Metal conductive film, manufacturing method, touch panel and electronic product

Abstract

The present invention provides a metal conductive film, comprising at least two metal mesh layers with the same routing form and located in the same plane, and arranged superimposed at the joints to form a continuous routing, wherein the base of the metal mesh layer is formed with a split portion extending along the original routing for splicing, and the split portions are superimposed to form a joint for achieving continuous conduction between the metal mesh layers to be spliced, and the joint includes an irregular area formed by the superimposed arrangement of the split portion and the base, which is different from the pattern of the original metal mesh layer. The present invention also discloses a method for manufacturing a metal conductive film, a touch panel, and an electronic product. When preparing a large-size metal conductive film, the present invention can utilize multiple metal mesh layers for splicing, specifically, utilizing the split portions of the metal mesh layers to be spliced ​​to be superimposed to form a continuously conductive joint, thereby ensuring that a continuously conductive whole is formed between the mesh layers, thereby ensuring the quality of splicing.

Description

Technical Field

[0001] The present invention relates to the technical field of metal conductive films, and in particular to a metal conductive film, a manufacturing method, a touch panel and an electronic product. Background Art

[0002] Transparent conductive film is a thin film with high transparency and conductive properties in the visible light range. It is primarily used in optoelectronic devices such as transparent electrodes for liquid crystal displays, touch screens, and thin-film solar cells. Currently, the technology for using metal mesh to produce transparent conductive films with dimensions under 600mm*600mm is highly mature. However, due to limitations in existing equipment, the production of integrated metal mesh transparent conductive films with dimensions larger than 600mm*600mm is not feasible. Existing equipment cannot directly produce larger transparent conductive films in one piece, hindering the production of large-scale conductive films. Summary of the Invention

[0003] The present invention provides a metal conductive film, a manufacturing method, a touch panel and an electronic product which divide a product into two or more areas and manufacture them sequentially to finally complete a large-sized product.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A metal conductive film comprises at least two metal mesh layers with consistent routing patterns and located in the same plane, and the joints are stacked to form a continuous routing metal mesh layer. The base of the metal mesh layer is formed with a split portion extending along the original routing for splicing. The split portions are stacked to form a seam for achieving continuous conduction between the metal mesh layers to be spliced.

[0006] Preferably, the joint includes an irregular area formed by the overlapping arrangement of the split parts and the base part, which is different from the pattern of the original metal grid layer, and a regular area formed by the overlapping arrangement of the split parts and consistent with the pattern of the original metal grid layer.

[0007] Preferably, the routing superposition arrangement of the irregular area is configured so that the routing at the end of the split part is superimposed on the routing at the base to form an intersection one for continuous conduction; the routing superposition arrangement of the regular area is configured so that the routing inside the split part is superimposed on each other to form a superimposed grid consistent with the pattern of the original metal grid layer.

[0008] Preferably, the superimposed grid is formed by a plurality of intersections formed by superimposing the inner side routing lines of the split parts of the metal grid layer to be spliced.

[0009] Preferably, the wirings in the metal grid layer are superimposed on each other to form polygonal grid units with n sides, and n≥3; the grid units are surrounded by nodes formed by the superimposed wirings in the metal grid layer.

[0010] Preferably, the grid units are regular polygons with the same number of sides.

[0011] Preferably, the grid units are random polygons with different numbers of sides.

[0012] Preferably, the width of the seam is w, and w≥0.1 mm, the aperture r of the grid unit is 50-1000 μm, and the grid line width d is 2-15 μm.

[0013] Preferably, it also includes dense circuits for external circuits arranged on the periphery of the metal grid layer, the dense circuits are composed of orthogonal grid lines, and the dense circuits for splicing are arranged in an orthogonal stacking manner through dense circuit splitting parts.

[0014] A method for manufacturing a metal conductive film comprises the following steps:

[0015] Exposing the photoresist surface in sequence according to the splicing area through two or more photomasks, and forming grooves consistent with the grid pattern of the metal grid layer after development to obtain a template;

[0016] The template is made into a metal mold through distillation and electroforming;

[0017] Imprinting grooves on the UV layer of the substrate using the mold using an embossing machine to prepare a sample; and

[0018] Conductive metal is filled into the sample groove to obtain the above-mentioned metal grid layer.

[0019] Preferably, the conductive metal is silver paste.

[0020] A touch panel comprises the above-mentioned metal conductive film.

[0021] An electronic product is provided with the above-mentioned touch panel.

[0022] It can be seen from the above technical solution that the present invention has the following beneficial effects: for metal conductive films with larger sizes, the product is divided into two or more areas and spliced ​​in sequence to finally complete the production of large-size products. During splicing, the grid of the normal part remains unchanged, and the grid of the splicing part is split into two parts, namely, an irregular area whose pattern is different from the original grid layer pattern and a regular area whose pattern is consistent with the original grid layer pattern. The irregular area plays a role of continuous conduction, and the grid density of the regular area remains consistent with that before splitting to ensure that there is no color difference visible to the naked eye on the whole, thereby ensuring the quality of splicing; at the same time, due to the small grid line width, it is difficult to observe the splicing marks macroscopically. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a metal grid layer containing dense circuits after splicing according to the present invention;

[0024] Figure 2 This is a schematic diagram of the present invention showing that the metal grid layer does not contain dense circuits after splicing;

[0025] Figure 3 Schematic diagram of two metal mesh layers to be spliced;

[0026] Figure 4 for Figure 3 Schematic diagram of the two metal mesh layers after splicing;

[0027] Figure 5 is a schematic diagram of another embodiment of two metal mesh layers to be spliced;

[0028] Figure 6 for Figure 5 Schematic diagram of the two metal mesh layers after splicing;

[0029] Figure 7 is a schematic diagram of a diamond-shaped metal grid layer;

[0030] Figure 8 is a schematic diagram of a square metal grid layer;

[0031] Figure 9 is a schematic diagram of an irregular trapezoidal metal grid layer;

[0032] Figure 10 Schematic diagram of a honeycomb quadrilateral metal grid layer;

[0033] Figure 11 for Figure 10 Schematic diagram of the first layer routing;

[0034] Figure 12 for Figure 10 Schematic diagram of the second layer routing;

[0035] Figure 13 Schematic diagram of random polygonal metal mesh interlayer;

[0036] Figure 14 Schematic diagram of the metal mesh layer aperture and line width;

[0037] Figure 15 This is a schematic diagram before dense line splicing;

[0038] Figure 16 This is a schematic diagram after dense line splicing.

[0039] In the figure: 10, metal grid layer, 11, first layer routing, 12, second layer routing, 110, grid unit, 111, node, 20, split part, 30, patchwork, 310, irregular area, 311, intersection one, 320, regular area, 321, superimposed grid, 3211, intersection two, 40, dense line, 410, dense line split part. DETAILED DESCRIPTION

[0040] A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0041] Example:

[0042] Reference Figure 1-6 A metal conductive film includes at least two metal mesh layers 10 with consistent routing forms and located in the same plane, and the joints are overlapped to form a continuous routing. The base of the metal mesh layer is formed with a split portion 20 extending along the original routing for splicing. The split portions are overlapped to form a splicing seam 30 for achieving continuous conduction between the metal mesh layers to be spliced. Therefore, when a large-size metal conductive film needs to be prepared, multiple metal mesh layers can be spliced ​​along the same plane. Specifically, the split portions of the metal mesh layers to be spliced ​​are overlapped to form a continuously conductive splicing seam, thereby ensuring that a continuously conductive whole is formed between the mesh layers, so as to solve the problem that existing equipment cannot form large-size metal conductive films in one piece.

[0043] As a preferred technical solution of the present invention, the joint 30 includes an irregular area 310 formed by the overlapping arrangement of the split parts and the base, which is different from the pattern of the original metal grid layer, and a regular area 320 formed by the overlapping arrangement between the split parts and consistent with the pattern of the original metal grid layer. Therefore, during splicing, the joint is divided into an irregular area and a regular area according to the pattern formed by the splicing of different parts of the split parts and the metal grid layer. The irregular area is used to achieve the connectivity of the metal grids to be spliced, so as to achieve the purpose of continuous conduction. The regular area has a transitional effect, ensuring that the spliced ​​metal grid becomes a continuously conductive whole.

[0044] Reference Figure 3-6 Furthermore, the routing superposition arrangement of the irregular area is configured so that the routing at the end of the split part and the routing at the base are superimposed to form an intersection 311 for continuous conduction. The existence of the intersection 1 can achieve conduction between the split part and the base of the metal grid, playing a role of connectivity; the routing superposition arrangement of the regular area is configured so that the routing inside the split part is superimposed on each other to form an overlay grid 321 that is consistent with the pattern of the original metal grid layer. The existence of the overlay grid can not only achieve continuous conduction between the split parts, but also weaken the adverse effects of the splicing marks.

[0045] Furthermore, the superimposed grid 321 is surrounded by a plurality of intersection points 2 3211 formed by overlapping the inner lines of the split parts of the metal grid layer to be spliced. Thus, during splicing, the inner lines of the split parts are superimposed to form a plurality of intersection points 2 that serve as a connection, and the plurality of intersection points 2 form a superimposed grid consistent with the original metal grid pattern, thereby ensuring continuous conduction, weakening the presence of splicing marks, and ensuring that there is no color difference visible to the naked eye.

[0046] As a preferred technical solution of the present invention, the drawings are now used to illustrate that the metal mesh layer 10 of the present invention is superimposed on each other to form a polygonal mesh unit 110 with n sides, and the mesh unit is surrounded by nodes 111 formed by the superposition of the metal mesh layer, wherein n can be 3, 4, 5 or 6, but is not limited to the above situation. As long as the meshes formed by the superposition of the metal mesh lines are adjacent to each other, when the number of sides of the formed mesh units is the same, the mesh layer can be formed by superimposing a first layer of lines 11 spaced apart from each other and a second layer of lines 12 spaced apart from each other, such as Figure 7-10 As shown, the split portion is a plurality of parallel lines extending outward from the base. When spliced, the end of the line overlaps with the base of the metal mesh layer to form an intersection point 1, and the inner lines of the line are superimposed to form a superimposed grid; wherein, the first layer of lines and the second layer of lines can be straight lines, or they can be arranged in a regular pattern of multiple broken line segments connected end to end, such as Figure 11 、 Figure 12 At the same time, the first layer routing and the second layer routing can be set at a certain angle or distributed orthogonally.

[0047] In addition, the number of sides of the grid cells can also be inconsistent, such as Figure 13 The grid layer is formed by randomly superimposing the lines into polygons with different numbers of sides, wherein the number of sides of the polygons can be 3, 4, 5, 6, etc., as long as the grid layer forms a continuously extended whole. When splicing, the split part is an irregular line extending outward from the base. The irregular line is superimposed with the base to form an intersection point 1, and the inner line of the irregular line is superimposed to form a superimposed grid.

[0048] Reference Figure 14 As a preferred technical solution of the present invention, the width of the splicing seam is w, and w≥0.1mm, the aperture r of the grid unit is 50-1000μm, and the grid line width d is 2-15μm. Since the grid line width is small, the splicing marks can be made invisible from a macro perspective, ensuring that there is no visible color difference to the naked eye, which is beneficial to improving the splicing quality of the metal grid layer.

[0049] Reference Figure 15-16In addition, in the present invention, when the periphery of the metal conductive film is connected to a dense circuit for an external circuit, after the metal grid layer is spliced, the dense circuit also needs to be superimposed. The dense circuit is composed of orthogonal grid lines. The superposition principle of the dense circuit is the same as the superposition principle of the grid layer, that is, the dense circuit used for splicing is provided with a dense circuit splitting part, and the dense circuit splitting part 410 is orthogonally superimposed to form a dense circuit seam, thereby realizing continuous conduction of different dense circuits. After the seam is formed, the circuit can be lasered open by laser to form multiple independent circuits.

[0050] The present invention also discloses a method for manufacturing a metal conductive film, comprising the following steps:

[0051] Exposing the photoresist surface in sequence according to the splicing area through two or more photomasks, and forming grooves consistent with the grid pattern of the metal grid layer after development to obtain a template;

[0052] The template is made into a metal mold through distillation and electroforming;

[0053] Imprinting grooves on the UV layer of the substrate using the mold using an embossing machine to prepare a sample; and

[0054] The sample grooves are filled with conductive metal to obtain the above-mentioned metal grid layer, thereby completing the preparation of the metal conductive film. Specifically, the conductive metal is preferably silver paste.

[0055] The present invention also discloses a touch panel, which includes the above-mentioned metal conductive film to realize the touch function of the touch panel. In addition, the metal conductive film also has the function of shielding electromagnetic waves or electrothermal heating, and can therefore be applied to corresponding touch panels.

[0056] The present invention also discloses an electronic product, which includes the touch panel.

[0057] The above-described embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A metal conductive film, characterized in that: The invention comprises at least two metal mesh layers (10) with the same routing form and located in the same plane, and the metal mesh layers are overlapped and arranged at the joint to form a continuous routing, wherein the base of the metal mesh layer is formed with a split portion (20) extending along the original routing for splicing, and the split portions are overlapped and arranged to form a splicing seam (30) for achieving continuous conduction between the metal mesh layers to be spliced; The patchwork seam (30) comprises an irregular area (310) formed by overlapping the split parts and the base and different from the original metal grid layer pattern, and a regular area (320) formed by overlapping the split parts and consistent with the original metal grid layer pattern.

2. The metal conductive film according to claim 1, wherein The routing superposition arrangement of the irregular area is configured so that the routing at the end of the split part and the routing at the base are superimposed to form an intersection (311) for continuous conduction; the routing superposition arrangement of the regular area is configured so that the routing inside the split part are superimposed to form a superimposed grid (321) consistent with the pattern of the original metal grid layer.

3. The metal conductive film according to claim 2, characterized in that The superimposed grid (321) is surrounded by a plurality of intersection points (3211) formed by superimposing the inner side routing lines of the split parts of the metal grid layer to be spliced.

4. The metal conductive film according to claim 3, characterized in that The wirings in the metal grid layer (10) are superimposed on each other to form polygonal grid units (110) with n sides, where n≥3; the grid units are surrounded by nodes (111) formed by the superimposed wirings in the metal grid layer.

5. The metal conductive film according to claim 4, characterized in that The grid unit (110) is a regular polygon with a consistent number of sides.

6. The metal conductive film according to claim 4, characterized in that The grid unit (110) is a random polygon with different numbers of sides.

7. The metal conductive film according to claim 5 or 6, characterized in that: The width of the seam is w, and w≥0.1 mm. The aperture r of the grid unit is 50-1000 μm, and the grid line width d is 2-15 μm.

8. The metal conductive film according to claim 7, wherein: It also includes dense circuits (40) arranged on the periphery of the metal grid layer for external circuits, wherein the dense circuits are formed by orthogonal grid lines, and the dense circuits for splicing are arranged in an orthogonal stacking manner through dense circuit splitting parts (410).

9. A method for manufacturing a metal conductive film, characterized in that: The following steps are involved: Exposing the photoresist surface sequentially according to the splicing area through two or more photomasks, and forming grooves consistent with the grid pattern of the metal grid layer according to any one of claims 1 to 8 after development to obtain a template; The template is made into a metal mold by vapor deposition and electroforming; The mold is used to emboss grooves on the UV layer of the substrate using an embossing machine to prepare a sample; as well as Conductive metal is filled in the sample groove to obtain the metal grid layer as described in any one of claims 1 to 8.

10. The method for manufacturing a conductive film according to claim 9, wherein: The conductive metal is silver paste.

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