heat dissipating device

Abstract

The application provides a heat dissipation device, comprising: a shell; wherein the shell comprises: a first sub-shell and a second sub-shell; the second sub-shell is close to the bottom of the heat dissipation device, and the first sub-shell is close to the top of the heat dissipation device; one or more holes are arranged on the second sub-shell and the part overlapping with the first sub-shell, and the first sub-shell and the second sub-shell can move relatively, wherein the one or more holes arranged on the second sub-shell are exposed to form an air duct through the relative movement. Through the application, the problem of low heat dissipation efficiency in the related art that a small hole is opened at the bottom and the top of the device to form a heat exchange mode of heat dissipation in which cold air is sucked from the bottom and discharged from the top to form a convection to form a heat exchange.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of hardware devices, in particular to a heat dissipation device. BACKGROUND

[0002] The current network access equipment, due to huge heat, all take the fixed open hole heat dissipation way, the open hole position is relatively hidden, the heat dissipation way is limited, such as Figure 1 As shown, a small hole is opened in the bottom groove, cold air is sucked from the bottom through the heat convection effect of air, passes through the mainboard heating device and the metal heat dissipation block, and is discharged from the top by convection to form heat exchange. However, due to the long path of the whole heat exchange process, the hidden position of the open hole, the shielding of the internal structure to the air and other reasons, the position of the intermediate device, such as Figure 1 The circular position, the heat cannot be effectively relieved.

[0003] For the above problems in the related art, there is no effective solution at present. SUMMARY

[0004] The embodiment of the present application provides a heat dissipation device to at least solve the problem of low heat dissipation efficiency of the heat dissipation way of opening small holes at the bottom and top of the equipment to make cold air sucked from the bottom and discharged from the top by convection to form heat exchange in the related art.

[0005] According to one embodiment of the present application, a heat dissipation device is provided, comprising: a shell; wherein the shell comprises: a first sub-shell and a second sub-shell; the second sub-shell is close to the bottom of the heat dissipation device, and the first sub-shell is close to the top of the heat dissipation device; one or more holes are arranged on the second sub-shell and the part overlapping with the first sub-shell, and the first sub-shell and the second sub-shell can move relatively, wherein the relative movement can make the one or more holes arranged on the second sub-shell exposed to form an air duct.

[0006] Optionally, the heat dissipation device further comprises: a mainboard support; wherein the mainboard support is assembled into the second sub-shell from the bottom of the heat dissipation device; the first sub-shell is assembled into the second sub-shell from the top of the heat dissipation device and guided by the outer side wall of the second sub-shell; and the mainboard is electrically connected to the mainboard of the equipment to be cooled by lead wires.

[0007] Optionally, a lead screw is arranged on the mainboard support, and a lead screw sleeve is arranged on the lead screw; wherein the lead screw is fixedly connected with the mainboard support; the first sub-shell is fixedly connected with the lead screw sleeve of the lead screw; wherein the relative movement of the first sub-shell and the second sub-shell is driven by the reciprocating movement of the lead screw sleeve through the rotary movement of the lead screw.

[0008] Optionally, the heat dissipation device further comprises a driving motor, and the driving motor is configured to receive a control instruction to drive the lead screw to rotate.

[0009] Optionally, when the temperature of the device to be cooled inside the shell exceeds a first preset threshold, a first control instruction is sent to the driving motor, wherein the first control instruction is configured to instruct the driving motor to drive the lead screw to rotate, thereby driving the relative movement between the first sub-shell and the second sub-shell, so that one or more holes provided on the second sub-shell are exposed to form an air duct; when the temperature of the device is lower than a second preset threshold, a second control instruction is sent to the driving motor, wherein the second control instruction is configured to instruct the driving motor to drive the lead screw to rotate, thereby driving the relative movement between the first sub-shell and the second sub-shell, so that the one or more holes provided on the second sub-shell are covered by the first sub-shell.

[0010] Optionally, a buckle is provided on the first sub-shell, and the buckle is connected with the first sub-shell and the second sub-shell.

[0011] Optionally, a fan is further provided on the mainboard support, and an air duct of the fan is consistent with the air duct formed by exposing the one or more holes provided on the second sub-shell through the relative movement.

[0012] Optionally, a sleeve guide rail is provided on the mainboard support, and a first magnet and a second magnet are provided inside the sleeve guide rail; the first magnet is provided at one end of the sleeve guide rail close to the mainboard support, and the second magnet is provided at one end of the sleeve guide rail away from the mainboard support; the mainboard support is fixedly connected with the first sub-shell; and the mainboard support is driven to move relatively by mutual attraction and mutual repulsion between the first magnet and the second magnet, thereby driving the first sub-shell to move relatively with respect to the second sub-shell.

[0013] According to the heat dissipation device provided in the application, one or more holes are provided on the second sub-shell and the overlapping part of the first sub-shell, so that the one or more holes provided on the second sub-shell can be exposed to form an air duct after the relative movement between the first sub-shell and the second sub-shell, thereby improving the heat dissipation efficiency of the device, and solving the problem of low heat dissipation efficiency of the heat dissipation mode of forming heat exchange by sucking cold air from the bottom and convecting the air from the top in the related art. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0015] Figure 1 is a structural schematic diagram of a heat dissipation device in the related art;

[0016] Figure 2 is a structural schematic diagram of a heat dissipation device according to an embodiment of the present application;

[0017] Figure 3 is an optional structural schematic diagram of a heat dissipation device according to an embodiment of the present application Figure 1 .

[0018] Figure 4 is an optional structural schematic diagram of a heat dissipation device according to an embodiment of the present application Figure 2 .

[0019] Figure 5 is an optional structural schematic diagram of a heat dissipation device according to an embodiment of the present application Figure 3 .

[0020] Figure 6 is an optional structural schematic diagram of a heat dissipation device according to an embodiment of the present application Figure 4 .

[0021] Figure 7 is an optional structural schematic diagram of a heat dissipation device according to an embodiment of the present application Figure 5 . DETAILED DESCRIPTION

[0022] The application will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0023] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence.

[0024] 5G technology can bring better user experience to users, its transmission rate is much higher than that of previous cellular networks, up to 10Gbit / s; its another advantage is low network delay, faster response. Due to its outstanding advantages, it will be able to meet the application scenarios of high-definition video, virtual reality and other big data transmission, as well as automatic driving, remote medical treatment and other low delay scenarios. But the realization of 5G puts forward higher requirements for the hardware system, high speed, low delay, multi antenna and other needs for the heat dissipation scene of hardware put forward more stringent requirements. At present, the 4G terminal, due to the low speed, the power consumption is relatively small, then to the 5G era, due to the size of the terminal does not change, the power consumption is greatly increased, especially the network access equipment, the heat dissipation problem needs to have innovative scheme, in order to meet the normal working conditions of each component of terminal product, make the product play its normal function, meet the user experience.

[0025] The starting point of the present application is based on the principle of convection heat dissipation, while not reducing the appearance objectively, increase the active convection air duct design, so that the product convection heat dissipation air duct can adjust according to the heat state of the product, and try its best to design the air duct near the device with large heat, strengthen the air convection effect of key area, shorten the air duct length and reduce the fan resistance, optimize the heat state of the product in different states, make the hardware performance reach the maximum play and then improve the product performance to meet the user experience demand of 5G product.

[0026] It should be noted that the heat dissipation device involved in the present application can also be applied to other products and equipment that need to be cooled, such as 4G related products and equipment, or other communication equipment, computer equipment and other hardware equipment.

[0027] In the present embodiment, a heat dissipation device is provided, Figure 2 is a structural schematic diagram of the heat dissipation device according to the embodiment of the present application, as Figure 2 shown, the heat dissipation device 11 comprises a shell 200; wherein the shell 200 comprises a first sub shell 201 and a second sub shell 203; the second sub shell 203 is close to the bottom of the heat dissipation device 11, and the first sub shell 201 is close to the top of the heat dissipation device 11;

[0028] wherein one or more holes 202 are provided on the second sub shell 203 and the part overlapping with the first sub shell 201, and the first sub shell 201 and the second sub shell 203 can move relatively, wherein the one or more holes provided on the second sub shell 203 can be exposed to form an air duct through relative movement.

[0029] In the alternative embodiment of the present application, the shell 200 can be arranged around the device to be cooled, which includes a bottom cover 103 arranged at the bottom of the device and a top cover 101 arranged at the top of the device, wherein the openings arranged on the grooves of the bottom cover 103 and the openings arranged on the top cover form air convection,

[0030] It can be seen that, in the heat dissipation device 11 of the present application, due to the one or more holes 202 arranged on the second sub-shell 203 and the overlapping part of the first sub-shell 201, after the relative movement of the first sub-shell 201 and the second sub-shell 203, the one or more holes 202 arranged on the second sub-shell 203 can be exposed to form an air duct, thereby improving the heat dissipation efficiency of the device, thereby solving the problem of low heat dissipation efficiency of the heat dissipation mode in the related art, which uses small holes on the bottom and top of the device to suck cold air from the bottom and exhaust it from the top to form heat exchange.

[0031] It should be noted that, although in the Figure 2 the first sub-shell 201 and the second sub-shell 203 in the shell 200 of the heat dissipation device 11 can be integrally arranged, i.e. the shell of the entire heat dissipation device 11 is composed of one first sub-shell 201 and one second sub-shell 203, of course, it can also be a sub-shell that is not integrally arranged, i.e. each side is composed of a single first sub-shell 201 and a second sub-shell 203, or only one or more sides are provided with a first sub-shell 201 and a second sub-shell 203, and a first sub-shell 201 and a second sub-shell 203 are not provided on all sides.

[0032] In addition, the first sub-shell 201 is not provided with holes, so that in the case of overlapping of the first sub-shell 201 and the second sub-shell 203, the one or more holes 202 on the second sub-shell 203 are blocked, i.e. cannot form an air duct for cooling. In addition, in Figure 2 the shape of the one or more holes is only an example, and can also be other shapes, such as a circular one or more holes, a rectangular one or more holes, etc., which can be adjusted according to actual needs, and the shape is not limited in the present application.

[0033] In addition, in Figure 2 only one row of holes is shown on the second sub-shell 203, which is only an example, and the number of holes and the number of rows of holes can be set according to actual needs, and the number of holes in each row can also be set according to actual conditions, such as Figure 3 two rows of holes 202 are arranged on the second sub-shell 203.

[0034] It should be noted that the one or more holes on the second sub-shell 203 are arranged in a region with high heat generation, for example, a chip area. As Figure 2As shown, the dashed circle corresponds to the area where the device generates high heat, so that the heat can be dissipated in time under high workload, and the heat dissipation effect of the area is accelerated.

[0035] As shown, the heat dissipation device further comprises a mainboard support 405. Figure 4

[0036] The mainboard support 405 is assembled into the second sub-housing 203 from the bottom of the heat dissipation device; the first sub-housing 201 is assembled into the second sub-housing 203 from the top of the heat dissipation device and guided by the outer side wall of the second sub-housing 203; the mainboard support 405 is electrically connected to the mainboard 406 of the device to be cooled through a lead.

[0037] Optionally, the mainboard support 405 is provided with a lead screw 404, and the lead screw 404 is provided with a lead screw sleeve 502; the lead screw 404 and the mainboard support 405 are fixedly connected; the first sub-housing 201 and the lead screw sleeve 502 of the lead screw are fixedly connected; the fixed connection can be achieved by screws.

[0038] The rotation of the lead screw can drive the reciprocating motion of the lead screw sleeve, and the reciprocating motion of the lead screw sleeve drives the relative motion of the first sub-housing 201 and the second sub-housing 203.

[0039] Optionally, the heat dissipation device 11 further comprises a driving motor; wherein the driving motor is used to receive control instructions to drive the lead screw to rotate.

[0040] It should be noted that when the temperature of the device to be cooled built-in the housing 200 exceeds the first preset threshold, the first control instruction is sent to the driving motor, wherein the first control instruction is used to instruct the driving motor to drive the lead screw 404 to rotate, and drive the relative motion of the first sub-housing 201 and the second sub-housing 203, so that one or more holes provided on the second sub-housing 203 are exposed to form an air duct; when the temperature of the device to be cooled built-in the housing 200 is lower than the second preset threshold, the second control instruction is sent to the driving motor, wherein the second control instruction is used to instruct the driving motor to drive the lead screw 404 to rotate, and drive the relative motion of the first sub-housing 201 and the second sub-housing 203, so that one or more holes 202 provided on the first sub-housing 201 cover the second sub-housing 203.

[0041] ​Therefore, in a specific application scenario: after starting, the whole system runs, and the temperature sensor inside the component detects the running temperature of the key position inside. When the temperature does not reach the preset starting point, the system remains in the current state and continues to run. Once the detected temperature reaches the preset high-temperature starting point, the system drives the motor to drive the first sub-housing 201 to move relative to the second sub-housing 203, thereby exposing one or more holes 202 to form an air duct, accelerating heat dissipation, and ensuring reliable operation of the whole machine. At the same time, temperature detection continues, and when the temperature of the key position is detected to drop to the preset low-temperature starting point, the system drives the motor to further drive the first sub-housing 201 to move reversely relative to the second sub-housing 203, so that the first sub-housing 201 covers the one or more holes 202 on the second sub-housing 203, thereby closing the air duct and continuing to run. During the operation of the whole machine, temperature detection is always in the running state. When the user turns off the system, the motor mechanism detects the position of the air duct, closes the air duct, and then turns off the system.

[0042] That is, in a normal use scenario, cold air enters from the bottom, passes through the mainboard, is heated and circulated to the top to form convection cooling. In a long-time high-power consumption scenario, due to the high temperature of the chip area, the cold air cannot effectively reach the chip area. At this time, the first sub-housing 201 and the second sub-housing 203 are pulled apart by the motor under the control of the driver program, exposing one or more holes 202 for heat dissipation in the chip area. Cold air can quickly reach the mainboard chip heating area under the action of the fan to form convection cooling. When the temperature drops to the preset temperature or the use scenario power consumption decreases, the driver program controls the motor to pull the first sub-housing 201 and the second sub-housing 203 back to the original state to ensure the original appearance form and avoid the influence of dust caused by long-term external heat dissipation holes, thereby realizing the active heat dissipation demand of the device. The device can be a 5G device or other hardware device, greatly relieving the heating performance of the device in extreme working conditions and improving user experience.

[0043] As shown in Figure 5 The first sub-housing is provided with a buckle 503, and the buckle 503 is connected with the first sub-housing 201 and the second sub-housing 203.

[0044] In a specific application scenario, when the first sub-housing 201 is moved under the drive of the lead screw 404 and the sleeve 502, on the one hand, the stroke of the lead screw 404 is limited, and on the other hand, the buckle 503 ensures that the second sub-housing 203 and the first sub-housing 201 are not separated due to external force during movement, thereby improving the assembly reliability of the whole machine. Inside the buckle 503, there is an opening on the first sub-housing 201. When maintenance is needed, a clamp is used to pry the buckle through the opening position to separate the second sub-housing 203 and the first sub-housing 201, and then the whole machine is maintained.

[0045] In addition, as shown in Figure 5 The first sub-housing 201 is assembled and the lead screw sleeve 502 is fixed together by the screw 501; the lead screw 404 and the mainboard support 405 are fixed by the screw 504.

[0046] As shown in Figure 6 The mainboard support 405 is also provided with a fan 601, wherein the air duct of the fan is consistent with the air duct formed by exposing one or more holes 202 on the second sub-housing 203 through relative movement.

[0047] That is, the lead screw 404 drives the first sub-housing 201 to slide relative to the second sub-housing 203, exposing one or more pre-set holes 202, and the leaked one or more holes form an air duct that can effectively provide cold air, so that the cold air can quickly reach the fin area, shorten the air duct of the fan 601, reduce the air pressure, thereby improving the efficiency of the fan 601 and prolonging the service life of the fan 601. It should be noted that the position of the fan in the present application is adjusted and set according to the product scheme design and thermal design.

[0048] As shown in Figure 7 The mainboard support 405 is provided with a sleeve guide rail 701; wherein the sleeve guide rail is internally provided with a first magnet 702 and a second magnet 703; the first magnet 702 is arranged at one end of the sleeve guide rail close to the mainboard support, and the second magnet 703 is arranged at one end of the sleeve guide rail away from the mainboard support; the mainboard support is fixedly connected with the first sub-housing 201.

[0049] In a specific application scenario, the first magnet can be a permanent magnet, and the second magnet can be an electromagnet; wherein the magnetic poles of the electromagnet are adjusted by energizing the electromagnet to make the electromagnet and the permanent magnet attract and repel each other to make the mainboard support move relatively to drive the first sub-housing 201 to move relatively to the second sub-housing 203.

[0050] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipating device, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a shell, wherein the shell comprises a first sub-shell and a second sub-shell; the second sub-shell is close to the bottom of the heat dissipation device, and the first sub-shell is close to the top of the heat dissipation device; one or more holes are arranged on the second sub-shell and the part overlapping with the first sub-shell, and the first sub-shell and the second sub-shell can move relatively, wherein the relative movement can expose the one or more holes arranged on the second sub-shell to form an air duct; the heat dissipation device further comprises a mainboard support; the mainboard support is assembled into the second sub-shell from the bottom of the heat dissipation device; the first sub-shell is assembled into the second sub-shell from the top of the heat dissipation device and is guided by the outer side wall of the second sub-shell; the mainboard is electrically connected to the mainboard of the equipment to be cooled through lead wires; the mainboard support is provided with a lead screw, and the lead screw is provided with a lead screw sleeve; the lead screw is fixedly connected with the mainboard support; the first sub-shell is fixedly connected with the lead screw sleeve of the lead screw; the rotation of the lead screw can drive the reciprocating movement of the lead screw sleeve, and the reciprocating movement of the lead screw sleeve drives the relative movement of the first sub-shell and the second sub-shell; or the mainboard support is provided with a sleeve guide rail; the sleeve guide rail is internally provided with a first magnet and a second magnet; the first magnet is arranged in the sleeve guide rail and is close to one end of the mainboard support; the second magnet is arranged in the sleeve guide rail and is away from the other end of the mainboard support; the mainboard support is fixedly connected with the first sub-shell; the mutual attraction and repulsion of the first magnet and the second magnet can drive the relative movement of the mainboard support and the relative movement of the first sub-shell relative to the second sub-shell. The heat dissipation device further comprises a driving motor; the driving motor is used for receiving control instructions to drive the lead screw to rotate.

3. The heat dissipation device according to claim 2, wherein when the temperature of the equipment to be cooled built in the shell exceeds a first preset threshold value, a first control instruction is sent to the driving motor, wherein the first control instruction is used for instructing the driving motor to drive the lead screw to rotate, drive the relative movement of the first sub-shell and the second sub-shell, and expose the one or more holes arranged on the second sub-shell to form an air duct; when the temperature of the equipment to be cooled built in the shell is lower than a second preset threshold value, a second control instruction is sent to the driving motor, wherein the second control instruction is used for instructing the driving motor to drive the lead screw to rotate, drive the relative movement of the first sub-shell and the second sub-shell, and cover the one or more holes arranged on the second sub-shell by the first sub-shell. The first sub-shell is provided with a buckle connected with the first sub-shell and the second sub-shell. ​ ​ 2. The heat dissipating device according to claim 1, wherein ​ ​ ​ ​ ​ 4. The heat dissipating device of claim 1, wherein ​ 5. The heat dissipating device of claim 1, wherein The mainboard support is further provided with a fan, wherein an air duct of the fan is consistent with an air duct formed by exposing one or more holes provided on the second sub-housing through the relative movement.

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