Mask support template, its manufacturing method, and manufacturing method of frame-integrated mask

Abstract

The present invention relates to a mask support template, a manufacturing method thereof, and a manufacturing method of a frame-integrated mask. According to the manufacturing method of the mask support template of the present invention, the template (50) is used to support the mask (100) for forming OLED pixels and make it correspond to the frame (200), and the method includes the following steps: (a) preparing a rolled mask metal film (110'); (b) bonding the mask metal film (110') to the template (50) having a temporary bonding portion (55) formed on one surface; (c) reducing the thickness of the mask metal film (110') bonded to the template (50); and (d) manufacturing the mask (100) by forming a mask pattern (P) on the mask metal film (110).

Description

Technical Field

[0001] The present invention relates to a mask support template, a manufacturing method thereof, and a manufacturing method of a frame-integrated mask. More specifically, it relates to a mask support template, a manufacturing method thereof, and a manufacturing method of a frame-integrated mask that can prevent the mask from deforming, stably support and move the mask, stably attach the mask to the frame, and accurately align each mask. Background Art

[0002] As a technology for forming pixels in the OLED (organic light-emitting diode) manufacturing process, the FMM (Fine Metal Mask) method is mainly used. In this method, a thin-film metal mask (Shadow Mask) is closely attached to a substrate, and an organic substance is deposited at a desired position.

[0003] In the existing OLED manufacturing process, after manufacturing the mask into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. A single mask can have multiple units corresponding to a single display. In addition, in order to manufacture a large-area OLED, multiple masks can be fixed to the OLED pixel deposition frame. During the process of fixing to the frame, each mask is stretched to make it flat. Adjusting the stretching force to make the entire part of the mask flat is a very difficult task. In particular, in order to make all units flat and at the same time align mask patterns with dimensions of only several μm to several tens of μm, it is required to finely adjust the stretching force applied to each side of the mask and confirm the alignment state in real time, which is a highly demanding task.

[0004] Nevertheless, during the process of fixing multiple masks to a single frame, there are still problems such as poor alignment between masks and between mask units. In addition, during the process of welding and fixing the mask to the frame, since the thickness of the mask film is too thin and the area is large, there are problems such as the mask sagging or twisting due to the load; problems such as misalignment of mask units caused by wrinkles, burrs, etc. generated at the welding part during the welding process.

[0005] In ultra-high-definition OLEDs, the existing QHD (Quarter High Definition) picture quality is 500 - 600 PPI (pixels per inch), and the pixel size reaches about 30 - 50 μm. In contrast, 4K UHD (Ultra High Definition) and 8K UHD have higher resolutions such as ~860 PPI and ~1600 PPI. Considering the pixel size of ultra-high-definition OLEDs, it is necessary to reduce the alignment error between units to the order of several μm. Exceeding this error will lead to product defects and the yield may be extremely low. Therefore, it is necessary to develop technologies that can prevent deformation such as sagging or distortion of the mask and enable precise alignment, as well as technologies for fixing the mask to the frame. Summary of the Invention

[0006] Technical Problem

[0007] Therefore, the present invention is proposed to solve the problems in the above-mentioned prior art, and its purpose is to provide a mask support template that enables the mask to be stably attached to the frame and a manufacturing method thereof.

[0008] In addition, the purpose of the present invention is to provide a mask support template that can prevent the mask from deforming, stably support and move the mask, and a manufacturing method thereof.

[0009] In addition, the purpose of the present invention is to provide a mask support template that can form a fine mask pattern on the mask and a manufacturing method thereof.

[0010] In addition, the purpose of the present invention is to provide a mask support template that can improve the adhesion between the mask and the frame when attaching the mask to the frame and a manufacturing method thereof.

[0011] In addition, the purpose of the present invention is to provide a mask support template that can be reused after attaching the mask to the frame and a manufacturing method thereof.

[0012] In addition, the purpose of the present invention is to provide a manufacturing method for a frame-integrated mask that enables the mask and the frame to form an integrated structure.

[0013] In addition, the purpose of the present invention is to provide a manufacturing method for a frame-integrated mask that can prevent deformation such as sagging or distortion of the mask and accurately perform alignment.

[0014] In addition, the purpose of the present invention is to provide a manufacturing method for a frame-integrated mask that can significantly shorten the manufacturing time and significantly improve the yield.

[0015] Technical Solution

[0016] The above object of the present invention is achieved by a method for manufacturing a mask support template, which is used to support a mask for forming OLED pixels and make the mask correspond to a frame. The method includes the following steps: (a) preparing a mask metal film; (b) bonding the mask metal film to a template having a temporary bonding portion formed on one side; (c) reducing the thickness of the mask metal film bonded to the template; and (d) manufacturing a mask by forming a mask pattern on the mask metal film.

[0017] In addition, the above object of the present invention is achieved by a method for manufacturing a mask support template, which is used to support a mask for forming OLED pixels and make the mask correspond to a frame. The method includes the following steps: (a) preparing a mask metal film; (b) reducing at least a part of the thickness from the first surface and the second surface opposite to the first surface of the mask metal film; (c) bonding the mask metal film to a template having a temporary bonding portion formed on one side; and (d) manufacturing a mask by forming a mask pattern on the mask metal film.

[0018] In step (a), a mask metal film is prepared and at least a part of the thickness is reduced from the first surface of the mask metal film. In step (b), the first surface of the mask metal film is bonded to the template. In step (c), at least a part of the thickness can be reduced from the second surface opposite to the first surface of the mask metal film.

[0019] The temporary bonding portion can be an adhesive or an adhesive sheet that can be separated by heating, or an adhesive or an adhesive sheet that can be separated by irradiating ultraviolet rays.

[0020] The thickness reduction of the mask metal film can be carried out by any one of chemical mechanical polishing (CMP, Chemical Mechanical Polishing), chemical wet etching, and dry etching.

[0021] When the thickness of the mask metal film is reduced by the chemical mechanical polishing method, the surface roughness on one surface of the mask metal film can be reduced.

[0022] When the thickness of the mask metal film is reduced by chemical wet etching or dry etching, polishing can be further carried out in subsequent steps to reduce the surface roughness of one surface of the mask metal film.

[0023] The thickness of the mask metal film can be reduced to 5 μm to 20 μm.

[0024] Step (d) may include the following steps: (d1) forming a patterned insulating portion on the mask metal film; (d2) forming a mask pattern by etching the portion of the mask metal film exposed between the insulating portions; and (d3) removing the insulating portion.

[0025] Based on the thickness of the mask metal film, when the first surface is 0% and the second surface is 100%, at least a part of the mask can use a part equivalent to 10% to 90% of the thickness of the mask metal film.

[0026] In addition, the above object of the present invention is achieved by a mask support template for supporting a mask for forming an OLED pixel and corresponding the mask to a frame. The mask support template includes: a template; a temporary bonding portion formed on the template; and a mask bonded to the template by sandwiching the temporary bonding portion and having a mask pattern formed thereon, and the thickness of the mask is 5 μm to 20 μm.

[0027] The mask may include a central portion formed by reducing at least a part of the thickness from the upper and lower surfaces of a mask metal film manufactured by a rolling process.

[0028] Based on the thickness of the mask metal film, when the upper surface is 0% and the lower surface is 100%, at least a part of the mask can use a part equivalent to 10% to 90% of the thickness of the mask metal film.

[0029] The temporary bonding portion may be an adhesive or an adhesive sheet that can be separated by heating, or an adhesive or an adhesive sheet that can be separated by irradiating ultraviolet rays.

[0030] A laser passing hole may be formed in an edge portion of the template corresponding to a welding portion of the mask.

[0031] The material of the template may include any one of a wafer, glass, silica, heat-resistant glass, quartz, alumina (Al 2 O 3 )), and borosilicate glass.

[0032] In addition, the above object of the present invention is achieved by a method for manufacturing a frame-integrated mask in which at least one mask and a frame for supporting the mask are formed integrally. The method includes the following steps: (a) loading a template manufactured by the above manufacturing method onto a frame having at least one mask unit area so that the mask corresponds to the mask unit area of the frame; and (b) attaching the mask to the frame.

[0033] Advantages of the Invention

[0034] According to the present invention as described above, there is an effect that the mask can be stably attached to the frame.

[0035] In addition, the present invention has an effect that the mask can be supported and moved stably without being deformed.

[0036] In addition, the present invention has the effect of being able to form a fine mask pattern on the mask.

[0037] In addition, the present invention has the effect of improving the adhesion between the mask and the frame when attaching the mask to the frame.

[0038] In addition, the present invention has the effect of being reusable after attaching the mask to the frame.

[0039] In addition, the present invention has the effect of enabling the mask and the frame to form an integral structure.

[0040] In addition, the present invention has the effect of preventing deformation such as sagging or distortion of the mask and accurately performing alignment.

[0041] In addition, the present invention has the effect of significantly shortening the manufacturing time and significantly improving the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a schematic diagram showing a conventional mask for OLED pixel deposition.

[0043] Figure 2 is a schematic diagram showing a conventional process of attaching a mask to a frame.

[0044] Figure 3 is a schematic diagram showing an alignment error between cells occurring in a conventional stretching mask process.

[0045] Figure 4 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention.

[0046] Figure 5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.

[0047] Figure 6 is a schematic diagram showing a process of manufacturing a frame according to an embodiment of the present invention.

[0048] Figure 7 is a schematic diagram showing a process of manufacturing a frame according to another embodiment of the present invention.

[0049] Figure 8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.

[0050] Figure 9 is a schematic diagram showing a mask according to an embodiment of the present invention.

[0051] Figures 10 to 11 is a schematic diagram showing a process of manufacturing a mask support template by forming a mask by bonding a mask metal film to a template.

[0052] Figure 12 It is a schematic diagram of a mask metal film showing another embodiment of the present invention.

[0053] Figure 13 It is a schematic diagram of the manufacturing process of a mask metal film showing another embodiment of the present invention.

[0054] Figure 14 It is a schematic diagram of the process of loading a mask support template onto a frame showing an embodiment of the present invention.

[0055] Figure 15 It is a schematic diagram of the state where the mask corresponds to the unit area of the frame after loading the template onto the frame showing an embodiment of the present invention.

[0056] Figure 16 It is a schematic diagram of the process of separating the mask from the template after attaching the mask to the frame showing an embodiment of the present invention.

[0057] Figure 17 It is a schematic diagram of the state where the mask is attached to the frame showing an embodiment of the present invention.

[0058] Figure 18 It is a schematic diagram of an OLED pixel deposition apparatus using a frame-integrated mask showing an embodiment of the present invention.

[0059]

Reference Signs

[0060] 40, 45: Support substrate

[0061] 41, 46: Bonding part

[0062] 50: Template

[0063] 50a, 50b: Central part, edge part of the template

[0064] 51: Laser passing hole

[0065] 55: Temporary bonding part

[0066] 70: Lower support

[0067] 90: Vacuum chuck

[0068] 100: Mask

[0069] 101, 102: One side, the other side of the mask

[0070] 110, 110', 110": Mask film, mask metal film

[0071] 111": First side of the mask metal film

[0072] 112″: The second side of the mask metal film

[0073] 115″: The central part of the mask metal film

[0074] 117″: The upper layer part of the mask metal film

[0075] 119″: The lower layer part of the mask metal film

[0076] 200: Frame

[0077] 210: Edge frame part

[0078] 220, 220': Mask unit sheet part

[0079] 221: Edge sheet part

[0080] 223: First grid sheet part

[0081] 225: Second grid sheet part

[0082] 1000: OLED pixel deposition device

[0083] C: Unit, mask unit

[0084] CM: Chemical treatment

[0085] CR: Mask unit area

[0086] DM: dummy part, mask dummy part

[0087] ET: Apply heat

[0088] L: Laser

[0089] R: Hollow area of the edge frame part

[0090] P: Mask pattern

[0091] PS, PS1, PS2: Planarization process

[0092] US: Apply ultrasonic wave

[0093] UV: Apply ultraviolet ray

[0094] W: Welding

[0095] WB: Solder ball Detailed implementation manners

[0096] The following detailed description of the present invention will refer to the accompanying drawings, which illustrate specific embodiments capable of implementing the present invention as examples. These embodiments will be described in sufficient detail to enable those skilled in the art to implement the present invention. Although the various embodiments of the present invention are different from each other, they do not necessarily exclude each other. For example, the specific shapes, structures, and characteristics described herein are related to one embodiment and can be implemented as other embodiments without departing from the spirit and scope of the present invention. In addition, the position or configuration of individual components in each disclosed embodiment can be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description should not be regarded as limiting, and the scope of the present invention is only defined by the appended claims and all equivalent scopes thereof as long as it is appropriately described. Similar reference numerals in the drawings represent the same or similar functions in many aspects, and for convenience, lengths, areas, thicknesses, and their shapes may be exaggerated.

[0097] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

[0098] Figure 1 It is a schematic diagram showing a conventional mask 10 for depositing OLED pixels.

[0099] Refer to Figure 1 , the existing mask 10 can be manufactured in a stick - type or a plate - type. Figure 1 The mask 10 shown in (a) of Figure 1 can be used as a stick - type mask, and both sides of the stick can be welded and fixed to the OLED pixel deposition frame for use.

[0100] The body of the mask 10 (or the mask film 11) has a plurality of display units C. One unit C corresponds to one display of a smartphone or the like. Pixel patterns P are formed in the unit C to correspond to each pixel of the display. When the unit C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. As an example, pixel patterns P are formed in the unit C to have a resolution of 70×140. That is, a large number of pixel patterns P form a set to constitute one unit C, and a plurality of units C can be formed on the mask 10.

[0101] Figure 2 It is a schematic diagram of the process of attaching the existing mask 10 to the frame 20. Figure 3 It is a schematic diagram of the alignment error between units that occurs during the process of stretching the existing mask 10 from F1 to F2. Figure 1The example of the strip mask 10 having six cells C (C1 - C6) shown in (a) will be described.

[0102] Referring to Figure 2 In (a), first, the strip mask 10 should be flattened. Tensile forces F1 - F2 are applied along the long axis direction of the strip mask 10, and as it is stretched, the strip mask 10 is unfolded. In this state, the strip mask 10 is loaded onto the frame 20 in a square shape. The cells C1 - C6 of the strip mask 10 will be located in the blank area inside the frame of the frame 20. The size of the frame 20 can be sufficient to accommodate the cells C1 - C6 of one strip mask 10 in the blank area inside the frame, or it can be sufficient to accommodate the cells C1 - C6 of multiple strip masks 10 in the blank area inside the frame.

[0103] Referring to Figure 2 In (b), after fine - tuning the tensile forces F1 - F2 applied to each side of the strip mask 10 and performing alignment, a part of the side surface of the strip mask 10 is welded W, and the strip mask 10 and the frame 20 are connected. Figure 2 The side cross - section of the strip mask 10 and the frame connected to each other is shown in (c).

[0104] Referring to Figure 3 , even though the tensile forces F1 - F2 applied to each side of the strip mask 10 are fine - tuned, there is still a problem that the alignment between the mask cells C1 - C3 is not good. For example, the distances D1 - D1″, D2 - D2″ between the patterns P of the cells C1 - C3 are different from each other, or the pattern P is skewed. Since the strip mask 10 has a large area including multiple (as an example, six) cells C1 - C6 and has a very thin thickness of several tens of μm, it is prone to sagging or distortion due to the load. In addition, it is a very difficult task to adjust the tensile forces F1 - F2 to make all the cells C1 - C6 flat and at the same time to confirm the alignment state between each of the cells C1 - C6 in real - time through a microscope.

[0105] Therefore, a small error in the tensile forces F1 - F2 may cause an error in the degree of stretching or unfolding of each cell C1 - C3 of the strip mask 10, and thus, the distances D1 - D1″, D2 - D2″ between the mask patterns P are different. Although it is very difficult to perfectly align to make the error zero, in order to avoid the mask pattern P with a size of several μm to several tens of μm having an adverse effect on the pixel process of the ultra - high - definition OLED, the alignment error is preferably not more than 3 μm. The alignment error between such adjacent cells is called pixel position accuracy (PPA).

[0106] In addition, when approximately 6 to 20 strip masks 10 are respectively connected to a frame 20, it is a very difficult task to precisely align the strip masks 10 with each other and between the multiple units C1 - C6 of the strip mask 10, and it will only increase the alignment - based process time, which will be an important reason for reducing productivity.

[0107] In addition, after the strip mask 10 is connected and fixed to the frame 20, the tensile forces F1 - F2 applied to the strip mask 10 can act on the frame 20 in the reverse direction. That is, after the strip mask 10 tightened and stretched by the tensile forces F1 - F2 is connected to the frame 20, tension can act on the frame 20. Generally, when this tension is not large, it will not have a great impact on the frame 20. However, in the case where the size of the frame 20 is miniaturized and the strength becomes lower, this tension will cause slight deformation of the frame 20. In this way, a problem of destroying the alignment state between the multiple units C1 - C6 may occur.

[0108] In view of this, the present invention proposes a frame 200 and a frame - integrated mask that can form an integral structure with the mask 100. It can not only prevent the mask 100 integrated with the frame 200 from deforming such as sagging or twisting, but also can be precisely aligned with the frame 200. When the mask 100 is connected to the frame 200, no tensile force is applied to the mask 100. Therefore, after the mask 100 is connected to the frame 200, no tension that causes deformation is applied to the frame 200. And it can significantly shorten the manufacturing time of integrally connecting the mask 100 to the frame 200 and significantly improve the yield.

[0109] Figure 4 is a front view ((a) of Figure 4 showing a frame - integrated mask according to an embodiment of the present invention) and a side cross - sectional view ((b) of Figure 4 showing a frame - integrated mask according to an embodiment of the present invention), Figure 5 is a front view ((a) of Figure 5 showing a frame according to an embodiment of the present invention) and a side cross - sectional view ((b) of Figure 5 showing a frame according to an embodiment of the present invention).

[0110] Referring to Figure 4 and Figure 5 , the frame - integrated mask may include a plurality of masks 100 and a frame 200. In other words, it is a form in which a plurality of masks 100 are respectively attached to the frame 200. Hereinafter, for the sake of convenience of explanation, although a mask 100 in a rectangular shape is taken as an example for explanation, before the mask 100 is attached to the frame 200, it may be in the form of a strip mask having protrusions for clamping on both sides, and after being attached to the frame 200, the protrusions can be removed.

[0111] Multiple mask patterns P are formed on each mask 100, and one unit C can be formed on one mask 100. One mask unit C can correspond to one display of a smartphone or the like.

[0112] The mask 100 can use a metal sheet produced by a rolling process. The mask 100 can be an invar alloy with a coefficient of thermal expansion of about 1.0×10 -6 / °C or a superinvar material with a coefficient of thermal expansion of about 1.0×10 -7 / °C. Due to the very low coefficient of thermal expansion of the mask 100 made of this material, the possibility of the pattern shape of the mask being deformed by thermal energy is small, and it can be used as a Fine Metal Mask (FMM) or a Shadow Mask in the manufacture of high-resolution OLEDs. In addition, considering that a technology for implementing a pixel deposition process in a range with a small temperature change value has been recently developed, the mask 100 can also be made of materials such as nickel (Ni) or nickel-cobalt (Ni-Co) with a slightly larger coefficient of thermal expansion.

[0113] The metal sheet produced by the rolling process can have a thickness of dozens to hundreds of μm in the manufacturing process. In order to form the subsequent mask pattern P finely, it is necessary to make the relatively thick metal sheet with the above thickness into a thinner thickness. A process of making the thickness thinner than about 50 μm can be further performed on the metal sheet by methods such as chemical mechanical polishing. The thickness of the mask is preferably about 2 μm to 50 μm, more preferably about 5 μm to 20 μm. However, it is not necessarily limited to this.

[0114] For the case of using a metal sheet produced by the rolling process, in terms of thickness, although there is a problem that the thickness is greater than that of the coating formed by electroforming, due to the low coefficient of thermal expansion (CTE), no additional heat treatment process is required, and it has the advantage of strong corrosion resistance.

[0115] In addition, instead of necessarily using a metal sheet produced by a rolling process, a metal sheet produced by electroforming can be used. At this time, the coefficient of thermal expansion of the electroformed sheet can be reduced by further performing a heat treatment process. The base material used as the cathode electrode for electroforming can be a conductive material. In particular, since metals due to metal oxides, polycrystals due to inclusions and grain boundaries cannot apply a uniform electric field to the cathode body, a part of the plated metal sheet will be formed unevenly. Therefore, a mother board (or cathode body) of a single crystal material can be used. In particular, it can be a single crystal silicon material, and metals such as Ti, Cu, and Ag can also be used; semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, and Ge; carbon-based materials such as graphite and graphene; including CH 3 NH 3 PbCl 3 、CH 3 NH 3 PbBr 3 、CH 3 NH 3 PbI 3 、SrTiO 3 single crystal ceramics for superconductors such as perovskite structures; single crystal super heat-resistant alloys for aircraft parts, etc. In order to have conductivity, doping can be performed on a part or all of them. Since single crystal materials have no defects, a uniform electric field is formed on the entire surface during electroforming, so a uniform metal sheet is generated. Based on this, the frame-integrated masks 100 and 200 can further improve the image quality level of OLED pixels.

[0116] The frame 200 is formed in a form capable of attaching a plurality of masks 100. The frame 200 may include a plurality of corners formed along a first direction (e.g., horizontal) and a second direction (e.g., vertical) including the outermost periphery edge. Such a plurality of corners can divide the area for attaching the mask 100 on the frame 200.

[0117] The frame 200 may include an edge frame portion 210 having a generally quadrangular shape and a square shape. The inside of the edge frame portion 210 may be a hollow shape. That is, the edge frame portion 210 may include a hollow region R. The frame 200 may be formed of metal materials such as invar alloy, super invar alloy, aluminum, and titanium. Considering thermal deformation, the frame 200 is preferably formed of invar alloy, super invar alloy, nickel, nickel-cobalt, etc. having the same coefficient of thermal expansion as the mask. These materials can be applied to the edge frame portion 210 and the mask unit sheet portion 220 which are components of the frame 200.

[0118] In addition, the frame 200 has a plurality of mask unit regions CR and may include a mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet portion 220 is the same as the mask 100 and can be formed by rolling or by other film-forming processes such as electroforming. In addition, the mask unit sheet portion 220 can be connected to the edge frame portion 210 after forming a plurality of mask unit regions CR on a planar sheet by laser scribing, etching, etc. Alternatively, the mask unit sheet portion 220 can form a plurality of mask unit regions CR by laser scribing, etching, etc. after connecting a planar sheet to the edge frame portion 210. In this specification, the case where a plurality of mask unit regions CR are first formed in the mask unit sheet portion 220 and then connected to the edge frame portion 210 will be mainly described.

[0119] The mask unit sheet portion 220 may include an edge sheet portion 221 and at least one of a first grid sheet portion 223 and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to respective portions divided on the same sheet, and they are integrally formed with each other.

[0120] The edge sheet portion 221 can be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially quadrangular shape or a square shape corresponding to the edge frame portion 210.

[0121] In addition, the first grid sheet portion 223 may be formed to extend along a first direction (lateral). The first grid sheet portion 223 is formed in a straight line shape, and both ends thereof can be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 preferably has the same pitch.

[0122] In addition, the second grid sheet portion 225 may be formed to extend along a second direction (vertical). The second grid sheet portion 225 is formed in a straight line shape, and both ends thereof can be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has the same pitch.

[0123] On the other hand, depending on the size of the mask unit C, the pitch between the first grid sheet portions 223 and the pitch between the second grid sheet portions 225 may be the same or different.

[0124] Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the cross-sectional shape perpendicular to the length direction can be a quadrangular shape such as a rectangle or a trapezoid, a triangular shape, etc., and the edges and corners can be rounded. The cross-sectional shape can be adjusted during processes such as laser scribing and etching.

[0125] The thickness of the edge frame portion 210 can be greater than the thickness of the mask unit sheet portion 220. Since the edge frame portion 210 is responsible for the overall rigidity of the frame 200, it can be formed to have a thickness of several millimeters to several centimeters.

[0126] Regarding the mask unit sheet portion 220, the process of manufacturing a thick sheet is substantially difficult. If it is too thick, there is a possibility that the organic material source 600 [refer to Figure 18 will block the path through the mask 100 during the OLED pixel deposition process. On the contrary, if it is too thin, it may be difficult to ensure sufficient rigidity to support the mask 100. Therefore, the mask unit sheet portion 220 is preferably thinner than the thickness of the edge frame portion 210 but thicker than the thickness of the mask 100. The thickness of the mask unit sheet portion 220 can be about 0.1 mm to 1 mm. Also, the widths of the first grid sheet portion 223 and the second grid sheet portion 225 can be about 1 - 5 mm.

[0127] In the planar sheet, except for the regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11 - CR56) can be provided. From another perspective, the mask unit region CR can refer to the blank region in the hollow region R of the edge frame portion 210 except for the regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225.

[0128] As the unit C of the mask 100 corresponds to the mask unit region CR, it can substantially serve as a channel for depositing the pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display such as a smartphone. One mask pattern P for constituting one unit C can be formed in one mask 100. Or, one mask 100 has a plurality of units C and each unit C can correspond to each unit region CR of the frame 200. However, in order to accurately align the mask 100, it is necessary to avoid using a large-area mask 100. The mask 100 is preferably a small area having one unit C. Or, one mask 100 having a plurality of units C can also correspond to one unit region CR of the frame 200. At this time, in order to accurately align, a mask 100 corresponding to about 2 - 3 or so few units C can be considered.

[0129] The mask 200 has a plurality of mask unit regions CR, and each mask 100 can be attached in a form corresponding to each mask unit C and each mask unit region CR respectively. Each mask 100 can include a mask unit C formed with a plurality of mask patterns P and a dummy portion around the mask unit C (corresponding to the portion of the mask film 110 other than the unit C). The dummy portion can include only the mask film 110, or can include the mask film 110 formed with a predetermined dummy portion pattern having a similar form to the mask pattern P. The mask unit C corresponds to the mask unit region CR of the frame 200, and a part or all of the dummy portion can be attached to the frame 200 (the mask unit sheet portion 220). Thus, the mask 100 and the frame 200 can form an integral structure.

[0130] On the other hand, according to another embodiment, the frame is not manufactured in a manner of attaching the mask unit sheet portion 220 to the edge frame portion 210, but a frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) integrated with the edge frame portion 210 is directly formed in the hollow region R portion of the edge frame portion 210 can be used. This type of frame also includes at least one mask unit region CR, and a frame-integrated mask can be manufactured by corresponding the mask 100 to the mask unit region CR.

[0131] Next, the manufacturing process of the frame-integrated mask will be described.

[0132] First, the frame 200 described in Figure 4 and Figure 5 can be provided. Figure 6 FIG. is a schematic diagram showing the manufacturing process of the frame 200 according to an embodiment of the present invention.

[0133] Referring to Figure 6 (a) of FIG., the edge frame portion 210 is provided. The edge frame portion 210 can be in a square shape including a hollow region R.

[0134] Secondly, referring to Figure 6 (b) of FIG., the mask unit sheet portion 220 is manufactured. After manufacturing a planar sheet using rolling or other film-forming processes, the mask unit region CR portion is removed by laser scribing, etching, etc., thereby manufacturing the mask unit sheet portion 220. In this specification, an example of forming a 6×5 mask unit region CR (CR11-CR56) will be described. There can be 5 first grid sheet portions 223 and 4 second grid sheet portions 225.

[0135] Then, the mask unit sheet part 220 can be corresponded to the edge frame part 210. During the corresponding process, the edge sheet part 221 can be corresponded to the edge frame part 210 in a state where all sides of the mask unit sheet part 220 are stretched by F1 - F4 to make the mask unit sheet part 220 flatly extended. The mask unit sheet part 220 can also be clamped and stretched at multiple points (as an example of (b) of Figure 6 1 - 3 points) on one side. On the other hand, instead of all sides, the mask unit sheet part 220 can also be stretched along a part of the side direction by F1 and F2.

[0136] Then, if the mask unit sheet part 220 is corresponded to the edge frame part 210, the edge sheet part 221 of the mask unit sheet part 220 can be attached by welding method W. Preferably, all sides are welded by W so that the mask unit sheet part 220 is firmly attached to the edge frame part 210. The welding by W should be performed as close as possible to the corner side of the frame part 210, so as to minimize the warping space between the edge frame part 210 and the mask unit sheet part 220 and improve the adhesion. The welding W part can be generated in the form of a line or a spot, has the same material as the mask unit sheet part 220, and becomes a medium to connect the edge frame part 210 and the mask unit sheet part 220 into one body.

[0137] Figure 7 It is a schematic diagram showing the frame manufacturing process of another embodiment of the present invention. Figure 6 In the embodiment of Figure 7 first manufactures the mask unit sheet part 220 with the mask unit region CR, and then attaches it to the edge frame part 210, while

[0138] First, as shown in Figure 6 (a) of

[0139] provides the edge frame part 210 including the hollow region R. Figure 7 Then, referring to (a) of Figure 7In the example of (a), the unit sheet portion 220' is clamped and stretched at points 1 to 3. On the other hand, the F1 and F2 mask unit sheet portions 220' may be stretched along a part of the side portions instead of all the side portions.

[0140] Then, if the mask unit sheet portion 220' corresponds to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' can be attached by welding. Preferably, all sides are welded so that the mask unit sheet portion 220' is firmly attached to the edge frame portion 220. Welding should be performed as close as possible to the corner side of the edge frame portion 210 to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220' and improve adhesion. The welded portion can be generated in the form of a line or a spot, has the same material as the mask unit sheet portion 220', and can become a medium for connecting the edge frame portion 210 and the mask unit sheet portion 220' into one.

[0141] Then, refer to Figure 7 (b) A mask unit region CR is formed on a planar sheet (a planar mask unit sheet portion 220'). The sheet of the mask unit region CR is removed by laser scribing, etching, etc., so that the mask unit region CR can be formed. In this specification, the formation of 6×5 mask unit regions CR (CR11-CR56) is used as an example for explanation. After the mask unit region CR is formed, a mask unit sheet portion 220 can be formed, wherein the portion welded W to the edge frame portion 210 becomes an edge sheet portion 221, and the mask unit sheet portion 220 has 5 first grid sheet portions 223 and 4 second grid sheet portions 225.

[0142] Figure 8 This is a schematic diagram showing a conventional mask for forming a high-resolution OLED.

[0143] In order to realize high-resolution OLED, the size of the pattern gradually becomes smaller, and the thickness of the mask metal film used must also be thinner. Figure 8 As shown in (a), if you want to achieve high-resolution OLED pixels 6, you need to reduce the pixel spacing and pixel size in the mask 10' (PD->PD'). In addition, in order to prevent the shadow effect from causing uneven deposition of the OLED pixels 6, the pattern of the mask 10' should be formed 14 obliquely. However, in the process of obliquely forming 14 the pattern in a thicker mask 10' having a thickness T1 of about 30-50μm, it is difficult to perform patterning 13 that matches the fine pixel spacing PD' and pixel size, which becomes a factor that reduces the yield in the processing process. In other words, in order to have a fine pixel spacing PD' and obliquely form 14 the pattern, a thinner mask 10' should be used.

[0144] Specifically, in order to achieve a high resolution at the UHD level, as shown in (b) of Figure 8 , only by using a thin mask 10' with a thickness T2 of less than 20 μm can fine patterning be performed. In addition, in order to achieve an ultra-high resolution above UHD, a thinner mask 10' with a thickness T2 of 10 μm can be considered.

[0145] Figure 9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

[0146] The mask 100 may include a mask unit C in which a plurality of mask patterns P are formed and a dummy portion DM around the mask unit C. As described above, the mask 100 can be manufactured using a metal sheet generated by a rolling process, and one unit C can be formed in the mask 100. The dummy portion DM corresponds to the portion of the mask film 110 [mask metal film 110] other than the unit C, and may include only the mask film 110, or may include a mask film 110 in which a predetermined dummy pattern similar to the shape of the mask pattern P is formed. The dummy portion DM corresponds to the edge of the mask 100, and a part or all of the dummy portion DM may be attached to the frame 200 [mask unit sheet portion 220].

[0147] The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5 - 20 μm. Since the frame 200 has a plurality of mask unit regions CR (CR11 - CR56), a plurality of masks 100 may also be provided, and the masks 100 include mask units C (C11 - C56) corresponding to each mask unit region CR (CR11 - CR56).

[0148] Since one surface 101 of the mask 100 is a surface for contacting and attaching to the frame 200, it is preferably a flat surface. The one surface 101 can be made flat and mirror-finished by the planarization process described below. The other surface 102 of the mask 100 can face one surface of the template 50 described below.

[0149] Figures 10 to 11 is a schematic diagram showing a process of forming a mask 100 by bonding a mask metal film 110 to a template 50 to manufacture a mask support template according to an embodiment of the present invention.

[0150] Refer to Figure 10In (a), the template 50 can be provided. The template 50 is a medium for moving the mask 100 while being attached and supported on one side of the template 50. In order to support the flat mask 100 and move it, one side of the template 50 is preferably in a flat shape. The central portion 50a corresponds to the mask unit C of the mask metal film 110, and the edge portion 50b can correspond to the dummy portion DM of the mask metal film 110. In order to support the entire mask metal film 110, the template 50 can be in a large flat plate shape with a size larger than that of the mask metal film 110.

[0151] In order to facilitate visual observation such as vision during the process of aligning and attaching the mask 100 to the frame 200, the template 50 is preferably made of a transparent material. Moreover, the transparent material allows the laser to pass through. As the transparent material, materials such as glass, silica, heat-resistant glass, quartz, aluminum oxide (Al 2 O 3 ), borosilicate glass, zirconia, etc. can be used. As an example, the template 50 can use a material with excellent heat resistance, chemical durability, mechanical strength, transparency, etc. in borosilicate glass. Moreover, The thermal expansion coefficient of is approximately 3.3, and there is not much difference from the thermal expansion coefficient of the invar alloy mask metal film 110, which has the advantage of facilitating the control of the mask metal film 110.

[0152] In addition, in order not to generate an airgap between the interface of the template 50 and the mask metal film 110 [or the mask 100], the side of the template 50 in contact with the mask metal film 110 can be a mirror surface. Based on this, the surface roughness Ra of one side of the template 50 can be 100 nm or less. In order to achieve a template 50 with a surface roughness Ra of 100 nm or less, a wafer can be used for the template 50. The surface roughness Ra of the wafer is approximately 10 nm, and there are many products on the market, and the surface treatment process is well-known, so it can be used as the template 50. Since the surface roughness Ra of the template 50 is at the nm level, there is no airgap AG or the airgap AG hardly exists, and it is easy to generate weld beads WB based on laser welding, so it has no influence on the alignment error of the mask pattern P.

[0153] A laser passing hole 51 may be formed in the template 50, so that the laser L irradiated from the upper part of the template 50 reaches the welding part (the area where welding is performed) of the mask 100. The laser passing hole 51 may be formed on the template 50 corresponding to the position and number of the welding parts. A plurality of welding parts may be arranged at a predetermined interval at the edge of the mask 100 or in the dummy part DM, so a plurality of laser passing holes 51 may also be formed corresponding thereto and at a predetermined interval. As an example, since a plurality of welding parts are arranged at a predetermined interval in the dummy part DM on both sides (left / right) of the mask 100, a plurality of laser passing holes 51 may also be formed at a predetermined interval on both sides (left / right) of the template 50.

[0154] The laser passing hole 51 does not necessarily correspond to the position and number of the welding parts. For example, laser L may be irradiated only on a part of the laser passing holes 51 for welding. In addition, a part of the laser passing holes 51 that do not correspond to the welding parts may also be used as alignment marks when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser L, the laser passing hole 51 may not be formed either.

[0155] A temporary bonding part 55 may be formed on one surface of the template 50. The temporary bonding part 55 is used to temporarily bond the mask 100 [or the mask metal film 110'] to one surface of the template 50 and be supported by the template 50 before attaching it to the frame 200.

[0156] The temporary bonding part 55 uses an adhesive or adhesive sheet that can be separated by heating, or an adhesive or adhesive sheet that can be separated by irradiating ultraviolet rays.

[0157] As an example, the temporary bonding part 55 may use liquid wax. The liquid wax may be the same wax as that used in the semiconductor wafer polishing step or the like, and its type is not particularly limited. The liquid wax mainly contains substances such as acrylic acid, vinyl acetate, nylon, and various polymers as resin components for controlling and maintaining adhesion, impact resistance, etc., and solvents. As an example, the temporary bonding part 55 may use acrylonitrile-butadiene rubber (ABR) as the resin component and SKYLIQUID ABR-4016 containing n-propanol as the solvent component. The liquid wax may be formed on the temporary bonding part 55 by spin coating.

[0158] The temporary bonding part 55 as liquid wax has a decreased viscosity at a temperature higher than 85°C - 100°C, and an increased viscosity at a temperature lower than 85°C, and a part of it hardens like a solid, so the mask metal film 110' can be fixedly bonded to the template 50.

[0159] Then, refer toFigure 10 In (b) of [description], the mask metal film 110' can be bonded to the template 50. After heating the liquid wax to above 85°C and bringing the mask metal film 110' into contact with the template 50, the mask metal film 110' and the template 50 can be passed between rollers for bonding.

[0160] According to an embodiment, the template 50 is baked at a temperature of about 120°C for 60 seconds to vaporize the solvent of the temporary bonding portion 55, and the lamination process of the mask metal film is directly performed. Lamination can be carried out by loading the mask metal film 110' on the template 50 having the temporary bonding portion 55 formed on one side and passing it between an upper roll at about 100°C and a lower roll at about 0°C. As a result, the mask metal film 110' can be in contact with the template 50 by sandwiching the temporary bonding portion 55.

[0161] As another example, the temporary bonding portion 55 can use a thermal release tape. The thermal release tape is a base film with a PET film or the like arranged in the middle, and thermal-release adhesives are arranged on both sides of the base film. A release film / dielectric film can be arranged on the outer contour of the adhesive layer. Among them, the separation temperatures of the adhesive layers arranged on both sides of the base film can be different from each other.

[0162] According to an embodiment, in a state where the release film / dielectric film is removed, the lower surface of the thermal release tape [the lower second adhesive layer of the base film] is bonded to the template 50, and the upper surface of the thermal release tape [the upper first adhesive layer of the base film] can be bonded to the mask metal film 110'. Since the separation temperatures of the first adhesive layer and the second adhesive layer are different from each other, in the [description] mentioned later, Figure 16 when separating the template 50 from the mask 100, as the first adhesive layer is heated, the mask 100 can be separated from the template 50 and the temporary bonding portion 55.

[0163] Next, further referring to Figure 10 In (b) of [description], planarization PS can be performed on one side of the mask metal film 110'. Here, planarization PS means mirror-polishing one side (the upper surface) of the mask metal film 110' while removing a part of the upper portion of the mask metal film 110' to make the thickness thinner. As shown in Figure 8As shown in (b), in order to achieve a high resolution at the UHD level, only a thinner mask metal film 110 with a thickness of about 20 μm or less can be used for fine patterning. In order to achieve an ultra-high resolution above UHD, a thinner mask metal film 110 with a thickness of about 10 μm should be used. However, the mask metal film 110' generated by the rolling process has a thickness of about 25 - 500 μm, so it is necessary to make the thickness thinner. In addition, even if the mask metal film 110' generated by the electroforming process, which is thinner than the thickness of the rolling process, is used, the etching characteristics will be different according to the composition of the surface layer and the crystal structure / microstructure of the plated mask metal film 110'. Therefore, it is necessary to control the surface characteristics and thickness by planarizing the PS.

[0164] More specifically, the back surface 101 opposite to the surface 102 of the mask metal film 110' adhered to the template 50 can be planarized by PS and the thickness of the mask metal film 110' can be reduced. The planarization of PS can be performed by a chemical mechanical polishing method, and any well-known chemical mechanical polishing method can be used, and there is no particular limitation on it. Moreover, the thickness of the mask metal film 110' can be reduced by a chemical wet etching or dry etching method.

[0165] During the process of performing the planarization of PS, as a column, during the chemical mechanical polishing process, the surface roughness Ra of the upper surface of the mask metal film 110' can be controlled. Preferably, mirror finishing can be performed to further reduce the surface roughness. Or, as another example, after the planarization of PS is performed by a chemical wet etching or dry etching process, a polishing process such as a separate chemical mechanical polishing process can be additionally performed to reduce the surface roughness Ra.

[0166] In addition, as long as it is a planarization process that can thin the thickness of the mask metal film 110', any process can be used without particular limitation. Thus, as shown in (c), as the thickness of the mask metal film 110' is reduced (110' -> 110), the thickness of the mask metal film 110 becomes about 5 μm to 20 μm. Figure 10 As shown in (c), as the thickness of the mask metal film 110' is reduced (110' -> 110), the thickness of the mask metal film 110 becomes about 5 μm to 20 μm.

[0167] Then, referring to (d), a patterned insulating portion 25 can be formed on the mask metal film 110. The insulating portion 25 can be formed of a photoresist material by a printing method or the like. Figure 11 As shown in (d), a patterned insulating portion 25 can be formed on the mask metal film 110. The insulating portion 25 can be formed of a photoresist material by a printing method or the like.

[0168] Next, etching of the mask metal film 110 can be performed. Methods such as dry etching and wet etching can be used, and there is no particular limitation on them. As a result of the etching, the portion of the mask metal film 110 exposed at the empty position 26 between the insulating portions 25 is etched. The etched portion of the mask metal film 110 constitutes the mask pattern P, and thus the mask 100 formed with a plurality of mask patterns P can be manufactured.

[0169] Then, referring to Figure 11 in (e), the manufacturing of the template 50 that supports the mask 100 can be completed by removing the insulating portion 25.

[0170] Figure 12 FIG. is a schematic diagram of the mask metal film 110″ showing another embodiment of the present invention.

[0171] In order to fabricate the Figure 9 mask 100 described above, a process of forming the mask pattern P on the mask metal film 110″ needs to be performed. The mask pattern P can be formed by etching or the like. However, in order to achieve a high-resolution OLED of above UHD, the width of the mask pattern P should be less than 40 μm. Therefore, when performing etching, the morphology and orientation of the grains in the mask metal film 110″ also need to be considered. Since the etching rate varies depending on the grain orientation, if the non-uniform grains are etched, it is possible that the mask pattern P with the required width is not generated, and even an error of several μm will affect the achievement of high resolution.

[0172] Generally, for a metal film (sheet) generated by rolling, there are differences in the morphology, orientation, etc. of the grains on the surface, that is, the upper surface and the lower surface, and the portion in the central part of the metal film. Referring to Figure 12 FIG., there are differences in the grain characteristics between the portion 117″ [upper layer portion 117″] having a predetermined thickness from the upper surface 111″ of the mask metal film 110″, the portion 119″ [lower layer portion 119″] having a predetermined thickness from the lower surface 112″, and the portion corresponding to the central part 115″ other than the upper layer portion 117″ and the lower layer portion 119″. The grains in the upper layer portion 117″ and the lower layer portion 119″ are elongated in the rolling direction by rolling and have an irregular morphology. The grains on the central part 115″ generally have no directionality and have a spherical morphology.

[0173] Accordingly, another embodiment of the present invention is characterized in that, in order to prevent etching errors caused by different grain morphologies, the mask 100 is manufactured using the central portion 115″ of the mask metal film 110″ other than the upper portion 117″ and the lower portion 119″. The mask metal film 110 having the central portion 115″ can be manufactured by performing a line planarization PS1, PS2 process or a thickness reduction process on the upper portion 117″ and the lower portion 119″. Since only the central portion 115″ with regular and uniform grains is etched to form the mask pattern P, it has the advantage of being able to finely control the width of the mask pattern P.

[0174] Figure 13 is a schematic diagram of the manufacturing process of the mask metal film 110 of another embodiment of the present invention.

[0175] Referring to Figure 13 in (a), the lower surface 112″ [second surface] of the mask metal film 110″ manufactured by a rolling process can be bonded to the support substrate 40 using the bonding portion 41. The bonding portion 41 has the same material as the temporary bonding portion 55 or has a predetermined adhesive force, and any material that can be separated subsequently can be used.

[0176] After bonding the mask metal film 110″ to the support substrate 40, planarization PS1 can be performed on the upper surface 111″ [first surface]. At this time, planarization PS1 and PS2 refer to mirror-polishing one surface of the mask metal film 110′ while removing a part of the mask metal film 110′ to make the thickness thinner. Planarization PS1 and PS2 can be performed by methods such as chemical wet etching or dry etching.

[0177] Based on the thickness of the mask metal film 110″, when the upper surface is 0% and the lower surface is 100%, the central portion 115″ can use at least a part of the thickness portion from 10% to 90%. If planarization PS1 and PS2 are performed in almost the same thickness range, the thickness reduction of the upper surface 111″ by the planarization PS1 process can be about 5% to 45% of the thickness of the entire mask metal film 110″. However, it is not necessarily limited to this. If, based on the thickness of the mask metal film 110″, the central portion 115″ uses at least a part of the thickness portion from 10% to 90%, the thickness reduction degree in each of the planarization PS1 and PS2 processes can be changed.

[0178] After performing the planarization PS1 process, the upper layer portion 117″ can be removed from the mask metal film 110″.

[0179] Then, referring to Figure 13In (b) thereof, prepare another support substrate 45, and the upper surface 111″ [the first surface] of the mask metal film 110' can be bonded to the support substrate 45 using the bonding portion 46. The support substrate 45 and the bonding portion 46 can be the same as the support substrate 40 and the bonding portion 41.

[0180] Then, referring to Figure 13 In (c) thereof, after bonding the mask metal film 110' to the support substrate 40, the support substrate 40 can be separated. Then, planarization PS2 can be performed on the second surface 112″. After performing the planarization PS2 process, the lower layer portion 119″ can be removed from the mask metal film 110″.

[0181] In Figure 13 In (b) and (c) thereof, the support substrate 45 can correspond to the above-mentioned template 50, and the bonding portion 45 can correspond to the above-mentioned temporary bonding portion 55. In this case, as in Figure 10 step (b) thereof, Figure 13 step (b) thereof can be replaced by the step of bonding the mask metal film 110″ to the template 50 formed with the temporary bonding portion 55, Figure 13 the planarization PS2 in step (c) thereof can be replaced by Figure 10 the planarization PS in step (b) thereof.

[0182] Then, referring to Figure 13 In (d) thereof, when the planarization PS2 is completed, the manufacturing of the mask metal film 110 can be completed. The mask metal film 110 includes a central portion 115″, and the thickness of the mask metal film 110 is about 5 μm to 20 μm.

[0183] In addition, Figure 12 and Figure 13 although it is assumed in Figure 13 that the mask metal film 110 is manufactured by a rolling process, even for a mask metal film manufactured by other processes such as electroforming, there are still differences in the characteristics of the grains between the surface portion and the central portion, so the planarization PS1 and PS2 processes as shown in

[0184] Figure 14 is a schematic diagram showing the process of loading a mask support template onto a frame according to an embodiment of the present invention.

[0185] Referring to Figure 14 , the template 50 can be transferred by the vacuum chuck 90. The opposite surface of the template 50 to which the mask 100 is bonded can be adsorbed by the vacuum chuck 90 and transferred. The vacuum chuck 90 can be connected to a moving means (not shown) that moves in the x, y, z, and θ axes. Moreover, the vacuum chuck 90 can be connected to a flipping means (not shown) that flips (flips) after adsorbing the template 50. As in Figure 14As shown in (b) thereof, even during the process of being transferred to the frame 200 after being flipped in the state where the vacuum chuck 90 adsorbs the template 50, the bonding state and alignment state of the mask 100 will not be affected.

[0186] Figure 15 FIG. is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention so that a mask corresponds to a unit area of the frame. Figure 15 Although an example of corresponding / attaching one mask 100 to the unit area CR is shown, a process of simultaneously corresponding a plurality of masks 100 to respective unit areas CR and attaching the masks 100 to the frame 200 can also be performed. At this time, a plurality of templates 50 for separately supporting the plurality of masks 100 may be provided.

[0187] Then, referring to Figure 15 , the mask 100 can be corresponded to one mask unit area CR of the frame 200. By loading the template 50 onto the frame 200 [or the mask unit sheet portion 220] so that the mask 100 corresponds to the mask unit area CR. While controlling the position of the template 50 / vacuum chuck 90, it can be observed through a microscope whether the mask 100 corresponds to the mask unit area CR. Since the template 50 presses the mask 100, the mask 100 can be in close contact with the frame 200.

[0188] On the other hand, a lower support 70 may be further disposed below the frame 200. The lower support 70 has a size that can enter the inside of the hollow region R of the frame edge portion 210 and has a flat shape. Moreover, a predetermined support groove (not shown) corresponding to the shape of the mask unit sheet portion 220 may also be formed on the upper surface of the lower support 70. At this time, the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are inserted into the support groove, so that the mask unit sheet portion 220 is better fixed.

[0189] The lower support 70 can press the opposite surface of the mask unit area CR in contact with the mask 100. That is, the lower support 70 supports the mask unit sheet portion 220 upward, so that the mask unit sheet portion 220 can be prevented from sagging downward during the attachment process of the mask 100. At the same time, the lower support 70 and the template 50 press the edge portion of the mask 100 and the frame 200 [or the mask unit sheet portion 220] in opposite directions, so that the alignment state of the mask 100 is not damaged and the alignment is maintained.

[0190] In this way, only by attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200, the process of corresponding the mask 100 to the mask unit area CR of the frame 200 can be completed, and no tensile force is applied to the mask 100 during this process.

[0191] Next, a laser L is irradiated onto the mask 100 so that the mask 100 is attached to the frame 200 by laser welding. Weld beads WB are generated in the welded portion of the laser-welded mask, and the weld beads WB may have the same material as the mask 100 / frame 200 and are integrally connected to the mask 100 / frame 200. At this time, the welded portion of the mask 100 irradiated by the laser L [or a part of the dummy portion DM] is formed thicker than the mask unit C, so a sufficient amount of the welded portion is melted to form the welding weld beads WB, and stable welding can be performed.

[0192] Figure 16 FIG. is a schematic view showing a process of separating the mask 100 from the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

[0193] Refer to Figure 16 , after attaching the mask 100 to the frame 200, the mask 100 and the template 50 can be debonded. The separation of the mask 100 and the template 50 can be performed by heating ET, chemical treatment CM, applying ultrasonic waves US, applying ultraviolet rays UV, or at least one of them to the temporary adhesive portion 55. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. As an example, if heat ET higher than 85°C - 100°C is applied, the viscosity of the temporary adhesive portion 55 decreases, and the adhesive force between the mask 100 and the template 50 becomes weak, so that the mask 100 and the template 50 can be separated. As another example, the temporary adhesive portion 55 is immersed CM in chemical substances such as IPA, acetone, and ethanol, and the mask 100 and the template 50 are separated by dissolving and removing the temporary adhesive portion 55. As still another example, if ultrasonic waves US or ultraviolet rays UV are applied, the adhesive force between the mask 100 and the template 50 becomes weak, so that the mask 100 and the template 50 can be separated.

[0194] Figure 17 FIG. is a schematic view showing a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention.

[0195] Refer to Figure 17 , one mask 100 can be attached to one unit area CR of the frame 200.

[0196] Since the thickness of the mask unit sheet portion 220 of the frame 200 is thin, if the mask 100 is attached to the mask unit sheet portion 220 in a state where a tensile force is applied, the tensile force remaining in the mask 100 will act on the mask unit sheet portion 220 and the mask unit region CR, thus causing deformation. Therefore, the mask 100 should be attached to the mask unit sheet portion 220 without applying a tensile force to the mask 100. In the present invention, the process of corresponding the mask 100 to the mask unit region CR of the frame 200 can be completed only by attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200, and no tensile force is applied to the mask 100 during this process. Thereby, it is possible to prevent the tensile force applied to the mask 100 from acting on the frame 200 as a tension in the reverse direction, resulting in deformation of the frame 200 (or the mask unit sheet portion 220).

[0197] Existing Figure 1 The existing mask 10 includes 6 units C1 - C6 and has a longer length, while the mask 100 of the present invention includes a single unit C and has a shorter length. Therefore, the degree of PPA distortion will be smaller. For example, assuming that the length of the mask 10 including multiple units C1 - C6,... is 1 m, and a PPA error of 10 μm occurs in the total length of 1 m, the mask 100 of the present invention can change the above error range to 1 / n as the relative length decreases (equivalent to a decrease in the number of units C). For example, if the length of the mask 100 of the present invention is 100 mm, the length is reduced from 1 m of the existing mask 10 to 1 / 10. Therefore, a PPA error of 1 μm occurs in the total length of 100 mm, having the effect of significantly reducing the alignment error.

[0198] In addition, if the mask 100 has multiple units C and even if the correspondence between each unit C and each unit region CR of the frame 200 is still within the range of minimizing the alignment error, the mask 100 can also correspond to multiple mask unit regions CR of the frame 200. Alternatively, the mask 100 having multiple units C can also correspond to a single mask unit region CR. At this time, considering the process time and productivity based on alignment, the mask 100 preferably has as few units C as possible.

[0199] In the present invention, since it is only necessary to confirm the alignment state after corresponding a single unit C of the mask 100, compared with the existing method of corresponding multiple units C (C1 - C6) simultaneously and requiring confirmation of the alignment state of all of them [refer to Figure 2 , the manufacturing time can be significantly shortened.

[0200] That is, compared with the conventional method of simultaneously matching six cells C1 - C6 and simultaneously confirming the alignment status of the six cells C1 - C6, the manufacturing method of the frame - integrated mask of the present invention can significantly shorten the time through six processes of respectively corresponding each of the cells C11 - C16 included in the six masks 100 to one cell region CR11 - CR16 and confirming each alignment status.

[0201] In addition, in the manufacturing method of the frame - integrated mask of the present invention, the product yield of the 30 - time process of respectively corresponding 30 masks 100 to 30 cell regions CR (CR11 - CR56) and aligning them will be significantly higher than the product yield of the existing product of the 5 - time process of corresponding and aligning five masks 10 (refer to Figure 2 (a)) each including six cells C1 - C6 to the frame 200. Since the existing method of aligning six cells C1 - C6 in the region corresponding to six cells C each time is significantly cumbersome and difficult to operate, the product yield is low.

[0202] In addition, in Figure 10 (b) as described above, when the mask metal film 110 is bonded to the template 50 through a lamination process, a temperature of about 100 °C is applied to the mask metal film 110. Based on this, the mask metal film 110 is bonded to the template 50 in a state where a partial tensile force is applied. Then, when the mask 100 is attached to the frame 200, if the mask 100 is separated from the template 50, the mask 100 will shrink by a predetermined degree.

[0203] If the template 50 is separated from the mask 100 after each mask 100 is respectively attached to its corresponding mask cell region CR, the multiple masks 100 apply contraction tensions in opposite directions, so this force is offset, and thus the mask unit sheet part 220 will not be deformed. For example, in the first grid sheet part 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region, the tension acting in the right - hand direction on the mask 100 attached to the CR11 cell region and the tension acting in the left - hand direction on the mask 100 attached to the CR12 cell region are mutually offset. Thus, the deformation of the frame 200 [or the mask unit sheet part 220] caused by the tension is minimized, and thus the alignment error of the mask 100 [or the mask pattern P] can be minimized to the greatest extent.

[0204] Figure 18 FIG. 17 is a schematic diagram of an OLED pixel deposition apparatus 1000 using frame - integrated masks 100 and 200 according to an embodiment of the present invention.

[0205] Refer to Figure 18, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 that houses a magnet 310 and is configured with a cooling water pipe 350; a deposition source supply unit 500 that supplies an organic material source 600 from below the magnetic plate 300.

[0206] A target substrate 900 such as glass for depositing the organic material source 600 may be inserted between the magnetic plate 300 and the deposition source supply unit 500. On the target substrate 900, frame-integrated masks 100, 200 [or FMM] for depositing the organic material source 600 on different pixels may be arranged in close contact or very close proximity. The magnet 310 can generate a magnetic field and be attached to the target substrate 900 through the magnetic field.

[0207] The deposition source supply unit 500 may move back and forth along a left-right path and supply the organic material source 600. The organic material source 600 supplied by the deposition source supply unit 500 may be deposited on one side of the target substrate 900 after passing through the pattern P formed in the frame-integrated masks 100, 200. The organic material source 600 deposited after passing through the pattern P of the frame-integrated masks 100, 200 may be used as the pixel 700 of the OLED.

[0208] To prevent uneven deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100, 200 may be formed obliquely S [or formed in a conical shape S]. The organic material source 600 passing through the pattern in the diagonal direction along the inclined surface contributes to the formation of the pixel 700, so that the pixel 700 can be deposited with a uniform thickness overall.

[0209] As described above, the present invention has been described with reference to the preferred embodiments with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains may make various deformations and changes without departing from the spirit of the present invention. The deformation examples and change examples should be regarded as all belonging to the scope of the present invention and the appended claims.

Claims

1. A manufacturing method of a mask support template, which is used to bond and support a mask for forming OLED pixels and transfer it to a frame, and after attaching the mask to the frame correspondingly, the template is separated from the mask. Among them, This method includes the following steps: (a) Prepare a mask metal film; (b) Bond the mask metal film to a template with a temporary bonding part formed on one side; (c) Reduce the thickness of the mask metal film bonded to the template; and (d) Manufacture a mask by forming a mask pattern on the mask metal film. The step (d) includes the following steps: (d1) Form a patterned insulating part on the mask metal film; (d2) Form a mask pattern by etching the part of the mask metal film exposed between the insulating parts; and (d3) Remove the insulating part.

2. The manufacturing method of the mask support template as described in claim 1, Among them, In step (a), prepare a mask metal film and reduce at least a part of the thickness from the first side of the mask metal film. In step (b), bond the first side of the mask metal film to the template. In step (c), reduce at least a part of the thickness from the second side opposite to the first side of the mask metal film.

3. The manufacturing method of the mask support template as described in claim 1, Among them, The temporary bonding part is an adhesive or adhesive sheet that can be separated based on heating, or an adhesive or adhesive sheet that can be separated based on ultraviolet irradiation.

4. The manufacturing method of the mask support template as described in claim 1, Among them, The thickness reduction of the mask metal film is carried out by any one of chemical mechanical polishing, chemical wet etching, and dry etching.

5. The manufacturing method of the mask support template as described in claim 4, Among them, When using the chemical mechanical polishing method to reduce the thickness of the mask metal film, the surface roughness on one side of the mask metal film is reduced.

6. The manufacturing method of the mask support template as described in claim 4, Among them, When using chemical wet etching or dry etching to reduce the thickness of the mask metal film, polishing is further carried out in subsequent steps to reduce the surface roughness of one side of the mask metal film.

7. The manufacturing method of the mask support template as described in claim 1, Among them, Reduce the thickness of the mask metal film to 5 μm to 20 μm.

8. The manufacturing method of the mask support template as described in claim 2, Among them, Based on the thickness of the mask metal film, when the first side is 0% and the second side is 100%, the mask uses at least a part of the part equivalent to 10% to 90% of the thickness of the mask metal film.

9. A manufacturing method of a mask support template, which is used to bond and support a mask for forming OLED pixels and transfer it to a frame, and after attaching the mask to the frame correspondingly, the template is separated from the mask. Among them, This method includes the following steps: (a) Prepare a mask metal film; (b) Reduce at least a part of the thickness from the first side of the mask metal film and the second side opposite to the first side; (c) Bond the mask metal film to a template with a temporary bonding part formed on one side; and (d) Manufacture a mask by forming a mask pattern on the mask metal film. The step (d) includes the following steps: (d1)Form a patterned insulating portion on the mask metal film; (d2)Form a mask pattern by etching the portion of the mask metal film exposed between the insulating portions; and (d3)Remove the insulating portion.

10. The method for manufacturing a mask support template according to claim 9, wherein Based on the thickness of the mask metal film, when the first surface is 0% and the second surface is 100%, the mask uses at least a part of the portion equivalent to 10% to 90% of the thickness of the mask metal film.

11. A mask support template for adhering to and supporting a mask for forming OLED pixels and transferring it to a frame, after attaching the mask corresponding to the frame, separating the template from the mask, wherein The mask support template includes: A template; A temporary adhesion portion formed on the template; and A mask adhered to the template by sandwiching the temporary adhesion portion and having a mask pattern formed thereon, The thickness of the mask is 5 μm to 20 μm, The temporary adhesion portion is formed on the entire surface of one surface of the template, and the mask metal film is adhered to the entire surface of the temporary adhesion portion. The temporary adhesion portion is a heat-separable adhesive or adhesive sheet, or an ultraviolet-ray-irradiation-separable adhesive or adhesive sheet, By controlling the position of the template to make the mask correspond to the frame, after the mask is attached to the frame, by applying heat or ultraviolet rays to the temporary adhesion portion of the template, the adhesive force of the temporary adhesion portion between the template and the mask is weakened, so as to separate the template from the mask attached to the frame.

12. The mask support template according to claim 11, wherein The mask includes a central portion formed by reducing at least a part of the thickness from the upper surface and the lower surface of the mask metal film manufactured by a rolling process.

13. The mask support template according to claim 11, wherein Based on the thickness of the mask metal film, when the upper surface is 0% and the lower surface is 100%, the mask uses at least a part of the portion equivalent to 10% to 90% of the thickness of the mask metal film.

14. The mask support template according to claim 11, wherein Laser through holes are formed in the edge portion of the template corresponding to the welding portion of the mask.

15. The mask support template according to claim 11, wherein The material of the template includes any one of a wafer, glass, silicon dioxide, heat-resistant glass, quartz, alumina, and borosilicate glass.

16. A method for manufacturing a frame-integrated mask, the frame-integrated mask being formed by integrating at least one mask and a frame for supporting the mask, wherein The method includes the following steps: (a) Load a mask support template manufactured by the method for manufacturing a mask support template according to claim 1 or 9 onto a frame having at least one mask unit area, and make the mask correspond to the mask unit area of the frame; and (b) Attach the mask to the frame.

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