Electronic component and electronic component module having the same

Abstract

Provided are an electronic component capable of improving heat dissipation and an electronic component module having the electronic component. The electronic component (1) comprises a substrate (2), a functional part (3), a plurality of external connection conductor parts (4), a first heat conduction part (5), and a second heat conduction part (6). The functional part (3) is arranged on a main surface (21) side of the substrate (2). The functional part (3) generates heat. The plurality of external connection conductor parts (4) are directly or indirectly arranged on a main surface (21) of the substrate (2). The first heat conduction part (5) is directly or indirectly arranged on the first area (221) of the other main surface (22) of the substrate (2), when viewed from above in the thickness direction (D1) of the substrate (2), between a first area (221) that does not overlap with the functional part (3) and a second area (222) that only overlaps with the functional part (3). The second heat conducting portion (6) is directly or indirectly provided on at least a portion of the second region (222) on the other main surface (22) of the substrate (2) when viewed from above in the thickness direction (D1) of the substrate (2), and is separated from the first heat conducting portion (5).

Description

Technical Field

[0001] The present invention generally relates to an electronic component and an electronic component module including the electronic component, and more particularly to an electronic component including a functional portion that generates heat and an electronic component module including the electronic component. Background Art

[0002] Conventionally, as an electronic component module, there is known a branching filter including a wiring board, a transmission filter chip, and a reception filter chip (for example, refer to Patent Document 1).

[0003] In the splitter described in Patent Document 1, a transmission filter chip and a reception filter chip are flip-chip mounted on a flat upper surface of a wiring substrate via bumps. The bumps are made of metal such as gold (Au), for example.

[0004] The transmission filter chip and the reception filter chip are composed of a surface acoustic wave device chip, including a piezoelectric substrate and an IDT (Interdigital Transducer) provided on the surface of the piezoelectric substrate facing the wiring substrate. The transmission filter chip and the reception filter chip generate heat from the IDT during operation.

[0005] The splitter according to the third embodiment of Patent Document 1 has a metal film formed on the upper surface (the surface opposite to the surface facing the wiring substrate) and all the side surfaces of the transmission filter chip, and a metal film formed on the upper surface (the surface opposite to the surface facing the wiring substrate) and all the side surfaces of the reception filter chip. Patent Document 1 describes that heat generated by the heat generating element of the elastic wave device chip (electronic component) flows into the solder sealing the elastic wave device chip, thereby obtaining a heat dissipation effect, and flows from the wiring substrate to the mounting substrate via the solder, thereby also obtaining a heat dissipation effect.

[0006] Prior Art Literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2016-181759 Summary of the invention

[0009] Problems to be solved by the invention

[0010] In the electronic component described in Patent Document 1 and the electronic component module having the electronic component, a metal film is used as a heat dissipation path, so that failures and characteristic changes caused by heat can be suppressed. Here, in the electronic component described in Patent Document 1, a metal film (heat conduction part) is uniformly formed on the entire upper surface and all side surfaces, so it seems that the heat transfer efficiency is good. However, in the electronic component and the electronic component module having the electronic component, it is not considered that the heat generated by the functional parts such as the IDT on one main surface side of the main surface of the substrate such as the piezoelectric substrate and the other main surface in the electronic component is efficiently transferred through the external connecting conductor part such as the bump on one main surface side of the substrate in the electronic component. Therefore, in the electronic component having a functional part accompanied by heat generation and the electronic component module having the electronic component, there is a situation where it is desired to further improve the heat dissipation.

[0011] An object of the present invention is to provide an electronic component capable of improving heat dissipation and an electronic component module including the electronic component.

[0012] Means for solving problems

[0013] An electronic component according to one embodiment of the present invention includes a substrate, a functional part, a plurality of external connection conductor parts, a first heat conducting part, and a second heat conducting part. The substrate has one main surface and another main surface. The functional part is provided on the one main surface side of the substrate. The functional part generates heat. The plurality of external connection conductor parts are directly or indirectly provided on the one main surface of the substrate. The first heat conducting part is directly or indirectly provided on the first region of the first region that does not overlap with the functional part and the second region that overlaps only with the functional part on the other main surface of the substrate in a plan view from the thickness direction of the substrate. The first heat conducting part has a heat conductivity greater than that of the substrate. The second heat conducting part is directly or indirectly provided on at least a part of the second region on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and is separated from the first heat conducting part. The second heat conducting part has a heat conductivity greater than that of the substrate. The other main surface of the substrate has no heat conductive portion having a higher heat conductivity than that of the substrate disposed between the first heat conductive portion and the second heat conductive portion in a plan view in the thickness direction of the substrate.

[0014] An electronic component according to one embodiment of the present invention comprises a substrate, a functional part, a plurality of external connection conductor parts and a heat conduction part. The substrate has one main surface and another main surface. The functional part is arranged on the one main surface side of the substrate. The functional part generates heat. The plurality of external connection conductor parts are directly or indirectly arranged on the one main surface of the substrate. The heat conduction part is directly or indirectly arranged on at least the first region of a first region that does not overlap with the functional part and a second region that overlaps only with the functional part on the other main surface of the substrate when viewed from above in the thickness direction of the substrate. The heat conduction part has a heat conductivity greater than that of the substrate. The heat conduction part is not arranged in the entire region of the second region when viewed from above in the thickness direction of the substrate.

[0015] An electronic component according to one embodiment of the present invention includes a substrate, a functional portion, a plurality of external connection conductor portions, a first heat conducting portion, a second heat conducting portion, and a third heat conducting portion. The substrate has one main surface and another main surface. The functional portion is provided on the one main surface side of the substrate. The functional portion generates heat. The plurality of external connection conductor portions are provided directly or indirectly on the one main surface of the substrate. The first heat conducting portion is provided directly or indirectly on a portion of the first region of the first region that does not overlap with the functional portion and the second region that overlaps only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate. The first heat conducting portion has a heat conductivity greater than that of the substrate. The second heat conducting portion is provided directly or indirectly on at least a portion of the second region on the other main surface of the substrate in a plan view from the thickness direction of the substrate and is separated from the first heat conducting portion. The second heat conducting portion has a heat conductivity greater than that of the substrate. The third heat conducting part is directly or indirectly provided on the first region of the other main surface of the substrate between the first heat conducting part and the second heat conducting part. The third heat conducting part is connected to the first heat conducting part and the second heat conducting part. The third heat conducting part is thinner than the first heat conducting part and the second heat conducting part.

[0016] An electronic component according to one embodiment of the present invention comprises a substrate, a functional part, a plurality of external connection conductor parts and a heat conduction part. The substrate has a main surface, another main surface and four or more side surfaces. The functional part is arranged on the one main surface side of the substrate. The functional part generates heat. The plurality of external connection conductor parts are directly or indirectly arranged on the one main surface of the substrate. The heat conduction part is directly or indirectly arranged only on the side closest to the functional part among the four or more side surfaces of the substrate. The heat conduction part has a heat conductivity greater than that of the substrate.

[0017] An electronic component module according to one aspect of the present invention includes the electronic component and a wiring substrate. The electronic component is mounted on the wiring substrate via the plurality of external connection conductors.

[0018] Effects of the Invention

[0019] In the electronic component and the electronic component module according to the above aspect of the present invention, heat dissipation can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional view of an electronic component module including the electronic component according to the first embodiment of the present invention.

[0021] Figure 2 This is a perspective view showing a state where an electronic component module including the above electronic components is mounted on a motherboard.

[0022] Figure 3 A is a diagram showing simulation results of heat flux related to an electronic component module including the same electronic components as above. Figure 3 B is an explanatory diagram of a heat dissipation path related to an electronic component module having the same electronic component as above.

[0023] Figure 4 A is a diagram showing simulation results of heat flux related to an electronic component module including an electronic component according to a comparative example. Figure 4 B is an explanatory diagram of a heat dissipation path related to an electronic component module having the same electronic component as above.

[0024] Figure 5 It is a cross-sectional view of an electronic component module including an electronic component according to Modification 1 of Embodiment 1 of the present invention.

[0025] Figure 6 It is a cross-sectional view of an electronic component module including an electronic component according to Modification 2 of Embodiment 1 of the present invention.

[0026] Figure 7It is a cross-sectional view of an electronic component module including an electronic component according to Modification 3 of Embodiment 1 of the present invention.

[0027] Figure 8 It is a cross-sectional view of an electronic component module including the electronic component according to the second embodiment of the present invention.

[0028] Fig. 9 It is a cross-sectional view of an electronic component module including an electronic component according to a modification of the second embodiment of the present invention.

[0029] Fig.10 It is a cross-sectional view of an electronic component module including the electronic component according to the third embodiment of the present invention.

[0030] Fig.11 This is a graph showing the results of a simulation of the relationship between the thickness of the heat conducting portion and the temperature of the functional portion.

[0031] Fig.12 It is a cross-sectional view of an electronic component module including an electronic component according to a fourth embodiment of the present invention.

[0032] Fig.13 It is a cross-sectional view of an electronic component module including an electronic component according to another modified example of the present invention. DETAILED DESCRIPTION

[0033] In the following embodiments 1 to 4, etc., reference is made to Figures 1 to 10 , 12 and 13 are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the diagrams do not necessarily reflect the actual dimensional ratios.

[0034] (Implementation Method 1)

[0035] (1.1) Overall structure of electronic components and electronic component modules

[0036] Below, refer to Figures 1 to 3 B An electronic component module 100 including the electronic component 1 according to the first embodiment will be described.

[0037] like Figure 1 As shown in FIG. 2, the electronic component module 100 according to the first embodiment includes an electronic component 1 and a wiring substrate 10. The electronic component 1 is mounted on the wiring substrate 10. Thus, in the electronic component module 100, the electronic component 1 is electrically and mechanically connected to the wiring substrate 10. The electronic component module 100 further includes a sealing resin portion 20 covering the electronic component 1 on the wiring substrate 10. Figure 2 In the figure, the sealing resin portion 20 is omitted. In the electronic component module 100 , a space S1 surrounded by the electronic component 1 , the wiring substrate 10 , and the sealing resin portion 20 is formed.

[0038] The electronic component module 100 is used in a state of being mounted on, for example, a motherboard 30. The motherboard 30 is not a component of the electronic component module 100. The motherboard 30 is, for example, a circuit board such as a printed wiring board.

[0039] The electronic component 1 includes a substrate 2, a functional portion 3, a plurality of external connection conductor portions 4, a first heat conducting portion 5, and a second heat conducting portion 6. The substrate 2 has a main surface (first main surface) 21 and another main surface 22 (second main surface). The functional portion 3 is provided on the side of the one main surface 21 of the substrate 2. The functional portion 3 generates heat. The plurality of external connection conductor portions 4 are directly provided on the one main surface 21 of the substrate 2, but are not limited to this, and may be indirectly provided on the one main surface 21 of the substrate 2. As an example, the plurality of external connection conductor portions 4 are separated from the functional portion 3 when viewed from above in the thickness direction D1 of the substrate 2. The first heat conducting portion 5 is directly provided on the first region 221 of the first region 221 that does not overlap with the functional portion 3 and the second region 222 that overlaps only with the functional portion 3 on the other main surface 22 of the substrate 2, but are not limited to this, and may be indirectly provided on the first region 221. The first heat conductive portion 5 has a thermal conductivity greater than that of the substrate 2 .

[0040] The second heat conducting portion 6 is directly provided at least on a part of the second region 222 of the other main surface 22 of the substrate 2, but is not limited thereto, and may be indirectly provided at least on a part of the second region 222. The second heat conducting portion 6 is separated from the first heat conducting portion 5 when viewed from above in the thickness direction D1 of the substrate 2. The second heat conducting portion 6 has a thermal conductivity greater than that of the substrate 2.

[0041] (1.2) Components of electronic components and electronic component modules

[0042] First, the components of the electronic component 1 will be described with reference to the drawings, and then the components other than the electronic component 1 in the electronic component module 100 will be described.

[0043] The electronic component 1 is, for example, an elastic wave device including an IDT (Interdigital Transducer) electrode as the functional portion 3 .

[0044] (1.2.1)Substrate

[0045] The substrate 2 has a main surface 21 and another main surface 22 on opposite sides of each other in the thickness direction D1. The main surface 21 and the other main surface 22 are opposite to each other. In addition, the substrate 2 has four side surfaces 23. The outer peripheral shape of the substrate 2 when viewed from the thickness direction D1 is a rectangular shape, but is not limited to this, and may be, for example, a square shape. The thickness of the substrate 2 is, for example, 100 μm or more.

[0046] The substrate 2 is, for example, a piezoelectric substrate. The piezoelectric substrate is, for example, a lithium niobate (LiNbO 3 ) substrate, but is not limited thereto, and may be, for example, a lithium tantalate (LiTaO 3 ) substrate, a quartz substrate, or the like.

[0047] (1.2.2) Functional department

[0048] In the electronic component 1, a plurality of (for example, two) functional portions 3 are provided on one main surface 21 of the substrate 2. The number of the functional portions 3 is not limited to two, and may be three or more, or may be one.

[0049] Each of the plurality of functional parts 3 is an IDT electrode, and is disposed on one main surface 21 of the substrate 2. The material of the IDT electrode is, for example, aluminum (Al), copper (Cu), platinum (Pt), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), or an alloy mainly composed of any one of these metals. In addition, the IDT electrode may also have a multilayer structure in which a plurality of layers including these metals or alloys are stacked. In addition, in the electronic component 1 involved in the first embodiment, if the wavelength of the elastic wave determined by the electrode finger pitch of the IDT electrode is set to λ [μm], the thickness of the substrate 2 is preferably greater than 10λ. The functional part 3 is, for example, electrically connected to at least two of the plurality of external connection conductor parts 4 via wiring layers. The material of each wiring layer is, for example, aluminum, copper, platinum, gold, silver, palladium, titanium, nickel, chromium, molybdenum, tungsten, or an alloy mainly composed of any one of these metals. In addition, each wiring layer may also have a multilayer structure in which a plurality of layers including these metals or alloys are stacked.

[0050] In the electronic component 1, when a plurality of IDT electrodes are provided, for example, a plurality of surface acoustic wave resonators including the plurality of IDT electrodes may be electrically connected to form a filter. The filter is, for example, a bandpass filter. The filter may be, for example, a transmission filter or a reception filter. The transmission filter and the reception filter are not limited to bandpass filters, and may be, for example, high-pass filters. The surface acoustic wave resonator is a SAW (Surface Acoustic Wave) resonator.

[0051] (1.2.3) External connection conductor

[0052] Each of the plurality of external connecting conductor portions 4 includes, for example, a pad electrode 41 and a bump 42 formed on the pad electrode 41 .

[0053] The material of each pad electrode 41 is, for example, aluminum, copper, platinum, gold, silver, palladium, titanium, nickel, chromium, molybdenum, tungsten, or an alloy mainly containing any of these metals.

[0054] In addition, each pad electrode 41 is not limited to a single-layer structure, but may be a multi-layer structure. The material of the bump 42 is, for example, solder, but is not limited thereto, and may be gold (Au) or the like.

[0055] In the electronic component 1, each of the plurality of external connection conductor portions 4 includes a pad electrode 41 and a bump 42, but may include only a pad electrode 41. Each pad electrode 41 may be formed integrally with the corresponding wiring layer using the same material as the wiring layer, or may be formed separately from the wiring layer.

[0056] The plurality of external connection conductor parts 4 are located on the inner side than the outer periphery of the substrate 2 when viewed from above in the thickness direction D1 of the substrate 2. Here, the plurality of external connection conductor parts 4 are located at least on the periphery of the substrate 2 when viewed from above in the thickness direction D1 of the substrate 2. The plurality of external connection conductor parts 4 are arranged along the outer periphery of the substrate 2 when viewed from above in the thickness direction D1 of the substrate 2. The plurality of external connection conductor parts 4 surround the plurality of functional parts 3 when viewed from above in the thickness direction D1 of the substrate 2. The outer peripheral shape of each bump 42 is, for example, circular. The outer diameter of each bump 42 is, for example, greater than 30 μm and less than 200 μm, and is 100 μm as an example. In addition, the outer peripheral shape of the bump 42 is not limited to a circular shape, and may be, for example, a square shape.

[0057] In the electronic component module 100, the wiring substrate 10 includes a plurality of conductor portions 14. In the electronic component module 100, a main surface 11 of the wiring substrate 10 that faces the electronic component 1 includes surfaces of the plurality of conductor portions 14. The plurality of external connection conductor portions 4 are connected to conductor portions 14 that face each other in the thickness direction D1 of the substrate 2 among the plurality of conductor portions 14 of the wiring substrate 10.

[0058] At least a part of the external connection conductor parts 4 among the plurality of external connection conductor parts 4 is electrically connected to the functional part 3 etc. via the wiring layer on one main surface 21 of the substrate 2. The plurality of external connection conductor parts 4 may also include an independent external connection conductor part that is not electrically connected to the functional part 3 etc. The so-called "independent external connection conductor part" is, for example, an external connection conductor part that is not intended for electrical connection. In more detail, the "independent external connection conductor part" is, for example, a virtual external connection conductor part used to improve the parallelism of the electronic component 1 relative to the wiring substrate 10 (used to suppress the situation where the electronic component 1 is installed obliquely relative to the wiring substrate 10). In addition, the "independent external connection conductor part" is, for example, an external connection conductor part for dissipating the heat generated by the functional part 3. The external connection conductor part 4 that is arranged near the functional part 3 and constitutes a part of the heat dissipation path for dissipating the heat generated by the functional part 3 among the plurality of external connection conductor parts 4 may be an external connection conductor part 4 that is electrically connected to the functional part 3, an external connection conductor part 4 that is connected to the ground electrode of the wiring substrate 10, or an independent external connection conductor part.

[0059] (1.2.4) First heat conducting portion and second heat conducting portion

[0060] The first heat conducting portion 5 is directly provided on the other main surface 22 of the substrate 2, in a plan view from the thickness direction D1 of the substrate 2, on a part of the first region 221 of the first region 221 that does not overlap with the functional portion 3 and the second region 222 that overlaps only with the functional portion 3. The first heat conducting portion 5 does not extend to the second region 222 of the other main surface 22 of the substrate 2. The second heat conducting portion 6 is directly provided on the second region 222 of the other main surface 22 of the substrate 2. The second heat conducting portion 6 extends to the first region 221 of the other main surface 22 of the substrate 2 (the second heat conducting portion 6 spans the second region 222 and the first region 221), but is separated from the first heat conducting portion 5.

[0061] In the electronic component 1 according to the first embodiment, the first heat conducting portion 5 and the second heat conducting portion 6 are separated. In the electronic component 1 according to the first embodiment, the second heat conducting portion 6 is surrounded by the first heat conducting portion 5 over the entire circumference when viewed from above in the thickness direction D1 of the substrate 2, and is separated from the first heat conducting portion 5. The first heat conducting portion 5 is separated from the boundary between the first region 221 and the second region 222 in the other main surface 22 of the substrate 2. In addition, the first heat conducting portion 5 is formed so that the end on the side opposite to the second heat conducting portion 6 side reaches the side surface 23 of the substrate 2 and the ridgeline 25 of the other main surface 22 of the substrate 2, but is not limited thereto.

[0062] The first heat conducting part 5 and the second heat conducting part 6 are, for example, metal films. The material of the metal film is, for example, copper. The thickness of the metal film is, for example, 3 μm or more and 50 μm or less, and is 20 μm as an example. The thicker the metal film is, the easier it is for the heat generated by the functional part 3 to be thermally transferred through the metal film itself. However, if the thickness of the metal film becomes too thick, it will not only lead to an increase in the cost of forming the metal film, but also lead to an increase in the component height of the electronic component 1, so it may sometimes become an inappropriate structure for the requirements of high function and high density. Therefore, the thickness of the first heat conducting part 5 and the second heat conducting part 6 is preferably 50 μm or less, and more preferably 20 μm or less. The gap between the first heat conducting part 5 and the second heat conducting part 6 is preferably 20 μm or more from the viewpoint of efficiently dissipating the heat generated by the functional part 3 from the external connection conductor part 4, if the thermal influence of the first heat conducting part 5 and the second heat conducting part 6 is considered.

[0063] The material of the metal film is not limited to copper, but may be a copper alloy. In addition, the material of the metal film may be, for example, aluminum, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, or an alloy with any of these metals as the main body. In addition, the metal film is not limited to a single-layer structure, but may be a multilayer structure. The material of the first heat conduction part 5 and the second heat conduction part 6 is not limited to metal, but may be, for example, aluminum nitride, silicon nitride, sapphire or diamond. In addition, the first heat conduction part 5 and the second heat conduction part 6 may be, for example, a laminated film of an aluminum nitride film on the other main surface 22 of the substrate 2 and a metal film on the aluminum nitride film. In addition, in the electronic component 1, although the thickness of the first heat conduction part 5 and the thickness of the second heat conduction part 6 on the other main surface 22 of the substrate 2 are the same, they may be different. In addition, in the electronic component 1, although the material of the first heat conduction part 5 and the material of the second heat conduction part 6 are the same, they may be different.

[0064] (2) Wiring substrate

[0065] The electronic component module 100 includes the above-mentioned wiring substrate 10 in addition to the electronic component 1. The wiring substrate 10 is a substrate on which the electronic component 1 is mounted. The wiring substrate 10 has a main surface 11 including a surface of a plurality of conductor portions 14 and another main surface 12 including a surface of a plurality of external connection electrodes. The one main surface 11 and the other main surface 12 are opposed to each other in the thickness direction of the wiring substrate 10. In the electronic component module 100, an electronic component 1 is mounted on the wiring substrate 10 on the side of one main surface 11 of the wiring substrate 10. The wiring substrate 10 is larger than the substrate 2 when viewed from above in the thickness direction D1 of the substrate 2. The outer peripheral shape of the wiring substrate 10 is a rectangular shape, but is not limited thereto, and may be, for example, a square shape. The wiring substrate 10 is, for example, a printed wiring substrate. The wiring substrate 10 also includes a plurality of through electrodes that electrically connect the plurality of conductor portions 14 and the plurality of external connection electrodes one-to-one.

[0066] The wiring substrate 10 is not limited to a printed wiring substrate, and may be, for example, a ceramic substrate or a ceramic multilayer substrate. In addition, the wiring substrate 10 may be an interposer using a silicon substrate, or an electronic component having at least one of a side electrode and a through electrode (an electronic component that can be used as an interposer), etc.

[0067] (3) Sealing resin part

[0068] The sealing resin portion 20 covers the electronic component 1 on the wiring substrate 10 and seals the electronic component 1. The sealing resin portion 20 directly or indirectly covers the other main surface 22 and each side surface 23 of the substrate 2 in the electronic component 1 mounted on the wiring substrate 10. The sealing resin portion 20 is in contact with the area on the other main surface 22 of the substrate 2 that is not covered by the first heat conducting portion 5 and the second heat conducting portion 6, the first heat conducting portion 5, the second heat conducting portion 6, and each side surface 23 of the substrate 2. In addition, the sealing resin portion 20 also covers a part of each bump 42 and is in contact with the outer peripheral surface of each bump 42. In the electronic component module 100 involved in the first embodiment, a space S1 surrounded by the electronic component 1, the wiring substrate 10, and the sealing resin portion 20 is formed. Here, the sealing resin portion 20 is formed so as not to cover the functional portion 3 of the electronic component 1. In the electronic component module 100, in the thickness direction D1 of the substrate 2, there is a space S1 between the functional portion 3 and the wiring substrate 10.

[0069] The sealing resin portion 20 constitutes a sealing portion for sealing the electronic component 1. The sealing resin portion 20 is formed of a resin having electrical insulation properties or the like. The sealing resin portion 20, for example, includes a filler mixed with the resin in addition to the resin, but the filler is not an essential component. The resin is, for example, an epoxy resin. However, the resin is not limited to epoxy resin, and may be, for example, a polyimide resin, an acrylic resin, a polyurethane resin, or a silicone resin. The filler is, for example, an inorganic filler such as silicon oxide or alumina. The sealing resin portion 20 may include, for example, a black pigment such as carbon black in addition to the resin and the filler. The thermal conductivity of the sealing resin portion 20 is smaller than that of the first thermally conductive portion 5 and the second thermally conductive portion 6.

[0070] The electronic component module 100 is, as an example, a CSP (Chip Size Package) type electronic device, but is not limited thereto. Here, in the electronic component module 100, when viewed from above in the thickness direction D1 of the substrate 2, the size of the wiring substrate 10 and the sealing resin portion 20 is slightly larger than the chip size of the electronic component 1.

[0071] The outer peripheral shape of the sealing resin portion 20 when viewed from the thickness direction D1 of the substrate 2 is a rectangular shape, but is not limited to this, and may be, for example, a square shape. When viewed from above in the thickness direction D1 of the substrate 2, the size of the sealing resin portion 20 is substantially the same as the size of the wiring substrate 10. In addition, in the electronic component module 100, when viewed from above in the thickness direction D1 of the substrate 2, the size of the wiring substrate 10 is substantially the same as the size of the sealing resin portion 20, but is not limited to this, and the size of the wiring substrate 10 may also be larger than the size of the sealing resin portion 20. In this case, for example, the wiring substrate 10 may not have the above-mentioned multiple through electrodes, but may be provided with multiple external connection electrodes on one main surface 11 side.

[0072] (4) Method for manufacturing electronic component module

[0073] Hereinafter, an example of a method for manufacturing the electronic component module 100 will be briefly described.

[0074] First, a preparation step is performed to prepare the electronic component main body before providing the first heat conducting portion 5, the second heat conducting portion 6, and the bumps 42 in the electronic component 1. Here, in the preparation step, a wafer including a plurality of electronic component main bodies is prepared.

[0075] After the preparation step, a heat conducting portion forming step is performed to form the first heat conducting portion 5 and the second heat conducting portion 6. In the heat conducting portion forming step, the first heat conducting portion 5 and the second heat conducting portion 6 are formed on the other main surface 22 of the substrate 2 in each of the plurality of electronic component bodies by using a sputtering technique, a plating technique, a photolithography technique, or the like.

[0076] After the heat conduction portion forming step, a dicing step of dividing the wafer into individual electronic components 1 is performed.

[0077] After the dicing step, a mounting step is performed in which the electronic component 1 is flip-chip mounted on one main surface 11 of the wiring substrate 10 using a plurality of bumps 42 .

[0078] After the mounting step, a sealing step is performed to form the sealing resin portion 20. In the sealing step, for example, a liquid or pellet-like thermosetting resin or a resin sheet is used to form the sealing resin portion 20 covering the electronic component 1 on the wiring substrate 10.

[0079] In the method of manufacturing the electronic component module 100 , the above-mentioned sealing step is completed, and the electronic component module 100 can be obtained.

[0080] Next, based on Figure 3 A and Figure 3 Before describing the heat dissipation path of the heat generated by the functional portion 3 in the electronic component 1 according to the first embodiment, based on Figure 4 4A and 4B illustrate a heat dissipation path of heat generated by the functional portion 3 in the electronic component 1r according to the comparative example.

[0081] like Figure 4 As shown in A of 4 and B of 4, the electronic component 1r according to the comparative example is different from the electronic component 1 according to the first embodiment in the shape and pattern of the heat conducting portion 5. Regarding the electronic component 1r according to the comparative example, the same components as those of the electronic component 1 according to the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

[0082] In the electronic component 1 r according to the comparative example, the first heat conducting portion 5 is provided so as to cover the entire other main surface 22 of the substrate 2 .

[0083] Figure 4 A shows the result of simulating the heat flux caused by the flow of heat generated by the functional part 3 in the electronic component module 100r including the electronic component 1r according to the comparative example. Figure 4 As can be seen from A, in the electronic component module 100 r including the electronic component 1 r according to the comparative example, the heat generated by the functional portion 3 is easily transferred to the first heat conducting portion 5 . Figure 4 B is based on Figure 4 The distribution of the heat flux of A is schematically shown by arrows as the heat dissipation path of the heat generated by the functional part 3. Figure 4 The hollow arrow in B indicates that the heat flux transferred from the functional portion 3 to the first heat conducting portion 5 is larger than the heat flux transferred from the functional portion 3 to the wiring substrate 10 via the external connecting conductor portion 4 .

[0084] Figure 3 A shows the result of simulating the heat flux caused by the flow of heat generated by the functional part 3 in the electronic component module 100 including the electronic component 1 according to the first embodiment. Figure 3 As can be seen from A, in the electronic component module 100 including the electronic component 1 according to the first embodiment, the heat generated by the functional portion 3 is more easily transferred to the wiring substrate 10 via the external connection conductor portion 4 than in the comparative example. Figure 3 B is based on Figure 3 The distribution of the heat flux of A is schematically shown by arrows as the heat dissipation path of the heat generated by the functional part 3. Figure 3 The hollow arrow in B shows that the heat flux transferred from the functional portion 3 to the first heat conducting portion 5 is smaller than that in the comparative example, and the heat flux transferred from the functional portion 3 to the wiring substrate 10 via the external connecting conductor portion 4 is larger than that in the comparative example.

[0085] In addition, the temperature distribution when heat is generated by the functional part 3 was simulated for the electronic component module 100r including the electronic component 1r involved in the comparative example and the electronic component module 100 including the electronic component 1 involved in the first embodiment. The results confirmed that the electronic component module 100 including the electronic component 1 involved in the first embodiment can suppress the temperature increase of the functional part 3 compared with the electronic component module 100r including the electronic component 1r involved in the comparative example.

[0086] (5) Effect

[0087] The electronic component 1 according to the first embodiment includes a substrate 2, a functional portion 3, a plurality of external connection conductor portions 4, a first heat conducting portion 5, and a second heat conducting portion 6. The substrate 2 has a main surface 21 and another main surface 22. The functional portion 3 is provided on the one main surface 21 side of the substrate 2. The functional portion 3 generates heat. The plurality of external connection conductor portions 4 are provided directly or indirectly on the one main surface 21 of the substrate 2. The first heat conducting portion 5 is provided directly or indirectly on the first region 221 of the first region 221 that does not overlap with the functional portion 3 and the second region 222 that overlaps only with the functional portion 3 on the other main surface 22 of the substrate 2, as viewed from above in the thickness direction D1 of the substrate 2. The first heat conducting portion 5 has a heat conductivity greater than that of the substrate 2. The second heat conducting portion 6 is provided directly or indirectly on at least a portion of the second region 222 (in the region 221) on the other main surface 22 of the substrate 2, as viewed from above in the thickness direction D1 of the substrate 2. Figure 1 The second heat conducting portion 6 has a thermal conductivity greater than that of the substrate 2. The other main surface 22 of the substrate 2 is not provided with a heat conducting portion having a thermal conductivity greater than that of the substrate 2 between the first heat conducting portion 5 and the second heat conducting portion 6 when viewed from above in the thickness direction D1 of the substrate 2.

[0088] In the electronic component 1 involved in the first embodiment, the heat dissipation can be improved. Here, the electronic component 1 involved in the first embodiment can efficiently dissipate the heat generated by the functional part 3 by using the heat dissipation path through the external connection conductor part 4, so the heat dissipation can be improved. In the electronic component 1, there is no special cooling mechanism such as an air cooling mechanism and a heat sink, but the heat generated by the functional part 3 is efficiently dissipated by transferring the heat to the wiring substrate 10 via the external connection conductor part 4. That is, in the electronic component 1, the external connection conductor part 4 is effectively used as a part of the heat dissipation path. More specifically, in the electronic component 1, the heat generated by the functional part 3 is not only easily transferred to the heat conduction part 5 away from the functional part 3, but also easily transferred to the external connection conductor part 4 via the substrate 2. Therefore, in the electronic component 1 involved in the first embodiment, compared with the case where the first heat conduction part 5 is formed on the entire other main surface 22 of the substrate 2 as in the electronic component 1r involved in the comparative example, the heat dissipation path width can be increased, and the heat generation temperature in the actual operation can be reduced. In the electronic component 1 involved in embodiment 1, the first heat-conducting portion 5 is not arranged in the second area 222 and its periphery on the other main surface 22 of the substrate 2, so that heat is preferentially transferred from the functional portion 3 toward the portion of the substrate 2 that is located on the outside than the functional portion 3 when viewed from above in the thickness direction D1 and the first heat-conducting portion 5, thereby improving the heat dissipation effect from the external connection conductor portion 4 arranged near them.

[0089] Furthermore, in the electronic component 1 according to the first embodiment, the first heat conducting portion 5 is opposed to the plurality of external connecting conductor portions 4 via the substrate 2 in the thickness direction D1 of the substrate 2. Thus, in the electronic component 1 according to the first embodiment, the heat generated by the functional portion 3 is more easily concentrated on the external connecting conductor portion 4, and the heat dissipation can be improved.

[0090] Furthermore, in the electronic component 1 according to the first embodiment, a part of the heat generated by the functional portion 3 is also transferred to the second heat conducting portion 6 , so that the heat dissipation can be improved.

[0091] Furthermore, the electronic component module 100 according to the first embodiment includes the electronic component 1 and the wiring substrate 10 on which the electronic component 1 is mounted via the plurality of external connection conductors 4. Thus, the electronic component module 100 according to the first embodiment can improve heat dissipation.

[0092] In addition, the electronic component module 100 according to the first embodiment further includes a sealing resin portion 20. The sealing resin portion 20 covers the electronic component 1 on the wiring substrate 10. Thus, in the electronic component module 100, the electronic component 1 can be sealed by the sealing resin portion 20, and on the other hand, even if the heat generated by the functional portion 3 is not easily dissipated via the substrate 2 and the sealing resin portion 20, the heat generated by the functional portion 3 is easily transferred to the wiring substrate 10 via the substrate 2 and the external connection conductor portion 4, so that the heat dissipation effect can be effectively obtained. In addition, when the electronic component module 100 is mounted on the motherboard 30 for use, the heat transferred to the wiring substrate 10 is transferred to the motherboard 30, so that the heat dissipation effect can be more effectively obtained.

[0093] In addition, in the electronic component module 100 according to the first embodiment, a space S1 surrounded by the electronic component 1, the wiring substrate 10, and the sealing resin portion 20 is formed. In the electronic component module 100, the functional portion 3 is opposed to the wiring substrate 10 via at least the space S1. Therefore, in the electronic component module 100 according to the first embodiment, the space S1 is interposed between the functional portion 3 and the wiring substrate 10. In the electronic component module 100, even if the space S1 is interposed between the functional portion 3 and the wiring substrate 10, since the heat generated by the functional portion 3 is easily transferred to the wiring substrate 10 via the substrate 2 and the external connection conductor portion 4, the heat dissipation effect can be effectively obtained.

[0094] (Variation 1 of Implementation Example 1)

[0095] The following is based on Figure 5 An electronic component 1 a according to Modification 1 of Embodiment 1 and an electronic component module 100 a including the electronic component 1 a will be described.

[0096] The electronic component 1a according to the modification example 1 is different from the electronic component 1 according to the embodiment 1 in that it further includes a side heat conduction portion 7. In the electronic component 1a according to the modification example 1, a plurality (four) of side heat conduction portions 7 are provided. The plurality of side heat conduction portions 7 are directly provided on the corresponding side surfaces 23 among the four side surfaces 23 of the substrate 2. In the electronic component 1a, the side heat conduction portion 7 is directly provided on the side surface 23, but may be indirectly provided on the side surface 23. Regarding the electronic component 1a and the electronic component module 100a according to the modification example 1, the same reference numerals are given to the same components as those of the electronic component 1 and the electronic component module 100 according to the embodiment 1, and the description thereof is omitted.

[0097] In the electronic component 1 a , the side surface heat conductive portion 7 has a thermal conductivity greater than that of the substrate 2 .

[0098] The side heat conduction part 7 is, for example, a metal film. The material of the metal film is, for example, copper. The material of the metal film is not limited to copper, and may also be a copper alloy. In addition, the material of the metal film may also be, for example, aluminum, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, or an alloy with any of these metals as the main body. The four side heat conduction parts 7 are each connected to the first heat conduction part 5 on the substrate 2. Here, the four side heat conduction parts 7 are formed as one body with the first heat conduction part 5. The four side heat conduction parts 7 are not connected to the second heat conduction part 6 on the substrate 2. In addition, in the electronic component 1a, the four side heat conduction parts 7 are formed as one body, and two side heat conduction parts 7 adjacent to each other in the direction along the outer periphery of the substrate 2 are connected.

[0099] At least a portion of each of the plurality of side heat conduction portions 7 is located on the side opposite to the functional portion 3 when viewed from one of the plurality of external connection conductor portions 4. Therefore, when viewed from above in the thickness direction D1 of the substrate 2, one of the plurality of external connection conductor portions 4 is located between at least a portion of each of the plurality of side heat conduction portions 7 and the functional portion 3.

[0100] Hereinafter, an example of a method for manufacturing the electronic component module 100 a will be briefly described.

[0101] First, a preparation step is performed to prepare the electronic component main body before providing the first heat conducting portion 5, the second heat conducting portion 6, the side heat conducting portions 7, and the bumps 42 in the electronic component 1a. In this preparation step, a wafer including a plurality of electronic component main bodies is prepared.

[0102] After the preparation step, for example, a dicing step is performed in which the wafer before being singulated into a plurality of electronic component bodies is attached to a wafer tape (adhesive resin tape) and the wafer is diced to thereby singulate the wafer into a plurality of electronic component bodies.

[0103] After the dicing step, an expansion step is performed in which the wafer tape is stretched by an expansion device or the like to increase the interval between adjacent electronic component bodies among the plurality of electronic component bodies.

[0104] After the expansion step, a heat conducting portion forming step of forming the first heat conducting portion 5, the second heat conducting portion 6, and each side heat conducting portion 7 is performed. In the heat conducting portion forming step, the first heat conducting portion 5 and the second heat conducting portion 6 are formed on the other main surface 22 of the substrate 2 in each of the plurality of electronic component bodies on the wafer tape by using a sputtering technique, a plating technique, a photolithography technique, or the like, and the side heat conducting portion 7 is formed on each side surface 23 of the substrate 2. Alternatively, the first heat conducting portion 5 and the second heat conducting portion 6 may be formed on each of the plurality of electronic component bodies before the wafer is singulated into the plurality of electronic component bodies, and then the wafer may be singulated into the plurality of electronic component bodies by dicing, and the side heat conducting portion 7 may be formed on each side surface 23 of the substrate 2 in each of the plurality of electronic component bodies after masking the other main surface 22 side of the substrate 2 in each of the plurality of electronic component bodies. That is, in the method for manufacturing the electronic component module 100a, the step of forming the first heat conducting portion 5 and the second heat conducting portion 6 and the step of forming the side heat conducting portion 7 may be separated. When forming the side heat conducting portion 7, not only the exposed area on the other principal surface 22 side of the substrate 2 in the electronic component body but also the exposed area on the one principal surface 21 side of the substrate 2 in the electronic component body may be masked.

[0105] After the heat conduction portion forming step, a mounting step of flip-chip mounting the electronic component 1 a on one main surface 11 of the wiring substrate 10 using a plurality of bumps 42 is performed.

[0106] After the mounting step, a sealing step is performed to form the sealing resin portion 20. In the sealing step, for example, a liquid or granular thermosetting resin, a resin sheet, or the like is used to form the sealing resin portion 20 covering the electronic component 1a on the wiring substrate 10.

[0107] In the method for manufacturing the electronic component module 100 a , the above-mentioned sealing step is completed, and the electronic component module 100 a can be obtained.

[0108] Furthermore, in the electronic component 1a according to the modification 1 of the first embodiment, the side heat conduction portion 7 is provided, so that heat is preferentially transferred from the functional portion 3 toward the portion of the substrate 2 located closer to the side heat conduction portion 7 than the functional portion 3 when viewed from above in the thickness direction D1 and the first heat conduction portion 5, thereby improving the heat dissipation effect from the external connection conductor portion 4 arranged near these portions. In the electronic component 1a according to the modification 1, the side heat conduction portion 7 can be physically arranged near the external connection conductor portion 4, so that the heat dissipation can be improved compared with the electronic component 1 according to the first embodiment.

[0109] Furthermore, in the electronic component 1a according to the first modification of the first embodiment, each of the plurality of side surface heat conducting portions 7 is located from the side surface 23 corresponding to the side surface heat conducting portion 7 among the four side surfaces 23 of the substrate 2 and the ridgeline 25 of the other main surface 22 of the substrate 2 to the ridgeline 24 of the corresponding side surface 23 and the one main surface 21 of the substrate 2. Thus, in the electronic component 1a according to the first modification of the first embodiment, the physical distance between the side surface heat conducting portion 7 and the external connection conductor portion 4 close to the side surface heat conducting portion 7 can be further shortened, and the heat dissipation can be improved, compared with the case where the side surface heat conducting portion 7 is not located at the position reaching the ridgeline 24.

[0110] The number of the side heat conducting parts 7 is not limited to four, and may be one, two, or three, for example. In addition, although the side heat conducting parts 7 may be separated into a plurality of parts on the side surface 23 of the substrate 2, in this case, it is preferred that the side heat conducting parts 7 are separated so that the side heat conducting parts 7 are always arranged in the part closest to the external connection conductor part 4 in the side surface 23 from the viewpoint of heat dissipation. With regard to the patterning of the side heat conducting parts 7, for example, it is sufficient to form the side heat conducting parts 7 after appropriately masking a part of the side surface 23 of the substrate 2 in advance. In addition, with regard to the patterning of the side heat conducting parts 7, for example, it is sufficient to form a metal film that becomes the basis of the side heat conducting parts 7 on the side surface 23 of the substrate 2, mask a necessary part of the metal film, and then etch away the unnecessary part of the metal film.

[0111] (Variation 2 of Implementation Example 1)

[0112] The following is based on Figure 6 An electronic component 1 b according to a second modification of the first embodiment and an electronic component module 100 b including the electronic component 1 b will be described.

[0113] The electronic component 1b according to the second modification is different from the electronic component 1a according to the first modification (see Figure 5 ) is that it further includes a heat conducting portion (one main surface side heat conducting portion) 8 extending from the side surface side heat conducting portion 7 to one main surface 21 of the substrate 2. The heat conducting portion 8 has a heat conductivity greater than that of the substrate 2. Regarding the electronic component 1b and the electronic component module 100b according to the modification 2, the same reference numerals are used for the same components as those of the electronic component 1a and the electronic component module 100a according to the modification 1, and the description thereof is omitted.

[0114] In the electronic component 1 b according to the second modification, the heat conducting portion 8 is directly provided on the one principal surface 21 of the substrate 2 . Alternatively, the heat conducting portion 8 may be indirectly provided on the one principal surface 21 of the substrate 2 .

[0115] The heat conducting part 8 is, for example, a metal film. The material of the metal film is, for example, copper. The material of the metal film is not limited to copper, and may be a copper alloy. In addition, the material of the metal film may be, for example, aluminum, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, or an alloy mainly composed of any of these metals. The heat conducting part 8 is connected to the side heat conducting part 7 on the substrate 2. The heat conducting part 8 is opposite to the first heat conducting part 5 via the substrate 2 in the thickness direction D1 of the substrate 2. The thickness of the heat conducting part 8 is the same as that of the first heat conducting part 5, but is not limited thereto, and may be thinner or thicker than the thickness of the first heat conducting part 5.

[0116] The heat conducting portion 8 is separated from the functional portion 3 on one main surface 21 of the substrate 2. In the electronic component 1b according to the second modification, the external connecting conductor portion 4 for heat dissipation among the plurality of external connecting conductor portions 4 is directly provided on the heat conducting portion 8.

[0117] The electronic component 1b according to the second modification includes the heat conducting portion 8 provided on one main surface 21 of the substrate 2 , so that the heat generated by the functional portion 3 is easily transferred to the external connecting conductor portion 4 compared to the electronic component 1a according to the first modification, and the heat dissipation is improved.

[0118] (Variation 3 of Implementation Example 1)

[0119] The following is based on Figure 7 An electronic component 1c according to Modification 3 of Embodiment 1 and an electronic component module 100c including the electronic component 1c will be described.

[0120] The electronic component 1c according to the modification example 3 is different from the electronic component 1a according to the modification example 1 in that the electronic component 1a according to the modification example 1 (see Figure 5 ) is divided into two. Regarding the electronic component 1c and the electronic component module 100c according to the third modification, the same components as those of the electronic component 1a and the electronic component module 100a according to the first modification are denoted by the same reference numerals and their description is omitted.

[0121] In the electronic component 1c according to the third modification, the second heat conducting portion 6 is divided into two. Therefore, compared with the electronic component 1a according to the first modification, the heat generated by the functional portion 3 is more easily transferred to the first heat conducting portion 5 and the external connecting conductor portion 4, thereby improving the heat dissipation.

[0122] (Implementation Method 2)

[0123] The following is based on Figure 8 An electronic component 1d according to the second embodiment and an electronic component module 100d including the electronic component 1d will be described.

[0124] The electronic component 1d according to the second embodiment is different from the electronic component 1a according to the first modification of the first embodiment in that the electronic component 1d does not include the electronic component 1a according to the first modification of the first embodiment (see Figure 5 ) and the second heat conducting portion 6 among the second heat conducting portions 6. Regarding the electronic component 1d and the electronic component module 100d according to the second embodiment, the same components as those of the electronic component 1a and the electronic component module 100a according to the first modification of the first embodiment are denoted by the same reference numerals and their description is omitted.

[0125] The electronic component 1d according to the second embodiment has only one functional portion 3. In the electronic component 1d, the second heat conducting portion 6 is not provided in the second region 222 of the other main surface 22 of the substrate 2 (see Figure 5 ). Thus, in the electronic component 1 d , the heat generated by the functional portion 3 is easily transferred to the external connection conductor portion 4 close to the functional portion 3 .

[0126] The electronic component 1d according to the second embodiment includes a substrate 2, a functional portion 3, a plurality of external connection conductor portions 4, and a heat conducting portion 5. The substrate 2 has one main surface 21 and another main surface 22. The functional portion 3 is provided on the one main surface 21 side of the substrate 2. The functional portion 3 generates heat. The plurality of external connection conductor portions 4 are provided directly or indirectly on the one main surface 21 of the substrate 2. The heat conducting portion 5 is provided directly or indirectly on at least the first region 221 of the first region 221 that does not overlap with the functional portion 3 and the second region 222 that overlaps only with the functional portion 3 on the other main surface 22 of the substrate 2, as viewed from above in the thickness direction D1 of the substrate 2. The heat conducting portion 5 has a heat conductivity greater than that of the substrate 2. The heat conducting portion 5 is not provided in the entire region of the second region 222 as viewed from above in the thickness direction D1 of the substrate 2. As a result, in the electronic component 1d, the heat generated by the functional portion 3 is easily transferred to the external connection conductor portion 4 close to the functional portion 3, and the heat dissipation can be improved. The heat conducting portion 5 may extend onto the second region 222 in a plan view in the thickness direction D1 of the substrate 2 . However, in this case, the heat conducting portion 5 is not provided on a part of the second region 222 .

[0127] In the electronic component module 100d, the second region 222 of the other main surface 22 of the substrate 2 is covered with the sealing resin portion 20. Here, the sealing resin portion 20 is in contact with the second region 222 of the other main surface 22 of the substrate 2.

[0128] Furthermore, in the electronic component 1d according to the second embodiment, the side heat conducting portion 7 is directly provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2. Thus, in the electronic component 1d, the heat generated by the functional portion 3 is easily transferred to the external connection conductor portion 4 close to the side heat conducting portion 7. The side heat conducting portion 7 may be indirectly provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2.

[0129] (Variation of Implementation Example 2)

[0130] The following is based on Fig. 9 An electronic component 1e according to a modification of the second embodiment and an electronic component module 100e including the electronic component 1e will be described.

[0131] The electronic component 1e according to the modification example has a different pattern of the heat conducting portion 5 from the electronic component 1d according to Embodiment 2. The electronic component 1e and the electronic component module 100e according to the modification example have the same components as those of the electronic component 1d and the electronic component module 100d according to Embodiment 2, and description thereof is omitted.

[0132] In the electronic component 1e according to the modification, the number of the functional portion 3 is one. In the electronic component 1e according to the modification, the functional portion 3 is located on the outer peripheral side of the center of one main surface 21 of the substrate 2. In the electronic component 1e according to the modification, the side heat conduction portion 7 is provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2. In addition, in the electronic component 1e according to the modification, the heat conduction portion 5 is provided in the first area 221 of the other main surface 22 of the substrate 2 at a location away from the second area 222.

[0133] In the manufacturing method of the electronic component 1e according to the modification, for example, when the heat conducting portion 5 and the side heat conducting portion 7 are formed by different steps, the side heat conducting portion 7 may be formed on each of the plurality of side surfaces 23 of the substrate 2 while the other main surface 22 of the substrate 2 is masked. In addition, after forming a metal film on the other main surface 22 of the substrate 2 and each side surface 23, a necessary portion of the metal film may be masked and an unnecessary portion may be removed by etching or the like.

[0134] In the electronic component 1e involved in the modified example, a heat conduction portion 5 is provided in a portion away from the second region 222 in the first region 221 of the other main surface 22 of the substrate 2. Therefore, compared with the electronic component 1d involved in embodiment 2, the heat generated by the functional portion 3 is easily transferred to the external connection conductor portion 4 close to the functional portion 3.

[0135] (Implementation method 3)

[0136] The following is based on Fig.10 An electronic component 1f according to a third embodiment and an electronic component module 100f including the electronic component 1f will be described.

[0137] The electronic component 1f according to the third embodiment is similar to the electronic component 1 according to the first embodiment (see Figure 1 The difference between the first heat conducting part 5 and the second heat conducting part 6 is that a third heat conducting part 9 thinner than the first heat conducting part 5 and the second heat conducting part 6 is further provided between the first heat conducting part 5 and the second heat conducting part 6. Regarding the electronic component 1f and the electronic component module 100f according to the third embodiment, the same components as those of the electronic component 1 and the electronic component module 100 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0138] The third heat conducting part 9 is integrated with the first heat conducting part 5 and the second heat conducting part 6 and connected to the first heat conducting part 5 and the second heat conducting part 6. In the electronic component 1f, for example, the thickness of the first heat conducting part 5 and the second heat conducting part 6 is 20 μm, and the thickness of the third heat conducting part 9 is 3 μm.

[0139] The third heat conducting part 9 is, for example, a metal film. The material of the metal film is, for example, copper. The material of the metal film is not limited to copper, but may be a copper alloy. In addition, the material of the metal film may be, for example, aluminum, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, or an alloy with any of these metals as the main body. In addition, the metal film is not limited to a single-layer structure, but may be a multi-layer structure. The material of the third heat conducting part 9 is not limited to metal, and may be, for example, aluminum nitride, silicon nitride, sapphire, diamond, etc. In addition, the third heat conducting part 9 may be, for example, a laminated film of an aluminum nitride film on the other main surface 22 of the substrate 2 and a metal film on the aluminum nitride film.

[0140] The manufacturing method of the electronic component 1f according to the third embodiment is substantially the same as the manufacturing method of the electronic component 1 described in the manufacturing method of the electronic component module 100 according to the first embodiment. In the manufacturing method of the electronic component 1f according to the third embodiment, when forming the first heat conducting portion 5, the second heat conducting portion 6, and the third heat conducting portion 9, for example, the following process can be adopted, that is, after forming a seed layer on the other main surface 22 of the substrate 2, a plating layer is formed on the portion of the seed layer corresponding to the first heat conducting portion 5 and the second heat conducting portion 6 while performing appropriate masking.

[0141] Table 1 below shows the results of simulations of the temperature of the functional portion 3 during operation for an electronic component module having the same structure as the electronic component module 100f and not including the sealing resin portion 20. Table 1 shows the results of simulations of the temperature of the functional portion 3 for the cases where the thickness of the first heat conducting portion 5 and the second heat conducting portion 6 was changed to 20 μm, 10 μm, and 5 μm, respectively, and the thickness of the third heat conducting portion 9 was changed. In the simulation, copper was used as the material of the first heat conducting portion 5, the second heat conducting portion 6, and the third heat conducting portion 9.

[0142] [Table 1]

[0143]

[0144] Fig.11 Table 1 shows the relationship between the thickness of the third heat conducting portion 9 and the temperature of the functional portion 3 when the thickness of both the first heat conducting portion 5 and the second heat conducting portion 6 is set to 20 μm. Fig.11 In FIG. 1 , the horizontal axis is the thickness of the third heat conducting portion 9, and the vertical axis is the temperature of the functional portion 3. Fig.11 It can be seen that, in the electronic component 1f and the electronic component module 100f, since the thickness of the third heat conducting part 9 is thinner than the first heat conducting part 5 and the second heat conducting part 6, the temperature of the functional part 3 becomes lower than when the thickness of the third heat conducting part 9 is the same as that of the first heat conducting part 5 and the second heat conducting part 6, that is, when the metal film with a thickness of 20 μm is formed on the entire surface of the other main surface 22 of the substrate 2. Therefore, in the electronic component 1f and the electronic component module 100f, since the thickness of the third heat conducting part 9 is thinner than the first heat conducting part 5 and the second heat conducting part 6, the heat dissipation can be improved.

[0145] In the electronic component 1f, when the thickness of both the first heat conduction part 5 and the second heat conduction part 6 is set to 20 μm, from the viewpoint of suppressing the temperature rise of the functional part 3, taking into account manufacturing deviations, etc., the thickness of the third heat conduction part 9 is preferably less than half of the thickness of the first heat conduction part 5 and the second heat conduction part 6, and more preferably less than one quarter.

[0146] As for the relationship between the thickness of the third heat conducting part 9 and the temperature of the functional part 3, the results of a more detailed observation than those in Table 1 show that, in the electronic component 1f, when the thickness of both the first heat conducting part 5 and the second heat conducting part 6 is set to 20 μm, if the thickness of the third heat conducting part 9 is 3.6675 μm or less, the heat dissipation equivalent to that when the thickness of the third heat conducting part 9 is 0 μm can be obtained. In addition, it is found that, in the electronic component 1f, when the thickness of both the first heat conducting part 5 and the second heat conducting part 6 is set to 10 μm, if the thickness of the third heat conducting part 9 is 3.349 μm or less, the heat dissipation equivalent to that when the thickness of the third heat conducting part 9 is 0 μm can be obtained. Furthermore, it can be seen that in the electronic component 1f, when the thickness of both the first heat conducting part 5 and the second heat conducting part 6 is set to 5 μm, if the thickness of the third heat conducting part 9 is 3.053 μm or less, the heat dissipation performance equivalent to that when the thickness of the third heat conducting part 9 is 0 μm can be obtained. Therefore, from these results, it can be seen that in the electronic component 1f, when the thickness of the first heat conducting part 5 and the second heat conducting part 6 is set to X [μm], the thickness of the third heat conducting part 9 is set to Y [μm], and the natural logarithm is set to log e , at this time, by satisfying

[0147] Y≤0.476×log e Under the condition of X+2.240, it is possible to obtain heat dissipation equivalent to the case where the thickness of the third heat conducting portion 9 is 0 μm, that is, the case where there is no third heat conducting portion 9 (the electronic component 1 according to the first embodiment).

[0148] (Implementation 4)

[0149] The following is based on Fig.12 An electronic component 1g according to a fourth embodiment and an electronic component module 100g including the electronic component 1g will be described.

[0150] The electronic component 1g according to the fourth embodiment is different from the electronic component 1 according to the first embodiment in that a heat conducting portion 17 is provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2, instead of the heat conducting portion 17 provided on the electronic component 1 according to the first embodiment (see Figure 1 and 2) the first heat conducting portion 5 and the second heat conducting portion 6 provided on the other main surface 22 of the substrate 2. The heat conducting portion 17 has a thermal conductivity greater than that of the substrate 2. Regarding the electronic component 1g and the electronic component module 100g according to the fourth embodiment, the same components as those of the electronic component 1 and the electronic component module 100 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0151] The heat conducting part 17 is, for example, a metal film. The material of the metal film is, for example, copper. The material of the metal film is not limited to copper, and may also be a copper alloy. In addition, the material of the metal film may also be, for example, aluminum, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, or an alloy based on any of these metals.

[0152] The manufacturing method of the electronic component 1g according to the fourth embodiment is substantially the same as the manufacturing method of the electronic component 1 described in the manufacturing method of the electronic component module 100 according to the first embodiment. In the manufacturing method of the electronic component 1g according to the fourth embodiment, when forming the heat conducting portion 17, for example, the following process can be adopted, that is, after appropriately masking the other main surface 22 of the substrate 2 and three of the four side surfaces 23, the heat conducting portion 17 is formed on the side surface 23 closest to the functional portion 3. In addition, even when a metal film is formed including the other main surface 22 of the substrate 2, the metal film can be patterned by grinding and removing the metal film using a grinding device or the like. The patterning method of the metal film is not particularly limited.

[0153] The electronic component 1g according to the fourth embodiment described above includes a substrate 2, a functional portion 3, a plurality of external connection conductor portions 4, and a heat conduction portion 17. The substrate 2 has a main surface 21, another main surface 22, and four side surfaces 23. The functional portion 3 is provided on the side of the main surface 21 of the substrate 2. The functional portion 3 generates heat. The plurality of external connection conductor portions 4 are directly or indirectly provided on the main surface 21 of the substrate 2. The heat conduction portion 17 is directly or indirectly provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2. The heat conduction portion 17 has a heat conductivity greater than that of the substrate 2. The heat conduction portion 17 is not provided on the other main surface 22 of the substrate 2. In addition, the heat conduction portion 17 is not provided on the main surface 21 of the substrate 2.

[0154] In the electronic component 1g according to the fourth embodiment, the heat conducting portion 17 is provided only on the side surface 23 closest to the functional portion 3 among the four side surfaces 23 of the substrate 2, and is not provided on the other main surface 22 of the substrate 2. Therefore, compared with the case where the first heat conducting portion 5 and the second heat conducting portion 6 are provided on the other main surface 22 of the substrate 2 as in the electronic component 1 according to the first embodiment, it is possible to achieve a reduction in the height of the component while obtaining a heat dissipation effect. Therefore, the electronic component 1g according to the fourth embodiment can also be applied to applications where there are strict restrictions on the height of the component.

[0155] The above-mentioned Embodiments 1 to 4 are merely one of various embodiments of the present invention. The above-mentioned Embodiments 1 to 4 can be variously modified according to design etc. as long as the object of the present invention can be achieved.

[0156] (Other Modifications)

[0157] In the electronic component 1 according to the first embodiment (see Figure 1 In the embodiment 2), the second heat conducting portion 6 extends over the entire second region 222 and a portion of the first region 221, but is not limited thereto. For example, the second heat conducting portion 6 only needs to be directly or indirectly provided on at least a portion of the second region 222 when viewed from the thickness direction D1 of the substrate 2 on the other main surface 22 of the substrate 2 and be separated from the first heat conducting portion 5.

[0158] The planar shape of the substrate 2 viewed from the thickness direction D1 of the substrate 2 is not limited to a rectangular shape, and may be, for example, a square shape. In addition, the material of the substrate 2 is not limited to silicon (Si), and may be, for example, lithium niobate, lithium tantalate, quartz, glass, etc.

[0159] Furthermore, the substrate 2 has four side surfaces 23 , but the present invention is not limited thereto. For example, the substrate 2 may be chamfered to have more than four side surfaces 23 .

[0160] The substrate 2 of the electronic component 1 including the elastic wave device is not limited to a piezoelectric substrate, and may be, for example, a piezoelectric substrate having piezoelectricity, or a laminated substrate. More specifically, the piezoelectric substrate may be, for example, a laminated substrate including a support substrate, a low acoustic velocity film, and a piezoelectric film.

[0161] Here, the low-acoustic-velocity film is directly or indirectly disposed on a supporting substrate. In addition, the piezoelectric film is directly or indirectly disposed on the low-acoustic-velocity film. In the low-acoustic-velocity film, the sound velocity of the propagating body wave is lower than the sound velocity of the elastic wave propagating in the piezoelectric film. In the supporting substrate, the sound velocity of the propagating body wave is higher than the sound velocity of the elastic wave propagating in the piezoelectric film. The materials of the piezoelectric film, the low-acoustic-velocity film, and the supporting substrate are, for example, lithium tantalate, silicon oxide, and silicon. For example, when the wavelength of the elastic wave determined by the electrode finger period of the IDT electrode is set to λ, the thickness of the piezoelectric film is less than 3.5λ. The thickness of the low-acoustic-velocity film is, for example, less than 2.0λ.

[0162] In the electronic component 1, when the substrate 2 is a laminated substrate, the size of the piezoelectric film and the low acoustic velocity film is smaller than the size of the supporting substrate when viewed from above in the thickness direction of the substrate 2, and each external connection conductor portion 4 is arranged so as not to overlap with the piezoelectric film and the low acoustic velocity film in the thickness direction D1 of the substrate 2. In this case, for example, an electrical insulating layer is interposed between the external connection conductor portion 4 and the supporting substrate. The material of the electrical insulating layer is, for example, polyimide resin, epoxy resin, silicon oxide, silicon nitride, etc.

[0163] The materials of the piezoelectric film, the low acoustic velocity film and the supporting substrate are not limited to the above examples. For example, the piezoelectric film can be formed of any one of lithium tantalate, lithium niobate, zinc oxide (ZnO), aluminum nitride (AlN), or lead zirconate titanate (PZT). In addition, the low acoustic velocity film can contain at least one material selected from the group consisting of silicon oxide, glass, silicon oxynitride, tantalum oxide, and compounds in which fluorine, carbon or boron is added to silicon oxide. In addition, the supporting substrate can contain at least one material selected from the group consisting of silicon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, lithium tantalate, lithium niobate, quartz, alumina, zirconium oxide, cordierite, mullite, steatite, forsterite, magnesium oxide and diamond.

[0164] In addition, the piezoelectric substrate may include, for example, a bonding layer between the low acoustic velocity film and the piezoelectric film. The bonding layer may include, for example, a resin (epoxy resin, polyimide resin). In addition, the piezoelectric substrate may include a dielectric film between the low acoustic velocity film and the piezoelectric film, on the piezoelectric film, or under the low acoustic velocity film.

[0165] The piezoelectric substrate may be, for example, a stacked substrate including a support substrate, a high-acoustic-velocity film, a low-acoustic-velocity film, and a piezoelectric film.

[0166] Here, the high-acoustic-velocity film is directly or indirectly disposed on the supporting substrate. The low-acoustic-velocity film is directly or indirectly disposed on the high-acoustic-velocity film. The piezoelectric film is directly or indirectly disposed on the low-acoustic-velocity film. In the high-acoustic-velocity film, the acoustic velocity of the body wave propagating is higher than the acoustic velocity of the elastic wave propagating in the piezoelectric film. In the low-acoustic-velocity film, the acoustic velocity of the body wave propagating is lower than the acoustic velocity of the elastic wave propagating in the piezoelectric film.

[0167] The high acoustic velocity membrane includes piezoelectric materials such as diamond-like carbon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, silicon, sapphire, lithium tantalate, lithium niobate, quartz, alumina, zirconia, cordierite, mullite, steatite, forsterite and other ceramics, magnesium oxide, diamond, or materials with the above materials as the main components, or materials with the mixture of the above materials as the main components.

[0168] Regarding the thickness of the high-acoustic-velocity film, since the high-acoustic-velocity film has the function of confining elastic waves in the piezoelectric film and the low-acoustic-velocity film, the thicker the high-acoustic-velocity film is, the better. The piezoelectric substrate may also have a bonding layer, a dielectric film, etc. as other films other than the high-acoustic-velocity film, the low-acoustic-velocity film, and the piezoelectric film.

[0169] The elastic wave devices constituting the electronic components 1 to 1g are not limited to SAW (Surface Acoustic Wave) resonators, and may be, for example, BAW (Bulk Acoustic Wave) resonators.

[0170] The BAW resonator includes a substrate, a first electrode, a piezoelectric film, and a second electrode. The first electrode is formed on the substrate. The piezoelectric film is formed on the first electrode. The second electrode is formed on the piezoelectric film.

[0171] The substrate in the BAW resonator includes, for example, a silicon substrate and an electrical insulating film formed on the silicon substrate. The electrical insulating film is, for example, a silicon oxide film. The piezoelectric film includes, for example, lead zirconate titanate (PZT).

[0172] The substrate of the BAW resonator has a cavity on the side opposite to the piezoelectric film side of the first electrode. The BAW resonator is a FBAR (Film Bulk Acoustic Resonator). In addition, the structure of the BAW resonator constituting the FBAR is an example and is not particularly limited. In the case where the electronic component 1 is a BAW resonator, the functional portion 3 is a portion of the stack of the first electrode, the piezoelectric film, and the second electrode that overlaps with the cavity in the thickness direction of the substrate.

[0173] The BAW resonator is not limited to FBAR, and may be, for example, an SMR (Solidly Mounted Resonator).

[0174] The electronic component 1 is not limited to the elastic wave device, and any electronic component having a chip-shaped functional part that generates heat when in operation may be used. It may be an active component or a passive component. The electronic component 1 may be, for example, a semiconductor chip such as a power amplifier, a low noise amplifier, a DC-DC converter, an IC (Integrated Circuit), an IPD (Intelligent Power Device), or an MPU (Micro Processing Unit). In addition, the electronic component 1 is not limited to the elastic wave device or a semiconductor chip, and any electronic component having a functional part that generates heat when in use may be used. Therefore, the substrate 2 varies depending on the function and type of the electronic components 1, 1a to 1g, and is not limited to a piezoelectric substrate. For example, it may be a silicon substrate, a germanium substrate, a compound semiconductor substrate, an epitaxial substrate, a ceramic body, or the like.

[0175] In the electronic component 1, there are a plurality of functional parts. When the plurality of functional parts include a functional part with a relatively large amount of heat and a functional part with a relatively small amount of heat, the functional part 3 with heat generation preferably includes a functional part with a relatively large amount of heat generation, and need not include a functional part with a relatively small amount of heat generation. In addition, in the electronic component 1, there are a plurality of functional parts. When at least one of the plurality of functional parts includes a functional part with heat generation at a first given temperature (for example, 80°C) or higher, the functional part 3 with heat generation preferably includes at least one functional part with heat generation at a first given temperature or higher, and need not include two or more functional parts with heat generation at a first given temperature or higher. In addition, in this case, the functional part 3 with heat generation need not include a functional part with a heat generation temperature lower than a second given temperature (for example, 80°C) (for example, a functional part with a heat generation temperature of 30°C or higher and less than 80°C). In addition, the first given temperature and the second given temperature are different depending on the allowable temperature of the functional part, the temperature characteristics of the functional part, etc., and are not limited to 80°C. In addition, although the first given temperature and the second given temperature are the same, they may also be different.

[0176] When the electronic component 1 is a power amplifier or a low noise amplifier, the functional portion 3 has an amplification function. In this case, the functional portion 3 is, for example, a transistor portion such as an HBT (Heterojunction Bipolar Transistor).

[0177] When the electronic component 1 is a DC-DC converter, the functional unit 3 has a power conversion function. The DC-DC converter is, for example, a single-chip switching regulator.

[0178] When the electronic component 1 is an MPU, the functional unit 3 has a logic function. In this case, the functional unit 3 is, for example, a register, a calculation circuit, a control circuit, or the like.

[0179] Furthermore, in the electronic component 1, when viewed from above in the thickness direction D1 of the substrate 2, all of the plurality of external connection conductor portions 4 are separated from the functional portion 3, but the present invention is not limited thereto, and when viewed from above in the thickness direction D1 of the substrate 2, the external connection conductor portions 4 separated from the functional portion 3 and the external connection conductor portions 4 overlapping the functional portion 3 may also exist in a mixed state. In addition, here, the external connection conductor portion 4 overlapping the functional portion 3 is connected to the functional portion 3, for example, via a rewiring layer.

[0180] In the electronic component 1, the first heat conducting portion 5 is not limited to the case where it is opposed to the plurality of external connection conductor portions 4 via the substrate 2 in the thickness direction D1 of the substrate 2, and it is sufficient as long as it is opposed to at least one of the plurality of external connection conductor portions 4. Thus, the electronic component 1 can improve heat dissipation. In addition, in the electronic component 1d, the heat conducting portion 5 is not limited to the case where it is opposed to the plurality of external connection conductor portions 4 via the substrate 2 in the thickness direction D1 of the substrate 2, and it is sufficient as long as it is opposed to at least one of the plurality of external connection conductor portions 4. Thus, the electronic component 1d can improve heat dissipation.

[0181] Furthermore, in the electronic component module 100, the sealing resin portion 20 only needs to cover the electronic component 1 at least on one main surface 11 side of the wiring substrate 10, and may also cover a part or all of the side surface of the wiring substrate 10. Furthermore, in the electronic component module 100, the sealing resin portion 20 is not an essential component. Furthermore, in the electronic component module 100, there is also a case where the space S1 may not exist depending on the function of the functional portion 3 of the electronic component 1. For example, in the case where the functional portion 3 is a transistor portion such as an HBT, Fig.13 As shown, the electronic component module 100 may include a resin portion (underfill portion) 29 surrounded by the electronic component 1 , the wiring substrate 10 , and the sealing resin portion 20 .

[0182] Furthermore, in the electronic component module 100 , one electronic component 1 is mounted on the wiring substrate 10 , but the present invention is not limited to this, and a plurality of electronic components 1 may be mounted.

[0183] (Summarize)

[0184] Based on the above-described embodiments and the like, the following aspects are disclosed in this specification.

[0185] The electronic component (1; 1a; 1b; 1c) involved in the first embodiment comprises a substrate (2), a functional part (3), a plurality of external connection conductor parts (4), a first heat conduction part (5) and a second heat conduction part (6). The substrate (2) has a main surface (21) and another main surface (22). The functional part (3) is arranged on the side of one main surface (21) of the substrate (2). The functional part (3) generates heat. The plurality of external connection conductor parts (4) are directly or indirectly arranged on one main surface (21) of the substrate (2). The first heat conduction part (5) is directly or indirectly arranged on the first area (221) of the other main surface (22) of the substrate (2) in a plan view from the thickness direction (D1) of the substrate (2), which does not overlap with the functional part (3) and a second area (222) which overlaps only with the functional part (3). The first heat conduction part (5) has a heat conductivity greater than that of the substrate (2). The second heat conducting portion (6) is directly or indirectly provided on at least a portion of the second region (222) on the other main surface (22) of the substrate (2) when viewed from above in the thickness direction (D1) of the substrate (2), and is separated from the first heat conducting portion (5). The second heat conducting portion (6) has a heat conductivity greater than that of the substrate (2). The other main surface (22) of the substrate (2) is not provided with a heat conducting portion having a heat conductivity greater than that of the substrate (2) between the first heat conducting portion (5) and the second heat conducting portion (6) when viewed from above in the thickness direction (D1) of the substrate (2).

[0186] In the electronic component (1; 1a; 1b; 1c) according to the first aspect, heat dissipation can be improved.

[0187] In the electronic component (1; 1a; 1b; 1c) involved in the second embodiment, in the first embodiment, the first heat conduction portion (5) is opposite to the plurality of external connection conductor portions (4) via the substrate (2) in the thickness direction (D1) of the substrate (2).

[0188] In the electronic component (1; 1a; 1b; 1c) according to the second aspect, heat dissipation can be improved.

[0189] In the electronic component (1a; 1b; 1c) according to the third aspect, in the first aspect or the second aspect, the substrate (2) has four or more side surfaces (23). The electronic component (1a; 1b; 1c) further includes a side surface heat conduction portion (7). The side surface heat conduction portion (7) is directly or indirectly provided on at least one side surface (23) of the four or more side surfaces (23) of the substrate (2). The side surface heat conduction portion (7) has a thermal conductivity greater than that of the substrate (2).

[0190] In the electronic component (1a; 1b; 1c) according to the third aspect, the heat dissipation property can be further improved.

[0191] In the electronic component (1a; 1b; 1c) involved in the fourth embodiment, in the third embodiment, the side heat conduction portion (7) is located at a position from a side surface (23) corresponding to the side heat conduction portion (7) among four or more side surfaces (23) and a ridgeline (25) of another main surface (22) to a ridgeline (24) of the corresponding side surface (23) and a main surface (21).

[0192] In the electronic component (1a; 1b; 1c) involved in the fourth embodiment, compared with the case where the side heat conduction part (7) is not located at a position that reaches the ridge line (24), the physical distance between the side heat conduction part (7) and the external connection conductor part (4) close to the side heat conduction part (7) can be further shortened, thereby improving the heat dissipation.

[0193] In the electronic component (1a; 1b; 1c) according to the fifth embodiment, in the first embodiment or the second embodiment, the substrate (2) has four or more side surfaces (23). The electronic component (1a; 1b; 1c; 1d; 1e) further comprises a side heat conduction portion (7). The side heat conduction portion (7) is directly or indirectly provided on at least one side surface (23) of the four or more side surfaces (23) of the substrate (2). The side heat conduction portion (7) has a heat conductivity greater than that of the substrate (2). At least a portion of the side heat conduction portion (7) is located on the side opposite to the functional portion (3) side when viewed from one of the plurality of external connection conductor portions (4).

[0194] In the electronic component (1a; 1b; 1c) according to the fifth aspect, the side heat conduction portion (7) can be physically arranged near the external connection conductor portion (4), thereby improving heat dissipation.

[0195] In the electronic component (1a; 1b; 1c) according to the sixth aspect, in the fifth aspect, the side heat conduction portion (7) is connected to the first heat conduction portion (5).

[0196] In the electronic component (1a; 1b; 1c) according to the sixth aspect, heat dissipation can be improved.

[0197] The electronic component (1d; 1e) involved in the seventh embodiment comprises a substrate (2), a functional part (3), a plurality of external connection conductor parts (4) and a heat conduction part (5). The substrate (2) has a main surface (21) and another main surface (22). The functional part (3) is arranged on the side of one main surface (21) of the substrate (2). The functional part (3) generates heat. The plurality of external connection conductor parts (4) are directly or indirectly arranged on one main surface (21) of the substrate (2). The heat conduction part (5) is directly or indirectly arranged on at least the first area (221) of a first area (221) that does not overlap with the functional part (3) and a second area (222) that overlaps only with the functional part (3) on the other main surface (22) of the substrate (2) when viewed from above in the thickness direction (D1) of the substrate (2). The heat conduction part (5) has a heat conductivity greater than the heat conductivity of the substrate (2). The heat conduction portion (5) is not provided in the entire area of ​​the second region (222) when viewed from above in the thickness direction (D1) of the substrate (2).

[0198] In the electronic component (1d; 1e) according to the seventh aspect, heat dissipation can be improved.

[0199] In the electronic component (1d; 1e) involved in the eighth embodiment, in the seventh embodiment, the heat conduction portion (5) is opposite to at least one of the plurality of external connection conductor portions (4) via the substrate (2) in the thickness direction (D1) of the substrate (2).

[0200] In the electronic component (1d; 1e) according to the eighth aspect, heat dissipation can be improved.

[0201] Regarding the electronic component (1d; 1e) involved in the ninth aspect, in the seventh aspect or the eighth aspect, the substrate (2) has four side surfaces (23). The electronic component (1d; 1e) further includes a side surface heat conduction portion (7). The side surface heat conduction portion (7) is directly or indirectly provided on at least one side surface (23) of the four or more side surfaces (23) of the substrate (2). The side surface heat conduction portion (7) has a thermal conductivity greater than that of the substrate (2).

[0202] In the electronic component (1d; 1e) according to the ninth aspect, the heat dissipation property can be further improved.

[0203] In the electronic component (1d; 1e) according to the tenth aspect, in the seventh aspect or the eighth aspect, the substrate (2) has four or more side surfaces (23). The electronic component (1d; 1e) further includes a side heat conduction portion (7). The side heat conduction portion (7) is directly or indirectly provided on at least one side surface (23) of the four or more side surfaces (23) of the substrate (2). The side heat conduction portion (7) has a thermal conductivity greater than that of the substrate (2). At least a portion of the side heat conduction portion (7) is located on the side opposite to the functional portion (3) side when viewed from one of the plurality of external connection conductor portions (4).

[0204] In the electronic component (1d; 1e) according to the tenth aspect, the side heat conduction portion (7) can be physically arranged near the external connection conductor portion (4), thereby improving heat dissipation.

[0205] In the electronic component (1d) according to the eleventh aspect, in the tenth aspect, the side heat conduction portion (7) is connected to the heat conduction portion (5).

[0206] In the electronic component (1d) according to the eleventh aspect, heat dissipation can be improved.

[0207] The electronic component (1f) involved in the twelfth embodiment comprises a substrate (2), a functional part (3), a plurality of external connection conductor parts (4), a first heat conduction part (5), a second heat conduction part (6) and a third heat conduction part (9). The substrate (2) has a main surface (21) and another main surface (22). The functional part (3) is arranged on the side of one main surface (21) of the substrate (2). The functional part (3) generates heat. The plurality of external connection conductor parts (4) are directly or indirectly arranged on one main surface (21) of the substrate (2). The first heat conduction part (5) is directly or indirectly arranged on a part of the first area (221) in a first area (221) that does not overlap with the functional part (3) and a second area (222) that only overlaps with the functional part (3) on the other main surface (22) of the substrate (2) when viewed from above in the thickness direction (D1) of the substrate (2). The first heat conduction part (5) has a thermal conductivity greater than the thermal conductivity of the substrate (2). The second heat conducting part (6) is directly or indirectly provided on at least a part of the second region (222) on the other main surface (22) of the substrate (2) when viewed from above in the thickness direction (D1) of the substrate (2), and is separated from the first heat conducting part (5). The second heat conducting part (6) has a heat conductivity greater than that of the substrate (2). The third heat conducting part (9) is directly or indirectly provided on the first region (221) of the other main surface (22) of the substrate (2) between the first heat conducting part (5) and the second heat conducting part (6). The third heat conducting part (9) is connected to the first heat conducting part (5) and the second heat conducting part (6). The third heat conducting part (9) is thinner than the thickness of the first heat conducting part (5) and the thickness of the second heat conducting part (6).

[0208] The electronic component (1f) according to the twelfth aspect can improve heat dissipation.

[0209] Regarding the electronic component (1f) involved in the 13th embodiment, in the 12th embodiment, the thickness of the first heat conducting part (5) and the second heat conducting part (6) is set to X [μm], the thickness of the third heat conducting part (9) is set to Y [μm], and the natural logarithm is set to log e ,at this time,

[0210] Satisfy Y≤0.476×log e Condition of X+2.240.

[0211] In the electronic component (1f) according to the thirteenth aspect, it is possible to obtain heat dissipation performance equal to or less than that of a case where the third heat conducting portion (9) is not provided.

[0212] The electronic component (1g) involved in the 14th embodiment comprises a substrate (2), a functional part (3), a plurality of external connection conductor parts (4) and a heat conduction part (17). The substrate (2) has a main surface (21), another main surface (22) and four or more side surfaces (23). The functional part (3) is arranged on the side of one main surface (21) of the substrate (2). The functional part (3) generates heat. The plurality of external connection conductor parts (4) are directly or indirectly arranged on one main surface (21) of the substrate (2). The heat conduction part (17) is directly or indirectly arranged only on the side surface (23) closest to the functional part (3) among the four or more side surfaces (23) of the substrate (2). The heat conduction part (17) has a thermal conductivity greater than the thermal conductivity of the substrate (2).

[0213] In the electronic component (1g) according to the fourteenth aspect, heat dissipation can be improved.

[0214] The electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) involved in the 15th embodiment comprises: any one electronic component (1; 1a; 1b; 1c; 1d; 1e; 1f) of the 1st to 14th embodiments; and a wiring substrate (10), on which the electronic component (1; 1a; 1b; 1c; 1d; 1e; 1f) is mounted via a plurality of external connection conductor portions (4).

[0215] In the electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) according to the fifteenth aspect, heat dissipation can be improved.

[0216] The electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) according to the sixteenth aspect further comprises a sealing resin portion (20) in the fifteenth aspect. The sealing resin portion (20) covers the electronic component (1; 1a; 1b; 1c; 1d; 1e; 1f; 1g) on ​​the wiring substrate (10).

[0217] In the electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) involved in the 16th embodiment, the electronic component (1; 1a; 1b; 1c; 1d; 1e; 1f; 1g) can be sealed by the sealing resin portion (20). On the other hand, even if the heat generated by the functional portion (3) is not easily dissipated via the substrate (2) and the sealing resin portion (20), the heat generated by the functional portion (3) can be easily transferred to the wiring substrate (10) via the substrate (2) and the external connection conductor portion (4), so that the heat dissipation effect can be effectively obtained.

[0218] Regarding the electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) according to the seventeenth embodiment, in the sixteenth embodiment, a space (S1) surrounded by the electronic component (1; 1a; 1b; 1c; 1d; 1e; 1f; 1g), the wiring substrate (10) and the sealing resin portion (20) is formed. In the electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g), the functional portion (3) is opposed to the wiring substrate (10) via at least the space (S1).

[0219] In the electronic component module (100; 100a; 100b; 100c; 100d; 100e; 100f; 100g) involved in the 17th embodiment, even if the space (S1) is interposed between the functional part (3) and the wiring substrate (10), the heat generated by the functional part (3) can be easily transferred to the wiring substrate (10) via the substrate (2) and the external connecting conductor part (4), so that the heat dissipation effect can be effectively obtained.

[0220] Explanation of symbols

[0221] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g Electronic components

[0222] 1r Electronic components

[0223] 2 substrate

[0224] 21 A main surface

[0225] 22 Another main surface

[0226] 221 Area 1

[0227] 222 Area 2

[0228] 23 Side

[0229] 24 Ridge

[0230] 25 Ridge

[0231] 3 Functional Department

[0232] 4 External connection conductor

[0233] 41 pad electrode

[0234] 42 Bump

[0235] 5. 1st heat transfer part (heat transfer part)

[0236] 6. Second heat transfer unit

[0237] 7 Side heat transfer part

[0238] 8 Heat transfer part (one main surface side heat transfer part)

[0239] 9 Third heat transfer unit

[0240] 10 Wiring substrate

[0241] 11. One main surface

[0242] 12 Another main surface

[0243] 14 Conductor

[0244] 17 Heat transfer unit

[0245] 20 Sealing resin part

[0246] 29 Resin Department

[0247] 30 Motherboard

[0248] 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g electronic component module

[0249] 100r Electronics Module

[0250] D1 Thickness direction

[0251] S1 space.

Claims

1. An electronic component comprising: a substrate having one major surface and another major surface; A functional part is provided on the one main surface side of the substrate and generates heat; A plurality of external connection conductor portions are directly or indirectly provided on the one main surface of the substrate; a first heat conducting portion, which is directly or indirectly provided on the first region of the first region not overlapping with the functional portion and the second region overlapping only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and has a heat conductivity greater than that of the substrate; and The second heat conducting portion is directly or indirectly provided on at least a portion of the second region on the other main surface of the substrate when viewed from above in the thickness direction of the substrate, and is separated from the first heat conducting portion and has a heat conductivity greater than that of the substrate. The other main surface of the substrate has no heat conducting portion having a greater heat conductivity than that of the substrate disposed between the first heat conducting portion and the second heat conducting portion when viewed from above in the thickness direction of the substrate. The substrate has more than four sides, The electronic component further comprises: a side heat conducting portion, which is directly or indirectly provided on at least one of the four or more side surfaces of the substrate and has a heat conductivity greater than that of the substrate; The side heat conducting portion is connected to the first heat conducting portion.

2. The electronic component according to claim 1, wherein The side surface heat conducting portion is located at a position extending from a ridgeline between a side surface corresponding to the side surface heat conducting portion and the other main surface among the four or more side surfaces to a ridgeline between the corresponding side surface and the one main surface.

3. An electronic component comprising: a substrate having a main surface and another main surface; A functional part is provided on the one main surface side of the substrate and generates heat; A plurality of external connection conductor portions are directly or indirectly provided on the one main surface of the substrate; a first heat conducting portion, which is directly or indirectly provided on the first region of the first region not overlapping with the functional portion and the second region overlapping only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and has a heat conductivity greater than that of the substrate; and The second heat conducting portion is directly or indirectly provided on at least a portion of the second region on the other main surface of the substrate when viewed from above in the thickness direction of the substrate, and is separated from the first heat conducting portion and has a heat conductivity greater than that of the substrate. The other main surface of the substrate has no heat conducting portion having a greater heat conductivity than that of the substrate disposed between the first heat conducting portion and the second heat conducting portion when viewed from above in the thickness direction of the substrate. The substrate has more than four sides, The electronic component further comprises: a side heat conducting portion, which is directly or indirectly provided on at least one of the four or more side surfaces of the substrate and has a heat conductivity greater than that of the substrate; At least a portion of the side surface heat conductive portion is located on a side opposite to the functional portion side when viewed from one of the plurality of external connecting conductor portions.

4. The electronic component according to claim 3, wherein The side heat conducting portion is connected to the first heat conducting portion.

5. The electronic component according to claim 1 or 3, wherein: The first heat conducting portion is opposed to at least one of the plurality of external connecting conductor portions via the substrate in the thickness direction of the substrate.

6. An electronic component comprising: a substrate having a main surface and another main surface; A functional part is provided on the one main surface side of the substrate and generates heat; a plurality of external connection conductor portions, directly or indirectly provided on the one main surface of the substrate; and The heat conducting portion is directly or indirectly provided on at least the first region of the first region not overlapping with the functional portion and the second region overlapping only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and has a heat conductivity greater than a heat conductivity of the substrate, The heat conducting portion is not provided in the entire area of ​​the second area when viewed from above in the thickness direction of the substrate. The substrate has more than four sides, The electronic component further comprises: a side heat conducting portion, which is directly or indirectly provided on at least one of the four or more side surfaces of the substrate and has a heat conductivity greater than that of the substrate; The side heat conducting portion is connected to the heat conducting portion.

7. An electronic component comprising: a substrate having one major surface and another major surface; A functional part is provided on the one main surface side of the substrate and generates heat; a plurality of external connection conductor portions, directly or indirectly provided on the one main surface of the substrate; and The heat conducting portion is directly or indirectly provided on at least the first region of the first region not overlapping with the functional portion and the second region overlapping only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and has a heat conductivity greater than a heat conductivity of the substrate, The heat conducting portion is not provided in the entire area of ​​the second area when viewed from above in the thickness direction of the substrate. The substrate has more than four sides, The electronic component further comprises: a side heat conducting portion, which is directly or indirectly provided on at least one of the four or more side surfaces of the substrate and has a heat conductivity greater than that of the substrate; At least a portion of the side surface heat conductive portion is located on a side opposite to the functional portion side when viewed from one of the plurality of external connecting conductor portions.

8. The electronic component according to claim 7, wherein The side heat conducting portion is connected to the heat conducting portion.

9. The electronic component according to claim 6 or 7, wherein: The heat conducting portion is opposed to at least one of the plurality of external connecting conductor portions via the substrate in the thickness direction of the substrate.

10. An electronic component comprising: a substrate having one major surface and another major surface; A functional part is provided on the one main surface side of the substrate and generates heat; A plurality of external connection conductor portions are directly or indirectly provided on the one main surface of the substrate; a first heat conducting portion, which is directly or indirectly provided on a portion of the first region of the first region that does not overlap with the functional portion and the second region that overlaps only with the functional portion on the other main surface of the substrate in a plan view from the thickness direction of the substrate, and has a heat conductivity greater than that of the substrate; a second heat conducting portion, which is directly or indirectly provided on at least a portion of the second region on the other main surface of the substrate when viewed from above in the thickness direction of the substrate, is separated from the first heat conducting portion, and has a heat conductivity greater than that of the substrate; and The third heat conducting part is directly or indirectly provided on the first region of the other main surface of the substrate between the first heat conducting part and the second heat conducting part, is connected to the first heat conducting part and the second heat conducting part, and is thinner than the first heat conducting part and the second heat conducting part.

11. The electronic component according to claim 10, wherein The thickness of the first heat conducting part and the second heat conducting part is X, whose unit is μm, the thickness of the third heat conducting part is Y, whose unit is μm, and the natural logarithm is loge. Satisfy Y≤0.476×log e Condition of X+2.

240.

12. An electronic component module comprising: The electronic component according to any one of claims 1 to 11; and The electronic component is mounted on a wiring substrate via the plurality of external connection conductor portions.

13. The electronic component module according to claim 12, wherein: The invention further includes a sealing resin portion that covers the electronic component on the wiring substrate.

14. The electronic component module according to claim 13, wherein: A space surrounded by the electronic component, the wiring substrate and the sealing resin portion is formed, The functional portion faces the wiring substrate via at least the space.

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