Heat dissipation components and projectors

Abstract

The present application provides a heat dissipation assembly and projector. The heat dissipation assembly includes a first heat absorption module, a heat dissipation module, and a heat pipe. The surface of the first heat absorption module is adapted to conform to multiple heat-generating modules of the projector, each oriented in a different direction. The heat dissipation module and the first heat absorption module are spaced apart. One end of the heat pipe is connected to the first heat absorption module, and the other end of the heat pipe is connected to the heat dissipation module. The present application provides a heat dissipation assembly and projector that improve heat dissipation efficiency and assembly stability.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a heat dissipation component and a projector. Background Art

[0002] Projectors and other projectors have numerous heat-generating modules distributed on different sides, requiring multiple heat pipes to dissipate heat for each module. However, installing too many heat pipes not only occupies more space and hinders the miniaturization of the heat-generating modules, but also creates a greater bridging force between the heat pipes and the modules, leading to risks such as loose fit between the modules and components such as chips. Furthermore, the maximum energy that the heat pipes can absorb is limited, resulting in low heat dissipation efficiency. Therefore, research on heat dissipation components to improve the heat dissipation efficiency and assembly stability of projectors has become a technical issue that needs to be addressed. Summary of the Invention

[0003] The present application provides a heat dissipation component and a projector that improve heat dissipation efficiency and assembly stability.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation assembly, comprising:

[0005] a first heat absorbing module, wherein a surface of the first heat absorbing module is used to adhere to a plurality of heat generating modules on the projector facing in different directions;

[0006] a heat dissipation module, spaced apart from the first heat absorption module; and

[0007] A heat pipe, one end of the heat pipe is connected to the first heat absorption module, and the other end of the heat pipe is connected to the heat dissipation module.

[0008] In a possible implementation, the inner cavity of the first heat absorption module is connected to the inner cavity of the heat pipe.

[0009] In a possible implementation manner, the inner cavity of the heat pipe and the inner cavity of the first heat absorption module are both closed cavities.

[0010] In a possible implementation, the first heat absorption module is provided with at least one boss, and the boss is used to connect to the heat generation module via a heat conductive material.

[0011] In a possible embodiment, the boss has a boss inner cavity, and the boss inner cavity is communicated with the inner cavity of the first heat absorption module; or, the boss is protruding from the outer surface of the first heat absorption module.

[0012] In a possible embodiment, the heat dissipation module includes a plurality of first heat dissipation fins and a first fan, the plurality of first heat dissipation fins are arranged around the other end of the heat pipe, and the air outlet of the first fan is facing the plurality of first heat dissipation fins and the other end of the heat pipe.

[0013] In one possible embodiment, the heat dissipation assembly further includes a light modulation radiator, which includes a second fan, a second heat absorption module, and a plurality of second heat dissipation fins provided on the second heat absorption module. The second heat absorption module is used to contact the light modulation assembly of the projector. The air outlet of the second fan is directly opposite the plurality of second heat dissipation fins. The second heat absorption module is a temperature vapor chamber.

[0014] In a possible implementation manner, the first heat absorption module is U-shaped or L-shaped.

[0015] In a possible implementation, the first heat absorption module is a temperature vapor chamber.

[0016] On the other hand, an embodiment of the present application provides a projector, including a light source assembly and the above-mentioned heat dissipation assembly, wherein the light source assembly includes a plurality of light-emitting modules facing different sides, and the heat absorption module is attached to the plurality of light-emitting modules.

[0017] The heat dissipation assembly provided in the embodiment of the present application is configured to absorb heat from multiple heating modules on the projector facing different directions by providing a first heat absorption module. One end of the heat pipe is connected to the first heat absorption module, and the other end is connected to the heat dissipation module, so that the first heat absorption module absorbs heat from the heating modules it contacts and dissipates the heat into the air through the heat pipe and the heat dissipation module. Moreover, the present application designs the structure of the first heat absorption module so that the first heat absorption module can dissipate heat from different heating modules, and conducts heat through a smaller number of heat pipes, which can effectively avoid the need to provide multiple heat pipes to dissipate heat from different heating modules respectively. In this way, while heat dissipation from different heating modules is achieved, the number of heat pipes provided is reduced, thereby reducing the risk of loose fitting between the heating modules and devices such as chips due to the large bridging force between the heat pipes and the heating modules. It also solves the problem of low heat dissipation efficiency due to the limitation of the maximum energy that can be absorbed by the heat pipes, thereby improving the heat dissipation efficiency and assembly stability of the heat dissipation assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1This is a schematic structural diagram of a heat dissipation assembly provided in an embodiment of the present application;

[0020] Figure 2 This is a structural diagram of a projector provided in an embodiment of the present application;

[0021] Figure 3 yes Figure 2 A schematic diagram of a partial structure of a projector shown;

[0022] Figure 4 yes Figure 3 A schematic diagram of the structure inside the first heat absorption module is shown;

[0023] Figure 5 yes Figure 1 The structural schematic diagram of the heat dissipation component shown;

[0024] Figure 6 yes Figure 3 The partial cross section of the first heat absorption module is shown Figure 1 ;

[0025] Figure 7 yes Figure 3 The partial cross section of the second heat absorption module shown Figure 2 ;

[0026] Figure 8 yes Figure 5 The structural diagram of the heat dissipation component and the light emitting module shown;

[0027] Figure 9 yes Figure 3 A cross-sectional view of the first heat absorption module and the heat pipe shown;

[0028] Figure 10 yes Figure 3 A cross-sectional view of the second first heat absorption module and the heat pipe is shown;

[0029] Figure 11 yes Figure 2 A first partial schematic diagram of the projector shown;

[0030] Figure 12 yes Figure 11 A perspective view of the heat dissipation assembly shown;

[0031] Figure 13 yes Figure 3 A cross-sectional view of the third first heat absorption module shown;

[0032] Figure 14 yes Figure 2 A second partial schematic diagram of the projector shown;

[0033] Figure 15 yes Figure 14Another perspective view of the projector shown. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. In addition, reference to "embodiment" or "implementation method" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment or implementation method may be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] There are multiple heating modules in the projector. In the general heat dissipation structure, the heat pipe can only realize one-to-one heat transfer between the heating module and the heat dissipation structure, resulting in the need for multiple heat pipes to transfer heat to different heating modules respectively. Setting up more heat pipes will not only occupy a large space and be unfavorable for the miniaturization of the projector, but also make the bridging force between the heat pipe and the heating module larger, resulting in the risk of loose fitting between the circuit board of the heating module and devices such as the chip (or light-emitting unit); and the limitation of the maximum energy that the heat pipe can absorb leads to low heat dissipation efficiency.

[0036] See also Figure 1 This application provides a heat dissipation assembly 100 for a projector 1000 that improves heat dissipation efficiency and assembly stability. The heat dissipation assembly 100 includes a first heat absorption module 10, at least one heat pipe 20, and a heat dissipation module 30. The surface of the first heat absorption module 10 is configured to conform to multiple heat dissipation modules 200 of the projector 1000, each oriented in a different direction.

[0037] Optionally, the first heat absorption module 10 is bent. The first heat absorption module 10 is bent to form multiple heat absorption portions 110 facing in different directions. Very rapid heat exchange can be achieved between the different heat absorption portions 110, so that the temperatures of the multiple heat absorption portions 110 are similar or the same. The multiple heat absorption portions 110 are respectively used to absorb heat from different heating modules 200. Optionally, each heat absorption portion 110 is attached to a heating module 200 via a thermally conductive material, or each heat absorption portion 110 is attached to two or more heating modules 200 via a thermally conductive material to absorb heat from the heating modules 200.

[0038] See also Figure 1One end of the heat pipe 20 is connected to the first heat absorbing module 10, and the other end of the heat pipe 20 is connected to the heat dissipation module 30. The heat dissipation module 30 surrounds the other end of the heat pipe 20. Because the multiple heat absorbing portions 110 are integrated, rapid heat exchange can be achieved between the multiple heat absorbing portions 110. Thus, when one end of the heat pipe 20 is connected to any one of the multiple heat absorbing portions 110, the heat absorbed from the heating modules 200 by the multiple heat absorbing portions 110 can be transferred to the heat dissipation module 30. In other words, the heat of the multiple heating modules 200 is transferred to the multiple heat absorbing portions 110 respectively. The multiple heat absorbing portions 110 transfer the heat to the heat dissipation module 30 through one or more heat pipes 20, and then the heat is transferred to the air by the heat dissipation module 30, thereby releasing the heat and cooling the heating modules 200. In this embodiment, the number of heat pipes 20 is less than or equal to the number of heating modules 200. In this way, heat dissipation for multiple heating modules 200 can be achieved without a large number of heat pipes 20.

[0039] The heat dissipation component 100 provided in the embodiment of the present application is compared with each heating module 200 being provided with one or more heat pipes 20. On the one hand, the number of pipes is reduced, thereby avoiding the problem of a large space occupied by a large number of pipes in the projector; on the other hand, the heat absorption portion 110 and the heating module 200 are arranged in a surface-to-surface manner, and the multiple heat absorption portions 110 can be arranged around the circumference of the multiple heating modules 200. Such an arrangement can effectively reduce the bridging force between the heat absorption portion 110 and the heating module 200, thereby reducing the risk of separation between the chip and the substrate; on the third hand, the heat absorption portion 110 can be equivalent to the heat absorption part, and the heat absorption portion 110 and the heating module 200 are arranged in a surface-to-surface manner. The contact area between the heat dissipation component 100 and the heating module 200 is large. In other words, the heat dissipation The heat absorbing area of the thermal component 100 and the heating module 200 is large, so that the heat dissipation efficiency between the heat dissipation component 100 and the heating module 200 is high; fourthly, since the multiple sub-heat absorbing parts 110 are integrally formed, heat exchange can be quickly performed between two adjacent sub-heat absorbing parts 110, so that the temperature between different heating modules 200 remains relatively balanced; fifthly, since the maximum limit of heat absorption by the heat pipe 20 directly contacting the heating module 200 is low, when the heat generation of the heating module 200 increases, more heat pipes 20 are required for heat transfer, resulting in an increase in the space required for the heat dissipation structure, and there is a greater risk in assembly. The first heat absorbing module 10 in the present application has a relatively large heat absorbing area, so the maximum limit of heat absorption by the first heat absorbing module 10 is high, which can meet the heat dissipation needs of the heating module 200 with a larger heat generation.

[0040] The heat dissipation assembly 100 provided in the embodiment of the present application is provided with a first heat absorption module 10 to absorb heat from a plurality of heat-generating modules 200 on the projector 1000 facing in different directions. One end of the heat pipe 20 is connected to the heat absorption portion 110, and the heat dissipation module 30 is connected to the circumference of the other end of the heat pipe 20. The first heat absorption module 10 absorbs heat from the heat-generating module 200 in contact with it and diffuses the heat into the air through the heat pipe 20 and the heat dissipation module 30. In addition, the present application designs the structure of the first heat absorption module 10 so that the first heat absorption module 10 includes a plurality of integrally formed heat absorption portions 110. These heat absorption portions 110 can be By dissipating heat for different heating modules 200 and conducting heat through a smaller number of heat pipes 20, it is possible to effectively avoid the need to set up multiple heat pipes 20 to dissipate heat for different heating modules 200 respectively. In this way, while achieving heat dissipation for different heating modules 200, the number of heat pipes 20 provided is reduced, thereby reducing the risk of loose fitting between the heating module 200 and devices such as chips due to a large bridging force between the heat pipe 20 and the heating module 200. It also solves the problem of low heat dissipation efficiency caused by the limitation of the maximum energy that the heat pipe 20 can absorb, thereby improving the heat dissipation efficiency and assembly stability of the heat dissipation component 100.

[0041] See also Figure 2 The projector 1000 includes a housing 300 and a light source assembly 400, a light modulation assembly 500, an optical lens assembly 600, and a heat dissipation assembly 100 disposed within the housing 300. The light source assembly 400 includes a plurality of light-emitting modules 410 for emitting light. The plurality of light-emitting modules 410 are disposed on different sides of the light modulation assembly 500. The plurality of light-emitting modules 410 are configured to emit light from different directions toward the light modulation assembly 500. The light modulation assembly 500 is configured to modulate the light emitted from the light source assembly 400 according to image information. The optical lens assembly 600 is configured to project the light modulated by the light modulation assembly 500.

[0042] See also Figure 3, this application is explained by taking the heating module 200 as the light-emitting module 410 as an example. For scenarios where the power consumption of multiple light-emitting modules 410 is different, for example, the power consumption of the first light-emitting module 411 is greater than the power consumption of the second light-emitting module 412 and the third light-emitting module 413, so the heat generated by the first light-emitting module 411 is greater than the heat generated by the second light-emitting module 412 and the third light-emitting module 413. The heat dissipation method through multiple heat pipes 20 cannot reduce the temperature of the first light-emitting module 411, the second light-emitting module 412 and the third light-emitting module 413 to a more balanced temperature. The temperature of the first light-emitting module 411 is greater than the temperature of the second light-emitting module 412 and the third light-emitting module 413, and when the temperature exceeds the design standard, the power consumption of the first light-emitting module 411 needs to be reduced, which results in a reduction in the brightness of the first light-emitting module 411. The reduction in the brightness of the first light-emitting module 411 is not conducive to the synthesis of the required light brightness and color, affecting the display effect.

[0043] The present embodiment provides a heat dissipation assembly 100 that can effectively dissipate heat from multiple heating modules 200 and achieve a substantially uniform temperature effect. When multiple heat-absorbing portions 110 absorb heat from different heating modules 200, even if the power consumption of different heating modules 200 varies, the multiple heat-absorbing portions 110 can rapidly exchange heat to achieve temperature uniformity. Therefore, the multiple heating modules 200 can maintain a relatively uniform temperature, thereby achieving appropriate luminance for each light-emitting module 410, promoting the desired brightness and color of the light, and improving the display effect.

[0044] Optional, see Figure 4 , the first heat absorption module 10 is a temperature equalizing plate. In order to distinguish it from other temperature equalizing plates in this article, the first heat absorption module 10 is defined as the first temperature equalizing plate. Specifically, the first heat absorption module 10 is in the shape of a sealed box. The appearance of the first heat absorption module 10 is similar to a copper plate, and the interior is a vacuum cavity. The first heat absorption module 10 includes a bottom plate 11, a top plate 12 and a side plate 13 connected to the sides of the bottom plate 11 and the top plate 12. The bottom plate 11, the top plate 12 and the side plate 13 surround a heat absorption cavity 14. The heat absorption cavity 14 is a vacuum cavity. Optionally, the bottom plate 11 and the top plate 12 are arranged opposite to each other. The side of the bottom plate 11 facing away from the top plate 12 is bonded to the heating module 200 by a thermally conductive material. Furthermore, the first heat absorption module 10 also includes a plurality of support columns 15 arranged at intervals, and the support columns 15 are supported between the bottom plate 11 and the top plate 12. The bottom plate 11 and the top plate 12 are both metal plates, such as copper plates, to increase the thermal conductivity. It should be noted that, Figure 4 The support column 15 does not separate the heat absorption chamber 14. The support column 15 is columnar, so the heat absorption chamber 14 is in an integrated through-state.

[0045] Optional, see Figure 4Capillary structures 16 are provided on the bottom plate 11, top plate 12, and support columns 15. Capillary structures 16 can be made of sintered metal powder, sintered metal mesh, metal foam, micro-channels, or other structures. A working fluid is provided within the heat absorption chamber 14. The working fluid includes, but is not limited to, water, fluorinated solvents such as fluorinated liquid, alcohols such as ethanol, and refrigerants such as R134a, R1234zd, and HP-1. The phase change (evaporation and condensation) of the working fluid allows rapid heat diffusion within the heat absorption chamber 14, achieving a two-dimensional temperature uniformity effect.

[0046] The liquid working medium at the heat source on bottom plate 11 evaporates due to heat, rapidly dissipating the heat throughout heat absorption chamber 14. The gaseous working medium then condenses on top plate 12, releasing heat and transferring the heat to the heat sink fins through top plate 12. The liquefied liquid working medium flows back to the heat source on bottom plate 11 through capillary forces within capillary structure 16, where it continues to vaporize due to heat. This completes the phase change cycle, evenly dissipating the heat from the heat source across the entire heat dissipation surface of the vapor chamber.

[0047] Compared to general heat-conducting structures, the heat-dissipating plate has an extremely high heat-dissipating rate, so the heat-dissipating plate can ensure temperature balance among the multiple heat-absorbing parts 110. Therefore, when the heat-absorbing parts 110 perform heat exchange with the multiple heating modules 200, the multiple heat-absorbing parts 110 can ensure that the multiple heating modules 200 have a high temperature uniformity. When the heating module 200 is a light-emitting module 410, the different light-emitting modules 410 can all operate at appropriate brightness, thereby improving the projection light efficiency of the projector 1000.

[0048] Of course, in other embodiments, the first heat absorption module 10 is not a temperature vapor chamber. For example, the first heat absorption module 10 is a vacuum copper cavity. A low-boiling-point working fluid is placed within the cavity. The working fluid undergoes phase change heat transfer within the cavity. Furthermore, the top plate 12 of the first heat absorption module 10 can be equipped with cooling fins that can be used in conjunction with a fan to dissipate heat from the top plate 12 and promote the liquefaction of the gaseous working fluid.

[0049] See also Figure 5 This application does not limit the number of times the first heat absorbing module 10 can be bent, that is, the number of heat absorbing portions 110 with different orientations formed by the bending of the first heat absorbing module 10 is not limited. Optionally, the number of heating modules 200 is two. The two heating modules 200 are a first heating module 210 and a second heating module 220. The first heating module 210 and the second heating module 220 are respectively disposed on different sides of the optical modulation assembly 500.

[0050] See also Figure 5 The first heat absorbing module 10 is bent once to form two heat absorbing portions 110 facing in different directions, which are respectively referred to as the first heat absorbing portion 101 and the second heat absorbing portion 102. Specifically, the first heat absorbing module 10 is L-shaped or V-shaped.

[0051] The first heat absorbing portion 101 and the second heat absorbing portion 102 dissipate heat from two heating modules 200 located on different sides, respectively. The inner cavity of the first heat absorbing portion 101 communicates with the inner cavity of the second heat absorbing portion 102, and the temperature distribution on the first heat absorbing portion 101 and the temperature distribution on the second heat absorbing portion 102 is uniform. The first heat absorbing portion 101 and the second heat absorbing portion 102 are respectively configured to contact (or adhere to) the first heating module 210 and the second heating module 220 via thermally conductive material, allowing the heat dissipation assembly 100 to dissipate heat from the first heating module 210 and the second heating module 220 located on different sides simultaneously. This heat dissipation assembly 100 has a simple structure, requires fewer pipes, and can evenly dissipate heat from the first heating module 210 and the second heating module 220, achieving high heat dissipation efficiency.

[0052] For details, please refer to Figure 6 After the first heat absorption module 10 is bent, the bottom plate 11 is bent to form a first bottom plate 111 and a second bottom plate 112 facing different sides, with the bending angle including but not limited to 90°. The top plate 12 is bent to form a first top plate 121 and a second top plate 122 facing different sides. The first top plate 121 corresponds to the first bottom plate 111. The second top plate 122 corresponds to the second bottom plate 112. The first top plate 121, the first bottom plate 111, and a portion of the heat absorption cavity between the first top plate 121 and the first bottom plate 111 form the first heat absorption portion 101. The second top plate 122, the second bottom plate 112, and another portion of the heat absorption cavity between the second top plate 122 and the second bottom plate 112 form the second heat absorption portion 102.

[0053] In other words, the first heat absorbing portion 101 and the second heat absorbing portion 102 are different modules formed on different sides of a box-shaped cavity after being bent. The working medium in the heat absorbing cavity 14 can flow freely between the first heat absorbing portion 101 and the second heat absorbing portion 102.

[0054] Optionally, the first heat absorbing portion 101 is closer to the heat dissipation module 30 than the second heat absorbing portion 102. One end of the heat pipe 20 is connected to the first heat absorbing portion 101, so that the heat pipe 20 has a relatively short length, reducing the transmission path of the vaporized heat dissipation medium and shortening the transmission path of the liquefied heat dissipation medium, thereby improving heat dissipation efficiency.

[0055] Optionally, the inner cavity of the first heat absorbing module 10 is connected to the inner cavity of the heat pipe 20. For example, the inner cavity of the heat pipe 20 is connected to the inner cavity of the first heat absorbing part 101 and the inner cavity of the second heat absorbing part 102. The other end of the heat pipe 20 is connected to the heat dissipation module 30.

[0056] The present application does not specifically limit the number of heat pipes 20. Optionally, the number of heat pipes 20 is two. Of course, in other embodiments, the number of heat pipes 20 is one, three, etc. When there are multiple heat pipes 20, one end of each of the multiple heat pipes 20 is connected to the first heat absorbing portion 101 or the second heat absorbing portion 102. Alternatively, one end of a portion of the multiple heat pipes 20 is connected to the first heat absorbing portion 101, and one end of another portion of the multiple heat pipes 20 is connected to the second heat absorbing portion 102.

[0057] Specifically, the heat pipe 20 uses evaporative cooling. The interior of the heat pipe 20 is pumped into a negative pressure state and filled with an appropriate liquid. This liquid has a low boiling point and is easy to evaporate. The wall of the heat pipe 20 has a liquid wick, which is made of a capillary porous material. The end of the heat pipe 20 connected to the first heat absorption module 10 is the evaporation end, and the end of the heat pipe 20 connected to the heat dissipation module 30 is the condensation end. When the evaporation end of the heat pipe 20 absorbs heat from the first heat absorption module 10, the liquid in the capillary evaporates rapidly, and the vapor flows to the condensation end of the heat pipe 20 under a small pressure difference, releasing heat and recondensing into liquid. The liquid then flows back to the evaporation end of the heat pipe 20 along the porous material by the action of capillary force, and the cycle continues to transfer heat from one end of the heat pipe 20 to the other end. This cycle is carried out quickly so that heat can be conducted continuously. The heat pipe 20 has an appearance similar to a copper tube, and has a vacuum cavity inside, which contains a capillary structure and a working fluid. The phase change (evaporation and condensation) of the working fluid is used to achieve rapid diffusion of heat in the cavity, thereby achieving a one-dimensional temperature uniformity effect.

[0058] In this embodiment, one end of the heat pipe 20 is connected to the first heat absorbing portion 101, and the other end of the heat pipe 20 is connected to the heat dissipation module 30, so as to conduct heat between the first heat absorbing portion 101 and the heat dissipation module 30. Because the first heat absorbing portion 101 and the second heat absorbing portion 102 are integral, the heat pipe 20 facilitates heat conduction between the first heat absorbing module 10 and the heat dissipation module 30.

[0059] See also Figure 7 The first heat absorbing module 10 is bent twice to form three heat absorbing parts 110 in different directions, which are respectively recorded as the first heat absorbing part 101, the second heat absorbing part 102 and the third heat absorbing part 103. Specifically, the first heat absorbing module 10 is U-shaped.

[0060] The bottom plate 11 is bent twice to form a first bottom plate 111, a second bottom plate 112, and a third bottom plate 113. The second bottom plate 112 and the third bottom plate 113 are disposed opposite to each other and are connected to opposite ends of the first bottom plate 111, respectively.

[0061] The top plate 12 is bent twice to form a first top plate 121, a second top plate 122, and a third top plate 123. The third top plate 123 is arranged opposite the third bottom plate 113. The third top plate 123, the third bottom plate 113, and a portion of the heat absorption cavity between the third top plate 123 and the third bottom plate 113 form the third heat absorption portion 103. The inner cavity of the third heat absorption portion 103, the inner cavity of the second heat absorption portion 102, and the inner cavity of the first heat absorption portion 101 are interconnected to form a heat absorption cavity 14. The third heat absorption portion 103 is used to contact the third heating module 230 (see Figure 5 ).

[0062] The first heat absorbing portion 101, the second heat absorbing portion 102, and the third heat absorbing portion 103 enclose a semi-enclosed receiving space. The receiving space is used to accommodate the light source assembly 400. Specifically, the first heat absorbing portion 101, the second heat absorbing portion 102, and the third heat absorbing portion 103 are respectively attached to the first heating module 210, the second heating module 220, and the third heating module 230 using thermally conductive material.

[0063] Optional, see Figure 3 and Figure 5 The multiple light-emitting modules 410 include a first light-emitting module 411, a second light-emitting module 412, and a third light-emitting module 413. The first light-emitting module 411, the second light-emitting module 412, and the third light-emitting module 413 are the first heating module 210, the second heating module 220, and the third heating module 230, respectively. The first light-emitting module 411, the second light-emitting module 412, and the third light-emitting module 413 emit red light, green light, and blue light, respectively. The first light-emitting module 411, the second light-emitting module 412, and the third light-emitting module 413 are respectively located on three sides of the light modulation component 500. In other words, the first light-emitting module 411, the second light-emitting module 412, and the third light-emitting module 413 are arranged around the light modulation component 500. The present application does not specifically limit the number of light-emitting modules 410. Of course, in other embodiments, the light-emitting module 410 further includes a fourth light-emitting module 414, wherein the fourth light-emitting module 414 emits at least one of red light, green light, and blue light. The fourth light emitting module 414 may be disposed on the same side as one of the first light emitting module 411 , the second light emitting module 412 , and the third light emitting module 413 .

[0064] This embodiment uses a projector 1000 equipped with a first light-emitting module 411, a second light-emitting module 412, and a third light-emitting module 413 as an example. For heat pipes 20 to dissipate heat from the first, second, and third light-emitting modules 411, 412, and 413, at least three heat pipes 20 are required to dissipate heat from each of the three light-emitting modules 410. The heat dissipation assembly 100 provided in this embodiment of the present application, by bending the first heat-absorbing module 10 to form multiple heat-absorbing portions 110 with different orientations, and attaching each heat-absorbing portion 110 to a light-emitting module 410 on each side, allows for uniform heat dissipation from the light-emitting modules 410 on the three sides with high heat dissipation efficiency. Furthermore, the internal cavities of the multiple heat-absorbing portions 110 are interconnected, allowing the multiple heat-absorbing portions 110 to be connected to the heat dissipation module 30 with fewer heat pipes 20. This simplifies the structure of the heat dissipation assembly 100 and occupies a small space.

[0065] See also Figure 8 The first light-emitting module 411 (shown as 210) includes a first substrate 211 and a first light-emitting unit 212 disposed on the first substrate 211. The first substrate 211 includes, but is not limited to, a circuit board. The first light-emitting unit 212 includes, but is not limited to, an LED lamp, etc. The connection method between the first substrate 211 and the first light-emitting unit 212 includes, but is not limited to, welding, etc. Similarly, the second light-emitting module 412 (shown as 220) includes a second substrate 221 and a second light-emitting unit 222 disposed on the second substrate 221. The third light-emitting module 413 (shown as 230) includes a third substrate 231 and a third light-emitting unit 232 disposed on the third substrate 231. The second light-emitting unit 222 and the third light-emitting unit 232 both include, but are not limited to, LED lamps, etc. The second substrate 221 and the third substrate 231 include, but are not limited to, a circuit board, etc. The first light-emitting unit 212, the second light-emitting unit 222, and the third light-emitting unit 232 are located on three sides of the light modulation assembly 500, and all emit light toward the light modulation assembly 500. The first substrate 211 is disposed on a side of the first light emitting unit 212 away from the optical modulation component 500 , the second substrate 221 is disposed on a side of the second light emitting unit 222 away from the optical modulation component 500 , and the third substrate 231 is disposed on a side of the third light emitting unit 232 away from the optical modulation component 500 .

[0066] Optional, see Figure 4 The first heat absorbing module 10 is provided with at least one boss 17, which is used to connect to the heat generating module 200 via a thermally conductive material. The boss 17 has a boss cavity that communicates with the inner cavity of the first heat absorbing module 10; alternatively, the boss 17 is protruding from the outer surface of the first heat absorbing module 10.

[0067] Specifically, a boss 17 is provided on the side of the first bottom plate 111 facing away from the first top plate 121. The boss 17 is used to connect the heating module 200 via a thermally conductive material. The boss 17 can be a solid heat-conducting block welded or integrally formed on the side of the first bottom plate 111 facing away from the first top plate 121. The boss 17 can also be formed by a portion of the first bottom plate 111 protruding toward the side facing away from the first top plate 121. The boss 17 has an inner cavity that communicates with the inner cavity of the first heat absorption module 10.

[0068] This application does not limit the number of bosses 17. Optionally, the first heat absorbing portion 101 includes a first boss connected to the first substrate 211 of the first light-emitting module 411 via a thermally conductive material. The second heat absorbing portion 102 includes a second boss connected to the second substrate 221 of the second light-emitting module 412 via a thermally conductive material. The third heat absorbing portion 103 includes a third boss connected to the third substrate 231 of the third light-emitting module 413 via a thermally conductive material.

[0069] Optionally, the first heating module 210 is protruding from the side of the optical modulation assembly 500, and the heat absorbing portion 110 is provided with a groove that mates with the heating module 200. At least a portion of the heating module 200 is disposed within the groove. Optionally, the first heat absorbing portion 101, the second heat absorbing portion 102, and the third heat absorbing portion 103 are provided with grooves corresponding to the first heating module 210, the second heating module 220, and the third heating module 230, respectively. The above design of the heat absorbing portion 110, on the one hand, enables the heat absorbing portion 110 to serve as a heat dissipation structure while also being structurally complementary to the heating module 200, thereby improving the compactness of the assembled structure and improving the assembly firmness; on the other hand, it can increase the contact area between the heating module 200 and the heat absorbing portion 110, thereby improving the heat dissipation efficiency of the heating module 200; on the other hand, a protrusion is formed between the grooves of two adjacent heat absorbing portions 110. When the light emitting module 410 (i.e., the heating module 200) is arranged in the groove, the protrusion between the two adjacent heat absorbing portions 110 can block light between the two adjacent light emitting modules 410, thereby preventing the light emitted by the two adjacent light emitting modules 410 from crosstalking with each other.

[0070] See also Figure 9, the inner cavity of the first heat absorption module 10 is connected to the inner cavity of the heat pipe 20. Specifically, one end of the heat pipe 20 is connected to the top plate 12 of the first heat absorption part 101. If the first heat absorption module 10 is a temperature equalizing plate, the capillary structure inside the heat pipe 20 is continuous with the capillary structure 16 on the first heat absorption part 101. A portion of the gas working medium in the heat absorption cavity 14 in the first heat absorption module 10 can be condensed and liquefied on the top plate 12 and circulated to the bottom plate 11, and the other portion of the gas working medium flows to the heat dissipation module 30 through the heat pipe 20, and is cooled and liquefied at the condensation end of the heat pipe 20, and flows back to the bottom plate 11 through the capillary structure in the heat pipe 20 and the capillary structure 16 of the heat absorption part 110, and then liquefied and circulated again to dissipate heat. In other words, the above has two heat dissipation paths, and these two heat dissipation paths reinforce each other, thereby improving the heat dissipation efficiency of the heat dissipation component 100 for the heat generation module 200.

[0071] Optional, see Figure 10 The inner cavity of the heat pipe 20 is spaced apart from the inner cavity of the first heat absorption module 10. In other words, the inner cavities of the heat pipe 20 and the first heat absorption module 10 are both closed cavities. In this way, independent circulation occurs within the heat absorption cavity 14 and the heat pipe 20, and the heat pipe 20 can further dissipate heat from the first heat absorption module 10, thereby improving heat dissipation efficiency. In other words, the first heat absorption module 10 not only serves as an independent heat dissipation structure but also serves as a heat conduction module for the heat pipe 20 to dissipate heat.

[0072] See also Figure 11 The heat dissipation module 30 includes a plurality of first heat dissipation fins 31 and a first fan 32. The plurality of first heat dissipation fins 31 are arranged around the other end of the heat pipe 20. The plurality of first heat dissipation fins 31 are arranged in parallel and spaced apart. The other end of the heat pipe 20 passes through the plurality of first heat dissipation fins 31 so that the other end of the heat pipe 20 can fully contact the plurality of first heat dissipation fins 31. The air outlet of the first fan 32 is directly facing the plurality of first heat dissipation fins 31 and the other end of the heat pipe 20 to dissipate heat from the other end of the heat pipe 20, causing the gas working medium to cool down and liquefy at the other end of the heat pipe 20.

[0073] Optional, see Figure 12 The height of the other end of the heat pipe 20 is greater than the height of one end of the heat pipe 20, so that the liquid working medium at the other end of the heat pipe 20 can flow back to one end of the heat pipe 20 under the action of gravity, thereby increasing the circulation speed of the working medium and improving the heat dissipation rate of the heat dissipation component 100.

[0074] See also Figure 13One end of the heat pipe 20 is connected to the first heat absorbing portion 101. The second top plate 122 is inclined relative to the second bottom plate 112, and the distance between the end of the second top plate 122 closer to the first top plate 121 and the second bottom plate 112 is greater than the distance between the end of the second top plate 122 farther from the first top plate 121 and the second bottom plate 112. Since the diameter of the end of the second top plate 122 away from the first top plate 121 is small, and the diameter of the end of the second top plate 122 close to the first top plate 121 is large, the steam pressure at the end of the second top plate 122 away from the first top plate 121 is relatively large at certain times. Subsequently, the steam in the second heat absorbing part 102 will quickly move toward the first heat absorbing part 101 under the push of the air pressure at the bottom, thereby accelerating the heat exchange between the first heat absorbing part 101 and the second heat absorbing part 102, and improving the temperature uniformity effect of the first heat absorbing module 10; it also enables the steam in the second heat absorbing part 102 to flow to the interface where the heat pipe 20 is connected to the first heat absorbing part 101 as quickly as possible, and then flow into the heat pipe 20 as quickly as possible.

[0075] Furthermore, as the second bottom plate 112 approaches the first bottom plate 111, the second top plate 122 assembly moves away from the second bottom plate 112. That is, as the second bottom plate 112 approaches the first bottom plate 111, the steam pressure gradually decreases.

[0076] In this embodiment, the diameter of the heat absorption cavity 14 in the second heat absorption portion 102 is designed to form a specially shaped second heat absorption portion 102. This guides the steam in the second heat absorption portion 102 so that the steam flows quickly to the first heat absorption portion 101, so that the heat pipe 20 connected to the first heat absorption portion 101 can also dissipate heat from the second heat absorption portion 102.

[0077] Optionally, the distance between the first bottom plate 111 and the first top plate 121 may be equal to the distance between the end of the second top plate 122 close to the first top plate 121 and the second bottom plate 112 , so that the steam in the second heat absorption part 102 can flow quickly to the first heat absorption part 101 .

[0078] Further, see Figure 13 The distance between the end of the third top plate 123 close to the first top plate 121 and the third bottom plate 113 is greater than the distance between the end of the third top plate 123 away from the first top plate 121 and the third bottom plate 113 .

[0079] Of course, in other embodiments, one end of the heat pipe 20 is connected to the second heat absorbing portion 102. The distance between the end of the first top plate 121 close to the second top plate 122 and the second bottom plate 112 is greater than the distance between the end of the first top plate 121 away from the second top plate 122 and the first bottom plate 111.

[0080] See also Figure 14 and Figure 15The projector 1000 also includes a light modulation component 500. The light modulation component 500 is located at the light outlet of the light source component 400. The heat dissipation component 100 also includes a light modulation heat sink 700. The light modulation heat sink 700 includes a second fan 710, a second heat absorption module 720, and a plurality of second heat dissipation fins 730 provided on the second heat absorption module 720. The second heat absorption module 720 contacts the light modulation component 500 and is used to dissipate heat from the light modulation component 500. The second temperature absorbing plate 720 is bonded to the light modulation component 500 by a thermally conductive material. The air outlet of the second fan 710 faces the plurality of second heat dissipation fins 730, and the second heat absorption module 720 is a temperature absorbing plate. The above are some embodiments of the present application. It should be noted that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A heat dissipation component for a projector, characterized in that: Applied to a projector, the projector includes a plurality of first heating modules, second heating modules, and third heating modules facing different sides, and the heat dissipation component includes: a first heat absorbing module, wherein the first heat absorbing module is bent to form a plurality of first heat absorbing parts, a second heat absorbing part, and a third heat absorbing part facing in different directions, wherein a surface of the first heat absorbing part is used to adhere to the first heat-generating module, a surface of the second heat absorbing part is used to adhere to the second heat-generating module, and a surface of the third heat absorbing part is used to adhere to the third heat-generating module; the first heat absorbing part, the second heat absorbing part, and the third heat absorbing part are respectively provided with grooves corresponding to the first heat-generating module, the second heat-generating module, and the third heat-generating module, a bulge is formed between the grooves of two adjacent heat absorbing parts, the second top plate of the second heat absorbing part is inclined relative to the second bottom plate of the second heat absorbing part, and the distance between an end of the second top plate of the second heat absorbing part close to the first top plate of the first heat absorbing part and the second bottom plate of the second heat absorbing part is greater than the distance between an end of the second top plate away from the first top plate and the second bottom plate; a heat dissipation module, spaced apart from the first heat absorption module; and A heat pipe, wherein the inner cavity of the first heat absorption module is connected to the inner cavity of the heat pipe, one end of the heat pipe is connected to the top plate of the first heat absorption part, and the other end of the heat pipe is connected to the heat dissipation module.

2. The heat dissipation assembly according to claim 1, wherein: The first heat absorption module is provided with at least one boss, and the boss is used to connect to the heat generation module through a heat conductive material.

3. The heat dissipation assembly according to claim 2, wherein: The boss has a boss inner cavity, which is communicated with the inner cavity of the first heat absorption module; or, the boss is protruding from the outer surface of the first heat absorption module.

4. The heat dissipation assembly according to claim 1, wherein: The heat dissipation module includes a plurality of first heat dissipation fins and a first fan. The plurality of first heat dissipation fins are arranged around the other end of the heat pipe, and the air outlet of the first fan faces the plurality of first heat dissipation fins and the other end of the heat pipe.

5. The heat dissipation assembly according to claim 1, wherein: The heat dissipation assembly further includes a light modulation heat sink, which includes a second fan, a second heat absorption module, and a plurality of second heat dissipation fins provided on the second heat absorption module. The second heat absorption module is configured to contact the light modulation assembly of the projector. The air outlet of the second fan faces the plurality of second heat dissipation fins. The second heat absorption module is a temperature vapor chamber.

6. The heat dissipation assembly according to any one of claims 1 to 5, wherein: The first heat absorption module is U-shaped or L-shaped.

7. The heat dissipation assembly according to any one of claims 1 to 5, wherein: The first heat absorption module is a temperature distribution plate.

8. A projector, characterized in that: It comprises a light source assembly and the heat dissipation assembly according to any one of claims 1 to 7, wherein the light source assembly comprises a plurality of light-emitting modules facing different sides, and the heat absorption module is attached to the plurality of light-emitting modules.

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