Housing components and electronic equipment

Abstract

The present application provides a shell assembly and an electronic device. The shell assembly of the embodiment of the present application includes: a light-emitting layer for emitting light; a dimming layer, arranged on one side of the light-emitting layer, for dimming the light emitted by the light-emitting layer, so that the light with an incident angle within a preset angle range passes through the dimming layer; and a projection layer, arranged on a side of the dimming layer away from the light-emitting layer, for projecting the light passing through the dimming layer to a side of the projection layer away from the light-emitting layer for aerial imaging. The shell assembly of the embodiment of the present application has a smaller volume and can be used for aerial imaging in a narrow space.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a housing assembly and an electronic device. Background Art

[0002] The current aerial imaging devices are relatively large in size and are mostly used for aerial imaging of relatively large devices. They are difficult to be used in portable electronic devices, especially in small spaces. Summary of the invention

[0003] In view of the above problems, an embodiment of the present application provides a shell assembly which is small in size and can be applied to aerial imaging in a narrow space.

[0004] The present application embodiment provides a housing assembly, which includes:

[0005] A luminous layer for emitting light;

[0006] a dimming layer, disposed on one side of the light emitting layer, for dimming the light emitted by the light emitting layer so that the light with an incident angle within a preset angle range passes through the dimming layer; and

[0007] The projection layer is arranged on the side of the dimming layer away from the light emitting layer, and is used to project the light passing through the dimming layer to the side of the projection layer away from the light emitting layer, so as to perform aerial imaging.

[0008] Based on the same concept, an embodiment of the present application further provides a shell assembly, which includes the shell assembly described in the embodiment of the present application.

[0009] Based on the same concept, the present application also provides an electronic device according to an embodiment, which includes the housing assembly described in the embodiment of the present application.

[0010] The shell assembly of the embodiment of the present application adds a dimming layer between the light-emitting layer and the projection layer so that only light with an incident angle within a preset angle range can pass through the light-transmitting layer and enter the projection layer. As a result, the light-emitting layer and the projection layer can be stacked in parallel, have a smaller volume, and can be applied to aerial imaging in a narrow space. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a structural schematic diagram of an aerial imaging device of the related technology of the present application.

[0013] Figure 2 It is a structural schematic diagram of a shell assembly according to an embodiment of the present application.

[0014] Figure 3 It is a schematic diagram of the structure of the light-emitting layer of one embodiment of the present application.

[0015] Figure 4 It is a schematic structural diagram of a light-emitting layer in yet another embodiment of the present application.

[0016] Figure 5 It is a schematic diagram of the structure of a driving circuit according to an embodiment of the present application.

[0017] Figure 6 It is a schematic structural diagram of a light-emitting layer in yet another embodiment of the present application.

[0018] Figure 7 It is a schematic diagram of the structure of a projection layer according to an embodiment of the present application.

[0019] Figure 8 It is a structural schematic diagram of a projection layer according to another embodiment of the present application.

[0020] Fig. 9 It is a structural schematic diagram of a projection layer according to another embodiment of the present application.

[0021] Fig.10 It is a structural schematic diagram of a projection layer according to another embodiment of the present application.

[0022] Fig.11 It is a structural schematic diagram of a shell assembly of another embodiment of the present application.

[0023] Fig.12 It is a structural schematic diagram of a shell assembly of another embodiment of the present application.

[0024] Fig.13 It is a structural schematic diagram of a shell assembly of another embodiment of the present application.

[0025] Fig.14 It is a structural schematic diagram of a shell assembly of another embodiment of the present application.

[0026] Fig.15 It is a structural schematic diagram of a shell assembly of another embodiment of the present application.

[0027] Fig.16 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0028] Fig.17 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0029] Fig.18 This is a circuit block diagram of an electronic device according to another embodiment of the present application.

[0030] Fig.19 It is a schematic diagram of information interaction between an electronic device and a user according to an embodiment of the present application.

[0031] Description of reference numerals:

[0032] 100-shell component 16-electron injection layer

[0033] 10-light-emitting layer 17-cathode

[0034] 11- anode 18- driving circuit

[0035] 12-hole injection layer 181-source

[0036] 13-hole transport layer 183-drain

[0037] 14-light-emitting unit layer 185-gate

[0038] 15-Electron transport layer 187-Active layer

[0039] 19-substrate 71-base layer

[0040] 111-light source 73-color layer

[0041] 113-light guide plate 75-coating layer

[0042] 101-light incident surface 90-protective layer

[0043] 103-light emitting surface 200-air imaging system

[0044] 30-dimming layer 210-display panel

[0045] 50-projection layer 230-projection device

[0046] 51-first substrate 250-air imaging

[0047] 52- Second substrate 300- Electronic device

[0048] 53-reflection unit 310-processor

[0049] 531-reflection surface 330-memory

[0050] 70-Decoration layer 350-Gesture recognition module DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0053] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0054] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0055] "Air imaging" is also known as "air imaging technology" or medium-free floating projection technology. It is a technology that uses a projection system to project images into an almost invisible air wall, allowing viewers to see images or videos floating in the air. Figure 1As shown, the aerial imaging system 200 of the related art includes a display panel 210 and a projection device 230. The display panel 210 and the projection device 230 are arranged at an angle. After the content or color displayed on the display panel 210 is projected by the projection device 230, the aerial imaging 250 is performed in the air on the side of the projection device 230 away from the display panel 210. Light rays of various angles emitted from the same point on the display panel 210 can be converged and imaged in the air on the side of the projection device 230 away from the display panel 210 only after being reflected by the projection device 230. If the light rays directly pass through the projection device 230 without being reflected by the projection device 230, they cannot be converged. The light rays that directly pass through without being reflected will also interfere with the aerial imaging, making the aerial imaging unclear or blurred. The light intensity of the light emitted perpendicular to the display panel 230 is the largest. When the display panel 210 and the projection device 230 are arranged in parallel or the angle between them is too small, the light emitted perpendicularly from the display panel 230 directly passes through the projection device 230 without being reflected by the projection device 230, thereby blurring the aerial image 250, affecting the quality of the aerial image, or even failing to form an image. Therefore, in order to allow the light emitted perpendicularly from the display panel 210 to be reflected by the projection device 230 to the side of the projection device 230 away from the display panel 210 and converged to obtain a clear aerial image 250, it is necessary to set the display panel 210 and the projection device 230 at a certain angle, usually 45°, which makes the aerial imaging system 200 have a larger volume and is difficult to apply to small devices, especially small spaces, such as the housing of electronic equipment.

[0056] See also Figure 2 The shell assembly 100 provided in the embodiment of the present application is applied to aerial imaging. The shell assembly 100 includes: a light-emitting layer 10, which is used to emit light, and the color of the display content or the color of the light-emitting layer 10 is controlled by controlling the color of the light; a dimming layer 30, which is arranged on one side of the light-emitting layer 10, and is used to dim the light emitted by the light-emitting layer 10, so that the light passing through the incident angle α (such as Figure 2 ) is light within a preset angle range passing through the dimming layer 30; and a projection layer 50 is disposed on the side of the dimming layer 30 away from the light-emitting layer 10, and is used to project the light passing through the dimming layer 30 to the side of the projection layer 50 away from the light-emitting layer 10, so as to perform aerial imaging. In other words, the projection layer 50 is used to reflect the light passing through the dimming layer 30 to the side of the projection layer 50 away from the light-emitting layer 10, and converge to form an image in the air.

[0057] The term “dimming layer 30 ” in the present application refers to a film layer that allows light incident at certain angles to pass through, while blocking light incident at other angles.

[0058] Optionally, the dimming layer 30 is adhered to the surface of the light-emitting layer 10 by transparent glue (not shown), such as OCA optical glue (Optically Clear Adhesive); or, the dimming layer 30 is directly stacked with the light-emitting layer 10, and then assembled and fixed by a fixing member or a frame. In addition, the dimming layer 30 can also be stacked and installed with the light-emitting layer 10 by other methods, which are not specifically limited in this application.

[0059] Optionally, the projection layer 50 is adhered to the surface of the dimming layer 30 away from the light-emitting layer 10 by transparent glue (not shown), such as OCA optical glue (Optically Clear Adhesive); or, the projection layer 50 is directly stacked with the dimming layer 30, and then assembled and fixed by a fixing member or a frame. In addition, the projection layer 50 can also be stacked and installed with the dimming layer 30 by other methods, which are not specifically limited in this application.

[0060] The housing assembly 100 of the present application may be a housing, a middle frame, a decorative part, etc. of an electronic device. The housing assembly 100 of the embodiment of the present application may be a 2D structure, a 2.5D structure, a 3D structure, etc. Optionally, the housing assembly 100 includes a bottom plate (not shown) and a side plate bent and connected to the bottom plate (not shown), the bottom plate and the side plate enclose a receiving space, and the receiving space is used to receive components (such as a PCB board, etc.).

[0061] The housing assembly 100 of the embodiment of the present application sets a dimming layer 30 between the light-emitting layer 10 and the projection layer 50, so that only light with an incident angle α within a preset angle range can pass through the dimming layer 30. In this way, after being dimmed by the dimming layer 30, the light has a certain incident angle when it enters the projection layer 50, so that the incident light can be projected to the side of the projection layer 50 away from the light-emitting layer 10 through the projection layer 50, effectively filtering the light that passes through the projection layer 50 without being reflected by the projection layer 50, so that the aerial imaging can be clearer and the aerial imaging quality is improved. At the same time, the dimming layer 30 and the projection layer 50 can be stacked in parallel, and the angle of the light entering the projection layer 50 can be controlled by the dimming layer 30, and there is no need to set the light-emitting layer 10 and the projection layer 50 at a 45° angle in order to obtain a clear image as in related designs. Therefore, the shell assembly of the present application can be made more miniaturized and can be applied to more scenarios, especially scenarios in small spaces, such as the shell of an electronic device 300, so that the pattern or color on the shell of the electronic device 300 has a three-dimensional sense (three-dimensional effect), which is used to improve the appearance of the shell of the electronic device 300.

[0062] Optionally, the light-emitting layer 10 may be, but is not limited to, an organic light-emitting layer or an inorganic light-emitting layer. Optionally, the organic light-emitting layer may be, but is not limited to, an organic light-emitting diode light-emitting layer (Organic Light-Emitting Diode, OLED), a backlight module, etc. Optionally, the inorganic light-emitting layer may be, but is not limited to, a light-emitting diode light-emitting layer (Light Emitting Diodes, LED), a quantum dot light-emitting diode light-emitting layer (Quantum Dot Light Emitting Diodes, referred to as QLED), a micro light-emitting diode light-emitting layer (Micro Light Emitting Diodes, referred to as Micro LED), and a sub-millimeter light-emitting diode light-emitting layer (Mini-led). Compared with the backlight module and the inorganic light-emitting layer, the organic light-emitting diode light-emitting layer consumes less power, which can make the electronic device have a longer battery life, and the thickness is thinner, which is more suitable for aerial imaging in narrow spaces such as the housing of the electronic device. Compared with the organic light-emitting diode light-emitting layer and the backlight module, the inorganic light-emitting layer has a higher brightness, which can make the imaging clearer.

[0063] See also Figure 3In some embodiments, when the light-emitting layer 10 is an organic light-emitting layer, the light-emitting layer 10 includes a stacked anode 11, a hole injection layer 12, a hole transport layer 13, a light-emitting unit layer 14, an electron transport layer 15, an electron injection layer 16 and a cathode 17. The anode 11 is used to load a positive voltage to generate holes. The holes jump over the energy barrier of the hole injection layer 12 under the drive of the external voltage and move to the hole transport layer 13. The hole transport layer 13 is used to transfer the holes to the light-emitting unit layer 14. The cathode 17 is used to load a negative voltage to generate electrons. The electrons jump over the energy barrier of the electron injection layer 16 under the drive of the external voltage and move to the electron transport layer 15. The electron transport layer 15 is used to transfer electrons to the light-emitting unit layer 14. Holes and electrons recombine in the light-emitting unit layer 14 to generate excitons, which activate the organic molecules in the light-emitting unit layer 14, thereby causing the electrons in the outermost layer of the organic molecules to transition from the ground state to the excited state. Since the electrons in the excited state are extremely unstable, they will transition to the ground state, and energy will be released in the form of light during the transition process, thereby achieving the light emission of the light-emitting layer 10. In one embodiment, the cathode 17 is arranged closer to the dimming layer 30 than the anode 11, and the cathode 17 is made of a transparent conductive material, such as indium tin oxide (ITO), and the anode 11 can be made of a transparent or opaque conductive material, such as titanium (Ti), aluminum (Al), molybdenum (Mo), copper (Cu), gold (Au) and other metals or metal alloys. In another embodiment, the anode 11 is arranged closer to the dimming layer 30 than the cathode 17, and the anode 11 is made of a transparent conductive material, such as indium tin oxide (ITO), and the cathode 17 can be made of a transparent or opaque conductive material, such as titanium (Ti), aluminum (Al), molybdenum (Mo), copper (Cu), gold (Au) and other metals or metal alloys. In other words, the light-emitting layer 10 is a transverse OLED.

[0064] See also Figure 4 Optionally, the cathode 17 is arranged closer to the dimming layer 30 than the anode 11, and the light-emitting layer 10 also includes a driving circuit 18, which is arranged on the side of the anode 11 away from the dimming layer 30, and the driving circuit 18 is electrically connected to the anode 11 for controlling the light-emitting unit layer 14 to emit light; and a substrate 19, which is arranged on the side of the driving circuit 18 away from the anode 11.

[0065] See also Figure 5Optionally, the driving circuit 18 includes a thin film transistor arranged in an array, and the thin film transistor includes a source 181, a drain 183, a gate 185 and an active layer 187 (also called a channel layer). The source 181 and the drain 183 are arranged in the same layer and are spaced apart, and are respectively connected to the active layer 187. The gate 185 and the active layer 187 are insulated from each other and are used to access the gate 185 signal, and the anode is electrically connected to the drain 183 or the source 181. Specifically, the thin film transistor can be a top gate structure or a bottom gate structure. Optionally, the source 181, the drain 183 and the gate 185 can be, but are not limited to, metals or metal alloys such as titanium (Ti), aluminum (Al), molybdenum (Mo), copper (Cu), gold (Au), etc. Optionally, the active layer 187 can be, but are not limited to, a semiconductor layer such as amorphous silicon (a-Si), polycrystalline silicon (p-Si), metal oxide (metal oxide), etc.

[0066] Optionally, the substrate 19 may be a glass substrate, or a substrate in which a polyimide (PI) flexible substrate is deposited on a glass substrate, etc.

[0067] See also Figure 6 In another embodiment, the light emitting layer 10 may be a backlight module, and the backlight module includes a light source 111 and a light guide plate 113. Optionally, the light source 111 is used to emit light, and the light source 111 may be, but is not limited to, an LED lamp, a QLED lamp, a Micro LED lamp, a Mini-led lamp, etc. The light guide plate 113 is used to transform the point light source emitted by the light source 111 into a surface light source for uniform emission. The light guide plate 113 includes a connected light incident surface 101 and a light emitting surface 103. The light source 111 is arranged close to the light incident surface 101 of the light guide plate 113. The light emitted by the light source 111 enters the light guide plate 113 from the light incident surface 101 of the light guide plate 113, and then is emitted through the light emitting surface 103 of the light guide plate 113.

[0068] Optionally, the thickness of the light-emitting layer 10 may range from 50um to 150um; specifically, it may be, but not limited to, 50um, 60um, 70um, 80um, 90um, 100um, 110um, 120um, 130um, 140um, 150um, etc. When the housing assembly 100 of the embodiment of the present application is applied to a larger space, the thickness of the light-emitting layer 10 may also be thicker, which is not specifically limited in the present application.

[0069] Optionally, the color of the light provided by the light emitting layer 10 may include but is not limited to at least one of white light, orange light, red light, blue light, green light, etc. The light emitting layer 10 may be a light emitting device that can only emit monochromatic light, or may be a display layer including a red light emitting unit, a blue light emitting unit, and a green light emitting unit, and the chromaticity and brightness of the red light emitting unit, the blue light emitting unit, and the green light emitting unit may be adjusted to control the display layer of the content displayed by the light emitting layer 10.

[0070] Optionally, the dimming layer 30 includes multiple light-transmitting layers (not shown), each of which has the same refractive index, and the multiple light-transmitting layers are stacked along the stacking direction of the light-emitting layer 10, the dimming layer 30 and the projection layer 50. Optionally, the number of the light-transmitting layers is at least 800 layers. In other words, the dimming layer 30 includes at least 800 stacked light-transmitting layers; specifically, the number of light-transmitting layers may be, but is not limited to, 900 layers, 1000 layers, 1100 layers, 1200 layers, 1300 layers, 1400 layers, 1500 layers, etc. After the light emitted by the light-emitting layer 10 enters the dimming layer 30, since the light will be refracted once after passing through each light-transmitting layer, only the light with an incident angle greater than a certain angle can pass through the dimming layer 30, and the light with an incident angle less than this angle will eventually fail to pass through the dimming layer 30 due to the refraction of light.

[0071] Optionally, the light-transmitting layer is a nano-level light-transmitting layer, in other words, each light-transmitting layer is a light-transmitting layer with a thickness of nanometer level. Optionally, the thickness of the light-transmitting layer is 30nm to 120nm, specifically, it can be but not limited to 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 120nm, etc. The light-transmitting layer can be but not limited to a polyethylene terephthalate layer (Polyethylene terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate Two Formic Acid Glycol Ester, PEN), a polycarbonate layer (Polycarbonate, PC), a polyimide layer (Polyimide, PI), etc. The light transmittance of the light-transmitting layer is greater than or equal to 85%, specifically, the light transmittance of the light-transmitting layer is but not limited to 85%, 87%, 90%, 92%, 95%, 98%, etc. In a specific embodiment, the dimming layer 30 includes at least 800 layers of nano-scale PET films stacked. Optionally, when the light-transmitting layer is a material with high ductility such as a PEN layer or a PET layer, the dimming layer 30 can be prepared by the following steps: 1) stacking and laminating at least 800 layers of light-transmitting layers; and 2) biaxially stretching the stacked multi-layer light-transmitting layers to obtain the dimming layer 30. PEN and PET have better ductility than PC and PI. Therefore, when the light-transmitting layer is a PEN layer or a PET layer, the dimming layer 30 can be obtained by stacking and laminating at least 800 layers of light-transmitting layers, and then biaxially stretching the stacked multi-layer light-transmitting layers to obtain a dimming layer 30 with multiple nano-scale light-transmitting layers stacked.

[0072] Optionally, the thickness of the dimming layer 30 ranges from 30 μm to 150 μm; specifically, it can be, but is not limited to, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, etc. The thickness of the dimming layer 30 can be adjusted according to the wavelength or color of the light emitted by the light-emitting layer 10, so that the light emitted by the light-emitting layer 10 and the light with an incident angle α in a preset angle range can pass through. In a specific embodiment, when the wavelength of the light emitted by the light-emitting layer 10 is 430 nm to 480 nm (blue light), the thickness of the dimming layer 30 is 70 μm.

[0073] Optionally, the preset angle range may be a range of values ​​between any two values ​​between 0° and 90°, excluding 0° and 90°.

[0074] Optionally, the preset angle range is 30°≤α<90°, specifically, it can be but not limited to 30°, 35°, 40°, 45°, 48°, 50°, 55°, 58°, 60°, 62°, 65°, 70°, 75°, 80°, 89°, etc. In some embodiments, the preset angle range is 45°≤α<90°. In other words, only light with an incident angle α between 45° and 90° can pass through the dimming layer 30, and light at other angles ultimately does not pass through the dimming layer 30 due to reflection and refraction of light. Light rays of various angles emitted from the same point on the light-emitting layer 10 can be converged and imaged in the air on the side of the projection layer 50 away from the light-emitting layer 10 only after being reflected by the projection layer 50. If the light rays are not reflected by the projection layer 50 and directly pass through the projection layer 50, they cannot be converged. Light rays that are directly passed through the projection layer 50 without being reflected will also interfere with the aerial imaging, making the aerial imaging unclear or blurred. Therefore, by making the light with an incident angle α of 45°≤α<90° unable to pass through the dimming layer 30 through the dimming layer 30, the light rays that are not reflected by the projection layer 50 and directly pass through the projection layer 50 can be reduced as much as possible, thereby reducing the interference of this part of light rays on the aerial imaging, affecting the imaging quality, or even failing to form an image. Specifically, the incident angle α can be any interval range between 45° and 90°, or any value, such as 45°, 48°, 50°, 55°, 58°, 60°, 62°, 65°, 70°, 75°, 80°, 89°, etc.

[0075] See also Figure 2 , Figure 7 and Figure 8 In some embodiments, the projection layer 50 includes a first substrate 51 and a plurality of reflective portions 53 disposed in the first substrate 51. The plurality of reflective portions 53 are used to reflect the light passing through the dimming layer 30 to the side of the projection layer 50 away from the light-emitting layer 10 and converge to form an image. The refractive index of the plurality of reflective portions 53 is greater than the refractive index of the first substrate 51. The plurality of reflective portions 53 are arranged at intervals to form a reflective grating. In other words, the projection layer 50 includes a first substrate 51 and a reflective grating formed inside the first substrate 51. The reflective grating includes a plurality of reflective portions 53 arranged at intervals. Compared with being disposed on the surface of the first substrate 51, the reflective portion 53 disposed inside the first substrate 51 is not easily damaged during the assembly of the projection layer 50, and the assembly process is relatively simple.

[0076] Optionally, the thickness of the projection layer 50 may be 30um to 200um; specifically, the thickness of the projection layer 50 may be but is not limited to 30um, 40um, 50um, 60um, 70um, 80um, 90um, 100um, 120um, 140um, 160um, 180μm, 200um, etc.

[0077] Optionally, the first substrate 51 may be, but not limited to, a polyurethane (PU) substrate, and the reflective portion 53 may be, but not limited to, a polybenzyl methacrylate reflective portion 53. In addition, the reflective portion 53 may also be other reflective portions 53 having a refractive index greater than that of the first substrate 51 and being transparent, which is not specifically limited in this application. Optionally, the projection layer 50 may be formed by the following steps: 1) mixing and molding benzyl methacrylate with polyurethane; 2) irradiating with light (e.g., laser, ultraviolet light, etc.) to polymerize the benzyl methacrylate to form a plurality of reflective portions 53 arranged at intervals.

[0078] like Figure 7 As shown, in some embodiments, the plurality of reflective portions 53 are arranged in an array. Figure 8 As shown, in other embodiments, the reflective portion 53 is a strip-shaped reflective strip, and the plurality of reflective portions 53 are arranged along a first direction (eg Figure 8 As shown by arrow A), each of the reflecting portions 53 is arranged in a spaced relationship along the second direction (as shown by arrow A). Figure 8 The first direction and the second direction intersect. In a specific embodiment, the first direction is perpendicular to the second direction. In other words, the extension direction of the plurality of reflective portions 53 is perpendicular to the arrangement direction. When the plurality of reflective portions 53 are arranged in an array, the imaging of the projection layer 50 can be made more complete, and a more complete aerial imaging can be obtained. When the plurality of reflective portions 53 are reflective strips arranged at intervals, the preparation process of the projection layer 50 can be simplified, and it can be applied to fields that do not have such high requirements for imaging integrity, for example, in the presentation of color or three-dimensional effects.

[0079] Optionally, the reflective portion 53 may be in the shape of a cube, a cuboid, a prism, a pyramid or other structure having a reflective surface.

[0080] Please also see Fig. 9 and Fig.10Optionally, the width W of the reflective portion 53 is 50 μm to 300 μm; specifically, it can be, but not limited to, 50 μm, 60 μm, 80 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, 230 μm, 250 μm, 280 μm, 300 μm, etc. The “width of the reflective portion 53” refers to the width of the reflective portion 53 away from the surface of the light-emitting layer 10 along the arrangement direction of the plurality of reflective portions 53. The smaller the width W of the reflective portion 53, the more accurate the imaging can be. However, the reduction in width reduces the overall reflected light, which reduces the brightness of the imaging and increases the difficulty of processing. Therefore, when the width W of the reflective portion 53 is within this range, a better balance can be obtained in terms of imaging accuracy and brightness. Optionally, when the reflective portion 53 is a strip-shaped reflective strip, the length of the reflective portion 53 is not specifically limited.

[0081] Optionally, the spacing D between two adjacent reflective parts 53 is 10 μm to 200 μm; specifically, it can be, but is not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 80 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, etc. “The spacing D between two adjacent reflective parts 53” refers to the spacing between two adjacent reflective parts 53 away from the surface of the light-emitting layer 10 along the arrangement direction of the plurality of reflective parts 53. When the spacing D between adjacent reflective parts 53 is too large, more light directly passes through the projection layer 50 without being reflected by the projection layer 50, thereby affecting the imaging quality of the housing assembly 100.

[0082] Optionally, along the stacking direction of the light-emitting layer 10, the dimming layer 30 and the projection layer 50, in other words, along the surface perpendicular to the projection layer 50 and close to the dimming layer 30, the height H of the reflective portion 53 is 150 μm to 250 μm, specifically, but not limited to, 150 μm, 160 μm, 170 μm, 180 μm, 200 μm, 205 μm, 210 μm, 215 μm, 220 μm, 225 μm, 230 μm, 235 μm, 240 μm, 245 μm, 250 μm, etc. When the height H of the reflective portion 53 is within this range, the light emitted by the dimming layer 30 can be better reflected, so that the imaging is clearer and the imaging quality is higher.

[0083] Optionally, each of the reflective portions 53 includes one or more reflective surfaces 531, and the reflective surfaces 531 are used to reflect the light that passes through the dimming layer 30 and enters the projection layer 50 to the side of the projection layer 50 away from the light-emitting layer 10, and the angle β between the reflective surface 531 and a preset direction is 0° to 25°, and the preset direction is perpendicular to the projection layer 50. Specifically, β can be, but is not limited to, 0°, 2°, 4°, 5°, 8°, 10°, 12°, 15°, 18°, 20°, 22°, 25°, etc. When the angle β between the reflective surface and the preset direction is greater than 25°, the density of the reflective portion 53 is reduced, so that the light flux passing through the projection layer 50 is reduced, thereby affecting the clarity of the imaging and reducing the imaging quality. Optionally, the area of ​​the surface of the reflective portion 53 close to the dimming layer 30 is greater than the area of ​​the surface of the reflective portion 53 away from the dimming layer 30. Optionally, along a direction perpendicular to the stacking direction of the light-emitting layer 10 , the dimming layer 30 and the projection layer 50 , a cross-sectional area of ​​the reflective portion 53 gradually decreases from a surface close to the dimming layer 30 to a surface far from the dimming layer 30 .

[0084] See also Figure 7 , Figure 8 and Fig.11 In some embodiments, the projection layer 50 includes a second substrate 52 and a plurality of reflective portions 53, wherein the plurality of reflective portions 53 are arranged at intervals on the surface of the second substrate 52 away from the light-emitting layer 10 to form a reflective grating for reflecting the light passing through the dimming layer 30 to the side of the projection layer 50 away from the light-emitting layer 10 and converging the light to form an image. The reflective portion 53 is disposed on the surface of the second substrate 52, so that the structure and size of the reflective portion 53 can be better controlled to avoid the large deviation of the refractive index of each reflective portion 53 due to the inconsistent size of the reflective portion 53, thereby generating unstable imaging temperature.

[0085] like Figure 7 As shown, in some embodiments, the plurality of reflective portions 53 are arranged in an array. Figure 8 As shown, in other embodiments, the reflective portion 53 is a strip-shaped reflective strip, and the plurality of reflective portions 53 are arranged along a first direction (eg Figure 8 As shown by arrow A), each of the reflecting portions 53 is arranged in a spaced relationship along the second direction (as shown by arrow A). Figure 8 The first direction is perpendicular to the second direction. In a specific embodiment, the first direction is perpendicular to the second direction. In other words, the extending direction of the plurality of reflective portions 53 is perpendicular to the arrangement direction. For the description of other features of the reflective portion 53, please refer to the description of the above embodiment, which will not be repeated here.

[0086] Optionally, the second substrate 52 may be, but is not limited to, a light-transmitting substrate such as a polyethylene terephthalate (PET) substrate, a polymethyl methacrylate (PMMA) substrate, or a polycarbonate (PC) substrate.

[0087] In some embodiments, the reflector 53 is a transparent resin reflector. Optionally, the transparent resin reflector may be, but is not limited to, an epoxy resin reflector, an acrylate reflector (e.g., polymethyl methacrylate (PMMA)), a photocurable texture part (UV texture part), etc. In other words, the transparent resin reflector is made of transparent resins such as epoxy resin or acrylate, UV glue, etc. Optionally, the light transmittance of the transparent resin reflector is greater than or equal to 85%, specifically, it may be, but is not limited to, 85%, 88%, 90%, 92%, 94%, 96%, etc. Optionally, the transparent resin reflector is made by the following steps: 1) using a transparent resin monomer to form a semi-cured or uncured transparent resin layer on the second substrate 52; 2) using printing, molding or hot pressing to cure the surface of the second substrate 52 away from the light-emitting layer 10 to form a plurality of transparent resin reflectors 53 arranged at intervals. When the reflector 53 is a transparent resin reflector, the reflector 53 is easier to shape, and the preparation process of the projection layer 50 is simpler and the cost is lower.

[0088] In other embodiments, along the stacking direction of the light-emitting layer 10, the dimming layer 30 and the projection layer 50, the reflective portion 53 includes a stacked multilayer optical coating layer (not shown), and each layer of the optical coating layer has the same refractive index. The optical coating layer may be, but is not limited to, a TiO2 layer, a NbO2 layer, a Nb2O3 layer, a Nb2O2 layer, a Nb2O5 layer, a SiO2 layer, or a ZrO2 layer. In this embodiment, the reflective portion 53 may be prepared by the following steps: 1) using non-conductive vacuum metalization (NCVM) technology to form a stacked multilayer optical coating layer on the surface of the second substrate 52, and etching the multilayer optical coating layer (e.g., laser etching, etc.) to form a plurality of reflective portions 53 arranged in an array or spaced apart on the surface of the second substrate 52. When the reflective portion 53 is formed by an optical coating layer, since the optical coating layer is relatively hard, the reflective portion 53 has a higher hardness. During assembly, the reflective portion 53 is not easily damaged, so that the housing assembly 100 has a better yield.

[0089] For the description of the parts of this embodiment that are the same as those in the above embodiment, please refer to the above embodiment and will not be repeated here.

[0090] See also Fig.12In some embodiments, the projection layer 50 includes a second substrate 52 and a plurality of reflective portions 53 disposed on the second substrate 52. The plurality of reflective portions 53 are arranged at intervals on the surface of the second substrate 52 away from the light-emitting layer 10. The second substrate 52 and the plurality of reflective portions 53 are an integrated structure. The second substrate 52 serves as a protective layer of the housing assembly 100. The plurality of reflective portions are used to reflect the light passing through the dimming layer to the side of the projection layer away from the light-emitting layer and converge to form an image. Integrating the reflective portion 53 and the protective layer of the housing assembly 100 into an integrated structure can further reduce the thickness of the housing assembly 100, which is conducive to improving user experience.

[0091] In some embodiments, the plurality of reflective portions 53 are arranged in an array. In other embodiments, the reflective portion 53 is a strip-shaped reflective strip, and the plurality of reflective portions 53 are arranged in a first direction (eg, Figure 8 As shown by arrow A), each of the reflecting portions 53 is arranged in a spaced relationship along the second direction (as shown by arrow A). Figure 8 The first direction is perpendicular to the second direction. In a specific embodiment, the first direction is perpendicular to the second direction. In other words, the extending direction of the plurality of reflective portions 53 is perpendicular to the arrangement direction. For the description of other features of the reflective portion 53, please refer to the description of the above embodiment, which will not be repeated here.

[0092] In this embodiment, the projection layer 50 can be directly used as the appearance layer or the shell layer of the shell component 100. In other words, when used, the projection layer 50 is used as the outermost layer of the shell component 100. In this embodiment, the light transmittance of the projection layer 50 is greater than or equal to 85%, specifically, it can be but not limited to 85%, 88%, 90%, 92%, 94%, 96%, etc. In this embodiment, the thickness of the projection layer 50 is 0.2mm to 1mm, specifically, it can be but not limited to 0.2mm, 0.3mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, etc. The projection layer 50 can be a 2D structure, a 2.5D structure, a 3D structure, etc.

[0093] Optionally, the projection layer 50 may be, but is not limited to, a polyethylene terephthalate layer (PET), a polymethyl methacrylate layer (PMMA), a polycarbonate layer (PC), an inorganic glass layer, a light-transmitting inorganic fiber resin board, etc. The raw material components of the inorganic fiber resin board include, but are not limited to, inorganic fiber cloth and polymerizable resin. The polymerizable resin may be, but is not limited to, epoxy resin (e.g., bisphenol A epoxy resin), phenolic resin, polyester resin, thermoplastic resin, etc. The inorganic fiber resin board is formed by soaking the inorganic fiber cloth in the polymerizable resin, and after curing, one or more layers of laminated inorganic fiber resin boards are formed. The inorganic fiber resin board has good mechanical strength. Therefore, when the inorganic fiber resin board is used as a substrate, the projection layer 50 can be made thinner to improve the user experience. The inorganic fiber cloth may be, but is not limited to, an inorganic fiber cloth formed by one or more of glass fiber, carbon fiber quartz glass fiber, boron fiber, ceramic fiber, and metal fiber. The inorganic fiber resin plate has good mechanical strength. Therefore, when the inorganic fiber resin plate is used as the substrate of the projection layer 50, it can be made thinner to improve the user experience. Optionally, the projection layer 50 can be formed by the following steps: 1) providing a light-transmitting substrate; 2) engraving or laser etching the surface of the light-transmitting substrate to form a plurality of reflective portions 53 arranged in an array or arranged at intervals on the surface of the light-transmitting substrate, and the portion of the light-transmitting substrate other than the plurality of reflective portions 53 is the second substrate 52. When the projection layer 50 is made of a material with high strength and high modulus such as inorganic glass or an inorganic fiber resin plate, the projection layer 50 is not easily worn due to exposure to the surface during the use of the housing assembly 100, thereby affecting the projection function of the projection layer 50.

[0094] For the description of the parts of this embodiment that are the same as those in the above embodiment, please refer to the above embodiment and will not be repeated here.

[0095] See also Fig.13In some embodiments, the housing assembly 100 of the embodiment of the present application further includes a decorative layer 70, which is disposed on the side of the projection layer 50 away from the light-emitting layer 10, and is used to cooperate with the light-emitting layer 10 to adjust the aerial imaging. In a specific embodiment, the color and pattern of the decorative layer 70 are superimposed on the color of the light emitted by the light-emitting layer 10 to change the color and pattern of the imaging, so that the aerial imaging of the housing assembly 100 in the air has more diverse color or colorful visual effects. The decorative layer 70 has a color or pattern or the decorative layer 70 is a patterned film layer. When the light emitted by the light-emitting layer 10 passes through the dimming layer 30 and is reflected by the projection layer 50, the color of the light passing through the projection layer 50 overlaps with the color of the decorative layer 70, so that the aerial imaging on the side of the projection layer 50 away from the light-emitting layer 10 can display more colors, thereby making the aerial imaging have more diverse color or colorful effects. Optionally, the decoration layer 70 is adhered to the surface of the projection layer 50 by transparent glue (not shown) such as OCA optical glue (Optically Clear Adhesive). In addition, the decoration layer 70 can also be stacked and installed with the projection layer 50 by other methods, which are not specifically limited in this application.

[0096] Optionally, the decoration layer 70 includes a base layer 71 , a color layer 73 and a coating layer 75 which are stacked, and the base layer 71 is arranged closer to the projection layer 50 than the coating layer 75 .

[0097] Optionally, the base layer 71 is transparent, and the base layer 71 may be, but is not limited to, one or more of polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polycarbonate (PC), and the like.

[0098] Optionally, the color layer 73 is translucent, and the pigment components of the color layer 73 may include, but are not limited to, one or more of polyurethane, polyvinyl chloride, etc. In addition, the raw material components of the color layer 73 also include pigments. By controlling the color and ratio of the pigments, the color layer 73 can present different color appearance effects. The color layer 73 is used to make the aerial imaging of the projection layer 50 of the housing assembly 100 away from the light-emitting layer 10 present a color effect after the color of the light reflected by the projection layer 50 and the color of the color layer 73 are superimposed. When the color layer 73 is monochrome, the aerial imaging of the decorative layer 70 away from the projection layer 50 is a color after the two colors are superimposed. When the color layer 73 is colorful, the aerial imaging of the decorative layer 70 away from the projection layer 50 presents a superimposed color effect. The thickness of the color layer 73 is 2 μm to 30 μm, specifically, but not limited to, 2 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 30 μm, etc. Optionally, the color layer 73 is formed by spraying, offset printing or printing a glue solution composed of raw material components of the color layer 73, and then performing photocuring.

[0099] Optionally, the coating layer 75 may be one or more of indium, tin, indium oxide, etc., for making the decorative layer 70 have a glare effect, so that the aerial imaging of the projection layer 50 of the housing assembly 100 away from the light-emitting layer 10 has a glare effect. Optionally, the coating layer 75 may include one or more coating layers 75, and the thickness of the coating layer 75 may be 5nm to 100nm. Specifically, the thickness of the coating layer 75 may be, but is not limited to, 5nm, 10nm, 20nm, 22nm, 25nm, 28nm, 30nm, 32nm, 34nm, 35nm, 50nm, 80nm, 100nm, etc.

[0100] See also Fig.14 and Fig.15In some embodiments, the housing assembly 100 of the embodiment of the present application further includes a protective layer 90, which is disposed on the side of the projection layer 50 away from the light-emitting layer 10, and is used to protect the projection layer 50 or the decorative layer 70, so that the housing assembly 100 is not easily damaged, worn or scratched, which affects the quality of aerial imaging, and the housing assembly 100 has a longer life. Optionally, in one embodiment, the protective layer 90 is adhered to the surface of the projection layer 50 away from the light-emitting layer 10 by transparent glue such as OCA optical glue (Optically Clear Adhesive); in another embodiment, the protective layer 90 is adhered to the surface of the decorative layer 70 away from the light-emitting layer 10 by transparent glue such as OCA optical glue (Optically Clear Adhesive); or the protective layer 90 is directly stacked with the projection layer 50 or the decorative layer 70, and then assembled and fixed by a fixing member or a frame. In addition, the protective layer 90 can also be stacked and installed with the projection layer 50 or the decorative layer 70 in other ways, which is not specifically limited in this application.

[0101] Optionally, the protective layer 90 is light-transmitting, and the protective layer 90 may be, but is not limited to, one or more of a polyethylene terephthalate (PET) shell, a polymethyl methacrylate (PMMA) shell, a polycarbonate shell (PC), an inorganic glass shell, a light-transmitting inorganic fiber resin plate, etc. The light transmittance of the light-transmitting shell is greater than or equal to 85%, specifically, it may be, but is not limited to, 85%, 88%, 90%, 92%, 94%, 96%, etc. Optionally, the thickness of the light-transmitting shell is 0.1 mm to 2 mm, specifically, it may be, but is not limited to, 0.1 mm, 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.3 mm, 1.6 mm, 2 mm, etc. Optionally, the light-transmitting shell may be a 2D structure, a 2.5D structure, a 3D structure, etc.

[0102] See also Fig.16 The embodiment of the present application also provides an electronic device 300, which includes the housing assembly 100 described in the embodiment of the present application.

[0103] The shell assembly 100 of the present application can be used as a shell, middle frame or decorative part of the electronic device 300, and is used to image the color or pattern of the shell of the electronic device 300 through the shell assembly 100, so that the color and pattern on the shell of the electronic device have a better three-dimensional sense, thereby improving the appearance expression of the shell of the electronic device 300.

[0104] The electronic device 300 in the embodiment of the present application may be, but is not limited to, a portable electronic device 300 such as a mobile phone, a tablet, a laptop computer, a desktop computer, a smart bracelet, a smart watch, etc.

[0105] See also Fig.17 Optionally, the electronic device 300 of the embodiment of the present application further includes a processor 310 and a memory 330. The processor 310 is electrically connected to the light-emitting layer 10 of the housing assembly 100 and the memory 330, respectively, and is used to control the light-emitting layer 10 to turn on and off, and to control the color of the emitted light, thereby adjusting the content, pattern and color displayed by the light-emitting layer 10, and then adjusting the color of the aerial image. The memory 330 is used to store the program code required for the operation of the processor 310, the display content, pattern, and color of the light-emitting layer 10, etc. Optionally, the processor 310 can call the display content, pattern and color stored in the memory 330, and control the light-emitting layer 10 to display different patterns, content or colors according to different states of the electronic device 300, such as a mobile phone. For example, when a call or text message comes in, the light-emitting layer 10 can be controlled to display a first pattern or a first color or an image of the incoming caller to prompt the user that a call or message is received; for another example, when the battery is low, the light-emitting layer 10 can be controlled to display a second pattern or a second color to prompt the user that the electronic device is not lit enough. In addition, the processor 310 calls the content, pattern and color stored in the memory 330 for the user to select, and controls the light-emitting layer 10 to display the pattern, color or content selected by the user according to the pattern, color or content selected by the user, so that the shell assembly 100 of the electronic device 300 presents different patterns and colors, thereby preventing the user from aesthetic fatigue and improving the user experience.

[0106] The processor 310 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 703 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 701, which enables the computing device to provide a wide variety of services.

[0107] Optionally, the memory 330 may include a volatile memory (Volatile Memory), such as a random access memory (Random Access Memory, RAM); the memory 330 may also include a non-volatile memory (NVM), such as a read-only memory (Read-Only Memory, ROM), a flash memory (Flash Memory, FM), a hard disk drive (Hard Disk Drive, HDD) or a solid-state drive (SSD). The memory 330 may also include a combination of the above-mentioned types of memory.

[0108] See also Fig.18 and Fig.19 The electronic device 300 of the embodiment of the present application further includes a gesture recognition module 350, which is electrically connected to the processor 310 and is used to obtain the user's gesture information and send the gesture information to the processor 310, so that the processor 310 generates a control signal according to the gesture information to control the light-emitting layer 10 of the housing assembly 100 to display the preset information, wherein the preset information may be information pre-stored in the memory 330, which may be pre-associated with specific gesture information. When the processor 310 receives the user's specific gesture information, the light-emitting layer 10 of the housing assembly 100 is controlled to display the corresponding preset information, which may be but not limited to a specific pattern, text, image, color, etc. For example, when the user draws a circle or makes a circle gesture with a hand gesture, it means that the user wants to switch the content displayed by the light-emitting layer 10. At this time, the processor 310 can call out the content stored in the memory 330 for the user to select. When the user gestures the corresponding number collected by the gesture recognition module 350, it is transmitted to the processor 310, so that the processor 310 controls the light-emitting layer 10 to display the corresponding content according to the user's gesture information. The specific gesture control and content display can be adjusted according to user needs and actual conditions, and this application does not make any specific limitations.

[0109] Optionally, the gesture recognition module 350 may be, but is not limited to, a gesture recognition sensor, a camera, etc.

[0110] References to "embodiments" and "implementations" herein mean that a particular feature, structure, or characteristic described in conjunction with an embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various locations in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments that are mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0111] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A housing assembly, characterized in that: include: A luminous layer for emitting light; A dimming layer, disposed on one side of the light emitting layer, for dimming the light emitted by the light emitting layer so that the light with an incident angle within a preset angle range passes through the dimming layer; as well as A projection layer is disposed on a side of the dimming layer away from the light-emitting layer, and is used to project the light passing through the dimming layer to a side of the projection layer away from the light-emitting layer, so as to perform aerial imaging; The dimming layer includes multiple light-transmitting layers, and the multiple light-transmitting layers are stacked along the stacking direction of the light-emitting layer, the dimming layer and the projection layer.

2. The housing assembly according to claim 1, characterized in that: The refractive index of each light-transmitting layer is the same, and the light transmittance of the light-transmitting layer is greater than or equal to 85%.

3. The housing assembly according to claim 1, characterized in that: The thickness of the dimming layer ranges from 30 μm to 150 μm, the number of the light-transmitting layers is at least 800, and the thickness of the light-transmitting layers ranges from 30 nm to 120 nm.

4. The housing assembly according to claim 1, characterized in that: The preset angle range is 45° to 90°, excluding 90°.

5. The housing assembly according to any one of claims 1 to 4, characterized in that: The housing assembly further comprises a decoration layer, which is arranged on a side of the projection layer away from the light-emitting layer and is used to cooperate with the light-emitting layer to adjust the imaging.

6. The housing assembly according to claim 5, characterized in that: The projection layer includes a first substrate and a plurality of reflective portions arranged in the first substrate, wherein the plurality of reflective portions are arranged at intervals and are used to reflect light passing through the dimming layer to a side of the projection layer away from the light-emitting layer and converge to form an image, and the refractive index of the plurality of reflective portions is greater than the refractive index of the first substrate.

7. The housing assembly according to claim 5, characterized in that: The projection layer includes a second substrate and a plurality of reflective portions, which are arranged at intervals on a surface of the second substrate away from the light-emitting layer, and are used to reflect light passing through the dimming layer to a side of the projection layer away from the light-emitting layer, and converge to form an image.

8. The housing assembly according to claim 7, characterized in that: The reflecting part is a transparent resin reflecting part; or, the reflecting part includes a multi-layer optical coating layer, and the multi-layer optical coating layer is stacked along the stacking direction of the light-emitting layer, the dimming layer and the projection layer.

9. The housing assembly according to any one of claims 6 to 8, characterized in that: The shell assembly further includes a protective layer, which is disposed on a side of the projection layer away from the light-emitting layer and is used to protect the projection layer.

10. The housing assembly according to claim 5, characterized in that: The projection layer includes a second substrate and a plurality of reflective portions, wherein the plurality of reflective portions are arranged at intervals on a surface of the second substrate away from the light-emitting layer, and the plurality of reflective portions and the second substrate are an integral structure, and the second substrate serves as a protective layer of the shell assembly, and the plurality of reflective portions are used to reflect light passing through the dimming layer to a side of the projection layer away from the light-emitting layer, and converge to form an image.

11. The housing assembly according to any one of claims 6 to 8 and 10, characterized in that: The width of the reflection part is 50 μm to 300 μm, the interval between adjacent reflection parts is 10 μm to 200 μm, and the height of the reflection part is 150 μm to 250 μm.

12. The housing assembly according to claim 11, characterized in that Each of the reflecting parts includes one or more reflecting surfaces, which are used to reflect the light that passes through the dimming layer and enters the projection layer to the side of the projection layer away from the light-emitting layer. The angle between the reflecting surface and the preset direction is 0° to 25°, wherein the preset direction is perpendicular to the projection layer.

13. An electronic device, characterized in that: A housing assembly comprising any one of claims 1-12.

Images