Intelligent power module and manufacturing method thereof

Abstract

The present invention relates to an intelligent power module and a manufacturing method thereof, which includes an MCU control circuit, a rectification circuit and an inverter circuit. The MCU control circuit, the rectification circuit and the inverter circuit are respectively arranged on separate circuit boards, so that the MCU control circuit operating at low voltage is isolated from the circuit boards of the rectification circuit and the inverter circuit operating at high voltage, thereby greatly reducing the influence of the control signal by the surrounding high voltage or electromagnetic signals. Moreover, compared with the IPM module solution without integrated MCU in the prior art, the length of the control signal line can be greatly shortened, the signal transmission efficiency can be improved, and further the influence of the control signal by the surrounding high voltage or electromagnetic signals can be reduced, so as to effectively enhance the anti-interference EMS ability of the IPM operation, and thus improve the reliability of the whole IPM module operation.

Description

Technical Field

[0001] The present invention relates to an intelligent power module and a manufacturing method thereof, belonging to the technical field of power semiconductor devices. Background Art

[0002] An intelligent power module, namely IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technologies. The intelligent power module integrates power switching devices and high-voltage drive circuits, and internally incorporates fault detection circuits such as overvoltage, overcurrent, and overheating. Currently, in the design of existing IPM modules, generally, low-voltage control circuits such as IC drive control circuits, IPM sampling and amplification circuits, and PFC current protection circuits are arranged on the same circuit board as the inverter circuit composed of high-voltage power devices. Since some of these circuits operate at low voltages (such as below 15V) like the IC drive control circuit, and some operate at high voltages (such as 200 - 300V) like the inverter circuit, when arranged on the same board, the high-voltage operating circuits are likely to interfere with the low-voltage operating circuits, and in severe cases, it will affect the control of the inverter circuit by the control circuit, resulting in chaos and thus affecting the reliability of the IPM module operation. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to solve the problem that in the existing IPM module, since all circuits are arranged on the same circuit board, the high-voltage operating circuits inside interfere with the low-voltage operating circuits, thus affecting the operation reliability of the IPM module.

[0004] Specifically, the present invention discloses an intelligent power module, including: a first circuit board and a plurality of second circuit boards. The first circuit board and the plurality of second circuit boards are arranged on the same layer. The intelligent power module includes a plurality of unit circuits, and the plurality of unit circuits include at least two of an MCU control circuit, an inverter circuit, and a rectifier circuit. Among them, the MCU control circuit is arranged on the first circuit board, and the inverter circuit and the rectifier circuit are respectively arranged on each second circuit board. The working heat generation of the first circuit board is lower than that of the second circuit board.

[0005] Optionally, the intelligent power module further includes a drive circuit for driving the inverter circuit to operate, and the drive circuit is arranged on the first circuit board.

[0006] Optionally, the intelligent power module is provided with a first pin group for inputting control signals to the MCU control circuit and a second pin group for outputting drive signals for driving the load to work by the inverter circuit. The first pin group and the second pin group are respectively arranged on opposite sides of the intelligent power module. Among them, the first circuit board is arranged close to the side of the first pin group, and the plurality of second circuit boards are arranged side by side close to the side of the second pin group.

[0007] Optionally, the first circuit board and the second circuit board are made of different materials. The first circuit board is a glass fiber board or a flexible copper clad laminate, and the second circuit board is a metal board or a non-metal board.

[0008] Optionally, the intelligent power module further includes a PFC circuit, which is disposed on another second circuit board.

[0009] Optionally, the intelligent power module further includes a sealing layer. The first circuit board is coated within the sealing layer, and the other side of each second circuit board where the electronic components are mounted is exposed from the sealing layer.

[0010] Optionally, the intelligent power module further includes a heat sink, which is mounted on the other side of the second circuit board.

[0011] Optionally, there are multiple second circuit boards on which the inverter circuit is disposed.

[0012] Optionally, the intelligent power module further includes multiple bonding wires, which are connected between the first circuit board, the second circuit board, and the pins disposed on the first circuit board and the second circuit board.

[0013] The present invention also discloses a manufacturing method of the intelligent power module as described above. The manufacturing method includes the following steps:

[0014] Configure multiple substrates, on the surface of each of which a circuit wiring layer is provided, and the circuit wiring layer is provided with multiple pads;

[0015] Configure electronic components and pins on the surface of the circuit wiring layer, so that the electronic components and pins are fixed to the pads and electrically connected to the pads, thereby forming the first circuit board and multiple second circuit boards respectively. The MCU control circuit is disposed on the first circuit board, and the inverter circuit and the rectifier circuit are respectively disposed on each second circuit board;

[0016] Connect bonding wires between multiple electronic components, circuit layers, and pins;

[0017] Inject the first circuit board and the multiple second circuit boards through a packaging mold to form a sealing layer. The sealing layer coats the first circuit board, and the sealing layer coats the side of the second circuit board where the electronic components are mounted, and the pins are exposed from the sealing layer;

[0018] Cut and shape the pins to form the intelligent power module, and test the formed intelligent power module.

[0019] The intelligent power module of the present invention includes an MCU control circuit, a rectification circuit, and an inversion circuit. The MCU control circuit, the rectification circuit, and the inversion circuit are respectively arranged on separate circuit boards, so that the MCU control circuit operating at low voltage is isolated from the circuit boards of the rectification circuit and the inversion circuit operating at high voltage, thereby greatly reducing the influence of control signals by surrounding high-voltage or electromagnetic signals. Moreover, compared with the IPM module solution without integrated MCU in the prior art, the length of the control signal line can be greatly shortened, the signal transmission efficiency can be improved, and further the influence of control signals by surrounding high-voltage or electromagnetic signals can be reduced, thereby effectively enhancing the anti-interference EMS ability of the IPM operation and improving the reliability of the entire IPM module operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a top view of the IPM module according to an embodiment of the present invention with the sealing layer removed from the side where electronic components are mounted on the circuit board;

[0021] Figure 2 is a cross-sectional view of the IPM module according to an embodiment of the present invention in the left-right direction;

[0022] Figure 3 is a cross-sectional view of the IPM module according to an embodiment of the present invention in the up-down direction.

[0023] REFERENCE SIGNS:

[0024] First circuit board 1, MCU control circuit 11, drive circuit 12, first substrate 13, second circuit board 2, rectification circuit 21, PFC circuit 22, first inversion circuit 23, second inversion circuit 24, second substrate 25, pins 3, pin connection frame 31, bonding wire 4, sealing layer 5, IGBT 61, MCU 62, drive chip 63, freewheeling diode 64, heat sink 7. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] It should be noted that, without conflict in structure or function, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to examples.

[0026] The present invention provides an intelligent power module, namely an IPM module, as Figures 1 to 3As shown, the IPM module includes a plurality of circuit boards, namely the first circuit board 1 and a plurality of second circuit boards 2. The first circuit board 1 and the plurality of second circuit boards 2 are arranged on the same layer. The intelligent power module includes a plurality of unit circuits, and the plurality of unit circuits include at least two of the MCU control circuit 11, the inverter circuit, and the rectifier circuit 21. The MCU control circuit 11 is arranged on the first circuit board 1, and the inverter circuit and the rectifier circuit 21 are respectively arranged on each second circuit board 2. The MCU control circuit 11 operates in the weak current area, such as a voltage of 5-12V, and mainly includes the MCU62 chip. The inverter circuit is such as Figure 1The first inverter circuit 23 therein mainly includes six switching transistors in the upper and lower bridge arms, such as IGBT 61 (Insulated Gate Bipolar Transistor), and the inverter circuit and the rectifier circuit 21 operate at a high voltage, such as 200 - 300V. By separately arranging the control circuit in the low-voltage area and the control circuit in the high-voltage area on different circuit boards, the low-voltage working area and the high-voltage working area are well isolated. Since the control signal trace of the MCU control circuit 11 is the output PWM signal to control the working state of the switching transistors in the inverter circuit, such as the working frequency, etc., its control signal line is easily interfered by the surrounding high-voltage signals or electromagnetic signals during operation. Seriously, it may cause signal distortion, resulting in disordered operation of the switching transistors, and ultimately abnormal operation of the IPM module. In severe cases, module short-circuit may occur, causing a sharp increase in current and resulting in its damage. By independently isolating the circuit board where the MCU control circuit 11 is located from the circuit boards where the inverter circuit and the rectifier circuit 21 are located, the influence of the control signal by the surrounding high-voltage or electromagnetic signals is greatly reduced; moreover, compared with the prior art where the IPM module only includes a drive circuit 12 and an inverter, when applying a controller to the IPM module, its MCU is an independent external device. Thus, the control signal trace between the MCU and the IPM module to control the inside of the IPM module is much longer than that of the present application because its trace layout is on the PCB board of the controller rather than on the wiring layer inside the IPM module of the present invention. In the present invention, the MCU is integrated inside the IPM module, which can greatly shorten the length of the control signal line, improve the signal transmission efficiency, and further reduce the influence of the control signal by the surrounding high-voltage or electromagnetic signals, thereby effectively enhancing the anti-interference EMS ability of the IPM operation and improving the reliability of the entire IPM module operation. Moreover, since the first circuit board 1 is mainly provided with the MCU control circuit 11, its working heat generation is significantly less than that of the second circuit board 2 operating in the high-voltage area. By separately arranging these two circuit boards, the heat generation of the second circuit board 2 transmitted to the first circuit board 1 can be significantly reduced because the working temperature of components such as MCU62 is much lower than that of the switching transistors on the inverter of the second circuit board 2, such as IGBT61 or MOS transistor (metal oxide semiconductor), etc. Therefore, the working temperature of the MCU62 components can be minimized, thereby also improving its working stability.

[0027] In some embodiments of the present invention, as Figures 1 to 3 shown, the second circuit board 2 of the inverter circuit is provided in multiple numbers, that is, the IPM module includes multiple inverter circuits, such as Figure 1The first inverter circuit 23 and the second inverter circuit 24 in it. Each inverter circuit can drive a load to work, so that multiple loads can be driven. For example, the compressor and the fan motor can be driven to work simultaneously. In this way, multiple inverter circuits are integrated inside the IPM module, which can better adapt to the application scenario that needs to drive multiple loads at the same time. Compared with the prior art that requires multiple IPM modules to be used simultaneously, this application can achieve this function through one IPM module, thereby expanding its application scenario and reducing costs.

[0028] In some embodiments of the present invention, such as Figure 1 shown, the IPM module further includes a drive circuit 12 for driving the inverter circuit to work. The drive circuit 12 is disposed on the first circuit board 1 and mainly consists of a drive chip 63. The control terminal of the drive circuit 12 is connected to the MCU 62, and is disposed on the same circuit board as the MCU 62, that is, the first circuit board 1. Since the control signal line disposed on the first circuit board 1 between the MCU 62 and the drive circuit 12 is a weak current trace, therefore, disposing the drive circuit 12 and the MCU 62 on the same circuit board helps to further shorten the length of the control signal line, improve the signal transmission efficiency, and further reduce the influence of the control signal by the surrounding strong current or electromagnetic signal, thereby improving the anti-interference ability of the IPM module to work. The drive circuit 12 can be multiple to correspondingly drive multiple inverter circuits. For example, Figure 1 there are two drive circuits in

[0029] In some embodiments of the present invention, such as Figure 1 shown, the IPM module further includes a PFC (Power Factor Correction) circuit. The PFC circuit 22 is disposed on another second circuit board 2. Since the PFC circuit 22 also works in the strong current area, it is disposed on the second circuit board 2 to be isolated from the first circuit board 1.

[0030] In some embodiments of the present invention, such as Figures 1 to 3 shown, the intelligent power module is provided with a first pin group for inputting control signals to the MCU control circuit 11, and a second pin group for outputting drive signals of the inverter circuit to drive the load to work. The first pin group and the second pin group are respectively disposed on opposite sides of the intelligent power module. The first circuit board 1 is disposed close to the side of the first pin group, and multiple second circuit boards 2 are arranged side by side close to the side of the second pin group. For example, Figure 1As shown, pin 3 of the IPM module is distributed on its upper and lower sides, thereby forming upper and lower two-way pin groups respectively. The first circuit board 1 of the MCU control circuit 11 is arranged above the IPM module. If the first substrate 13 also arranges the drive circuit 12 at the same time, the occupied area is relatively large after adding the MCU control circuit 11. Therefore, it is arranged in a long strip above the IPM module. A plurality of second circuit boards 2 are respectively provided with a rectification circuit 21, a plurality of inverter circuits, etc. arranged in parallel. The area of each second circuit board 2 is relatively smaller than that of the first circuit board 1, and it is square and close to a square. These second circuit boards 2 are arranged in parallel below the IPM module. The pin 3 of the control signal input to the MCU 62 is connected to the upper pin group. Further, when the first circuit board 1 also arranges a plurality of drive circuits 12, the weak-current pins 3 related to the drive circuit 12, such as the pins 3 connected to its internal bootstrap circuit, are also arranged in the upper pin group. These pins 3 form the first pin group, and the first pin group mainly transmits weak-current signals. The signals output from the plurality of second circuit boards 2 are mainly strong-current signals, such as the high-voltage pulsating direct current (200 - 300V) output by the rectification circuit 21, the three-phase high-voltage signals for driving the motor windings output by the inverter circuit, etc. These signals are connected to the lower pin group, thereby forming the second pin group. Through such a layout of the first circuit board 1 and the plurality of second circuit boards 2, the first circuit board and the plurality of second circuit boards 2 are compactly arranged, the occupied area of the entire circuit board is reasonably optimized and reduced, and the weak-current control signal input to the MCU 62 is placed in the first pin group, while the strong-current output signals of the inverter circuit and the rectification circuit 21 are placed in the second pin group. In this way, the pins 3 of the strong-current and weak-current signals of the IPM module are distributed on both sides of it, achieving the maximum degree of isolation, thereby further reducing the influence of strong current on weak current, and further improving the working reliability of the IPM module.

[0031] In some embodiments of the present invention, since the first circuit substrate 1 mainly works in the weak current area, the second circuit substrate 2 works in the strong current area, and the heating power of the second circuit substrate 2 is greater than that of the first circuit substrate 1, the materials of the two substrates can be set to be different, so as to achieve cost optimization. For example, the body of the plurality of second substrates 25, i.e., the second substrate 25, can be a metal substrate, whose main body is made of a metal material with good thermal conductivity, such as aluminum, copper, etc., an insulating medium layer is attached to the first surface of the metal substrate, and a circuit layer is placed on the insulating medium layer. The circuit layer can be formed by etching copper foil, or it can be formed by printing a paste-like conductive medium. The conductive medium can be a conductive material such as graphene, solder paste, silver glue, etc. A mounting position for mounting electronic components, i.e., a solder pad, is provided on the circuit layer. The plurality of second substrates 25 can also be a non-metallic substrate, whose main body is made of an insulating material with good thermal conductivity, such as glass, ceramic, etc., and a circuit layer is placed on the first surface of the non-metallic substrate. The circuit layer process is the same as the metal substrate circuit layer, and it does not include an insulating layer relative to the metal substrate because its body is an insulating material. The first circuit substrate 1 generates very little heat and does not need to be cooled. Its main body, namely the first substrate 13, can be made of fiberglass board or flexible copper clad board, which is cheaper than the second circuit substrate 2, thereby reducing the cost of the entire circuit substrate.

[0032] In some embodiments of the present invention, Figures 1 to 3 As shown, the IPM module is provided with a sealing layer 5, and the first circuit substrate 1 is provided to be enclosed in the sealing layer 5, and the other side of each second circuit substrate 2 relative to the installation of electronic components is exposed from the sealing layer 5. The first circuit substrate 1 works in the weak current area, and it mainly transmits the weak current control signal connected to the MCU 62, while the second circuit substrate 2 works in the strong current area, and the current it transmits is large, so the power consumption of the work is high, and the heat generation is much larger than that of the first circuit. Therefore, the first circuit substrate 1 is completely enclosed in the sealing layer 5, and the other side of the second circuit substrate 2 relative to the installation of electronic components, that is, the heat dissipation surface, is exposed from the sealing layer 5, so that the second circuit substrate 2 is half-enclosed. The first circuit substrate 1 is well protected by the fully enclosed sealing layer 5. For example, the first circuit substrate 1 can adopt a flexible copper-clad plate, so the fully enclosed structure can achieve good protection to prevent damage caused by external objects touching it, and reduce the influence of external interference signals on the first circuit substrate 1; and the heat dissipation surface of the second circuit substrate 2 is exposed from the sealing layer 5, which can realize good transmission of its heat to the outside of the IPM module, which is conducive to improving its heat dissipation effect.

[0033] Furthermore, in some embodiments of the present invention, the IPM module further includes a heat sink 7, which is mounted on the other side of the second circuit substrate 2. Figure 2 As shown, the heat sink 7 is installed on the heat dissipation surface of the second circuit substrate 2 to dissipate the heat generated by the second circuit substrate 2 .

[0034] In some embodiments of the present invention, as Figures 1 to 3 shown, multiple bonding wires 4 are also provided inside the IPM module, which are connected between electronic components, the circuit layers of the first circuit board 1 and the second circuit board 2, and the pins 3 provided on the first capacitor board and the second circuit board 2. The electronic components are the MCU 62, IGBT 61, driving chip 63, freewheeling diode 64 and others such as resistors and capacitors mentioned in the above embodiments. The bonding wires 4 are usually gold wires, copper wires, gold-copper hybrid wires, or fine aluminum wires of 38 um or less. Specifically, the bonding wires 4 can be connected between electronic components, between an electronic component and a circuit layer, between an electronic component and a pin 3, etc., so as to form the circuit connection of the entire IPM module.

[0035] The present invention also provides a manufacturing method of the intelligent power module mentioned in the above embodiments, which is characterized in that the manufacturing method includes the following steps:

[0036] Step S100: Configure multiple substrates, wherein a circuit layer is provided on the surface of each substrate, and multiple pads are provided on the circuit layer;

[0037] Step S200: Configure electronic components and pins 3 on the surface of the circuit wiring layer, so that the electronic components and pins 3 are fixed to the pads and electrically connected to the pads, so that multiple substrates respectively form a first circuit board 1 and multiple second circuit boards 2, wherein the MCU control circuit 11 is provided on the first circuit board 1, and the inverter circuit and the rectifier circuit 21 are respectively provided on each second circuit board 2;

[0038] Step S300: Connect bonding wires 4 between multiple electronic components, circuit layers, and pins 3;

[0039] Step S400: Inject the first circuit board 1 and multiple second circuit boards 2 through a packaging mold to form a sealing layer 5, wherein the sealing layer 5 covers the first circuit board 1, and the sealing layer 5 covers the side of the second circuit board 2 where the electronic components are installed, and the pins 3 protrude from the sealing layer 5;

[0040] Step S500: Cut and form the pins 3 to form an intelligent power module, and test the formed intelligent power module.

[0041] In step S100, multiple different substrates can be designed according to the circuit layout, and their bodies can be made of metal substrates, non-metal substrates, and flexible copper clad laminates. Among them, different substrates are determined according to the requirements of circuit design. If the circuit involves electronic components with large power and high heat generation, it is preferably a metal substrate or a non-metal substrate. If there are no electronic components with large power in the circuit, only control chips such as the MCU 62, a glass fiber board or a flexible copper clad laminate can be used. Among them, as Figures 1 to 3As shown, the main body of the metal substrate which is the second substrate 25 is made of a metal material with good thermal conductivity, such as aluminum, copper, etc. An insulating dielectric layer is attached to the first surface of the metal substrate, and a circuit layer is placed on the insulating dielectric layer. The circuit layer can be formed by copper foil etching or printed with a paste-like conductive medium. The conductive medium can be conductive materials such as graphene, solder paste, silver paste, etc. The main body of the non-metal substrate is made of an insulating material with good thermal conductivity, such as glass, ceramic, etc. A circuit layer is placed on the first surface of the non-metal substrate. The process of the circuit layer is the same as that of the metal substrate circuit layer, and it does not include an insulating layer relative to the metal substrate because its main body is an insulating material. The flexible copper clad laminate with the main body being the first substrate 13 can form an insulating thin film layer, and then the conductive medium layer is printed on the insulating thin film layer based on the printing process to complete. The specific manufacturing processes of the metal substrate, non-metal substrate, glass fiber board or flexible copper clad laminate are prior arts and will not be elaborated here. A plurality of pads for mounting electronic components are provided on the circuit layer and the flexible copper clad laminate or glass fiber board. These pads form component mounting positions and are also used to connect the bonding wires 4.

[0042] In step S200, the above-mentioned multiple circuit boards can be placed in a carrier, where the carrier can be made of materials such as synthetic stone, ceramic, PPS, etc. that can withstand high temperatures above 200 °C. Then, the electronic components of the power device are mounted on the component mounting positions through a solder paste brushing or silver paste dotting by an automatic die bonding equipment (DA machine), the electronic components such as resistors, capacitors, and MCU62 are mounted on the component mounting positions through an automatic surface mounting SMT equipment, multiple pins 3 are placed on the corresponding mounting positions by a manipulator or manually, and then all the electronic components or devices are soldered to the substrate through a reflow oven. Among them, the control circuit where the MCU62 is located is arranged on a separate substrate to form the first circuit board 1. The substrate of the first circuit board 1 is a glass fiber board or a flexible copper clad laminate. The inverter circuit and the rectifier circuit 21 are respectively arranged on different substrates to form multiple second circuit boards 2. The substrate of the second circuit board 2 is a metal substrate or a non-metal substrate.

[0043] Further, multiple second circuit boards 2 may respectively be provided with multiple inverter circuits, so as to drive multiple loads, for example, the compressor and the fan motor can be driven to work simultaneously. One of the multiple second circuit boards 2 may also be provided with a PFC circuit 22. The first circuit board 1 may also be provided with a drive circuit 12 for driving the inverter circuit to work. The control end of the drive circuit 12 is connected to the MCU 62. Since the control signal line provided on the first circuit board 1 between the MCU 62 and the drive circuit 12 is a weak-current trace, setting the drive circuit 12 and the MCU 62 on the same circuit board helps to further shorten the length of the control signal line, improve the signal transmission efficiency, and further reduce the influence of the surrounding strong current or electromagnetic signals on the control signal, thereby improving the anti-interference ability of the IPM module during operation. There may be multiple such drive circuits 12 to correspondingly drive multiple inverter circuits.

[0044] When these multiple circuit boards are installed in a vehicle, as Figure 1 shown, the first circuit board 1 can be arranged above, and the multiple second circuit boards 2 are arranged in parallel below the first circuit board 1. The multiple pins 3 can be divided into two groups. The first pin group and the second pin group are respectively arranged on the upper and lower sides. The first pin group is close to the outer side of the first circuit board 1, and the second pin group is close to the outer side of the multiple second circuit boards 2. The first pin group is connected to the weak-current control signal input to the MCU 62 and some weak-current signals output by the drive circuit 12, such as the ports of the bootstrap circuit. The second pin group is connected to the drive signal for driving the load to work output by the inverter circuit and the output ports of the PFC circuit 22 and the rectifier circuit 21. The first pin group mainly transmits weak-current signals. The signals output from the multiple second circuit boards 2 are mainly strong-current signals, such as the high-voltage pulsating direct current (200 - 300V) output by the rectifier circuit 21, the three-phase high-voltage signals for driving the motor windings output by the inverter circuit, etc. These signals are connected to the lower pin group to form the second pin group. By arranging the first circuit board 1 and the multiple second circuit boards 2 in this way, the first circuit board and the multiple second circuit boards 2 are compactly arranged, the area occupied by the entire circuit board is reasonably optimized and reduced, and the weak-current control signal input to the MCU 62 is placed in the first pin group, while the strong-current output signals of the inverter circuit and the rectifier circuit 21 are placed in the second pin group, so that the pins 3 of the strong-current and weak-current signals of the IPM module are distributed on both sides of it, achieving the maximum degree of isolation, thereby further reducing the influence of the strong current on the weak current, and further improving the working reliability of the IPM module.

[0045] The pin 3 preferably includes a first pin group and a second pin group connected horizontally, and a pin connection frame 31 connecting the first pin group and the second pin group. The pin connection frame 31 realizes the integral fixation of all the pins 3, facilitating the positioning of the entire circuit board in subsequent manufacturing steps.

[0046] In step S300, this step is for connecting bonding wires 41. Multiple bonding wires 4 can be connected between the bonding pads on the surfaces of electronic components such as IGBT 61 and freewheeling diodes 64 and the bonding pads of the circuit layer, between the bonding pad on the surface of the driving chip 63 and pin 3, and between the other bonding pad on the surface of the driving chip 63 and the other bonding pad on the surface of IGBT 61, thereby forming the circuit connection of the entire IPM module.

[0047] In step S400, this step is for implementing the sealing layer 5. The first semi-finished product formed in the above step S300 can be transported to a packaging mold (not shown in the figure). The packaging mold includes an upper film and a lower film arranged up and down, and pin 3 is fixedly arranged between the upper film and the lower film. The circuit board is positioned by contacting the fixing device located in the lower mold through pin 3 fixedly connected to the circuit board. At least two ejector pins are arranged on the upper mold, and the free ends of the ejector pins can abut against the circuit layer. Through these two ejector pins, the distance between each circuit board and the lower mold can be controlled to achieve positioning. This distance cannot be too far, otherwise it will affect the heat dissipation performance, and this distance cannot be too close, otherwise it will cause problems such as incomplete injection of glue.

[0048] Then, the packaging mold with the circuit board placed inside is closed, and sealing resin is injected through the gate. The sealing method can adopt transfer molding using thermosetting resin or injection molding using thermosetting resin. Moreover, the gas inside the mold cavity corresponding to the sealing resin injected from the gate is discharged to the outside through the exhaust port.

[0049] Finally, demolding is performed. After demolding, the sealing resin forms the sealing layer 5, and the free end of pin 3 exposes from the sealing layer 5.

[0050] The sealing layer 5 completely seals the upper and lower surfaces of the first circuit board 1, and the sealing layer 5 only seals the upper side of the second circuit board 2, that is, the side where the electronic components and pin 3 are installed. The bottom surface of the second circuit board 2, which is the heat dissipation surface, exposes from the sealing layer 5. In this way, the sealing layer 5 completely covers the first circuit board 1 and semi-covers the second circuit board 2. In this way, the first circuit board 1 is well protected through the completely covered sealing layer 5, and it is well protected to prevent damage caused by external objects touching it, and the influence of external interference signals on the first circuit board 1 is reduced; while the heat dissipation surface of the second circuit board 2 exposes from the sealing layer 5, which can achieve good transmission of its heat outside the IPM module, facilitating the improvement of its heat dissipation effect.

[0051] In step S500, this step is to cut and shape pin 3 of the IPM module of the second semi-finished product forming the sealing layer 5. According to the required length and shape for use, pin 3 can be cut to remove the pin connection frame 31, and pin 3 can be shaped; and the IPM module is further tested, such as performing conventional electrical parameter tests, generally including insulation withstand voltage, static power consumption, delay time and other test items, and performing appearance AOI tests, generally including assembly hole size, pin 3 offset and other test items. Those passing the tests are finished products. In this way, the entire manufacturing process of the IPM module is completed.

[0052] The manufacturing method of the IPM module of the present invention configures multiple substrates, where each substrate has a circuit layer on its surface, the circuit layer is provided with multiple pads, and electronic components and pin 3 are arranged on the surface of the circuit wiring layer, so that the electronic components and pin 3 are fixed to the pads and electrically connected to the pads, so that multiple substrates respectively form the first circuit substrate 1 and multiple second circuit substrates 2, where the MCU control circuit 11 is arranged on the first circuit substrate 1, and the inverter circuit and the rectifier circuit 21 are respectively arranged on each second circuit substrate 2. Then, bonding wires 4 are connected between multiple electronic components, the circuit layer and pin 3. Finally, pin 3 is cut and formed to form an intelligent power module, and the formed intelligent power module is tested. By isolating the circuit substrate where the MCU control circuit 11 is located from the circuit substrates where the inverter circuit and the rectifier circuit 21 are located independently, the influence of control signals by surrounding high-voltage electricity or electromagnetic signals is greatly reduced. Moreover, compared with the IPM module solution without integrated MCU in the prior art, the length of the control signal line can be greatly shortened, the signal transmission efficiency can be improved, and further the influence of control signals by surrounding high-voltage electricity or electromagnetic signals can be reduced, thereby effectively enhancing the anti-interference EMS ability of the IPM during operation, and thus improving the reliability of the entire IPM module during operation. And since the first circuit substrate 1 is mainly provided with the MCU control circuit 11, its working heat generation is significantly less than that of the second circuit substrate 2 working in the high-voltage electricity area. By arranging these two circuit substrates independently, the heat generated by the second circuit substrate 2 transmitted to the first circuit substrate 1 can be significantly reduced, so the working temperature of the MCU62 components can be minimized, thereby also improving its working stability.

[0053] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0054] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0055] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0056] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0058] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as a limitation on the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An intelligent power module, characterized in that, Comprising: A first circuit board and a plurality of second circuit boards, the first circuit board and the plurality of second circuit boards being arranged on the same layer. The intelligent power module includes a plurality of unit circuits, and the plurality of unit circuits include at least two of an MCU control circuit, an inverter circuit, and a rectifier circuit. Among them, the MCU control circuit is arranged on the first circuit board, and the inverter circuit and the rectifier circuit are respectively arranged on each of the second circuit boards. The operating heat generation of the first circuit board is lower than that of the second circuit board. It further includes a drive circuit for driving the inverter circuit to operate, and the drive circuit is arranged on the first circuit board. The intelligent power module is provided with a first pin group for inputting control signals to the MCU control circuit, and a second pin group for the inverter circuit to output drive signals for driving the load to operate. The first pin group and the second pin group are respectively arranged on opposite sides of the intelligent power module. Among them, the first circuit board is arranged close to the side of the first pin group, and the plurality of second circuit boards are arranged side by side close to the side of the second pin group. It further includes a PFC circuit, and the PFC circuit is arranged on another second circuit board.

2. The intelligent power module according to claim 1, wherein The materials of the first circuit board and the second circuit board are different. The first circuit board is a fiberglass board or a flexible copper clad laminate, and the second circuit board is a metal substrate or a non-metal substrate.

3. The intelligent power module according to claim 1, wherein It further includes a sealing layer, and the first circuit board is covered within the sealing layer, and the other side of each second circuit board opposite to the side where electronic components are installed is exposed from the sealing layer.

4. The intelligent power module according to claim 3, wherein It further includes a radiator, and the radiator is installed on the other side of the second circuit board.

5. The intelligent power module according to claim 1, wherein The second circuit boards on which the inverter circuit is arranged are multiple.

6. The intelligent power module according to claim 1, characterized in that, It further includes a plurality of bonding wires, and the plurality of bonding wires are connected between the first circuit board, the second circuit board, and the pins arranged on the first circuit board and the second circuit board.

7. A manufacturing method of an intelligent power module according to any one of claims 1 to 6, characterized in that, The manufacturing method includes the following steps: Configure a plurality of substrates, and on the surface of each substrate, a circuit wiring layer is provided, and the circuit wiring layer is provided with a plurality of pads. Configure electronic components and pins on the surface of the circuit wiring layer so that the electronic components and the pins are fixed to the pads and electrically connected to the pads, so that the plurality of substrates respectively form a first circuit board and a plurality of second circuit boards. Among them, the MCU control circuit is arranged on the first circuit board, and the inverter circuit and the rectifier circuit are respectively arranged on each of the second circuit boards. Connect bonding wires between the plurality of electronic components, the circuit wiring layer, and the pins. Inject the first circuit board and the plurality of second circuit boards through a packaging mold to form a sealing layer. Among them, the sealing layer covers the first circuit board, the sealing layer covers the side of the second circuit board where the electronic components are installed, and the pins are exposed from the sealing layer. Cut and form the pins to form the intelligent power module, and test the formed intelligent power module.

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