Image pickup element and image pickup apparatus

Abstract

The present invention prevents short circuits in an imaging element provided with an electromagnetic shielding member. The imaging element according to the present invention is provided with an electromagnetic shielding member and an adhesive. The electromagnetic shielding member is disposed between a wiring and an imaging chip in a package, the wiring being provided inside the package while the package has a recess in which the imaging chip is mounted. The adhesive is used for mounting the imaging chip. Further, the adhesive is disposed so as to cover the electromagnetic shielding member.

Description

Technical Field

[0001] The present disclosure relates to an imaging element and an imaging device. More specifically, the present disclosure relates to an imaging element in which an imaging chip is mounted in a package, and an imaging device including the imaging element. Background Art

[0002] Generally, imaging devices such as digital cameras, digital video cameras (e.g., camera-integrated recorders), and surveillance cameras that capture an object and generate image data have been widely popularized. In addition, as an imaging element provided in these imaging devices, for example, there is an imaging element in which wirings are provided inside a package in which an imaging chip is mounted. However, in recent years, since the specifications for flowing a large current have increased, it has been important to prevent the characteristics of the imaging element from deteriorating due to the influence of magnetic field lines from the wirings provided inside the package.

[0003] Therefore, for example, an imaging element has been proposed in which a shielding member is disposed between a wiring provided inside a package and an imaging chip accommodated in a recess of the package, and the shielding member is configured to prevent magnetic field lines generated in the wiring from reaching the imaging chip (e.g., see Patent Document 1).

[0004] Citation List

[0005] Patent Document

[0006] Patent Document 1: WO 2017 / 081840 A Summary of the Invention

[0007] Technical Problem

[0008] In the above conventional technology, it is possible to prevent magnetic field lines generated in the wiring provided inside the package from reaching the imaging chip. Here, bonding wirings or internal leads that electrically connect the wiring provided inside the package to the imaging chip may be provided in the recess of the package. In this case, since the shielding member is a magnetic material or a conductor, it is important to prevent a short circuit between the shielding member and the internal leads or the like in the recess of the package.

[0009] In view of the above problems, the present invention has been made, and an object of the present invention is to prevent a short circuit in an imaging element in which a shielding member is disposed.

[0010] Solution to the Technical Problem

[0011] A first aspect of the present disclosure is an imaging element including: an electromagnetic shielding member disposed between a wiring having an internal wiring and a package provided with a recess for mounting an imaging chip; and an adhesive for mounting the imaging chip, the adhesive being disposed so as to cover the electromagnetic shielding member.

[0012] In addition, in the first aspect, the adhesive may be arranged to completely cover the electromagnetic shielding member.

[0013] In addition, in the first aspect, the adhesive may be arranged to completely cover the outer surface of the electromagnetic shielding member.

[0014] In addition, in the first aspect, the electromagnetic shielding member may be formed by laminating an adhesive film on both surfaces of a metal film.

[0015] In addition, in the first aspect, the adhesive may be arranged to completely cover the metal film exposed on the outer surface of the electromagnetic shielding member.

[0016] In addition, in the first aspect, in a top view, the imaging chip may have a substantially rectangular shape, the electromagnetic shielding member may have a substantially rectangular shape, the adhesive may be arranged in a square shape to completely cover the outer surface of the electromagnetic shielding member, and the imaging chip may be mounted on the upper side of the adhesive arranged in the square shape.

[0017] In addition, in the first aspect, the electromagnetic shielding member may be formed by laminating an adhesive film on both surfaces of a metal film at a portion that becomes substantially rectangular in a top view, and a coating end formed only of the adhesive film is provided at a portion corresponding to one side of the substantially rectangular shape, and the adhesive is arranged to completely cover the metal film exposed on the outer surface of the electromagnetic shielding member.

[0018] In addition, in the first aspect, in a top view, the imaging chip may have a substantially rectangular shape, the adhesive may be arranged in a substantially square shape without a portion corresponding to the coating end, and the imaging chip may be mounted on the upper side of the adhesive arranged in the substantially square shape.

[0019] In addition, in the first aspect, in a top view, the size of the electromagnetic shielding member may be smaller than the size of the imaging chip.

[0020] In addition, in the first aspect, in a top view, the size of the electromagnetic shielding member may be substantially the same as the size of the light receiving surface of the imaging chip.

[0021] In addition, in the first aspect, the metal film may include a soft magnetic material having a relative magnetic permeability of 1000 or more at 100 kHz.

[0022] In addition, in the first aspect, the relative magnetic permeability of the metal film at 100 kHz may be 5000 or more.

[0023] In addition, in the first aspect, the metal film may include copper or aluminum.

[0024] In addition, in the first aspect, the electromagnetic shielding member may include magnetic shielding or electrostatic shielding.

[0025] In addition, a second aspect of the present disclosure is an imaging device including: an imaging element including an electromagnetic shielding member and an adhesive, the electromagnetic shielding member being disposed between the wiring and the imaging chip in a package having wiring inside and a recess for mounting the imaging chip, the adhesive being for mounting the imaging chip and being disposed so as to cover the electromagnetic shielding member; and a processing circuit that processes an image signal generated by the imaging element.

[0026] By adopting these aspects, an operation is provided in which the electromagnetic shielding member is covered with an adhesive in the recess of the package to prevent a short circuit between the electromagnetic shielding member and another conductor from occurring. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a cross-sectional view showing a configuration example of an imaging element 100 according to a first embodiment of the present disclosure.

[0028] Figure 2 is a plan view showing a configuration example of an imaging element 100 according to a first embodiment of the present disclosure.

[0029] Figure 3 is a diagram showing an example of a method for manufacturing an electromagnetic shielding member 140 according to a first embodiment of the present disclosure.

[0030] Figure 4 is a diagram showing an example of a method for manufacturing an imaging element 100 according to a first embodiment of the present disclosure.

[0031] Figure 5 is a cross-sectional view showing a configuration example of an imaging element 500 according to a comparative example.

[0032] Figure 6 is a cross-sectional view showing a configuration example of an imaging element 200 according to a second embodiment of the present disclosure.

[0033] Figure 7 is a plan view showing a configuration example of an imaging element 200 according to a second embodiment of the present disclosure.

[0034] Figure 8 is a diagram showing an example of a method for manufacturing an electromagnetic shielding member 240 according to a second embodiment of the present disclosure.

[0035] Figure 9It is a plan view and a cross-sectional view showing a structural example of the electromagnetic shielding member 240 according to the second embodiment of the present disclosure.

[0036] Figure 10 It is a diagram showing an example of a method for manufacturing the imaging element 200 according to the second embodiment of the present disclosure.

[0037] Figure 11 It is a plan view showing a structural example of the electromagnetic shielding member according to a modified example of the second embodiment of the present disclosure.

[0038] Figure 12 It is a block diagram showing a schematic structural example of a camera, which is an example of an imaging device to which the present disclosure can be applied. Detailed Description of the Invention

[0039] Next, forms for implementing the present disclosure (hereinafter, referred to as embodiments) will be described with reference to the drawings. In the following drawings, the same or similar parts are denoted by the same or similar reference numerals. In addition, the embodiments will be described in the following order.

[0040] 1. First Embodiment

[0041] 2. Second Embodiment

[0042] 3. Modified Example

[0043] 4. Application Example of Camera

[0044] <1. First Embodiment>

[0045] [Structure of Imaging Element]

[0046] Figure 1 It is a cross-sectional view showing a structural example of the imaging element 100 according to the first embodiment of the present disclosure. Figure 2 It is a plan view showing a structural example of the imaging element 100 according to the first embodiment of the present disclosure. Note that in each of the following drawings, the X direction, the Y direction, and the Z direction are three mutually orthogonal directions.

[0047] The imaging element 100 includes a package 110, an imaging chip 120, a sealing glass 130, an electromagnetic shielding member 140, a wafer bonding resin 150, bonding wirings 160a and 160b, and internal leads 161a and 161b.

[0048] The package 110 has a recess 111, and the imaging chip 120 is accommodated in the recess 111. The recess 111 is formed in the package 110 to be deeper than the thickness (distance in the Z direction) of the imaging chip 120 and the wafer bonding resin 150. Note that a material having insulation properties can be used as the material of the package 110. For example, materials such as synthetic resin or ceramic can be used as the material of the package 110.

[0049] In addition, the package 110 can be, for example, a stacked package such as low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC). In addition, the packaging wirings 112a to 112c are provided inside the package 110. The packaging wirings 112a to 112c can be provided between the respective layers constituting the package 110.

[0050] The packaging wirings 112a to 112c electrically connect external terminals (not shown) provided on the package 110 to the imaging chip 120. In addition, the packaging wirings 112a to 112c are electrically connected to the imaging chip 120 through, for example, bonding wirings 160a and 160b. In addition, internal leads 161a connected to the bonding wiring 160a and internal leads 161b connected to the bonding wiring 160b are formed in the recess 111 of the package 110. Note that, for example, tungsten, copper, etc. can be used as the material of the packaging wirings 112a to 112c.

[0051] The imaging chip 120 is a semiconductor chip that receives light irradiated to a pixel region 121 (light receiving surface) via an optical system (not shown) and outputs an image signal according to the amount of light received by each pixel. The imaging chip 120 includes, for example, a signal processing region and a circuit region disposed around the signal processing region. The signal processing region includes the pixel region 121 (light receiving surface) and an amplifier circuit, a memory, etc. disposed around the pixel region 121, and a plurality of photodiodes that convert light into an electric signal are arranged one-dimensionally or two-dimensionally in the pixel region 121. In addition, the imaging chip 120 is mounted on the upper side (upper side in the Z direction) of the electromagnetic shielding member 140 by using the wafer bonding resin 150, and the electromagnetic shielding member 140 adheres to the wafer adhesion surface of the recess 111 of the package 110. Note that, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) sensor, etc. can be used as the imaging element.

[0052] The sealing glass 130 is fixed to the package 110 so as to cover the pixel region 121 (light receiving surface) of the imaging chip 120, and hermetically seals the space 113 in which the imaging chip 120 is provided. For example, the sealing glass 130 is joined to the package body 110 by an adhesive or the like to close the recess 111 of the package body 110. In addition, the sealing glass 130 has light transmissivity and functions to prevent scratches, dust, etc. from adhering to the imaging chip 120.

[0053] For example, borosilicate glass, quartz glass, alkali-free glass, Pyrex (registered trademark), etc. can be used as the material of the sealing glass 130. Note that an infrared (IR) cut-off filter that blocks infrared light, a crystal low-pass filter, or the like can be used instead of the sealing glass 130.

[0054] The electromagnetic shielding member 140 is an electromagnetic shielding member (magnetic shielding member or electrostatic shielding member) manufactured by laminating adhesive films 142 and 143 on both surfaces of a metal film 141, and it is adhered to the wafer adhesion surface of the recess 111 of the package body 110. In addition, on the upper side (upper side in the Z direction) of the electromagnetic shielding member 140, the imaging chip 120 is mounted using a wafer bonding resin 150. Here, magnetism from the package wiring lines 112a to 112c provided inside the package body 110 causes noise (for example, band noise) to be generated. Therefore, in the present disclosure, the electromagnetic shielding member 140 is disposed between the imaging chip 120 and the package wiring lines 112a to 112c (package body 110). Therefore, noise (for example, band noise) generated by the magnetism from the package wiring lines 112a to 112c can be suppressed, and deterioration of the characteristics of the imaging chip 120 can be prevented.

[0055] In addition, in a top view (when viewed from the upper side in the Z direction), the size of the electromagnetic shielding member 140 is set to be smaller than the size of the imaging chip 120. That is, in a top view, the rectangular region of the electromagnetic shielding member 140 is set to be smaller than the rectangular region of the imaging chip 120. For example, as Figure 2 shown, in a top view, the size of the electromagnetic shielding member 140 can be substantially the same as the size of the pixel region 121 (smaller than the size of the imaging chip 120).

[0056] Note that the total thickness (distance in the Z direction) of the electromagnetic shielding member 140 can be 100 μm or less. Therefore, it is possible to reduce the height of the imaging chip 120 disposed on the wafer adhesion surface while maintaining the shielding effect. In addition, a conductor such as a magnetic film, copper (e.g., copper foil), or aluminum can be used as the material of the metal film 141. The metal film 141 is preferably made of a material with high electrical conductivity such as copper. This is because the electrostatic shielding effect of the electromagnetic shielding member 140 can be improved. In addition, for example, when a soft magnetic material containing iron as the main component is used as the material of the metal film 141, the relative magnetic permeability at 100 kHz is preferably 1000 or more, and further preferably 5000 or more. This is because the magnetic shielding effect of the electromagnetic shielding member 140 can be improved. Note that the manufacturing method of the electromagnetic shielding member 140 will be described in detail with reference to Figure 3 The manufacturing method of the electromagnetic shielding member 140 will be described in detail.

[0057] The wafer bonding resin 150 is an adhesive for wafer bonding used to mount the imaging chip 120 in the recess 111 of the package 110. Specifically, the wafer bonding resin 150 is used to mount the imaging chip 120 on the upper side (upper side in the Z direction) of the electromagnetic shielding member 140 adhered to the recess 111 of the package 110 on the wafer adhesion surface. In addition, the wafer bonding resin 150 is coated to cover the side surface of the electromagnetic shielding member 140. That is, the wafer bonding resin 150 is coated so that the wafer bonding resin 150 covers (protects) the metal film 141 located on the side surface of the electromagnetic shielding member 140. In this way, the wafer bonding resin 150 is arranged in a U-shape so as to cover only the outer peripheral portion of the electromagnetic shielding member 140. Note that the wafer bonding resin 150 is an example of the adhesive described in the claims.

[0058] [Manufacturing Example of Electromagnetic Shielding Member]

[0059] Figure 3 is a diagram showing an example of a method for manufacturing the electromagnetic shielding member 140 according to the first embodiment of the present disclosure. Figure 3 A in shows a top view of a large-area electromagnetic shielding member formed by laminating large-area adhesive films on both surfaces of a large-area metal film. Figure 3 B in shows the electromagnetic shielding member in the case of cutting the large-area electromagnetic shielding member shown in A in Figure 3 by the cutting members 171 to 173. Note that for ease of description, Figure 3 shows an example of cutting the large-area electromagnetic shielding member into six electromagnetic shielding members, but the present invention is not limited thereto.

[0060] In Figure 3In A, the dashed line indicates a portion for cutting a large-area electromagnetic shielding member formed by laminating large-area adhesive films on both surfaces of a large-area metal film.

[0061] Figure 3 B of [the figure] shows Figure 3 a side surface of the large-area electromagnetic shielding member when viewed from the direction of arrow 170 shown in A of [the figure]. As Figure 3 shown in B of [the figure], the large-area electromagnetic shielding member is formed by laminating adhesive films 182 and 183 having the same (or substantially the same) size as the metal film 181 on both surfaces of the large-area metal film 181. Then, the electromagnetic shielding member 140 is manufactured by cutting the large-area electromagnetic shielding member formed by the large-area metal film 181 and the large-area adhesive films 182 and 183 into a desired size using cutting members 171 to 173.

[0062] Here, for example, it can be conceived that the two surfaces of a plurality of pre-individually separated metal films are sandwiched between large-area adhesive films, and then the adhesive films are cut to be larger than the metal films to manufacture the electromagnetic shielding member. In this case, the side surface of the electromagnetic shielding member (the side surface of the metal film) can be protected by the larger-cut adhesive film. However, in this case, since processes such as sandwiching or cutting must be performed on a plurality of pre-individually separated metal films, the productivity is considered low.

[0063] On the other hand, in the first embodiment, the large-area electromagnetic shielding member formed by laminating the large-area adhesive films 182 and 183 on both surfaces of the large-area metal film 181 can be cut to manufacture the electromagnetic shielding member 140 for the imaging element 100. Therefore, the productivity of the electromagnetic shielding member 140 can be improved, and the manufacturing cost of the imaging element 100 can be reduced.

[0064] However, since the large-area electromagnetic shielding member is cut to manufacture the electromagnetic shielding member for the imaging element, the metal film is exposed on the side surface of the electromagnetic shielding member. The influence of mounting the imaging element in the case where the metal film is exposed on the side surface of the electromagnetic shielding member will be described with reference to Figure 5 the following [description].

[0065] [Manufacturing example of imaging element]

[0066] Figure 4 is a diagram showing an example of a method for manufacturing the imaging element 100 according to the first embodiment of the present disclosure.

[0067] First, as Figure 4 shown in A of [the figure], the electromagnetic shielding member 140 formed by laminating the adhesive films 142 and 143 on both surfaces of the metal film 141 is adhered to the wafer adhesion surface of the recess 111 of the package 110.

[0068] Next, as shown in B of Figure 4 the wafer bonding resin 150 is applied to cover the side surfaces of the outer peripheral portion of the electromagnetic shielding member 140 that is attached to the wafer adhesion surface of the recess 111 of the package 110 (the surface of the metal film 141 is exposed). That is, the wafer bonding resin 150 is applied in a square shape so as to cover the side surfaces of the outer peripheral portion of the electromagnetic shielding member 140. Therefore, the metal film 141 located on the side surface of the electromagnetic shielding member 140 is protected by the wafer bonding resin 150.

[0069] Next, as shown in C of Figure 4 the imaging chip 120 is placed on the wafer bonding resin 150 applied to the side surfaces of the outer peripheral portion of the electromagnetic shielding member 140, and the electromagnetic shielding member 14 adheres to the wafer adhesion surface of the recess 111 of the package 110. After the imaging chip 120 is mounted, the wafer bonding resin 150 is cured. Thereafter, wire bonding is performed, and the package wirings 112a to 112c of the package 110 are electrically connected to the imaging chip 120 by bonding the wirings 160a and 160b.

[0070] Next, as shown in D of Figure 4 the space 113 in which the imaging chip 120 is disposed is hermetically sealed by fixing the sealing glass 130 to the package 110.

[0071] [Effect of the wafer bonding resin]

[0072] The effect of the wafer bonding resin 150 shown in Figure 1 and Figure 2 will be described with reference to the comparative examples.

[0073] Figure 5 is a cross-sectional view showing a configuration example of an imaging element 500 according to a comparative example.

[0074] The imaging element 500 includes a package 510, an imaging chip 520, a sealing glass 530, an electromagnetic shielding member 540, a wafer bonding resin 550, bonding wirings 560a and 560b, and internal leads 561a and 561b.

[0075] Note that each part of the imaging element 500 corresponds to Figure 1 the part of the imaging element 100 with the same name shown in

[0076] Here, it is assumed that the imaging element 500 has undergone a high-temperature and high-humidity test. In this case, since the electromagnetic shielding member 540 is mounted in the recess 511 of the package 510 and the metal film 541 is exposed on the side surface of the electromagnetic shielding member 540, the metal film 541 may be eluted during the high-temperature and high-humidity test. When the metal film 541 is eluted in this way, as shown by the arrow 571, a short circuit may occur between the eluted metal film 541 and the internal lead 561a of the package 510.

[0077] On the other hand, in Figure 1 and Figure 2 the imaging element 100 shown, the side surface of the electromagnetic shielding member 140 is covered with the die bonding resin 150 to protect the metal film 141. In this way, since the electromagnetic shielding member 140 is mounted in the recess 111 of the package body 110 and the metal film 141 on the side surface of the electromagnetic shielding member 140 is protected, it is possible to prevent the metal film 141 from being eluted by the high-temperature and high-humidity test. Therefore, it is possible to prevent a short circuit from occurring between the metal film 141 and the internal leads 161a and 161b of the package body 110.

[0078] Note that in the first embodiment, an example is shown in which the die bonding resin 150 is arranged in a square shape to cover only the outer peripheral portion of the electromagnetic shielding member 140. However, the die bonding resin 150 may be coated and arranged to cover the upper surface and all side surfaces of the electromagnetic shielding member 140.

[0079] As described above, in the imaging element 100 according to the first embodiment of the present disclosure, the side surface of the electromagnetic shielding member 140 arranged on the bottom surface of the imaging chip 120 is covered with the adhesive of the die bonding resin 150, so that a short circuit between the electromagnetic shielding member 140 and other conductors can be prevented.

[0080] <2. Second Embodiment>

[0081] In the first embodiment, an example is shown in which the die bonding resin 150 is coated to cover the side surface of the electromagnetic shielding member 140 mounted on the wafer adhesion surface of the recess 111 of the package body 110. In this way, when the die bonding resin 150 is coated in a square shape, the space surrounded by the imaging chip 120, the die bonding resin 150, and the electromagnetic shielding member 140 is sealed. Therefore, considering the increase in pressure in the above space, it can be thought to provide air holes in the space. Therefore, in the second embodiment, an example is shown in which a part of the square-shaped die bonding resin is a slit, and air holes are provided in the space surrounded by the imaging chip, the die bonding resin, and the electromagnetic shielding member.

[0082] [Structure of Imaging Element]

[0083] Figure 6 FIG. Figure 6 is a cross-sectional view showing an example of the structure of the imaging element 200 according to the second embodiment of the present disclosure. Figure 7 FIG. Figure 7 is a plan view showing an example of the structure of the imaging element 200 according to the second embodiment of the present disclosure.

[0084] The imaging element 200 is different from the imaging element 100 in that an electromagnetic shielding member 240 having a coated end portion 245 is provided instead of Figure 1 and Figure 2 the electromagnetic shielding member 140 in the imaging element 100 shown in, and the wafer bonding resin 250 is not coated on the portion corresponding to the coated end portion 245. Note that since aspects other than the above are similar to Figure 1 and Figure 2 the imaging element 100 shown in, parts that are the same as those in the imaging element 100 are denoted by the same reference numerals, and descriptions of these parts will be omitted. In addition, the coated end portion 245 will be described in detail with reference to Figure 8 and Figure 9 .

[0085] [Example of the Structure of the Electromagnetic Shielding Member]

[0086] Figure 8 FIG. Figure 8 is a view showing an example of a method for manufacturing the electromagnetic shielding member 240 according to the second embodiment of the present disclosure. Figure 9 FIG. Figure 9 is a plan view and a cross-sectional view showing an example of the structure of the electromagnetic shielding member 240 according to the second embodiment of the present disclosure.

[0087] Figure 8 A in FIG. Figure 8 shows a top view of a large-area adhesive film constituting a large-area electromagnetic shielding member. Figure 8 B in FIG. Figure 8 shows a top view of a large-area metal film constituting a large-area electromagnetic shielding member. In Figure 8 A in FIG. Figure 8 and Figure 8 B in FIG. Figure 8 , portions for cutting the large-area adhesive film and the large-area metal film are shown by dashed lines. Note that for ease of explanation, Figure 8 FIG. Figure 8 shows an example in which a large-area electromagnetic shielding member is cut into six electromagnetic shielding members, but is not limited thereto.

[0088] As Figure 8 shown in B of FIG. Figure 8 , the large-area metal film is formed into a roll (strip) shape and its width L1 is narrower than the width L3 of the large-area adhesive film. Note that the length L2 of the large-area metal film may be the same (or substantially the same) as the length L2 of the large-area adhesive film.

[0089] Furthermore, as Figure 8 shown in A of FIG. Figure 8 , the large-area adhesive film is cut to provide coated end portions (portions without a metal film, protruding portions) 245 at both ends (both ends in the width direction) of the roll (strip).

[0090] In this way, in the case of manufacturing the electromagnetic shield 240 having the coated end 245, use is made of a large-area electromagnetic shield formed by laminating a large-area adhesive film shown in A of Figure 8 on both surfaces of a large-area metal film shown in B of Figure 8 . In other words, use is made of a roll-shaped electromagnetic shield in which the left-right direction ( Figure 8 the left-right direction shown in Figure 8 ) is significantly longer than the up-down direction ( Figure 8 the up-down direction shown in Figure 8 ), and there are peripheral portions (including the portion of the coated end) that do not have a metal film but only have an adhesive film at both ends in the up-down direction. In addition, the peripheral portion is manufactured to correspond to one side of the electromagnetic shield 240, and the peripheral portion is cut out to have the shape of the coated end 245.

[0091] Figure 9 The electromagnetic shield 240 formed by cutting the adhesive film provided with the coated end 245 and the metal film not provided with the coated end is shown.

[0092] Figure 9 A of Figure 9 shows a plan view of the electromagnetic shield 240 formed by laminating the adhesive film provided with the coated end 245 on both surfaces of the metal film not provided with the coated end. Figure 9 B of Figure 9 shows a cross-sectional view of the electromagnetic shield 240 when viewed from the directions of arrows A1 and A2 in A of Figure 9 .

[0093] As Figure 8 shown, the adhesive film is provided with the coated end 245, but the metal film is not provided with the coated end. Therefore, as Figure 9 shown in B of Figure 9 , no layer of the metal film 241 is formed on the coated end 245, and the metal film 241 is not exposed on the side surface of the coated end 245 of the electromagnetic shield 240. As described above, the portions of the side surface of the metal film 241 of the electromagnetic shield 240 corresponding to the coated end 245 of the electromagnetic shield 240 are protected by the adhesive film 242 formed on both surfaces of the metal film 241. In particular, on the side surface (the side surface indicated by arrow A3) at the end of the coated end 245 of the electromagnetic shield 240, the metal film 241 is not exposed, and the side surface of the metal film 241 is protected by the adhesive film 242 forming the coated end 245.

[0094] As described above, regarding the coated end portion 245 of the electromagnetic shielding member 240, the side surface of the metal film 241 is protected by the adhesive film 242 that forms the coated end portion 245, so that the metal film 241 is not exposed and does not need to be protected by the wafer bonding resin 250. Therefore, in the case where the wafer bonding resin 250 is coated on the side surface of the electromagnetic shielding member 240, as Figure 6 and Figure 7 shown, the wafer bonding resin 250 is not coated on the portion corresponding to the coated end portion 245. That is, the wafer bonding resin 250 can be coated such that the coated end portion 245 becomes a slit of the wafer bonding resin 250.

[0095] As described above, the wafer bonding resin 250 is arranged in a rectangular frame shape so as to cover only the outer peripheral portion (outer surface) of the electromagnetic shielding member 240, and a slit is formed at at least one position of the rectangular frame shape. In addition, the coated end portion 245 of the electromagnetic shielding member 240 is arranged in the slit. In addition, as Figure 6 and Figure 7 shown, a hole 243 can be formed in the slit on the upper side (upper side in the Z direction) of the coated end portion 245.

[0096] [Manufacturing example of imaging element]

[0097] Figure 10 is a diagram showing an example of a method for manufacturing an imaging element 200 according to the second embodiment of the present disclosure.

[0098] First, as Figure 10 shown in A of, the electromagnetic shielding member 240 formed by laminating the adhesive film 242 on both surfaces of the metal film 241 is bonded to the wafer adhesion surface of the recess 111 of the package 110. Note that regarding the coated end portion 245 of the electromagnetic shielding member 240, the side surface of the metal film 241 is protected by the adhesive film 242 that forms the coated end portion 245.

[0099] Next, as Figure 10As shown in B of FIG. , the wafer bonding resin 250 is coated to cover the side surface of the outer peripheral portion of the electromagnetic shielding member 240 on the wafer adhesion surface of the concave portion 111 adhered to the package body 110 (the side surface other than the side surface of the top end of the coated end portion 245 of the electromagnetic shielding member 240). That is, the wafer bonding resin 250 is coated in a square shape with a notch to cover the side surface of the outer peripheral portion of the electromagnetic shielding member 240, but the wafer bonding resin 250 is not present only at the coated end portion 245 of the electromagnetic shielding member 240. That is, the wafer bonding resin 250 is coated in a square shape with a notch to cover the side surface of the outer peripheral portion of the electromagnetic shielding member 240, and a slit is formed at at least one position (the position of the coated end portion 245 of the electromagnetic shielding member 240) of the square shape with a notch. By forming a slit at at least one position of the wafer bonding resin 250 coated in a square shape with a notch in this way, a hole 243 is formed on the upper side (the upper side in the Z direction) of the coated end portion 245. Therefore, it is possible to prevent the space surrounded by the imaging chip 120, the wafer bonding resin 250, and the electromagnetic shielding member 240 from being sealed. When performing a heat treatment to cure an adhesive or the like, it is possible to prevent the imaging chip 120 from floating or being damaged due to an increase in pressure in the space.

[0100] As described above, the metal film 241 exposed on the side surface of the electromagnetic shielding member 240 is protected by the wafer bonding resin 250. In addition, the coated end portion 245 of the electromagnetic shielding member 240 is disposed in the slit portion where the wafer bonding resin 250 is not present, but the metal film 241 is not exposed on the side surface of the coated end portion 245. In addition, the metal film 241 near the coated end portion 245 of the electromagnetic shielding member 240 is protected by the adhesive film 242 forming the coated end portion 245.

[0101] Next, as Figure 10 shown in C of FIG. , the imaging chip 120 is placed on the wafer bonding resin 250 coated on the side surface of the outer peripheral portion of the electromagnetic shielding member 240 (the electromagnetic shielding member 240 is adhered to the wafer adhesion surface of the concave portion 111 of the package body 110). After placing the imaging chip 120, the wafer bonding resin 250 is cured, and the packaging wirings 112a to 112c of the package body 110 are electrically connected to the imaging chip 120 through the bonding wirings 160a, 160b.

[0102] Next, as Figure 10 shown in D of FIG. , the space 113 provided with the imaging chip 120 is hermetically sealed by fixing the sealing glass 130 to the package body 110.

[0103] As described above, the imaging element 200 according to the second embodiment of the present disclosure can simplify the manufacturing process of the electromagnetic shielding member 240 by using the electromagnetic shielding member 240 including the coating end portion 245. In addition, by omitting the wafer bonding resin 250 on the coating end portion 245, damage to the imaging chip 120 during the manufacturing process of the imaging element 200 can be prevented.

[0104] <3. Modification Example>

[0105] Although the shape of the coating end portion 245 of the electromagnetic shielding member 240 described above is an example of a rectangle (each side is smaller than one side of the electromagnetic shielding member 240), the coating end portion may have other shapes. Therefore, modification examples of the coating end portion provided on the electromagnetic shielding member will be shown below.

[0106] Figure 11 It is a plan view showing a configuration example of an electromagnetic shielding member according to a modification example of the second embodiment of the present disclosure.

[0107] The electromagnetic shielding members 310, 320, 330, 340, 350, and 360 are modification examples of the electromagnetic shielding member 240, and the shape of the coating end portion is different from the shape of the electromagnetic shielding member 240. Therefore, the shape of the coating end portion will be mainly described here. Note that in Figure 11 The boundary between the rectangular electromagnetic shielding member formed by laminating the adhesive film on both surfaces of the metal film and the coating end portions 311, 321, 331, 341, 351, and 361 formed only by the adhesive film is indicated by a dotted line.

[0108] The electromagnetic shielding member 310 is provided with a rectangular coating end portion 311 on one side of the rectangular electromagnetic shielding member 310 (a rectangle formed by laminating the adhesive film on both surfaces of the metal film). That is, in the electromagnetic shielding member 310, the entire one side of the rectangular electromagnetic shielding member 310 is a rectangular coating end portion 311.

[0109] The electromagnetic shielding member 320 is provided with a triangular coating end portion 321 on one side of the rectangular electromagnetic shielding member 320 (a rectangle formed by laminating the adhesive film on both surfaces of the metal film). That is, in the electromagnetic shielding member 320, the entire one side of the rectangular electromagnetic shielding member 320 is a triangular coating end portion 321.

[0110] The electromagnetic shielding member 330 is provided with an arc-shaped coating end portion 331 on one side of the rectangular electromagnetic shielding member 330 (a rectangle formed by laminating the adhesive film on both surfaces of the metal film). That is, in the electromagnetic shielding member 330, the entire one side of the rectangular electromagnetic shielding member 330 is an arc-shaped coating end portion 331.

[0111] The electromagnetic shielding member 340 has a rectangular coating end portion 341 provided on one side of the rectangular electromagnetic shielding member 340 (a rectangle formed by laminating adhesive films on both surfaces of a metal film). That is, in the electromagnetic shielding member 340, the rectangular coating end portion 341 is provided only on a part of one side of the rectangle of the electromagnetic shielding member 340. Note that the electromagnetic shielding member 340 is obtained by only changing Figure 9 the length of the electromagnetic shielding member 240 shown in the left - right direction ( Figure 11 the left - right direction in

[0112] The electromagnetic shielding member 350 has a triangular coating end portion 351 provided on one side of the rectangular electromagnetic shielding member 350 (a rectangle formed by laminating adhesive films on both surfaces of a metal film). That is, in the electromagnetic shielding member 350, the triangular coating end portion 351 is provided only on a part of one side of the rectangle of the electromagnetic shielding member 350.

[0113] The electromagnetic shielding member 360 has an arcuate coating end portion 361 provided on one side of the rectangular electromagnetic shielding member 360 (a rectangle formed by laminating adhesive films on both surfaces of a metal film). That is, in the electromagnetic shielding member 360, the arcuate coating end portion 361 is provided only on a part of one side of the rectangle of the electromagnetic shielding member 360.

[0114] <4. Application Examples of the Camera>

[0115] The technology according to the present disclosure (this technology) is applicable to a variety of products. For example, this technology can be implemented as an imaging element installed in an imaging device such as a camera.

[0116] Figure 12 is a block diagram showing a schematic configuration example of a camera, which is an example of an imaging device to which this technology can be applied. The camera 1000 in the figure includes a lens 1001, an imaging element 1002, an imaging control unit 1003, a lens driving unit 1004, an image processing unit 1005, an operation input unit 1006, a frame memory 1007, a display unit 1008, and a recording unit 1009.

[0117] The lens 1001 is an imaging lens of the camera 1000. The lens 1001 collects light from a subject and makes the light incident on the imaging element 1002 described later to form an image of the subject.

[0118] The imaging element 1002 is a semiconductor element that captures an image of the light from the subject collected by the lens 1001. The imaging element 1002 generates an analog image signal according to the incident light, converts it into a digital image signal, and outputs it.

[0119] The imaging control unit 1003 controls imaging via the imaging element 1002. The imaging control unit 1003 controls the imaging element 1002 by generating a control signal and outputting the control signal to the imaging element 1002. In addition, the imaging control unit 1003 can perform autofocus in the camera 1000 based on the image signal output from the imaging element 1002. Here, autofocus is a system that detects the focal position of the lens 1001 and automatically adjusts it. As this autofocus, the following methods can be used: using the phase difference pixels arranged in the imaging element 1002 to detect the image plane phase difference and detect the focal position (image plane phase difference autofocus). In addition, a method of detecting the position with the highest contrast of the image as the focal position (contrast autofocus) can also be applied. The imaging control unit 1003 adjusts the position of the lens 1001 via the lens drive unit 1004 based on the detected focal position and performs autofocus. Note that the imaging control unit 1003 can be constructed by, for example, a digital signal processor (DSP) equipped with firmware.

[0120] The lens drive unit 1004 drives the lens 1001 based on the control of the imaging control unit 1003. The lens drive unit 1004 can drive the lens 1001 by changing the position of the lens 1001 using a built-in motor.

[0121] The image processing unit 1005 processes the image signal generated by the imaging element 1002. This processing corresponds to, for example, demosaicing (for generating an image signal of the missing color among the image signals corresponding to red, green, and blue for each pixel), noise reduction for removing noise from the image signal, and encoding of the image signal, etc. The image processing unit 1005 can be constructed by, for example, a microcomputer equipped with firmware.

[0122] The operation input unit 1006 receives an operation input from the user of the camera 1000. For example, a button or a touch panel can be used as the operation input unit 1006. The operation input received by the operation input unit 1006 is transmitted to the imaging control unit 1003 or the image processing unit 1005. Thereafter, processing corresponding to the operation input, such as processing for photographing a subject, etc., is started.

[0123] The frame memory 1007 is a memory that stores the frame of the image signal for one screen. The frame memory 1007 is controlled by the image processing unit 1005 and holds the frame during the image processing.

[0124] The display unit 1008 displays the image processed by the image processing unit 1005. For example, a liquid crystal panel can be used for the display unit 1008.

[0125] The recording unit 1009 records the images processed by the image processing unit 1005. For the recording unit 1009, for example, a memory card or a hard disk can be used.

[0126] The camera to which the present invention can be applied has been described above. This technology can be applied to the imaging element 1002 in the above configuration. Specifically, the imaging elements 100 and 200 described in Figure 1 , Figure 2 , Figure 6 , Figure 7 , etc. can be applied to the imaging element 1002. By applying the imaging elements 100 and 200 to the imaging element 1002, the productivity of the electromagnetic shielding member included in the imaging element 1002 can be improved, and the manufacturing cost of the camera 1000 can be reduced. In addition, by applying the imaging elements 100 and 200 to the imaging element 1002, it is possible to prevent a short circuit from occurring in the concave portion of the package of the imaging element 1002. Note that the image processing unit 1005 is an example of the processing circuit described in the claims. The camera 1000 is an example of the imaging device described in the claims.

[0127] Note that although the camera has been described as an example here, the technology according to the present invention can be applied to, for example, a surveillance device.

[0128] Finally, the description of each of the above embodiments is an example of the present disclosure, and the present disclosure is not limited to the above embodiments. Therefore, it goes without saying that various modifications can be made according to the design, etc. without departing from the technical concept of the present disclosure, and even modifications different from the above embodiments can be made.

[0129] In addition, the drawings in the above embodiments are schematic, and the ratios of the sizes of each part are not always consistent with the actual ones. In addition, it goes without saying that some parts having different size relationships and ratios between the respective drawings may be included in the drawings.

[0130] Note that this technology can be configured as follows.

[0131] (1) An imaging element, comprising:

[0132] An electromagnetic shielding member, which is arranged between the wiring and the imaging chip in a package body that has wiring inside and is provided with a concave portion for mounting the imaging chip; and

[0133] An adhesive for mounting the imaging chip, which is arranged to cover the electromagnetic shielding member.

[0134] (2) The imaging element according to (1), wherein the adhesive is arranged to completely cover the electromagnetic shielding member.

[0135] (3) The imaging element according to (1) or (2), wherein the adhesive is arranged to completely cover the outer surface of the electromagnetic shielding member.

[0136] (4) The imaging element according to any one of (1) to (3), wherein the electromagnetic shielding member is formed by laminating an adhesive film on both surfaces of a metal film.

[0137] (5) The imaging element according to (4), wherein the adhesive is arranged to completely cover the metal film exposed on the outer surface of the electromagnetic shielding member.

[0138] (6) The imaging element according to any one of (1) to (5), wherein

[0139] the imaging chip has a substantially rectangular shape in a top view,

[0140] the electromagnetic shielding member has a substantially rectangular shape in a top view,

[0141] in a top view, the adhesive is arranged in a U-shape to completely cover the outer surface of the electromagnetic shielding member, and

[0142] the imaging chip is mounted on the upper side of the adhesive arranged in a U-shape.

[0143] (7) The imaging element according to any one of (1) to (5), wherein

[0144] the electromagnetic shielding member is formed by laminating an adhesive film on both surfaces of a metal film at a portion that becomes substantially rectangular in a top view, and a coating end formed only of the adhesive film is provided at a portion corresponding to one side of the substantially rectangular shape, and

[0145] the adhesive is arranged to completely cover the metal film exposed on the outer surface of the electromagnetic shielding member.

[0146] (8) The imaging element according to (7), wherein

[0147] the imaging chip has a substantially rectangular shape in a top view,

[0148] in a top view, the adhesive is arranged in a substantially U-shape without a portion corresponding to the coating end, and

[0149] the imaging chip is mounted on the upper side of the adhesive arranged in the substantially U-shape.

[0150] (9) The imaging element according to (8), wherein in a top view, the size of the electromagnetic shielding member is smaller than the size of the imaging chip.

[0151] (10) The imaging element according to any one of (1) to (9), wherein, in a top view, the size of the electromagnetic shielding member is substantially the same as the size of the light receiving surface of the imaging chip.

[0152] (11) The imaging element according to (4) or (5), wherein the metal film contains a soft magnetic material having a relative magnetic permeability of 1000 or more at 100 kHz.

[0153] (12) The imaging element according to (11), wherein the metal film has a relative magnetic permeability of 5000 or more at 100 kHz.

[0154] (13) The imaging element according to any one of (4), (5), (11), and (12), wherein the metal film contains copper or aluminum.

[0155] (14) The imaging element according to any one of (1) to (13), wherein the electromagnetic shielding member includes a magnetic shielding member or an electrostatic shielding member.

[0156] (15) An imaging device, comprising:

[0157] An imaging element, including an electromagnetic shielding member and an adhesive, the electromagnetic shielding member having wirings inside and being disposed in a package body having a recess for mounting an imaging chip and being arranged between the wirings and the imaging chip, the adhesive being for mounting the imaging chip and being arranged to cover the electromagnetic shielding member; and

[0158] A processing circuit that processes an image signal generated by the imaging element.

[0159] List of reference numerals

[0160] 100, 200, 500 Imaging element

[0161] 110, 510 Package body

[0162] 111, 511 Recess

[0163] 112a to 112c, 512a to 512c Sealing wirings

[0164] 113, 513 Space

[0165] 120, 520 Imaging chip

[0166] 121, 521 Pixel region

[0167] 130, 530 Sealing glass

[0168] 140, 240, 310, 320, 330, 340, 350, 360, 540 Electromagnetic shielding member

[0169] 141, 241, 181, 541 Metal film

[0170] 142, 143, 182, 183, 242, 542, 543 Adhesive film

[0171] 150, 250, 550 Chip bonding resin

[0172] 160a, 160b, 560a, 560b Bonding wiring

[0173] 161a, 161b, 561a, 561b Inner lead

[0174] 243 Hole

[0175] 245, 311, 321, 331, 341, 351, 361 Coated end

[0176] 1000 Camera

[0177] 1002 Imaging element

[0178] 1005 Image processing unit

Claims

1. An imaging element, comprising: An electromagnetic shielding member disposed between the wiring and the imaging chip in a package having wiring inside and a recess for mounting the imaging chip; And An adhesive for mounting the imaging chip, the adhesive being disposed to cover a side surface of the electromagnetic shielding member and at least a part of an upper surface of the electromagnetic shielding member, wherein the electromagnetic shielding member is formed by laminating an adhesive film on two surfaces of a metal film at a portion that is rectangular in a top view, and a coating end formed only of the adhesive film is provided at a portion corresponding to one side of the rectangular shape, and wherein in a top view, the adhesive is disposed in a square shape without a portion corresponding to the coating end.

2. The imaging element according to claim 1, wherein, The adhesive is disposed to completely cover an outer peripheral portion of the electromagnetic shielding member.

3. The imaging element according to claim 1, wherein, The adhesive is disposed to completely cover an outer surface of the electromagnetic shielding member.

4. The imaging element according to claim 1, wherein, The adhesive is disposed to completely cover the metal film exposed on the outer surface of the electromagnetic shielding member.

5. The imaging element according to any one of claims 1 to 3, wherein in a top view, the imaging chip has a rectangular shape, and the imaging chip is mounted on an upper side of the adhesive disposed in the square shape.

6. The imaging element according to any one of claims 1 to 3, wherein, In a top view, a size of the electromagnetic shielding member is smaller than a size of the imaging chip.

7. The imaging element according to any one of claims 1 to 3, wherein, In a top view, a size of the electromagnetic shielding member is substantially the same as a size of a light receiving surface of the imaging chip.

8. The imaging element according to claim 1, wherein, The metal film contains a soft magnetic material having a relative magnetic permeability of 1000 or more at 100 kHz.

9. The imaging element according to claim 8, wherein, The metal film has a relative magnetic permeability of 5000 or more at 100 kHz.

10. The imaging element according to claim 1, wherein, The metal film contains copper or aluminum.

11. The imaging element according to any one of claims 1 to 3, wherein, The electromagnetic shielding member includes a magnetic shielding member or an electrostatic shielding member.

12. An imaging device, comprising: An imaging element, which is the imaging element according to any one of claims 1 to 11; And A processing circuit that processes an image signal generated by the imaging element.

Images