Double-layer coating die device

Abstract

A double-layer coating die device comprises: an upper die, a lower die and a gasket layer. The upper die comprises an upper die cavity and an upper die feed port, the upper die feed port connects the upper die cavity with the outside of the device, and the upper die cavity is located on the bottom surface of the upper die. The lower die comprises a lower die cavity and a lower die feed port, the lower die feed port connects the lower die cavity with the outside of the device, and the lower die cavity is located on the top surface of the lower die. The gasket layer is located between the upper and lower die heads. The gasket layer comprises an upper coating gasket, an isolation gasket and a lower coating gasket, the upper coating gasket is located between the isolation gasket and the upper die, and the lower coating gasket is located between the isolation gasket and the lower die. Openings are provided on both the upper and lower coating gaskets, and the openings connect the upper die cavity and / or the lower die cavity with the lip of the device. The upper coating gasket opening forms a gasket flow channel structure between the upper die and the isolation gasket, and the lower coating gasket opening forms a gasket flow channel structure between the lower die and the isolation gasket, thereby realizing the double-layer coating function of the device. The device structure is simpler and easier to process.

Description

Technical Field

[0001] The present application relates to the technical field of coating machines and coating machine accessories, and in particular to a double-layer coating die head device. Background Art

[0002] At present, most of the coating machines on the market are single-layer coating machines. For some multi-layer structure films, it is often necessary to repeat the operation many times to obtain a multi-layer structure film. Although the double-layer coating die head can meet the requirements of double-layer coating, compared with the single-layer coating die head, the double-layer die head consists of three layers: upper die, middle die and lower die. The structure is complex, the processing is difficult, and the cost is greatly increased. Summary of the invention

[0003] The present application provides a double-layer coating die device, the main purpose of which is to simplify the structure of the double-layer coating die device.

[0004] In one embodiment of the present application, a double-layer coating die device is provided, comprising: an upper die, a lower die and a gasket layer; the upper die comprises an upper die cavity and an upper die feed port, the upper die feed port connects the upper die cavity with the outer side of the device, and the upper die cavity is located on the bottom surface of the upper die; the lower die comprises a lower die cavity and a lower die feed port, the lower die feed port connects the lower die cavity with the outer side of the device, and the lower die cavity is located on the top surface of the lower die; the gasket layer is located between the upper die and the lower die; the gasket layer comprises an upper coating gasket, an isolation gasket and a lower coating gasket, the upper coating gasket is located between the isolation gasket and the upper die, and the lower coating gasket is located between the isolation gasket and the lower die; openings are provided on both the upper coating gasket and the lower coating gasket, and the openings connect the upper die cavity and / or the lower die cavity with the lip of the device.

[0005] In one embodiment, the opening includes a first opening and a second opening, the first opening and the second opening are connected to form a T-shape; the first opening on the upper coating gasket is connected to the upper mold cavity, and the second opening is connected to the lip of the upper mold head; the first opening on the lower coating gasket is connected to the lower mold cavity, and the second opening is connected to the lip of the lower mold head.

[0006] In one embodiment, the lip of the upper die head and the lip of the lower die head are staggered.

[0007] In one embodiment, a lip is provided on the same side of the upper die head and the lower die head, and the upper die head and the lower die head are fixedly connected by a locking member on the other side.

[0008] In one embodiment, the locking member includes a connecting plate and a bolt, the connecting plate connects the upper die head and the lower die head, and the bolt passes through the connecting plate to fix the upper die head and the lower die head.

[0009] In one embodiment, a groove is formed on the connecting plate, and the groove is arranged toward the gasket layer.

[0010] In one embodiment, a push-pull rod adjustment mechanism is further included, and the push-pull rod adjustment mechanism is used to adjust the relative position of the lower die head lip and the isolation gasket.

[0011] In one embodiment, an upper die avoidance groove is provided on the upper die head, and a lower die avoidance groove is provided on the lower die head. The upper die head fixes the upper coating gasket and the upper die head through an upper positioning pin, and the lower die head fixes the lower coating gasket and the isolation gasket to the lower die head through a lower positioning pin; the head of the upper positioning pin is located in the lower die avoidance groove, and the head of the lower positioning pin is located in the upper die avoidance groove.

[0012] In one embodiment, it further includes a plurality of micrometer head adjustment mechanisms arranged side by side, and the micrometer head adjustment mechanisms are used to adjust the surface density of the coating layer of the device.

[0013] According to the double-layer coating die device of the above embodiment, the gasket flow channel structure formed by the opening of the upper coating gasket between the upper die and the isolation gasket, and the gasket flow channel structure formed by the opening of the lower coating gasket between the lower die and the isolation gasket, can realize the double-layer coating function of the device. The double-layer coating device of this structure has a simple structure, is easy to process, and has a low processing cost. The gasket flow channel structure formed by the upper coating gasket or the lower coating gasket better ensures the uniformity of the thickness of the coating layer coated on the substrate by the slurry. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a double-layer coating die head device in one embodiment of the present application;

[0015] Figure 2 This is a schematic diagram of the lower die structure in one embodiment of the present application;

[0016] Figure 3 This is a schematic diagram of the upper die structure in one embodiment of the present application;

[0017] Figure 4 This is a schematic diagram of the internal structure of a double-layer coating die head device in one embodiment of the present application;

[0018] Figure 5 This is a schematic diagram of the internal structure of a double-layer coating die head device in another embodiment of the present application;

[0019] Figure 6for Figure 4 A schematic diagram of the structure enlargement in the middle;

[0020] Figure 7 for Figure 5 A magnified schematic diagram of the structure at B in the middle;

[0021] Figure 8 This is a schematic structural diagram of a coating gasket in one embodiment of the present application;

[0022] Fig. 9 This is a schematic diagram of the structure of an isolation gasket in one embodiment of the present application. DETAILED DESCRIPTION

[0023] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0024] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0025] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0026] like Figure 1-9As shown, in one embodiment, a double-layer coating die device includes: an upper die 1, a lower die 2 and a gasket layer 3. The upper die 1 includes an upper die cavity 11 and an upper die feed port 12, the upper die feed port 12 connects the upper die cavity 11 with the outside of the device, and the upper die cavity 11 is located on the bottom surface of the upper die 1. The lower die 2 includes a lower die cavity 21 and a lower die feed port 22, the lower die feed port 22 connects the lower die cavity 21 with the outside of the device, and the lower die cavity 21 is located on the top surface of the lower die 2. The gasket layer 3 is located between the upper die 1 and the lower die 2. The gasket layer 3 includes an upper coating gasket 31, an isolation gasket 32 ​​and a lower coating gasket 33, the upper coating gasket 31 is located between the isolation gasket 32 ​​and the upper die 1, and the lower coating gasket 33 is located between the isolation gasket 32 ​​and the lower die 2. Openings are provided on both the upper coating gasket 31 and the lower coating gasket 33. The opening on the upper coating gasket 31 connects the upper mold cavity 11 with the lip on the upper die head 1, and the opening on the lower coating gasket 33 connects the lower mold cavity 21 with the lip on the lower die head 2.

[0027] By using the double-layer coating die head device in the above embodiment of the present application, the gasket flow channel structure formed by the opening of the upper coating gasket 31 between the upper die head 1 and the isolation gasket 32, and the gasket flow channel structure formed by the opening of the lower coating gasket 33 between the lower die head 2 and the isolation gasket 32, the double-layer coating function of the device can be achieved. The double-layer coating device of this structure has a simple structure, is easy to process, and has a low processing cost. The gasket flow channel structure formed by the upper coating gasket 31 or the lower coating gasket 33 better ensures the uniformity of the thickness of the coating applied by the slurry on the substrate.

[0028] like Figure 8 As shown, in one embodiment, the opening includes a first opening 34 and a second opening 35, and the first opening 34 and the second opening 35 are as shown in FIG. Figure 8 As shown in the dotted box. The first opening 34 and the second opening 35 are connected and combined into a T-shape. The first opening 34 on the upper coating gasket 31 is connected to the upper mold cavity 11, and the second opening 35 on the upper coating gasket 31 is connected to the lip of the upper die head 1. The first opening 34 on the lower coating gasket 33 is connected to the lower mold cavity 21, and the second opening 35 on the lower coating gasket 33 is connected to the lip of the lower die head 2. The T-shaped opening becomes the place where the slurry flows, and the rest of the places are blocked. The slurry can only pass through the feed port, the mold cavity, the opening, and the lip in sequence. The staggered arrangement of the lip of the upper die head 1 and the lip of the lower die head 2 helps to ensure that when the upper die head 1 and the lower die head 2 are coated at the same time, the double-layer coating extruded from the lips of the upper and lower dies 2 can be better coated on the substrate, avoiding the phenomenon that when the lips are aligned, the coating of the upper die head 1 and the coating of the lower die head 2 are not flat when they are first coated on the substrate. As shown Figure 7As shown, H1 is the upper coating gap from the lip of the upper die 1 to the vertical tangent of the back roller 7, and H2 is the lower coating gap from the lip of the lower die 2 to the vertical tangent of the back roller 7. H1 is greater than H2. During coating, the back roller 7 drives the substrate on the back roller 7 to rotate, and the slurry extruded from the lip of the lower die 2 becomes the first coating layer, which is applied to the surface of the substrate. The slurry extruded from the lip of the upper die 1 becomes the second coating layer, which is applied to the surface of the first coating layer.

[0029] Specifically, in one embodiment, a lip is provided on the same side of the upper die head 1 and the lower die head 2, and the upper die head 1 and the lower die head 2 are fixedly connected by a locking member 6 on the other side. The locking member 6 includes a connecting plate 61 and a bolt 62, wherein the connecting plate 61 connects the upper die head 1 and the lower die head 2, and the bolt 62 passes through the connecting plate 61 to fix the upper die head 1 and the lower die head 2. A groove 63 is provided on the connecting plate 61, and the groove 63 is arranged toward the gasket layer 3. The upper die head 1 and the lower die head 2 are fixedly connected by the locking member 6, which facilitates the stability of the upper die head 1 and the lower die head 2 during operation and avoids displacement between the upper die head 1 and the lower die head 2. The connection, fixation and disassembly between the upper die head 1 and the lower die head 2 can be quickly realized by the connecting plate 61 and the bolt 62. More preferably, a plug is provided between the connecting plate 61 and the upper die head 1, and the misalignment between the lips of the upper die head 1 and the lower die head 2 can be adjusted.

[0030] Specifically, in one embodiment, a push-pull rod adjustment mechanism 5 is further included, and the push-pull rod adjustment mechanism 5 is used to adjust the relative position of the upper lip of the upper die head 1 and the lower die head 2. Figure 4 As shown, a push-pull rod adjustment mechanism 5 is provided on the lower die head 2, and the lower die head 2 is divided into a fixed area and a movable area. Under the action of the push-pull rod adjustment mechanism 5, the movable area of ​​the lower die head 2 can be adjusted to move left and right, so that the lip of the lower die head 2 moves left and right, and the position of the lip relative to the upper die head 1 changes.

[0031] like Figure 4 , 6As shown, in one embodiment, an upper die avoidance groove 13 is provided on the upper die head 1, and a lower die avoidance groove 23 is provided on the lower die head 2. The upper coating gasket 31 is fixed to the upper die head 1 by the upper positioning pin 14, and the lower coating gasket 33 and the isolation gasket 32 ​​are fixed to the lower die head 2 by the lower positioning pin 24. The head of the upper positioning pin 14 is located in the lower die avoidance groove 23, and the head of the lower positioning pin 24 is located in the upper die avoidance groove 13. There is a certain space inside the avoidance groove. When the head of the upper positioning pin 14 is located in the lower die avoidance groove 23, the head does not contact the lower die avoidance groove 23. When the head of the lower positioning pin 24 is located in the upper die avoidance groove 13, the head does not contact the upper die avoidance groove 13. The upper coating gasket 31 is fixed on the upper die 1, and the lower coating gasket 33 and the isolation gasket 32 ​​are fixed on the lower die 2. The upper coating gasket 31 can move synchronously with the upper die 1, and the lower coating gasket 33 can move synchronously with the lower die 2, which is helpful to adjust the upper coating gap or the lower coating gap. Specifically, in other embodiments, the isolation gasket 32 ​​and the upper coating gasket 31 can also be fixed on the upper die 1.

[0032] In one embodiment, it also includes a plurality of micrometer head adjustment mechanisms 4 arranged side by side, and the micrometer head adjustment mechanisms 4 are used to adjust the surface density of the device coating. A strip-shaped through hole 15 is arranged on the upper die head 1, and the micrometer head adjustment mechanism 4 includes an adjustment knob, a connecting rod and a moving end connected in sequence. The adjustment knob of the micrometer head adjustment mechanism 4 is located on the outer side of the upper die head 1, and the moving ends of the plurality of micrometer head adjustment mechanisms 4 are arranged side by side in the through hole 15, and the moving ends can move up and down along the through hole 15. The second opening 35 of the upper coating gasket 31 is located between the moving end and the isolation gasket 32. Figure 7 As shown, H3 is the distance between the bottom surface of the moving end and the top surface of the isolation gasket 32, that is, the thickness of the second opening 35. When the thickness of the coating extruded from the lip is uneven, when the local area is too thick, adjust the corresponding differential head adjustment mechanism 4 according to its position, turn the adjustment knob, and the connecting rod drives the moving end to move downward, and the thickness of the second opening 35 between the moving end and the isolation gasket 32 ​​is reduced; when the local area is too thin, adjust the corresponding differential head adjustment mechanism 4 according to its position, turn the adjustment knob, and the connecting rod drives the moving end to move upward, and the thickness of the second opening 35 between the moving end and the isolation gasket 32 ​​becomes larger. Setting the differential head adjustment mechanism 4 can more accurately and conveniently adjust the surface density of the coating. In other embodiments, multiple differential head adjustment mechanisms 4 can also be arranged side by side on the lower die head 2 to adjust the surface density of the coating of the lower die head 2.

[0033] like Figure 1 As shown, multiple micrometer head adjustment mechanisms 4 are installed side by side on the top of the device, a locking member 6 is provided on the left side to fix the upper die head 1 and the lower die head 2, and a lip is provided on the right side. In actual operation, the upper die head 1 and the lower die head 2 can be coated at the same time or one of the die heads can be coated with a single layer.

[0034] The above specific examples are used to illustrate the present application, which is only used to help understand the present application and is not intended to limit the present application. For technicians in the technical field to which the present application belongs, they can also make some simple deductions, deformations or substitutions based on the ideas of the present application.

Claims

1. A double-layer coating die head device, characterized in that: include: An upper die head, a lower die head and a gasket layer; the upper die head includes an upper die cavity and an upper die feed port, the upper die feed port connects the upper die cavity with the outer side of the device, and the upper die cavity is located on the bottom surface of the upper die head; the lower die head includes a lower die cavity and a lower die feed port, the lower die feed port connects the lower die cavity with the outer side of the device, and the lower die cavity is located on the top surface of the lower die head; the gasket layer is located between the upper die head and the lower die head; the gasket layer includes an upper coating gasket, an isolation gasket and a lower coating gasket, the upper coating gasket is located between the isolation gasket and the upper die head, the The lower coating gasket is located between the isolation gasket and the lower die head; openings are provided on the upper coating gasket and the lower coating gasket, and the openings connect the upper die cavity and / or the lower die cavity with the lip of the device; an upper die avoidance groove is provided on the upper die head, and a lower die avoidance groove is provided on the lower die head. The upper die head fixes the upper coating gasket and the upper die head through an upper positioning pin, and the lower die head fixes the lower coating gasket, the isolation gasket and the lower die head through a lower positioning pin; the head of the upper positioning pin is located in the lower die avoidance groove, and the head of the lower positioning pin is located in the upper die avoidance groove.

2. The double-layer coating die device according to claim 1, characterized in that: The opening includes a first opening and a second opening, the first opening and the second opening are connected to form a T-shape; the first opening on the upper coating gasket is connected to the upper mold cavity, and the second opening is connected to the lip of the upper mold head; the first opening on the lower coating gasket is connected to the lower mold cavity, and the second opening is connected to the lip of the lower mold head.

3. The double-layer coating die device according to claim 2, characterized in that: The lip of the upper die head and the lip of the lower die head are staggered.

4. The double-layer coating die head device according to claim 3, characterized in that: A lip is arranged on the same side of the upper die head and the lower die head, and the upper die head and the lower die head are fixedly connected by a locking piece on the other side.

5. The double-layer coating die device according to claim 4, characterized in that: The locking member includes a connecting plate and a bolt, wherein the connecting plate connects the upper die head and the lower die head, and the bolt passes through the connecting plate to fix the upper die head and the lower die head.

6. The double-layer coating die device according to claim 5, characterized in that: A groove is formed on the connecting plate, and the groove is arranged toward the gasket layer.

7. The double-layer coating die device according to claim 3, characterized in that: It also includes a push-pull rod adjustment mechanism, which is used to adjust the relative position of the lower die head lip and the isolation gasket.

8. The double-layer coating die device according to claim 2, characterized in that: It also includes a plurality of micrometer head adjustment mechanisms arranged side by side, and the micrometer head adjustment mechanisms are used to adjust the surface density of the coating layer of the device.

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