Protection Circuit, MCU Chip and Consumable Chip

Abstract

An embodiment of the present application provides a protection circuit, an MCU chip, and a consumable chip. The protection circuit includes a first contact, a second contact, and a metal layer. Among them, both the first contact and the second contact are disposed on the signal layer of the system circuit. The first contact is used to receive an electrostatic signal, and the second contact is used to connect to a preset port of a preset integrated circuit module of the system circuit. The metal layer is embedded in the system circuit to form an additional equivalent capacitance. And the metal layer is respectively connected to the first contact and the second contact to form a release path for the electrostatic signal, so as to achieve the purpose of electrostatic release and consumption, improve the effect of electrostatic release, effectively prevent electrostatic attacks, and thus improve the security of the system circuit data.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of integrated circuit technology, and in particular, to a protection circuit, an MCU chip, and a consumable chip. Background Art

[0002] With the continuous progress of semiconductor technology, more and more functions can be integrated on a chip. When it is necessary to power a wafer by a battery, since the battery is exposed externally, the wafer is vulnerable to Electro-Static Discharge (ESD) attacks, resulting in the loss of data stored in the wafer and the inability of the corresponding functions of the chip to operate properly.

[0003] In order to protect the data in the wafer, it is necessary to design an electrostatic protection circuit. Existing electrostatic protection circuits often need to add passive components, such as capacitors, inductors, magnetic beads, etc., or active components, such as diodes, etc., close to the chip ports. When static electricity occurs, the passive components or active components are used to consume or store the static electricity, thereby preventing the static electricity from attacking the chip and causing data loss.

[0004] The above methods for preventing static electricity attacks require adding components, resulting in high costs, and the static electricity absorption ability is limited, and the anti-static effect is not good. Summary of the Invention

[0005] The embodiments of the present application provide a protection circuit, an MCU chip, and a consumable chip. By means of a path formed by two contacts and a metal layer provided on the signal layer of the system circuit, static electricity is released and consumed, and the static electricity release effect is good, achieving the effect of preventing static electricity attacks and improving the security of data stored on the system circuit.

[0006] In a first aspect, the embodiments of the present application provide a protection circuit, which includes: a first contact, a second contact, and a metal layer; wherein, both the first contact and the second contact are provided on the signal layer of the system circuit, the first contact is used for receiving an electrostatic signal, and the second contact is used for connecting to a preset port of a preset integrated circuit module of the system circuit; the metal layer is embedded in the system circuit to form an additional equivalent capacitance; and the metal layer is respectively connected to the first contact and the second contact to form a release path for the electrostatic signal.

[0007] In a possible implementation manner, the metal layer includes a first metal layer and a second metal layer, the first metal layer includes an independent first part and a second part, the first part is connected to the first contact, the second part is connected to the second contact, and the first contact, the first metal layer, the second metal layer, and the second contact are connected in sequence to form a release path for the electrostatic signal.

[0008] In a possible implementation manner, the metal layer is a copper foil layer.

[0009] In a possible implementation manner, the signal layer of the system circuit includes a first signal layer and a second signal layer. The first contact and the second contact are both disposed on the first signal layer, and the metal layer is disposed between the first signal layer and the second signal layer.

[0010] In a possible implementation manner, the first contact and the second contact are both disposed on a preset integrated circuit module of the first signal layer or the second signal layer of the system circuit.

[0011] In a possible implementation manner, the first contact is disposed on the first signal layer of the system circuit, and the second contact is disposed on the second signal layer of the system circuit.

[0012] In a second aspect, an embodiment of the present application further provides an MCU chip, which includes a system circuit and a protection circuit provided in any one of the corresponding embodiments of the first aspect of the present application.

[0013] In a possible implementation manner, the preset port of the preset integrated circuit module of the system circuit is the power supply port or the general-purpose I / O port of the MCU chip.

[0014] In a third aspect, an embodiment of the present application further provides a consumable chip, which includes a system circuit and a protection circuit provided in any one of the corresponding embodiments of the first aspect of the present application.

[0015] In a possible implementation manner, the preset port of the preset integrated circuit module of the system circuit is the power supply port, the clock port, the reset port or the data port of the consumable chip.

[0016] A protection circuit, an MCU chip and a consumable chip provided by an embodiment of the present application. The protection circuit includes an electrostatic discharge path composed of a first contact, a second contact and a metal layer. The first contact and the second contact are both disposed on the signal layer of the system circuit. The second contact is connected to the preset port of the preset integrated circuit module. The electrostatic signal enters the electrostatic discharge path through the first contact for consumption and release, thereby greatly reducing the static electricity reaching the system circuit, effectively preventing the electrostatic attack on the system circuit, and improving the security of the data stored on the system circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0018] Figure 1 It is an application scenario diagram provided by an embodiment of the present application;

[0019] Figure 2 Schematic diagram of the protection circuit provided by an embodiment of the present application;

[0020] Figure 3 Schematic diagram of the protection circuit provided by another embodiment of the present application;

[0021] Figure 4 Schematic diagram of the protection circuit provided by another embodiment of the present application;

[0022] Figure 5 Schematic diagram of the protection circuit provided by another embodiment of the present application;

[0023] Figure 6 Schematic diagram of the protection circuit provided by another embodiment of the present application;

[0024] Figure 7 Schematic diagram of a structure of an MCU chip provided by an embodiment of the present application;

[0025] Figure 8 Schematic diagram of a structure of a consumable chip provided by an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 100: System circuit;

[0028] 101: First signal layer;

[0029] 102: Second signal layer;

[0030] 110: Preset component;

[0031] 120: Preset integrated circuit module;

[0032] 200: Protection circuit;

[0033] 210: First contact;

[0034] 220: Second contact;

[0035] 230: Metal layer;

[0036] 231: First metal layer;

[0037] 2311: First part of the first metal layer 231;

[0038] 2312: Second part of the first metal layer 231;

[0039] 232: Second metal layer;

[0040] 300: MCU chip;

[0041] 400: Consumable chip.

[0042] Through the above-mentioned accompanying drawings, specific embodiments of the present application have been shown, and there will be a more detailed description hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0043] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0044] The technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail below with specific embodiments. These several specific embodiments below can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the accompanying drawings.

[0045] The application scenario of the embodiments of the present application will be explained below:

[0046] Figure 1 An application scenario diagram provided for the embodiments of the present application is as Figure 1 shown. The system circuit 100 includes a first module IC_A and a second module IC_B. When the system circuit 100 is under electrostatic attack, the electrostatic signal enters through the contact E on the PCB (Printed Circuit Board) where the system circuit 100 is located, reaches the pin D of IC_B, and then reaches the pin F of IC_A after being attenuated by IC_B. Since this path is not grounded, the electrostatic signal is consumed through the exchange between the PCB and the atmosphere, and through the thermoelectric conversion of each component on the path, that is, the preset components 110, IC_A, and IC_B, which may cause damage to the components on the board or loss of the data stored thereon.

[0047] To prevent the components of the system circuit 100 from being attacked by static electricity, the prior art often adds a preset component 110, such as a passive component or an active component, at pin D, so as to increase the consumption of static electricity or store static electricity, thereby reducing the energy of the static electricity reaching the first module IC_A and the second module IC_B of the system circuit 100 and playing a protective role. However, the method of consuming static electricity by adding components has a high cost, a single consumption method and poor effects.

[0048] To solve the above problems, that is, to improve the anti-static attack effect of the system circuit, the present application provides an electrostatic discharge path composed of a first contact, a second contact and a metal layer. While increasing the transmission path of the static electricity signal and improving the static electricity consumption, an equivalent capacitance is added, and this equivalent capacitance can store the static electricity energy, thereby greatly reducing the amount of static electricity on the wafer of the system circuit and improving the security of the system circuit.

[0049] Figure 2 The structural schematic diagram of the protection circuit provided by an embodiment of the present application is as follows. Figure 2 As shown, the protection circuit 200 provided in this embodiment includes a first contact 210, a second contact 220 and a metal layer 230.

[0050] Among them, both the first contact 210 and the second contact 220 are arranged on the signal layer of the system circuit 100. The first contact 210 is used to receive the static electricity signal, and the second contact 220 is used to connect to the preset port P of the preset integrated circuit module 120 of the system circuit 100; the metal layer 230 is embedded in the system circuit 100 to form an additional equivalent capacitance, and the metal layer 230 is respectively connected to the first contact 210 and the second contact 220 to form an electrostatic signal release path, thereby consuming the electrostatic signal and achieving the effect of preventing the system circuit from being attacked by static electricity.

[0051] Specifically, the first contact 210 and the second contact 220 can be arranged at any position on any one or two signal layers of the system circuit 100, such as the existing ports on the PCB of the system circuit 100, or the contacts additionally added on the PCB of the system circuit 100. The first contact 210 and the second contact 220 can be fixed on the PCB of the system circuit by pads.

[0052] Specifically, through the path composed of the first contact 210, the metal layer 230, and the second contact 220, the transmission path of the electrostatic signal can be extended, increasing the consumption of the electrostatic signal during transmission, thereby reducing the energy of the electrostatic signal reaching each module of the system circuit 100. At the same time, by adding the metal layer 230 to the system circuit 100, an additional equivalent capacitance is formed between the metal layer 230 and the signal layer of the system circuit 100, thereby increasing the equivalent capacitance of the system circuit 100, improving the storage capacity of the equivalent capacitance for electrostatic signals, further weakening the attack of the electrostatic signal on each module of the system circuit 100, and improving the security of the system circuit 100.

[0053] In some embodiments, the first contact 210 can be connected to the ports on the system circuit 100 that can receive electrostatic signals, such as the input ports of the system circuit 100. The second contact 220 can select the ports of the preset integrated circuit module in the system circuit 100 that are vulnerable to electrostatic attack, such as the power supply ports.

[0054] Specifically, a path through which the electrostatic signal can pass can be selected on the system circuit 100, and two points at different positions on this path can be selected as the above-mentioned first contact 210 and second contact 220, and the connection between the first contact 210 and the second contact 220 is disconnected. Then, the first contact 210 and the second contact 220 are connected through the metal layer 230, so that the electrostatic signal enters from the first contact 210, passes through the metal layer 230, and then outputs from the second contact 220, so as to increase the transmission path of the electrostatic signal and improve the electrostatic consumption ability.

[0055] In some embodiments, the system circuit 100 can be the relevant circuit of the consumable chip of the image forming device. Of course, it can also be the relevant circuit of the main control unit of other devices, such as the relevant circuit of the MCU (Microcontroller Unit, micro control unit).

[0056] In some embodiments, the metal layer 230 can establish a connection by contacting the first contact 210 and the second contact 220, thereby forming a release path for the electrostatic signal.

[0057] In some embodiments, the shape of the metal layer 230 can be a cuboid, such as a long strip. The size of the metal layer 230 can be determined according to the specific application scenario, and the thickness of the metal layer 230 can be in the order of micrometers, millimeters, etc.

[0058] In some embodiments, the metal layer 230 can be a copper foil layer. Using a copper foil layer can make the equivalent resistance of the additional equivalent capacitance smaller, thereby improving the energy storage effect of the equivalent capacitance for electrostatic signals. Of course, the metal layer 230 can also be made of other materials, such as copper alloy.

[0059] In this embodiment, the protection circuit includes an electrostatic discharge path composed of a first contact, a second contact, and a metal layer. The first contact and the second contact are both disposed on the signal layer of the system circuit. The second contact is connected to a preset port of a preset integrated circuit module. The electrostatic signal enters the electrostatic discharge path through the first contact for consumption and release, thereby greatly reducing the static electricity reaching the system circuit, effectively preventing the electrostatic attack on the system circuit, and improving the security of the data stored on the system circuit.

[0060] Figure 3 FIG. 4 is a schematic structural diagram of a protection circuit provided in another embodiment of the present application. In this embodiment, the first contact 210 and the second contact 220 are disposed on the same surface of a certain signal layer, such as Figure 3 shown. In this embodiment, the signal layer of the system circuit 100 includes a first signal layer 101 and a second signal layer 102. The first contact 210 and the second contact 220 are both disposed on the first signal layer 101 of the system circuit 100, and the metal layer 230 is disposed between the first signal layer 101 and the second signal layer 102.

[0061] Specifically, the first contact 210 and the second contact 220 can be disposed at different positions on the front surface of the PCB corresponding to the system circuit 100. The metal layer 230 is disposed between the front surface and the back surface of the PCB, and the metal layer 230, the first contact 210, and the second contact 220 are connected through wiring to form a path.

[0062] Further, the first contact 210 and the second contact 220 can be two contacts on any path on the system circuit 100 that can receive electrostatic signals.

[0063] Specifically, for the system circuit 100 without the metal layer 230 introduced, the electrostatic signal enters from the first contact 210 and is transmitted to the second contact 220, and then enters the preset integrated circuit module 120 of the system circuit through the preset port P connected to the second contact 220. The transmission distance of the electrostatic signal between the first contact 210 and the second contact is d1. When the above metal layer 230 is added to the system circuit 100, the electrostatic signal enters from the first contact 210 and is transmitted along the path corresponding to the protection circuit 200, that is, the path composed of the first contact 210, the metal layer 230, and the second contact 230, and its corresponding transmission path is d1 + 2 * d2, where d2 is the distance that the electrostatic signal passes from the first contact 210 to the metal layer 230, and the distance that the electrostatic signal passes from the metal layer 230 to the second contact 220 is also d2. It can be seen that through the path of the electrostatic signal corresponding to the protection circuit 200, the transmission distance of the electrostatic signal is extended, thereby enhancing the consumption of the electrostatic signal during transmission, reducing the energy of the electrostatic signal reaching the preset integrated circuit module 120, and achieving the effect of electrostatic attack protection.

[0064] In some embodiments, the first contact 210 and the second contact 220 may also be both disposed on the second signal layer 102 of the system circuit 100. Specifically, the first contact 210 and the second contact 220 may be disposed at different positions on the reverse side of the PCB corresponding to the system circuit 100.

[0065] In some embodiments, the metal layer 230 may be multi-layered. Figure 4 The figure is a schematic structural diagram of a protection circuit provided by another embodiment of the present application. In this embodiment, the metal layer 230 has two layers. Combining Figure 3 and Figure 4 it can be seen that the metal layer 230 includes a first metal layer 231 and a second metal layer 232. The first contact 210, the first metal layer 231, the second metal layer 232, and the second contact 220 are connected in sequence to form a release path for the static electricity signal.

[0066] Specifically, the first metal layer 213 may include an independent first part 2311 and a second part 2312. Among them, the first part 2311 is connected to the first contact 210, the second part 2312 is connected to the second contact, and the second metal layer 2312 is disposed on a side of the first metal layer 2311 away from the first contact 210. The first metal layer 231 is a discontinuous metal layer, including the separated first part 2311 and the second part 2312.

[0067] Specifically, in this embodiment, the protection circuit 200 from top to bottom is as follows: the first contact 210 and the second contact 220, the first part 2311 of the first metal layer 213 connected to the first contact 210 and the second part 2321 of the first metal layer 213 connected to the second contact 220, and the second metal layer 232. The second metal layer 2312 is a continuous metal layer to transmit the static electricity signal received from the first part 2311 to the second part 2312.

[0068] In this embodiment, the transmission distance of the static electricity signal between the first contact 210 and the second contact 220 is: d1 + d2 * 2 + d3 * 3, where d3 is the distance that the static electricity signal passes from the first metal layer 231 to the second metal layer 232.

[0069] It can be seen that the transmission path of the electrostatic signal can be further extended by increasing the number of layers of the metal layer 230. And each additional layer of the metal layer will add an additional equivalent capacitance. This additional equivalent capacitance can store high-frequency electrostatic signals and then release the stored electrostatic signals into the air or onto the PCB of the system circuit 100 in a low-frequency manner, thereby achieving the effect of consuming the electrostatic signals. By increasing the additional equivalent capacitance, the storage capacity of the electrostatic signals of the system circuit 100 can be further improved, thereby enhancing the anti-static attack ability of the system circuit 100 and improving the security of the system circuit 100.

[0070] In some embodiments, the metal layer 230 may include a plurality of first metal layers 231 and a second metal layer 232. Each of the plurality of first metal layers 231 includes two separate or independent parts. The two parts of the first first metal layer 231 are respectively connected to the first contact 210 and the second contact 220. The two parts of the subsequent first metal layer 231 are connected to the two parts of the previous first metal layer 231. The second metal layer 232 is the last layer of the metal layer 230 and is a continuous metal layer to transmit the electrostatic signals of the first metal layer 231 connected thereto to the second contact 220, thereby forming a path for transmitting the electrostatic signals to extend the transmission distance.

[0071] And so on, the number of layers of the metal layer 230 can also be 4 layers, 5 layers or even more layers, which is not limited in this application.

[0072] In some embodiments, the first contact 210 and the second contact 220 may be located on different surfaces of the PCB of the system circuit 100, that is, on different signal layers. Figure 5 The figure is a schematic structural diagram of a protection circuit provided by another embodiment of the present application. In this embodiment, the first contact 210 and the second contact 220 are located on different signal layers, such as Figure 5 As shown, the first contact 210 is disposed on the first signal layer 101 of the system circuit 100, and the second contact 220 is disposed on the second signal layer 102 of the system circuit 100. Correspondingly, the metal layer 230 is disposed between the first signal layer 101 and the second signal layer 102 and is respectively connected to the first contact 210 and the second contact 230, thereby forming a release path for the electrostatic signals.

[0073] In some embodiments, the metal layer 230 may be connected to the first contact 210 and the second contact 220 respectively through corresponding points on its two surfaces, or through two non-corresponding points on the two surfaces.

[0074] Specifically, before the metal layer 230 is introduced, the first contact 210 and the second contact 220 are connected to each other, and the transmission distance of the electrostatic signal from the first contact 210 to the second contact 220 is d1. After adding the protection circuit, the original connection relationship between the first contact 210 and the second contact 220 is disconnected, and instead, a connection is established through the metal layer 230. When the first contact 210 and the second contact 220 are connected through the corresponding points O on both sides of the metal layer 230, the transmission distance that the electrostatic signal passes from the first contact 210 to the second contact 220 after adding the metal layer 230 is: d2 + d3, where d2 is the transmission distance between the first contact 210 and the point O, and d3 is the transmission distance between the point O and the second contact 220. It can be seen that d1 < d2 + d3. Therefore, the protection circuit increases the transmission distance of the electrostatic signal, so that more electrostatic signals are consumed before reaching the preset integrated circuit module 120 of the system circuit 100, improving the security of the preset integrated circuit module 120 and avoiding the situation where the data stored on the preset integrated circuit module 120 is lost due to electrostatic attacks.

[0075] Figure 6 The structural schematic diagram of the protection circuit provided by another embodiment of the present application. In this embodiment, on the basis of the Figure 5 embodiment shown, the metal layer 230 is set to be multi-layered. Figure 6 Taking two layers as an example, as Figure 6 shown, the metal layer 230 includes a third metal layer 233 and a fourth metal layer 234.

[0076] Among them, one side of the third metal layer 233 is connected to the first contact 210, and the other side is connected to the fourth metal layer 234, and the fourth metal layer 234 is connected to the second contact 220.

[0077] Specifically, the protection circuit from top to bottom is: the first contact 210, the third metal layer 233, the fourth metal layer 234, and the second contact 220. The third metal layer 233 and the fourth metal layer 234 can be the same metal layer, and their sizes and materials can be the same.

[0078] In some embodiments, the number of the third metal layer 233 or the fourth metal layer 234 can be multiple, so that the metal layer 230 includes 3 or more metal layers, to further increase the transmission distance of the electrostatic signal, and increase multiple additional equivalent capacitances to provide the storage capacity of the electrostatic signal, thereby increasing the consumption capacity of the electrostatic signal and improving the security of the system circuit 100.

[0079] Figure 7 The structural schematic diagram of an MCU chip provided by an embodiment of the present application. As Figure 7As shown, the MCU chip 300 includes a system circuit 100 and a protection circuit 200.

[0080] Among them, the protection circuit 200 can be the protection circuit provided by any one of the embodiments shown in this application. Figures 2 - 6 shown in the embodiments.

[0081] Specifically, the system circuit 100 may include one or more signal layers. The first contact 210 and the second contact 220 of the protection circuit 200 may be disposed on one or more signal layers of the system circuit, and the metal layer 230 is disposed below the signal layer or between two signal layers.

[0082] Among them, the preset integrated circuit module 120 is the MCU integrated circuit die. The preset ports of the preset integrated circuit module 120 may be ports related to electrostatic signal input such as power ports or general-purpose I / O (Input / Output) ports. Correspondingly, the first contact 210 and the second contact 220 are the power ports or general-purpose I / O ports of the MCU chip 300 and other ports related to electrostatic signal input.

[0083] In some embodiments, the MCU chip 300 may be the main control chip of an intelligent meter.

[0084] Of course, the MCU chip 300 provided in this application may also be the main control chip of other electronic devices.

[0085] Figure 8 It is a schematic structural diagram of a consumable chip provided by an embodiment of this application. As Figure 8 shown, the consumable chip 400 includes a system circuit 100 and a protection circuit 200.

[0086] Among them, the protection circuit 200 can be the protection circuit provided by any one of the embodiments shown in this application. Figures 2 - 6 shown in the embodiments.

[0087] Specifically, the system circuit 100 may include one or more signal layers. The first contact 210 and the second contact 220 of the protection circuit 200 may be disposed on one or more signal layers of the system circuit, and the metal layer 230 is disposed below the signal layer or between two signal layers.

[0088] Among them, the preset ports of the preset integrated circuit module 120 may be terminals related to electrostatic signal input such as power terminals, reset terminals, clock terminals or data terminals. Correspondingly, the first contact 210 and the second contact 220 are the power terminals or reset terminals or clock terminals or data terminals of the consumable chip and other terminals related to electrostatic signal input.

[0089] Specifically, the consumable chip is a medium installed on an image forming device, such as a printer, a copier, etc., for indicating consumable information and consumable remaining amount, and has functions such as consumable cartridge verification and determination of consumable remaining amount.

[0090] Specifically, the consumable chip includes a wafer storing chip model, serial number, printer control parameters, etc., and a power supply module for supplying power to the wafer. The power supply module can be a battery, such as a button battery. Since the battery is exposed to the outside, it is vulnerable to electrostatic attack, and the equivalent resistance of the button battery is relatively large. When it is subjected to electrostatic attack, a large amount of heat will be generated, which is likely to cause the data stored on the wafer to be lost.

[0091] By adopting the protection circuit 200 provided in any embodiment of the present application, the electrostatic attack on the wafer can be greatly reduced, and the effect of electrostatic protection can be achieved, thereby improving the security of the data in the wafer and avoiding the phenomenon that the consumable chip cannot be recognized when installed on the machine due to electrostatic attack.

[0092] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and the practice disclosed herein. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and the embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the claims.

[0093] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A protection circuit, characterized in that, The protection circuit includes: a first contact, a second contact, and a metal layer; Wherein, the first contact and the second contact are both disposed on the signal layer of the system circuit. The first contact is used for receiving an electrostatic signal, and the second contact is used for connecting to a preset port of a preset integrated circuit module of the system circuit; The metal layer is embedded in the system circuit to form an additional equivalent capacitance; and the metal layer is respectively connected to the first contact and the second contact to form a release path for the electrostatic signal; The metal layer includes a first metal layer and a second metal layer. The first metal layer includes an independent first part and a second part. The first part is connected to the first contact, and the second part is connected to the second contact. The first contact, the first metal layer, the second metal layer, and the second contact are sequentially connected to form a release path for the electrostatic signal.

2. The circuit according to claim 1, wherein The metal layer is a copper foil layer.

3. The circuit according to claim 1 or 2, characterized in that, The signal layer of the system circuit includes a first signal layer and a second signal layer. The first contact and the second contact are both disposed on the first signal layer, and the metal layer is disposed between the first signal layer and the second signal layer.

4. The circuit according to claim 3, wherein The first contact and the second contact are both disposed on the first signal layer or the second signal layer of the system circuit.

5. The circuit according to claim 3, characterized in that, The first contact is disposed on the first signal layer of the system circuit, and the second contact is disposed on the second signal layer of the system circuit.

6. An MCU chip, characterized in that, It includes a system circuit and the protection circuit according to any one of claims 1-5.

7. The MCU chip according to claim 6, characterized in that, The preset port of the preset integrated circuit module of the system circuit is a power port or a general-purpose I / O port.

8. A consumable chip, characterized in that, It includes a system circuit and the protection circuit according to any one of claims 1-5.

9. The consumable chip according to claim 8, wherein, The preset port of the preset integrated circuit module of the system circuit is a power port, a clock port, a reset port, or a data port.

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