generally includes an immersion tank 11, a heat exchange unit 25, and a bubble generating device 3.

[0040] like Figure 3 As shown, the immersion chamber 11 is filled with coolant, and the electronic device 10 to be cooled is located inside the immersion chamber 11 and submerged in the coolant. The coolant level 13 is higher than the top of the electronic device 10, meaning the electronic device 10 is completely submerged in the coolant. In some embodiments, the electronic device 10 may also be partially submerged in the coolant, and a portion of the non-heat-generating device may not be submerged. The immersion chamber 11 may be provided with a cover 12, which allows for convenient operation of the electronic device 10, such as plugging and unplugging. An air chamber 17 is formed in the immersion chamber 11 above the coolant level 13.

[0041] In some embodiments, the coolant may include fluorinated fluid or mineral oil. In other embodiments, the coolant may be other types, and the embodiments disclosed herein are not strictly limited in this respect.

[0042] In some embodiments, electronic device 10 may include internet devices (also known as IT devices), such as servers or switches. In other embodiments, electronic device 10 may be of other types, and the embodiments of this disclosure are not strictly limited in this respect.

[0043] A heat exchange unit 25 is disposed in the immersion chamber 11 and is used to cool the coolant in the immersion chamber 11 using an external cold source. The heat exchange unit 25 can be connected to the external cold source through an external cold supply pipe 23 and an external cold return pipe 24, so as to receive additional coolant from the external cold source via the external cold supply pipe 23 and return the heated additional coolant to the external cold source via the external cold return pipe 24. The additional coolant may include cooling water or other types of coolant, and the embodiments of this disclosure are not limited thereto. With the above arrangement, the heat exchange unit 25 can use the cooling provided by the external cold source to cool the coolant in the immersion chamber 11, thereby exchanging the heat dissipated by the electronic device 10 to the external cold circulation, and finally dissipating it to the external cold source.

[0044] In some embodiments, heat exchange unit 25 may include a plate heat exchanger. In other embodiments, heat exchange unit 25 may include other types of heat exchangers, and the embodiments disclosed herein are not strictly limited in this respect.

[0045] In some embodiments, such as Figure 3As shown, the bubble generating device 3 includes an air pump 30, an intake pipe 31, an exhaust pipe 32, and a bubble discharge channel 33. The air pump 30 is disposed in the immersion chamber 11 and connected to the intake pipe 31 and the exhaust pipe 32 to draw in air via the intake pipe 31 and exhaust air via the exhaust pipe 32. The intake port 311 of the intake pipe 31 is disposed in the air chamber 17 to draw in air from the air chamber 17. The exhaust pipe 32 is connected to the bubble discharge channel 33 to deliver gas to the bubble discharge channel 33. The bubble discharge channel 33 is disposed below the electronic device 10. The bubble discharge channel 33 includes a plurality of jet holes 331 for ejecting bubbles 34 toward the electronic device 10 to be cooled.

[0046] Using the above arrangement, the air pump 30 can draw air from the air chamber 17 at the top of the submerged housing 11 via the suction pipe 31, and then eject the gas through the exhaust pipe 32 from the jet hole 331 on the bubble discharge channel 33. Since the density of the gas is lower than that of the coolant, the ejected gas will form bubbles 34 under the action of natural buoyancy. The bubbles 34 are continuously ejected from the jet hole 331, creating a pseudo-boiling effect in the coolant. After passing through the coolant, the bubbles 34 return to the air chamber 17, thus forming an internal gas circulation path. After the coolant is heated by the electronic device 10, the hot coolant rises under the action of natural buoyancy, forming convection. Under the action of the pseudo-boiling effect formed by a large number of bubbles 34, this convection is further enhanced. In this way, the overall temperature uniformity of the coolant can be enhanced by utilizing the pseudo-boiling effect generated with relatively low energy consumption. Simultaneously, the turbulence caused by the numerous bubbles 34 surrounding the heat-generating components in the electronic device 10 is increased, thus increasing the local heat transfer coefficient and improving heat transfer efficiency. This overcomes the local heat dissipation bottleneck of high-power devices. Furthermore, by employing this pseudo-boiling effect, a plate heat exchanger can be installed only within the immersion tank 11. The outside of the immersion tank 11 only requires connection to an external cold source via external cooling supply pipes 23 and external cooling return pipes 24, simplifying the data center architecture and making it easier to align with cold-plate data center architectures. In addition, the internal gas circulation path reduces coolant evaporation losses.

[0047] In some embodiments, such as Figure 3 As shown, the heat exchange unit 25 is disposed between the electronic device 10 to be cooled and the bubble discharge channel 33. Multiple jet nozzles 331 are arranged facing the heat exchange unit 25. With this arrangement, the bubbles 34 ejected from the jet nozzles 331 first pass through the heat exchange unit 25, enhancing the upward convection of the coolant near the heat exchange unit 25 and further improving heat exchange efficiency. In other embodiments, the heat exchange unit 25 may also be disposed at other locations within the immersion chamber 11, such as... Figure 2 The heat exchange unit 25 is shown near the side wall of the immersion tank 11. In other embodiments, the heat exchange unit 25 may also be disposed outside the immersion tank 11, for example, as shown in the image. Figure 1 The layout shown.

[0048] In some embodiments, such as Figure 3 As shown, the plurality of jet holes 331 include multiple sets of jet holes 331 spaced apart from each other. Each set of jet holes 331 is disposed below a corresponding heat-generating device in the electronic device 10. This arrangement can enhance the turbulence at each heat-generating device and improve heat transfer efficiency. In other embodiments, the plurality of jet holes 331 may employ other arrangements, and the embodiments disclosed herein are not limited thereto.

[0049] In some embodiments, such as Figure 3 As shown, the air pump 30 is submerged in coolant. In some embodiments, the air pump 30 may also be disposed in the air chamber 17. In some embodiments, as Figure 3 As shown, the air pump 30 can be installed near the side wall of the immersion chamber 11, and the intake pipe 31 and exhaust pipe 32 are installed vertically near the side wall of the immersion chamber 11.

[0050] Figure 4 A schematic diagram of an immersion liquid cooling system according to another embodiment of the present disclosure is shown. Figure 4 The structure of the immersion liquid cooling system shown is similar to Figure 3 The structures of the immersion liquid cooling systems shown are similar, the difference being... Figure 4 The air pump 30 in the immersion liquid cooling system shown is located outside the immersion chamber 11. The differences between the two will be described in detail below, while the identical parts will not be repeated.

[0051] like Figure 4 As shown, the air pump 30 is located outside the immersion chamber 11. The air pump 30 is connected to an intake pipe 31 and an exhaust pipe 32 to draw in air via the intake pipe 31 and exhaust air via the exhaust pipe 32. The intake port 311 of the intake pipe 31 is located in the air chamber 17 to draw in air from the air chamber 17. The exhaust pipe 32 is connected to a bubble discharge channel 33 to deliver gas to the bubble discharge channel 33. The bubble discharge channel 33 is located below the electronic device 10 to eject bubbles 34 towards the electronic device 10 to be cooled via multiple jet holes 331. By placing the air pump 30 outside the immersion chamber 11, the structural design inside the immersion chamber 11 is simplified, and system reliability is enhanced. Furthermore, the external air pump 30 can simultaneously provide a pseudo-boiling effect to multiple immersion chambers 11, resulting in a simpler structural design.

[0052] In some embodiments, at least one of the intake pipe 31 and the exhaust pipe 32 may be provided with a component for adsorbing or condensing coolant vapor. For example, an external coolant may be coupled to at least one of the intake pipe 31 and the exhaust pipe 32 to convert coolant vapor back into liquid. Using this component, coolant evaporation loss can be reduced.

[0053] As described above, in conventional single-phase immersion liquid cooling solutions, it is difficult to increase the flow velocity of the coolant by designing the flow channels within the electronic device 10 or by adding moving parts (such as fans, pumps, etc.); it is also difficult to increase the overall flow velocity of the liquid in the immersion tank to enhance the heat dissipation capacity of the heat-generating device by increasing the pump head in the heat exchange unit. In the embodiments according to this disclosure, by utilizing the pseudo-boiling effect, the predicament of conventional single-phase immersion liquid cooling being unable to achieve local heat exchange enhancement can be overcome with only a low-cost and simple local flow channel design.

[0054] In some embodiments, to further improve the heat dissipation performance of the high-power devices 101 in the electronic device 10, one or more air guide pipes 35 are provided in the immersion chamber 11 to guide the air bubbles 34 to the corresponding high-power devices 101, such as... Figure 5 As shown, the air inlet 351 of the air guide pipe 35 is correspondingly positioned with the corresponding jet hole 331 on the bubble discharge channel 33, and the air outlet 352 of the air guide pipe 35 is positioned below the corresponding high-power device 101 in the electronic device 10 to be cooled. Due to the buoyancy effect of the bubbles 34 in the coolant, this air guide pipe 35 can adopt a very simple flexible pipe design. When the air guide pipe 35 is connected to the jet hole 331, there is no need to overly consider the airtightness issue, nor is it necessary to design a special joint. It is only necessary to place the air inlet 351 of the air guide pipe 35 at the jet hole 331, and make its lateral dimension slightly larger than the jet hole 331 to achieve the purpose of air guidance.

[0055] In some embodiments, such as Figure 5 As shown, the inlet end 351 of one or more air ducts 35 at least partially surrounds the corresponding jet hole 331 on the bubble discharge channel 33. In other words, the height of the inlet end 351 may be lower than the height of the top of the jet hole 331. In other embodiments, the height of the inlet end 351 may be substantially flush with or slightly higher than the height of the top of the jet hole 331, which can also guide the bubble 34 to the corresponding high-power device 101.

[0056] By inducing a local jet effect near the high-power device 101 using the gas guide pipe 35 under the boiling effect, the heat dissipation capacity of the high-power device 101 can be enhanced at a relatively low cost.

[0057] In some embodiments, a larger jet hole 331 may be provided for the high-power device 101 that requires enhanced heat exchange, and air may be guided through the air guide pipe 35 to guide more bubbles to the high-power device 101 that requires enhanced heat exchange.

[0058] In one embodiment, such as Figure 5As shown, at least one of one or more gas ducts 35 includes an inlet end 351 and two outlet ends 352. The gas duct 35 includes a main pipe 353 and two branch pipes 354, with the inlet end 351 disposed on the main pipe 353 and the two outlet ends 352 disposed on the two branch pipes 354 respectively. Using this arrangement, gas can be simultaneously supplied to two high-power devices 101 using the same gas duct 35. In other embodiments, at least one gas duct 35 may include more than one outlet end 352.

[0059] In the above text, combined Figure 3 and Figure 4 The single-phase immersion liquid cooling system illustrated describes the principles of this disclosure. However, it should be understood that the bubble generating device 3 described herein can also be applied to a two-phase immersion liquid cooling system. The two-phase immersion liquid cooling system can also have an immersion chamber 11 and a heat exchange unit 25. The immersion chamber 11 can have the structure and arrangement described above. The heat exchange unit 25 can be disposed within or outside the immersion chamber 11 for cooling the coolant within the immersion chamber 11. In a two-phase immersion liquid cooling system, the heating of high-power-density devices causes localized boiling of the coolant near them, allowing the heat generated by the devices to be carried away by the latent heat of phase change in the coolant. The evaporated coolant can be cooled again by a heat exchange coil disposed in the gas chamber 17 or by a condenser disposed outside the immersion chamber 11, thereby condensing back into a liquid state. In a two-phase immersion liquid cooling system, the pseudo-boiling effect can enhance the overall temperature uniformity of the coolant within the immersion chamber 11. Furthermore, by guiding the bubbles 34 through the air duct 35 to generate local jets, the heat dissipation capacity of individual components can be enhanced. In addition, strengthening local flow disturbances can accelerate the timely detachment of bubbles generated by boiling on the heat dissipation surface of the component, thereby enhancing the boiling effect and further improving heat dissipation efficiency.

[0060] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An immersion liquid cooling system, comprising: An immersion chamber (11) is provided for containing coolant and an electronic device (10) to be cooled, the electronic device (10) to be cooled being at least partially immersed in the coolant, and an air chamber (17) is formed in the immersion chamber (11) above the liquid surface (13) of the coolant. Heat exchange unit (25) for cooling the coolant using an external cold source; and The bubble generating device (3) includes an air pump (30), an air intake pipe (31), an exhaust pipe (32), and a bubble discharge channel (33). The air pump (30) is connected to the air intake pipe (31) and the exhaust pipe (32) to draw in air via the air intake pipe (31) and exhaust air via the exhaust pipe (32). The air intake port (311) of the air intake pipe (31) is disposed in the air chamber (17). The exhaust pipe (32) is connected to the bubble discharge channel (33). The bubble discharge channel (33) is disposed below the electronic device (10) to be cooled, and the bubble discharge channel (33) includes a plurality of jet holes (331) for ejecting bubbles toward the electronic device (10) to be cooled. The bubble discharge channel (33) is located inside the immersion chamber (11), the heat exchange unit (25) is disposed between the electronic device (10) to be cooled and the bubble discharge channel (33), and the plurality of jet holes (331) are arranged to face the heat exchange unit (25).

2. The immersion liquid cooling system according to claim 1, wherein the heat exchange unit (25) is connected to the external cold source through an external cold supply pipe (23) and an external cold return pipe (24).

3. The immersion liquid cooling system according to claim 1, wherein the plurality of jet holes (331) comprises a plurality of sets of jet holes (331) spaced apart from each other.

4. The immersion liquid cooling system according to claim 1, wherein the air pump (30) is disposed in the immersion chamber (11).

5. The immersion liquid cooling system according to claim 4, wherein the air pump (30) is immersed in the coolant.

6. The immersion liquid cooling system according to claim 4, wherein the air pump (30) is disposed adjacent to the side wall of the immersion chamber (11), and the air intake pipe (31) and the air exhaust pipe (32) are disposed vertically adjacent to the side wall of the immersion chamber (11).

7. The immersion liquid cooling system according to claim 1, wherein the air pump (30) is disposed outside the immersion chamber (11).

8. The immersion liquid cooling system according to claim 7, wherein at least one of the suction pipe (31) and the exhaust pipe (32) is provided with a component for adsorbing or condensing the vapor of the coolant.

9. The immersion liquid cooling system according to claim 1, wherein the immersion liquid cooling system is a single-phase immersion liquid cooling system or a two-phase immersion liquid cooling system.

10. The immersion liquid cooling system according to claim 1 further includes one or more air ducts (35) disposed in the immersion chamber (11), wherein the air inlet (351) of the one or more air ducts (35) is correspondingly disposed with respect to the corresponding air jet (331) on the bubble discharge channel (33), and the air outlet (352) of the one or more air ducts (35) is disposed below the corresponding high-power device (101) in the electronic device (10) to be cooled.

11. The immersion liquid cooling system according to claim 10, wherein at least one of the one or more air ducts (35) comprises an air inlet (351) and at least two air outlets (352).

12. The immersion liquid cooling system according to claim 10, wherein the air inlet (351) of the one or more air ducts (35) at least partially surrounds the corresponding air jet (331) on the bubble discharge channel (33).

Images