Semiconductor manufacturing system, substrate displacement assembly and method for processing semiconductor substrate

Abstract

Embodiments of the present invention relate to a semiconductor manufacturing system, a substrate displacement assembly, and a method for processing a semiconductor substrate. A substrate displacement assembly is disclosed to improve the durability of the substrate displacement assembly during semiconductor processing. In one embodiment, a semiconductor manufacturing system includes: a substrate support, wherein the substrate support is configured to have a plurality of pins; and a substrate displacement assembly for displacing a substrate on the substrate support in a first direction perpendicular to a top surface of the substrate support by the plurality of pins, wherein the substrate displacement assembly includes a pair of loading forks, a coupling, and a drive shaft, wherein the pair of loading forks includes a fork region and a base region, wherein the coupling is mechanically coupled to the base region by at least one first coupling screw extending in the first direction, wherein the coupling is also mechanically coupled to the drive shaft by a second coupling screw extending in the first direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor manufacturing system, a substrate displacement assembly for displacing a substrate on a substrate support, and a method for processing a semiconductor substrate. Background Art

[0002] In the semiconductor integrated circuit (IC) industry, there is a constant demand for smaller device sizes and higher circuit packing density. This demand drives the semiconductor industry to develop new materials and complex processes. For example, when features are to be formed on a wafer (e.g., gate / drain / source features of a transistor, horizontal interconnects, or vertical vias, etc.), the wafer typically passes through a mechanism including multiple processing stations, which typically use different process tools to perform various operations such as (for example) cleaning, photolithography, dielectric deposition, dry / wet etching, and metal deposition. However, the mechanisms used to lift and move the substrate in the processing stations often face frequent mechanical failures that affect manufacturing yields. Therefore, existing mechanisms are not completely satisfactory. Summary of the invention

[0003] An embodiment of the present invention provides a semiconductor manufacturing system comprising: a substrate support, wherein the substrate support is configured to have a plurality of pins; and a substrate displacement assembly for displacing a substrate on the substrate support in a first direction perpendicular to a top surface of the substrate support through the plurality of pins, wherein the substrate displacement assembly comprises a pair of loading forks, a coupling and a drive shaft, wherein the pair of loading forks comprises a fork region and a base region, wherein the coupling is mechanically coupled to the base region by at least one first coupling screw extending in the first direction, and wherein the coupling is also mechanically coupled to the drive shaft by a second coupling screw extending in the first direction.

[0004] An embodiment of the present invention provides a substrate displacement assembly for displacing a substrate on a substrate support, comprising: a pair of loading forks, wherein the pair of loading forks include a fork region and a base region; a coupling member, wherein the coupling member includes a flange region and a pipe region, wherein the coupling member is mechanically coupled to the base region by at least one first coupling screw extending in a first direction; and a drive shaft, wherein the drive shaft is mechanically coupled to the coupling member by a second coupling screw extending in the first direction.

[0005] An embodiment of the present invention provides a method for processing a semiconductor substrate: assembling a substrate displacement assembly; using the substrate displacement assembly to displace a substrate in a first direction; and performing a semiconductor manufacturing process on the substrate, wherein the substrate displacement assembly includes a pair of loading forks, a coupling and a drive shaft, wherein the pair of loading forks include a fork area and a base area, wherein the coupling includes a flange area and a channel area, wherein the coupling is mechanically coupled to the base area by at least one first coupling screw extending in the first direction; and wherein the drive shaft is mechanically coupled to the coupling by a second coupling screw extending in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The various aspects of the present disclosure can be best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that the various features are not necessarily drawn to scale. In fact, the size and geometry of the various features may be arbitrarily increased or decreased for clarity of description.

[0007] Figure 1A An exemplary block diagram illustrating a semiconductor processing system according to some embodiments of the present disclosure.

[0008] Figure 1B An exemplary block diagram illustrating a local computer according to some embodiments of the present disclosure, which local computer can be used to implement the methods described herein.

[0009] Figure 2A An exemplary semiconductor processing system according to some embodiments of the present disclosure is described.

[0010] Figure 2B to Figure 2C Exemplary perspective and side views of a substrate displacement assembly according to some embodiments of the present disclosure are illustrated.

[0011] FIG. 3A to FIG. 3B Exemplary perspective, top, and side views of couplings according to some embodiments of the present disclosure are illustrated.

[0012] Figure 4 A flow chart illustrating a method of displacing a substrate during a semiconductor manufacturing process according to some embodiments of the present disclosure.

[0013] [Explanation of Symbols]

[0014] 100: Semiconductor processing systems / systems

[0015] 102-1: First processing station

[0016] 102-2: Second processing station

[0017] 102-3: Third processing station

[0018] 108: Connect

[0019] 110: Remote computer resources

[0020] 112: Controller / local computer

[0021] 112-1, 112-2, 112-3: Local computers

[0022] 122: Processor

[0023] 124: Memory

[0024] 126: Input / output interface

[0025] 128: Communication interface

[0026] 130: System bus

[0027] 200: Semiconductor processing systems

[0028] 202: Chamber

[0029] 204: Substrate support

[0030] 205: Temperature control / sensing unit

[0031] 206: Semiconductor wafer / semiconductor substrate

[0032] 208: Pin

[0033] 210: Substrate displacement assembly

[0034] 211A, 252: Inner diameter

[0035] 211B, 254: outer diameter

[0036] 212: Loading Fork

[0037] 214, 300: coupling

[0038] 216: Drive shaft

[0039] 218: Driving mechanism

[0040] 220: Opening

[0041] 222A: Base area

[0042] 222B: Fork area

[0043] 224, 238A, 316: incision area

[0044] 226A, 226B, 230A, 230B, 304-1, 304-2, 308: Mounting holes

[0045] 228, 306: Alignment pin

[0046] 232, 234: Joint screws

[0047] 236: Concave hole

[0048] 238B: Key

[0049] 240: First thickness

[0050] 242: Second thickness

[0051] 244: Thickness

[0052] 246, 250: diameter

[0053] 248: Gap distance

[0054] 256: Length

[0055] 302: Flange area

[0056] 310: Pipeline area

[0057] 312: First surface

[0058] 314: Second Surface

[0059] 400: Methods

[0060] 402, 404, 406: Action

[0061] AA': Hatch line

[0062] X, Y: direction DETAILED DESCRIPTION

[0063] The following disclosure sets forth various exemplary embodiments for implementing the different features of the subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, it should be understood that when an element is referred to as being "connected to" or "coupled to" another element, the element may be directly connected to or coupled to the other element, or one or more intermediary elements may be present.

[0064] The present disclosure provides various embodiments of methods and systems for lifting and moving substrates in a processing station with improved reliability. Thus, the above-mentioned problems can be advantageously avoided.

[0065] The description of the exemplary embodiments should be understood in conjunction with the figures in the accompanying drawings, which are considered a part of the entire written description. In the description, relative terms such as "lower", "upper", "horizontal", "vertical", "above", "below", "up", "down", "top", and "bottom" and their derivatives (e.g., "horizontally", "downwardly", "upwardly", etc.) should be interpreted in the discussion as referring to the orientation currently described or shown in the drawings. These relative terms are for convenience of description and do not require that the device be constructed or operated in a specific orientation.

[0066] Figure 1A An exemplary block diagram illustrating a semiconductor processing system 100 according to some embodiments of the present disclosure. It should be noted that the semiconductor processing system (hereinafter referred to as the "system") 100 is merely an example and is not intended to limit the present disclosure. Therefore, it should be understood that additional functional blocks may be provided in Figure 1A The semiconductor processing system 100 is coupled to Figure 1A The semiconductor processing system 100 is shown in FIG. 1 , and some other functional blocks may only be briefly described herein.

[0067] In the illustrated embodiment, the system 100 includes a plurality of processing stations for an integrated circuit (IC) manufacturing process, such as a first processing station 102-1, a second processing station 102-2, and a third processing station 102-3. Examples of IC manufacturing processes performed in the first processing station 102-1, the second processing station 102-2, and the third processing station 102-3 include cleaning, photolithography, wet etching, dry etching, dielectric deposition, metal deposition, and may include any other semiconductor processes known in the art. In some embodiments, the first processing station 102-1 is a photolithography station, the second processing station 102-2 is a plasma processing station; and the third processing station 102-3 is a deposition station. At least one feature may be formed in each of the first processing station 102-1, the second processing station 102-2, and the third processing station 102-3, including a photoresist pattern, a metal contact, an etched trench, an isolation member, a via structure / hole, an interconnect, etc.

[0068] Each of the first processing station 102-1, the second processing station 102-2, and the third processing station 102-3 includes a substrate holder (not shown) for holding a substrate during a semiconductor manufacturing process. In some embodiments, the substrate holder may include a plurality of pins. In some other embodiments, the substrate holder may also include at least one vacuum groove for fixing the substrate on the substrate holder. In some embodiments, the plurality of pins are configured on the substrate holder, and the plurality of pins may be lifted by a substrate displaying assembly configured at the bottom side of the substrate holder. In some embodiments, the substrate displaying assembly is configured on the bottom side of the substrate holder and below the substrate holder, wherein the position of the substrate displaying assembly may be controlled by a coupled driven shaft, and the plurality of pins may be selectively moved up and down to lift the substrate upward from the substrate holder or to lower the substrate to the substrate holder. In some embodiments, the substrate displaying assembly comprises an inert material, such as ceramic, graphite, etc.

[0069] In some embodiments, the substrate support may further include at least one temperature control / sensing unit 205. In some embodiments, the temperature control / sensing unit 205 includes at least one heating element, at least one cooling element, and at least one temperature sensing element.

[0070] In some embodiments, the heating element can be a Peltier device and / or a resistive heater, such as a polyimide heater, a silicone heater, a mica heater, a metal heater (e.g., W, Ni / Cr alloy, Mo or Ta), a ceramic heater (e.g., WC), a semiconductor heater, a carbon heater, or any other suitable type of heating element desired. The heating element can be implemented in various designs or configurations, such as a screen printed heater, a wirewound heater, an etched foil heater, or any other suitable design desired.

[0071] In some embodiments, a cooling element is configured in a vacuum chuck to control the temperature of the substrate support and thereby the temperature of the warped substrate. In some embodiments, an external refrigerator (not shown) may be used to cool the liquid coolant or gas coolant passing through the cooling element to achieve greater cooling, and the liquid coolant or gas coolant may be recirculated to achieve greater efficiency. The external refrigerator that cools and recirculates the coolant fluid may be controlled by a controller (hereinafter also referred to as a "local computer") 112. According to some embodiments, a faster cooling rate may be achieved if the coolant fluid is cooled to a temperature below the atmospheric temperature using an external refrigerator. In some embodiments, a cooling element may not be necessary. In some embodiments, the cooling element may be cryogenic.

[0072] In some embodiments, a temperature sensing element is configured in the substrate support for detecting the local temperature of the vacuum chuck through a temperature sensing circuit. This is particularly useful in regulating the temperature of the substrate with a desired time response. In some embodiments, different types of temperature sensing elements can be implemented according to the desired performance (e.g., detection range, sensitivity, accuracy, response time, repeatability, size, power consumption, cost, etc.), including contact temperature sensors and non-contact temperature sensors. In some embodiments, the contact temperature sensor can be a thermostat composed of two different metals (e.g., nickel, copper, tungsten, aluminum, etc.), a thermistor usually composed of a ceramic material (e.g., oxides of nickel, manganese, cobalt, etc.), a thin film resistive sensor usually composed of a thin high-purity conductive metal (e.g., platinum, copper, nickel, etc.), a thermocouple composed of two different metals (e.g., copper, iron, various metal alloys, etc.) and two junctions, a semiconductor junction sensor, an infrared radiation sensor, etc. In some embodiments, a heating element can also be used as a temperature sensing element.

[0073] The local computer 112-1, the local computer 112-2, and the local computer 112-3 are each coupled to a remote computer resource 110 via a connection 108. In some embodiments, the connection 108 may include an Ethernet cable, an optical fiber, a wireless communication medium, and / or other networks known in the art. In some embodiments, the remote computer resource 110 includes a computer network, one or more servers, multiple applications, and / or multiple data centers, which is generally referred to as a "cloud" or cloud computing. It should be understood that other connections and intermediate circuits may be deployed between the local computers 112-1, the local computers 112-2, and the local computers 112-3 associated with the first processing station 102-1, the second processing station 102-2, and the third processing station 102-3 and the remote computer resource 110 to facilitate interconnection. In some embodiments, the local computer 112 (e.g., the local computer 112-1, the local computer 112-2, and the local computer 112-3) configures processing conditions and provides control signals to the corresponding processing stations 102 (e.g., the first processing station 102-1, the second processing station 102-2, and the third processing station 102-3).

[0074] although Figure 1A The system 100 in the illustrated embodiment includes only three processing stations (a first processing station 102-1, a second processing station 102-2, and a third processing station 102-3), three local computers (a local computer 112-1 / a local computer 112-2 / a local computer 112-3), and one remote computer resource 110, but it should be understood that Figure 1A The embodiments are provided for illustration purposes only. System 100 may include any desired number of processing stations while still remaining within the scope of the present disclosure.

[0075] Figure 1B An exemplary block diagram illustrating a local computer 112 according to some embodiments of the present disclosure, which can be used to implement the methods described herein. It should be noted that the local computer 112 is merely an example and is not intended to limit the present disclosure. Therefore, it should be understood that additional functional blocks may be provided in Figure 1B in a computer device or coupled to Figure 1B The computer device of the local computer 112 may be omitted or briefly described in this article. It should also be noted that the functions provided in each of the components and modules of the local computer 112 may be combined or separated into one or more modules.

[0076] According to some embodiments, in the illustrated embodiment, the local computer 112 includes a processor 122, a memory 124, an input / output interface 126, a communication interface 128, and a system bus 130. The processor 122 may include any processing circuitry operable to control the operation of the processing station 102. In various aspects, the processor 122 may be implemented as a general purpose processor, a chip multiprocessor (CMP), a special purpose processor, an embedded processor, a digital signal processor (DSP), a network processor, an input / output (I / O) processor, a media access control (MAC) processor, a radio baseband processor, a co-processor, a microprocessor (e.g., a complex instruction set computer (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, and / or a very long instruction word (VLIW) microprocessor), or other processing device. The processor 122 may also be implemented by a controller, a microcontroller, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a programmable logic device (PLD), etc.

[0077] In various aspects, the processor 122 may be arranged to run an operating system (OS) and various applications. Examples of operating systems include, for example, operating systems commonly known by the trade names Apple OS, Microsoft Window OS, Android OS, and any other proprietary or open source operating system. Examples of applications include, for example, phone applications, camera (e.g., digital camera, video camera) applications, browser applications, multimedia player applications, game applications, messaging applications (e.g., email, text messages, multimedia), viewer applications, etc.

[0078] In some embodiments, at least one non-transitory computer-readable storage medium containing computer-executable instructions is provided, wherein when the at least one non-transitory computer-readable storage medium is executed by at least one processor, the computer-executable instructions cause the at least one processor to perform embodiments of the methods described herein. This computer-readable storage medium may be embodied as memory 124.

[0079] In some embodiments, the memory 124 may include any machine-readable or computer-readable medium capable of storing data, including volatile / non-volatile memory and removable / non-removable memory. The memory 124 may include at least one non-volatile storage unit. The non-volatile storage unit is capable of storing one or more software programs. The software programs may contain, for example, applications, user data, device data, and / or configuration data, or combinations thereof, to name a few examples. The software programs may contain instructions executable by various components of a robotic controller of a tray-handling system.

[0080] For example, the memory 124 may include a read-only memory (ROM), a random-access memory (RAM), a dynamic random access memory (DRAM), a double-data-rate dynamic random access memory (DDR-RAM), a synchronous dynamic random access memory (SDRAM), a static random access memory (SRAM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a flash memory (e.g., a NOR flash memory or a NAND flash memory), a content addressable memory (CAM), a polymer memory (e.g., a ferroelectric polymer memory), a phase change memory (e.g., an ovonic memory), a ferroelectric memory (e.g., an RF memory), a 3D-capable memory (e.g., a 3D-capable memory), a 4K-capable memory (e.g., a 4K-capable memory), a 2D-capable memory (e.g., a 3D-capable memory), a 4K-capable memory, a 2D-capable memory, a 3D-capable memory, a 4K-capable memory, a 2 ...4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a 4K-capable memory, a memory), silicon-oxide-nitride-oxide-silicon (SONOS) memory, disk memory (e.g., floppy disk, hard drive, optical disk, magnetic disk) or card (e.g., magnetic card, optical card), or any other type of medium suitable for storing information.

[0081] In one embodiment, the memory 124 may contain an instruction set in the form of a file for executing the method of generating one or more timing libraries described herein. The instruction set may be stored in any acceptable machine-readable instruction form, including source code or various suitable programming languages. Some examples of programming languages ​​that can be used to store the instruction set include, but are not limited to, Java, C, C++, C#, Python, object-oriented C language (Objective-C), visual language (Visual Basic) or network programming (.NET programming). In some embodiments, a compiler or interpreter is included to convert the instruction set into machine executable code executed by the processor.

[0082] In some embodiments, the I / O interface 126 may include any suitable mechanism or component to enable a user to provide input to the processing station 102 or to provide output to the user. For example, the I / O interface 126 may include any suitable input mechanism, including but not limited to a button, a keypad, a keyboard, a click wheel, a touch screen, or a motion sensor. In some embodiments, the I / O interface 126 may include a capacitive sensing mechanism or a multi-touch capacitive sensing mechanism (e.g., a touch screen).

[0083] In some embodiments, the I / O interface 126 may include a visual peripheral output device for providing a display visible to the user. For example, the visual peripheral output device may include a screen incorporated into the local computer 112, such as, for example, a liquid crystal display (LCD) screen. As another example, the visual peripheral output device may include a removable display or projection system for providing a content display on a surface away from the local computer 112. In some embodiments, the visual peripheral output device may include an encoder / decoder (also referred to as a codec) for converting digital media data into an analog signal. For example, the visual peripheral output device may include a video codec, an audio codec, or any other suitable type of codec.

[0084] The visual peripheral output device may also include a display driver, circuitry for driving the display driver, or both. The visual peripheral output device may be operable to display content under the direction of the processor. For example, the visual peripheral output device may be capable of playing media playback information, application screens of applications implemented on the computer device, information about ongoing communication operations, information about upcoming communication requests, or device operation screens (to name a few examples).

[0085] In some embodiments, the communication interface 128 may include any suitable hardware, software, or combination of hardware and software capable of coupling the local computer 112 to one or more networks and / or additional devices. The communication interface 128 may be arranged to operate with any suitable technology to control information signals using a desired set of communication protocols, services, or operating procedures. The communication interface 128 may include appropriate physical connections to connect to corresponding wired communication media or wireless communication media.

[0086] According to some embodiments, the communication system and the communication method include a network. In various aspects, the network may include: a local area network (LAN) and a wide area network (WAN), including but not limited to the Internet, a wired channel, a wireless channel; a communication device (including a telephone, a computer, wiring, a radio, an optical channel or other electromagnetic channel, and a combination thereof), which includes other devices and / or components capable of conveying data / associated with conveying data. For example, the communication environment includes in-body communication, various devices and various communication modes, such as wireless communication, wired communication and a combination thereof.

[0087] Wireless communication modes include any communication mode between multiple points (e.g., multiple nodes) that utilizes, at least in part, wireless technology (including various protocols and combinations of multiple protocols associated with wireless transmission, data, and devices). The multiple points include, for example, wireless devices (e.g., wireless headsets), audio and multimedia devices and equipment (e.g., audio players and multimedia players), phones (including mobile phones and cordless phones), and computers and computer-related devices and components (e.g., printers), network connection machinery (e.g., circuit generation systems), and / or any other suitable devices or third-party devices.

[0088] Wired communication modes include any communication mode between multiple points that utilizes wired technology (including various protocols and combinations of multiple protocols associated with wired transmission, data, and devices). The multiple points include, for example, devices such as audio and multimedia devices and equipment (e.g., audio players and multimedia players), phones (including mobile phones and cordless phones), and computers and computer-related devices and components (e.g., printers), network connection machinery, and / or any other suitable devices or third-party devices. In various embodiments, the wired communication module can communicate according to several wired protocols. Examples of wired protocols may include Universal Serial Bus (USB) communications, RS-232, RS-422, RS-423, RS-485 serial protocols, Fire Wire, Ethernet, Fibre Channel, Music Instrument Digital Interface (MIDI), Advanced Technology Attachment (ATA), Serial ATA, Peripheral Component Interconnect Express (PCI Express), T-1 (and variants), Industry Standard Architecture (ISA) parallel communications, Small Computer System Interface (SCSI) communications, or Peripheral Component Interconnect (PCI) communications (to name a few).

[0089] Thus, in various aspects, the communication interface 128 may include one or more interfaces such as, for example, a wireless communication interface, a wired communication interface, a network interface, a transmission interface, a reception interface, a media interface, a system interface, a component interface, a switch interface, a chip interface, a controller interface, etc. For example, when implemented by a wireless device or implemented within a wireless system, the communication interface may include a wireless interface including one or more antennas, transmitters, receivers, transceivers, amplifiers, filters, control logic, etc.

[0090] In various embodiments, the communication interface 128 may provide voice and / or data communication functionality according to a number of wireless protocols. Examples of wireless protocols may include various wireless local area network (WLAN) protocols, including the Institute of Electrical and Electronics Engineers (IEEE) 802.xx series of protocols, such as IEEE 802.11a / b / g / n, IEEE 802.16, IEEE 802.20, etc. Other examples of wireless protocols may include various wireless wide area network (WWAN) protocols, such as the Global System for Mobile Communication (GSM) cellular wireless telephone system protocol with General Packet Radio Service (GPRS), the Code Division Multiple Access (CDMA) cellular wireless telephone communication system with 1xRTT, the Enhanced Data Rate For GSM Evolution (EDGE) system, the Evolution-Data Optimized (EV-DO) system, the Evolution-Data Voice (EV-DV) system, the high speed downlink packet access (HSDPA) system, and the like. Other examples of wireless protocols may include wireless personal area network (PAN) protocols, such as infrared protocols; protocols from the Bluetooth Special Interest Group (SIG) family of protocols, including Bluetooth specification versions v1.0, v1.1, v1.2, v2.0 with Enhanced Data Rate (EDR); and one or more Bluetooth profiles, etc. Another example of a wireless protocol may include near-field communication technology and protocols, such as electromagnetic induction (EMI) technology. Examples of EMI technology may include passive or active radio-frequency identification (RFID) protocols and devices.Other suitable protocols may include Ultra Wide Band (UWB), Digital Office (DO), Digital Home, Trusted Platform Module (TPM), ZigBee, etc.

[0091] The system bus 130 couples the processor 122, the memory 124, the I / O interface 126, and the communication interface 128 to each other as necessary. The system bus 130 may be any of several types of bus structures, which may include a memory bus or memory controller; a peripheral bus or external bus; and / or a local bus using any type of available bus architecture, including but not limited to a 9-bit bus, Industry Standard Architecture (ISA), Micro-Channel Architecture (MCA), Extended ISA (EISA), Intelligent Drive Electronics (IDE), Video Electronics Standards Association (VESA) Local Bus (VLB), Personal Computer Memory Card International Association (PCMCIA) bus, Small Computer System Interface (SCSI) or other proprietary bus, or any custom bus suitable for computing device applications.

[0092] Figure 2A An exemplary semiconductor processing system 200 according to some embodiments of the present disclosure is illustrated. In the illustrated embodiment, the semiconductor processing system 200 includes a chamber 202, a substrate support 204, and a substrate displacement assembly 210. In some embodiments, the substrate support 204 is used in the chamber 202 to hold and secure a semiconductor wafer (hereinafter also referred to as a "semiconductor substrate") 206 during a semiconductor manufacturing process being performed. Examples of semiconductor manufacturing processes performed in the chamber 202 include at least one of the following: cleaning, photolithography, wet etching, dry etching, dielectric deposition, metal deposition, and any other semiconductor process known in the art. In some embodiments, the chamber 202 is used to deposit a semiconductor layer on the semiconductor substrate 206 using a chemical vapor deposition (CVD) process.

[0093] In the illustrated embodiment, the substrate support 204 includes a plurality of pins 208 extending from a top surface to a back surface of the substrate support 204. In some embodiments, each of the plurality of pins 208 may be one of the following: a retractable spring loaded guide pin, a self-contained pin, a through pin, and other types of pins known in the art. In some embodiments, each of the plurality of pins 208 is made of stainless steel, alumina, copper, plastic, or ceramic depending on the particular conditions of the semiconductor manufacturing process performed in the chamber 202. In the illustrated embodiment, the plurality of pins 208 disposed in the substrate support 204 may be activated by the back side of the substrate support 204 to lift the semiconductor substrate 206 upward from the substrate support 204 or to lower the semiconductor substrate 206 downward to the substrate support 204.

[0094] In the illustrated embodiment, a substrate displacement assembly 210 is disposed below the substrate support 204 to actuate the plurality of pins 208 in the y-direction. In the illustrated embodiment, the substrate displacement assembly 210 includes a pair of load forks 212, a coupler 214, a driving shaft 216, and a driving mechanism 218. In some embodiments, the pair of load forks 212 are coupled to the driving shaft 216 via the coupler 214, wherein the driving shaft 216 is further mechanically coupled to the driving mechanism 218. In some embodiments, the driving mechanism 218 is disposed outside the chamber 202. In some embodiments, the driving mechanism 218 includes a linear motor and a ball screw that can transform a rotational motion into a linear motion of the pair of load forks 212 in the y-direction.

[0095] Figure 2B to Figure 2CAn exemplary perspective view and side view (along section line AA' through opening 220) of a substrate displacement assembly 210 are illustrated in accordance with some embodiments of the present disclosure. In the illustrated embodiment, the substrate displacement assembly 210 includes a pair of loading forks 212, a coupling 214, and a drive shaft 216. In some embodiments, the pair of loading forks 212 have an inner diameter 211A and an outer diameter 211B. In some embodiments, the inner diameter 211A and the outer diameter 211B are configured to align with the substrate support 204 and the plurality of pins 208. In some embodiments, the pair of loading forks 212 have a unibody construction having a base region 222A and a fork region 222B. In some embodiments, the unibody construction of the pair of loading forks 212 is made of an inert material, such as ceramic, graphite, and plastic, to prevent the introduction of chemical contamination into the chamber 202 and the semiconductor manufacturing process.

[0096] In some embodiments, the base region 222A is a region configured to be mechanically assembled with the coupling 214. In some embodiments, the one-piece construction improves rigidity and reduces failures. In some embodiments, the base region 222A of the pair of loading forks 212 has a first thickness 240, and the fork region 222B of the pair of loading forks 212 has a second thickness 242. In some embodiments, the first thickness 240 is greater than the second thickness 242. In some embodiments, the first thickness is greater than 3 millimeters. In some embodiments, the first thickness 240 is 11.56 millimeters and the second thickness is 3.56 millimeters.

[0097] In the illustrated embodiment, the base region 222A includes two mounting holes 226A. In some embodiments, the base region 222A also includes two cutout regions 224. In some embodiments, each of the two mounting holes 226A extends from the top surface of the base region 222A to the rear surface for receiving a joining screw 234. In some embodiments, the joining screw 234 mechanically couples the pair of loading forks 212 to the coupling 214. In some embodiments, the rear surface of the base region 222A also includes two dent holes 236 for alignment purposes. In some embodiments, each of the two dent holes 236 has a bowl shape configured to receive an alignment pin 228 on the coupling 214.

[0098] In the illustrated embodiment, the coupling member 214 includes a flange region 302 ( Figure 3A) and tube region 310( Figure 3A ). In some embodiments, the flange area 302 has a circular shape, the diameter 246 of the flange area 302 is in the range of 40.0 mm to 45.0 mm and preferably 42.0 mm, and the thickness 244 of the flange area 302 is in the range of 4.0 mm to 6.0 mm and preferably 5.0 mm. In some embodiments, the flange area 302 further includes three mounting holes 226B and 230A, wherein the mounting holes 226B are aligned with the mounting holes 226A on the pair of loading forks 212 for receiving the engaging screws 234, and the mounting holes 230A are used to receive the engaging screws 232. In some embodiments, the mounting holes 230A extend from the top surface of the flange area 302 to the rear surface of the flange area 302 to receive the engaging screws 232, and the engaging screws 232 are used to mechanically couple the coupling 214 with the drive shaft 216. In some embodiments, after the coupling 214 is fully coupled with the drive shaft 216, the engaging screws 232 are flush with the top surface of the flange area 302. In some other embodiments, after the coupling 214 is fully coupled to the drive shaft 216 , the engagement screw 232 is below the top surface of the flange area 302 .

[0099] In some embodiments, the flange area 302 further includes two alignment pins 228, wherein the alignment pins 228 lock in position with the recessed holes 236 on the rear surface of the pair of loading forks 212 when the alignment pins 228 are aligned with the pair of loading forks 212. In some embodiments, the pipe area 310 below the flange area 302 has an inner diameter 252 in the range of 13.0 mm to 14.0 mm (preferably 13.8 mm), an outer diameter 254 in the range of 20.0 mm to 22.0 mm (preferably 21.0 mm), and a length 256 in the range of 25.0 mm to 26.0 mm (preferably 25.4 mm). In some embodiments, the pipe area 310 is coupled to the flange area 302 on a first end, and the pipe area 310 is configured to have a cutout area 238A on a second end for receiving a key 238B configured on a side wall of the drive shaft 216. In some embodiments, the coupling 214 is made of metal, such as aluminum or the like.

[0100] In the illustrated embodiment, the drive shaft 216 has a diameter 250 in the range of 12.0 mm to 13.0 mm, preferably 12.68 mm. In some embodiments, the drive shaft 216 includes a mounting hole 230B that aligns with the mounting hole 230A on the flange area 302 of the coupling 214 for receiving an engagement screw 232 to mechanically couple the coupling 214 to the drive shaft 216. In some embodiments, a clearance distance 248 between the inner wall of the conduit area 310 of the coupling 214 and the side wall of the drive shaft 216 is greater than 0.1 mm. In some embodiments, the clearance distance 248 is 0.65 mm. In some embodiments, the drive shaft 216 is made of metal, such as aluminum or the like.

[0101] FIG. 3A to FIG. 3B Exemplary stereoscopic, top, and side views of a coupling 300 according to some embodiments of the present disclosure are illustrated. In the illustrated embodiment, the coupling 300 includes a flange area 302 and a conduit area 310. In some embodiments, the flange area 302 has a circular shape. In some embodiments, the flange area 302 also includes three mounting holes 304-1, a mounting hole 304-2, and a mounting hole 308. In some embodiments, the mounting hole 308 is configured at the center of the flange area 302 and extends from a first surface 312 of the flange area 302 to a second surface 314. In some embodiments, the mounting hole 308 is configured to receive a coupling screw to mechanically couple the coupling 300 to a drive shaft. In some embodiments, the mounting hole 304-1 and the mounting hole 304-2 are configured to align with mounting holes on a pair of loading forks for receiving a coupling screw to mechanically couple the coupling 300 to the pair of loading forks. In some embodiments, the mounting holes 304-1 and 304-2 extend from the top surface (e.g., the first surface 312) of the flange region to the rear surface (e.g., the second surface 314) to receive the engagement screws 232, which are used to mechanically couple the coupling 214 to the drive shaft 216. In some other embodiments, the mounting holes 304-1 and 304-2 are configured on the first surface 312 and do not extend to the second surface 314. In the illustrated embodiment, the flange region 302 also includes two alignment pins 306 located on the first surface 312, and the two alignment pins 306 are configured to align with the recessed holes on the pair of loading forks.

[0102] In some embodiments, the conduit region 310 of the coupling 300 is coupled to the flange region 302 on a first end and is configured to have a cutout region 316 on a second end. In some embodiments, the cutout region 316 is configured to receive a key pin on a drive shaft. In some embodiments, the coupling 300 has an integrally formed construction. In some embodiments, the coupling 300 is made of metal, such as aluminum.

[0103] Figure 4 A flowchart illustrating a method 400 for displacing a substrate during a semiconductor manufacturing process according to some embodiments of the present disclosure. In some embodiments, the operations of the method 400 are performed by Figures 1A to 3B For the purpose of discussion, Figures 1A to 3B The following embodiment of method 400 is described. The illustrated embodiment of method 400 is merely an example for holding a warped substrate on a vacuum chuck during semiconductor processing. Therefore, it should be understood that any of the various operations may be omitted, reordered, and / or added and still be within the scope of the present disclosure.

[0104] Method 400 begins with operation 402, in which a substrate displacement assembly is assembled into a semiconductor manufacturing process chamber according to some embodiments. In some embodiments, the semiconductor manufacturing process chamber is located in a semiconductor processing station 102 for performing an IC manufacturing process, as described above with respect to Figure 1A Examples of IC manufacturing processes performed in the processing station include cleaning, photolithography, wet etching, dry etching, dielectric deposition, metal deposition, and any semiconductor process known in the art. In some embodiments, the substrate displacement assembly may include the substrate displacement assembly described above with respect to Figures 2A to 3B Features of the substrate displacement assembly 210 are described.

[0105] The method 400 continues to operation 404, where the substrate is displaced by the substrate displacement assembly 210 according to some embodiments. In some embodiments, after the semiconductor substrate 206 is loaded into the chamber 202 of the semiconductor manufacturing process, the semiconductor substrate 206 is transferred to the substrate support 204. In some embodiments, the semiconductor substrate 206 is supported by a plurality of pins 208 configured on the substrate support 204. In some embodiments, the semiconductor substrate 206 is then lowered onto the top surface of the substrate support 204 by lowering the plurality of pins 208 using the pair of loading forks 212. In some embodiments, the driving mechanism 218 controls the pair of loading forks 212 through the driving shaft 216 coupled to the coupling 214.

[0106] The method 400 continues to operation 406, where, according to some embodiments, a semiconductor fabrication process is performed on the semiconductor substrate 206. Examples of semiconductor fabrication processes performed in the chamber 202 include at least one of: cleaning, photolithography, wet etching, dry etching, dielectric deposition, metal deposition, and any other semiconductor process known in the art. In some embodiments, the chamber 202 is used to deposit a semiconductor layer on the semiconductor substrate 206 using a chemical vapor deposition (CVD) process.

[0107] The method 400 continues to operation 406, where the substrate is further displaced by the substrate displacement assembly 210, according to some embodiments. In some embodiments, after the semiconductor manufacturing process is completed on the semiconductor substrate 206, the semiconductor substrate 206 is then lifted from the substrate support 204 by the plurality of pins 208, wherein the plurality of pins 208 are pushed upward in the y-direction using the pair of loading forks 212 in the substrate displacement assembly 210. In some embodiments, the semiconductor substrate 206 is removed from the semiconductor manufacturing process chamber for further processing or measurement.

[0108] In one embodiment, a semiconductor manufacturing system includes: a substrate support, wherein the substrate support is configured to have a plurality of pins; and a substrate displacement assembly for displacing a substrate on the substrate support in a first direction perpendicular to a top surface of the substrate support through the plurality of pins, wherein the substrate displacement assembly includes a pair of loading forks, a coupling, and a drive shaft, wherein the pair of loading forks includes a fork region and a base region, wherein the coupling is mechanically coupled to the base region by at least one first engagement screw extending in the first direction, and wherein the coupling is also mechanically coupled to the drive shaft by a second engagement screw extending in the first direction.

[0109] In some embodiments, in the semiconductor manufacturing system, each of the plurality of pins extends outwardly from the top surface of the substrate support to the rear surface of the substrate support. In some embodiments, in the semiconductor manufacturing system, the first thickness of the base region is greater than the second thickness of the fork region. In some embodiments, in the semiconductor manufacturing system, the base region is configured to have at least one first mounting hole, wherein each of the at least one first mounting hole extends from the top surface of the base region to the rear surface of the base region, wherein the coupling member includes a flange region, wherein the flange region is configured to have at least one second mounting hole, wherein each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engagement screw. In some embodiments, in the semiconductor manufacturing system, the coupling member further includes a conduit region, wherein the conduit region is coupled to the flange region on a first end, wherein the conduit region further includes a cutout region on a second end, and wherein the conduit region is configured to receive the drive shaft. In some embodiments, in the semiconductor manufacturing system, the cutout region on the second end of the conduit region of the coupling member is aligned with a key on the drive shaft. In some embodiments, in the semiconductor manufacturing system, in a second direction perpendicular to the first direction, a gap distance between an inner wall of the pipe area of ​​the coupling member and a side wall of the drive shaft is greater than 0.1 mm.

[0110] In another embodiment, a substrate displacement assembly for displacing a substrate on a substrate support comprises: a pair of loading forks, wherein the pair of loading forks include a fork region and a base region; a coupling member, wherein the coupling member includes a flange region and a channel region, wherein the coupling member is mechanically coupled to the base region by at least one first coupling screw extending in a first direction; and a drive shaft, wherein the drive shaft is mechanically coupled to the coupling member by a second coupling screw extending in the first direction.

[0111] In some embodiments, in the substrate displacement assembly, the fork region of the pair of loading forks is configured to align with a plurality of pins extending outwardly from the top surface of the substrate support to the rear surface of the substrate support to push each of the plurality of pins in the first direction. In some embodiments, in the substrate displacement assembly, the first thickness of the base region is greater than the second thickness of the fork region. In some embodiments, in the substrate displacement assembly, the base region is configured to have at least one first mounting hole, wherein the flange region is configured to have at least one second mounting hole, wherein each of the at least one first mounting hole extends from the top surface of the base region to the rear surface of the base region, and wherein each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engagement screw. In some embodiments, in the substrate displacement assembly, the conduit region is coupled to the flange region on a first end, wherein the conduit region further includes a cutout region on a second end, and wherein the conduit region is configured to receive the drive shaft from the second end. In some embodiments, in the substrate displacement assembly, the cutout region on the second end of the conduit region of the coupling is aligned with a key on the drive shaft. In some embodiments, in the substrate displacement assembly, in a second direction perpendicular to the first direction, a gap distance between an inner wall of the conduit region of the coupling member and a side wall of the driving shaft is greater than 0.1 mm.

[0112] Furthermore, in another embodiment, a method for processing a semiconductor substrate is provided: assembling a substrate displacement assembly; displacing a substrate in a first direction using the substrate displacement assembly; and performing a semiconductor manufacturing process on the substrate, wherein the substrate displacement assembly comprises a pair of loading forks, a coupling, and a drive shaft, wherein the pair of loading forks comprises a fork region and a base region, wherein the coupling comprises a flange region and a channel region, wherein the coupling is mechanically coupled to the base region by at least one first coupling screw extending in the first direction; and wherein the drive shaft is mechanically coupled to the coupling by a second coupling screw extending in the first direction.

[0113] In some embodiments, in the method for processing a semiconductor substrate, the fork region of the pair of loading forks is configured to align with a plurality of pins extending outwardly from the top surface of the substrate support to the rear surface of the substrate support to push each of the plurality of pins in the first direction. In some embodiments, in the method for processing a semiconductor substrate, the first thickness of the base region is greater than the second thickness of the fork region. In some embodiments, in the method for processing a semiconductor substrate, the base region is configured to have at least one first mounting hole, the flange region is configured to have at least one second mounting hole, each of the at least one first mounting hole extends from the top surface of the base region to the rear surface of the base region, and each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engagement screw. In some embodiments, in the method for processing a semiconductor substrate, the conduit region is coupled to the flange region on a first end, the conduit region further includes a cutout region on a second end, the conduit region is configured to receive the drive shaft from the second end, and the cutout region on the second end of the conduit region of the coupling is aligned with a key on the drive shaft. In some embodiments, in the method for processing a semiconductor substrate, in a second direction perpendicular to the first direction, a gap distance between an inner wall of the pipe region of the coupling member and a side wall of the driving shaft is greater than 0.1 mm.

[0114] The foregoing summarizes the features of several embodiments so that those skilled in the art may better understand the various aspects of the present disclosure. Those skilled in the art will appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures to perform the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that these equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and modifications may be made herein without departing from the spirit and scope of the present disclosure.

[0115] In this document, the term "module" used herein refers to software, firmware, hardware, and any combination of these elements for implementing the associated functions described herein. In addition, for the purpose of discussion, various modules are described as discrete modules; however, it should be clear to those skilled in the art that according to embodiments of the present invention, two or more modules can be combined to form a single module that implements the associated functions.

[0116] It should be further understood by those skilled in the art that any of the various illustrative logical blocks, modules, processors, components, circuits, methods, and functions described in conjunction with the various aspects disclosed herein may be implemented by electronic hardware (e.g., digital implementations, analog implementations, or a combination of the two), firmware, various forms of programs or design code containing instructions (for convenience, may be referred to herein as "software" or "software modules"), or any combination of these technologies. To clearly illustrate this interchangeability of hardware, firmware, and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of functionality. Whether such functionality is implemented as hardware, firmware, or software, or as a combination of these technologies, depends on the specific application and the design constraints faced by the overall system. Those skilled in the art may implement the described functionality in various ways for each specific application, but such implementation decisions will not result in a departure from the scope of the present disclosure.

[0117] In addition, it should be understood by those skilled in the art that the various illustrative logic blocks, modules, devices, components, and circuits described herein may be implemented within or by an integrated circuit (IC), which may include a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device, or any combination thereof. The logic blocks, modules, and circuits may also include antennas and / or transceivers to communicate with various components within a network or within a device. The general purpose processor may be a microprocessor, but in an alternative, the processor may be any conventional processor, controller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a combination of multiple microprocessors, a combination of one or more microprocessors in combination with a DSP core, or any other suitable configuration to implement the functions described herein.

[0118] Unless otherwise specifically stated, conditional language such as "can / may", "could / might", etc., is understood within the context of common use to convey that certain embodiments include but other embodiments do not include certain features, elements, and / or steps. Thus, such conditional language is generally not intended to imply that one or more embodiments require features, elements, and / or steps in any way, or to imply that one or more embodiments must include logic for determining, with or without user input or prompting, whether such features, elements, and / or steps are included or will be performed in any particular embodiment.

[0119] In addition, after reading this disclosure, those skilled in the art will be able to configure functional entities to implement the operations described herein. The term "configured" used herein with respect to a specified operation or function refers to a system, device, component, circuit, structure, machine, etc. being physically or virtually constructed, programmed, and / or arranged to implement the specified operation or function.

[0120] Unless otherwise specifically stated, negative conjunction language such as the phrase "at least one of X, Y, or Z" is understood within the context of common use to present that an item, term, etc. can be X, Y, or Z, or any combination thereof (e.g., X, Y, and / or Z). Therefore, such negative conjunction language is generally not intended to, and should not, imply that certain embodiments require the presence of at least one of X, at least one of Y, or at least one of Z, respectively.

[0121] It should be emphasized that many changes and modifications may be made to the above-described embodiments, and the elements of these many changes and modifications should be understood as other acceptable examples. All these modifications and changes are intended to be included in the scope of this disclosure and protected by the accompanying claims.

Claims

1. A semiconductor manufacturing system, comprising: a substrate support, wherein the substrate support is configured with a plurality of pins; as well as a substrate displacement assembly for displacing the substrate on the substrate support in a first direction perpendicular to the top surface of the substrate support by means of the plurality of pins, The substrate displacement assembly comprises a pair of loading forks, a coupling and a driving shaft, wherein the pair of loading forks comprises a fork region and a base region, wherein the coupling is mechanically coupled to the base region by at least one first coupling screw extending in the first direction, wherein the coupling is also mechanically coupled to the driving shaft by a second coupling screw extending in the first direction, wherein the coupling also comprises a channel region, and in a second direction perpendicular to the first direction, a gap distance between an inner wall of the channel region of the coupling and a side wall of the driving shaft is greater than 0.1 mm. 2 . The semiconductor manufacturing system of claim 1 , wherein each of the plurality of pins extends outwardly from the top surface of the substrate support to a rear surface of the substrate support. 3 . The semiconductor manufacturing system of claim 1 , wherein a first thickness of the pedestal region is greater than a second thickness of the fork region.

4. A semiconductor manufacturing system according to claim 1, wherein the base area is configured to have at least one first mounting hole, wherein each of the at least one first mounting hole extends from the top surface of the base area to the rear surface of the base area, wherein the coupling member includes a flange area, wherein the flange area is configured to have at least one second mounting hole, wherein each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engaging screw.

5. The semiconductor manufacturing system of claim 4, wherein the conduit region is coupled to the flange region on a first end, wherein the conduit region further includes a cutout region on a second end, and wherein the conduit region is configured to receive the drive shaft.

6. The semiconductor manufacturing system of claim 5, wherein the cutout region on the second end of the conduit region of the coupling aligns with a key on the drive shaft. The semiconductor manufacturing system according to claim 1 , wherein the drive shaft is made of metal.

8. A substrate displacement assembly for displacing a substrate on a substrate support, comprising: a pair of loading forks, wherein the pair of loading forks comprises a fork region and a base region; a coupling member, wherein the coupling member includes a flange region and a conduit region, wherein the coupling member is mechanically coupled to the base region by at least one first engagement screw extending in a first direction; as well as a drive shaft, wherein the drive shaft is mechanically coupled to the coupling member by a second engagement screw extending in the first direction, Wherein in a second direction perpendicular to the first direction, a gap distance between an inner wall of the pipe area of ​​the coupling member and a side wall of the drive shaft is greater than 0.1 mm.

9. The substrate displacement assembly of claim 8, wherein the fork regions of the pair of loading forks are configured to align with a plurality of pins extending outwardly from a top surface of the substrate support to a rear surface of the substrate support to urge each of the plurality of pins in the first direction.

10. The substrate displacement assembly of claim 8, wherein a first thickness of the pedestal region is greater than a second thickness of the fork region.

11. A substrate displacement assembly according to claim 8, wherein the base region is configured to have at least one first mounting hole, wherein the flange region is configured to have at least one second mounting hole, wherein each of the at least one first mounting hole extends from a top surface of the base region to a rear surface of the base region, and wherein each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engagement screw.

12. The substrate displacement assembly of claim 8, wherein the conduit region is coupled to the flange region on a first end, wherein the conduit region further includes a cutout region on a second end, and wherein the conduit region is configured to receive the drive shaft from the second end.

13. The substrate displacement assembly of claim 12, wherein the cutout region on the second end of the conduit region of the coupling aligns with a key on the drive shaft.

14. The substrate displacement assembly of claim 8, wherein the drive shaft is made of metal.

15. A method for processing a semiconductor substrate, comprising: assembling a substrate displacement assembly; displacing a substrate in a first direction using the substrate displacement assembly; as well as performing a semiconductor manufacturing process on the substrate, wherein the substrate displacement assembly comprises a pair of loading forks, a coupling, and a drive shaft, wherein the pair of loading forks comprises a fork region and a base region, wherein the coupling comprises a flange region and a conduit region, wherein the coupling is mechanically coupled to the base region by at least one first engagement screw extending in the first direction; and wherein the drive shaft is mechanically coupled to the coupling by a second engagement screw extending in the first direction, Wherein in a second direction perpendicular to the first direction, a gap distance between an inner wall of the pipe area of ​​the coupling member and a side wall of the drive shaft is greater than 0.1 mm.

16. The method of claim 15, wherein the fork regions of the pair of loading forks are configured to align with a plurality of pins extending outwardly from a top surface of the substrate support to a rear surface of the substrate support to urge each of the plurality of pins in the first direction.

17. The method of claim 15, wherein a first thickness of the base region is greater than a second thickness of the prong region.

18. The method of claim 15, wherein the base region is configured to have at least one first mounting hole, wherein the flange region is configured to have at least one second mounting hole, wherein each of the at least one first mounting hole extends from a top surface of the base region to a rear surface of the base region, and wherein each of the at least one second mounting hole is aligned with each of the at least one first mounting hole to receive the at least one first engaging screw.

19. The method of claim 15, wherein the conduit region is coupled to the flange region on a first end, wherein the conduit region further comprises a cutout region on a second end, wherein the conduit region is configured to receive the drive shaft from the second end, and wherein the cutout region on the second end of the conduit region of the coupling is aligned with a key on the drive shaft.

20. The method of claim 15, wherein the drive shaft is made of metal.

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