Electronic device and method of manufacturing the same

Abstract

The present invention discloses an electronic device and a manufacturing method thereof. The electronic device includes a first flexible substrate, a second flexible substrate and a sealing material. The first flexible substrate has a first laser cutting buffer zone, and the first flexible substrate includes a first edge. The second flexible substrate has a second laser cutting buffer zone, and the second flexible substrate includes a second edge. The sealing material is arranged between the first flexible substrate and the second flexible substrate. The sealing material is spaced apart from the first edge by the first laser cutting buffer zone, and the sealing material is spaced apart from the second edge by the second laser cutting buffer zone. In this way, the cracking of the sealing material is reduced.

Description

Technical Field

[0001] The present invention relates to an electronic device and a manufacturing method thereof, and in particular to an electronic device using a flexible substrate as a substrate and a manufacturing method thereof. Background Art

[0002] With the advancement of technology, display devices are gradually developing towards a trend of being lighter and thinner. In liquid crystal display devices, the glass substrate can be replaced by a flexible substrate made of plastic to reduce the overall weight and thickness (which can be called a plastic liquid crystal display (PLCD)). The existing method of making PLCD is to make multiple PLCDs at a time and then cut the PLCDs. However, there are still some problems when cutting multiple PLCDs. For example, laser cutting will generate high temperatures. Therefore, when the cutting line is too close to the sealant, the sealant is prone to cracking, causing liquid crystal leakage. Summary of the invention

[0003] According to one embodiment of the present invention, an electronic device is disclosed. The electronic device includes a first flexible substrate, a second flexible substrate, and a sealing material. The first flexible substrate has a first laser cut buffer zone, and the first flexible substrate includes a first edge. The second flexible substrate has a second laser cut buffer zone, and the second flexible substrate includes a second edge. The sealing material is disposed between the first flexible substrate and the second flexible substrate. The sealing material is spaced apart from the first edge by the first laser cut buffer zone, and the sealing material is spaced apart from the second edge by the second laser cut buffer zone.

[0004] According to another embodiment of the present invention, a method for manufacturing an electronic device is disclosed. First, a mother panel is provided, wherein the mother panel includes a first flexible motherboard, a second flexible motherboard and at least one sealing material, and the sealing material is disposed between the first flexible motherboard and the second flexible motherboard. Next, a separation process is performed to cut the first flexible motherboard into a first flexible substrate, and to cut the second flexible motherboard into a second flexible substrate, wherein the separation process includes performing a laser cutting process. The first flexible substrate has a first laser cutting buffer zone, the first flexible substrate includes a first edge, the second flexible substrate has a second laser cutting buffer zone, and the second flexible substrate includes a second edge. The sealing material is spaced apart from the first edge by the first laser cutting buffer zone, and the sealing material is spaced apart from the second edge by the second laser cutting buffer zone. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 FIG. 1 is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present invention;

[0006] Figure 2 FIG. 1 is a structural schematic diagram of a step in a method for manufacturing an electronic device according to an embodiment of the present invention;

[0007] Figure 3 Shown Figure 2 A schematic cross-sectional view along the section line A-A';

[0008] Figure 4 FIG. 1 is a schematic top view of an electronic device according to a first embodiment of the present invention;

[0009] Figure 5 Shown are partial enlarged top and cross-sectional schematic views of an electronic device according to a first embodiment of the present invention;

[0010] Figure 6 Shown is a schematic diagram of a method for manufacturing an electronic device according to some embodiments of the present invention;

[0011] Figure 7 FIG2 is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention;

[0012] Figure 8 A schematic cross-sectional view of an electronic device according to a third embodiment of the present invention; and

[0013] Fig. 9 FIG. 4 is a schematic top view of an electronic device according to a fourth embodiment of the present invention.

[0014] Description of reference numerals: 10-mother panel; 100, 200, 300, 400-electronic device; 102, 402-first flexible substrate; 102R-first laser cutting buffer; 104-second flexible substrate; 104R-second laser cutting buffer; 12-first flexible motherboard; 126, 226-black matrix layer; 14-second flexible motherboard; 14P-part; 16-sealing material; 16S-outer side; 18-liquid crystal layer; 18L-liquid crystal molecule; 20-carrier; 22, 24-alignment mark; 34-protective film; 328-covering layer; 330-light shielding layer; 332-frame; CL11, CL12, CL13, CL14-first laser cutting line; CL21, CL22, CL23, CL24-second laser cutting line; CL25-laser pre-cutting line; DR-display area; E11, E12, E13, E14, E21, E22, E23, E24, E3, E5-edge; G1, G2, G3, G4, G5, G6-minimum distance; L1, L2-tangent; R-area; S12, S14, S142, S144, S146, S148-step; SS-semi-finished substrate; VD1, VD2-top view direction; D1, D2-direction. DETAILED DESCRIPTION

[0015] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to facilitate the understanding of the readers and simplify the drawings, the multiple drawings in the present invention only depict a portion of the electronic device or splicing device, and at least some of the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present invention.

[0016] Certain words are used throughout the specification and claims to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, the words "having" and "including" are open-ended words and should be interpreted as "including but not limited to..."

[0017] It should be understood that when an element or a film layer is referred to as being disposed "on" or "connected to" another element or film layer, it may be directly on or directly connected to the other element or layer, or there may be an intervening element or film layer between the two (indirect case). Conversely, when an element is referred to as being "directly" "on" or "directly connected to" another element or film layer, there may be no intervening element or film layer between the two.

[0018] The terms "about," "equal to," or "same" generally mean within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0019] Although the terms first, second, third, etc. can be used to describe a variety of components, the components are not limited to these terms. These terms are only used to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but may be replaced by first, second, third, etc. according to the order in which the components are declared in the claims. Therefore, in the following description, the first component may be the second component in the claims.

[0020] It should be noted that the following embodiments may replace, reorganize, or mix the technical features in several different embodiments to complete other embodiments without departing from the spirit of the present invention or causing any conflicts.

[0021] The electronic device of the present invention may include a display device, an antenna device, a sensing device, a light-emitting device, or a splicing device, but is not limited thereto. The electronic device may include a bendable or flexible electronic device. The electronic device may, for example, include a liquid crystal layer, fluorescence, phosphor, a light-emitting diode, other suitable display media, or a combination of the foregoing, but is not limited thereto. The light-emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro light-emitting diode (microLED), a quantum dot light-emitting diode (quantum dot LED, which may include QLED, QDLED) or other suitable materials, or a combination of the foregoing, but is not limited thereto. The following text will use a display device as an electronic device to illustrate the contents of the present invention, but the present invention is not limited thereto.

[0022] Figure 1 FIG. 1 is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 2 FIG. 1 is a structural schematic diagram of a step in a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 3 Shown Figure 2 Schematic cross-sectional view along the section line A-A', Figure 4 FIG. 1 is a schematic top view of an electronic device according to a first embodiment of the present invention. Figure 5 FIG. 1 is a partially enlarged top view and cross-sectional view of an electronic device according to a first embodiment of the present invention, wherein Figure 5 The upper part of Figure 4 An enlarged schematic diagram of region R, Figure 5 The lower half is a schematic cross-sectional view of the upper half along the section line B-B'. Figure 1 As shown, the method for manufacturing an electronic device may include sequentially performing step S12 and step S14. Figures 2 to 4 Describe it in detail. Figures 1 to 3As shown, first, step S12 is performed to provide a mother panel 10. The mother panel 10 may include a first flexible mother board 12, a second flexible mother board 14 and at least one sealing material 16, and the sealing material 16 is disposed between the first flexible mother board 12 and the second flexible mother board 14 to join the first flexible mother board 12 and the second flexible mother board 14. The sealing material 16 may have a ring shape to seal one or more functional elements between the first flexible mother board 12 and the second flexible mother board 14. For example, the sealing material 16 may include a photocurable resin or other suitable materials. In some embodiments, in order to save manufacturing costs, the mother panel 10 may include a plurality of sealing materials 16, each surrounding a corresponding element. The electronic device of this embodiment takes a liquid crystal display device as an example, and the one or more functional elements may include, for example, a liquid crystal layer 18, but is not limited thereto, so each sealing material 16 may seal the corresponding liquid crystal layer 18 between the first flexible mother board 12 and the second flexible mother board 14.

[0023] In some embodiments, a circuit element for controlling the rotation of the liquid crystal molecules 18L of the liquid crystal layer 18 may be formed on the surface of one of the first flexible motherboard 12 and the second flexible motherboard 14 facing the other, which may include, for example, a thin film transistor, a scan line, a data line, and a pixel electrode, etc., but not limited thereto, and a filter element, such as a color filter layer and a black matrix layer, etc., may be selectively formed on the surface of the other of the first flexible motherboard 12 and the second flexible motherboard 14 facing the first one, but not limited thereto. For the sake of clarity, Figure 2 and Figure 3 The circuit elements and filter elements formed on the first flexible mother board 12 and the second flexible mother board 14 are omitted, but the present invention is not limited thereto. According to the type or function of the electronic device, the type and configuration position of the circuit elements and filter elements can be adjusted accordingly, or the electronic device may not include the filter element, and is not limited thereto. Figure 3 In some embodiments, the electronic device may also be a self-luminous display device, such as an organic light emitting diode display device.

[0024] In some embodiments, taking a liquid crystal display device as an example, the formation method of the mother panel 10 can be described as follows. First, a first flexible motherboard 12 formed with circuit elements can be set on a carrier 20, and then a plurality of sealing materials 16 are formed on the first flexible motherboard 12. Next, a liquid crystal layer 18 is filled in the area surrounded by the sealing material 16, and then a second flexible motherboard 14 formed with a filter element is set on the sealing material 16, so that the first flexible motherboard 12 and the second flexible motherboard 14 are bonded together through the sealing material 16 to form the mother panel 10. In some embodiments, the step of bonding the first flexible motherboard 12 and the second flexible motherboard 14 can be performed by aligning the alignment mark 22 on the first flexible motherboard 12 and the corresponding alignment mark 24 on the second flexible motherboard 14 in the horizontal direction. The horizontal direction can include, for example, the direction D1 and / or the direction D2. In some embodiments, the shape or size of the alignment mark 22 and the alignment mark 24 can be the same or different from each other. The method of forming the sealing material 16 and the liquid crystal layer 18 of the present invention is not limited to the above method.

[0025] In some embodiments, when the first flexible motherboard 12 is disposed on the carrier 20 before the second flexible motherboard 14, the motherboard 10 may further include a protective film 34 disposed on the surface of the second flexible motherboard 14 relative to the first flexible motherboard 12, so that the protective film 34 can be used to protect the display area of ​​the electronic device (for example, the area surrounded by the sealing material 16 when viewed from the top direction VD) in the subsequent cutting process to reduce particles attached to the display area or reduce damage to the display area of ​​the electronic device. In some embodiments, the material of the protective film 34 includes, for example, polyethylene (PE). The thickness of the protective film 34 may be, for example, greater than or equal to 20 microns and less than or equal to 40 microns, or 30 microns.

[0026] In some embodiments, the materials of the first flexible motherboard 12 and the second flexible motherboard 14 may include polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN) or polyarylate (PAR), other appropriate materials, or combinations thereof, but not limited thereto.

[0027] like Figures 1 to 5As shown, after step S12, step S14 is performed, that is, a separation process is performed to separate the first flexible motherboard 12 into at least one first flexible substrate 102, and to separate the second flexible motherboard 14 into at least one second flexible substrate 104. In this embodiment, the separation process of step S14 may include steps S142 to S148. Specifically, as Figure 2 and Figure 3 As shown, in step S142, a laser cutting process is performed to form at least one first laser cutting line CL11, at least one first laser cutting line CL12, at least one first laser cutting line CL13, and at least one first laser cutting line CL14 in the first flexible mother substrate 12, and at least one second laser cutting line CL21, at least one second laser cutting line CL22, at least one second laser cutting line CL23, and at least one second laser cutting line CL24 in the second flexible mother substrate 14. In some embodiments, the first laser cutting lines CL11, CL12, CL13, and CL14 may penetrate the first flexible mother substrate 12 to separate the portion of the first flexible mother substrate 12 that serves as the first flexible substrate 102 from other portions to form the first flexible substrate 102. The second laser cutting lines CL21, CL22, CL23, and CL24 may penetrate the second flexible mother substrate 14 to separate the portion of the second flexible mother substrate 14 that serves as the semi-finished substrate SS from other portions to form the semi-finished substrate SS. In this embodiment, when the first flexible motherboard 12 is disposed on the carrier 20 before the second flexible motherboard 14, step S14 may further form at least one laser pre-cut line CL25 in the second flexible motherboard 14. The laser pre-cut line CL25 may divide the semi-finished substrate SS into the second flexible substrate 104 and the portion 14P of the semi-finished substrate SS located between the second laser cutting line CL21 and the laser pre-cut line CL25 (for example, the portion of the second flexible motherboard 14 between the first laser cutting buffer area (such as the first laser cutting buffer area) and the second laser cutting line CL21). Figure 4 and Figure 5 The first laser cutting buffer area 102R shown in FIG. 1 overlaps and is located at the second laser cutting buffer area ( Figure 4 and Figure 5In some embodiments, the laser pre-cut line CL25 may not penetrate the second flexible mother board 14 to reduce or avoid damage to the portion of the circuit element corresponding to the laser pre-cut line CL25 in the top view direction VD, so the portion 14P between the second laser cutting line CL21 and the laser pre-cut line CL25 is still not separated from the portion of the second flexible substrate 104. In some embodiments, the laser pre-cut line CL25 may be formed before or after the first laser cutting lines CL11, CL12, CL13, CL14 and the second laser cutting lines CL21, CL22, CL23, CL24 are formed, or between any two of the first laser cutting lines CL11, CL12, CL13, CL14 and the second laser cutting lines CL21, CL22, CL23, CL24 are formed.

[0028] In this embodiment, the portion of the first flexible motherboard 12 surrounded by the first laser cutting lines CL11, CL12, CL13, and CL14 can form a first flexible substrate 102, and the portion of the second flexible motherboard 14 surrounded by the second laser cutting lines CL22, CL23, CL24 and the laser pre-cutting lines CL25 can form a second flexible substrate 104, and the sealing material can be arranged in the area surrounded by the first laser cutting lines CL11, CL12, CL13, and CL14 and the area surrounded by the second laser cutting lines CL22, CL23, CL24 and the laser pre-cutting lines CL25, so that an electronic device can be defined by the first laser cutting lines CL11, CL12, CL13, CL14 and the second laser cutting lines CL22, CL23, CL24 and the laser pre-cutting lines CL25. The area surrounded by the first laser cutting lines CL11, CL12, CL13, CL14 and the second laser cutting lines CL22, CL23, CL24 and the laser pre-cutting lines CL25 of the present invention is not limited to the above. In this embodiment, the number of the first laser cutting lines CL11, CL12, CL13, CL14 can be multiple, and the number of the second laser cutting lines CL21, CL22, CL23, CL24 and the laser pre-cutting lines CL25 can also be multiple, so as to cut out multiple electronic devices, but not limited to this. The number of the first laser cutting lines CL11, CL12, CL13, CL14, the second laser cutting lines CL21, CL22, CL23, CL24 and the laser pre-cutting lines CL25 of the present invention can be determined according to the number of electronic devices to be formed.

[0029] exist Figure 2In the embodiment of the present invention, the first laser cutting line CL11 and the second laser cutting line CL21 may be approximately aligned in the top-view direction VD1 of the mother panel 10, the first laser cutting line CL12 and the second laser cutting line CL22 may be approximately aligned in the top-view direction VD1 of the mother panel 10, the first laser cutting line CL13 and the second laser cutting line CL23 may be approximately aligned in the top-view direction VD1 of the mother panel 10, and the first laser cutting line CL14 and the second laser cutting line CL24 may be approximately aligned in the top-view direction VD1 of the mother panel 10, so Figure 2 The first laser cutting lines CL11, CL12, CL13, and CL14 are respectively on the same line with the second laser cutting lines CL21, CL22, CL23, and CL24, so that the aligned first laser cutting line CL11 and the second laser cutting line CL21 can be formed once from top to bottom in the same laser cutting (for example, from the upper surface of the second flexible mother board 14 to the lower surface of the first flexible mother board 12), the aligned first laser cutting line CL12 and the second laser cutting line CL22 can be formed once from top to bottom in the same laser irradiation, the aligned first laser cutting line CL13 and the second laser cutting line CL23 can be formed once from top to bottom in the same laser irradiation, and the aligned first laser cutting line CL14 and the second laser cutting line CL24 can be formed once from top to bottom in the same laser irradiation, but the present invention is not limited to this. In some embodiments, at least one group of the first laser cutting line CL11 and the corresponding second laser cutting line CL21, the first laser cutting line CL12 and the corresponding second laser cutting line CL22, the first laser cutting line CL13 and the corresponding second laser cutting line CL23, and the first laser cutting line CL14 and the corresponding second laser cutting line CL24 may also be misaligned in the top-down direction VD1, so at least one group of first laser cutting lines CL11, CL12, CL13, CL14 and the corresponding second laser cutting lines CL21, CL22, CL23, CL24 may be formed in batches in different laser cutting passes.

[0030] It should be noted that in order to reduce the cracking of the sealing material 16 due to the high temperature generated by the laser in the laser cutting process, each laser cutting line or laser pre-cutting line CL25 may have a certain distance from the sealing material 16 (i.e., the minimum distance between the laser cutting line or laser pre-cutting line CL25 and the sealing material 16 when viewed from the top direction VD1), thereby being separated from the sealing material 16. The minimum distance may be, for example, greater than or equal to 200 microns. Alternatively, the minimum distance may range from 300 microns to 450 microns. Alternatively, the minimum distance may range from 300 microns to 400 microns or from 400 microns to 450 microns.

[0031] In some embodiments, the black matrix layer (not shown) formed on the second flexible motherboard 14 may have an opening (not shown) overlapping with the laser cutting line in the top view direction VD1, so as to facilitate machine alignment during the laser cutting process.

[0032] In some embodiments, step S14 may also selectively perform a wheel cutting process (step S144) after the laser cutting process (step S142), so that the wheel cutting process can cut the carrier 20 along the first laser cutting line CL11 and the second laser cutting line CL21 aligned with each other, the first laser cutting line CL12 and the second laser cutting line CL22 aligned with each other, the first laser cutting line CL13 and the second laser cutting line CL23 aligned with each other, and the first laser cutting line CL14 and the second laser cutting line CL24 aligned with each other.

[0033] like Figure 1 , Figure 4 and Figure 5 As shown, after the wheel cutting process, step S146 is performed to remove the protective film 34, and at the same time, the portion 14P of the semi-finished substrate SS is removed along the laser pre-cutting line CL25 to separate the second flexible substrate 104 from the portion 14P. The removal method can be, for example, tearing. Since the protective film 34 can be adhered to the portion 14P, the portion 14P can be torn off from the second flexible substrate 104 in the step of tearing off the protective film 34. Subsequently, step S148 is performed to remove the carrier 20, thereby forming the electronic device 100 of the present embodiment. The carrier 20 can, for example, include glass or other suitable materials. In some embodiments, the removal of the carrier 20 can, for example, be performed by irradiating the interface between the carrier 20 and the first flexible substrate 102 with a laser from the side of the carrier 20 opposite to the first flexible motherboard 12 to reduce the adhesion between the carrier 20 and the first flexible substrate 102, so that the first flexible substrate 102 can be separated from the carrier 20. It should be noted that the laser light energy of the laser cutting process may be, for example, one or several thousand times the laser light energy used to separate the carrier 20 and the first flexible substrate 102. In some embodiments, the protective film 34 and the portion 14P of the semi-finished substrate SS (such as Figure 2 and Figure 3 Between step S146 of removing the carrier 20 and step S148 of removing the carrier 20, a polarizer may be attached to the side of the second flexible substrate 104 opposite to the first flexible mother substrate (e.g., the side of the original protective film 34). In some embodiments, after step S148 of removing the carrier 20, another polarizer may be attached to the side of the first flexible substrate 102 opposite to the second flexible substrate 104 (e.g., the side of the original carrier 20).

[0034] Please refer to Figure 6 , Figure 6Schematic diagram of a method for manufacturing an electronic device according to some embodiments of the present invention is shown. In some embodiments, the order of setting the first flexible motherboard 12 and the second flexible motherboard 14 can also be interchanged, that is, the second flexible motherboard 14 can be first set on the carrier 20, and then the sealing material 16 is formed on the second flexible motherboard 14 and the liquid crystal layer 18 is filled, and then the first flexible motherboard 12 is attached. In this case, step S142 may not form the laser pre-cut line CL25 in the second flexible motherboard 14, and step S146 of removing the portion 14P of the semi-finished substrate SS can be performed after step S148 of removing the carrier 20, so that the electronic device 100 can be formed after removing the portion 14P. The portion 14P can be torn off manually, for example. In some embodiments, a polarizer may be bonded to a side of the first flexible substrate 102 opposite to the second flexible substrate 104 between step S146 and step S148, and another polarizer may be bonded to a side of the second flexible substrate 104 opposite to the first flexible substrate 102 after step S148 of removing the carrier 20, but the present invention is not limited thereto.

[0035] like Figure 2 and Figure 4 As shown, the first flexible substrate 102 formed by the above method may have four edges E11, E12, E13, and E14, which are formed by the first laser cutting lines CL11, CL12, CL13, and CL14, respectively, and the second flexible substrate 104 may have four edges E21, E22, E23, and E24, which are formed by the laser pre-cutting line CL25 and the second laser cutting line CL22, CL23, and CL24, respectively, so the edges E21, E22, E23, and E24 may correspond to the edges E11, E12, E13, and E14, respectively. Since in the top view direction VD2 of the electronic device 100, the edge E12 is roughly aligned with the edge E22, the edge E13 is roughly aligned with the edge E23, and the edge E14 is roughly aligned with the edge E24, therefore Figure 4 The edges E22, E23, and E24 are shown as being on the same line as the edges E12, E13, and E14, respectively, but the present invention is not limited thereto. The shape of the electronic device 100 of this embodiment may be, for example, a rectangle, but the shape of the electronic device 100 of the present invention is not limited thereto. In some embodiments, the shape of the electronic device may also be a circle or other geometric shapes.

[0036] In some embodiments, since the edges E11, E12, E13, E14 of the first flexible substrate 102 and the edges E22, E23, E24 of the second flexible substrate 104 are formed by laser cutting, they may have a relatively flat surface. Since the edge E21 of the second flexible substrate 104 corresponding to the laser pre-cut line CL25 may be formed by tearing, the edge E21 may be an uneven surface. The roughness of the edge E21 may be greater than the roughness of the edges E22, E23, E24 of the second flexible substrate 104 formed by laser cutting. In addition, the roughness of the edge E21 of the second flexible substrate 104 may also be greater than the roughness of the edges E11, E12, E13, E14 of the first flexible substrate 102 formed by laser cutting.

[0037] like Figure 4 and Figure 5 As shown, in the electronic device 100 of the present embodiment, the first flexible substrate 102 may have a first laser cutting buffer area 102R, and the sealing material 16 and the edges E11, E12, E13, and E14 are separated from the first laser cutting buffer area 102R, and the second flexible substrate 104 may have a second laser cutting buffer area 104R, and the sealing material 16 and the edges E21, E22, E23, and E24 are separated from the second laser cutting buffer area 104R. The first laser cutting buffer area 102R may be defined as a region extending from the edges E11, E12, E13, and E14 away from the first flexible substrate 102 toward the inner side of the sealing material 16 to the outer side 16S of the sealing material 16. Similarly, the second laser cutting buffer area 104R may be defined as a region extending from the edges E21, E22, E23, and E24 away from the second flexible substrate 104 toward the inner side of the sealing material 16 to the outer side 16S of the sealing material 16. For example, the display region DR of the electronic device 100 may be located inside the sealing material 16 .

[0038] It should be noted that, through the design of the first laser cutting buffer 102R and the second laser cutting buffer 104R, the influence of the high temperature generated by the laser on the sealing material 16 can be reduced, thereby reducing the cracking of the sealing material 16. In the embodiment taking the liquid crystal display device as an example, the liquid crystal layer 18 is arranged and sealed between the first flexible substrate 102 and the second flexible substrate 104. Through the design of the first laser cutting buffer 102R and the second laser cutting buffer 104R, the leakage of the liquid crystal molecules 18L of the liquid crystal layer 18 can be reduced to improve the production yield of the electronic device 100. For example, the width of the first laser cutting buffer 102R and the width of the second laser cutting buffer 104R can both be greater than or equal to 200 microns, wherein the aforementioned width is the minimum width between the edge of the substrate and the sealing material.

[0039] In some embodiments, Figure 5 In the cross-sectional view of the lower half of the first flexible substrate 102, there may be a minimum distance G1 between the edge E11 of the first flexible substrate 102 and the projection of the sealing material 16 onto a plane perpendicular to the top-view direction VD2 of the electronic device 100, for example, the minimum width of the first laser-cut buffer area 102R from the edge E11 to the sealing material 16. Figure 5 In the cross-sectional view below, there may also be a minimum distance G2 between the edge E21 of the second flexible substrate 104 and the projection of the sealing material 16 onto a plane perpendicular to the top-view direction VD2 of the electronic device 100, such as the minimum width of the second laser cutting buffer 104R from the edge E21 to the sealing material 16. The minimum distance G1 may be greater than the minimum distance G2. In some embodiments, the minimum distance G2 may also be obtained by measuring the minimum distances between five points of the uneven edge E21 and the sealing material 16 and taking the average value thereof.

[0040] like Figure 4 As shown, there may also be a minimum distance G3 between the edges E12, E13, E14 of the first flexible substrate 102 and the sealing material 16, that is, the width of the first laser cutting buffer zone 102R from the edges E12, E13, E14 to the sealing material 16. The minimum distances G3 of the first flexible substrate 102 may be the same as each other, or at least two of them may be different. There may also be a minimum distance G4 between the edges E22, E23, E24 of the second flexible substrate 104 and the sealing material 16, that is, the width of the second laser cutting buffer zone 104R from the edges E22, E23, E24 to the sealing material 16. The minimum distances G4 of the second flexible substrate 104 may be the same as each other, or at least two of them may be different. In some embodiments, the minimum distances G3, G4 may be different from the minimum distance G1 and the minimum distance G2, or the minimum distances G3, G4 may be the same as one of the minimum distances G1 and the minimum distance G2. Figure 4 In the illustrated embodiment, the minimum distance G3 may be approximately the same as the minimum distance G4, but is not limited thereto. For example, the minimum distances G1, G2, G3, and G4 may range from 300 microns to 450 microns, respectively. Alternatively, depending on the requirements, the minimum distances G1, G2, G3, and G4 may range from 300 microns to 400 microns or from 400 microns to 450 microns, respectively.

[0041] In some embodiments, the electronic device 100 may further include a black matrix layer 126 disposed on the second flexible substrate 104. The black matrix layer 126 may be used to define the area of ​​the sub-pixel or pixel of the display device. For example, the black matrix layer 126 is disposed on the surface of the second flexible substrate 104 facing the first flexible substrate 102, but is not limited thereto. In some embodiments, a portion of the first laser-cut buffer area 102R is not covered by the black matrix layer 126 in the top-view direction VD2 of the electronic device 100. For example, the black matrix layer 126 may overlap the sealing material 16 in the top-view direction VD2, and extend from the inside to the outside of the sealing material 16, but does not overlap with part of the first laser-cut buffer area 102R, and the present invention is not limited thereto. In some embodiments, the edge E3 of the black matrix layer 126 adjacent to the edge E21 of the second flexible substrate 104 may have a minimum distance G5 from the edge E21, and the minimum distance G5 is less than or equal to the minimum distance G2 of the edge E21 of the corresponding second flexible substrate 104. In some embodiments, another edge (eg, edge E4) of the black matrix layer 126 and a corresponding edge (eg, edge E24) of the second flexible substrate 104 may have a minimum distance (eg, minimum distance G6) that is less than or equal to the minimum distance G4.

[0042] The electronic device of the present invention is not limited to the above-mentioned embodiment, and may have different variant embodiments. To simplify the description, the different variant embodiments below will use the same reference numerals as the first embodiment to mark the same elements. To facilitate comparison of the differences between the first embodiment and the different variant embodiments, the differences between the different variant embodiments will be highlighted below, and the repeated parts will not be described in detail.

[0043] Figure 7 FIG. 2 is a cross-sectional view of an electronic device according to a second embodiment of the present invention. The difference between the electronic device 200 of this embodiment and the above-mentioned embodiment is that the edge E3 of the black matrix layer 226 of this embodiment adjacent to the edge E21 of the second flexible substrate 104 can be approximately aligned with the outer side 16S of the sealing material 16, so the minimum distance G5 between the edge E3 of the black matrix layer 226 and the edge E21 of the second flexible substrate 104 can be approximately the same as the minimum distance G2 between the sealing material 16 and the edge E21 of the second flexible substrate 104. In some embodiments, the sealing material 16 may not overlap with the black matrix layer 226 in the top-view direction VD2 of the electronic device 200.

[0044] Figure 8FIG. 3 is a schematic cross-sectional view of an electronic device according to a third embodiment of the present invention. The difference between the electronic device 300 of this embodiment and the above-mentioned embodiments is that the electronic device 300 of this embodiment may also include a covering layer 328 and a light shielding layer 330 disposed on the covering layer 328, wherein the light shielding layer 330 overlaps with the first laser-cut buffer zone 102R and the black matrix layer 126 in the top-view direction VD2 of the electronic device 300. For example, by covering the portion of the first flexible substrate 102 from edge E11 to edge E3 in the top-view direction VD2 by the light shielding layer 330, the light generated by the electronic device 300 can be reduced from being emitted from the portion of the second flexible substrate 104 that does not overlap with the black matrix layer 126 in the top-view direction VD2, thereby reducing light leakage. In some embodiments, in the top-view direction VD2, the light shielding layer 330 may also cover the first flexible substrate 102 from other edges (such as Figure 4 The light shielding layer 330 extends from the edge E12, E13, and E14 shown in the figure to the edge of the corresponding black matrix layer 126. In some embodiments, the light shielding layer 330 may include ink, photoresist material, or other suitable light shielding material, but is not limited thereto.

[0045] In some embodiments, the electronic device 300 may further include a frame 332, and in the top-view direction VD2 of the electronic device 300, the frame 332 may overlap with the first laser-cut buffer 102R and the black matrix layer 126, thereby reducing light leakage. For example, the frame 332 may cover the portion of the first flexible substrate 102 from edge E11 to edge E3 in the top-view direction VD2. In some embodiments, the frame 332 may also cover the portion of the first flexible substrate 102 from other edges (such as Figure 4 The edge E12, E13, E14 shown in the figure to the edge of the corresponding black matrix layer 126. In some embodiments, the frame 332 may include metal or other suitable materials, but is not limited thereto. In some embodiments, one of the light shielding layer 330 and the frame 332 may overlap with the first laser cutting buffer 102R and the black matrix layer 126. In some embodiments, the electronic device 300 may also include a combination of the cover layer 328 and the light shielding layer 330 and one of the frame 332.

[0046] Fig. 9 FIG. 4 is a top view schematic diagram of an electronic device according to a fourth embodiment of the present invention. The difference between the electronic device 400 of this embodiment and the above embodiments is that the top view shape of the electronic device 400 of this embodiment may be non-rectangular. For example, the first flexible substrate 402 and the second flexible substrate of the electronic device 400 may be circular or other geometric shapes. For clear illustration, Fig. 9The second flexible substrate is omitted. In the non-rectangular electronic device 400, the minimum distance G1 between the sealing material 16 and the first flexible substrate 402 may be defined as the minimum distance between the edge E11 of the first flexible substrate 402 and the edge E5 of the sealing material 16 in a direction perpendicular to the extending direction of the tangent L1 of the edge E11 of the first flexible substrate 402. For example, the minimum distance G1 may be the distance between the tangent L1 of the edge E11 of the first flexible substrate 402 and the tangent L2 parallel to the tangent L1 and passing through the edge E5 of the sealing material 16.

[0047] In summary, in the electronic device and the manufacturing method thereof of the present invention, the first laser cutting buffer area and the second laser cutting buffer area can reduce the influence of the high temperature generated by the laser on the sealing material, thereby avoiding the cracking of the sealing material.

[0048] The above description is only an embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may be modified and varied in various ways, and the different features between the embodiments may be arranged and combined at will as long as they do not conflict or violate the spirit of the disclosure, depending on the design requirements. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for manufacturing an electronic device, characterized in that: The following steps are involved: Providing a mother panel, wherein the mother panel includes a first flexible mother panel, a second flexible mother panel and at least one sealing material, and the at least one sealing material is disposed between the first flexible mother panel and the second flexible mother panel, wherein providing the mother panel further includes forming a black matrix layer on the second flexible mother panel, overlapping with the at least one sealing material in a top view direction of the mother panel, and providing the mother panel includes laminating the first flexible mother panel and the second flexible mother panel through the at least one sealing material; as well as Performing a separation process to cut the first flexible motherboard into a first flexible substrate and to cut the second flexible motherboard into a second flexible substrate, wherein the separation process includes performing a laser cutting process; The first flexible substrate has a first laser cutting buffer zone, the first flexible substrate includes a first edge, the second flexible substrate has a second laser cutting buffer zone, and the second flexible substrate includes a second edge and a third edge; wherein the at least one sealing material is spaced from the first edge by the first laser cutting buffer zone, and the at least one sealing material is spaced from the second edge by the second laser cutting buffer zone, The separation process further includes removing a portion of the second flexible motherboard that overlaps with the first laser cutting buffer zone in the top-view direction of the mother panel and is located outside the second laser cutting buffer zone, and the portion of the second flexible motherboard is removed by tearing off. wherein the first edge and the second edge are arranged on the same side of the at least one sealing material in the top-view direction of the mother panel, the minimum distance between the second edge and the at least one sealing material is smaller than the minimum distance between the first edge and the at least one sealing material, and the roughness of the second edge is greater than the roughness of the third edge and the roughness of the first edge, The laser cutting process includes forming a laser pre-cutting line before removing the portion of the second flexible mother board, the laser pre-cutting line is located between the second laser cutting buffer area and the portion, and the laser pre-cutting line does not penetrate the second flexible mother board, The first flexible motherboard and the second flexible motherboard are bonded together and aligned through an alignment mark on the first flexible motherboard and another alignment mark on the second flexible motherboard, and the alignment mark and the another alignment mark do not overlap with the at least one sealing material in the top-view direction of the mother panel.

2. The method for manufacturing an electronic device according to claim 1, characterized in that: The separation process further includes performing a knife cutting process after the laser cutting process.

3. The method for manufacturing an electronic device according to claim 1, characterized in that: Providing the mother panel includes disposing one of the first flexible mother board and the second flexible mother board on a carrier board.

4. The method for manufacturing an electronic device according to claim 3, characterized in that: Providing the mother panel further includes forming a liquid crystal layer between the first flexible mother panel and the second flexible mother panel before laminating the second flexible mother panel to the first flexible mother panel.

5. The method for manufacturing an electronic device according to claim 1, characterized in that: The width of the first laser cutting buffer area and the width of the second laser cutting buffer area are both greater than or equal to 200 micrometers.

6. The method for manufacturing an electronic device according to claim 1, characterized in that: A portion of the first laser-cut buffer area is not covered by the black matrix layer in the top-view direction of the mother panel.

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