Electronic device

Abstract

An electronic device is provided. The electronic device includes: a display panel including a display area and a non-display area adjacent to the display area; an input sensor stacked with a first area of the display area; and an antenna stacked with a second area of the display area. The input sensor includes a first sensing layer including a bridge pattern and a second sensing layer including sensor electrodes and disposed on a layer different from the first sensing layer. The bridge pattern connects two adjacent sensor electrodes. The antenna includes a first antenna layer and a second antenna layer. The first antenna layer includes a first antenna having a first frequency band, and the first antenna layer and the first sensing layer are disposed on the same layer. The second antenna layer includes a second antenna having a second frequency band different from the first frequency band. The second antenna layer and the second sensing layer are disposed on the same layer.

Description

[0001] This patent application claims priority to Korean Patent Application No. 10-2019-0140246, filed on Nov. 5, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The inventive concept relates to an electronic device, and more particularly, to an electronic device having an antenna. Background Art

[0003] An electronic device may include an electronic module. For example, the electronic device may be a portable terminal or a wearable device, and the electronic module may include an antenna module, a camera module, or a battery module. As portable terminals become thinner and wearable devices become smaller, the space in which the electronic modules are installed is gradually reduced. In addition, as electronic devices become highly functional and have more advanced specifications, the number of electronic modules included in the electronic device is increasing. Summary of the Invention

[0004] The present disclosure provides an electronic device having improved antenna efficiency by providing a first antenna and a second antenna that provide different frequency bands on an upper layer and a lower layer in a display area, respectively.

[0005] According to an embodiment of the inventive concept, an electronic device includes: a display panel including a display area and a non-display area adjacent to the display area; an input sensor stacked with a first area of the display area; and an antenna stacked with a second area of the display area. The input sensor includes a first sensing layer including a bridge pattern and a second sensing layer including a plurality of sensor electrodes and disposed on a layer different from the first sensing layer. The bridge pattern is configured to connect two adjacent sensor electrodes among the plurality of sensor electrodes. The antenna includes a first antenna layer and a second antenna layer. The first antenna layer includes a first antenna having a first frequency band, and the first antenna layer and the first sensing layer are disposed on the same layer. The second antenna layer includes a second antenna having a second frequency band different from the first frequency band, and the second antenna layer and the second sensing layer are disposed on the same layer.

[0006] In an embodiment, the input sensor and the antenna further include a first insulating layer and a second insulating layer covering the bridge pattern and the first antenna layer. The first antenna layer and the bridge pattern are disposed on the first insulating layer. The second antenna layer and the plurality of sensor electrodes are disposed on the second insulating layer.

[0007] In an embodiment, the electronic device further includes a third insulating layer covering the plurality of sensor electrodes and the second antenna layer.

[0008] In an embodiment, the display panel includes a thin film encapsulation layer. The input sensor and the antenna are directly disposed on an upper surface of the thin film encapsulation layer.

[0009] In an embodiment, the first antenna layer includes a first metal layer, a second metal layer on the first metal layer, and a third metal layer on the second metal layer. The second antenna layer includes a fourth metal layer and a fifth metal layer on the fourth metal layer.

[0010] In an embodiment, each of the first metal layer and the third metal layer is a titanium layer. The second metal layer is an aluminum layer. Each of the fourth metal layer and the fifth metal layer is a titanium layer or an aluminum layer.

[0011] In an embodiment, the first frequency band is less than the second frequency band.

[0012] In an embodiment, the first antenna layer includes a plurality of first antennas. The second antenna layer includes a plurality of second antennas.

[0013] In an embodiment, each of the plurality of second antennas is stacked with a corresponding first antenna of the plurality of first antennas.

[0014] In an embodiment, each of the plurality of first antennas has an area larger than the area of the corresponding second antenna of the plurality of second antennas.

[0015] In an embodiment, the thickness of each of the plurality of second antennas is less than the thickness of the corresponding first antenna of the plurality of first antennas.

[0016] In an embodiment, the antenna further includes a plurality of transmission lines. Each of the plurality of transmission lines connects a corresponding first antenna of the plurality of first antennas and a corresponding second antenna of the plurality of second antennas.

[0017] In an embodiment, each of the first antenna and the second antenna includes a grid pattern.

[0018] In an embodiment, the display panel further includes a signal transmission region. In a plan view, a first region surrounds the signal transmission region. The second region is at least one of the upper left region and the upper right region of the display panel.

[0019] According to an embodiment of the inventive concept, an electronic device including a bent region and a non-bent region includes: a display panel including a display region having a first region overlapping with the non-bent region and a second region overlapping with the bent region, and a non-display region adjacent to the display region; an input sensor disposed on the display panel and overlapping with the first region; and an antenna disposed on the display panel and overlapping with the second region. The input sensor includes a first insulating layer directly disposed on an upper surface of the display panel, a first sensing layer disposed on the first insulating layer, a second insulating layer covering the first sensing layer, and a second sensing layer disposed on the second insulating layer and having a plurality of sensor electrodes. The antenna includes: a plurality of first antennas having a first frequency band, wherein the plurality of first antennas and the first sensing layer are disposed on the same layer; and a plurality of second antennas having a second frequency band. The plurality of second antennas and the second sensing layer are disposed on the same layer.

[0020] In an embodiment, the first frequency band is less than the second frequency band.

[0021] In an embodiment, each of the plurality of second antennas overlaps with a corresponding one of the plurality of first antennas.

[0022] In an embodiment, the input sensor includes: a plurality of first sensor electrodes spaced apart in a first direction; a plurality of first connection electrodes, each of the plurality of first connection electrodes being configured to connect two corresponding first sensor electrodes adjacent to each other among the plurality of first sensor electrodes; a plurality of second sensor electrodes spaced apart in a second direction; and a plurality of second connection electrodes, each of the plurality of second connection electrodes being configured to connect two corresponding second sensor electrodes adjacent to each other among the plurality of second sensor electrodes.

[0023] In an embodiment, the plurality of second connection electrodes are disposed on the first insulating layer. The second insulating layer is disposed on the plurality of second connection electrodes. The plurality of first sensor electrodes, the plurality of second sensor electrodes, and the plurality of first connection electrodes are disposed on the second insulating layer. Each of the plurality of first connection electrodes overlaps with a corresponding second connection electrode among the plurality of second connection electrodes.

[0024] In an embodiment, the electronic device further includes a third insulating layer covering the plurality of first sensor electrodes, the plurality of second sensor electrodes, the plurality of first connection electrodes, and the plurality of second antennas.

[0025] In an embodiment, each of the plurality of first antennas and each of the plurality of second antennas includes a mesh pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the inventive concept and, together with the description, are used to explain the principles of the inventive concept. In the accompanying drawings:

[0027] Figure 1 is a perspective view of an electronic device according to an embodiment of the inventive concept;

[0028] Figures 2A to 2D is a cross-sectional view of an electronic device according to an embodiment of the inventive concept;

[0029] Figure 3A and Figure 3B is a cross-sectional view of a display panel according to an embodiment of the inventive concept;

[0030] Figure 4 is a plan view of a display panel according to an embodiment of the inventive concept;

[0031] Figure 5A is an enlarged cross-sectional view of a display panel according to an embodiment of the inventive concept;

[0032] Figure 5B is an enlarged cross-sectional view of an upper insulating layer according to an embodiment of the inventive concept;

[0033] Figure 6A is a cross-sectional view of an electronic device according to an embodiment of the inventive concept;

[0034] Figure 6B is a cross-sectional view of an input sensor and an antenna according to an embodiment of the inventive concept;

[0035] Figure 7 is a plan view of an input sensor and an antenna according to an embodiment of the inventive concept;

[0036] Figure 8 is a cross-sectional view of an input sensor according to an embodiment of the inventive concept;

[0037] Figure 9 is a cross-sectional view of an antenna according to an embodiment of the inventive concept;

[0038] Figure 10 is a cross-sectional view of an antenna according to an embodiment of the inventive concept;

[0039] Figure 11 is a cross-sectional view of an antenna according to an embodiment of the inventive concept;

[0040] Figure 12 is a plan view of an input sensor and an antenna according to an embodiment of the inventive concept;

[0041] Figure 13is a perspective view of an electronic device according to another embodiment of the inventive concept;

[0042] Figure 14 is a cross-sectional view of a surface taken along line I-I' of; Figure 13 ; and

[0043] Figure 15 is a perspective view of an input sensor and an antenna according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0044] In the present disclosure, when an element (or region, layer, part, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, it means that the element can be disposed directly on / directly connected to / directly coupled to the other element, or a third element can be disposed between the element and the other element.

[0045] Like reference numerals refer to like elements. Additionally, in the drawings, the thickness, ratios, and dimensions of elements may be exaggerated for effective description of the technical content. The term "and / or" includes all combinations of one or more of the associated components that can be defined.

[0046] It will be understood that although terms such as "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of exemplary embodiments of the inventive concept, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, singular forms of terms may include plural forms.

[0047] Furthermore, terms such as "under", "below", "above", "on", etc. are used to describe the relationship of components shown in the drawings. The terms are used as relative concepts and are described with reference to the directions indicated in the drawings.

[0048] It should be understood that the term "comprising" or "having" is intended to specify the presence of the stated features, integers, steps, operations, elements, components, or combinations thereof in the disclosure, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0049] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will also be understood that terms defined in a general dictionary should be interpreted as having a meaning consistent with the meaning in the context of the prior art, and are not explicitly defined herein unless they are interpreted in an idealized sense or an overly formal sense.

[0050] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0051] Figure 1 is a perspective view of an electronic device ED according to an embodiment of the inventive concept. As Figure 1 shown, the electronic device ED may display an image IM through a display surface ED-IS. The display surface ED-IS is parallel to a plane defined by a first direction axis DR1 and a second direction axis DR2. A normal direction of the display surface ED-IS (e.g., a thickness direction of the electronic device ED) is indicated by a third direction axis DR3.

[0052] A front surface (or an upper surface) and a rear surface (or a lower surface) of each component or unit to be described hereinafter are distinguished by the third direction axis DR3. However, the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 shown in the present embodiment are merely exemplary. Hereinafter, the first direction to the third direction are directions respectively indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, and are given the same reference numerals.

[0053] In an embodiment of the inventive concept, an electronic device ED provided with a planar display surface is shown. However, the inventive concept is not limited thereto. In an embodiment, the electronic device ED may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display regions that emit images in different directions, and may include, for example, a polygonal columnar display surface.

[0054] The electronic device ED according to the present embodiment may be a rigid display device. However, the inventive concept is not limited thereto. In an embodiment, the electronic device ED may be a flexible electronic device ED. In the present embodiment, an electronic device ED applicable to a cellular phone terminal is exemplarily shown. Although not shown, an electronic module, a camera module, a power module, etc. mounted on a main board may be provided together with the electronic device ED in a bracket / case, etc. to construct a cellular phone terminal. The electronic device ED according to the inventive concept may be applied to large electronic devices such as televisions and monitors, and small and medium-sized electronic devices such as tablet computers, car navigation system units, game consoles, and smart phones.

[0055] As Figure 1 shown, the display surface ED-IS includes an image area ED-DA on which the image IM is displayed and a border area ED-NDA adjacent to the image area ED-DA. The border area ED-NDA is an area on which the image IM is not displayed. In an embodiment, the image area ED-DA of the display surface ED-IS may correspond to a display area, and the display area may include a first area ED-DA1 and a second area ED-DA2. In Figure 1In, for example, the first region ED-DA1 may be present at the center, and the second region ED-DA2 may be present on both sides. The inventive concept is not limited thereto. In an embodiment, the display surface ED-IS may be a borderless display surface without a border region ED-NDA.

[0056] In Figure 1 an icon image is shown as an example of the image IM.

[0057] As Figure 1 shown in, the image region ED-DA may have a quadrilateral shape. The border region ED-NDA may surround the image region ED-DA. However, embodiments of the inventive concept are not limited thereto. The shape of the image region ED-DA and the shape of the border region ED-NDA may have various shapes.

[0058] Figures 2A to 2D is a cross-sectional view of an electronic device ED according to an embodiment of the inventive concept. Figures 2A to 2D A cross-section taken along the second direction axis DR2 and the third direction axis DR3 is shown. Figures 2A to 2D The stacking relationship of the functional panels and / or functional units constituting the electronic device ED is described.

[0059] An electronic device ED according to an embodiment of the inventive concept may include a display panel, an input sensor, an antireflection unit, and a window. At least some of the components among the display panel, the input sensor, the antireflection unit, and the window may be formed in a series of processes, or at least some of them may be bonded to each other through a bonding member. In Figures 2A to 2D an optically clear adhesive OCA is exemplarily shown as the bonding member. The bonding members described below may include typical adhesives or pressure-sensitive adhesives. In an embodiment of the inventive concept, the antireflection unit and the window may be replaced by other components or may be omitted.

[0060] In Figures 2A to 2D among the input sensor, the antireflection unit, and the window, the corresponding component formed in a series of processes with another component is denoted as a "layer". Among the input sensor, the antireflection unit, and the window, the component bonded to another component through a bonding member is denoted as a "panel". The panel includes a substrate layer (such as a resin film, a composite film, a glass substrate, etc.) providing a substrate surface, but the "layer" may not include the substrate layer. In other words, the unit denoted as a "layer" is disposed on the substrate surface provided by other units.

[0061] Depending on the presence of the substrate layer, the input sensor, the antireflection unit, and the window may be referred to as an input sensing panel ISP, an antireflection panel RPP, and a window panel WP, or an input sensing layer ISL, an antireflection layer RPL, and a window layer WL.

[0062] AsFigure 2A As shown in Figure 2A , the electronic device ED may include a display panel DP, an input sensing layer ISL, an anti-reflection panel RPP, and a window panel WP. The input sensing layer ISL is directly disposed on the display panel DP. In the present disclosure, "component B is directly disposed on component A" means that no separate adhesive layer / adhesive member is disposed between component A and component B. After forming component A, component B may be integrally formed on the substrate surface provided by component A through a series of processes.

[0063] The display module DM may include a display panel DP and an input sensing layer ISL. The input sensing layer ISL may be directly disposed on the display panel DP. An optically clear adhesive OCA is disposed between the display module DM and the anti-reflection panel RPP and between the anti-reflection panel RPP and the window panel WP. The present invention is not limited thereto. In an embodiment, the anti-reflection panel RPP may be integrally formed on the input sensing layer ISL. In an embodiment, the window panel WP may be integrally formed on the anti-reflection panel RPP.

[0064] The display panel DP may generate an image, and the input sensing layer ISL may obtain coordinate information of an external input (e.g., a touch event). Although not shown separately, the display module DM according to an embodiment of the inventive concept may further include a protection member disposed on the lower surface of the display panel DP. The protection member and the display panel DP may be coupled to each other through an adhesive member. Each of the Figures 2B to 2D electronic devices ED to be described below may also include a protection member. The present invention is not limited thereto. In an embodiment, the display panel DP may be integrally formed on the protection member.

[0065] The display panel DP according to an embodiment of the inventive concept may be a light-emitting display panel, but the inventive concept is not limited thereto. In an embodiment, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The emission layer of the organic light-emitting display panel may include an organic light-emitting material. The emission layer of the quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, for ease of description, the display panel DP will be described as an organic light-emitting display panel.

[0066] The antireflection panel RPP can reduce the reflectivity of external light incident from the upper side of the window panel WP. The antireflection panel RPP according to an embodiment of the inventive concept may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type polarizer may include a stretchable synthetic resin film, and the liquid crystal coating type polarizer may include liquid crystals arranged in a predetermined arrangement. Both the phase retarder and the polarizer may further include a protective film. The phase retarder and the polarizer themselves or the protective film may be defined as the base layer of the antireflection panel RPP.

[0067] The antireflection panel RPP according to an embodiment of the inventive concept may include a color filter. The color filter has a predetermined arrangement. The arrangement of the color filter may be determined in consideration of the emission color of pixels included in the display panel DP. The antireflection panel RPP may further include a black matrix adjacent to the color filter.

[0068] The antireflection panel RPP according to an embodiment of the inventive concept may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light respectively reflected from the first reflective layer and the second reflective layer may interfere with each other destructively, and thus, the reflectivity of external light may be reduced.

[0069] The window panel WP according to an embodiment of the inventive concept may include a base layer WP-BS and a light blocking pattern WP-BZ. The base layer WP-BS may include a glass substrate and / or a synthetic resin film, etc. The base layer WP-BS is not limited to a single layer. The base layer WP-BS may include two or more films bonded with an adhesive member.

[0070] The light blocking pattern WP-BZ partially overlaps with the base layer WP-BS. For example, the light blocking pattern WP-BZ is disposed on the rear surface of the base layer WP-BS and is disposed in the light blocking region WP-NT of the base layer WP-BS. The light blocking region WP-NT may be disposed in the border region ED-NDA of the electronic device ED. The other region of the base layer WP-BS where the light blocking pattern WP-BZ is not disposed is defined as the transmission region WP-T of the window panel WP. The transmission region WP-T may be disposed in the image region ED-DA.

[0071] The light blocking pattern WP-BZ may be a colored organic film pattern, and may be formed, for example, by a coating method. Although not shown separately, the window panel WP may further include a functional coating layer disposed on the front surface of the base layer WP-BS. The functional coating layer may include an anti-fingerprint layer, an antireflection layer, a hard coating layer, etc. In Figures 2B to 2D, the window panel WP and the window layer WL are shown, but the base layer WP-BS and the light blocking pattern WP-BZ are not shown.

[0072] like Figure 2B and Figure 2C As shown in FIG. 1 , the electronic device ED may include a display panel DP, an input sensing panel ISP, an anti-reflection panel RPP, and a window panel WP. The stacking order of the input sensing panel ISP and the anti-reflection panel RPP may be subject to change.

[0073] like Figure 2D As shown in , the electronic device ED may include a display panel DP, an input sensing layer ISL, an anti-reflection layer RPL, and a window layer WL. The bonding member may be omitted from the electronic device ED, and the input sensing layer ISL, the anti-reflection layer RPL, and the window layer WL may be integrally formed on a substrate surface provided in the display panel DP in a series of processes. The stacking order of the input sensing layer ISL and the anti-reflection layer RPL may be subject to change.

[0074] Figure 3A and Figure 3B is a cross-sectional view of a display panel DP according to an embodiment of the inventive concept.

[0075] like Figure 3A As shown in FIG. 1 , the display panel DP includes a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-DEL, and an upper insulating layer TFL. Figure 1 The display area DP-DA and the non-display area DP-NDA corresponding to the image area ED-DA and the frame area ED-NDA shown in the figure may be defined in the display panel DP. Figure 1 The first area ED-DA1 and the second area ED-DA2 shown in the figure may correspond to the first area DP-DA1 and the second area DP-DA2 defined in the display panel DP, respectively. In this embodiment, when an area corresponds to another area, it means that the areas overlap each other, and the areas are not limited to have the same area.

[0076] The base layer BL may include at least one plastic film. The base layer BL may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate.

[0077] The circuit element layer DP-CL includes at least one intermediate insulating layer and a circuit element. The intermediate insulating layer may include at least one intermediate inorganic film and at least one intermediate organic film. The circuit element may include a signal line, a driving circuit of a pixel, etc. The following is a detailed description thereof.

[0078] The display element layer DP-DEL may include at least organic light-emitting diodes. The display element layer DP-DEL may include an organic film such as a pixel defining film.

[0079] The upper insulating layer TFL may include a plurality of thin films. Some of the thin films of the upper insulating layer TFL may improve optical efficiency, and some of its thin films may be used to protect the organic light-emitting diodes. A detailed description of the upper insulating layer TFL will be given below.

[0080] As Figure 3B shown, the display panel DP includes a substrate layer BL, a circuit element layer DP-CL disposed on the substrate layer BL, a display element layer DP-DEL, a package substrate ES, and a sealant SM for bonding the substrate layer BL to the package substrate ES. The package substrate ES may be spaced apart from the display element layer DP-DEL, with a predetermined gap GP between the display element layer DP-DEL and the package substrate ES. The substrate layer BL and the package substrate ES may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate. The sealant SM may include an organic bonding member or a glass frit, etc.

[0081] Figure 4 is a plan view of the display panel DP according to an embodiment of the inventive concept. Figure 5A is an enlarged cross-sectional view of the display panel DP according to an embodiment of the inventive concept. Figure 5B is an enlarged cross-sectional view of the upper insulating layer TFL according to an embodiment of the inventive concept. Based on Figure 3A the display panel DP shows Figure 5A the display panel DP.

[0082] As Figure 4 shown, the display panel DP includes a driving circuit GDC, a plurality of signal lines SGL (hereinafter, signal lines), a plurality of signal pads (also referred to as "pads" or "bonding pads") DP-PD (hereinafter, signal pads), and a plurality of pixels PX (hereinafter, pixels).

[0083] The display area DP-DA may be defined as an area in which the pixels PX are disposed. Each of the pixels PX includes an organic light-emitting diode and a pixel driving circuit connected thereto. The driving circuit GDC, the signal lines SGL, the signal pads DP-PD, and the pixel driving circuit may be included in Figure 3A and Figure 3B the circuit element layer DP-CL shown.

[0084] The driving circuit GDC may include a scan driving circuit. The scan driving circuit may generate a plurality of scan signals (hereinafter, scan signals), and sequentially output the scan signals to a plurality of scan lines GL (hereinafter, scan lines) which will be described later. The scan driving circuit may also output another control signal to the driving circuit of the pixel PX.

[0085] The scan driving circuit may include a plurality of thin film transistors formed by the same process as that of the driving circuit of the pixel PX (for example, a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process).

[0086] The signal lines SGL include scan lines GL, data lines DL, power supply lines PL, and control signal lines CSL. Each of the scan lines GL is connected to a corresponding one of the plurality of pixels PX, and each of the data lines DL is connected to a corresponding one of the plurality of pixels PX. The power supply line PL is connected to the pixel PX. The control signal line CSL may provide a control signal to the scan driving circuit.

[0087] The signal lines SGL overlap with the display area DP-DA and the non-display area DP-NDA. The signal lines SGL may include a pad portion and a line portion. The line portion may overlap with the display area DP-DA and the non-display area DP-NDA. The pad portion may be connected to an end of the line portion. The pad portion may be disposed in the non-display area DP-NDA and overlap with a corresponding one of the signal pads DP-PD. The area of the non-display area DP-NDA in which the signal pads DP-PD are provided may be defined as a pad area DP-PA. A circuit substrate (not shown) may be connected to the pad area DP-PA.

[0088] The line portion connected to the pixel PX may constitute most of the signal lines SGL. The line portion may be connected to the transistors T1 and T2 of the pixel PX (see Figure 5A ). The line portion may have a single-layer / multi-layer structure, and the line portion may be a single body, or may include two or more other portions. The two or more portions may be disposed on different layers, and may be connected to each other through contact holes passing through an insulating layer provided between the two or more portions.

[0089] Figure 5AA partial cross-section of the display panel DP is shown, which shows the transistors T1 and T2 and the light-emitting diode OLED formed in the display panel DP. The circuit element layer DP-CL disposed on the substrate layer BL may include at least one insulating layer and circuit elements. The circuit elements may include signal lines, driving circuits of pixels, etc. The circuit element layer DP-CL can be formed by a forming process such as coating and deposition of an insulating layer, a semiconductor layer, and a conductive layer, and a patterning process of an insulating layer, a semiconductor layer, and a conductive layer by a photolithography process.

[0090] In an embodiment, the circuit element layer DP-CL may include a buffer film BFL as an inorganic film, a first intermediate inorganic film 10, a second intermediate inorganic film 20, and an intermediate organic film 30. The buffer film BFL may include a plurality of inorganic films stacked. Figure 5A The arrangement relationships of all the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, the first control electrode GE1, the second control electrode GE2, the first input electrode DE1, the first output electrode SE1, the second input electrode DE2, and the second output electrode SE2 constituting the switching transistor T1 and the driving transistor T2 are exemplarily shown. The first through hole CH1 to the fourth through hole CH4 are also exemplarily shown.

[0091] The display element layer DP-DEL may include an organic light-emitting diode OLED. The display element layer DP-DEL includes a pixel defining film PDL. For example, the pixel defining film PDL may be an organic layer.

[0092] The first electrode AE is disposed on the intermediate organic film 30. The first electrode AE is connected to the second output electrode SE2 through a fifth through hole CH5 passing through the intermediate organic film 30. An opening OP is defined in the pixel defining film PDL. At least a part of the first electrode AE is exposed by the opening OP of the pixel defining film PDL. The opening OP of the pixel defining film PDL is called a light-emitting opening to distinguish it from other openings.

[0093] As Figure 5A shown, the display area DP-DA includes a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. In an embodiment, the light-emitting area PXA is defined as some areas corresponding to the first electrode AE exposed by the opening OP.

[0094] The hole control layer HCL can be commonly provided in both the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer HCL can include a hole transport layer and may also include a hole injection layer. The emission layer EML is provided on the hole control layer HCL. The emission layer EML is provided in a region corresponding to the opening OP. For example, the emission layer EML can be divided and formed in each of a plurality of pixels PX. The emission layer EML can include an organic material and / or an inorganic material. The emission layer EML can generate a predetermined colored light.

[0095] The electron control layer ECL is provided on the emission layer EML. The electron control layer ECL can include an electron transport layer and may also include an electron injection layer. The hole control layer HCL and the electron control layer ECL can be commonly formed in a plurality of pixels PX using an opening mask. The second electrode CE is provided on the electron control layer ECL. The second electrode CE has an integral shape and is commonly provided in a plurality of pixels PX.

[0096] As Figure 5A and Figure 5B shown, the upper insulating layer TFL is provided on the second electrode CE. The upper insulating layer TFL can include a plurality of thin films. In an embodiment, the upper insulating layer TFL includes a capping layer CPL and a thin film encapsulation layer TFE. The thin film encapsulation layer TFE includes a first inorganic layer IOL1, an organic layer IOL2, and a second inorganic layer IOL3.

[0097] The capping layer CPL is provided on the second electrode CE and contacts the second electrode CE. The capping layer CPL can include an organic material. The first inorganic layer IOL1 is provided on the capping layer CPL and contacts the capping layer CPL. The organic layer IOL2 is provided on the first inorganic layer IOL1 and contacts the first inorganic layer IOL1. The second inorganic layer IOL3 is provided on the organic layer IOL2 and contacts the organic layer IOL2.

[0098] The capping layer CPL can be used to protect the second electrode CE from subsequent processes (such as a sputtering process) and improve the light-emitting efficiency of the organic light-emitting diode OLED. The capping layer CPL can have a refractive index greater than that of the first inorganic layer IOL1.

[0099] The first inorganic layer IOL1 and the second inorganic layer IOL3 can be used to protect the display element layer DP-DEL from moisture / oxygen, and the organic layer IOL2 can be used to protect the display element layer DP-DEL from foreign substances such as dust particles. The first inorganic layer IOL1 and the second inorganic layer IOL3 can be any one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. In an embodiment, the first inorganic layer IOL1 and the second inorganic layer IOL3 can include a titanium oxide layer, an aluminum oxide layer, etc. The organic layer IOL2 can include an acrylic organic layer, but the inventive concept is not limited thereto.

[0100] In an embodiment of the inventive concept, an inorganic layer (e.g., a LiF layer) may be further provided between the cover layer CPL and the first inorganic layer IOL1. The LiF layer may improve the light-emitting efficiency of the light-emitting diode OLED.

[0101] Figure 6A is a cross-sectional view of an electronic device ED according to an embodiment of the inventive concept. Figure 6B is a cross-sectional view of an input sensor ISL and an antenna AL according to an embodiment of the inventive concept. For ease of description, a "layer"-type window (window layer) WL, an input sensor (input sensing layer) ISL, and an antenna AL are exemplarily shown.

[0102] In Figure 6A , the electronic device ED includes a display panel DP, an antenna AL, an input sensor ISL, and a window WL. In an embodiment, the electronic device ED includes a window WL on the display panel DP, and the antenna AL and the input sensor ISL may be disposed between the display panel DP and the window WL. Redundant descriptions of the display panel DP, the window WL, and the input sensor ISL will be omitted. Here, the antenna AL may transmit, receive, or transmit / receive wireless communication signals (e.g., radio frequency signals). The antenna AL may include a plurality of antenna elements, and the plurality of antenna elements may transmit, receive, or transmit / receive the same frequency band, or transmit, receive, or transmit / receive different frequency bands.

[0103] Figure 6A The display area DA, the first area DA1, and the second area DA2 in Figure 3A respectively correspond to the display area DP-DA, the first area DP-DA1, and the second area DP-DA2 of

[0104] In Figure 6BAmong them, the input sensor ISL and the antenna AL may each include a first insulating layer IL1, a first conductive layer CL1, a second insulating layer IL2, a second conductive layer CL2, and a third insulating layer IL3. The first insulating layer IL1 is directly disposed on the upper insulating layer TFL. In an embodiment of the inventive concept, the first insulating layer IL1 may be omitted.

[0105] Each of the first conductive layer CL1 and the second conductive layer CL2 may have a single-layer structure or a multilayer structure in which layers are stacked along the third direction axis DR3. The conductive layer of the multilayer structure may include at least one transparent conductive layer and at least one metal layer. The transparent conductive layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. For example, each of the first conductive layer CL1 and the second conductive layer CL2 may have a three-layer metal layer structure such as titanium / aluminum / titanium.

[0106] Each of the first insulating layer IL1 to the third insulating layer IL3 may include an inorganic material or an organic material. In an embodiment, each of the first insulating layer IL1 and the second insulating layer IL2 may be an inorganic film including an inorganic substance. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The third insulating layer IL3 may include an organic film. The organic film may include at least any one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and perylene resin. Refer to Figure 8 and Figure 9 for a more detailed description of the input sensor ISL and the antenna AL.

[0107] Figure 7 is a plan view of the input sensor ISL and the antenna AL according to an embodiment of the inventive concept.

[0108] As Figure 7 shown, the input sensor ISL includes a sensing region IS-DA1 and a wiring region IS-NDA that respectively correspond (or overlap) to a first region DP-DA1 (see Figure 3A ) of the display region DP-DA of the display panel DP and the non-display region DP-NDA. The antenna AL may include an antenna region IS-DA2 that corresponds (or overlaps) to a second region DP-DA2 (see Figure 3A ) of the display region DP-DA.

[0109] The input sensor ISL includes a plurality of first sensor units (e.g., first sensor electrodes) SP1, a plurality of second sensor units (i.e., second sensor electrodes) SP2, a plurality of first connection units (i.e., first connection electrodes) CP1, a plurality of second connection units (i.e., second connection electrodes) CP2, a plurality of sensing signal lines, a first pad unit PD1, and a second pad unit PD2. The antenna AL includes a plurality of first antenna elements AP1, a plurality of second antenna elements AP2, a third pad unit PD3, and a plurality of transmission lines.

[0110] The first sensor units SP1 and the second sensor units SP2 are disposed in the sensing area IS-DA1. The first antenna elements AP1 and the second antenna elements AP2 are disposed in the antenna area IS-DA2. The plurality of sensing signal lines, the plurality of transmission lines, the first pad unit PD1, the second pad unit PD2, and the third pad unit PD3 are disposed in the wiring area IS-NDA.

[0111] The first sensor units SP1 are arranged along a first direction DR1 and along a second direction DR2. Each of the first sensor units SP1 and the first connection units CP1 may have a grid pattern having a plurality of grid openings. Each of the first sensor units SP1 and each of the first connection units CP1 are alternately arranged in the second direction DR2. Each of the first connection units CP1 connects two adjacent first sensor units SP1 among the first sensor units SP1.

[0112] The second sensor units SP2 are arranged along a first direction DR1 and along a second direction DR2. Each of the second sensor units SP2 and the second connection units CP2 may have a grid pattern having a plurality of grid openings. Each of the second sensor units SP2 and each of the second connection units CP2 are alternately arranged in the first direction DR1. Each of the second connection units CP2 connects two adjacent second sensor units SP2 among the second sensor units SP2.

[0113] The first sensor units SP1 and the second sensor units SP2 may be electrostatically coupled. When a sensing signal is applied to the first sensor units SP1, a capacitor is formed between the first sensor units SP1 and the second sensor units SP2.

[0114] Refer to Figure 6B , the second connection unit CP2 according to an embodiment of the inventive concept may be included in a first conductive layer CL1 (see Figure 6B ), and may be connected to the second sensor units SP2 described with reference to Figure 7 . The first sensor units SP1, the second sensor units SP2, and the first connection units CP1 are included in a second conductive layer CL2 (see Figure 6B) and the first connection unit CP1 can be connected with reference to Figure 7 the first sensor unit SP1 described. However, the inventive concept is not limited thereto. The positions of the first conductive layer CL1 and the second conductive layer CL2 can be subject to change.

[0115] The plurality of sensing signal lines include first sensing signal lines SPL1a to SPL1d and second sensing signal lines SPL2a to SPL2e. One ends of the first sensing signal lines SPL1a to SPL1d are connected to the first sensor unit SP1, and the other ends of the first sensing signal lines SPL1a to SPL1d are respectively connected to pads included in the first pad unit PD1. The first sensing signal lines SPL1a to SPL1d can transmit the sensing signals that have been output from the first pad unit PD1 to the first sensor unit SP1.

[0116] One ends of the second sensing signal lines SPL2a to SPL2e are connected to the second sensor unit SP2. The other ends of the second sensing signal lines SPL2a to SPL2e are respectively connected to pads included in the second pad unit PD2. The second sensing signal lines SPL2a to SPL2e transmit the electrical signals that have been output from the second pad unit PD2 to the second sensor unit SP2.

[0117] Although not shown, the first sensing signal lines SPL1a to SPL1d and the second sensing signal lines SPL2a to SPL2e may also be arranged in a grid pattern.

[0118] The first antenna element AP1 and the second antenna element AP2 can be arranged in the second direction DR2. For ease of description, four first antenna elements AP1 and four second antenna elements AP2 are arranged in the second direction DR2. Each of the four second antenna elements AP2 is stacked with a corresponding one of the four first antenna elements AP1. However, the inventive concept is not limited thereto. The number of the first antenna elements AP1 and the number of the second antenna elements AP2 are not limited to Figure 7 and can be less than or greater than 4. In Figure 7 the antenna AL is only provided in the second region DA2 in one direction of the display region DA. However, the inventive concept is not limited thereto. The antenna AL can be provided in the second regions ED-DA2 existing on the left and right sides of the first region ED-DA1 (see Figure 1) Each of the first antenna element AP1 and the second antenna element AP2 can have a grid pattern. To allow the transmission of an image set in the image area ED-DA, each of the first antenna element AP1 and the second antenna element AP2 can have a grid pattern. The grid pattern can mean a structure in which a plurality of openings are defined in a predetermined layer. Optionally, the grid pattern can be referred to as a lattice structure. The first antenna element AP1 and the second antenna element AP2 can be modified in various shapes in the antenna area IS-DA2. In an embodiment, the second antenna element AP2 can be disposed on a different layer from the first antenna element AP1. The second antenna element AP2 can be disposed on the upper side of the first antenna element AP1, and each of the second antenna element AP2 can be stacked with a corresponding one of the first antenna element AP1. The first antenna element AP1 and the second antenna element AP2 can have different frequency bands from each other. In an embodiment, the first antenna element AP1 can have a first frequency band, the first antenna element AP1 can operate properly above the first frequency band, and the second antenna element AP2 can have a second frequency band, the second antenna element AP2 can operate properly above the second frequency band. In an embodiment, the second frequency band can be greater than the first frequency band. For example, the first frequency band is a frequency range from 26 GHz to 30 GHz or from 27 GHz to 29 GHz. The first antenna element AP1 can operate at 28 GHz. For example, the second frequency band is a frequency range from 36 GHz to 39 GHz or from 38 GHz to 40 GHz. The second antenna element AP2 can operate at 39 GHz.

[0119] On a plane, the area of the second antenna element AP2 is smaller than the area of the first antenna element AP1. The antenna element can have an area inversely proportional to the frequency within the frequency band in which the antenna element operates properly, such that the area of the first antenna element AP1 providing the first frequency band is greater than the area of the second antenna element AP2 providing the second frequency band. The frequency within the second frequency band is higher than the frequency within the first frequency band.

[0120] A plurality of transmission lines can connect the first antenna element AP1 and the second antenna element AP2 and can transmit signals of frequencies within the frequency band provided to the third pad unit PD3. The third pad unit PD3 can be connected to a circuit unit (not shown) such as a radio frequency integrated circuit and provide signals.

[0121] Figure 8 is a cross-sectional view of an input sensor ISL according to an embodiment of the inventive concept. Figure 8 is along Figure 7 a cross-sectional view of the surface taken along line I-I'.

[0122] Referring to Figure 8 , the input sensor ISL includes a first sensing layer SL1 and a second sensing layer SL2.

[0123] In this embodiment, the first sensing layer SL1 includes a plurality of second connection units CP2. The plurality of second connection units CP2 are formed by a first conductive layer CL1 (see Figure 6B ). The second sensing layer SL2 includes a plurality of first sensor units SP1 (see Figure 7 ), a plurality of second sensor units SP2, and a plurality of first connection units CP1. The plurality of first sensor units SP1 (see Figure 7 ), the plurality of second sensor units SP2, and the plurality of first connection units CP1 are formed by a second conductive layer CL2 (see Figure 6B ). The second sensor units SP2 and the second connection units CP2 may be connected through a first connection contact hole CNT-1 penetrating through a second insulating layer IS-IL2. The second connection units CP2 are disposed on a first insulating layer IS-IL1 and may be covered by the second insulating layer IS-IL2, and the first sensor units SP1 (see Figure 7 ), the second sensor units SP2, and the first connection units CP1 are disposed on the second insulating layer IS-IL2 and may be covered by a third insulating layer IS-IL3. In an embodiment, each of the second connection units CP2 may include a bridge pattern that, below a corresponding first connection unit CP1, connects two adjacent second sensor units SP2 disposed higher than the bridge pattern. For example, the plurality of first connection units CP1 and the plurality of second connection units CP2 are shown to cross each other. However, the inventive concept is not limited thereto. In an embodiment, each of the second connection units CP2 may be modified to have a shape of "<" and / or ">", so as not to overlap with the first connection units CP1. The second connection units CP2 having a shape of "<" or ">" may overlap with the first sensor units SP1.

[0124] Figure 9 is a cross-sectional view of an antenna AL according to an embodiment of the inventive concept. Figure 9 is a cross-sectional view of a surface taken along line II-II' of Figure 7 .

[0125] Referring to Figure 9 , the antenna AL includes a first antenna layer AL1 and a second antenna layer AL2. The first antenna layer AL1 includes a plurality of first antenna elements AP1, and the second antenna layer AL2 includes a plurality of second antenna elements AP2. The first antenna layer AL1 and the second antenna layer AL2 are respectively connected to Figure 8The first sensing layer SL1 and the second sensing layer SL2 in [it] are provided on the same layer. The antenna AL may have the same stacked structure as the input sensor ISL. In an exemplary embodiment, the first antenna layer AL1 and the first sensing layer SL1 may be formed of the same layer, and the second antenna layer AL2 and the second sensing layer SL2 may be formed of the same layer. For example, the first antenna layer AL1 and the first sensing layer SL1 may be formed of the first conductive layer CL1, and the second antenna layer AL2 and the second sensing layer SL2 may be formed of the second conductive layer CL2. Referring to Figure 9 , the first antenna element AP1 and the second connection unit CP2 may be formed of the first conductive layer CL1. The second antenna element AP2, the first sensor unit SP1, the second sensor unit SP2, and the first connection unit CP1 may be formed of the second conductive layer CL2. The first antenna layer AL1 and the second connection unit CP2 are provided on the first insulating layer A-IL1 and are covered by the second insulating layer A-IL2. The second antenna layer AL2, the first sensor unit SP1, the second sensor unit SP2, and the first connection unit CP1 are provided on the second insulating layer A-IL2 and may be covered by the third insulating layer A-IL3. The first insulating layer A-IL1 to the third insulating layer A-IL3 of the antenna AL respectively correspond to the same layer as the first insulating layer IS-IL1 to the third insulating layer IS-IL3 of the input sensor ISL. In an embodiment, the first antenna element AP1 may be provided in the first antenna layer AL1, and the second antenna element AP2 may be provided in the second antenna layer AL2. The first antenna element AP1 and the second antenna element AP2 may include a mesh pattern having a plurality of openings MH. In Figure 9 , a plurality of first antenna elements AP1 and a plurality of second antenna elements AP2 may be provided to overlap each other. In an embodiment, different from Figure 9 , the first antenna element AP1 and the second antenna element AP2 may be in the first antenna layer AL1 and the second antenna layer AL2 respectively without overlapping each other.

[0126] The thickness of the second antenna element AP2 may be less than the thickness of the first antenna element AP1. Here, the thickness may correspond to the length in the third direction DR3. A detailed description thereof will be provided with reference to Figure 10 .

[0127] Figure 10 is a cross-sectional view of the antenna AL according to an embodiment of the inventive concept.

[0128] Referring to Figure 10 , the first antenna layer AL1 and the second antenna layer AL2 may include a multi-layer metal layer. Although not shown separately, in Figure 10Exemplarily shown therein is a first antenna element AP1 having a three-layer structure including a first metal layer ML1, a second metal layer ML2, and a third metal layer ML3, and a second antenna element AP2 having a two-layer structure including a fourth metal layer ML4 and a fifth metal layer ML5. The first metal layer ML1 to the fifth metal layer ML5 may include a mesh pattern having a plurality of openings MH. Each of the first metal layer ML1 to the fifth metal layer ML5 may be a titanium layer or an aluminum layer. In an embodiment, the first metal layer ML1 is a titanium layer, the second metal layer ML2 is an aluminum layer, the third metal layer ML3 is a titanium layer, and the fourth metal layer ML4 and the fifth metal layer ML5 may both be a titanium layer or an aluminum layer. In an embodiment, each of the first metal layer ML1 to the third metal layer ML3 of the first antenna element AP1 may be formed of a titanium layer, and the second antenna element AP2 may be formed only of the fourth metal layer ML4, where the fourth metal layer ML4 may be formed of a titanium layer. Herein, the thicknesses of the plurality of titanium layers and aluminum layers may be the same. Accordingly, the thickness of the second antenna element AP2 may be less than the thickness of the first antenna element AP1. For example, the thickness of the second antenna element AP2 disposed on the upper side of the first antenna element AP1 to overlap with the first antenna element AP1 may be less than the thickness of the first antenna element AP1. The second antenna element AP2 may be formed to be thin to reduce signal interference that may affect the first antenna element AP1.

[0129] Figure 11 is a cross-sectional view of an antenna AL according to an embodiment of the inventive concept. Figure 11 is a cross-sectional view taken along line Figure 7 III-III' of.

[0130] Referring to Figure 11 , the antenna AL may include a plurality of transmission lines passing through the second insulating layer A-IL2 and connecting the first antenna element AP1 and the second antenna element AP2, respectively. The plurality of transmission lines may include a first transmission line CNL1 and a second transmission line CNL2. In an embodiment, each of the first antenna element AP1 may include the first transmission line CNL1, and each of the second antenna element AP2 may include the second transmission line CNL2. The first transmission line CNL1 and the second transmission line CNL2 may both be connected to different pads in the third pad unit PD3. In another embodiment, the plurality of transmission lines may pass through a contact hole between the first transmission line CNL1 and the second transmission line CNL2. In this embodiment, the first transmission line CNL1 and the second transmission line CNL2 may be connected to the same pad in the third pad unit PD3. In this case, the first transmission line CNL1 and the second transmission line CNL2 may be electrically connected to each other through the contact hole.

[0131] Figure 12 is a plan view of an input sensor ISL and an antenna AL according to an embodiment of the inventive concept.

[0132] In Figure 12 , the display panel DP may further include a signal transmission area STA. The signal transmission area STA is an area where signals of an electronic module such as a camera module (not shown) are transmitted, and corresponds to a non-display area. In an embodiment, the signal transmission area STA is disposed on the upper portion of the display panel DP in a plan view, and some areas on the left and right sides of the signal transmission area STA may be antenna areas IS-DA2 corresponding to a second area DA2 of the display area DA. The lower side of the signal transmission area STA may correspond to a sensing area IS-DA1 corresponding to a first area DA1 of the display area DA. For example, an area including some areas on the left and right sides and the lower side of the signal transmission area STA of the display panel DP is a sensing area IS-DA1 that overlaps with a first area DP-DA1 of the display panel DP (see Figure 3A ), and other areas on the left and right sides of the signal transmission area STA may be antenna areas IS-DA2 that overlap with a second area DP-DA2 of the display panel DP (see Figure 3A ). In an embodiment, the antenna area IS-DA2 may exist only on the left side or the right side of the signal transmission area STA. The input sensor ISL may be disposed in the sensing area IS-DA1, and the antenna AL may be disposed in the antenna area IS-DA2. However, the present invention is not limited thereto. In an embodiment, there may be one or more signal transmission areas STA, and the position of the signal transmission area STA may be set in all possible areas including the center, left side, and right side of the upper portion of the display area DA. In addition, in Figure 12 , two antennas on the left side and two antennas on the right side are shown. However, the inventive concept is not limited thereto. The number of antennas is not limited, and different numbers of antennas may be included on the left side and the right side.

[0133] In an embodiment, the sensing area IS-DA1 corresponding to the first area DA1 of Figure 6A may surround the signal transmission area STA, and the antenna area IS-DA2 corresponding to the second area DA2 of Figure 6A may be disposed on at least one of the upper left corner area and the upper right corner area of the display panel DP.

[0134] Figure 13 is a perspective view of an electronic device ED-1 according to an embodiment of the inventive concept.

[0135] In Figure 13In this case, a portable terminal having two surfaces with curved edges is exemplarily shown. However, the inventive concept is not limited thereto. The edge of one surface may be provided as a curved surface, or the edges of all four surfaces may be provided as curved surfaces. Further, although not shown separately, the electronic device ED-1 according to the inventive concept may be used in large electronic devices such as televisions or external advertising boards, and may also be used in medium and small electronic devices such as personal computers, laptop computers, personal digital terminals, car navigation units, game consoles, portable electronic devices, watch-type electronic devices, and cameras. These are merely examples, and the electronic device ED-1 may be adopted in other electronic devices without departing from the inventive concept.

[0136] The electronic device ED-1 according to an embodiment may have a plurality of regions separated in a display surface ED-IS. In the electronic device ED-1, an image region ED-DA in which a first image IM1 and a second image IM2 are displayed, a border region ED-NDA adjacent to the image region ED-DA, and a hole region HA may be defined. In an embodiment, the border region ED-NDA may be omitted. In an embodiment, the image region ED-DA may include a first region ED-DA1 in which the first image IM1 is displayed and a second region ED-DA2 in which the second image IM2 is displayed.

[0137] In Figure 13 this case, a clock widget or the like is shown as an example of the images IM1 and IM2. The border region ED-NDA may surround the image region ED-DA. The edge of the hole region HA may be surrounded by the first region ED-DA1. In a plan view, the hole region HA may be spaced apart from the border region ED-NDA, and the first region ED-DA1 may be between the hole region HA and the border region ED-NDA. The hole region HA is a region in which a module hole (not shown) is defined. Therefore, in a plan view, the module hole (such as a camera hole) may be surrounded by the image region ED-DA in which the images IM1 and IM2 are displayed.

[0138] The electronic device ED-1 according to an embodiment may include a bent region BA and a non-bent region NBA. The bent region BA may be a region bent based on a bending axis BX. The non-bent region NBA may be a region that extends from the bent region BA and is flat. The bent region BA may be an edge region of the electronic device ED-1. The bent region BA may be defined on one side surface of the electronic device ED-1 and on the other side surface opposite to the one side surface. At this time, the bent region BA defined on one side surface of the electronic device ED-1 may be referred to as a first bent region, and the bent region BA defined on the other side surface of the electronic device ED-1 may be referred to as a second bent region.

[0139] The non-bending area NBA can be parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the electronic device ED-1 is indicated by the third direction DR3. The non-bending area NBA can be an area corresponding to the front surface of the electronic device ED-1, and the bending area BA can be an area corresponding to the side surface of the electronic device ED-1.

[0140] Figure 14 is a cross-sectional view of the surface taken along the Figure 13 line I-I'. Figure 15 is a perspective view of the input sensor ISL and the antenna AL according to an embodiment of the inventive concept.

[0141] Referring to Figure 14 and Figure 15 , a first area ED-DA1 of the image area ED-DA overlaps with the non-bending area NBA, and a second area ED-DA2 thereof overlaps with the bending area BA. The input sensor ISL can be disposed in the non-bending area NBA that overlaps with the first area ED-DA1, and the antenna AL can be disposed in the bending area BA that overlaps with the second area ED-DA2. Redundant descriptions made with reference to Figure 6A will be omitted. In Figure 15 , each of the first antenna element AP1 and the second antenna element AP2 can include a plurality of mesh patterns. The mesh patterns can be formed of silver, lead, or copper. The first antenna element AP1 and the second antenna element AP2 can be disposed in the first bending area or the second bending area, or can be disposed in both the first bending area and the second bending area. For example, although not shown in the drawings, the antenna AL can be disposed in both the first bending area and the second bending area on both sides of the input sensor ISL.

[0142] In an embodiment, the antenna AL can be spaced apart from the first sensor unit SP1 and the second sensor unit SP2 by at least 1 mm to 2 mm on the second insulating layer IL2 (see Figure 6B ). For example, the first antenna element AP1 can be spaced apart from the most adjacent first sensor unit SP1 and second sensor unit SP2 (see Figure 7 ) by at least 1 mm. By placing the antenna AL and the sensor units SP1 and SP2 in the antenna area IS-DA2 (see Figure 7 ) and the sensing area IS-DA1 (see Figure 7 ) that are spaced apart from each other, field interference can be reduced.

[0143] In an embodiment of the inventive concept, an electronic device may dispose antennas that provide at least two different frequencies on a region in a display area that is separate from an input sensor. The antennas may include a plurality of antenna elements disposed to be stacked on top of each other in different layers. The plurality of antenna elements may be stacked together with a sensor unit of the input sensor. In an embodiment of the inventive concept, the antennas may be disposed on a side edge region or a curved region of the display area, or on the left side and / or the right side of a signal transmission region, thereby solving problems of signal interference caused by a user's touch, user hazards, and image quality degradation caused by a user's touch.

[0144] An electronic device according to the inventive concept may improve antenna efficiency by disposing a first antenna (i.e., a first antenna element) and a second antenna (i.e., a second antenna element) that provide different frequency bands on two layers in a display area. The first antenna and the second antenna of the inventive concept are stacked together with the input sensor, such that the process is efficient. The first antenna and the second antenna of the inventive concept have a grid structure, thereby preventing image quality problems, and have different thicknesses and areas, thereby preventing signal interference and the like.

[0145] As described above, the inventive concept has been disclosed in the drawings and the specification. Although specific terms have been used herein, they are only for the purpose of describing the inventive concept and are not intended to limit the meaning or scope of the invention as set forth in the claims. Accordingly, those skilled in the art will understand that various modifications and equivalent embodiments may be made therefrom. Therefore, the true technical protection scope of the inventive concept should be determined by the technical spirit of the appended claims.

Claims

1. An electronic device, the electronic device comprising: A display panel, including a display area and a non-display area adjacent to the display area; An input sensor, stacked with a first area of the display area; And An antenna, stacked with a second area of the display area, Wherein, the input sensor includes: a first sensing layer including a bridge pattern; and a second sensing layer including a plurality of sensor electrodes and disposed on a layer different from the first sensing layer, Wherein, the bridge pattern is configured to connect two adjacent sensor electrodes among the plurality of sensor electrodes, Wherein, the antenna includes: a first antenna layer including a plurality of first antennas having a first frequency band, the first antenna layer and the first sensing layer are disposed on the same layer; and a second antenna layer including a plurality of second antennas having a second frequency band different from the first frequency band, the second antenna layer and the second sensing layer are disposed on the same layer, Wherein, an area of each of the plurality of first antennas and an area of each of the plurality of second antennas are such that one is greater than the other, and each of the plurality of second antennas is stacked with a corresponding first antenna among the plurality of first antennas, and Wherein, the plurality of first antennas are arranged along a first direction, and the plurality of second antennas are arranged along the first direction.

2. The electronic device according to claim 1, Among them, The input sensor and the antenna further include a first insulating layer and a second insulating layer covering the bridge pattern and the first antenna layer, Wherein, the first antenna layer and the bridge pattern are disposed on the first insulating layer, and Wherein, the second antenna layer and the plurality of sensor electrodes are disposed on the second insulating layer.

3. The electronic device according to claim 1, the electronic device further comprising: A third insulating layer, covering the plurality of sensor electrodes and the second antenna layer.

4. The electronic device according to claim 1, Among them, The display panel includes a thin film encapsulation layer, and Wherein, the input sensor and the antenna are directly disposed on an upper surface of the thin film encapsulation layer.

5. The electronic device according to claim 1, Among them, The first antenna layer includes: A first metal layer, a second metal layer on the first metal layer, and a third metal layer on the second metal layer, and Wherein, the second antenna layer includes a fourth metal layer and a fifth metal layer on the fourth metal layer.

6. The electronic device according to claim 5, Among them, Each of the first metal layer and the third metal layer is a titanium layer, Wherein, the second metal layer is an aluminum layer, and Wherein, each of the fourth metal layer and the fifth metal layer is a titanium layer or an aluminum layer.

7. The electronic device according to claim 1, Among them, The first frequency band is less than the second frequency band.

8. The electronic device according to claim 1, Among them, Each of the plurality of first antennas has an area larger than an area of a corresponding second antenna among the plurality of second antennas.

9. The electronic device according to claim 1, Among them, A thickness of each of the plurality of second antennas is less than a thickness of a corresponding first antenna among the plurality of first antennas.

10. The electronic device according to claim 1, Among them, the antenna further includes a plurality of transmission lines, and wherein each of the plurality of transmission lines connects a corresponding first antenna among the plurality of first antennas and a corresponding second antenna among the plurality of second antennas.

11. The electronic device according to claim 1, Among them, each of the plurality of first antennas and the plurality of second antennas includes a grid pattern.

12. The electronic device according to claim 1, Among them, the display panel further includes a signal transmission region, wherein, in a plan view, the first region surrounds the signal transmission region, and wherein the second region is at least one of the upper left corner region and the upper right corner region of the display panel.

13. An electronic device including a curved region and a non-curved region, the electronic device comprising: a display panel including a display region and a non-display region adjacent to the display region, the display region having a first region superimposed on the non-curved region and a second region superimposed on the curved region; an input sensor disposed on the display panel and superimposed on the first region; and an antenna disposed on the display panel and superimposed on the second region, wherein the input sensor includes: a first insulating layer directly disposed on the upper surface of the display panel; a first sensing layer disposed on the first insulating layer; a second insulating layer covering the first sensing layer; and a second sensing layer disposed on the second insulating layer and having a plurality of sensor electrodes, and wherein the antenna includes: a plurality of first antennas having a first frequency band, wherein the plurality of first antennas and the first sensing layer are disposed on the same layer; and a plurality of second antennas having a second frequency band, wherein the plurality of second antennas and the second sensing layer are disposed on the same layer.

14. The electronic device according to claim 13, Among them, the first frequency band is less than the second frequency band.

15. The electronic device according to claim 13, Among them, each of the plurality of second antennas is superimposed on a corresponding first antenna among the plurality of first antennas.

16. The electronic device according to claim 13, Among them, the input sensor includes: a plurality of first sensor electrodes arranged in a second direction; a plurality of first connection electrodes, each of the plurality of first connection electrodes being configured to connect two corresponding first sensor electrodes adjacent to each other in the second direction among the plurality of first sensor electrodes; a plurality of second sensor electrodes arranged in a first direction; and a plurality of second connection electrodes, each of the plurality of second connection electrodes being configured to connect two corresponding second sensor electrodes adjacent to each other in the first direction among the plurality of second sensor electrodes.

17. The electronic device according to claim 16, Among them, the plurality of second connection electrodes are disposed on the first insulating layer, and wherein the second insulating layer is disposed on the plurality of second connection electrodes, and Among them, the multiple first sensor electrodes, the multiple second sensor electrodes, and the multiple first connection electrodes are disposed on the second insulating layer, and Among them, each of the multiple first connection electrodes is stacked with a corresponding second connection electrode among the multiple second connection electrodes.

18. The electronic device according to claim 17, wherein the electronic device further comprises: A third insulating layer covering the multiple first sensor electrodes, the multiple second sensor electrodes, the multiple first connection electrodes, and the multiple second antennas.

19. The electronic device according to claim 13, Among them, Each of the multiple first antennas and each of the multiple second antennas includes a grid pattern.

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