Integrated circuit film expansion device and integrated circuit film expansion method

Abstract

An integrated circuit film expansion device. The integrated circuit film expansion device comprises: a product carrying portion, a first buckle ring carrying portion, a second buckle ring carrying portion and an exhaust hole. The product carrying portion is used to carry a workpiece. The first buckle ring carrying portion is arranged above the product carrying portion, wherein the first buckle ring carrying portion is used to carry a first buckle ring. The second buckle ring carrying portion is arranged below the product carrying portion, wherein the second buckle ring carrying portion is used to carry a second buckle ring. The exhaust hole is arranged below the product carrying portion.

Description

Technical Field

[0001] The present application relates to a device, and more specifically, to an integrated circuit film expansion device and an integrated circuit film expansion method. Background Art

[0002] Traditionally, when semiconductor wafers are cut into dies, if silicon scraps and dust generated by the cutting remain on the wafer, they will contaminate the dies, causing the performance of the dies after packaging to be less than expected. Summary of the invention

[0003] In view of this, the present application proposes an integrated circuit film expansion device and an integrated circuit film expansion method to solve the above problems.

[0004] According to one embodiment of the present application, an integrated circuit film expansion device is proposed. The integrated circuit film expansion device includes: a product carrying portion, a first buckle ring carrying portion, a second buckle ring carrying portion, and an exhaust hole. The product carrying portion is used to carry a workpiece. The first buckle ring carrying portion is arranged above the product carrying portion, wherein the first buckle ring carrying portion is used to carry a first buckle ring. The second buckle ring carrying portion is arranged below the product carrying portion, wherein the second buckle ring carrying portion is used to carry a second buckle ring. The exhaust hole is arranged below the product carrying portion.

[0005] According to an embodiment of the present application, the inner diameter of the first buckle ring is equal to the outer diameter of the second buckle ring.

[0006] According to an embodiment of the present application, the first buckle ring includes a convex portion, and the second buckle ring includes a concave portion, wherein the convex portion corresponds to the concave portion in position, shape, and size.

[0007] According to an embodiment of the present application, the product carrying portion, the first buckle ring carrying portion, and the second buckle ring carrying portion are coaxially arranged.

[0008] According to an embodiment of the present application, the product carrying portion is a ring structure.

[0009] According to an embodiment of the present application, the inner diameter of the annular structure is equal to the outer diameter of the working piece.

[0010] According to an embodiment of the present application, the diameter of the first buckle ring bearing portion is equal to the inner diameter of the first buckle ring.

[0011] According to an embodiment of the present application, the diameter of the first buckle ring bearing portion is greater than the diameter of the wafer in the workpiece.

[0012] According to an embodiment of the present application, the first buckle ring carrying portion includes a clamping structure for contacting the first buckle ring from a side surface to prevent the first buckle ring from moving.

[0013] According to an embodiment of the present application, the clamping structure includes a top screw.

[0014] According to an embodiment of the present application, an inner diameter of an outer ring of the second buckle ring bearing portion is equal to an outer diameter of the second buckle ring.

[0015] According to an embodiment of the present application, the second buckle ring bearing portion is a hollow structure.

[0016] According to one embodiment of the present application, the air extraction hole is used to connect to the air extraction device.

[0017] According to an embodiment of the present application, the product carrying portion receives the workpiece at a first preset position, and the integrated circuit film expansion device further includes a first driving device connected to the first buckle ring carrying portion. When the first driving device is activated, the first buckle ring carrying portion moves toward the second buckle ring carrying portion to a second preset position, wherein the second preset position is located below the first preset position.

[0018] According to an embodiment of the present application, the integrated circuit film expansion device further comprises a second driving device connected to the second buckle ring bearing part. When the second driving device is activated, the second buckle ring bearing part moves toward the first buckle ring bearing part so that the second buckle ring is buckled with the first buckle ring.

[0019] According to an embodiment of the present application, the integrated circuit film expansion device further comprises a housing, the product carrying portion is threadedly connected to the housing, the second buckle ring carrying portion is placed in the space surrounded by the housing, and the air extraction hole is arranged on the side surface of the housing.

[0020] According to an embodiment of the present application, the integrated circuit film expansion device further comprises a housing, the product carrying portion is threadedly connected to the housing, the second buckle ring carrying portion is placed in the space surrounded by the housing, and the air extraction hole is arranged on the bottom surface of the housing.

[0021] According to an embodiment of the present application, a method for expanding an integrated circuit film is provided. The method for expanding an integrated circuit film includes receiving a work piece through a product carrying portion, wherein the work piece is located at a first preset position, and the top surface of the wafer in the work piece faces downward; controlling a first buckle ring carrying portion carrying a first buckle ring to move downward to a second preset position, wherein the first buckle ring carrying portion is located above the product carrying portion, and the second preset position is located below the first preset position; and controlling a second buckle ring carrying portion carrying a second buckle ring to move upward until the second buckle ring is buckled with the first buckle ring, wherein the second buckle ring carrying portion is located below the product carrying portion.

[0022] According to an embodiment of the present application, the integrated circuit film expansion method further includes starting a vacuum device to extract particles dropped from the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present application but do not constitute a limitation to the present application. In the accompanying drawings:

[0024] Figure 1 It is a schematic diagram of the workpiece.

[0025] Figure 2 It is a schematic diagram of an integrated circuit film expansion device according to an embodiment of the present application.

[0026] Figure 3A and 3B They are schematic diagrams of a first buckle ring supporting device and a second buckle ring supporting device according to an embodiment of the present application.

[0027] Figures 4A to 4D It is a schematic diagram of the operation of an integrated circuit film expansion device according to an embodiment of the present application.

[0028] Figure 5 It is a flow chart of an integrated circuit film expansion method according to an embodiment of the present application. DETAILED DESCRIPTION

[0029] The following disclosure provides a variety of implementations or illustrations that can be used to implement different features of the present disclosure. The specific examples of components and configurations described below are used to simplify the present disclosure. As can be imagined, these descriptions are only illustrative and are not intended to limit the present disclosure. For example, in the description below, forming a first feature on or above a second feature may include certain embodiments in which the first and second features are directly in contact with each other; and may also include certain embodiments in which additional components are formed between the above-mentioned first and second features, so that the first and second features may not be in direct contact. In addition, the present disclosure may reuse component symbols and / or labels in multiple embodiments. Such repetition is based on the purpose of simplicity and clarity, and does not itself represent the relationship between the different embodiments and / or configurations discussed.

[0030] Furthermore, spatially relative terms such as "below," "below," "below," "above," and the like may be used herein to facilitate description of the relationship between one component or feature shown in the figure relative to another or more components or features. These spatially relative terms are intended to encompass a variety of different orientations of the device during use or operation in addition to the orientation shown in the figure. The device may be placed in other orientations (e.g., rotated 90 degrees or in other orientations), and these spatially relative descriptive terms should be interpreted accordingly.

[0031] Although the numerical ranges and parameters used to define the broader scope of the present application are approximate values, the relevant numerical values ​​in the specific embodiments have been presented as accurately as possible. However, any numerical value inherently inevitably contains standard deviations due to individual test methods. Here, "about" generally refers to the actual value within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. Alternatively, the term "about" means that the actual value falls within the acceptable standard error of the mean value, depending on the consideration of a person with ordinary knowledge in the technical field to which the present application belongs. It should be understood that, except for the experimental examples, or unless otherwise explicitly stated, all ranges, quantities, values ​​and percentages used herein (for example, to describe the amount of material used, the length of time, temperature, operating conditions, quantitative ratios and other similar ones) are modified by "about". Therefore, unless otherwise stated to the contrary, the numerical parameters disclosed in this specification and the attached claims are all approximate values ​​and can be changed as needed. At least these numerical parameters should be understood as the number of significant digits indicated and the values ​​obtained by applying the general rounding method. Herein, numerical ranges are expressed from one endpoint to another endpoint or between two endpoints; unless otherwise stated, the numerical ranges described herein include the endpoints.

[0032] Traditionally, when semiconductor wafers are cut into chips, if the silicon chips and dust generated by the cutting remain on the wafer, they will contaminate the chips, making the performance of the chips after packaging less than expected. In some processes, deionized water is used to flush the semiconductor wafer during the cutting process to wash away the silicon chips and dust. However, when the chip is a micro-electromechanical chip, since the middle part of the micro-electromechanical chip is a cavity formed by the back plate and the diaphragm, if deionized water is used for flushing, the back plate and the diaphragm will be damaged. If deionized water is not used for flushing, a large amount of silicon chips and dust will cause the chip performance to decline.

[0033] Figure 1is a schematic diagram of a workpiece 10. The workpiece 10 includes an expansion film 11 and a wafer 12. The expansion film 11 can be an ultraviolet irradiation tape. The wafer 12 is placed on the expansion film 11, and the surface away from the expansion film 11 is the top surface S12. The wafer 12 includes a plurality of crystal grains 121. The plurality of crystal grains 121 can be cut by the above-mentioned cutter wheel or laser. The plurality of crystal grains 121 can include the above-mentioned micro-electromechanical chips or other types of chips. As described above, a large amount of silicon chips and dust remain on the wafer 12 after cutting. If it cannot be effectively removed, it will affect the performance of the crystal grains 121.

[0034] Accordingly, the present application proposes an integrated circuit film expansion device and an integrated circuit film expansion method to solve the above-mentioned problems. Figure 2 1 is a schematic diagram of an integrated circuit film expansion device 100 according to an embodiment of the present application. In some embodiments, the integrated circuit film expansion device 100 is used to perform film expansion operations on a product (such as a workpiece 10) so that the distance between the grains (such as grains 121) on the product meets the requirements to facilitate subsequent chip bonding operations. For example, the distance between the grains 121 must be greater than 40 microns. In some embodiments, the integrated circuit film expansion device 100 includes a housing 110, a product carrying portion 120, a first buckle ring carrying portion 130, a second buckle ring carrying portion 140, and an exhaust hole 150. In some embodiments, the product carrying portion 120, the first buckle ring carrying portion 130, and the second buckle ring carrying portion 140 are coaxially arranged.

[0035] In some embodiments, the space surrounded by the housing 110 is used to accommodate the second buckle ring bearing portion 140. In some embodiments, the product bearing portion 120 is threadedly connected to the housing 110. In some embodiments, the product bearing portion 120 is used to carry a product (such as a workpiece 10). In some embodiments, the product bearing portion 120 is an annular structure. In some embodiments, the inner diameter of the product bearing portion 120 is equal to the outer diameter of the workpiece 10.

[0036] In some embodiments, the first buckle ring carrying portion 130 is disposed above the product carrying portion 120 . Figure 3A is a schematic diagram of a first buckle ring supporting portion 130 according to an embodiment of the present application. In some embodiments, the first buckle ring supporting portion 130 is used to support a first buckle ring 131. In some embodiments, the first buckle ring supporting portion 130 includes a clamping structure (not shown), and the clamping structure contacts the first buckle ring 131 from the side to prevent the first buckle ring 131 from moving. In some embodiments, the clamping structure includes a top screw. In some embodiments, the diameter of the first buckle ring supporting portion 130 is equal to the inner diameter of the first buckle ring 131. In some embodiments, the diameter of the first buckle ring supporting portion 130 is greater than the diameter of the wafer 12 in the workpiece 10.

[0037] In some embodiments, the second buckle ring carrying portion 140 is disposed below the product carrying portion 120 . Figure 3B : is a schematic diagram of the second buckle ring supporting portion 140 according to an embodiment of the present application. In some embodiments, the second buckle ring supporting portion 140 is substantially annular. In some embodiments, the second buckle ring supporting portion 140 is used to support the second buckle ring 141. In some embodiments, the second buckle ring supporting portion 140 includes an outer ring C140. In some embodiments, the inner diameter of the outer ring C140 of the second buckle ring supporting portion 140 is equal to the outer diameter of the second buckle ring 140. When the film expansion operation is to be performed, the second buckle ring 141 is placed on the inner side of the outer ring C140. In some embodiments, the second buckle ring supporting portion 140 is a hollow structure to save material.

[0038] In some embodiments, the first buckle ring 131 and the second buckle ring 141 are parent-child rings. In some embodiments, the inner diameter of the first buckle ring 131 is equal to the outer diameter of the second buckle ring 141. In some embodiments, the first buckle ring 131 includes a convex portion, and the second buckle ring 141 includes a concave portion, and the position, shape and size of the convex portion and the concave portion correspond, so that when the convex portion contacts the concave portion, the first buckle ring 131 and the second buckle ring 141 can be buckled.

[0039] Reference again Figure 2 , the exhaust hole 150 is disposed below the product carrying portion 120. In some embodiments, the exhaust hole 150 is connected to an external exhaust device. In some embodiments, the exhaust hole 150 is disposed on the side surface 1s110 of the shell 110. However, this is not a limitation of the present application. In some embodiments, the exhaust hole 150 may be disposed on the bottom surface 2s110 of the shell 110. In addition, the present application does not limit the number or shape of the exhaust hole 150. In some embodiments, the shell 110 may include a plurality of exhaust holes 150.

[0040] In some embodiments, the integrated circuit film expansion device 100 may further include other components. For example, the integrated circuit film expansion device 100 also includes a first drive device 160 and a second drive device 170. In some embodiments, the first drive device 160 is connected to the first buckle ring carrier 130. When the first drive device 160 is started, the first buckle ring carrier 130 is driven to move in the direction of the second buckle ring carrier 140 (i.e., the -Z axis direction). In some embodiments, the second drive device 170 is connected to the second buckle ring carrier 140. When the second drive device 170 is started, the second buckle ring carrier 140 is driven to move in the direction of the first buckle ring carrier 130 (i.e., the Z axis direction). In some embodiments, the first drive device 160 and the second drive device 170 are implemented by stepper motors. It should be noted that, Figure 2The positions of the first driving device 160 and the second driving device 170 shown are merely exemplary, and the present application does not limit the actual locations of the first driving device 160 and the second driving device 170 .

[0041] Figures 4A to 4D FIG. 1 is a schematic diagram of the operation of the integrated circuit film expansion device 100 according to an embodiment of the present application. Figures 4A to 4D In the steps shown, the air extraction hole 150 is connected to an external air extraction device through an air extraction pipe 151. In some embodiments, the external air extraction device is always kept in an open state. However, this is not a limitation of the present application.

[0042] like Figure 4A As shown, when the integrated circuit film expansion device 100 is to perform film expansion operation, the product carrying part 120 receives and carries the workpiece 10. When the product carrying part 120 receives the workpiece 10, the top surface S12 of the wafer 12 faces the direction of the -Z axis, and the workpiece 10 is located at the first preset position P1. In addition, when the integrated circuit film expansion device 100 is to perform film expansion operation, the first buckle ring 131 is placed on the first buckle ring carrying part 130, and the second buckle ring 141 is placed in the outer ring C140 of the second buckle ring carrying part 140.

[0043] Then, if Figure 4B As shown, the first driving device 160 is started, driving the first buckle ring bearing part 130 to move to the second buckle ring bearing part 140 (i.e., the -Z axis direction) to the second preset position P2, wherein the second preset position P2 is located below the first preset position P1. In this way, the first buckle ring 131 stretches the expansion film 11 of the workpiece 10, so that the distance between the grains 121 on the wafer 12 is pulled apart as the expansion film 11 is stretched. Since the top surface S12 of the wafer 12 faces the -Z axis direction, the silicon chips and dust remaining on the surface of the wafer 12 and between the grains 121 will fall due to gravity or be sucked away by the exhaust airflow generated by the external exhaust device.

[0044] Then, if Figure 4C As shown, the second driving device 170 is activated to drive the second buckle ring bearing portion 140 to move toward the direction of the first buckle ring bearing portion 130 (ie, the Z-axis direction) until the second buckle ring 141 is buckled with the first buckle ring 131. Figure 4D As shown, the first driving device 160 and the second driving device 170 are started to drive the first buckle ring bearing part 130 and the second buckle ring bearing part 140 to reset to complete the film expansion operation.

[0045] Because in Figure 4C In the steps shown, the second buckle ring 141 and the first buckle ring 131 are buckled with each other through the expanded film 11 when the expanded film 11 is in a stretched state. Figure 4DIn the steps shown, the expansion film 11 remains in a stretched state and cannot retract after the first buckle ring bearing portion 130 and the second buckle ring bearing portion 140 are reset, thus effectively preventing the distance of the die 121 from retracting.

[0046] To briefly summarize the present application, when the product carrying part 120 of the integrated circuit film expansion device 100 proposed in the present application receives the workpiece 10, the top surface S12 of the wafer 12 is oriented toward the -Z axis, so that the silicon chips and dust on the surface of the wafer 12 and between the grains 121 can fall due to gravity when the film expansion 11 is stretched. In addition, the integrated circuit film expansion device 100 proposed in the present application includes an exhaust hole 150 connected to an external exhaust device, and the silicon chips and dust can be further extracted by the exhaust airflow provided by the external exhaust device, thereby improving the cleanliness and further improving the process yield.

[0047] Figure 5 2 is a flow chart of an integrated circuit film expansion method 200 according to an embodiment of the present application. If substantially the same result can be obtained, the present application is not limited to the method completely in accordance with Figure 5 The integrated circuit expansion method 200 can be summarized as follows.

[0048] Step 201: receiving a workpiece through a product carrying portion, wherein the workpiece is located at a first preset position, and a top surface of a wafer in the workpiece faces downward.

[0049] Step 202: Control the first buckle ring carrying portion that carries the first buckle ring to move downward to a second preset position, wherein the first buckle ring carrying portion is located above the product carrying portion, and the second preset position is located below the first preset position.

[0050] Step 203: Control the second buckle ring carrying portion that carries the second buckle ring to move upward until the second buckle ring is buckled with the first buckle ring, wherein the second buckle ring carrying portion is located below the product carrying portion.

[0051] After reading this, those skilled in the art Figures 4A to 4D After reading the embodiments, it should be understood that Figure 5 The detailed description of the method flow steps is omitted here to save space.

[0052] As used herein, the terms "approximately", "substantially", "substantially" and "about" are used to describe and take into account small changes. When used in conjunction with an event or situation, the term may refer to an example where the event or situation occurs exactly and an example where the event or situation occurs very approximately. As used herein with respect to a given value or range, the term "about" generally means within ±10%, ±5%, ±1% or ±0.5% of a given value or range. A range may be expressed herein as from one endpoint to another or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term "substantially coplanar" may refer to two surfaces within a few microns (μm) positioned along the same plane, for example, within 10 μm, within 5 μm, within 1 μm or within 0.5 μm positioned along the same plane. When referring to a "substantially" identical numerical value or characteristic, the term may refer to a value within ±10%, ±5%, ±1% or ±0.5% of the average value of the value.

[0053] As used herein, the terms "approximately," "substantially," "substantially," and "about" are used to describe and explain small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation of less than or equal to ±10% of the numerical value, for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values ​​may be considered "substantially" or "approximately" the same if the difference between them is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%). For example, "substantially" parallel can refer to an angular variation range of less than or equal to ±10° relative to 0°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" vertical can refer to an angular variation range of less than or equal to ±10° relative to 90°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0054] For example, two surfaces may be considered coplanar or substantially coplanar if the displacement between the two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm. A surface may be considered planar or substantially planar if the displacement between any two points on the surface relative to the plane is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm.

[0055] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to transfer an electric current. Conductive materials generally refer to those materials that offer little or no resistance to the flow of electric current. One measure of conductivity is Siemens / meter (S / m). Typically, a conductive material is a material having a conductivity greater than approximately 104 S / m (e.g., at least 105 S / m or at least 106 S / m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0056] As used herein, the singular terms "a", "an" and "the" may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided "on" or "over" another component may encompass the case where the former component is directly on (e.g., physically in contact with) the latter component, as well as the case where one or more intermediate components are located between the former component and the latter component.

[0057] As used herein, spatially relative terms such as "below," "below," "lower," "above," "upper," "lower," "left," "right," etc. may be used herein for ease of description to describe the relationship of one component or feature to another component or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly. It should be understood that when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected or coupled to the other component, or intervening components may be present.

[0058] The foregoing summarizes several embodiments and detailed features of the present disclosure. The embodiments described in the present disclosure can be easily used as a basis for designing or modifying other processes and structures for performing the same or similar purposes and / or obtaining the same or similar advantages of the embodiments introduced herein. These equivalent constructions do not depart from the spirit and scope of the present disclosure and various changes, substitutions and modifications may be made without departing from the spirit and scope of the present disclosure.

Claims

1. An integrated circuit film expansion device, characterized in that: include: The product carrying part includes a ring structure. When the workpiece is expanded, the edge of the workpiece is placed on the ring structure. The workpiece is located at a first preset position, and the top surface of the wafer of the workpiece faces downward. A first buckle ring bearing portion, disposed above the product bearing portion, wherein the first buckle ring bearing portion is used to bear a first buckle ring; A second buckle ring bearing portion, disposed below the product bearing portion, wherein the second buckle ring bearing portion is used to bear a second buckle ring; An air extraction hole is provided below the product carrying portion, and the air extraction hole is connected to an air extraction device; as well as A shell, wherein the first buckle ring bearing part is arranged in the upper space of the shell, the product bearing part is connected to the upper end of the shell, the second buckle ring bearing part is placed in the space surrounded by the shell, and the air extraction hole is located on the bottom surface or side surface of the shell; When the workpiece is undergoing a film expansion operation, the first buckle ring supporting part moves downward into the shell, and pushes the workpiece downward from the first preset position to the second preset position to stretch the film expansion of the workpiece, so that silicon chips and dust remaining on the wafer will fall downward due to gravity and be sucked away by the exhaust airflow through the exhaust hole, and the second buckle ring supporting part moves upward to the second preset position, so that the first buckle ring and the second buckle ring are interlocked to complete the film expansion operation.

2. The integrated circuit film expansion device according to claim 1, characterized in that: The inner diameter of the first buckle ring is equal to the outer diameter of the second buckle ring.

3. The integrated circuit film expansion device according to claim 1, characterized in that: The first buckle ring includes a convex portion, and the second buckle ring includes a concave portion, wherein the convex portion corresponds to the concave portion in position, shape and size.

4. The integrated circuit film expansion device according to claim 1, characterized in that: The product carrying portion, the first buckle ring carrying portion and the second buckle ring carrying portion are coaxially arranged.

5. The integrated circuit film expansion device according to claim 1, characterized in that: The inner diameter of the annular structure is equal to the outer diameter of the working piece.

6. The integrated circuit film expansion device according to claim 1, characterized in that: The diameter of the first buckle ring bearing portion is equal to the inner diameter of the first buckle ring.

7. The integrated circuit film expansion device according to claim 6, characterized in that: The diameter of the first buckle ring bearing portion is greater than the diameter of the wafer in the workpiece.

8. The integrated circuit film expansion device according to claim 6, characterized in that: The first buckle ring bearing portion includes a clamping structure for contacting the first buckle ring from the side to prevent the first buckle ring from moving.

9. The integrated circuit film expansion device according to claim 8, characterized in that: The clamping structure includes a top wire.

10. The integrated circuit film expansion device according to claim 1, characterized in that: The inner diameter of the outer ring of the second buckle ring bearing portion is equal to the outer diameter of the second buckle ring.

11. The integrated circuit film expansion device according to claim 10, characterized in that: The second buckle ring bearing portion is a hollow structure.

12. The integrated circuit film expansion device according to claim 1, characterized in that: Also includes: A first driving device connected to the first buckle bearing portion; When the first driving device is activated, the first buckle ring bearing portion moves toward the second buckle ring bearing portion to the second preset position.

13. The integrated circuit film expansion device according to claim 12, characterized in that: Also includes: The second driving device is connected to the second buckle ring bearing part, wherein when the second driving device is started, the second buckle ring bearing part moves toward the first buckle ring bearing part so that the second buckle ring is buckled with the first buckle ring.

14. An integrated circuit film expansion method, characterized in that: include: Receiving a workpiece through a product carrying portion, wherein the product carrying portion is connected to the upper end of the housing, an edge portion of the workpiece is placed on the annular structure of the product carrying portion, the workpiece is located at a first preset position, and a top surface of a wafer in the workpiece faces downward; The first buckle ring bearing part that carries the first buckle ring is controlled to move downward into the shell, and the working piece is pushed to move downward from the first preset position to the second preset position to stretch the expansion film of the working piece, so that the silicon chips and dust remaining on the wafer will fall downward due to gravity and be sucked away by the exhaust airflow through the exhaust holes set on the side surface or the bottom surface of the shell, wherein the first buckle ring bearing part is located in the upper space of the shell, and the second preset position is located below the first preset position. The product carrying portion allows the workpiece to partially deform thereon to move from the first preset position to the second preset position; as well as The second buckle ring carrying portion carrying the second buckle ring is controlled to move upward until the second buckle ring is buckled with the first buckle ring, wherein the second buckle ring carrying portion is located below the product carrying portion.

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