PCB board placement device and PCB board position correction method

Abstract

The present invention belongs to the technical field of circuit board production equipment, and more particularly to a PCB board pick-up and placement device and a PCB board position correction method. The PCB board pick-up and placement device comprises a mounting frame, a pick-up and placement mechanism and a position identification mechanism. The mounting frame is provided with a mounting position for an external manipulator to install. The pick-up and placement mechanism is installed on the mounting frame. The pick-up and placement mechanism is provided with a pick-up and placement area, which is used to absorb or place the PCB board. The position identification mechanism is installed on the mounting frame and located in the pick-up and placement area. The position identification mechanism is used to identify the offset position of the edge of the PCB board. If the PCB board has an offset situation, the manipulator drives the mounting frame to rotate and / or move at this time to correct the position of the PCB board, and then places it in another process to achieve the purpose of transportation, thereby achieving the correction of the offset position of the PCB board in the process of transporting the PCB board, not only avoiding damage to the PCB board in the process of correction, but also effectively improving the transportation efficiency of the PCB board. In addition, this method is also applicable to relatively thin PCB boards.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board production equipment, and in particular relates to a PCB board taking and placing device and a PCB board position correction method. Background Art

[0002] In the PCB manufacturing process of the electronics industry, it is necessary to take and place the PCB boards stacked together in the board box on the board placing machine on the conveyor belt to enter the main process line. In actual situations, since the stacked PCB boards may be misaligned, that is, the stacking is uneven, when taking and placing the PCB boards, it is necessary to correct the offset PCB boards and place them on the main process line for transportation; or it is necessary to stack the PCB boards flowing from the main process line into the board box of the board placing machine, at this time, some of the PCB boards flowing from the main process line may also be relatively offset. In the prior art, a common method is to set a toggle rod on both sides of the conveyor belt, and when the PCB board with an angle offset (i.e., the PCB board not aligned) is placed on the conveyor belt, the side of the PCB board is toggled to correct the position of the PCB board. However, when this method is adopted, since there will be friction between the PCB board and the conveyor belt when the PCB board is toggled, it is easy to cause the board surface of the PCB board to be scratched, and this method cannot be used for thinner PCB boards. Summary of the invention

[0003] The object of the present invention is to provide a PCB board placement device and a PCB board position correction method, aiming to solve the technical problem that the PCB board is easily scratched during the position correction process of the PCB board in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a PCB board picking and placing device, including a mounting frame, a picking and placing mechanism and a position identification mechanism, the mounting frame is provided with a mounting position for an external manipulator to install, the picking and placing mechanism is installed on the mounting frame, the picking and placing mechanism is provided with a picking and placing area, the picking and placing area is used to absorb or place the PCB board, the position identification mechanism is installed on the mounting frame and located in the picking and placing area, and the position identification mechanism is used to identify the offset position of the edge of the PCB board.

[0005] Optionally, the position identification mechanism includes an edge-searching moving part, a first edge-searching sensing part and a second edge-searching sensing part, the edge-searching moving part is mounted on the mounting frame and is located in the picking and placing area, the first edge-searching sensing part and the second edge-searching sensing part are both mounted on the moving end of the edge-searching moving part, the first edge-searching sensing part and the second edge-searching sensing part are arranged at a predetermined distance, the sensing end of the first edge-searching sensing part and the sensing end of the second edge-searching sensing part are on the same straight line parallel to the edge of the PCB board located in the original set position, and the edge-searching moving part is used to drive the first edge-searching sensing part and the second edge-searching sensing part to move toward the edge of the PCB board located in the picking and placing area.

[0006] Optionally, the edge-searching moving part includes a support rod and a first screw module, the first screw module is installed on the mounting frame, the moving nut of the first screw module is connected to the support rod and drives the support rod to move, and the first edge-searching sensor and the second edge-searching sensor are installed on the support rod.

[0007] Optionally, the pick-and-place mechanism includes at least two suction components, which are installed on the mounting frame at intervals, and are used to suck PCB boards. The suction components are jointly arranged to form the pick-and-place area.

[0008] Optionally, two suction components are provided, and the pick-and-place mechanism further comprises a pick-and-place movable member, the pick-and-place movable member is mounted on the mounting frame, one suction component is mounted on the mounting frame, the movable end of the pick-and-place movable member is connected to another suction component and drives the suction component to approach or move away from the other suction component, and the two suction components are jointly enclosed to form the pick-and-place area.

[0009] Optionally, the pick-and-place moving member includes a second screw module, and a moving nut of the second screw module is connected to one of the suction components.

[0010] Optionally, the picking and placing mechanism also includes at least two oblique driving members, one of which is installed on the mounting frame, and the other is installed on the moving end of the picking and placing moving member, and the driving end of the oblique driving member is connected to the suction component and drives the suction component to move obliquely toward the direction of the other suction component.

[0011] Optionally, the picking and placing mechanism also includes a blowing piece, which is installed on the suction assembly and located near the outside of the picking and placing area. The blowing piece has an air inlet hole and a blowing hole. The air inlet hole is used to connect to the external air path, and the blowing hole is used to blow air toward the gap between two adjacent PCB boards.

[0012] The beneficial effects of the PCB board picking and placing device provided by the embodiment of the present invention are as follows: compared with the prior art, in the PCB board picking and placing device of the present invention, when the picking and placing mechanism sucks the PCB board for transportation, if the PCB board is offset, the manipulator drives the mounting frame to rotate and / or move to correct the position of the PCB board, and then places it in another process to achieve the purpose of transportation, thereby correcting the offset position of the PCB board during the transportation of the PCB board, not only avoiding damage to the PCB board during the correction process, but also effectively improving the transportation efficiency of the PCB board, and is also applicable to thinner PCB boards, with good use effect.

[0013] A PCB board position correction method provided in an embodiment of the present invention is used to transfer a PCB board in a board box to a main process line, using the PCB board pick-and-place device as described above, wherein the mounting position of the mounting frame is connected to the manipulator; the PCB board position correction method comprises the following steps:

[0014] The two adjacent edges of the PCB board at the original setting position are set as the x-axis and the y-axis to establish a rectangular coordinate system. Then, the offset PCB board intersects with the midpoint of the edge of the PCB board at the original setting position on the y-axis at one point in the y-axis direction. Let this intersection point D be (S x4 S y4 ), the point detected by the second edge-searching sensor when it moves to the edge of the PCB is B (S x2 , S y2 ), the point detected by the first edge-searching sensor when it moves to the edge of the PCB is A(S x1 , S y1 ), the deflection point of the PCB board close to the origin is P(x, y);

[0015] If the PCB board is deflected relative to the original set position and the deflection angle is θ, the stroke n of the first edge search sensor to reach the edge of the PCB board and the stroke m of the second edge search sensor to reach the edge of the PCB board are recorded; then:

[0016]

[0017] x=-e×(-S y4 +y);

[0018]

[0019] Among them, S x4 =0, S y2 =Hm,S y1 =Hn;S x1 , S x2 and S y4are all known; Z is the distance between the sensing end of the first edge-searching sensing element and the sensing end of the second edge-searching sensing element;

[0020] According to the deflection angle θ and the deflection point (x, y), the manipulator drives the mounting frame to rotate around the deflection point (x, y), so that the PCB board is rotated by the angle θ and aligned; and the corner end of the PCB board located at the deflection point (x, y) is moved to the coordinate origin to complete the correction of the PCB board.

[0021] The beneficial effect of the method is that the offset PCB board can be adjusted quickly and accurately, so that the PCB board can be neatly conveyed on the main process line, and the use effect is good.

[0022] A PCB board position correction method provided in an embodiment of the present invention is used to transfer a PCB board on a process main line to a board placing box, using the PCB board picking and placing device as described above, wherein the mounting position of the mounting frame is connected to the manipulator; the PCB board position correction method comprises the following steps:

[0023] A rectangular coordinate system is established with the point of the original setting position of the PCB board as the origin O, and the induction stop point C on the process main line is set as (S x3 , S y3 ), the point detected by the second edge-searching sensor when it moves to the edge of the PCB is B (S x2 , S y2 ), the point detected by the first edge-searching sensor when it moves to the edge of the PCB is A(S x1 , S y1 ), the deflection point of the PCB board close to the origin is P(x, y);

[0024] If the PCB board is deflected relative to the original set position and the deflection angle is θ, the stroke n of the first edge search sensor to reach the edge of the PCB board and the stroke m of the second edge search sensor to reach the edge of the PCB board are recorded; then:

[0025]

[0026] x=-e×(-S y3 +y);

[0027]

[0028] Among them, S x3 =0, S y2 =Hm,S y1 =Hn;S x1 , S x2 and S y3are all known; Z is the distance between the sensing end of the first edge-searching sensing element and the sensing end of the second edge-searching sensing element;

[0029] According to the deflection angle θ and the deflection point (x, y), the manipulator drives the mounting frame to rotate around the deflection point (x, y), so that the PCB board is rotated by the angle θ and aligned; and the corner end of the PCB board located at the deflection point (x, y) is moved to the coordinate origin to complete the correction of the PCB board.

[0030] The method has the beneficial effect of quickly and accurately adjusting the offset PCB boards so that the PCB boards can be neatly stacked in the board box, and the use effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0032] Figure 1 A schematic diagram of the structure of a PCB board pick-up and placement device provided in an embodiment of the present invention;

[0033] Figure 2 for Figure 1 A schematic diagram of the structure of a position identification mechanism of a PCB board pick-and-place device;

[0034] Figure 3 for Figure 1 A schematic diagram of the structure of a pick-and-place mechanism of a PCB board pick-and-place device;

[0035] Figure 4 for Figure 1 A side view structural schematic diagram of;

[0036] Figure 5 for Figure 4 Structural diagram of the PCB board absorption state;

[0037] Figure 6 for Figure 5 A schematic diagram of the structure of the state of obliquely pulling the PCB board and blowing air on the PCB board;

[0038] Figure 7 for Figure 4 A schematic diagram of the structure of the blowing part;

[0039] Figure 8 for Figure 1 A schematic diagram of the structure of the PCB board pick-and-place device used to pick up boards from the main process line;

[0040] Fig. 9 for Figure 8 Schematic diagram of the parameters of the calibration PCB board;

[0041] Fig.10 for Figure 1 A schematic diagram of the structure of the PCB board picking and placing device for taking a board from a board placing box;

[0042] Fig.11 for Fig.10 Schematic diagram of the parameters of the correction PCB board.

[0043] Among them, the reference numerals in the figure are:

[0044] 10—Mounting frame;

[0045] 11—installation position;

[0046] 20—pick-and-place mechanism;

[0047] 21 - suction assembly; 22 - pick-up and placement area; 23 - pick-up and placement moving member; 24 - inclined pull driving member; 25 - blowing member; 211 - suction nozzle; 212 - suction nozzle bracket; 231 - second screw rod module; 232 - moving slide rail; 251 - blowing hole; 252 - air inlet hole;

[0048] 30—position identification mechanism;

[0049] 31—edge-searching moving part; 32—first edge-searching sensing part; 33—second edge-searching sensing part; 311—first screw rod module; 312—support rod;

[0050] 40(40a)—PCB board. DETAILED DESCRIPTION

[0051] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. Figures 1 to 11 The described embodiments are exemplary and intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0052] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0054] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] like Figure 1 , 8 10, the PCB board picking and placing device provided by the embodiment of the present invention is now described. The PCB board picking and placing device includes a mounting frame 10, a picking and placing mechanism 20 and a position identification mechanism 30. The mounting frame 10 is provided with a mounting position 11 for an external manipulator to install. The picking and placing mechanism 20 is installed on the mounting frame 10. The picking and placing mechanism 20 is provided with a picking and placing area 22. The picking and placing area 22 is used to absorb or place a PCB board 40. The position identification mechanism 30 is installed on the mounting frame 10 and is located in the picking and placing area 22. The position identification mechanism 30 is used to identify the offset position of the edge of the PCB board 40.

[0056] Compared with the prior art, the PCB board picking and placing device provided by the embodiment of the present invention has a method for picking and placing the PCB board 40a when the picking and placing mechanism 20 sucks the PCB board 40 for transportation. If the PCB board 40a is offset, the manipulator drives the mounting frame 10 to rotate and / or move to correct the position of the PCB board 40a, and then places the PCB board 40a in another process to achieve the purpose of transportation, thereby correcting the offset position of the PCB board 40a during the transportation of the PCB board 40a, not only avoiding damage to the PCB board 40a during the correction process, but also effectively improving the transportation efficiency of the PCB board 40a. It is also applicable to thinner PCB boards 40 and has a good use effect.

[0057] In another embodiment of the present invention, Figure 2 , 8As shown in , 9, the position identification mechanism 30 includes an edge-searching moving member 31, a first edge-searching sensing member 32 and a second edge-searching sensing member 33. The edge-searching moving member 31 is mounted on the mounting frame 10 and is located in the pick-and-place area 22. The first edge-searching sensing member 32 and the second edge-searching sensing member 33 are both mounted on the moving end of the edge-searching moving member 31. The first edge-searching sensing member 32 and the second edge-searching sensing member 33 are arranged at a predetermined distance apart. The sensing end of the first edge-searching sensing member 32 and the sensing end of the second edge-searching sensing member 33 are on the same straight line parallel to the edge of the PCB board 40 located at the original set position. The edge-searching moving member 31 is used to drive the first edge-searching sensing member 32 and the second edge-searching sensing member 33 to move toward the edge of the PCB board 40 located in the pick-and-place area 22. Specifically, when the pick-and-place mechanism 20 is in the process of sucking up the PCB board 40, the PCB board 40 is located in the pick-and-place area 22, and the edge-searching moving member 31 drives the first edge-searching sensing member 32 and the second edge-searching sensing member 33 to move toward the same edge of the PCB board 40, and records the time t1 when the first edge-searching sensing member 32 reaches the edge of the PCB board 40 (the time t1 can be used to obtain the distance n moved by the first edge-searching sensing member 32 when it reaches the edge of the PCB board 40 according to the known moving speed v of the first edge-searching sensing member 32) and the time t2 when the second edge-searching sensing member 33 reaches the edge of the PCB board 40 (the time t2 can be used to obtain the distance n moved by the second edge-searching sensing member 33 according to the known moving speed v of the second edge-searching sensing member 33). 3) when the PCB board 40 reaches the edge of the PCB board 40. According to the different times recorded by the first edge-searching sensor 32 and the second edge-searching sensor 33, as well as the fixed structural parameters of the mechanism during the transportation process, the offset parameters of the PCB board 40a can be calculated and fed back to the manipulator. At this time, the manipulator drives the mounting frame 10 to rotate and / or move to correct the position of the PCB board 40a, and then places it in another process to achieve the purpose of transportation, thereby correcting the offset position of the PCB board 40a during the transportation of the PCB board 40a, not only avoiding damage to the PCB board 40a during the correction process, but also effectively improving the transportation efficiency of the PCB board 40a. In addition, this method of correcting the offset position of the PCB board 40a during the transportation process is applicable to both relatively thick PCB boards 40 and relatively thin PCB boards 40, and has a good use effect.

[0058] Among them, the first edge-searching sensor 32 and the second edge-searching sensor 33 can be mature photoelectric sensing switch devices on the market. For example, when the first edge-searching sensor 32 and the second edge-searching sensor 33 are moving, the first edge-searching sensor 32 and the second edge-searching sensor 33 continuously emit light signals, and the light signals are continuously fed back to the first edge-searching sensor 32 and the second edge-searching sensor 33 by the PCB board 40. When the first edge-searching sensor 32 or the second edge-searching sensor 33 does not receive feedback of the light signal, it means that the first edge-searching sensor 32 or the second edge-searching sensor 33 has reached the edge of the PCB board 40.

[0059] Further, in the process of correcting the offset PCB board 40, as Figure 8 , 10 As shown, when the sucked PCB board 40 is in the original set position, the distance between the sensing end of the first edge search sensor 32 and the sensing end of the second edge search sensor 33 is Z, and the distance between the sensing end of the first edge search sensor 32 or the sensing end of the second edge search sensor 33 at the original position and the edge of the original set position of the PCB board 40 is H.

[0060] Then, in a PCB board position correction method, if Fig.10 , 11 As shown, it is used to transfer the PCB board 40 in the board box to the main process line, using the PCB board pick-up and placement device as mentioned above, and the mounting position 11 of the mounting frame 10 is connected to the manipulator; when the pick-up and placement mechanism 20 takes out the PCB board 40 from the board box of the board placing machine to the main process line for transportation, at this time, the axis of the rotation center on the mounting frame 10 is located between the first edge search sensor 32 and the second edge search sensor 33. When the suction component 21 sucks the PCB board 40, if the PCB board 40a is deflected relative to the original set position and the deflection angle is θ, it is obtained:

[0061] like Fig.10 , 11 As shown, the two adjacent edges of the PCB board 40 at the original setting position are set as the x-axis and the y-axis to establish a rectangular coordinate system. Then, the offset PCB board 40a intersects with the midpoint of the edge of the PCB board 40 at the original setting position on the y-axis at one point in the y-axis direction. Let this intersection point D be (S x4 S y4 ), that is, point D here can be set as the midpoint of the edge of the PCB board 40 in the y-axis direction at the original setting position. Since the PCB board 40a is put into the main process line for transportation, the offset of the PCB board 40a in the x-axis direction can be ignored, and the point detected by the second edge search sensor 33 when it moves to the edge of the PCB board 40a is B (S x2 , S y2 ), the first edge-searching sensor 32 moves to the edge of the PCB board 40a and detects the point A (S x1 , S y1 ), the deflection point of the PCB board 40a close to the origin is P(x, y); S x4 =0, S y2 =Hm,S y1 =Hn; and, S x1 , S x2 and S y4 All are known, among which S y4is half of the length of the board edge of the PCB board 40 in the y-axis direction; then: x=-e×(-S y4 +y).

[0062] By feeding back the calculated deflection angle θ and the deflection point (x, y) to the manipulator, the manipulator rotates the deflection point (x, y) by an angle θ to align the deflection point, and moves the deflection point (x, y) to the origin of the coordinates, so that the manipulator completes the correction process of the offset PCB board 40 in this case. This method can quickly and accurately adjust the offset PCB board 40a, so that the PCB board 40a can be neatly transported on the main process line, and the use effect is good.

[0063] In another PCB board position correction method, such as Figure 8 , 9 As shown, it is used to transfer the PCB board 40 on the process main line to the board box. The above-mentioned PCB board picking and placing device is used, and the mounting position 11 of the mounting frame 10 is connected to the manipulator; when the picking and placing mechanism 20 stacks the PCB board 40 transported on the process main line of the process main line into the board box of the board placing machine, there is an induction stop point C on the process main line, that is, when the PCB board 40 moves to the induction stop point, the PCB board 40 stops moving, and the suction component 21 sucks the PCB board 40 into the board box. When the suction component 21 sucks the PCB board 40, if the PCB board 40a is deflected relative to the original set position and the deflection angle is θ, it can also be obtained from the above parameters:

[0064] like Figure 8 , 9 As shown, a rectangular coordinate system is established with the point of the original setting position of the PCB board 40 as the origin O, and the induction stop point C on the process main line is set as (S x3 , S y3 ), the second edge-searching sensor 33 moves to the edge of the PCB board 40a and detects the point B (S x2 , S y2 ), the first edge-searching sensor 32 moves to the edge of the PCB board 40a and detects the point A (S x1 , S y1 ), the deflection point of the PCB board 40a close to the origin is P(x, y); S x3 =0, S y2 =Hm,S y1 =Hn; and, S x1 , S x2 , S y3 Known, then: x=-e×(-S y3 +y).

[0065] By feeding back the calculated deflection angle θ and the deflection point (x, y) to the manipulator, the manipulator rotates the angle θ around the deflection point (x, y) to align the deflection point, and moves the deflection point (x, y) to the origin of the coordinates, so that the manipulator completes the correction process of the offset PCB board 40a in this case. This method can quickly and accurately adjust the offset PCB board 40a, so that the PCB board 40a can be neatly stacked in the board box, and the use effect is good.

[0066] In another embodiment of the present invention, Figure 2 As shown, the edge search moving member 31 includes a support rod 312 and a first screw module 311. The first screw module 311 is installed on the mounting frame 10. The moving nut of the first screw module 311 is connected to the support rod 312 and drives the support rod 312 to move. The first edge search sensor 32 and the second edge search sensor 33 are installed on the support rod 312. Specifically, the sub-rod is perpendicular to the moving direction of the first screw module 311 (that is, perpendicular to the screw of the first screw module 311). After the suction component 21 sucks the PCB board 40 into the pick-up and placement area 22, the first screw module 311 drives the support rod 312 to move linearly from the pick-up and placement area 22 toward the edge of the PCB board 40. When the PCB board 40 is not offset, the first edge-searching sensor 32 and the second edge-searching sensor 33 simultaneously sense the edge of the PCB board 40. At this time, the robot receives feedback and does not perform correction operations, and directly places the PCB board 40 to the next position; when the PCB board 40a is offset, the first edge-searching sensor 32 and the second edge-searching sensor 33 arrive at the edge of the PCB board 40a at different times. At this time, the robot receives feedback and performs correction based on the calculation results obtained from the obtained offset parameters, and then places the corrected PCB board 40 to the next position.

[0067] In another embodiment of the present invention, Figure 1 , 3 As shown in FIG. 4 , the pick-and-place mechanism 20 includes at least two suction components 21, which are installed on the mounting frame 10 at intervals. The suction components 21 are used to pick up the PCB board 40, and the suction components 21 are surrounded together to form a pick-and-place area 22. Specifically, by setting each suction component 21 as needed, the PCB board 40 can be stably picked up, and the use effect is good.

[0068] In another embodiment of the present invention, Figure 1 , 3As shown in FIG. 4 , two suction components 21 are provided, and the pick-and-place mechanism 20 further includes a pick-and-place moving member 23, the pick-and-place moving member 23 is mounted on the mounting frame 10, one suction component 21 is mounted on the mounting frame 10, the moving end of the pick-and-place moving member 23 is connected to another suction component 21 and drives the suction component 21 to approach or move away from the other suction component 21, and a pick-and-place area 22 is formed between the two suction components 21. Specifically, by providing two suction components 21, one of which is fixedly mounted on the mounting frame 10, and the other is mounted on the moving end of the pick-and-place moving member 23, when it is necessary to pick and place PCB boards 40 of different sizes, the distance between the two suction components 21 is adjusted by the pick-and-place moving member 23 to form pick-and-place areas 22 of different sizes, which is convenient to use and has a wide range of applications.

[0069] In another embodiment of the present invention, Figure 3 As shown, the pick-and-place moving member 23 includes a second screw module 231, and the moving nut of the second screw module 231 is connected to one of the suction components 21. Specifically, the moving nut of the second screw module 231 drives one of the suction components 21 to move back and forth, thereby adjusting the distance between the two suction components 21. Among them, the screw of the second screw module 231 can be made perpendicular to the screw of the first screw module 311, so that the moving direction of the suction component 21 is perpendicular to the moving direction of the first edge search sensor 32 and the second edge search sensor 33, so that interference can be avoided and the PCB board 40 can be ensured to be transported and / or corrected in an orderly manner. Furthermore, the picking and placing moving part 23 also includes a moving slide rail 232, the slider of the moving slide rail 232 is connected to the moving nut of the second screw module 231, one of the suction components 21 is connected to the slider of the moving slide rail 232, and the guide rail of the moving slide rail 232 extends in the same direction as the screw of the second screw module 231. The moving slide rail 232 is set to assist the movement of the suction component 21, so that its movement is smoother.

[0070] In another embodiment of the present invention, Figure 3 As shown, the suction assembly 21 includes a plurality of suction nozzles 211 arranged in a linear manner, and two suction assemblies 21 are arranged in parallel. Specifically, each suction nozzle 211 sucks the PCB board 40 by vacuuming, thereby avoiding damage to the PCB board 40, and is applicable to PCB boards 40 of different thicknesses. The suction assembly 21 also includes a long strip suction nozzle bracket 212, and each suction nozzle 211 is arranged along the length direction of the suction nozzle bracket 212, so that when sucking the PCB board 40, the edges on the opposite sides of the PCB board 40 can be sucked, and then the other two edges that are not sucked can be used for detection and correction by the correction mechanism, and the transportation and correction do not affect each other, so that the PCB board 40 can be corrected during the transportation process, and the use effect is good.

[0071] In another embodiment of the present invention, Figure 4 , 5 As shown in FIGS. 6 and 7 , the pick-and-place mechanism 20 further includes at least two oblique driving members 24, wherein one oblique driving member 24 is mounted on the mounting frame 10, and the other oblique driving member 24 is mounted on the moving end of the pick-and-place moving member 23, and the driving end of the oblique driving member 24 is connected to the suction assembly 21 and drives the suction assembly 21 to move obliquely toward the direction of the other suction assembly 21. Specifically, when the PCB boards 40 are stacked, when the suction assembly 21 sucks the PCB board 40, by setting the oblique driving member 24, when the PCB board 40 is sucked, the sucked edge of the PCB board 40 is first slightly tilted toward the middle of the PCB board 40, so that the sucked PCB board 40 can be separated from the lower PCB board 40 more smoothly, and the influence of the mutual adhesion between the PCB boards 40 on the board picking is reduced. Among them, the oblique driving member 24 can be a cylinder, a linear motor or other linear module, etc., which can be set as needed.

[0072] In another embodiment of the present invention, Figure 4 , 5 As shown in FIGS. 6 and 7 , the pick-and-place mechanism 20 further includes a blowing member 25, which is mounted on the suction assembly 21 and is located near the outer side of the pick-and-place area 22. The blowing member 25 has an air inlet 252 and an air blow hole 251. The air inlet 252 is used to connect to the external air path, and the air blow hole 251 is used to blow air toward the gap between two adjacent PCB boards 40. Specifically, after the oblique pull driving member 24 pulls the PCB board 40 so that the edge of the PCB board 40 is slightly tilted, the blowing member 25 is provided, and air is taken in from the air inlet 252 on the blowing member 25, so that the air blow hole 251 blows air toward the PCB board 40 and the lower PCB board 40 at the tilted position of the PCB board 40, so that the sucked PCB board 40 can be better separated from the lower PCB board 40, and the PCB board 40 at the lower layer is prevented from being attached to the sucked PCB board 40, thereby causing the lower PCB board 40 to be offset, and the use effect is good.

[0073] In another embodiment of the present invention, Figure 7 As shown, a plurality of blowing holes 251 are provided, and the blowing holes 251 are arranged in the vertical direction on the blowing member 25. Specifically, by arranging the blowing holes 251 in the vertical direction, air can be blown more accurately toward the PCB board 40 and the space between the lower PCB board 40, so that the two PCB boards 40 are separated, and the use effect is good.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB board pick-and-place device, characterized in that: It includes a mounting frame, a pick-and-place mechanism and a position identification mechanism, wherein the mounting frame is provided with a mounting position for an external manipulator to install, the pick-and-place mechanism is installed on the mounting frame, the pick-and-place mechanism is provided with a pick-and-place area, the pick-and-place area is used to absorb or place a PCB board, the position identification mechanism is installed on the mounting frame and located in the pick-and-place area, and the position identification mechanism is used to identify the offset position of the edge of the PCB board; The position identification mechanism comprises an edge-searching moving member, a first edge-searching sensing member and a second edge-searching sensing member, the edge-searching moving member is mounted on the mounting frame and is located in the pick-and-place area, the first edge-searching sensing member and the second edge-searching sensing member are both mounted on the moving end of the edge-searching moving member, the first edge-searching sensing member and the second edge-searching sensing member are arranged at a predetermined distance, the sensing end of the first edge-searching sensing member and the sensing end of the second edge-searching sensing member are on the same straight line parallel to the edge of the PCB board located at the original set position, and the edge-searching moving member is used to drive the first edge-searching sensing member and the second edge-searching sensing member to move toward the edge of the PCB board located in the pick-and-place area; The pick-and-place mechanism includes two suction components, and the pick-and-place mechanism also includes a pick-and-place moving member, the pick-and-place moving member is installed on the mounting frame, one suction component is installed on the mounting frame, the moving end of the pick-and-place moving member is connected to the other suction component and drives the suction component to approach or move away from the other suction component, and the two suction components are jointly surrounded to form the pick-and-place area; The picking and placing mechanism also includes a blowing piece, which is installed on the suction assembly and located near the outside of the picking and placing area. The blowing piece has an air inlet hole and a blowing hole. The air inlet hole is used to connect to the external air path, and the blowing hole is used to blow air toward the gap between two adjacent PCB boards.

2. The PCB board pick-up and placement device according to claim 1, characterized in that: The edge-searching moving part includes a support rod and a first screw rod module, the first screw rod module is installed on the mounting frame, the moving nut of the first screw rod module is connected to the support rod and drives the support rod to move, and the first edge-searching sensing part and the second edge-searching sensing part are installed on the support rod.

3. The PCB board pick-up and placement device according to claim 1, characterized in that: The pick-and-place moving member comprises a second screw module, and a moving nut of the second screw module is connected to one of the suction components.

4. The PCB board pick-up and placement device according to claim 1, characterized in that: The picking and placing mechanism also includes at least two oblique driving members, one of which is installed on the mounting frame, and the other is installed on the moving end of the picking and placing moving member, and the driving end of the oblique driving member is connected to the suction component and drives the suction component to move obliquely toward the direction of the other suction component.

5. A PCB board position correction method, characterized in that: The method is used to transfer the PCB board in the board box to the main process line, using the PCB board picking and placing device according to any one of claims 1 to 4, wherein the mounting position of the mounting frame is connected to the manipulator; the PCB board position correction method comprises the following steps: The two adjacent edges of the PCB board at the original setting position are set as the x-axis and the y-axis to establish a rectangular coordinate system. Then, the offset PCB board intersects with the midpoint of the edge of the PCB board at the original setting position on the y-axis at one point in the y-axis direction. Let this intersection point D be The second edge-searching sensor moves to the edge of the PCB board and detects point B. The first edge search sensor moves to the edge of the PCB board and detects the point A. , the deflection point of the PCB board close to the origin is P ; If the PCB board is deflected relative to the original setting position and the deflection angle is , record the travel distance of the first edge search sensor to the edge of the PCB board , and the travel of the second edge search sensor to the edge of the PCB board ;but: ； ； ； in, , , ; , and All are known; is the distance between the sensing end of the first edge-searching sensing element and the sensing end of the second edge-searching sensing element; According to the deflection angle and deflection point , the manipulator drives the mounting frame to deflect the point The PCB rotates as the center The angle is aligned; and the position is at the deflection point The corner end of the PCB board is moved to the coordinate origin to complete the correction of the PCB board.

6. A PCB board position correction method, characterized in that: The method is used to transfer the PCB board on the main process line to the board box, using the PCB board picking and placing device according to any one of claims 1 to 4, wherein the mounting position of the mounting frame is connected to the manipulator; the PCB board position correction method comprises the following steps: A rectangular coordinate system is established with the original set position of the PCB board as the origin O, and the induction stop point C on the process main line is set as The second edge-searching sensor moves to the edge of the PCB board and detects point B. The first edge search sensor moves to the edge of the PCB board and detects the point A. , the deflection point of the PCB board close to the origin is P ; If the PCB board is deflected relative to the original setting position and the deflection angle is , record the travel distance of the first edge search sensor to the edge of the PCB board , and the travel of the second edge search sensor to the edge of the PCB board ;but: ； ； ； in, , , ; , and All are known; is the distance between the sensing end of the first edge-searching sensing element and the sensing end of the second edge-searching sensing element; According to the deflection angle and deflection point , the manipulator drives the mounting frame to deflect the point The PCB rotates as the center The angle is aligned; and the position is at the deflection point The corner end of the PCB board is moved to the coordinate origin to complete the correction of the PCB board.

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