Heat exchange core and heat exchanger

Abstract

The application relates to the technical field of heat exchange devices, in particular to a heat exchange core and a heat exchanger. The heat exchange core comprises a plurality of chip assemblies arranged in stacks, and two adjacent chip assemblies are arranged at intervals to form a cooling flow channel; the chip assembly comprises two oppositely arranged chips, and a to-be-cooled flow channel is formed between the two chips; the chip comprises a main heat exchange part and a fluid introduction end part connected to one end of the main heat exchange part, the fluid introduction end part is provided with a cooling fluid inlet and a to-be-cooled fluid inlet, the cooling fluid inlet is arranged on the side of the to-be-cooled fluid far from the main heat exchange part; the cooling flow channel comprises an end part introduction cooling section and a main cooling section which are communicated with each other, the cooling fluid inlet is communicated with the end part introduction cooling section, and the to-be-cooled fluid inlet is communicated with the to-be-cooled flow channel.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange devices, and in particular to a heat exchange core and a heat exchanger. Background Art

[0002] The laminated plate heat exchanger has been increasingly widely used due to its compact product structure and high heat exchange efficiency, such as laminated plate oil cooler, laminated plate water-air intercooler, laminated plate EGR cooler, etc.

[0003] The heat exchange core in the stacked plate heat exchanger includes multiple stacked chip assemblies. One chip assembly includes two oppositely arranged chips. A cooling channel is formed between the two chips, and a cooling channel is formed between two adjacent chip assemblies. The ends of the chips are provided with a low-temperature fluid inlet and a high-temperature fluid inlet or a low-temperature fluid outlet and a high-temperature fluid outlet. The middle part of the chip is the effective heat exchange part. Therefore, the two ends of the heat exchanger are the inlet and outlet ends of the fluid, and the middle part of the heat exchanger is the effective heat exchange part.

[0004] Traditional stacked-plate heat exchangers usually set the inlet and outlet of high-temperature fluid at both ends of the heat exchanger, and the inlet and outlet of low-temperature fluid are set closer to the effective heat exchange part. After entering the heat exchanger, the low-temperature fluid flows directly to the effective heat exchange part, while the high-temperature fluid directly contacts the wall surface at the end of the heat exchanger when entering the heat exchanger. This will cause the heating rate of the end of the heat exchanger to be much higher than the effective heat exchange part in the middle, which is likely to cause thermal stress concentration at the junction of the end of the chip and the effective heat exchange part, eventually causing the chip to break, thereby causing the heat exchanger to leak. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat exchange core and a heat exchanger to solve, to a certain extent, the technical problem in the prior art that the heating rate at the end of the heat exchanger is much higher than that of the effective heat exchange part in the middle, which easily causes thermal stress concentration at the junction of the end of the chip and the effective heat exchange part, and eventually leads to chip breakage, thereby causing heat exchanger leakage.

[0006] The present invention provides a heat exchange core, comprising: a plurality of stacked chip assemblies, wherein two adjacent chip assemblies are spaced apart to form a cooling channel; the chip assembly comprises two chips arranged opposite to each other, and a cooling channel is formed between the two chips;

[0007] The chip includes a main heat exchange part and a fluid introduction end connected to one end of the main heat exchange part, the fluid introduction end is provided with a cooling fluid inlet and a to-be-cooled fluid inlet, and the cooling fluid inlet is arranged on the side of the to-be-cooled fluid away from the main heat exchange part; the cooling flow channel includes an end introduction cooling section and a main cooling section that are interconnected, the cooling fluid inlet is connected to the end introduction cooling section, and the to-be-cooled fluid inlet is connected to the to-be-cooled flow channel.

[0008] As an optional solution, a guide rib is provided at the fluid inlet end of the chip, and the guide rib is located on the side of the inlet of the fluid to be cooled close to the main heat exchange part; the guide rib is arranged in a V shape, and the middle part of the guide rib is arranged close to the main heat exchange part.

[0009] As an optional solution, the chip also includes an auxiliary cooling fluid inlet, which is arranged on the side of the fluid inlet to be cooled close to the main heat exchange part, and the auxiliary cooling fluid inlet is provided at least in the middle part of the chip in the width direction of the chip.

[0010] Furthermore, the auxiliary cooling fluid inlet is arranged at the fluid introduction end; in the length direction of the chip, the edge of the auxiliary cooling fluid inlet close to the main heat exchange part does not protrude from the edge of the inlet of the fluid to be cooled close to the main heat exchange part.

[0011] Furthermore, the connection between the fluid introduction end and the main heat exchange part is arranged in an inclined surface, and in the two chips of the same chip assembly, the end of the inclined surface of one chip close to the main heat exchange part is arranged away from the other chip, so that the height of the end introduction cooling section formed between the two adjacent chip assemblies is greater than the height of the main cooling section.

[0012] Furthermore, in the width direction of the chip, the width of the inclined surface gradually increases from an end away from the main heat exchange portion to an end close to the main heat exchange portion.

[0013] Furthermore, a reinforcing protrusion is provided in the cooling channel section at the fluid introduction end.

[0014] Furthermore, a fluid outlet end is connected to the side of the main heat exchange portion away from the fluid inlet end, and the fluid outlet end is connected to a cooling fluid outlet and a fluid outlet to be cooled; the cooling flow channel includes an end outlet cooling section connected to the main cooling section away from the end outlet cooling section, the cooling fluid outlet is connected to the end outlet cooling section, and the fluid outlet to be cooled is connected to the flow channel to be cooled.

[0015] The present invention provides a heat exchanger, comprising: a fluid pipeline and the above-mentioned heat exchange core, wherein the fluid pipeline comprises a cooling fluid introduction pipeline and a to-be-cooled fluid introduction pipeline, the cooling fluid introduction pipeline is connected to the cooling fluid inlet of the outermost chip, and the to-be-cooled fluid introduction pipeline is connected to the to-be-cooled fluid inlet of the outermost chip.

[0016] Furthermore, the cooling fluid introduction pipe and the to-be-cooled fluid introduction pipe are integrally formed.

[0017] The heat exchange core provided by the present invention includes: a plurality of stacked chip assemblies, wherein two adjacent chip assemblies are spaced apart to form a cooling channel; the chip assembly includes two chips arranged opposite to each other, and a channel to be cooled is formed between the two chips; the chip includes a main heat exchange part and a fluid introduction end connected to one end of the main heat exchange part, the fluid introduction end is provided with a cooling fluid inlet and a fluid inlet to be cooled, and the cooling fluid inlet is arranged on the side of the fluid to be cooled away from the main heat exchange part; the cooling channel includes an end introduction cooling section and a main cooling section that are connected to each other, the cooling fluid inlet is connected to the end introduction cooling section, and the fluid inlet to be cooled is connected to the channel to be cooled.

[0018] Multiple chip assemblies are stacked, a cooling channel is formed between two adjacent chip assemblies, a channel to be cooled is formed in a chip assembly, and in the stacking direction of the chip assemblies, a cooling channel and a channel to be cooled are alternately arranged; the cooling fluid inlets are connected in sequence to form a cooling fluid channel, and multiple fluids to be cooled are connected in sequence to form a fluid channel to be cooled; each cooling fluid inlet is connected to the cooling channel and isolated from the channel to be cooled, and each fluid inlet to be cooled is connected to the channel to be cooled and isolated from the channel to be cooled.

[0019] The cooling fluid enters the cooling fluid channel from the outermost cooling fluid inlet and then enters each layer of cooling flow channel. The fluid to be cooled enters the fluid channel to be cooled from the outermost inlet of the fluid to be cooled and then enters each layer of flow channel to be cooled. The cooling fluid inlet is located at a position away from the main heat exchange part of the fluid to be cooled, that is, the cooling fluid inlet is set at the outermost side of the chip. After the cooling fluid enters the cooling flow channel, it first enters the fluid introduction end and then flows to the middle position heat exchange part to exchange heat with the fluid to be cooled in the flow channel to be cooled. The cooling fluid flows from the end of the cooling flow channel to the middle part, and cools the end position where the cooling fluid inlet is located, thereby reducing the temperature rise rate of the chip end, thereby avoiding the large difference in temperature rise rate between the end of the chip and the middle main heat exchange part, resulting in thermal stress concentration at the connection between the fluid introduction end of the chip and the main heat exchange part, thereby avoiding chip breakage, thereby avoiding heat exchange core leakage, and thereby avoiding heat exchanger failure.

[0020] It should be understood that both the foregoing general description and the following detailed description are for purposes of illustration and description and are not necessarily limiting of the present disclosure. The accompanying drawings, which are incorporated into and constitute a part of the specification, illustrate the subject matter of the present disclosure. Together, the description and the drawings serve to explain the principles of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic structural diagram of a chip in a heat exchange core according to a first embodiment of the present invention;

[0023] Figure 2 This is a schematic structural diagram of a chip in a heat exchange core according to a second embodiment of the present invention;

[0024] Figure 3 This is a schematic structural diagram of a heat exchange core according to a third embodiment of the present invention;

[0025] Figure 4 This is a schematic structural diagram of a heat exchange core according to a fourth embodiment of the present invention;

[0026] Figure 5 for Figure 4 A cross-sectional view of the heat exchange core shown;

[0027] Figure 6 for Figure 4 The schematic diagram of the structure of the chip in the heat exchange core shown;

[0028] Figure 7 This is a schematic structural diagram of a chip in a heat exchange core according to a fourth embodiment of the present invention;

[0029] Figure 8 Schematic diagram of the structure of a heat exchanger according to an embodiment of the present invention;

[0030] Figure 9 for Figure 8 Schematic diagram of the structure of the fluid pipeline in the heat exchanger shown.

[0031] Figure markings: 10-chip assembly; 20-cooling channel; 30-channel to be cooled; 40-reinforced protrusion; 50-fluid pipeline; 60-heat exchange core; 11-chip; 111-fluid inlet end; 112-main heat exchange part; 113-fluid outlet end; 114-cooling fluid inlet; 115-fluid inlet to be cooled; 116-auxiliary cooling fluid inlet; 117-cooling fluid outlet; 118-fluid outlet to be cooled; 119-guide rib; 21-end introduction cooling section; 22-main cooling section; 23-end outlet cooling section; 211-slant; 51-cooling fluid introduction pipe; 52-fluid introduction pipe to be cooled. DETAILED DESCRIPTION

[0032] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0033] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0034] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0035] The terms “first” and “second” are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0036] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0037] like Figures 1 to 7 As shown, the present invention provides a heat exchange core 60, comprising: a plurality of stacked chip assemblies 10, wherein two adjacent chip assemblies 10 are spaced apart to form a cooling channel 20; the chip assembly 10 comprises two chips 11 arranged opposite to each other, and a channel to be cooled 30 is formed between the two chips 11; the chip 11 comprises a main heat exchange portion 112 and a fluid introduction end portion 111 connected to one end of the main heat exchange portion 112, the fluid introduction end portion 111 is provided with a cooling fluid inlet 114 and a fluid inlet 115 to be cooled, and the cooling fluid inlet 114 is arranged on a side of the fluid to be cooled away from the main heat exchange portion 112; the cooling channel 20 comprises an end introduction cooling section 21 and a main cooling section 22 which are connected to each other, the cooling fluid inlet is connected to the end introduction cooling section 21, and the fluid inlet 115 to be cooled is connected to the channel to be cooled 30.

[0038] In this embodiment, multiple chip assemblies 10 are stacked, a cooling channel 20 is formed between two adjacent chip assemblies 10, and a channel to be cooled 30 is formed in a chip assembly 10. In the stacking direction of the chip assemblies 10, a cooling channel 20 and a channel to be cooled 30 are alternately arranged; the cooling fluid inlets 114 are connected in sequence to form a cooling fluid channel, and multiple fluid inlets to be cooled are connected in sequence to form a fluid channel to be cooled; each cooling fluid inlet 114 is connected to the cooling channel 20 and is isolated from the channel to be cooled 30, and each fluid inlet 115 to be cooled is connected to the channel to be cooled 30 and is isolated from the channel to be cooled 30.

[0039] The cooling fluid enters the cooling fluid channel from the outermost cooling fluid inlet 114, and then enters each layer of cooling channel 20. The to-be-cooled fluid enters the to-be-cooled fluid channel from the outermost to-be-cooled fluid inlet 115, and then enters each layer of to-be-cooled channel 30. The cooling fluid inlet 114 is located at a position away from the main heat exchange portion 112 of the to-be-cooled fluid inlet 115, that is, the cooling fluid inlet 114 is set at the outermost side of the chip 11. When the cooling fluid enters the cooling channel 20, it first enters the fluid introduction end 111, and then flows to the middle position heat exchange portion, so as to The cooling fluid exchanges heat with the fluid to be cooled in the cooling channel 30, and flows from the end of the cooling channel 20 to the middle part thereof, cooling the end position where the cooling fluid inlet 115 is located, thereby reducing the end temperature rise rate of the chip 11, thereby avoiding a large difference in temperature rise rate between the end of the chip 11 and the middle main heat exchange part 112, resulting in thermal stress concentration at the connection between the fluid introduction end 111 of the chip 11 and the main heat exchange part 112, thereby avoiding breakage of the chip 11, thereby avoiding leakage of the heat exchange core 60, and avoiding failure of the heat exchanger.

[0040] Specifically, an annular first boss can be provided at the edge of the inlet 115 for the fluid to be cooled. In the same chip assembly 10, the first boss of one chip 11 extends in a direction away from the other chip 11, so that the first boss of one chip 11 in two adjacent chip assemblies 10 can abut against the first boss of one chip 11 in the other chip assembly 10, thereby achieving brazing, that is, the first boss is located in the cooling fluid, and multiple inlets 115 for the fluid to be cooled and multiple first bosses form a fluid channel to be cooled. The first boss is isolated from the cooling channel 20, that is, the end of the cooling channel 20 is introduced into the cooling section 21, which is annularly surrounded by the fluid channel to be cooled to exchange heat with the fluid to be cooled therein. The first boss can be provided on the chip 11 by welding. Optionally, the first boss is directly formed by the flanged edge of the inlet 115 for the fluid to be cooled, which has high production efficiency.

[0041] The two chips 11 in the same chip assembly 10 can be directly welded to each other on the side of the cooling fluid inlet 115 away from the main heat exchange part 112, and a cooling fluid inlet 114 is set at this position. The interval between the two main heat exchange parts 112 is set to form a cooling flow channel 30.

[0042] The shape of the cooling fluid inlet 114 can be triangular, quadrilateral, elliptical, circular, waist-shaped or irregular, etc. The number of the cooling fluid inlet 114 can be one or more (eg, two, three or four, etc.).

[0043] The shape of the inlet 115 for the fluid to be cooled can be triangular, quadrilateral, elliptical, circular, waist-shaped or irregular, etc. The number of the inlet 115 for the fluid to be cooled can be one or more (eg, two, three or four, etc.).

[0044] It should be noted that the total flow area of ​​cooling fluid inlet 114 and the total flow area of ​​fluid to be cooled inlet 115 can be set according to the specific type of cooling fluid and the type of fluid to be cooled. For example, when the fluid to be cooled is gas and the cooling fluid is water, the total flow area of ​​fluid to be cooled inlet 115 is larger than the total flow area of ​​cooling fluid inlet 114.

[0045] like Figure 2 As shown, based on the above embodiment, further, the fluid inlet end 111 of the chip 11 is provided with a guide rib 119, and the guide rib 119 is located on the side of the inlet 115 of the fluid to be cooled close to the main heat exchange part 112; the guide rib 119 is arranged in a V shape, and the middle part of the guide rib 119 is arranged close to the main heat exchange part 112.

[0046] In this embodiment, a guide rib 119 is provided on one side of the inlet 115 of the fluid to be cooled close to the main heat exchange portion 112. When the cooling fluid is introduced from the end into the cooling section 21 and enters the main cooling section 22, the guide rib 119 can guide the cooling fluid to the center of the main cooling section 22 in the width direction of the chip 11, thereby avoiding the cooling fluid on both sides from flowing directly backward (in the length direction of the chip 11), thereby avoiding the formation of a triangular dead angle area at the position where the cooling section 21 is introduced close to the end of the main cooling section 22, so that the heat exchange of the heat exchange core 60 is uniform.

[0047] Among them, the guide rib 119 can be set on the chip 11 by welding or interference connection, and the edge of the first boss close to the main heat exchange part 112 can be optionally directly set into a V shape to form the guide rib 119, so that the structure of the chip 11 is simple and the processing is convenient.

[0048] The angle of the guide rib 119 can be 90 degrees, 100 degrees, 110 degrees, 120 degrees or 130 degrees, etc.

[0049] like Figure 3 As shown, based on the above embodiment, the chip 11 also includes an auxiliary cooling fluid inlet 116, which is arranged on the side of the fluid inlet 115 to be cooled close to the main heat exchange part 112. In the width direction of the chip 11, at least the middle part of the chip 11 is provided with an auxiliary cooling fluid inlet 116.

[0050] In this embodiment, an auxiliary cooling fluid inlet 116 is provided at least at the center position (the center position in the width direction of the chip 11) of the side of the fluid inlet 115 to be cooled close to the main heat exchange portion 112. The cooling fluid can then directly enter the main cooling section 22 through the auxiliary cooling fluid inlet only, and can directly flow through the center position of the main cooling section 22 (the center position in the width direction of the chip 11), thereby avoiding the formation of a triangular dead angle area at the position where the cooling section 21 is introduced near the end of the main cooling section 22, so that the heat exchange of the heat exchange core 60 is uniform.

[0051] The auxiliary cooling fluid inlet 116 may be in a triangular, quadrilateral, circular, elliptical, or waist-shaped shape. There may be one auxiliary cooling fluid inlet 116 or multiple auxiliary cooling fluid inlets 116 (e.g., two, three, or four), with at least one auxiliary cooling fluid inlet 116 disposed at least at the center (the center in the width direction of the chip 11) of the side of the cooling fluid inlet 115 close to the main heat exchange portion 112.

[0052] The auxiliary cooling fluid inlet 116 may be provided on the main heat exchange portion 112 , that is, in the length direction of the chip 11 , the auxiliary cooling fluid inlet 116 may protrude from the to-be-cooled fluid inlet 115 .

[0053] Optional, such as Figures 4 to 6 As shown, the auxiliary cooling fluid inlet 116 is arranged at the fluid introduction end 111; in the length direction of the chip 11, the edge of the auxiliary cooling fluid inlet 116 close to the main heat exchange part 112 does not protrude from the edge of the to-be-cooled fluid inlet 115 close to the main heat exchange part 112.

[0054] In this embodiment, the middle part of the edge of the fluid inlet 115 to be cooled close to the main heat exchange part 112 is concave, and the auxiliary cooling fluid inlet 116 can be set in the concave part, so that in the length direction of the chip 11, the edge of the auxiliary cooling fluid close to the main heat exchange part 112 does not protrude from the edge of the fluid inlet 115 to be cooled close to the main heat exchange part 112. This chip 11 has a regular structure, which avoids the auxiliary cooling fluid inlet 116 occupying the area of ​​the main heat exchange part 112. When fins are set at the position corresponding to the main heat exchange part 112 in the flow channel 30 to be cooled, the fins can be avoided from being processed again, which facilitates assembly.

[0055] like Figures 4 to 6 As shown, on the basis of the above embodiment, further, the connection between the fluid introduction end 111 and the main heat exchange part 112 is set in a slope 211, and the slopes 211 of the two chips 11 in the same chip assembly 10 are inclined away from each other, that is, the end of the slope 211 of one chip away from the main heat exchange part 112 is set close to the other chip 11, and the end of the slope 211 close to the main heat exchange part 112 is set away from the other chip 11. After the adjacent chips 11 of the upper and lower chip assemblies 10 are connected, the height of the end introduction cooling section 21 can be greater than the height of the main cooling section 22. When the end is introduced into the cooling section 21, the flow resistance of the cooling fluid is small, and the fluid introduction end 111 of the chip 11 is cooled while quickly flowing to the main cooling section 22, thereby ensuring the heat exchange rate of the main cooling section 22.

[0056] Optionally, for the convenience of description, the channel at the inclined surface is defined as a transition cooling section, one end of the transition cooling section is connected to the end introduction cooling section 21, and the other end of the transition cooling section is connected to the main cooling section 22; from the direction away from the main cooling section to the direction close to the main cooling section, the height of the transition cooling section (coinciding with the thickness direction of the chip component) gradually decreases, and in the width direction of the chip 11, the width of the inclined surface 211 gradually increases from the end away from the main heat exchange part 112 to the end close to the main heat exchange part 112, so the width of the transition cooling section gradually increases, so the cross-sectional area of ​​the transition cooling section is avoided to change greatly or the cross-sectional area of ​​the transition cooling section is avoided, thereby ensuring the uniformity of the flow of the cooling fluid.

[0057] like Figure 7 As shown, based on the above embodiment, a reinforcement protrusion 40 is further provided in the end lead-in cooling section 21. In this embodiment, the reinforcement protrusion 40 can improve the strength of the end lead-in cooling section 21. The height of the reinforcement protrusion 40 can be less than half the height of the end lead-in cooling section 21.

[0058] like Figures 1 to 7 As shown, the side of the main heat exchange portion 112 away from the fluid inlet end 111 is connected to a fluid outlet end 113, which is connected to a cooling fluid outlet 117 and a to-be-cooled fluid outlet 118. The cooling channel 20 includes an end outlet cooling section 23 connected to the main cooling section 22 away from the end outlet cooling section 23. The cooling fluid outlet 117 is connected to the end outlet cooling section 23, and the to-be-cooled fluid outlet 118 is connected to the to-be-cooled channel 30. Optionally, the chip 11 is structurally symmetrical for ease of use.

[0059] like Figure 8 and Figure 9As shown, the present invention provides a heat exchanger comprising a fluid conduit 50 and a heat exchange core 60 according to any of the above-described technical solutions. The fluid conduit 50 includes a cooling fluid inlet conduit 51 and a to-be-cooled fluid inlet conduit 52. The cooling fluid inlet conduit 51 communicates with the cooling fluid inlet 114 of the outermost chip 11, while the to-be-cooled fluid inlet conduit 52 communicates with the to-be-cooled fluid inlet 115 of the outer chips 11. The heat exchanger of an embodiment of the present invention, comprising the heat exchange core 60 according to any of the above-described technical solutions, thus possesses all the beneficial technical effects of the heat exchange core 60 and will not be further elaborated herein.

[0060] The cooling fluid introduction pipe 51 and the to-be-cooled fluid introduction pipe 52 can be independently provided, or alternatively, they can be integrally formed, which has a simple and compact structure.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will understand that the technical solutions described in the aforementioned embodiments may still be modified, or some or all of the technical features therein may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention. In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description. In addition, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments.

Claims

1. A heat exchange core, characterized in that: include: A plurality of stacked chip assemblies, wherein two adjacent chip assemblies are spaced apart to form a cooling channel; the chip assembly comprises two chips arranged opposite to each other, and a cooling channel is formed between the two chips; The chip includes a main heat exchange part and a fluid introduction end connected to one end of the main heat exchange part, the fluid introduction end is provided with a cooling fluid inlet and a to-be-cooled fluid inlet, and the cooling fluid inlet is arranged on the side of the to-be-cooled fluid away from the main heat exchange part; the cooling flow channel includes an end introduction cooling section and a main cooling section that are interconnected, the cooling fluid inlet is connected to the end introduction cooling section, and the to-be-cooled fluid inlet is connected to the to-be-cooled flow channel.

2. The heat exchange core according to claim 1, characterized in that: The fluid inlet end of the chip is provided with a guide rib, and the guide rib is located on the side of the inlet of the fluid to be cooled close to the main heat exchange part; the guide rib is arranged in a V shape, and the middle part of the guide rib is arranged close to the main heat exchange part.

3. The heat exchange core according to claim 1, characterized in that: The chip further includes an auxiliary cooling fluid inlet, which is arranged on a side of the fluid inlet to be cooled close to the main heat exchange portion; in the width direction of the chip, the auxiliary cooling fluid inlet is provided at least in the middle portion of the chip.

4. The heat exchange core according to claim 3, characterized in that: The auxiliary cooling fluid inlet is arranged at the fluid introduction end; in the length direction of the chip, the edge of the auxiliary cooling fluid inlet close to the main heat exchange part does not protrude from the edge of the fluid to be cooled inlet close to the main heat exchange part.

5. The heat exchange core according to claim 1, characterized in that: The connection between the fluid introduction end and the main heat exchange part is arranged in an inclined surface, and in the two chips of the same chip assembly, the end of the inclined surface of one chip close to the main heat exchange part is arranged away from the other chip.

6. The heat exchange core according to claim 5, characterized in that: In the width direction of the chip, the width of the inclined surface gradually increases from an end away from the main heat exchange portion to an end close to the main heat exchange portion.

7. The heat exchange core according to claim 5, characterized in that: A reinforcing protrusion is provided in the cooling channel section of the fluid introduction end.

8. The heat exchange core according to any one of claims 1 to 7, characterized in that: The side of the main heat exchange part away from the fluid inlet end is connected to a fluid outlet end, and the fluid outlet end is connected to a cooling fluid outlet and a fluid outlet to be cooled; the cooling flow channel includes an end outlet cooling section connected to the main cooling section away from the end introduction cooling section, the cooling fluid outlet is connected to the end outlet cooling section, and the fluid outlet to be cooled is connected to the flow channel to be cooled.

9. A heat exchanger, characterized in that: include: A fluid pipeline and a heat exchange core as described in any one of claims 1 to 8, wherein the fluid pipeline includes a cooling fluid introduction pipeline and a to-be-cooled fluid introduction pipeline, the cooling fluid introduction pipeline is connected to the cooling fluid inlet of the outermost chip, and the to-be-cooled fluid introduction pipeline is connected to the to-be-cooled fluid inlet of the outermost chip.

10. The heat exchanger according to claim 9, characterized in that The cooling fluid introduction pipe and the to-be-cooled fluid introduction pipe are integrally formed.

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