SMD Crystal Fully Automatic Packaging Machine

Abstract

This invention belongs to the field of automation equipment technology, and particularly relates to a fully automatic SMD crystal packaging machine, including a first detection CCD, a second detection CCD, a material replenishment module, and a conveying module for conveying a carrier belt. A feeding module is provided on one side of the conveying module for sequentially placing crystals onto the carrier belt. The first and second detection CCDs are sequentially arranged along the conveying direction of the conveying module to detect crystals at positions before and after the conveying module. The material replenishment module is located on one side of the conveying module to remove defective crystals at the rear position and place crystals from the front position at the rear position. The detection CCDs take photos of crystals at both the front and rear positions, and multiple tests are performed on crystals at different positions to improve the stability of the crystal loading process and improve the quality of the finished product.

Description

Technical Field

[0001] This invention belongs to the field of automation equipment technology, and in particular relates to a fully automatic packaging machine for SMD crystals. Background Technology

[0002] Surface mount devices (SMDs) are relatively mature components in the electronics industry. However, due to their special shape, the problems of product testing and automated packaging cannot be well solved. At present, the testing and packaging work is still in the stage of manual material loading, which is inefficient. In addition, due to manual involvement, errors are inevitable, such as mixing defective products with good products, or placing the carrier tape in the tape and reel in the wrong direction. Some products also have serious scratches on the surface and poor appearance, which affect product quality and packaging effect. Summary of the Invention

[0003] The purpose of this invention is to provide a fully automatic SMD crystal packaging machine, which aims to solve the problem of poor SMD crystal packaging effect in the prior art.

[0004] To achieve the above objectives, this invention provides a fully automatic SMD crystal packaging machine, comprising a first detection CCD, a second detection CCD, a material replenishment module, and a conveying module for conveying a carrier belt. A feeding module is provided on one side of the conveying module for sequentially placing crystals onto the carrier belt. The first and second detection CCDs are sequentially arranged along the conveying direction of the conveying module to detect crystals at positions before and after the conveying module. The material replenishment module is located on one side of the conveying module to remove defective crystals at the later position and place crystals from the earlier position into the later position.

[0005] Optionally, the feeding module includes a picking arm, a feeding base, an XY-axis positioning stage, and a turntable for placing crystals. The XY-axis positioning stage is movably connected to the feeding base. The feeding base is provided with a first driving component, which is connected to the XY-axis positioning stage and used to drive the XY-axis positioning stage to move. The turntable is rotatably connected to the XY-axis positioning stage. The XY-axis positioning stage is provided with a second driving component, which is connected to the turntable and used to drive the turntable to rotate. The picking arm is movably disposed between the feeding base and the conveying module to convey the crystals placed on the turntable to the carrier belt of the feeding module.

[0006] Optionally, the feeding module further includes a positioning CCD for positioning the crystal on the turntable, the positioning CCD being electrically connected to the first driving component and the second driving component respectively.

[0007] Optionally, the turntable is provided with a clamping element, and the turntable has a clearance space in the middle; the clearance space is provided with a material ejector assembly, the material ejector assembly includes a material ejector cylinder and a material ejector block, the material ejector cylinder is connected to the XY axis positioning platform, and the material ejector block is connected to the piston rod of the material ejector cylinder.

[0008] Optionally, one side of the conveying module is further provided with a film feeding module for conveying the film to the carrier belt surface and a belt pressing module for fixing the film to the carrier belt surface.

[0009] Optionally, the conveying module includes a conveyor platform, a first pulley, a second pulley, a belt, and a pulley drive motor. The first pulley and the second pulley are rotatably connected to the conveyor platform. The belt is wound around the first pulley and the second pulley. The pulley drive motor is connected to the first pulley and is used to drive the first pulley to rotate. The first detection CCD and the second detection CCD are both located on the upper side of the belt. A guide platform is also connected to the conveyor platform. The adhesive film in the adhesive film feeding module is adhered to the carrier belt after passing through the gap between the bottom surface of the guide platform and the top surface of the belt.

[0010] Optionally, the first pulley is provided with a first clamping wheel for clamping the carrier belt on the side away from the second pulley, and the second pulley is provided with a second clamping wheel for clamping the carrier belt on the side away from the first pulley.

[0011] Optionally, the belt pressing module includes a pressing table, a pressing cylinder, and a pressing block. The pressing cylinder is connected to the pressing table, and the pressing block is connected to the piston rod of the pressing cylinder and located on the upper side of the belt.

[0012] Optionally, the film feeding module includes a film support, a film roll, a guide block, and multiple guide wheels; the film roll and each of the guide wheels are rotatably connected to the film support.

[0013] Optionally, the material replenishment module includes a material replenishment swing arm, which is disposed on one side of the conveying module and is electrically connected to the second detection CCD.

[0014] The above-mentioned one or more technical solutions in the fully automatic SMD crystal packaging machine provided in this invention embodiment have at least one of the following technical effects: the carrier belt has multiple cavities for accommodating crystals. The carrier belt is placed on the conveyor module, and the feeding module clamps the crystals into the cavities of the carrier belt. At this time, the crystals are positioned in front of the conveyor module. The first detection CCD takes a picture of the crystals in the front position for the first detection. If the detection result is unsatisfactory, the crystals are removed and another crystal is clamped back into the cavity of the carrier belt for continued detection. If the detection result is satisfactory, the conveyor module conveys the carrier belt to the rear position, and the feeding module continues to clamp other crystals to the front position of the conveyor module and place them... The crystal is moved to another cavity; the second detection CCD takes a picture of the crystal placed in the rear position for a second inspection. If the crystal in the rear position fails the inspection, the replenishment module removes the crystal from the rear position and clamps the crystal in the front position to the rear position for continued inspection. The feeding module clamps another crystal back to the front position, and the first detection CCD takes a picture again for testing. If the crystal in the rear position passes the inspection, the conveyor module continues to transport the carrier belt to the next processing station. The detection CCD is set to take pictures of the crystals in both the front and rear positions for testing. Multiple inspections of crystals in different positions improve the stability of the crystal loading process and improve the quality of the finished product. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the fully automatic SMD crystal packaging machine provided in an embodiment of the present invention.

[0017] Figure 2 This is a front view of the fully automatic SMD crystal packaging machine provided in an embodiment of the present invention.

[0018] Figure 3 This is a top view of the fully automated SMD crystal packaging machine provided in an embodiment of the present invention.

[0019] The following are the labeling elements in the figure:

[0020] 10—First detection CCD; 20—Second detection CCD; 30—Conveyor module

[0021] 40—Feeding Module; 41—Turntable; 42—XY Axis Positioning Table

[0022] 43—Feeding base; 44—Positioning CCD; 45—Material picking arm

[0023] 50—Film feeding module; 60—Band hot pressing module; 70—Material replacement module. Detailed Implementation

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The following description is based on the accompanying drawings. Figures 1-3 The described embodiments are exemplary and intended to explain embodiments of the invention, and should not be construed as limiting the invention.

[0025] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0028] In one embodiment of the present invention, such as Figures 1-3As shown, an SMD crystal fully automatic packaging machine is provided, including a first detection CCD 10, a second detection CCD 20, a material replenishment module 70, and a conveying module 30 for conveying a carrier belt. A feeding module 40 for sequentially placing crystals onto the carrier belt is provided on one side of the conveying module 30. The first detection CCD 10 and the second detection CCD 20 are sequentially arranged along the conveying direction of the conveying module 30 to detect crystals at two positions before and after the conveying module 30. The material replenishment module 70 is provided on one side of the conveying module 30 to remove crystals that fail at the later position and place crystals at the earlier position into the later position.

[0029] In this embodiment of the invention, the carrier tape has multiple cavities for accommodating crystals. The carrier tape is placed onto the conveying module 30, and the feeding module 40 clamps the crystals into the cavities of the carrier tape. At this time, the crystals are positioned in front of the conveying module 30. The first detection CCD 10 takes a picture of the crystal in the front position for initial detection. If the detection result is unsatisfactory, the crystal is removed, and another crystal is clamped back into the carrier tape cavity for further detection. If the detection result is satisfactory, the conveying module 30 conveys the carrier tape to a rear position, and the feeding module 40 continues to clamp other crystals in front of the conveying module 30 and place them into another cavity. The second detection CCD 20... The crystal placed in the rear position is photographed for a second inspection. If the crystal in the rear position fails the inspection, the replacement module 70 removes the crystal from the rear position and clamps the crystal in the front position to the rear position for continued inspection. The feeding module 40 clamps another crystal back to the front position, and the first inspection CCD 10 performs another photographic test. If the crystal in the rear position passes the inspection, the conveyor module 30 continues to convey the carrier belt to the next processing station. The inspection CCD is set to photograph and test the crystals in both the front and rear positions, and the crystals in different positions are inspected multiple times to improve the stability of the crystal loading process and improve the quality of the finished product.

[0030] In another embodiment of the present invention, the feeding module 40 of the fully automatic SMD crystal packaging machine includes a picking arm 45, a feeding base 43, an XY-axis positioning stage 42, and a turntable 41 for placing crystals. The XY-axis positioning stage 42 is movably connected to the feeding base 43. The feeding base 43 is provided with a first driving component, which is connected to the XY-axis positioning stage 42 and used to drive the XY-axis positioning stage 42 to move. The turntable 41 is rotatably connected to the XY-axis positioning stage 42. The XY-axis positioning stage 42 is provided with a second driving component, which is connected to the turntable 41 and used to drive the turntable 41. The material-picking arm 45 is movably disposed between the feeding base 43 and the conveying module 30 to transport the crystal placed on the turntable 41 to the carrier belt of the feeding module 40. The first drive component drives the XY-axis positioning stage 42 to move on the horizontal plane. The first drive component drives the XY-axis positioning stage 42 to move away from the material-picking arm 45 so as to fix the crystal ring containing the crystal on the turntable 41. After the crystal ring is fixed, the first drive component drives the XY-axis positioning stage 42 to move closer to the material-picking arm 45. The second drive component drives the turntable 41 to rotate, rotating the crystal ring to a suitable picking angle so that the material-picking arm 45 can pick up the crystal.

[0031] Specifically, the first driving component can be a first linear module and a second linear module. The second linear module is connected to the slider of the first linear module, and the XY-axis positioning stage 42 is connected to the slider of the second linear module. The first linear module drives the XY-axis positioning stage 42 to move along the X-axis, and the second linear module drives the XY-axis positioning stage 42 to move along the Y-axis. The first linear module and the second linear module cooperate to drive the XY-axis positioning stage 42 to move in the plane formed by the X-axis and the Y-axis.

[0032] Specifically, the second drive component can be a rotary motor, which is connected to the XY axis positioning stage 42. The output end of the rotary motor is connected to the turntable 41 to drive the turntable 41 to rotate to the desired position.

[0033] In another embodiment of the present invention, the feeding module 40 of the fully automatic SMD crystal packaging machine further includes a positioning CCD 44 for positioning the crystals on the turntable 41. The positioning CCD 44 is electrically connected to the first driving component and the second driving component respectively. The positioning CCD 44 takes pictures of the crystals on the wafer ring for positioning and screening. The first driving component and the second driving component cooperate to move the turntable 41 to the optimal pick-up and put-down position so that the pick-up arm 45 can pick up the material, thereby realizing automatic positioning and picking up with high efficiency.

[0034] In another embodiment of the present invention, the turntable 41 of the fully automatic SMD crystal packaging machine is provided with a clamping member, and the center of the turntable 41 is provided with a clearance space; a top material assembly is provided in the clearance space, the top material assembly includes a top material cylinder and a top block, the top material cylinder is connected to the XY axis positioning stage 42, and the top block is connected to the piston rod of the top material cylinder; wherein, the crystal ring includes an outer ring and a soft blue film covering the outer ring, and each crystal is arranged sequentially on the soft blue film. During the material picking process, the top material cylinder lifts the soft blue film, making it easier for the material picking arm 45 to pick up the crystal and reducing the situation of unsuccessful material picking.

[0035] Specifically, the clamping component includes a positioning flange and a rotating clamp. The positioning flange is fixedly connected to the edge of the turntable 41, and the middle part of the rotating clamp is rotatably connected to the other edge of the turntable 41. The rotating clamp is positioned opposite to the positioning flange. A spring is connected to the first end of the rotating clamp, and the spring is connected to the turntable 41 and is used to push the first end of the rotating clamp to swing away from the positioning flange. The second end of the rotating clamp swings towards the positioning flange to clamp the wafer ring. The XY-axis positioning stage 42 is also provided with a pushing element, which is located on one side of the rotating clamp. The pushing element pushes the first end of the rotating clamp, which overcomes the spring force and swings towards the positioning protrusion. This causes the second end of the rotating clamp to swing away from the positioning protrusion, placing the wafer ring onto the turntable 41. One end of the wafer ring abuts against the positioning protrusion. After the wafer ring is placed, the pushing element removes the force on the first end of the rotating clamp. The spring pushes the first end of the rotating clamp, causing it to swing away from the positioning protrusion. The second end of the rotating clamp swings towards the positioning protrusion and abuts against the other end of the wafer ring, thus fixing the wafer ring.

[0036] Specifically, the picking arm 45 includes a picking motor, a picking arm, and a picking suction cup. The picking motor is mounted on the feeding base 43. One end of the picking arm is connected to the output end of the picking motor, and the other end of the picking arm is connected to the picking suction cup. The picking motor drives the picking arm to swing back and forth between the feeding base 43 and the conveying module 30. The picking suction cup picks up the crystals on the wafer ring or picks up the crystals that fail the test at the front position of the conveying module 30.

[0037] In another embodiment of the present invention, the conveying module 30 of the fully automatic SMD crystal packaging machine is further provided with a film feeding module 50 for conveying the film to the carrier belt surface and a belt pressing module 60 for fixing the film to the carrier belt surface; the film is attached to the carrier belt section that has passed two photographic inspections, and the belt pressing module 60 then heat-presses the film to fix it on the carrier belt, thus completing the packaging process of the SMD crystal.

[0038] Specifically, one side of the conveying module 30 is also provided with a carrier tape finished material roll and a cutting module. After the carrier tape is hot-pressed, it is wound on the carrier tape finished material roll. When the carrier tape reaches the preset length, the cutting module cuts the carrier tape and replaces the carrier tape finished material roll to continue winding the carrier tape.

[0039] In another embodiment of the present invention, the conveying module 30 of the fully automatic SMD crystal packaging machine includes a conveyor platform, a first pulley, a second pulley, a belt, and a pulley drive motor. The first pulley and the second pulley are rotatably connected to the conveyor platform. The belt is wound around the first pulley and the second pulley. The pulley drive motor is connected to the first pulley and is used to drive the first pulley to rotate. The first detection CCD 10 and the second detection CCD 20 are both located on the upper side of the belt. A guide platform is also connected to the conveyor platform. The adhesive film in the adhesive film feeding module 50 is adhered to the carrier belt after passing through the gap between the bottom surface of the guide platform and the top surface of the belt. An empty material roll for storing empty material rolls is rotatably arranged on the conveyor platform. After the empty material rolls come out, the empty material rolls adhere to the surface of the belt and move with the belt.

[0040] In another embodiment of the present invention, the first pulley of the fully automatic SMD crystal packaging machine is provided with a first pressing wheel for pressing the carrier belt on the side away from the second pulley, and the second pulley is provided with a second pressing wheel for pressing the carrier belt on the side away from the first pulley; the empty carrier belt passes through the gap between the first pressing wheel and the belt, and the carrier belt after hot pressing passes through the gap between the second pressing wheel and the belt and is wound into the carrier belt finished material roll. The first pressing wheel and the second pressing wheel make the carrier belt conveying more stable.

[0041] Specifically, a cover plate is also provided on the conveyor platform. The cover plate is located between the front and rear positions of the conveyor module 30 to reduce the interference of the crystal between the front and rear positions on the first detection CCD10 and the second detection CCD20, avoid false detection, and improve the detection accuracy.

[0042] In another embodiment of the present invention, the hot pressing module 60 of the fully automatic SMD crystal packaging machine includes a hot pressing table, a hot pressing cylinder, and a hot pressing block. The hot pressing cylinder is connected to the hot pressing table, and the hot pressing block is connected to the piston rod of the hot pressing cylinder and disposed on the upper side of the belt. The hot pressing block is connected to a hot pressing regulator so that the temperature of the hot pressing block is adjusted to a preset stable value. The hot pressing cylinder drives the hot pressing block to move, so that the hot pressing block presses the film and fixes the film on the carrier belt, thereby encapsulating the crystal in the carrier belt cavity.

[0043] In another embodiment of the present invention, the film feeding module 50 of the fully automatic SMD crystal packaging machine includes a film support, a film roll, a guide block and a plurality of guide wheels; the film roll and each of the guide wheels are rotatably connected to the film support.

[0044] In another embodiment of the present invention, the replenishment module 70 of the fully automatic SMD crystal packaging machine includes a replenishment swing arm, which is disposed on one side of the conveying module 30 and is electrically connected to the second detection CCD 20; wherein, the replenishment module 70 further includes a third drive component, which drives the replenishment swing arm to move to remove the crystal at the rear position when the crystal at the rear position fails the photo detection, and places the crystal at the rear position in the rear position, and the second detection CCD 20 performs detection again.

[0045] Specifically, the fully automatic SMD crystal packaging machine also includes a display module, which is electrically connected to the first detection CCD10, the second detection CCD20 and the positioning CCD44 respectively. The display module is used to display the CCD's imaging results and feed back the detection structure to the display module, so that the staff can monitor it.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic packaging machine for SMD crystals, characterized in that: The device includes a first detection CCD, a second detection CCD, a material replenishment module, and a conveying module for conveying a carrier belt. A feeding module is provided on one side of the conveying module for sequentially placing each crystal onto the carrier belt. The first detection CCD and the second detection CCD are sequentially arranged along the conveying direction of the conveying module to detect crystals at two positions before and after the conveying module. The material replenishment module is located on one side of the conveying module to remove crystals that fail at the later position and place crystals from the earlier position into the later position. The conveying module is also provided with a cover plate, which is located between the front and rear positions of the conveying module; The feeding module includes a picking arm, a feeding base, an XY-axis positioning stage, and a turntable for placing crystals. The XY-axis positioning stage is movably connected to the feeding base. The feeding base is provided with a first driving component, which is connected to the XY-axis positioning stage and used to drive the XY-axis positioning stage to move. The turntable is rotatably connected to the XY-axis positioning stage. The XY-axis positioning stage is provided with a second driving component, which is connected to the turntable and used to drive the turntable to rotate. The picking arm is movably disposed between the feeding base and the conveying module to convey the crystals placed on the turntable to the carrier belt of the feeding module. The feeding module also includes a positioning CCD for positioning the crystal on the turntable, and the positioning CCD is electrically connected to the first driving component and the second driving component respectively. The turntable is equipped with a clamping device, and the turntable has a clearance space in the middle. The clearance space is equipped with a material ejector assembly, which includes a material ejector cylinder and a material ejector block. The material ejector cylinder is connected to the XY axis positioning platform, and the material ejector block is connected to the piston rod of the material ejector cylinder. The clamping component includes a positioning flange and a rotating clamp. The positioning flange is fixedly connected to the edge of the turntable, and the middle part of the rotating clamp is rotatably connected to the other edge of the turntable. The rotating clamp is positioned opposite to the positioning flange. A spring is connected to the first end of the rotating clamp, and the spring is connected to the turntable. The XY-axis positioning stage is also equipped with a pushing element. The pushing element pushes the first end of the rotating clamp to swing towards the positioning flange, causing the second end of the rotating clamp to swing away from the positioning flange, placing the wafer ring on the turntable. One end of the wafer ring abuts against the positioning flange. After the wafer ring is placed, the pushing element removes the force on the first end of the rotating clamp. The spring pushes the first end of the rotating clamp, causing the first end of the rotating clamp to swing away from the positioning flange, and the second end of the rotating clamp swings towards the positioning flange and abuts against the other end of the wafer ring, fixing the wafer ring.

2. The fully automatic SMD crystal packaging machine according to claim 1, characterized in that: One side of the conveying module is also provided with a film feeding module for conveying the film to the carrier belt surface and a belt pressing module for fixing the film to the carrier belt surface.

3. The fully automatic SMD crystal packaging machine according to claim 2, characterized in that: The conveying module includes a conveyor platform, a first pulley, a second pulley, a belt, and a pulley drive motor. The first pulley and the second pulley are rotatably connected to the conveyor platform. The belt is wound around the first pulley and the second pulley. The pulley drive motor is connected to the first pulley and is used to drive the first pulley to rotate. The first detection CCD and the second detection CCD are both located on the upper side of the belt. A guide platform is also connected to the conveyor platform. The adhesive film in the adhesive film feeding module is adhered to the carrier belt after passing through the gap between the bottom surface of the guide platform and the top surface of the belt.

4. The fully automatic SMD crystal packaging machine according to claim 3, characterized in that: The first pulley has a first clamping wheel for clamping the carrier belt on the side away from the second pulley, and the second pulley has a second clamping wheel for clamping the carrier belt on the side away from the first pulley.

5. The fully automatic SMD crystal packaging machine according to claim 3, characterized in that: The belt pressing module includes a pressing table, a pressing cylinder, and a pressing block. The pressing cylinder is connected to the pressing table, and the pressing block is connected to the piston rod of the pressing cylinder and located on the upper side of the belt.

6. The fully automatic SMD crystal packaging machine according to claim 3, characterized in that: The film feeding module includes a film support, a film roll, a guide block, and multiple guide wheels; the film roll and each of the guide wheels are rotatably connected to the film support.

7. The fully automatic SMD crystal packaging machine according to any one of claims 1 to 6, characterized in that: The material replenishment module includes a material replenishment swing arm, which is located on one side of the conveying module and is electrically connected to the second detection CCD.

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