Power module and manufacturing method thereof

Abstract

The present invention provides a power module and a manufacturing method thereof. The power module includes a substrate, an electronic component, a magnetic component, and a plastic encapsulation component. The substrate includes a first surface, a second surface, and an operating area, wherein the first surface and the second surface are opposite to each other, and the operating area is disposed on the first surface or the second surface; the electronic component is disposed on the substrate; the magnetic component is disposed in the operating area of ​​the substrate and has a side periphery; and the plastic encapsulation component is disposed on the substrate, covering the electronic component and at least partially surrounding the side periphery of the magnetic component, wherein the projections of the plastic encapsulation component and the operating area on the first surface of the substrate do not overlap, and a gap is formed between the plastic encapsulation component and the side periphery of the magnetic component.

Description

Technical Field

[0001] The present invention relates to a power module, and in particular to a power module capable of optimizing a transformer by avoiding plastic packaging materials, and a manufacturing method thereof. Background Art

[0002] Traditional power modules, such as a DC / DC converter, typically consist of power devices, magnetic components, and a circuit substrate. The circuit substrate is used to mount the power devices and magnetic components, interconnecting them. Magnetic components, such as a transformer consisting of a core assembly and windings, are assembled with the circuit substrate and then encapsulated with a plastic encapsulating material, completely encapsulating the magnetic components. However, once the plastic encapsulating material cures, it can easily generate stress, which can lead to increased losses or parameter changes in magnetic components, such as transformers.

[0003] Therefore, how to develop a power module and its manufacturing method to solve the problems faced by the prior art by avoiding the position of the magnetic components by using plastic packaging materials to provide a good and stable structural assembly while simplifying the process is indeed a topic that needs to be addressed in this field. Summary of the Invention

[0004] The present invention aims to provide a power module and its manufacturing method. By avoiding the transformer's position by encapsulating the plastic, a stable structural assembly is achieved, simplifying the process and eliminating the stress generated by the encapsulating material covering the transformer's magnetic core, which increases transformer losses. Furthermore, by embedding a copper block during the encapsulation process, the thermal resistance of the product is reduced, further enhancing the competitiveness of the power module.

[0005] Another object of the present invention is to provide a power module and a method for manufacturing the same. By optimizing the packaging mold design to avoid the installation location of the transformer core, the plastic encapsulation process can be performed before the transformer core is assembled on the substrate, so that the plastic encapsulation material does not come into close contact with the transformer core, effectively avoiding the problem of increased transformer losses. Furthermore, multiple power modules can be plastic encapsulated together using a connecting structure before the magnetic components are assembled, which helps to integrate and simplify the power module manufacturing process, while achieving the goals of enhancing structural stability and reducing manufacturing costs.

[0006] To achieve the above-mentioned objectives, the present invention provides a power module, the structure of which includes a substrate, an electronic component, a magnetic component, and a plastic-encapsulated component. The substrate includes a first surface, a second surface, and an operating area, wherein the first surface and the second surface are opposite to each other, and the operating area is arranged on the first surface or the second surface. The electronic component is arranged on the substrate. The magnetic component is arranged in the operating area of ​​the substrate and has a side periphery. The plastic-encapsulated component is arranged on the substrate, covers the electronic component, and at least partially surrounds the side periphery of the magnetic component, wherein the projections of the plastic-encapsulated component and the operating area on the first surface of the substrate do not overlap, and a gap is formed between the plastic-encapsulated component and the side periphery of the magnetic component.

[0007] To achieve the above-mentioned object, the present invention also provides a method for manufacturing a power module, comprising the following steps: (a) providing a substrate, wherein the substrate includes a first surface and a second surface opposite to each other, and at least one working area, wherein the at least one working area is arranged on the first surface or the second surface; (b) providing an electronic component, which is arranged on the substrate; (c) forming a plastic packaging component, which is arranged on the substrate and covers the electronic component, and the projection of the plastic packaging component on the first surface does not overlap with the projection of the working area on the first surface; and (d) providing a magnetic component, which is arranged in the working area on the substrate, so that the plastic packaging component at least partially surrounds a side periphery of the magnetic component, wherein a gap is formed between the plastic packaging component and the side periphery of the magnetic component.

[0008] To achieve the above-mentioned purpose, the present invention further provides a method for manufacturing a power module, comprising the following steps: (a) providing a continuous sheet comprising a plurality of substrates, wherein the plurality of substrates are arranged in an array, wherein each substrate comprises a first surface, a second surface and an operating area opposite to each other; (b) providing a plurality of electronic components, which are respectively arranged on the plurality of substrates, and wherein the plurality of electronic components correspond to the plurality of operating areas; (c) forming a plurality of plastic-encapsulated parts through a single plastic-encapsulation process, respectively covering the corresponding electronic components, and wherein the projection of each plastic-encapsulated part on the first surface of the substrate does not overlap with the projection of the corresponding operating area on the first surface; and (d) providing a plurality of magnetic components, wherein each magnetic component is arranged in the corresponding operating area, so that the corresponding plastic-encapsulated part at least partially surrounds a side periphery of the magnetic component, wherein a gap is formed between the corresponding plastic-encapsulated part and the side periphery of the magnetic component.

[0009] The present invention provides a power module and a manufacturing method thereof. By avoiding the transformer's position by encapsulating the plastic, a good and stable structural assembly is achieved, while simplifying the process and eliminating the stress caused by the encapsulation material covering the transformer's magnetic core, which would otherwise increase transformer losses. Furthermore, by embedding a copper block during the encapsulation process, the thermal resistance of the product is reduced, further enhancing the competitiveness of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1AThe figure discloses an exploded structural diagram of a power module according to a first preferred embodiment of the present invention.

[0011] Figure 1B The figure is an exploded structural diagram of the power module according to the first preferred embodiment of the present invention from another perspective.

[0012] Figure 2A The figure discloses a three-dimensional structural diagram of a power module according to a first preferred embodiment of the present invention.

[0013] Figure 2B The figure is a three-dimensional structural diagram of the power module according to the first preferred embodiment of the present invention from another perspective.

[0014] Figure 3 1 is a cross-sectional structural diagram of a power module according to a first preferred embodiment of the present invention.

[0015] Figure 4A 1 is a top view of a power module according to a first preferred embodiment of the present invention.

[0016] Figure 4B 1 is a bottom view of a power module according to a first preferred embodiment of the present invention.

[0017] Figure 5 1 is a side view of a power module according to a first preferred embodiment of the present invention.

[0018] Figures 6A to 6E The present invention discloses a schematic diagram of a process flow of a power module according to a first preferred embodiment of the present invention.

[0019] Figure 7A The present invention discloses a schematic structural diagram of the connection of two substrates and the corresponding first plastic encapsulation mold in a preferred embodiment of the present invention.

[0020] Figure 7B The present invention discloses a schematic structural diagram of the connection of two substrates and the corresponding first plastic encapsulation mold from another perspective in a preferred embodiment of the present invention.

[0021] Figure 8 This is a three-dimensional structural diagram of the two substrates after being combined with the first plastic packaging mold in a preferred embodiment of the present invention.

[0022] Figure 9A For public Figure 8 Cross-sectional structure diagram.

[0023] Figure 9B for Figure 9A Top view of .

[0024] Figure 10A The present invention discloses a schematic structural diagram of the connection of two substrates that have undergone a first plastic encapsulation process and a second plastic encapsulation mold in a preferred embodiment of the present invention.

[0025] Figure 10B This is a schematic diagram showing the corresponding structure of two substrates connected after the first plastic encapsulation process and the second plastic encapsulation mold at another viewing angle in a preferred embodiment of the present invention.

[0026] Figure 11 This is a three-dimensional structural diagram of two substrates that have undergone a first plastic packaging process and are combined with a second plastic packaging mold in a preferred embodiment of the present invention.

[0027] Figure 12A For public Figure 11 Cross-sectional structure diagram.

[0028] Figure 12B for Figure 12A Top view of .

[0029] Figure 13 This is a schematic diagram of the combination of the substrate and the third plastic packaging mold in a preferred embodiment of the present invention.

[0030] Figure 14 For public Figure 13 Schematic diagram of the structure of the middle substrate combined with the third plastic packaging mold to form a plastic packaging material layer.

[0031] Figure 15 Removed for public use Figure 14 Schematic diagram of the structure of the plastic packaging material layer on the middle substrate to expose the working area.

[0032] Figure 16 To disclose another embodiment of a substrate structure application.

[0033] Figure 17 The figure discloses an exploded structural diagram of a power module according to a second preferred embodiment of the present invention.

[0034] Figure 18A The figure is a three-dimensional structural diagram of a power module according to a third preferred embodiment of the present invention.

[0035] Figure 18B 1 is a three-dimensional structural diagram of a power module according to a fourth preferred embodiment of the present invention.

[0036] Figure 18C 1 is a three-dimensional structural diagram of a power module according to a fifth preferred embodiment of the present invention.

[0037] Figure 19A 1 is a structural exploded view of a power module according to a sixth preferred embodiment of the present invention.

[0038] Figure 19B 1 is a three-dimensional structural diagram of a power module according to a sixth preferred embodiment of the present invention.

[0039] The reference numerals are as follows:

[0040] 1, 1a, 1b, 1c, 1d, 1e: Power modules

[0041] 10, 10a, 10b; 10c: substrate

[0042] 10': continuous

[0043] 101: Connection

[0044] 11: Side 1

[0045] 12: Side 2

[0046] 13, 13a: Perforation

[0047] 20: Electronic components

[0048] 21: First electronic component

[0049] 22: Second electronic component

[0050] 30: Plastic sealed parts

[0051] 31: First plastic sealing component

[0052] 31a: Plastic material layer

[0053] 32: Second plastic sealing component

[0054] 40: Magnetic components

[0055] 41: First magnetic core

[0056] 410: Top surface

[0057] 42: Second magnetic core

[0058] 420: Bottom

[0059] 43: Winding

[0060] 51, 52, 53, 53a, 53b, 53c: Copper blocks

[0061] 531a, 531b, 531c: first exposed surface

[0062] 532a, 532b, 532c: second exposed surface

[0063] 533c: step groove

[0064] 54: Signal connector

[0065] 60: Magnetic components

[0066] 61: Magnetic core

[0067] 62: Winding

[0068] 9: The first plastic mold

[0069] 9': Second plastic sealing mold

[0070] 9a: The third plastic sealing mold

[0071] 91, 91', 91a: Plastic-sealed space

[0072] 92, 92', 94: Plastic sealed ports

[0073] 93, 93': Boss

[0074] L1, L2, L3, L4, L1', L2', L3', L4': side perimeter

[0075] H1, H2, H3, H4: Height

[0076] L0, L0': lateral periphery

[0077] R1, R2: working area

[0078] G1, G2: Gap

[0079] g1, g2: minimum gap distance DETAILED DESCRIPTION

[0080] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various modifications in different forms without departing from the scope of the present invention, and that the description and drawings are intended to be illustrative in nature and not to limit the present invention.

[0081] Figure 1A The figure discloses an exploded structural diagram of a power module according to a first preferred embodiment of the present invention. Figure 1B The figure is an exploded structural diagram of the power module according to the first preferred embodiment of the present invention from another perspective. Figure 2A The figure discloses a three-dimensional structural diagram of a power module according to a first preferred embodiment of the present invention. Figure 2B The figure is a three-dimensional structural diagram of the power module according to the first preferred embodiment of the present invention from another perspective. Figure 3 1 is a cross-sectional structural diagram of a power module according to a first preferred embodiment of the present invention. Figure 4A 1 is a top view of a power module according to a first preferred embodiment of the present invention. Figure 4BThe present invention discloses a bottom view of a power module according to a first preferred embodiment of the present invention. In this embodiment, the power module 1 includes a substrate 10, an electronic component 20, a plastic package 30, and a magnetic component 40. The substrate 10 is, for example, a printed circuit board (PCB) and includes a first surface 11, a second surface 12, and at least one operating area. The first surface 11 and the second surface 12 of the substrate 10 are opposite each other. In this embodiment, an operating area R1 is defined on the first surface 11 of the substrate 10, and an operating area R2 is defined on the second surface 12 of the substrate 10. In other embodiments, the operating area R1 may be provided only on the first surface 11, or the operating area R2 may be provided only on the second surface 12. In this embodiment, the electronic component 20 includes, for example, a first electronic component 21 and a second electronic component 22. The electronic components 20 may include resistors, capacitors, or semiconductor devices. The first electronic component 21 is provided on the first surface 11, and the second electronic component 22 is provided on the second surface 12. In other embodiments, one of the first electronic component 21 and the second electronic component 22 may be omitted, but the present invention is not limited thereto. In this embodiment, the molding component 30 includes, for example, a first molding component 31 and a second molding component 32. The first molding component 31 is arranged on the first surface 11 of the substrate 10, and covers the first electronic component 21 on the first surface 11. The second molding component 32 is arranged on the second surface 12, and covers the second electronic component 22 on the second surface 12. In other embodiments, the first molding component 31 or the second molding component 32 may be omitted corresponding to the first electronic component 21 or the second electronic component 22, that is, one of the first molding component 31 and the second molding component 32 may be omitted, and the present invention is not limited to this. It should be noted that the molding component 30 is arranged on the substrate 10 to cover the electronic component 20. On the other hand, in this embodiment, the magnetic component 40 includes a first magnetic core 41, a second magnetic core 42 and a planar winding 43 arranged in the substrate 10 (see Figure 3 ), and at least one through-hole 13 is provided in the working area R1 and the working area R2. The first magnetic core 41 and the second magnetic core 42 constitute a magnetic core assembly, which are respectively provided on the first surface 11 and the second surface 12, and are fastened to the substrate 10 through the through-hole 13. Of course, the present invention is not limited thereto. The magnetic assembly 40 can also be a separate magnetic assembly, which can be a winding and a magnetic powder material integrated into one body, and surface mounted in the working area of ​​the substrate 10; or the winding can be wound on the skeleton and form a magnetic assembly with the magnetic core, which is then provided in the working area of ​​the substrate 10 and fixed through the soldering pads or soldering holes provided on the substrate 10 to achieve electrical connection with the electronic component 20.

[0082] It is noteworthy that in this embodiment, the first magnetic core 41 has a side periphery L0. When the first magnetic core 41 is disposed on the first surface 11, it is assembled to the working area R1 on the first surface 11 of the substrate 10. The second magnetic core 42 has a side periphery L0'. When the second magnetic core 42 is disposed on the second surface 12, it is assembled to the working area R2 on the second surface 12 of the substrate 10. Furthermore, when the magnetic assembly 40 is disposed on the substrate 10, the first molding member 31 at least partially surrounds the side periphery L0 of the first magnetic core 41 of the magnetic assembly 40. That is, the outer periphery L0 of the first magnetic core 41 is at least partially or completely surrounded by the first molding member 31. The projection of the first molding member 31 on the first surface 11 does not overlap with the projection of the working area R1 on the first surface 11, that is, the two are offset. Furthermore, a gap G1 is formed between the first molding member 31 and the side periphery L0 of the first magnetic core 41 of the magnetic assembly 40. The gap G1 has a minimum gap distance g1. Preferably, the minimum gap distance g1 is greater than or equal to 0.2 mm. Furthermore, when the magnetic assembly 40 is disposed on the substrate 10, the second molding member 32 also at least partially surrounds the side periphery L0' of the second magnetic core 42 of the magnetic assembly 40, i.e., the outer edge of the second magnetic core 42 is at least partially or completely surrounded by the second molding member 32. The projection of the second molding member 32 on the first surface 11 and the projection of the working area R2 on the first surface 11 do not overlap, i.e., the two are offset. Furthermore, a gap G2 is formed between the second molding member 32 and the side periphery L0' of the second magnetic core 42 of the magnetic assembly 40. The gap G2 has a minimum gap distance g2. Preferably, the minimum gap distance g2 is greater than or equal to 0.2 mm. Preferably, the first magnetic core 41 and the second magnetic core 42 are disposed symmetrically in a vertical direction, with the working areas R1 and R2 overlapping, i.e., the projections of the working areas R1 and R2 on the first surface 11 of the substrate 10 completely overlap. Of course, the present invention is not limited to this. The plastic encapsulation component 30 can be formed, for example, by optimizing the encapsulation mold to avoid the work areas R1 and R2 used for mounting the magnetic component. Furthermore, the plastic encapsulation component 30 can be encapsulated before the magnetic component 40 is assembled on the substrate 10, so that the plastic encapsulation material does not tightly wrap around (contact) the first magnetic core 41 and the second magnetic core 42 of the magnetic component 40. Furthermore, because the gaps G1 and G2 formed between the plastic encapsulation component 30 and the first magnetic core 41 and the second magnetic core 42 of the magnetic component 40 are greater than or equal to 0.2 mm, the plastic encapsulation component 30 can effectively prevent the forces between the plastic encapsulation component 30 and, for example, a transformer from causing changes in transformer parameters and thereby increasing transformer losses.

[0083] In this embodiment, the side periphery L0 of the first magnetic core 41 is composed of four side peripheries L1, L2, L3, and L4, for example. Figure 4AAs shown, the first plastic packaging component 31 surrounds three side peripheries L1, L2, and L3. In another embodiment, the first plastic packaging component 31 may, for example, surround two side peripheries L1 and L2. In other embodiments, the first plastic packaging component 31 may, for example, surround four side peripheries L1, L2, L3, and L4. In some other embodiments, when the first magnetic core 41 is a circular magnetic core, the first plastic packaging component 31 at least surrounds more than half of the side periphery L0 of the first magnetic core 41. Of course, the present invention is not limited to this. In addition, in this embodiment, the side periphery L0' of the second magnetic core 42 is, for example, composed of four side peripheries L1', L2', L3', and L4', as shown in FIG. Figure 4B As shown, the second molding component 32 surrounds three side peripheries L1', L2', and L3'. In another embodiment, the second molding component 32 may surround two side peripheries L1' and L2', for example. In other embodiments, the second molding component 32 may surround four side peripheries L1', L2', L3', and L4', for example. In still other embodiments, when the second magnetic core 42 is a circular magnetic core, the second molding component 32 surrounds at least half of the side periphery L0' of the second magnetic core 42. Of course, the ratio of the side peripheries L0 and L0' of the molding component 30 surrounding the magnetic component 40 can be adjusted according to actual application requirements. By avoiding the position of the magnetic component and forming gaps G1 and G2, the power module 1 is provided with a good and stable structural assembly, and the performance of the magnetic component 40 is prevented from being affected by stress from the molding component 30 and thus changing.

[0084] In this embodiment, the power module 1 further includes a copper block 51, for example, disposed above the electronic component 21 on the first surface 11 and embedded within the first plastic encapsulation component 31 during the same packaging process as the electronic component 21. In this embodiment, the copper block 51 can be exposed on the first plastic encapsulation component 31 or completely covered by the plastic encapsulation material. The copper block 51 and the electronic component 21 can be connected, for example, by thermally conductive adhesive, thermally conductive sheet, solder paste welding, etc., thereby reducing the thermal resistance of the product and further improving the performance of the power module 1. In this embodiment, the power module 1 also includes a copper block 52, which is directly disposed (for example, by welding) on ​​the first surface 11 of the substrate 10 and embedded within the first plastic encapsulation component 31. The copper block 52 can be exposed on the first plastic encapsulation component 31 or completely covered by the plastic encapsulation material to improve the heat dissipation efficiency of the power module. In one embodiment, the copper blocks 51 and 52 can be formed into a heat dissipation surface exposed outside the first plastic encapsulation component 31 through a grinding process, for example, but the present invention is not limited to this. In addition, in this embodiment, the power module 1 further includes a copper block 53, which is directly disposed on the second surface 12 of the substrate 10, embedded in the second plastic encapsulation component 32, and exposed outside the second plastic encapsulation component 32 to form, for example, an input or output pin of the power module 1. The power module 1 also includes a signal connector 54, which is disposed on the second surface 12 of the substrate 10, embedded in the second plastic encapsulation component 32, and has its terminals exposed outside the second plastic encapsulation component 32 to provide a signal transmission function. Of course, the present invention is not limited to this.

[0085] In this embodiment, after the plastic packaging component 30 encapsulates the electronic component 20 on the substrate 10, the first magnetic core 41 and the second magnetic core 42 are connected to the substrate 10 through the through-hole 13. The connection method is, for example, welding, gluing, or gasket bonding, but the present invention is not limited to this. Figure 5 1 is a side view of a power module according to a first preferred embodiment of the present invention. Figure 3 and Figure 5In this embodiment, the first electronic component 21, copper blocks 51, and copper blocks 52 are disposed on the first surface 11 of the substrate 10, and the first molding member 31 encapsulates the first electronic component 21, copper blocks 51, and copper blocks 52. The first molding member 31 and the first magnetic core 41 of the magnetic component 40 respectively cover the first surface 11 of the substrate 10. In this embodiment, the height H1 of the first magnetic core 41 of the magnetic component 40 on the first surface 11 is less than or equal to the height H2 of the first molding member 31 on the first surface 11. That is, the top surface 410 of the first magnetic core 41 is recessed inward from the surface of the first molding member 31 or is flush with the surface of the first molding member 31. Thus, the first molding member 31 structurally also functions to protect the first magnetic core 41 of the magnetic component 40. Furthermore, in this embodiment, the second electronic component 22, copper block 53, and signal connector 54 are disposed on the second surface 12 of the substrate 10, and the second molding member 32 encapsulates the second electronic component 22, copper block 53, and signal connector 54. The second molding member 32 and the second magnetic core 42 of the magnetic assembly 40 respectively cover the second surface 12 of the substrate 10. In this embodiment, the height H3 of the second magnetic core 42 of the magnetic assembly 40 on the second surface 12 is less than or equal to the height H4 of the second molding member 32 on the second surface 12. In other words, the bottom surface 420 of the second magnetic core 42 is further recessed inward from the surface of the second molding member 32 or is flush with the surface of the second molding member 32. Thus, the second molding member 32 structurally also serves to protect the second magnetic core 42 of the magnetic assembly.

[0086] As mentioned above, in order to achieve that the projections of the magnetic core assembly formed by the plastic packaging component 30 and the first magnetic core 41 and the second magnetic core 42 on the first surface 11 of the substrate 10 do not overlap, the present invention further provides a method for manufacturing a power module. Figures 6A to 6E To disclose the process flow of the first preferred embodiment of the power module of the present invention. Please refer to Figure 1A to Figure 1B 、 Figures 2A to 2B 、 Figure 3 、 Figures 4A to 4B as well as Figures 6A to 6E . In this embodiment, a substrate 10 such as a printed circuit board is first provided, and the substrate 10 includes a first surface 11 and a second surface 12 opposite to each other, and at least one working area, and the working area is arranged on the first surface 11 or the second surface 12. In this embodiment, an operating area R1 is arranged on the first surface 11, and an operating area R2 is arranged on the second surface 12. Next, a first electronic component 21 is provided and arranged on the first surface 11 of the substrate 10. In this embodiment, the first electronic component 21 can be assembled on the first surface 11 of the substrate 10 by, for example, surface mounting. That is, first use solder paste to print on the first surface 11 of the substrate 10, then place the first electronic component 21 in the setting position, and finally fix the first electronic component 21 on the first surface 11 of the substrate 10 by reflow soldering, as shown in FIG. Figure 6AAfter the first electronic component 21 is fixed, the substrate 10 may be subjected to surface treatment such as cleaning or plasma treatment, but the present invention is not limited thereto. In this embodiment, a copper block 51 may be connected to the first electronic component 21 by, for example, thermally conductive adhesive, thermally conductive sheet, solder paste welding, or the like, or a copper block 52 may be directly placed on the first surface 11 of the substrate 10 to enhance the heat dissipation performance of the power module 1, as shown. Figure 6B Then, a first plastic encapsulation component 31 is formed on the first surface 11 of the substrate 10 by, for example, a plastic encapsulation process, to cover the first electronic component 21, the copper block 51 and the copper block 52, as shown. Figure 6C As shown. It should be noted that the first plastic encapsulation component 31 is disposed on the first surface 11 of the substrate 10, and its projection on the first surface 11 does not overlap with the projection of the working area R1 on the first surface, so as to expose the working area R1 on the first surface 11 of the substrate 10. Then, the second electronic component 22 can be fixedly mounted on the second surface 12 of the substrate 10 by, for example, surface mounting. At the same time, parts such as the copper block 53 and the signal connector 54 can also be mounted on the second surface 12 of the substrate 10. Figure 6D Finally, a second plastic encapsulation component 32 is formed on the second surface 12 of the substrate 10 by, for example, a plastic encapsulation process, to cover the second electronic component 22, the copper block 53 and the signal connector 54, as shown. Figure 6E As shown. It should be noted that the second plastic sealing component 32 is arranged on the second surface 12 of the substrate 10, and its projection on the first surface 11 does not overlap with the projection of the working area R2 on the first surface 11, so as to expose the working area R2 on the second surface 12 of the substrate 10. In this embodiment, at least one through-hole 13 can be further provided on the substrate 10, and the at least one through-hole 13 is located in the working areas R1 and R2. The first magnetic core 41 and the second magnetic core 42 of the magnetic component 40 are fastened and connected to the substrate 10 through the at least one through-hole 13, and the manufacture of the power module 1 can be completed. The structure of the obtained power module 1 is as shown Figures 2A to 2B as well as Figure 3As shown. It is understandable that the shape and number of the through-holes 13 are related to the types of the first magnetic core 41 and the second magnetic core 42, and the present invention is not limited thereto. It is worth noting that after the magnetic component 40 is set on the substrate 10, the first plastic sealing component 31 at least partially surrounds the side periphery L0 of the first magnetic core 41 of the magnetic component 40, and the first plastic sealing component 31 further forms a gap G1 with the side periphery L0 of the first magnetic core 41 of the magnetic component 40, and the gap G1 has a minimum gap distance g1. Preferably, the minimum gap distance g1 is greater than or equal to 0.2mm. In addition, the second plastic sealing component 32 also at least partially surrounds the side periphery L0' of the second magnetic core 42 of the magnetic component 40, and the second plastic sealing component 32 further forms a gap G2 with the side periphery L0' of the second magnetic core 42 of the magnetic component 40, and the gap G2 has a minimum gap distance g2. Preferably, the minimum gap distance g2 is greater than or equal to 0.2mm. Since the gaps G1 and G2 between the molding component 30 and the magnetic assembly 40 are greater than or equal to 0.2 mm, the magnetic assembly 40 (eg, transformer) can be effectively prevented from suffering stress from the molding component 30 and causing increased losses in the magnetic assembly 40 .

[0087] In another embodiment, the first and second molding components 31, 32 of the molding component 30 may also be molded together on both sides. Specifically, the first electronic component 21 is secured to the first side 11 of the substrate 10. A copper block 51 may be disposed on the first electronic component 21, for example, using thermally conductive adhesive, a thermally conductive sheet, or solder paste, or the copper block 52 may be directly disposed on the first side 11 of the substrate 10. Similarly, the second electronic component 22 is secured to the second side 12 of the substrate 10, and components such as the copper block 53 and the signal connector 54 are disposed on the second side 12 of the substrate 10. A molding process is then performed to simultaneously form the first and second molding components 31, 32 on the first and second sides 11, 12 of the substrate 10. The first molding component 31 encapsulates the first electronic component 21, the copper block 51, and the copper block 52, while the second molding component 32 encapsulates the second electronic component 22, the copper block 53, and the signal connector 54. Other features are the same as those of the previous embodiment and are not further described.

[0088] On the other hand, the power module 1 can also be produced in the form of a continuous piece structure plastic package. 7A to 7B 、 Figure 8 、 Figures 9A to 9B 、 FIG. 10A to FIG. 10B 、 Figure 11 ,as well as FIG. 12A to FIG. 12BTo disclose a schematic diagram of the manufacturing process of two power modules as an example in a preferred embodiment of the present invention. It should be noted that, in this embodiment, although the manufacturing process of the continuous piece structure is described by taking two power modules as an example, the present invention is not limited to this. In addition, the continuous piece structure described in the present invention can combine multiple substrates 10 through the connecting portion 101 to form a continuous piece 10' or cut and remove the connecting portion 101 after plastic sealing a single continuous piece 10' to form multiple substrates 10, and the present invention is not limited to this. In other embodiments, multiple power modules 1 can adopt a continuous piece structure with m rows and n columns (m≥2, n≥1), or other arrangements can be adopted, and the present invention is not limited to this. Please refer to Figure 1A to Figure 1B 、 Figures 2A to 2B 、 Figure 3 、 Figures 4A to 4B as well as 7A to 7B . In this embodiment, a plurality of first electronic components 21, copper blocks 51 and copper blocks 52 are respectively arranged on the first surface 11 of the corresponding substrate 10, and are arranged in an array on the first surface 11. The first plastic encapsulation mold 9 is then pressed onto the first surface 11 of the connecting piece 10' to perform the first plastic encapsulation process. It is worth noting that the first plastic encapsulation mold 9 includes a plurality of plastic encapsulation spaces 91 and a plurality of plastic encapsulation openings 92, and the plurality of plastic encapsulation openings 92 are connected to the corresponding plastic encapsulation spaces 91. The plurality of plastic encapsulation spaces 91 spatially correspond to the first surfaces 11 of the plurality of substrates 10, respectively, so that plastic encapsulation materials such as epoxy resin are poured through the corresponding connected plastic encapsulation openings 92 to form a plurality of first plastic encapsulation parts 31, which respectively cover the corresponding first electronic components 21, copper blocks 51 and copper blocks 52. In this embodiment, the first plastic encapsulation mold 9 also includes a plurality of bosses 93, which protrude inwardly to the corresponding plastic encapsulation spaces 91. When a plurality of substrates 10 are combined with the first plastic encapsulation mold 9, each boss 93 is assembled to cover the working area R1 on the first surface 11 of the corresponding substrate 10 (see Figure 6C ), occupying the position of the first magnetic core 41 of the subsequent assembly of the magnetic component 40. Therefore, when a molding material such as an anhydrous resin is poured into the molding space 91 through the molding port 92, each boss 93 can prevent the molding material from filling or occupying the position of the first magnetic core 41 of the subsequent assembly of the magnetic component 40. In other words, the present invention can form a plurality of first molding components 31 through a first molding process by specially designing the first molding mold 9, respectively covering the first electronic component 21, the copper block 51 and the copper block 52 on the first surface 11 of the corresponding substrate 10, and the projections of the plurality of first molding components 31 on the first surface 11 do not overlap with the projections of the corresponding working areas R1 on the first surface 11, that is, they are misaligned to expose the working areas R1 on the first surface 11 of the plurality of substrates 10.

[0089] In this embodiment, after a first molding process forms a plurality of first molding components 31 on the first surface 11 of the corresponding substrate 10, a plurality of second electronic components 22 can be fixedly mounted on the second surface 12 of the corresponding substrate 10 on the connecting piece 10', for example, by surface mounting. Furthermore, a plurality of copper blocks 53 and a plurality of signal connectors 54 can also be mounted on the second surface 12 of the corresponding substrate 10. In this embodiment, a second molding process can be performed by pressing a second molding mold 9' onto the second surface 12 of the connecting piece 10'. In this embodiment, the second molding mold 9' includes a plurality of molding spaces 91' and a plurality of molding openings 92', with the plurality of molding openings 92' communicating with the corresponding molding spaces 91'. The plurality of molding spaces 91' spatially correspond to the second surfaces 12 of the plurality of substrates 10, respectively, so that molding materials such as epoxy resin are poured through the correspondingly connected molding ports 92' to form a plurality of second molding parts 32, which respectively cover the corresponding second electronic components 22, copper blocks 53 and signal connectors 54. In this embodiment, the second molding mold 9' further includes a plurality of bosses 93', which protrude inwardly to the corresponding molding spaces 91'. When the plurality of substrates 10 are combined with the second molding mold 9', each boss 93' is assembled to cover the working area R2 on the second surface 12 of the corresponding substrate 10 (see Figure 6E ), occupying the position of the second magnetic core 42 of the subsequent assembly of the magnetic component 40. Therefore, when a molding material such as epoxy resin is poured into the molding space 91' through the molding port 92', each boss 93' can prevent the molding material from filling or occupying the position of the second magnetic core 42 of the subsequent assembly of the magnetic component 40. In other words, the present invention can form a plurality of second molding components 32 through a second molding process by specially designing the second molding mold 9', respectively covering the second electronic component 22, the copper block 53 and the signal connector 54 on the second surface 12 of the corresponding substrate 10, and the projections of the plurality of second molding components 32 on the first surface 11 do not overlap with the projections of the corresponding working areas R2 on the first surface 11, that is, they are offset to expose the working areas R2 on the second surfaces 12 of the plurality of substrates 10. In this embodiment, the formation of the working areas R1 and R2 on each substrate 10 can be achieved by the design of the first molding mold 9 and the second molding mold 9', without the need for subsequent mechanical processing to remove the molding material. After the plastic encapsulation process, the mold is removed and the magnetic assembly is installed. The connected sheet 10' is then cut and the connecting portion 101 is removed to obtain multiple power modules 1. Of course, the connected sheet 10' can also be cut first, the connecting portion 101 removed to form multiple substrates 10, and then the magnetic assembly 40 is assembled on the corresponding substrates 10, but the present invention is not limited to this.

[0090] Similar to the aforementioned process of encapsulating both sides of a single power module 1, in another embodiment, multiple first electronic components 21, copper blocks 51, and copper blocks 52 can be respectively arranged on the first side 11 of the corresponding substrate 10, and multiple second electronic components 22, copper blocks 53, and signal connectors 54 can be respectively arranged on the second side 12 of the corresponding substrate 10. Then, by pressing, for example, a first encapsulation mold 9 and a second encapsulation mold 9' onto the connecting piece 10', a single encapsulation process is performed to simultaneously form multiple first encapsulation components 31 and multiple second encapsulation components 32, wherein the multiple first encapsulation components 31 respectively cover the corresponding first electronic components 21, copper blocks 51, and copper blocks 52, and the multiple second encapsulation components 32 respectively cover the corresponding second electronic components 22, copper blocks 53, and signal connectors 54. Other steps after encapsulation are the same as in the previous embodiment and will not be repeated here.

[0091] In this embodiment, at least one through-hole 13 of each substrate 10 on the connecting piece 10' is located in the corresponding working area R1, R2. The first magnetic core 41 and the second magnetic core 42 of a magnetic component 40 are respectively placed in the working area R1, R2 of the corresponding substrate 10 through the at least one through-hole 13 of each substrate 10, so that each first plastic sealing member 31 at least partially surrounds the side periphery L0 of the first magnetic core 41 of the corresponding magnetic component 40 (see Figure 4A ), and a gap G1 is formed between the first plastic encapsulation member 31 and the side periphery L0 of the first magnetic core 41 of the corresponding magnetic component 40, and the gap G1 has a minimum gap distance g1. Preferably, the minimum gap distance g1 is greater than or equal to 0.2 mm. In addition, each second plastic encapsulation member 32 also at least partially surrounds the side periphery L0' of the second magnetic core 42 of the corresponding magnetic component 40 (see Figure 4B ), and a gap G2 is formed between the second plastic-encapsulated component 32 and the side periphery L0' of the second magnetic core 42 of the corresponding magnetic component 40, and the gap G2 has a minimum gap distance g2. Preferably, the minimum gap distance g2 is greater than or equal to 0.2 mm. Since the gaps G1 and G2 formed between each plastic-encapsulated component 30 and the corresponding magnetic component are greater than or equal to 0.2 mm, the increase in transformer loss caused by the force between each plastic-encapsulated component 30 and the magnetic component 40 can be effectively avoided. On the other hand, multiple power modules 1 can be plastic-encapsulated together through the joint structure and then the magnetic component 40 can be assembled, which helps to integrate and simplify the manufacturing process of the power module 1, while achieving the purpose of enhancing structural stability and reducing manufacturing costs.

[0092] Figure 13 The third plastic encapsulation mold 9a and the substrate 10a are combined with the third plastic encapsulation mold 9a. 7A to 7B 、 Figure 8 、 Figures 9A to 9BThe first plastic mold 9 and the substrate 10 are similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the third plastic mold 9a omits the boss 93 structure in the first plastic mold 9, and the substrate 10a does not have a through hole. In other words, the space 91a of the mold 9a at the assembly position of the magnetic component 40 is a cavity, and there is no mold obstruction in the cavity. In this embodiment, the third plastic mold 9a (see Figure 13 ) forming a plastic encapsulation material layer 31a on the first surface 11 of the substrate 10, such as Figure 14 As shown, the plastic encapsulation material layer 31a directly covers the space 91a on the first surface 11 where a transformer is to be assembled. In one embodiment, the plastic encapsulation material layer 31a corresponding to the space 91a on the first surface 11 of the substrate 10 in the above embodiment can be removed by, for example, machining to form Figure 15 The structure shown includes a first plastic package component 31, and exposes an operating area R1 for further configuration of a transformer, for example. In one embodiment, a through hole 13 can be formed in the operating area R1 of the substrate 10a by, for example, machining, to form a Figure 6C The structure shown. In other words, in other embodiments, the through-holes 13 on the substrate 10 can be formed, for example, by machining after the molding process. The present invention does not limit the timing of forming the through-holes 13. Thus, the substrate 10a can be designed without any holes or grooves required for assembling the transformer core, and the molding mold 9a does not need to be designed with any avoidance, which can simplify the design of the molding mold 9a. Furthermore, because there is no structure in the cavity corresponding to the space 91a of the molding mold 9a that blocks the flow of the molding material, the molding material can flow smoothly in the molding space 91a, ensuring complete molding and preventing the formation of voids.

[0093] Figure 16 To disclose another embodiment of the substrate structure application. In this embodiment, the substrate 10b and 7A to 7B as well as Figures 9A to 9B The substrate 10 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be described in detail here. 7A to 7B 、 Figures 9A to 9B as well as Figure 16. In this embodiment, the substrate 10b has a smaller-sized through-hole 13a in the working area R1, and the position of the through-hole 13a deviates from the junction of the working area R1 and the first molding component 31. Therefore, during the molding process, the boss 93 of the first molding mold 9, for example, can tightly press the substrate 10b with a larger contact area, and prevent the molding material from leaking and overflowing from the edge of the boss 93 to the through-hole 13a during the molding process. Then, after the molding process completes the manufacturing process of the first molding component 31, the size of the through-hole 13a can be increased according to actual application requirements, such as by mechanical processing, to facilitate the subsequent assembly of the magnetic component 40. Of course, the present invention is not limited to this.

[0094] Figure 17 This is a structural exploded view of the power module of the second preferred embodiment of the present invention. In this embodiment, the power module 1a and Figures 1A to 5 The power module 1 shown is similar, and the same component numbers represent the same components, structures, and functions, which will not be repeated here. In this embodiment, the substrate 10a has solder pads or solder holes (not shown) in the working area R1 or the working area R2. The magnetic component 60 is a discrete magnetic component. The winding and magnetic powder material can be integrated to form a discrete magnetic component 60, or the winding 62 can be wound on the skeleton and combined with the magnetic core 61 to form a discrete magnetic component 60. It is fixed to the first surface 11 of the substrate 10a via the solder pads or solder holes provided in the working area R1 and is electrically connected to the first electronic component 21. In other embodiments, the magnetic component 60 can also be fixed to the second surface 12 of the substrate 10 via the solder pads or solder holes provided in the working area R2 and is electrically connected to the second electronic component 22.

[0095] Figure 18A The third preferred embodiment of the present invention discloses a three-dimensional structure diagram of a power module. In this embodiment, the power module 1b and Figures 1A to 5 The power module 1 shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description thereof will not be repeated here. In this embodiment, the copper block 53a disposed on the second surface 12 of the substrate 10 has a first exposed surface 531a and a second exposed surface 532a, located on a top surface and a side surface of the second plastic encapsulation component 32, respectively. The second exposed surface 532a of the copper block 53a protrudes from the sides of the substrate 10 and the second plastic encapsulation component 32, facilitating solder creep during soldering of the power module 1b, thereby enhancing assembly reliability.

[0096] Figure 18B This is a three-dimensional structural diagram of a power module according to a fourth preferred embodiment of the present invention. In this embodiment, the power module 1c and Figure 18AThe power module 1b shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the copper block 53b arranged on the second side 12 of the substrate 10 has a first exposed surface 531b and a second exposed surface 532b, which are respectively located on a top surface and a side surface of the second plastic package component 32. The first exposed surface 531b is coplanar with the top surface of the second plastic package component 32. The second exposed surface 532b is coplanar with the substrate 10 and the side surface of the second plastic package component 32. In this embodiment, after the second plastic package component 32 is formed by plastic packaging, the second exposed surface 532b of the copper block 53b can be exposed, for example, by polishing the side surface of the second plastic package component 32, and electroplating, as shown. Figure 18B As shown, when the power module 1c is soldered and fixed, the side surface is used for solder creeping, thereby enhancing the reliability of the assembly.

[0097] Figure 18C The third embodiment of the present invention discloses a three-dimensional structure diagram of a power module according to a fifth preferred embodiment of the present invention. Figure 18B The power module 1c shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description thereof will not be repeated here. In this embodiment, the copper block 53c disposed on the second surface 12 of the substrate 10 also has a first exposed surface 531c and a second exposed surface 532c, located on a top surface and a side surface of the second molded component 32, respectively. The first exposed surface 531c is coplanar with the top surface of the second molded component 32. The second exposed surface 532c is coplanar with the substrate 10 and the side surface of the second molded component 32. In this embodiment, the power module 1d also includes a step cut 533c connecting the top and side surfaces of the second molded component 32 to form a stepped structure. The step cut 533c can be milled out at the adjacent junction of the top and side surfaces of the second molded component 32 after the second molded component 32 is formed, and the surface of the step cut is electroplated. Part of the step groove 533c is adjacent to the first exposed surface 531c and the second exposed surface 532c of the copper block 53. Figure 18C As shown. Thus, the stepped structure of copper block 53c further enhances assembly reliability, thereby increasing the solder creep area and improving the assembly reliability of power module 1d. In another embodiment, the side of copper block 53 may not be exposed outside the second plastic encapsulation component 32. Therefore, at the position corresponding to copper block 53, step groove 533c is adjacent to the side of the second plastic encapsulation component 32 and the first exposed surface 531c of copper block 53.

[0098] Figure 19A 1 is a structural exploded view of a power module according to a sixth preferred embodiment of the present invention. Figure 19B This is a three-dimensional structural diagram of a power module according to a sixth preferred embodiment of the present invention. In this embodiment, the power module 1e and Figures 1A to 5 The power module 1 shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description is omitted here. In this embodiment, the magnetic component 60 of the power module 1e can be a discrete magnetic component 60 formed by integrating a winding 62 and a magnetic powder material 61, or a discrete magnetic component 60 formed by winding 62 wound around a magnetic core 61. The peripheral edge L0 of the magnetic component 60 is surrounded by the first molding component 31. In this embodiment, the manufacturing method of the power module 1e is the same as that of the power module 1 in the aforementioned embodiment, except that electronic components can be placed around the working area R1 for assembling the magnetic component 60. If the working area R1 on the substrate 10c is formed by a molding mold, the corresponding boss of the molding mold is positioned offset from the edge of the substrate 10c. During the molding process, the boss tightly presses against the working area R1, preventing the molding material from flowing in. After the molding mold is removed, a cavity is formed for assembling the magnetic component 60. Of course, the present invention is not limited to this.

[0099] As can be seen from the aforementioned embodiments, this embodiment optimizes the structure of the power module 1, allowing the plastic encapsulation component 30 and the magnetic assembly 40 to avoid each other within the mounting space of the substrate 10, effectively addressing the issue of increased transformer losses due to the influence of the plastic encapsulation material. It should be emphasized that the shape, number, combination, and placement of the magnetic assembly 40, as well as the work areas R1 and R2 for assembling and mounting the magnetic assembly 40, can be adjusted based on actual application requirements. The shape, size, and placement sequence of the through-holes 13 can also be adjusted based on actual application requirements. This is not a limitation of the present invention and will not be further elaborated.

[0100] In summary, the present invention provides a power module and a manufacturing method thereof. By avoiding the position of the transformer with the plastic packaging material, a good and stable structural assembly is provided, while simplifying the process and eliminating the need for the packaging material to cover the transformer core, which causes the transformer core to be subjected to stress and causes increased transformer losses. At the same time, copper blocks are embedded in the packaging process to reduce the thermal resistance of the product, further improving the competitiveness of the power module product. Furthermore, by optimizing the design of the packaging mold and avoiding the installation position of the magnetic component, the plastic packaging process can be carried out before the magnetic core component of the transformer is assembled on the substrate, for example, so that the plastic packaging material does not closely contact the magnetic core component of the transformer, effectively avoiding the problem of increased transformer losses. Furthermore, multiple power modules can be plastic-sealed together through a connecting structure and then the magnetic components or cores can be assembled, which helps to integrate and simplify the manufacturing process of the power module, while achieving the purpose of enhancing structural stability and reducing manufacturing costs.

[0101] The present invention can be modified in various ways by those skilled in the art without departing from the scope of protection of the appended claims.

Claims

1. A power module, comprising: A substrate comprising a first surface, a second surface, and an operating area, wherein the first surface and the second surface are opposite to each other, and the operating area is disposed on the first surface or the second surface; an electronic component disposed on the substrate; a magnetic component disposed in the operating area of ​​the substrate and having a peripheral edge on one side, wherein the magnetic component is disposed at the edge of the substrate; a plastic encapsulation component disposed on the substrate, covering the electronic component and at least partially surrounding the side periphery of the magnetic component, wherein the plastic encapsulation component and the projection of the operating area on the first surface of the substrate do not overlap, and a gap is formed between the plastic encapsulation component and the side periphery of the magnetic component, wherein the power module further includes a copper block disposed on the substrate, wherein the copper block includes a first copper block directly disposed on the substrate, wherein the first copper block is exposed outside the plastic encapsulation component and forms an input or output pin of the power module, wherein the first copper block has a first exposed surface and a second exposed surface, wherein the first exposed surface is located on a top surface of the plastic encapsulation component, and the second exposed surface is located on a side surface of the plastic encapsulation component; and A step groove connects the top surface of the plastic packaging component and the side surface of the plastic packaging component to form a stepped structure. 2 . The power module as claimed in claim 1 , wherein the gap is greater than or equal to 0.2 mm. The power module as claimed in claim 1 , wherein the substrate is a printed circuit board. 4 . The power module as claimed in claim 1 , wherein the substrate further comprises a through-hole, the through-hole being located in the operating area and passing through the first surface and the second surface. 5 . The power module according to claim 4 , wherein the magnetic assembly comprises a first magnetic core and a second magnetic core, and the first magnetic core and the second magnetic core are fastened to the substrate through the through-hole. The power module according to claim 1 , wherein the plastic encapsulation component surrounds at least half of the side periphery. 7 . The power module according to claim 1 , wherein the side periphery is four side peripheries of the magnetic component, and the plastic packaging component surrounds at least two of the four side peripheries.

8. The power module according to claim 1 , wherein the electronic component is disposed on the first surface of the substrate, the plastic encapsulation member covers the electronic component, and the plastic encapsulation member and the magnetic component respectively cover the first surface of the substrate, wherein a height of the magnetic component on the first surface is less than or equal to a height of the plastic encapsulation member on the first surface. 9 . The power module according to claim 1 , wherein the electronic component is disposed on the first surface and the second surface of the substrate, and the plastic packaging component covers the electronic component on the first surface and the second surface of the substrate. 10 . The power module according to claim 1 , wherein the copper block comprises a second copper block disposed on the electronic component or directly on the substrate and exposed outside the plastic package component to form a heat dissipation surface. 11 . The power module according to claim 1 , wherein the magnetic component is a discrete magnetic component disposed in the operating area.

12. A method for manufacturing a power module, comprising the steps of: (a) providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to each other, and at least one working area, wherein the at least one working area is disposed on the first surface or the second surface; (b) providing an electronic component disposed on the substrate; (b1) providing a copper block disposed on the substrate, wherein the copper block comprises a first copper block directly disposed on the substrate; (c) forming a plastic encapsulation component, disposed on the substrate, to cover the electronic component, wherein a projection of the plastic encapsulation component on the first surface does not overlap with a projection of the working area on the first surface, wherein the first copper block is exposed outside the plastic encapsulation component to form an input or output pin of the power module, wherein the first copper block has a first exposed surface and a second exposed surface, wherein the first exposed surface is located on a top surface of the plastic encapsulation component, and the second exposed surface is located on a side surface of the plastic encapsulation component; (c4) milling a step groove at the adjacent junction of the top surface and the side surface of the plastic-encapsulated component; and (d) providing a magnetic component disposed in the operating area on the substrate so that the plastic encapsulation component at least partially surrounds a side periphery of the magnetic component, wherein a gap is formed between the plastic encapsulation component and the side periphery of the magnetic component, wherein the magnetic component is disposed at an edge of the substrate. 13 . The method for manufacturing a power module as claimed in claim 12 , wherein the step (a) further comprises a step (a0) of forming a through hole on the substrate, the through hole passing through the first surface and the second surface and located in the working area. 14 . The method for manufacturing a power module according to claim 12 , wherein the copper block comprises a second copper block disposed on the electronic component or directly on the substrate and exposed outside the plastic package component to form a heat dissipation surface.

15. The method for manufacturing a power module according to claim 12, wherein: In step (b), the electronic component is disposed on the first surface and / or the second surface of the substrate; correspondingly, in step (c), the plastic encapsulation component covers the electronic component on the first surface and / or the plastic encapsulation component covers the electronic component on the second surface.

16. The method for manufacturing a power module according to claim 12, wherein: The step (c) comprises the steps of: (c0) providing a plastic encapsulation mold having a boss covering the working area on the substrate; (c1) forming the molded component through a molding process; and (c2) removing the plastic encapsulation mold to expose the working area on the substrate.

17. The method for manufacturing a power module according to claim 12, wherein: The step (c) comprises the steps of: (c0) providing a molding mold having a molding space, wherein at least a portion of the working area is exposed in the molding space; (c1) filling the molding space with a molding material through a molding process; (c2) removing the plastic encapsulation mold; as well as (c3) Partially removing the molding material to completely expose the working area to form the molding component. 18 . The method for manufacturing a power module according to claim 12 , wherein the step (d) further comprises a step ( d0 ) of forming a through hole, wherein the through hole passes through the first surface and the second surface and is located in the working area. 19 . The method for manufacturing a power module as claimed in claim 12 , wherein the gap is greater than or equal to 0.2 mm. 20 . The method for manufacturing a power module according to claim 12 , wherein the plastic encapsulation component surrounds at least half of the side periphery.

21. A method for manufacturing a power module, comprising the steps of: (a) providing a continuous sheet comprising a plurality of substrates arranged in an array, wherein each substrate comprises a first surface, a second surface, and a working area opposite to each other; (b) providing a plurality of electronic components, each disposed on the plurality of substrates, and the plurality of electronic components corresponding to the plurality of working areas; (b1) providing a plurality of copper blocks, each disposed on the plurality of substrates, wherein the plurality of copper blocks includes a plurality of first copper blocks, each disposed directly on the plurality of substrates; (c) forming a plurality of plastic-encapsulated components through a single plastic-encapsulation process, each of which covers the corresponding electronic component, wherein a projection of each plastic-encapsulated component on the first surface of the substrate does not overlap with a projection of the corresponding working area on the first surface, wherein the plurality of first copper blocks are respectively exposed outside the plurality of plastic-encapsulated components to form an input or output pin of the power module, wherein the first copper block has a first exposed surface and a second exposed surface, wherein the first exposed surface is located on a top surface of the plastic-encapsulated component, and the second exposed surface is located on a side surface of the plastic-encapsulated component; (c4) milling a step groove at the adjacent junction of the top surface and the side surface of the plastic-encapsulated component; and (d) providing a plurality of magnetic components, each magnetic component being disposed in the corresponding operating area so that the corresponding plastic-encapsulated component at least partially surrounds a side periphery of the magnetic component, wherein a gap is formed between the corresponding plastic-encapsulated component and the side periphery of the magnetic component.

22. The method for manufacturing a power module according to claim 21, wherein the step (d) further comprises a step (d1) of cutting the connected piece to separate the plurality of substrates.

Images