processing device

Abstract

The present application provides a processing apparatus, and an operator can determine whether a processing condition is appropriate without taking out a wafer from the processing apparatus. The processing apparatus has a chuck table, a processing unit, a processing feed unit, a shooting unit, and a control unit. The control unit includes: a control section that causes the processing feed unit to act to relatively move the chuck table after the processing unit has processed regions of a wafer held by the chuck table corresponding to all division predetermined lines, thereby positioning the chuck table directly below the shooting unit and causing the shooting unit to shoot the wafer; and a report generation section that derives information related to a processing state in each region from images obtained by shooting two or more different regions of the regions in which processing has been performed, and generates a report that records the information and the images.

Description

TECHNICAL FIELD

[0001] The present application relates to a processing apparatus that processes a wafer in which devices are formed in each region divided by a plurality of division predetermined lines. BACKGROUND

[0002] A device chip is mounted in an electronic device such as a mobile phone or a personal computer. The device chip is manufactured by dividing a wafer in which devices such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations) are formed in each region divided by a plurality of division predetermined lines along each division predetermined line by cutting.

[0003] A processing apparatus is used in the division of the wafer, and has a processing unit such as a cutting unit having a cutting tool (for example, see Patent Literature 1) and a laser irradiation unit that irradiates a laser beam having a wavelength absorbed by the wafer (for example, see Patent Literature 2).

[0004] The processing apparatus has a chuck table provided below the processing unit. A processing feed unit that moves the chuck table along a processing feed direction (X-axis direction) is provided below the chuck table. In addition, a photographing unit that photographs a wafer held by the chuck table is provided above the chuck table.

[0005] Further, a control unit that controls the operation of each structural element such as the processing unit, the chuck table, the processing feed unit, and the photographing unit is provided in the processing apparatus. After an operator inputs a predetermined processing condition to the control unit, each wafer is processed by the processing unit along the division predetermined line.

[0006] In order to confirm whether the processing condition is appropriate, the operator sometimes takes out a wafer in which a plurality of division predetermined lines are actually processed from the processing apparatus, and observes a plurality of portions of the division predetermined line using a microscope provided outside the processing apparatus (i.e., performs a kerf inspection).

[0007] Through the observation, the operator confirms, for example, whether the width of a cutting groove, the size and number of a notch (chipping), the deviation between the center line of the cutting groove and the center line of the division predetermined line, and the like are within an allowable range. Assuming that the deviation and the like exceed the allowable range, the operator appropriately corrects the processing condition. Then, the wafer returned to the processing apparatus is processed in accordance with the corrected processing condition.

[0008] Patent Literature 1: Japanese Patent Application Laid-Open No. 2000-108119

[0009] Patent Literature 2: Japanese Patent Application Laid-Open No. 2005-150523

[0010] However, if the wafer is taken out from the processing apparatus every time the processing conditions are confirmed using a microscope, there is a risk that the wafer is damaged in the conveyance or foreign matter or the like adheres to the wafer and the wafer is contaminated. SUMMARY

[0011] The present application was achieved in view of the above-described problems, and an object thereof is to provide a processing apparatus in which an operator can determine whether or not the processing conditions are appropriate without taking out a wafer from a processing apparatus.

[0012] According to one embodiment of the present application, there is provided a processing apparatus that processes a wafer in which devices are respectively formed in a plurality of regions divided by a plurality of division lines provided on a front surface side, the processing apparatus including: a cassette stage that places a cassette in which a plurality of wafers are accommodated; a chuck table that holds a wafer taken out from the cassette placed on the cassette stage; a processing unit that performs processing on a region of the wafer held by the chuck table corresponding to a division line; a processing feed unit that relatively feeds the chuck table and the processing unit; a photographing unit that photographs the wafer held by the chuck table; and a control unit that controls the processing unit, the processing feed unit, and the photographing unit, the control unit including: a control section that causes the processing feed unit to operate to relatively move the chuck table after the processing unit has performed processing on a region of the wafer held by the chuck table corresponding to all of the division lines, thereby positioning the chuck table directly below the photographing unit and causing the photographing unit to photograph the wafer; and a report generation section that derives information related to a processing state in each region from images obtained by photographing two or more different regions of the region in which processing has been performed and generates a report that records the information and the images.

[0013] Preferably, the report generation section generates the report for a wafer on which processing has been first performed among the plurality of wafers accommodated in the cassette.

[0014] Further, preferably, the information related to the processing state includes a width of a groove formed in the region corresponding to the division line, a state of a notch formed in the groove, and an offset amount of the groove with respect to a center line of the division line.

[0015] Further, preferably, the processing apparatus further includes a display unit that displays contents of the report.

[0016] Furthermore, preferably, the control unit also includes a configuration determination unit that determines the configuration of the two or more different regions when the number of the two or more different regions captured by the imaging unit is specified.

[0017] Alternatively, preferably, the processing unit is either a cutting unit or a laser beam irradiation unit, the cutting unit having a cutting tool that is rotatable, and the laser beam irradiation unit having a concentrator that focuses the laser beam.

[0018] The control unit of the processing apparatus according to one aspect of the present invention has a control unit and a report generation unit. After the processing unit processes the area of ​​the wafer held by the chuck stage corresponding to all predetermined dividing lines, the control unit actuates the processing feed unit to move the chuck stage relative to the wafer, thereby positioning the chuck stage directly below the imaging unit and enabling the imaging unit to image the wafer.

[0019] Furthermore, the report generation unit extracts information related to the processing status of each area by taking images of two or more different areas corresponding to all predetermined dividing lines, and generates a report recording this information and the images. By referring to this report, the operator can confirm whether the processing conditions are appropriate without removing the wafer from the processing unit. Therefore, the risk of wafer breakage, contamination, etc., caused by removing the wafer from the processing unit can be eliminated. Attached Figure Description

[0020] Figure 1 It is a three-dimensional diagram of the cutting device.

[0021] Figure 2 This is a 3D diagram of the frame unit.

[0022] Figure 3 This is a diagram showing a photograph taken of the front side of a wafer.

[0023] Figure 4 This is a diagram showing the various inspection areas.

[0024] Figure 5 This is an image showing one example of a report.

[0025] Figure 6 This is a perspective view of the laser processing apparatus according to the second embodiment.

[0026] Figure 7 Figure (A) is an example showing an inspection area located at the end, positioned further outward than the outer periphery of the wafer. Figure 7 (B) is a diagram showing the configuration of the corrected inspection area.

[0027] Label Explanation

[0028] 2: cutting device (processing device); 4: operation panel; 6: monitor (display unit); 8: cassette; 10: cassette table; 12: cassette elevator; 14: push-pull arm; 16: positioning member; 18: first conveyance unit; 20: chuck table; 20a: holding surface; 20b: clamp unit; 22: processing feed unit; 24: imaging unit; 26: cutting unit (processing unit); 26a: cutting tool; 28: second conveyance unit; 30: rotary cleaning unit; 32: control unit; 34: control section; 36: arrangement determination section; 38: report generation section; 40: laser processing device (processing device); 42: laser beam irradiation unit (processing unit); 42a: housing portion; 42b: head portion; 11: wafer; 11a: front surface; 11b: back surface; 13: division intended line; 13a, 13a1, 13a2: cutting groove; 13b: notch; 13c: inspection area; 15: device; 17: scribe lane; 19: frame; 21: frame unit; A, B, C, D, E, F, G: inspection area (region). DETAILED DESCRIPTION

[0029] An embodiment of one mode of the present application will be described with reference to the drawings. Figure 1 is a perspective view of a cutting device (processing device) 2. Also, in Figure 1 , a part of structural elements of the cutting device 2 is shown by a functional block. Also, hereinafter, an X-axis direction (processing feed direction), a Y-axis direction (index feed direction), and a Z-axis direction (height direction) are directions perpendicular to each other.

[0030] An operation panel 4 is provided on the front surface side of the cutting device 2. The operator, for example, makes a prescribed input via the operation panel 4, whereby a processing condition or the like can be set to the cutting device 2. A monitor (display unit) 6 is provided on the side surface of the front surface side of the cutting device 2.

[0031] A guide screen that guides the operation of the operator, an image imaged by the imaging unit 24 described later, and the content of a report described later, or the like are displayed on the monitor 6. Also, the monitor 6 can be a touch panel that functions as the operation panel 4. In this case, the operation panel 4 can be omitted.

[0032] In the cutting device 2, a wafer 11 (refer to Figure 2 ) formed of a semiconductor material such as silicon is subjected to cutting (processing). As Figure 2As shown, a plurality of division intended lines (spacer lines) 13 are provided in a lattice pattern on the front surface 11a side of the wafer 11. In each region divided by the plurality of division intended lines 13, a device 15 such as an IC (Integrated Circuit) or LSI (Large Scale Integration) is formed.

[0033] On the back surface 11b side of the wafer 11, a circular adhesive tape (dicing tape 17) formed of resin is attached. The diameter of the dicing tape 17 is larger than the diameter of the wafer 11. In the central portion of the dicing tape 17, the wafer 11 is attached, and on the outer peripheral portion of the dicing tape 17, one face of a ring-shaped frame 19 formed of metal is attached.

[0034] The wafer 11, the dicing tape 17, and the frame 19 constitute a frame unit 21. Figure 2 is a perspective view of the frame unit 21. A plurality of (for example, 25) frame units 21 are transported to the cutting device 2 in a state of being accommodated in one cassette 8 (refer to Figure 1 ).

[0035] Returning again Figure 1 to the other structural elements of the cutting device 2. The cutting device 2 has a rectangular plate-shaped cassette stage 10. The above-described cassette 8 is placed on the cassette stage 10. A cassette elevator 12 capable of moving the cassette stage 10 up and down is connected to the lower side of the cassette stage 10.

[0036] A push-pull arm 14 is provided on the rear side of the cassette stage 10. The push-pull arm 14 moves out the wafer 11 before cutting from the cassette 8 while gripping the frame 19 of the frame unit 21. In addition, the push-pull arm 14 can also move in the wafer 11 after cutting into the cassette 8 by pushing the frame 19.

[0037] A pair of positioning members (guides) 16 is provided on both sides of the moving path of the push-pull arm 14. The pair of positioning members 16 adjusts the position of the frame unit 21 in the X-axis direction. A first conveyance unit 18 that conveys the frame unit 21 from the pair of positioning members 16 is provided near the pair of positioning members 16.

[0038] The first conveyance unit 18 has an arm, a suction mechanism provided on one end side of the arm, and a rotation mechanism provided on the other end side of the arm. The first conveyance unit 18 rotates the arm by a predetermined angle by the rotation mechanism in a state where the frame 19 is sucked by the suction mechanism, thereby conveying the frame unit 21.

[0039] The first conveyance unit 18 conveys the frame unit 21 to a chuck table 20 in a state of being moved to a region closest to the cassette stage 10 in the X-axis direction. A disc-shaped porous plate is fixed to the upper surface side of the chuck table 20.

[0040] The lower surface side of the porous plate is connected to one end of a flow path (not shown) formed in the interior of the chuck table 20, and the other end of the flow path is connected to a suction source (not shown) such as an ejector.

[0041] If the suction source is activated, a negative pressure is generated on the upper surface of the porous plate, and the upper surface of the chuck table 20 functions as a holding surface 20a that sucks and holds the frame unit 21. The scribe tape 17 side of the frame unit 21 is held by the holding surface 20a so that the front surface 11a side of the wafer 11 is exposed.

[0042] A plurality of jig units 20b for fixing the frame 19 are provided in the outer peripheral portion of the chuck table 20. In addition, a θ stage (not shown) that rotates the chuck table 20 around a prescribed rotation axis is linked below the chuck table 20.

[0043] A machining feed unit 22 that moves the chuck table 20 in the X-axis direction is linked below the θ stage. In addition, a Z-axis feed unit (not shown) that moves the chuck table 20 in the Z-axis direction is linked below the machining feed unit 22. Figure 1

[0044] The machining feed unit 22 has an X-axis moving stage (not shown) that supports the θ stage. The X-axis moving stage is provided on a pair of X-axis guides (not shown) that are parallel to the X-axis in a slidable manner.

[0045] A ball screw (not shown) is arranged in the X-axis direction between the pair of X-axis guides. A pulse motor (not shown) for rotating the ball screw is linked to one end of the ball screw.

[0046] In addition, a nut portion (not shown) that is rotatably linked to the ball screw is provided on the lower surface of the X-axis moving stage. If the pulse motor is driven, the chuck table 20 moves in the X-axis direction together with the X-axis moving stage and the like.

[0047] A photographing unit 24 is provided above the movement path of the chuck table 20 in a manner so as to face the holding surface 20a. The photographing unit 24 has a camera that includes a prescribed optical system, a CCD image sensor or a CMOS image sensor, and the like, and for example, photographs the front surface 11a side of the wafer 11 held by the holding surface 20a to acquire an image.

[0048] The acquired image is displayed on the monitor 6, for example. A cutting unit (machining unit) 26 is provided on one side of the photographing unit 24 in the X-axis direction. The cutting unit 26 has a cylindrical spindle (not shown) arranged in the Y-axis direction.

[0049] ​A cutting tool 26a having a circular ring-shaped cutting edge is attached to one end portion of the main shaft. In addition, a rotary drive source such as a motor is connected to the other end side of the main shaft. When the rotary drive source is activated, the cutting tool 26a rotates at high speed.

[0050] Here, a cutting method of the wafer 11 using the cutting unit 26 will be described. In the case of cutting the wafer 11, first, the back surface lib side of the wafer 11 (i.e., the dicing tape 17) is held by the holding surface 20a in a manner that the front surface 11a is exposed, and the frame 19 is fixed by the plurality of jig units 20b.

[0051] Next, the front surface 11a side of the wafer 11 is imaged by the imaging unit 24, and the coordinates of the prescribed alignment marks are detected by performing image processing such as pattern matching on the image acquired by the imaging. Thus, the positions of the division intended lines 13 that are separated by a prescribed distance from the coordinates of the alignment marks are determined.

[0052] Next, the cutting tool 26a is positioned on the extension line of one of the division intended lines 13. Then, the lower end of the rotated cutting tool 26a is positioned between the back surface lib of the wafer 11 and the holding surface 20a.

[0053] Then, the chuck table 20 is processed by the processing feed unit 22, whereby the wafer 11 and the chuck table 20 are relatively moved in the X-axis direction. Thus, the region corresponding to one of the division intended lines 13 is cut (processed), and a cutting groove 13a is formed (see FIG. 6). Figure 3 ).

[0054] After cutting the wafer 11 along one of the division intended lines 13, the cutting unit 26 is moved in the Y-axis direction, and the cutting tool 26a is positioned on the extension line of another of the division intended lines 13 that is adjacent to one of the division intended lines 13 in the Y-axis direction.

[0055] Then, the wafer 11 is cut along the other division intended line 13. Similarly, the wafer 11 is cut along the remaining division intended lines 13. After the wafer 11 is cut along all of the division intended lines 13 in the X-axis direction, the wafer 11 is rotated by 90 degrees by the θ stage.

[0056] Then, the wafer 11 is cut along all of the division intended lines 13 in the X-axis direction. In this way, after the cutting grooves 13a are formed in the regions corresponding to all of the division intended lines 13 that are set in a lattice shape, the cutting is ended.

[0057] The frame unit 21 after the cutting is carried in from the chuck table 20 to the spin cleaning unit 30 located at the rear of the chuck table 20 by the 2nd carrying unit 28. In the spin cleaning unit 30, the frame unit 21 is subjected to spin cleaning and spin drying.

[0058] The frame unit 21 subjected to spin cleaning and spin drying by the spin cleaning unit 30 is carried into the cassette 8 by the 1st carrying unit 18, the positioning member 16, the push-pull arm 14, and the like. Next, the control unit 32 that controls the operation of the cutting device 2 is described.

[0059] The control unit 32 controls the operation of the cassette elevator 12, the push-pull arm 14, the positioning member 16, the chuck table 20, the machining feed unit 22, the shooting unit 24, the cutting unit 26, the 2nd carrying unit 28, the spin cleaning unit 30, and the like.

[0060] The control unit 32 is constituted, for example, of a computer including a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory or a hard disk drive. The processing device and the like are caused to operate in accordance with software stored in the auxiliary storage device and including a prescribed program, whereby the function of the control unit 32 is realized.

[0061] The control unit 32 includes a control section 34 constituted, for example, of a program. The control section 34 controls, for example, the operation of a solenoid valve (not shown) provided between one end and the other end of a flow path formed in the interior of the chuck table 20.

[0062] When the solenoid valve is in the open state, a negative pressure is generated on the holding surface 20a, and when the solenoid valve is in the closed state, the negative pressure of the holding surface 20a disappears. The control section 34 also controls, for example, the operation of the rotary drive source of the cutting unit 26.

[0063] According to the cutting method of the wafer 11 described above, after all of the division intended lines 13 are cut by the cutting unit 26, the control section 34 controls the pulse motor of the machining feed unit 22 to position the chuck table 20 directly below the shooting unit 24.

[0064] Then, the control section 34 causes the shooting unit 24 to operate, and the shooting unit 24 shoots the front surface 11a side of the wafer 11. Figure 3 is a view showing the case where the front surface 11a side of the wafer 11 is shot.

[0065] The imaging unit 24 images the entire front surface 11a side of the wafer 11, and images each of the two or more check regions (regions) that are enlarged compared with the entire image of the wafer 11. The imaging unit 24 of the present embodiment images seven check regions located at different positions.

[0066] Figure 4 is a view showing each check region. In the present embodiment, the lateral direction shown by Figure 4 is referred to as the channel 1 (CH1) direction, and the longitudinal direction shown by Figure 4 is referred to as the channel 2 (CH2) direction.

[0067] Each check region includes a prescribed range centered on the intersection of the division predetermined line 13 in the CH1 direction and the CH2 direction. As shown in the image of the check region A, a notch (chipping) 13b is generated in the cutting groove 13a1 in the CH1 direction and the cutting groove 13a2 in the CH2 direction, respectively.

[0068] In the check region A, the center line of the cutting groove 13a1 in the CH1 direction is offset to the rear side from the center line of the division predetermined line 13 in the CH1 direction. The center line of the cutting groove 13a1 refers to a straight line parallel to the CH1 direction passing through the center position of the CH2 direction width of the cutting groove 13a1. In addition, the center line of the division predetermined line 13 in the CH1 direction refers to a straight line parallel to the CH1 direction passing through the center position of the CH2 direction width of the division predetermined line 13 in the CH1 direction.

[0069] The check region B is located at a position to the right of the check region A in the CH1 direction and at the same position as the check region A in the CH2 direction. In the check region B, the center line of the cutting groove 13a2 in the CH2 direction is offset to the left side from the center line of the division predetermined line 13 in the CH2 direction.

[0070] The center line of the cutting groove 13a2 refers to a straight line parallel to the CH2 direction passing through the center position of the CH1 direction width of the cutting groove 13a2. In addition, the center line of the division predetermined line 13 in the CH2 direction refers to a straight line parallel to the CH2 direction passing through the center position of the CH1 direction width of the division predetermined line 13 in the CH2 direction.

[0071] In the check region B, as in the check region A, the center line of the cutting groove 13a1 in the CH1 direction is offset to the rear side from the center line of the division predetermined line 13 in the CH1 direction. In addition, no notch 13b is generated in the cutting groove 13a1 in the CH1 direction.

[0072] The inspection area C is located at a position leftward of the inspection area A in the CH1 direction and at a position frontward of the inspection area A in the CH2 direction. In the inspection area C, the center line of the cutting groove 13a1 in the CH1 direction is offset rearward from the center line of the division predetermined line 13 in the CH1 direction, and the center line of the cutting groove 13a2 in the CH2 direction is offset rightward from the center line of the division predetermined line 13 in the CH2 direction.

[0073] The inspection area D is located at approximately the center of the front face 11a. The inspection area D is located between the inspection areas A and B in the CH1 direction and at the same position as the inspection area C in the CH2 direction. In the inspection area D, the center line of the cutting groove 13a1 in the CH1 direction is also offset rearward from the center line of the division predetermined line 13 in the CH1 direction.

[0074] The inspection area E is located at a position rightward of the inspection area B in the CH1 direction and at the same position as the inspection areas C and D in the CH2 direction. In the inspection area E, the center line of the cutting groove 13a1 in the CH1 direction is also offset rearward from the center line of the division predetermined line 13 in the CH1 direction.

[0075] The inspection area F is located at the same position as the inspection area A in the CH1 direction and at a position frontward of the inspection area C in the CH2 direction. In the inspection area F, the center line of the cutting groove 13a1 in the CH1 direction is offset rearward from the center line of the division predetermined line 13 in the CH1 direction.

[0076] The inspection area G is located at the same position as the inspection area B in the CH1 direction and at the same position as the inspection area F in the CH2 direction. In the inspection area G, the center line of the cutting groove 13a1 in the CH1 direction is offset rearward from the center line of the division predetermined line 13 in the CH1 direction, and the center line of the cutting groove 13a2 in the CH2 direction is offset leftward from the center line of the division predetermined line 13 in the CH2 direction.

[0077] In a case where the operator specifies the number of two or more different inspection areas (regions) to be imaged by the imaging unit 24, the arrangement of the inspection areas A to G is determined by an arrangement determination section 36 that is a part of the control unit 32. The arrangement determination section 36 is constituted by a program, for example.

[0078] The arrangement determination section 36 sets the coordinates of the intersection of the center line of the division predetermined line 13 in the CH1 direction and the center line of the division predetermined line 13 in the CH2 direction as the center coordinates of the inspection area. The arrangement determination section 36 determines the center coordinates of the plurality of inspection areas in accordance with the number of the specified inspection areas.

[0079] The configuration determination section 36, for example, sets one coordinate of the coordinates of the plurality of intersection points that is located in the approximately center of the front surface 11a and a plurality of other coordinates located around the one coordinate as the center coordinates of the inspection regions, respectively. The configuration determination section 36 determines the configuration of the center coordinates of the inspection regions in such a manner that the center coordinates of at least two inspection regions are identical in the CH1 direction or the CH2 direction, for example.

[0080] After the configuration of the center coordinates of the inspection regions is determined, a range of a prescribed diameter (for example, 200 μm to 300 μm) from each of the center coordinates of the inspection regions is imaged by the imaging unit 24. Note that the range imaged by the imaging unit 24 is not limited to a circular shape, and can be an arbitrary shape.

[0081] The control unit 32 further includes a report generation section 38 that generates a report in which the images of the inspection regions and information related to the processing state of the wafer 11 in each of the inspection regions are recorded. The report generation section 38 is configured by a program, for example, and generates a report for the wafer 11 on which processing is first performed among the plurality of wafers 11 housed in the cassette 8.

[0082] The operator can confirm whether the processing conditions are appropriate without taking out the wafer 11 from the processing apparatus by referring to the report. In the case where the processing conditions are inappropriate, the processing conditions can be corrected. Therefore, when processing the second and subsequent wafers 11, the wafers 11 can be processed in accordance with the corrected processing conditions.

[0083] The information related to the processing state includes the width of the cut groove 13a, the state of the notch 13b formed in the cut groove 13a, and the offset amount of the center line of the cut groove 13a with respect to the center line of the division intended line 13. Note that the width of the cut groove 13a1 in the CH1 direction refers to the length of the cut groove 13a1 in the CH2 direction, and the width of the cut groove 13a2 in the CH2 direction refers to the length of the cut groove 13a2 in the CH1 direction.

[0084] In addition, the state of the notch 13b formed in the cut groove 13a refers to the number of notches 13b and the size of the notch 13b, for example. The size of the notch 13b refers to the maximum length of the notch 13b in the CH2 direction from the edge of the cut groove 13a1 or the maximum length of the notch 13b in the CH1 direction from the edge of the cut groove 13a2, for example.

[0085] The report of the present embodiment is displayed as an image on the monitor 6. Figure 5 is an image showing an example of the report. The entire image of the front surface 11a side of the wafer 11 is displayed at the upper right of the report. In the entire image, the positions corresponding to the inspection regions A to G are indicated by circles.

[0086] A circle in which the overall image is simplified is displayed below the overall image of the wafer 11, and the inspection regions A to G are shown in the circle. An image of the inspection regions is displayed to the left of the overall image of the wafer 11. In the example shown, an image of the inspection region D is displayed. Figure 5

[0087] In addition, the operator can select the image of the displayed inspection region by designating a desired inspection region. For example, the operator can switch the image of the inspection region D to the image of the inspection region A by designating the inspection region A shown in the circle in which the overall image is simplified.

[0088] Information related to the processing state of the selected inspection region is displayed below the image of the inspection regions. In the example shown, information related to the processing state of the inspection region D is displayed. Each piece of information is generated by the report generation section 38, for example, from the obtained image. Figure 5

[0089] As shown by "Width of Groove" in FIG. 10, the width of the cutting groove 13al of the inspection region D is 30 μm, and the width of the cutting groove 13a2 of the inspection region D is 31 μm. In addition, as shown by "Edge Collapse" in FIG. 10, the number of notches less than 5 μm in the cutting groove 13al of the inspection region D is 1, and the number of notches less than 5 μm in the cutting groove 13a2 of the inspection region D is 4. Figure 5 Figure 5 Figure 5

[0090] Figure 5 Figure 5 Figure 5

[0091] As shown by "Width of Groove" in FIG. 10, the width of the cutting groove 13al of the inspection region D is 30 μm, and the width of the cutting groove 13a2 of the inspection region D is 31 μm. In addition, as shown by "Edge Collapse" in FIG. 10, the number of notches less than 5 μm in the cutting groove 13al of the inspection region D is 1, and the number of notches less than 5 μm in the cutting groove 13a2 of the inspection region D is 4. Figure 6

[0092] ​​​​​​​​​The report generation section 38 derives the width of the cutting groove 13a, the number of notches of less than 5 μm, the number of notches of 5 μm or more, and the interval track offset, and the like, from the acquired image. Since the length of each pixel of the acquired image is predetermined, the report generation section 38 calculates the width of the cutting groove 13a and the position of the center line of the cutting groove 13a, for example, from the number of pixels corresponding to the width of the cutting groove 13a in the image.

[0093] Likewise, the report generation section 38 can calculate the size of the notch in a prescribed direction from the number of pixels in the prescribed direction corresponding to the notch in the image. In addition, the report generation section 38 can count the number of notches from the size of the notches. In this way, the report generation section 38 generates a report in which the image of each inspection region and information related to the processing state in each inspection region are recorded.

[0094] The operator can confirm whether the processing conditions are appropriate by referring to the report even without taking out the wafer 11 from the cutting apparatus 2 and observing the division intended line 13 by a microscope or the like. Therefore, it is possible to eliminate the risk of damage, contamination, and the like of the wafer 11 due to taking out the wafer 11 from the cutting apparatus 2.

[0095] In addition, the report is not limited to image display, and can be printed on paper. In the case where the report is printed on paper, the cutting apparatus 2 can have a report printing section (not shown) including a printer. In addition, instead of the report printing section, the report generation section 38 can output data necessary for generating the report to an external printer (not shown) and cause the printer to print the report.

[0096] In the case where the report is printed on paper, it is preferable to record the image of each inspection region and the information related to the processing state in the report in a manner that the correspondence relationship of the image of each inspection region and the information related to the processing state of the wafer 11 in each inspection region can be determined.

[0097] Next, a method of confirming and correcting the processing conditions will be described. First, the operator inputs prescribed processing conditions to the control unit 32 via the operation panel 4 (preparation step S10). The processing conditions are the kind of the cutting tool 26a, the flow rate of the cutting water supplied to the processing point, the rotational speed of the spindle, and the like.

[0098] In the preparation step S10, the number of the photographed inspection regions (regions) is also input, and the above-described configuration determination section 36 automatically determines the configuration of the inspection regions. After the processing conditions are input, the operator presses the automatic processing start button, and the cutting apparatus 2 starts processing of the wafer 11.

[0099] When the automatic processing start button is pressed, the first frame unit 21 is carried from the cassette 8 to the chuck table 20, and the frame unit 21 is held by the holding surface 20a and the clamp unit 20b (holding step S20).

[0100] After the holding step S20, the regions of the wafer 11 corresponding to all the division predetermined lines 13 are cut by the cutting unit 26 according to the above-described cutting method (cutting step S30). After the cutting step S30, the entire front surface 11a side of the wafer 11 and each inspection region designated by the arrangement determination section 36 are imaged by the imaging unit 24 (imaging step S40).

[0101] After the imaging step S40, the above-described report is generated by the report generation section 38 (report generation step S50). The operator confirms whether the processing conditions input in the preparation step S10 are appropriate by referring to the generated report (confirmation step S60). Thus, it is possible to eliminate the risk of damage, contamination, or the like of the wafer 11 due to the wafer 11 being taken out from the cutting apparatus 2.

[0102] After the confirmation step S60, the first frame unit 21 is washed and dried by the spin cleaning unit 30, and is carried into the cassette 8. In the case where the processing conditions are appropriate, the cutting step S30 is performed on the second and subsequent frame units 21 with the same processing conditions.

[0103] However, in the case where the processing conditions are not appropriate, the processing conditions are corrected after the confirmation step S60 (correction step S70). In the correction step S70, for example, replacement or reinstallation of the cutting tool 26a, setting change of the flow rate of cutting water, setting change of the rotation speed of the spindle, or the like is performed.

[0104] After the correction step S70, the holding step S20 to the confirmation step S60 are performed on the second frame unit 21. In the case where the processing conditions are appropriate, the second frame unit 21 is washed and dried, and is carried into the cassette 8. However, in the case where the processing conditions are not appropriate, the correction step S70 or the like is performed again.

[0105] Next, the second embodiment will be described. Figure 7 is a perspective view of a laser processing apparatus (processing apparatus) 40 of the second embodiment. The laser processing apparatus 40 has a laser beam irradiation unit (processing unit) 42 instead of the cutting unit 26. In this respect, the laser processing apparatus 40 is different from the cutting apparatus 2.

[0106] The laser beam irradiation unit 42 has a laser beam generating section (not shown) that generates a pulsed laser beam having a wavelength that is absorbed by the wafer 11. In addition, the laser beam generating section includes a laser oscillator (not shown). The laser beam irradiation unit 42 has a cylindrical housing section 42a, and a head section 42b is provided at the front end of the housing section 42a.

[0107] A condenser lens (not shown) that condenses the laser beam is provided in the head section 42b, and the head section 42b functions as a condenser. The laser beam generated by the laser beam generating section is emitted from the head section 42b toward the lower side through a prescribed optical system provided in the housing section 42a.

[0108] When the wafer 11 is processed, the back surface 11b side of the wafer 11 is held by the holding surface 20a, for example, in a manner in which the front surface 11a is exposed. Then, the area directly below the head section 42b is positioned on an extension line of one of the division predetermined lines 13.

[0109] In a state in which the laser beam having a prescribed output is irradiated from the head section 42b, when the chuck table 20 and the head section 42b are relatively processed to be fed, the area corresponding to the division predetermined line 13 is ablation-processed, and a laser-processed groove is formed.

[0110] The laser processing device 40 also has the control unit 32 as with the cutting device 2. Therefore, as with the first embodiment, after the laser-processed groove is formed on all of the division predetermined lines 13 of the first wafer 11, a report is generated by the report generating section 38.

[0111] The operator can confirm whether the processing conditions are appropriate without taking out the wafer 11 from the laser processing device 40 by referring to the report. Therefore, the risk of damage, contamination, and the like of the wafer 11 due to taking out the wafer 11 from the laser processing device 40 can be eliminated.

[0112] Next, other examples in which the arrangement determining section 36 determines the arrangement of the inspection regions will be described. The inspection regions lose their meaning if they are not set on the wafer 11. However, since the wafer 11 is in a disc shape, it is assumed that in a case in which a plurality of inspection regions are arranged at equal intervals in the CH1 and CH2 directions, the inspection region located at the end portion is sometimes located at a position that is outside the outer periphery of the front surface 11a.

[0113] Figure 7 (A) of FIG. 10 is a view that shows an example in which the inspection region 13c located at the end portion is located at a position that is outside the outer periphery of the wafer 11. In addition, in (A) of FIG. 10, the position of the inspection region 13c is simply indicated by a cross. In this case, the arrangement determining section 36 corrects the arrangement of the inspection region 13c in a manner in which the interval of the inspection region 13c is narrowed in the CH1 or CH2 direction. Figure 7 (A) of FIG. 10, the position of the inspection region 13c is simply indicated by a cross. In this case, the arrangement determining section 36 corrects the arrangement of the inspection region 13c in a manner in which the interval of the inspection region 13c is narrowed in the CH1 or CH2 direction.

[0114] Figure 7 (B) is a view showing the configuration of the corrected inspection regions 13c. The configuration determining section 36 corrects the coordinates of the inspection regions 13c in such a manner that the inspection regions 13c located at the end portions are located at positions that are more inward than the outer periphery of the front surface 11a.

[0115] For example, the configuration determining section 36 sets the intervals in the CH1 direction among the five inspection regions 13c located between one end portion and the central portion in the CH2 direction and the five inspection regions 13c located between the other end portion and the central portion in the CH2 direction to be narrower than the first intervals. Figure 7

[0116] Further, the configuration determining section 36 sets the intervals in the CH1 direction among the five inspection regions 13c located at one end portion in the CH2 direction and the five inspection regions 13c located at the other end portion in the CH2 direction to be narrower than the first intervals. In addition, in the correction example of (B) of FIG. 9, although the intervals in the CH1 direction are made narrower, instead, the intervals in the CH2 direction can be made narrower. ​

[0117] In this way, the configuration determining section 36 corrects the configuration of the inspection regions 13c in accordance with the number of inspection regions 13c specified by the operator, and thus it is possible to avoid the imaging unit 24 from taking images at positions that are more outward than the outer periphery of the wafer 11.

[0118] In addition to the above, the configuration, method, and the like of the above-described embodiments can be appropriately changed and implemented within a range that does not depart from the object of the present application. For example, the cutting grooves 13a and the laser-processed grooves are not limited to grooves formed by cutting (i.e., full cutting) of the wafer 11, and can be half-cut grooves obtained by partially removing the wafer 11.​​

Claims

1. A processing apparatus that processes a wafer in which devices are respectively formed in regions divided by a plurality of division intended lines set on a front surface side, characterized by comprising: a cassette stage that loads a cassette in which a plurality of wafers are accommodated; a chuck table that holds a wafer that is carried out from the cassette loaded on the cassette stage; a processing unit that performs processing on a region of the wafer held by the chuck table that corresponds to a division intended line; a processing feed unit that relatively feeds the chuck table and the processing unit; a photographing unit that photographs the wafer held by the chuck table; and a control unit that controls the processing unit, the processing feed unit, and the photographing unit, the control unit including: a control section that causes the processing feed unit to act to relatively move the chuck table after the processing unit has performed processing on a region of the wafer held by the chuck table that corresponds to all of the division intended lines, thereby positioning the chuck table directly below the photographing unit and causing the photographing unit to photograph the wafer; a report generation section that derives information related to a processing state in each region from images respectively photographed in two or more different regions of the regions in which processing has been performed, and generates a report that records the information and the images; and a configuration determination section that determines a configuration of the two or more different regions when a number of the two or more different regions photographed by the photographing unit is specified, the configuration determination section setting intervals of the regions in a second direction at equal intervals when the regions are respectively arranged on the front surface in a first direction and the second direction that are orthogonal to each other in accordance with the number of the regions that is specified, and adjusting intervals of the regions in the first direction in such a manner that a plurality of the regions are arranged at equal intervals within a width of the front surface in the first direction through a prescribed position in the second direction.

2. The processing apparatus according to claim 1, characterized in that the report generation section generates the report for a wafer in which processing has been first performed among the plurality of wafers accommodated in the cassette.

3. The processing apparatus according to claim 1 or 2, characterized in that the information related to the processing state includes a width of a groove formed in a region corresponding to a division intended line, a state of a notch formed in the groove, and an offset amount of the groove with respect to a center line of the division intended line.

4. The processing apparatus according to claim 1 or 2, characterized in that the processing apparatus further includes a display unit that displays contents of the report.

5. The processing apparatus according to claim 1 or 2, characterized in that the processing unit is any one of a cutting unit having a cutting tool that is rotatable and a laser beam irradiation unit having a condenser that condenses a laser beam. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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