A precision instrument electroplating method

Abstract

The present invention provides a precision instrument electroplating method, which is implemented using precision instrument electroplating equipment to complete the electroplating of the precision instrument; the precision instrument electroplating equipment includes a plating tank body, wherein a sealing mechanism is slidably installed on the right side of the plating tank body. When cleaning impurities floating on the surface of the electroplating solution, the sliding plate can be pulled back and forth along two sliding grooves by grasping the pull plate, so that a sponge block provided on the bottom end surface of the sliding plate contacts the impurities floating on the surface of the electroplating solution. Due to the porous material of the sponge block, the impurities floating on the surface of the electroplating solution are blocked and adsorbed into the gaps in the sponge block, thereby completing the cleaning operation of the impurities floating on the surface of the electroplating solution.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroplating, and more specifically, relates to a precision instrument electroplating method. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process of using electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] For example, application number: 202010018612.9 The present invention relates to the field of electroplating technology, and specifically to an electroplating tank structure and electroplating equipment, comprising: a plurality of electroplating tanks connected in sequence, with at least one group of two adjacent electroplating tanks spaced apart; and at least one expansion joint structure, the expansion joint structure connecting two adjacent electroplating tanks spaced apart. The present invention provides an electroplating tank structure and electroplating equipment that effectively solves the problem of collision or leakage between electroplating tanks when relative movement between them occurs due to the existing connection method between electroplating tanks.

[0004] Based on the search of the above patents and in combination with the prior art, it was found that after the electroplating application is completed in the existing electroplating tank, some impurities will float on the surface of the electroplating liquid, and a small amount of impurities will remain in the electroplating liquid. The impurities in the electroplating liquid are mostly cleaned by discharging all the electroplating liquid in the electroplating tank, and then filtering and cleaning the impurities in the discharged electroplating liquid. However, this method of complete discharge causes too high a capacity loss of the electroplating liquid, and subsequently adding the electroplating liquid to the electroplating tank again is also a high-intensity task. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a precision instrument electroplating method to solve the problem that after the electroplating application is completed in the existing electroplating tank, some impurities will float on the surface of the electroplating liquid and a small amount of impurities will remain in the electroplating liquid. At present, the impurities in the electroplating liquid are mostly cleaned by discharging all the electroplating liquid in the electroplating tank, and then filtering and cleaning the impurities in the discharged electroplating liquid. However, this complete discharge method causes too high a capacity loss of the electroplating liquid, and the subsequent re-addition of electroplating liquid to the electroplating tank is also a high-intensity work.

[0006] The present invention is achieved by the following specific technical means:

[0007] A precision instrument electroplating method, which is achieved by using precision instrument electroplating equipment to complete the electroplating of precision instruments; the precision instrument electroplating equipment includes a plating tank body, a closing mechanism is slidably installed on the right side of the plating tank body, and a sliding plate is slidably installed on the left side of the plating tank body; an impurity output mechanism is fixedly installed on the right side of the closing mechanism inside the plating tank body; the plating tank body includes a fixed connecting seat and a circular mounting hole, a circular mounting hole is opened at the center of the bottom surface of the inner end of the recessed tank, and the inner end of the plating tank is provided with a circular mounting hole. A fixed connecting seat is welded on the side of the right side surface. The impurity output mechanism includes a conveying pipe, a right-angle bent pipe, a sleeve and a circular conveying cavity. The bottom end of the conveying pipe passes through the circular mounting hole and is fixedly connected to it, and the bottom end of the conveying pipe is fixedly connected to a right-angle bent pipe. The top end of the conveying pipe is sleeved with a sleeve coaxial with it, and a circular conveying cavity is opened at the axial center of the bottom end face of the sleeve. The diameter of the circular conveying cavity is larger than the diameter of the conveying pipe. The top end face of the sleeve is fixedly connected to the fixed connecting seat. The top surface of the inner end of the circular conveying cavity is higher than the top surface of the conveying pipe. The bottom end face of the sleeve and the bottom end face of the partition plate are on the same horizontal plane. The electroplating tank body includes an electroplating tank, a support frame, and a partition plate. The top surface of the electroplating tank body is provided with an electroplating tank, and the support frame is fixedly mounted on the bottom surface of the electroplating tank body. A partition plate is fixedly connected to the right side of the inside of the electroplating tank, and the front and rear surfaces of the partition plate are fixedly connected to the front and rear side surfaces of the inner end of the electroplating tank, respectively. The bottom surface of the partition plate is higher than the bottom surface of the inner end of the electroplating tank, and the top surface of the partition plate is in the same horizontal plane as the top surface of the electroplating tank body. The electroplating tank body includes a circular groove, a rectangular groove, and a threaded through hole. The bottom surface of the partition plate is provided with a rectangular groove, and the length of the rectangular groove is consistent with the width of the electroplating tank. A circular groove is provided at the center of the top surface of the partition plate, and a threaded through hole connected to the rectangular groove is provided at the axial center of the bottom surface of the inner end of the circular groove.

[0008] Furthermore, the electroplating tank body includes a slide groove, a slide groove is provided on the front side and the rear side of the inner end of the electroplating tank, and the slide groove is located at the adjacent open end of the electroplating tank, the left end of the slide groove contacts the left side of the inner end of the electroplating tank, and the right end of the slide groove contacts the left end of the partition plate, the sliding plate includes a pull plate and a sponge block, the length of the sliding plate is consistent with the width of the electroplating tank, and a slider is provided on the front and rear ends of the sliding plate, and the two sliders are respectively slidably connected to the two slide grooves, the bottom end surface of the sliding plate is provided with a sponge block of the same length as the sliding plate, and the top end surface of the sliding plate is provided with a pull plate. The electroplating tank body includes a recessed groove, a recessed groove is provided on the bottom surface of the inner end of the electroplating tank adjacent to the right side of the inner end of the electroplating tank, and the width of the recessed groove is smaller than the distance between the right end surface of the partition plate and the right side of the inner end of the electroplating tank, the bottom surface of the inner end of the electroplating tank is an inclined surface structure with the left side higher and the right side lower, and the bottom surface of the inner end of the electroplating tank and the left side of the recessed groove are transitionally connected by an inclined ramp.

[0009] Furthermore, the sealing mechanism includes a rectangular sealing block, a bearing, and a screw. A screw is rotatably connected to the center of the top surface of the rectangular sealing block via a set of bearings. The rectangular sealing block is slidably connected within the rectangular groove. The screw is threadedly connected to the threaded through hole. When the top surface of the screw head and the top surface of the partition plate are in the same horizontal plane, the distance between the bottom surface of the screw head and the bottom surface of the inner end of the circular groove is consistent with the distance between the bottom surface of the current rectangular sealing block and the bottom surface of the inner end of the electroplating tank. The bottom surface of the rectangular sealing block adopts an inclined surface structure with the left side higher and the right side lower, and the bottom surface of the rectangular sealing block and the bottom surface of the inner end of the electroplating tank are parallel to each other.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] The present invention provides a slide groove on the front side and the rear side of the inner end of the electroplating tank, and the slide groove is located at the open end of the adjacent electroplating tank. The left end of the slide groove contacts the left side of the inner end of the electroplating tank, and the right end of the slide groove contacts the left end surface of the partition plate. A sliding plate is slidably installed between the two slide grooves. Therefore, when cleaning impurities floating on the liquid surface of the electroplating solution, the sliding plate can be pulled back and forth along the two slide grooves by grasping the pull plate, so that the sponge block provided on the bottom end surface of the sliding plate contacts the impurities floating on the liquid surface of the electroplating solution. Through the characteristics of the porous material of the sponge block, the impurities floating on the liquid surface of the electroplating solution are blocked and adsorbed into the gaps in the sponge block, thereby realizing the cleaning operation of the impurities floating on the liquid surface of the electroplating solution.

[0012] The bottom surface of the inner end of the electroplating tank of the present invention is an inclined surface structure with the left side higher and the right side lower. Therefore, impurities deposited in the bottom of the electroplating solution will slide into the recessed groove along the inclined surface of the electroplating tank. When the electroplating solution needs to be cleaned of impurities, after waiting for the impurities to settle for a period of time, more than 98% of the impurities are located in the recessed groove. Therefore, the staff can twist the screw along the threaded through hole through the tool, and the bearing converts the rotary motion of the screw into a linear motion to push the rectangular closing block down along the rectangular groove. The bottom end surface of the rectangular closing block of the present invention adopts an inclined surface structure with the left side higher and the right side lower, and the bottom end surface of the rectangular closing block is parallel to the bottom surface of the inner end of the electroplating tank. Therefore, the rectangular closing block slides down the rectangular groove until its bottom end surface is parallel to the electroplating tank. The bottom surfaces of the inner ends of the plating tanks are tightly attached, and the plating tanks are divided into two chambers, one large and one small. The staff can then add plating liquid to the small chamber until the liquid level in the small chamber is higher than the top surface of the sleeve. At this time, the siphon condition is met, and the plating liquid in the small chamber is extracted and input into the delivery pipe along the channel formed between the circular delivery cavity and the outer peripheral surface of the delivery pipe, and discharged from the right-angle bend pipe, thereby realizing the cleaning operation of residual impurities in the plating liquid in the plating tank. Moreover, the present invention is different from the traditional method of cleaning residual impurities in the plating liquid. It is not necessary to discharge all the plating liquid in the plating tank to clean the residual impurities in the plating liquid. The operation is simpler and more convenient, and the loss of plating liquid is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic cross-sectional structural diagram of the present invention.

[0014] Figure 2 The present invention Figure 1 Schematic diagram of the locally enlarged structure at point A in the middle.

[0015] Figure 3 The present invention Figure 2 Schematic diagram of the structure with the middle closing mechanism removed.

[0016] Figure 4 The present invention Figure 1 Schematic diagram of the locally enlarged structure at point B in the middle.

[0017] Figure 5 It is a partially enlarged structural schematic diagram of the impurity output mechanism of the present invention.

[0018] Figure 6 The present invention Figure 1 Schematic diagram of the structure when the middle sealing mechanism and impurity output mechanism are removed.

[0019] In the figure, the corresponding relationship between the component names and the drawing numbers is as follows:

[0020] 1. Electroplating tank body; 101. Electroplating tank; 102. Support frame; 103. Partition plate; 104. Slide groove; 105. Recessed groove; 106. Fixed connection seat; 107. Circular groove; 108. Rectangular groove; 109. Threaded through hole; 1010. Circular mounting hole; 2. Sliding plate; 201. Pull plate; 202. Sponge block; 3. Closing mechanism; 301. Rectangular closing block; 302. Bearing; 303. Screw; 4. Impurity output mechanism; 401. Delivery pipe; 402. Right-angle bend pipe; 403. Sleeve column; 404. Circular delivery cavity. DETAILED DESCRIPTION

[0021] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0022] In the description of the present invention, unless otherwise specified, "plurality" means two or more; terms such as "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," and "tail" indicate positions or relationships based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0024] Example:

[0025] As attached Figure 1 To the attached Figure 6 As shown:

[0026] The present invention provides a precision instrument electroplating method, which is achieved by using a precision instrument electroplating device to complete the electroplating of the precision instrument; the precision instrument electroplating device comprises: a plating tank body 1, a closing mechanism 3 is slidably installed on the right side of the plating tank body 1, and a sliding plate 2 is slidably installed on the left side of the plating tank body 1; the plating tank body 1 comprises a plating tank 101, a supporting frame 102 and a partition plate 103, the top surface of the plating tank body 1 is provided with a plating tank 101, the bottom surface of the plating tank body 1 is provided with a sealing mechanism 3, and the bottom surface of the plating tank body 1 is provided with a sealing mechanism 3. The end face is fixedly installed with a support frame 102, and a partition plate 103 is fixedly connected to the right side of the inside of the electroplating tank 101, and the front end face and the rear end face of the partition plate 103 are fixedly connected to the front side and the rear side of the inner end of the electroplating tank 101 respectively. The bottom end face of the partition plate 103 is higher than the bottom end face of the inner end of the electroplating tank 101, and the top end face of the partition plate 103 is in the same horizontal plane as the top end face of the electroplating tank body 1; the electroplating tank body 1 includes a circular groove 107, a rectangular groove 108 and a threaded through hole 109, and the bottom end face of the partition plate 103 is provided with a rectangular groove. Groove 108, and the length of the rectangular groove 108 is consistent with the width of the electroplating tank 101, a circular groove 107 is opened at the center of the top surface of the partition plate 103, and a threaded through hole 109 connected to the rectangular groove 108 is opened at the axial center of the bottom surface of the inner end of the circular groove 107; the impurity output mechanism 4 is fixedly installed on the right side of the closing mechanism 3 inside the electroplating tank body 1; the electroplating tank body 1 includes a slide groove 104, and a slide groove 104 is opened on the front side and the rear side of the inner end of the electroplating tank 101, and the slide groove 104 is located at the adjacent At the open end of the electroplating tank 101, the left end of the chute 104 contacts the left side of the inner end of the electroplating tank 101, and the right end of the chute 104 contacts the left end of the partition plate 103. The sliding plate 2 includes a pull plate 201 and a sponge block 202. The length of the sliding plate 2 is consistent with the width of the electroplating tank 101. The front and rear ends of the sliding plate 2 are each provided with a slider, and the two sliders are respectively slidably connected to the two chute 104. The bottom end surface of the sliding plate 2 is provided with a sponge block 202 of the same length as the bottom end surface of the sliding plate 2, and the top end surface of the sliding plate 2 is provided with a pull plate 201.The electroplating tank body 1 includes a fixed connection seat 106 and a circular mounting hole 1010. A circular mounting hole 1010 is opened at the center of the bottom surface of the inner end of the recessed groove 105 and penetrates the bottom surface of the electroplating tank body 1. A fixed connection seat 106 is welded to the side portion of the right side surface of the inner end of the electroplating tank 101. The impurity output mechanism 4 includes a delivery pipe 401, a right-angle bend pipe 402, a sleeve 403 and a circular delivery cavity 404. The bottom end of the delivery pipe 401 passes through the circular mounting hole 1010 and is fixedly connected to it, and A right-angled bend tube 402 is fixedly connected to the bottom end of the delivery tube 401. A coaxial sleeve 403 is sleeved onto the top end of the delivery tube 401. A circular delivery cavity 404 is defined at the axial center of the bottom end of the sleeve 403. The diameter of the circular delivery cavity 404 is larger than that of the delivery tube 401. The top end of the sleeve 403 is fixedly connected to the fixed connection seat 106. The inner top surface of the circular delivery cavity 404 is higher than the top end of the delivery tube 401. The bottom end of the sleeve 403 is flush with the bottom end of the partition plate 103.

[0027] Among them, the electroplating tank body 1 includes a recessed groove 105, and a recessed groove 105 is opened on the bottom surface of the inner end of the electroplating tank 101 adjacent to the right side surface of the inner end of the electroplating tank 101, and the width of the recessed groove 105 is smaller than the distance between the right end surface of the partition plate 103 and the right side surface of the inner end of the electroplating tank 101. The bottom surface of the inner end of the electroplating tank 101 is an inclined surface structure with the left side higher and the right side lower, and the bottom surface of the inner end of the electroplating tank 101 and the left side surface of the recessed groove 105 are connected by an inclined ramp.

[0028] Among them, the closing mechanism 3 includes a rectangular closing block 301, a bearing 302 and a screw 303. The center part of the top surface of the rectangular closing block 301 is rotatably connected to a screw 303 through a group of bearings 302. The rectangular closing block 301 is slidably connected in the rectangular groove 108. The screw 303 is threadedly connected to the threaded through hole 109. When the top surface of the screw head 303 and the top surface of the partition plate 103 are in the same horizontal plane, the distance between the bottom surface of the screw head 303 and the bottom surface of the inner end of the circular groove 107 is consistent with the distance between the bottom surface of the current rectangular closing block 301 and the bottom surface of the inner end of the electroplating tank 101.

[0029] Among them, the bottom end surface of the rectangular closing block 301 adopts an inclined surface structure with the left side higher and the right side lower. The bottom end surface of the rectangular closing block 301 is parallel to the bottom surface of the inner end of the electroplating tank 101. Therefore, the rectangular closing block 301 slides down along the rectangular groove 108 until its bottom end surface is tightly attached to the bottom surface of the inner end of the electroplating tank 101, dividing the electroplating tank 101 into two chambers, one large and one small.

[0030] The precision instrument electroplating method specifically comprises the following steps:

[0031] After the electroplating process is completed, some impurities will float on the surface of the electroplating solution; the front side and the rear side of the inner end of the electroplating tank 101 of the present invention are both provided with a slide groove 104, and the slide groove 104 is located at the open end of the adjacent electroplating tank 101, the left end of the slide groove 104 contacts the left side of the inner end of the electroplating tank 101, and the right end of the slide groove 104 contacts the left end surface of the partition plate 103, and a sliding plate 2 is slidably installed between the two slide grooves 104. Therefore, when cleaning impurities floating on the liquid surface of the electroplating solution, the sliding plate 2 can be pulled back and forth along the two slide grooves 104 by grasping the pulling plate 201, so that the sponge block 202 provided on the bottom end surface of the sliding plate 2 contacts the impurities floating on the liquid surface of the electroplating solution, and the impurities floating on the liquid surface of the electroplating solution are blocked and adsorbed into the gaps in the sponge block 202 due to the characteristics of the porous material of the sponge block 202, thereby achieving the cleaning operation of the impurities floating on the liquid surface of the electroplating solution;

[0032] Furthermore, after the electroplating process is completed, a small amount of impurities will remain in the plating solution in the electroplating tank 101; the bottom surface of the inner end of the electroplating tank 101 of the present invention is an inclined surface structure with the left side higher and the right side lower, so the impurities deposited at the bottom of the electroplating solution will slide along the inclined surface of the electroplating tank 101 into the recessed tank 105, and because the bottom surface of the inner end of the electroplating tank 101 and the left side of the recessed tank 105 are transitionally connected by an inclined ramp, the setting of the inclined ramp can block the impurities moving into the recessed tank 105, and prevent the impurities sliding into the recessed tank 105 from being affected by the water flow of the electroplating solution and escaping from the recessed tank 105, so that when the electroplating solution needs to be cleaned, When impurities are removed, after waiting for the impurities to settle for a period of time, more than 98% of the impurities are located in the concave groove 105. Therefore, the staff can twist the screw 303 along the threaded through hole 109 through the tool. Since the screw 303 and the rectangular closing block 301 are rotatably connected through the bearing 302, the bearing 302 converts the rotary motion of the screw 303 into a linear motion to push the rectangular closing block 301 down along the rectangular groove 108. The bottom end surface of the rectangular closing block 301 of the present invention adopts an inclined surface structure with the left side higher and the right side lower, and the bottom end surface of the rectangular closing block 301 is parallel to the bottom surface of the inner end of the electroplating tank 101. The rectangular closing block 301 slides down the groove 108 until its bottom surface is tightly attached to the bottom surface of the inner end of the electroplating tank 101. At this time, the electroplating tank 101 is divided into two chambers, one large and one small. Then the staff can add electroplating solution to the small chamber until the liquid level in the small chamber is higher than the top surface of the sleeve 403. At this time, the siphon condition is met, and the electroplating solution in the small chamber is drawn into the delivery pipe 401 along the channel formed between the circular delivery cavity 404 and the outer peripheral surface of the delivery pipe 401, and is discharged from the right-angle bend pipe 402. Because the impurity output mechanism 4 is located in the depressed groove 105, when the electroplating solution in the small chamber is drawn, Impurities in the recessed groove 105 will be extracted at the same time. Since the recessed groove 105 is located close to the bottom end surface of the sleeve 403, when the level of the electroplating solution in the small chamber is lower than the bottom end surface of the sleeve 403 and before the siphon condition disappears, all impurities in the recessed groove 105 will be transported out along with the extracted electroplating solution through the impurity output mechanism 4, thereby achieving the cleaning operation of the residual impurities in the electroplating solution in the electroplating tank 101. Moreover, the present invention is different from the traditional method of cleaning residual impurities in the electroplating solution. It is not necessary to discharge all the electroplating solution in the electroplating tank 101 in order to clean the residual impurities in the electroplating solution. The operation is simpler and more convenient, and the loss of the electroplating solution is greatly reduced.

[0033] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A precision instrument electroplating method, characterized in that: The precision instrument electroplating method is achieved by using precision instrument electroplating equipment, thereby completing the electroplating of the precision instrument; the precision instrument electroplating equipment includes an electroplating tank body (1), a closing mechanism (3) is slidably installed on the right side of the electroplating tank body (1), and a sliding plate (2) is slidably installed on the left side of the electroplating tank body (1); an impurity output mechanism (4) is fixedly installed on the right side of the closing mechanism (3) inside the electroplating tank body (1); the electroplating tank body (1) includes a fixed connecting seat (106) and a circular mounting hole (1010), a circular mounting hole (1010) is opened at the center of the bottom surface of the inner end of the recessed groove (105) and passes through the bottom surface of the electroplating tank body (1), and the electroplating tank body (1) is fixedly installed on the right side of the closing mechanism (3). A fixed connection seat (106) is welded on the side of the right side surface of the inner end of the plating tank (101). The impurity output mechanism (4) includes a delivery pipe (401), a right-angle bent pipe (402), a sleeve (403) and a circular delivery cavity (404). The bottom end of the delivery pipe (401) passes through the circular mounting hole (1010) and is fixedly connected thereto. The bottom end of the delivery pipe (401) is fixedly connected to a right-angle bent pipe (402). The top end of the delivery pipe (401) is sleeved with a sleeve (403) coaxial with the sleeve (403). A circular delivery cavity (404) is opened at the axial center of the bottom end surface of the sleeve (403). The diameter of the circular delivery cavity (404) is larger than the diameter of the delivery pipe (401). The sleeve (403) is fixed to the bottom end of the delivery pipe (401). 03) is fixedly connected to the fixed connection seat (106), the top surface of the inner end of the circular conveying cavity (404) is higher than the top surface of the conveying pipe (401), and the bottom surface of the sleeve (403) and the bottom surface of the partition plate (103) are in the same horizontal plane; the electroplating tank body (1) includes an electroplating tank (101), a support frame (102) and a partition plate (103), the top surface of the electroplating tank body (1) is provided with an electroplating tank (101), the bottom surface of the electroplating tank body (1) is fixedly installed with the support frame (102), and a partition plate (103) is fixedly connected to the right side of the inside of the electroplating tank (101), and the front end surface and the rear end surface of the partition plate (103) are respectively connected to the front side surface and the rear end surface of the inner end of the electroplating tank (101). The bottom end surface of the partition plate (103) is higher than the bottom surface of the inner end of the electroplating tank (101), and the top end surface of the partition plate (103) is in the same horizontal plane as the top end surface of the electroplating tank body (1); the electroplating tank body (1) includes a circular groove (107), a rectangular groove (108) and a threaded through hole (109); the bottom end surface of the partition plate (103) is provided with a rectangular groove (108), and the length of the rectangular groove (108) is consistent with the width of the electroplating tank (101); the center of the top end surface of the partition plate (103) is provided with a circular groove (107), and the axial center of the bottom end surface of the circular groove (107) is provided with a threaded through hole (109) connected to the rectangular groove (108);The electroplating tank body (1) includes a slide groove (104), and the front side and the rear side of the inner end of the electroplating tank (101) are both provided with a slide groove (104), and the slide groove (104) is located at the opening end of the adjacent electroplating tank (101), the left end of the slide groove (104) contacts the left side of the inner end of the electroplating tank (101), and the right end of the slide groove (104) contacts the left end of the partition plate (103), the sliding plate (2) includes a pull plate (201) and a sponge block (202), and the length of the sliding plate (2) is the same as that of the electroplating tank (101). ) width is consistent, and a slider is provided on the front end face and the rear end face of the sliding plate (2), and the two sliders are respectively connected to the two sliding grooves (104) in a sliding manner, the bottom end face of the sliding plate (2) is provided with a sponge block (202) of the same length as the sliding plate (2), and the top end face of the sliding plate (2) is provided with a pulling plate (201); the electroplating tank body (1) includes a recessed groove (105), and a recessed groove (105) is provided on the right side of the inner end of the electroplating tank (101) adjacent to the bottom surface of the inner end of the electroplating tank (101). ), and the width of the recessed groove (105) is smaller than the distance between the right end surface of the partition plate (103) and the right side surface of the inner end of the electroplating tank (101), the bottom surface of the inner end of the electroplating tank (101) is an inclined surface structure with the left side higher and the right side lower, and the bottom surface of the inner end of the electroplating tank (101) and the left side of the recessed groove (105) are transitionally connected by an inclined ramp; the closing mechanism (3) includes a rectangular closing block (301), a bearing (302) and a screw (303), and the center part of the top end surface of the rectangular closing block (301) is connected by a group of bearings (302) is rotatably connected with a screw (303), and the rectangular closing block (301) is slidably connected in the rectangular groove (108); the screw (303) is threadedly connected to the threaded through hole (109), and when the top surface of the screw (303) head end and the top surface of the partition plate (103) are in the same horizontal plane, the distance between the bottom surface of the screw (303) head end and the bottom surface of the inner end of the circular groove (107) is consistent with the distance between the bottom surface of the current rectangular closing block (301) and the bottom surface of the inner end of the electroplating tank (101).

2. A precision instrument electroplating method as claimed in claim 1, characterized in that: The bottom end surface of the rectangular closed block (301) adopts an inclined surface structure with the left side higher and the right side lower. The bottom end surface of the rectangular closed block (301) and the inner end bottom surface of the electroplating tank (101) are parallel to each other.

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