A near-field thermal radiation experimental device and a leveling method thereof

Abstract

The present application provides a near-field thermal radiation experimental device and a leveling method thereof, wherein the near-field thermal radiation experimental device includes: a shell, a bracket, a mobile platform, a fixed platform, a fixing device and a vacuum system. The mobile platform is used to support the first sample. The fixed platform is used to support the second sample. The fixing device is used to fix the second sample after it is completely fitted with the first sample. The near-field thermal radiation experimental device provided by the present application moves the mobile platform toward the fixing device until the first sample and the second sample are completely fitted. When the first sample and the second sample are completely fitted, the two first samples and the second sample are in a parallel state, and then the second sample is fixed by the fixing device, thereby ensuring the parallelism between the first sample and the second sample, so as to conduct a near-field thermal radiation experiment. Since the above-mentioned leveling is achieved by the contact between the first sample and the second sample, it is possible to ensure the nanometer-level parallelism between the first sample and the second sample, thereby ensuring the subsequent detection accuracy.

Description

Technical Field

[0001] The present application relates to the technical field of experimental devices, and in particular to a near-field thermal radiation experimental device and a leveling method for the near-field thermal radiation experimental device. Background Art

[0002] When the distance between the two heat sources reaches or is less than the characteristic wavelength of the blackbody radiation of the object, the radiation heat transfer between the two heat sources will exceed the blackbody radiation limit by several orders of magnitude. At present, the size of electronic components and other equipment is gradually decreasing, the scale effect is becoming more and more significant, and the heat transfer problem has become more complicated. The near-field radiation heat transfer problem is one of the key problems in heat transfer problems. The two-plate system is the most common system in real life. Studying the near-field radiation heat transfer heat flow between different two plates is of great significance to promoting the miniaturization of equipment.

[0003] In order to solve the technical difficulties of parallelizing large-size plate surfaces and achieving nanometer spacing in near-field radiation experiments of parallel plate systems, many experiments use high-precision six-axis motor equipment. However, six-axis motor equipment is expensive and the process of adjusting the parallelism of two samples is relatively complicated. Summary of the invention

[0004] The purpose of the present application is to provide a near-field thermal radiation experimental device and a leveling method that are simple to operate and can ensure the parallelism between two samples at the nanometer level.

[0005] In order to achieve at least one of the above-mentioned purposes, the present application provides a near-field thermal radiation experimental device, comprising: a shell, the shell having a accommodating cavity; a bracket, the bracket being arranged in the accommodating cavity; a vacuum device, the vacuum device being fixed on the shell and used to control the vacuum degree in the accommodating cavity; a moving platform, the moving platform being arranged on the bracket and being movable relative to the bracket, the moving platform being used to support a first sample; a fixed platform, the fixed platform being arranged above the moving platform, the fixed platform being provided with a stepped hole penetrating the fixed platform, the stepped surface of the stepped hole being used to support a second sample; and a fixing device, the fixing device being arranged on the fixed platform and used to fix the second sample after it is completely fitted with the first sample.

[0006] In some embodiments, the fixing device includes: a curing glue, which is disposed on the step surface and has a viscosity of 15000cps to 50000cps; and a curing device, which is disposed on the fixing platform and is used to apply curing conditions to the curing glue.

[0007] In some embodiments, the curing adhesive is a light-curing adhesive, the curing device is a curing light source, and the curing light source is used to irradiate light to the light-curing adhesive.

[0008] In some of the embodiments, the fixing device includes: a clamping device, which is arranged on the fixing platform and is used to clamp the second sample; and a first controller, which is connected to the clamping device and is used to control the clamping device to clamp the second sample.

[0009] In some of the embodiments, there is a laser emitting device, which is disposed on the fixed platform and is used to emit laser light to the second sample; a laser receiving device, which is disposed on the fixed platform and is used to receive laser light reflected by the second sample and send an electrical signal; and a second controller, which is connected to the laser receiving device and the mobile platform and is used to control the mobile platform to stop moving according to the electrical signal.

[0010] The embodiment of the second aspect of the present application provides a leveling method for a near-field thermal radiation experimental device, comprising the following steps:

[0011] mounting a first sample on a moving platform;

[0012] Mounting the second sample on the stepped surface of the stepped hole on the fixture, with the second sample protruding out of the stepped hole;

[0013] Controlling the movable platform to move toward the fixing device until the first sample is completely attached to the second sample;

[0014] controlling the fixing device to fix the second sample on the fixing platform;

[0015] The moving platform is controlled to move and the distance between the first sample and the second sample is adjusted.

[0016] In some of the embodiments, the following steps are included before the step of mounting the second sample on the step surface of the step hole on the fixture:

[0017] Inject curing glue with a viscosity of 15000cps to 50000cps on the step surface;

[0018] The step of controlling the fixing device to fix the second sample on the fixing platform specifically includes the following steps:

[0019] The curing device is controlled to apply curing conditions to the curing adhesive.

[0020] In some embodiments, the step of controlling the fixing device to fix the second sample on the fixing platform specifically includes the following steps:

[0021] injecting curing glue between the second sample and the stepped surface;

[0022] The curing device is controlled to apply curing conditions to the curing adhesive.

[0023] The above technical solution of the present application has the following advantages: when the first sample and the second sample are completely fitted together, the two first samples are in a parallel state with the second sample, and then the second sample is fixed by a fixing device, thereby ensuring the parallelism between the first sample and the second sample, so as to carry out a near-field thermal radiation experiment. Since the above leveling is achieved by the contact between the first sample and the second sample, the nanometer-level parallelism between the first sample and the second sample can be guaranteed, thereby ensuring the subsequent detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings. In addition, the drawings of the present application are provided for illustrative purposes only, and the proportions and quantities of the components in the drawings may not be consistent with the actual product. Among them:

[0025] Figures 1 to 3 It is a partial structural schematic diagram of the first embodiment of the near-field thermal radiation experimental device described in the present application;

[0026] Figure 4 is a structural block diagram of the fixing device described in the present application;

[0027] Figures 5 to 7 It is a partial structural schematic diagram of the second embodiment of the near-field thermal radiation experimental device described in the present application;

[0028] Figures 8 to 10 It is a partial structural schematic diagram of the third embodiment of the near-field thermal radiation experimental device described in the present application;

[0029] Fig.11 It is a structural block diagram of the control part described in this application.

[0030] in, Figures 1 to 11 The corresponding relationship between the reference numerals and component names is as follows:

[0031] Mobile platform 10, fixed platform 20, stepped hole 21, stepped surface 22, fixing device 30, curing glue 31, curing device 32, heating device 321, curing light source 322, spring 33, glue injection device 34, clamping device 35, first controller 36, laser emitting device 41, laser receiving device 42, second controller 43, first sample 50, second sample 60. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] The following discussion provides multiple embodiments of the present application. Although each embodiment represents a single combination of the application, different embodiments of the present application can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments described. Therefore, if one embodiment includes A, B, C, and another embodiment includes a combination of B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, D, even though the embodiment may not be clearly recorded in the following text.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0035] The near-field radiation heat transfer experimental device is mainly used to measure the radiation heat transfer heat flow between the first sample and the second sample at the micro-nano level gap. Therefore, when designing the near-field radiation heat transfer experimental device, the main difficulty of the device is to maintain the gap and parallelism between the two sample slices.

[0036] like Figures 1 to 10 As shown, the near-field thermal radiation experimental device provided in the present application includes: a shell (not shown in the figure), a bracket (not shown in the figure), a vacuum device (not shown in the figure), a mobile platform 10, a fixed platform 20, a heater (not shown in the figure), a TEC cooler (not shown in the figure), a heat flux meter (not shown in the figure) and a fixing device 30.

[0037] The housing has a receiving cavity.

[0038] The bracket is arranged in the accommodating cavity.

[0039] The vacuum device is fixed on the shell and is used to control the vacuum degree in the accommodating cavity.

[0040] The movable platform 10 is disposed on the support and is movable relative to the support. The movable platform 10 is used to support the first sample 50 .

[0041] The fixed platform 20 is disposed above the moving platform 10 . A stepped hole 21 penetrating the fixed platform 20 is disposed on the fixed platform 20 . A stepped surface 22 of the stepped hole 21 is used to support the second sample 60 .

[0042] The fixing device 30 is disposed on the fixing platform 20 and is used to fix the second sample 60 and the first sample 50 after they are completely attached to each other.

[0043] The heater is used to control the temperature of the second sample. In a specific embodiment of the present application, the heater is disposed on the second sample.

[0044] A TEC cooler (Thermo Electric Cooler, semiconductor cooler) is used to control the temperature of the first sample. In a specific embodiment of the present application, the TEC cooler is disposed on the first sample.

[0045] The heat flow meter is used to measure the heat flow of radiation heat exchange between the first sample and the second sample. In a specific embodiment of the present application, the heat flow meter is arranged on the first sample.

[0046] The near-field thermal radiation experimental device provided in the present application moves the mobile platform 10 toward the fixing device 30 until the first sample 50 and the second sample 60 are completely fitted together. When the first sample 50 and the second sample 60 are completely fitted together, the two first samples 50 and the second samples 60 are in a parallel state, and then the second sample 60 is fixed by the fixing device 30, thereby ensuring the parallelism between the first sample 50 and the second sample 60, so as to conduct a near-field thermal radiation experiment. Since the above-mentioned leveling is achieved by the contact between the first sample 50 and the second sample 60, the nanometer-level parallelism between the first sample 50 and the second sample 60 can be guaranteed, thereby ensuring the subsequent detection accuracy.

[0047] like Figure 4 As shown, in one embodiment of the present application, a laser emitting device 41, a laser receiving device 42 and a second controller 43.

[0048] The laser emitting device 41 is disposed on the fixed platform 20 , and is used to emit laser light toward the second sample 60 .

[0049] The laser receiving device 42 is disposed on the fixed platform 20 and is used to receive the laser reflected by the second sample 60 and send an electrical signal.

[0050] The second controller 43 is connected to the laser receiving device 42 and the mobile platform 10, and is used for controlling the mobile platform 10 to stop moving according to the electrical signal.

[0051] When the first sample 50 and the second sample 60 are completely fitted together, the first sample 50 will lift up the second sample 60, and the laser receiving device 42 will receive the laser reflected by the second sample 60, which will produce fluctuations. At this time, the laser receiving device 42 sends out an electrical signal, and the second controller 43 receives the electrical signal and controls the moving platform 10 to stop moving according to the electrical signal, so as to achieve leveling of the first sample 50 and the second sample 60. The detection accuracy of the laser receiving device 42 and the laser emitting device 41 is high, so that the movement of the moving platform 10 can be controlled in time.

[0052] Several embodiments of the fixing device 30 are described in detail below with reference to the accompanying drawings:

[0053] Embodiment 1

[0054] like Figures 1 to 3 As shown, in one embodiment of the present application, the fixing device 30 includes: a curing adhesive 31 and a curing device 32 .

[0055] The curing adhesive 31 is disposed on the stepped surface 22 , and the viscosity of the curing adhesive 31 is 15000 cps to 50000 cps.

[0056] The curing device 32 is disposed on the fixed platform 20 and is used to apply curing conditions to the curing adhesive 31 .

[0057] The curing glue 31 is disposed between the second sample 60 and the stepped surface 22. When the first sample 50 and the second sample 60 are completely attached, the distance of the gap between the second sample 60 and the stepped surface 22 will change. Due to the fluidity of the curing glue 31, the curing glue 31 will fill the partially changed gap distance. Then, the curing device 32 applies curing conditions to the curing glue 31 to cure the curing glue 31 to ensure the parallelism between the first sample 50 and the second sample 60. The viscosity of the curing glue 31 is within the range of 15000cps to 50000cps. Under the condition of ensuring the fluidity of the curing glue 31, the uncured curing glue 31 can effectively support the second sample 60, thereby ensuring the parallelism between the first sample 50 and the second sample 60 after the curing glue 31 is cured.

[0058] In one embodiment of the present application, the curing glue includes the following components in terms of mass percentage: 85% to 90% of colloid and 10% to 15% of nanoparticles.

[0059] The colloid provides fluidity and partial viscosity for the cured adhesive, and the nanoparticles provide partial viscosity for the cured adhesive. The cured adhesive supported by the above ratio can ensure that the uncured cured adhesive effectively supports the second sample while ensuring the fluidity of the cured adhesive, thereby ensuring the parallelism between the first sample and the second sample after the cured adhesive is cured.

[0060] like Figures 1 to 3As shown, in one embodiment of the present application, the curing adhesive 31 is a light-curing adhesive, and the curing device 32 is a curing light source 322 , which is used to irradiate light to the light-curing adhesive.

[0061] The liquid light-curing adhesive is cured under the irradiation of ultraviolet rays, and effectively supports the second sample 60 , thereby ensuring the parallelism between the first sample 50 and the second sample 60 after the curing adhesive 31 is cured.

[0062] Embodiment 2

[0063] like Figures 5 to 7 As shown, the solution of the second embodiment is substantially the same as the solution of the first embodiment, and the difference is that the fixing device 30 includes a spring 33 , a glue injection device 34 and a curing device 32 .

[0064] The spring 33 is disposed on the step surface 22 for supporting the second sample 60 .

[0065] The glue injection device 34 is disposed on the fixed platform 20 and is used to inject the curing glue 31 between the second sample 60 and the stepped surface 22 .

[0066] The curing device 32 is disposed on the fixed platform 20 and is used to apply curing conditions to the curing adhesive 31 .

[0067] The spring 33 supports the second sample 60. When the first sample 50 and the second sample 60 are completely attached, the distance of the gap between the second sample 60 and the stepped surface 22 will change. The spring 33 continues to support the second sample 60 under the action of elastic force. The glue injection device 34 injects the curing glue 31 between the second sample 60 and the stepped surface 22. Due to the fluidity of the curing glue 31, the curing glue 31 will fill the space between the second sample 60 and the stepped surface 22. Then, the curing device 32 applies curing conditions to the curing glue 31 to cure the curing glue 31 to ensure the parallelism between the first sample 50 and the second sample 60. The setting of the spring 33 ensures that there is a large gap between the second sample 60 and the stepped surface 22, which facilitates the injection device 34 to inject the curing glue 31. In addition, the fixing device 30 may not include the spring 33.

[0068] like Figures 5 to 7 As shown, in one embodiment of the present application, the curing adhesive 31 is a thermal curing adhesive, and the curing device 32 is a heating device 321, which is used to heat the thermal curing adhesive.

[0069] After the liquid heat-curing adhesive is heated, the heat-curing adhesive molecules polymerize and cross-link into a three-dimensional network structure, forming an insoluble and infusible solid adhesive layer to effectively support the second sample 60, thereby ensuring the parallelism between the first sample 50 and the second sample 60 after the curing adhesive 31 is cured.

[0070] Embodiment 3

[0071] like Figures 8 to 11 As shown, in one embodiment of the present application, the fixing device 30 includes: a clamping device 35 and a first controller 36 .

[0072] The clamping device 35 is disposed on the fixed platform 20 and is used to clamp the second sample 60 .

[0073] The first controller 36 is connected to the clamping device 35 and controls the clamping device 35 to clamp the second sample 60 .

[0074] When the first sample 50 and the second sample 60 are completely attached, the two first samples 50 and the second sample 60 are in a parallel state, and the first control device controls the clamping device 35 to clamp the second sample 60 to ensure the parallelism between the first sample 50 and the second sample 60 .

[0075] The leveling method provided in the embodiment of the second aspect of the present application is used for a near-field thermal radiation experimental device, comprising the following steps:

[0076] Step S10, installing the first sample on the mobile platform.

[0077] Step S30, mounting the second sample on the stepped surface of the stepped hole on the fixing device, with the second sample protruding out of the stepped hole.

[0078] Step S40, controlling the mobile platform to move toward the fixing device until the first sample and the second sample are completely attached to each other.

[0079] Step S50, controlling the fixing device to fix the second sample on the fixing platform.

[0080] Step S60, adjusting the vacuum degree in the receiving chamber. -5 Below Pa.

[0081] Step S70, controlling the moving platform to move and adjusting the distance between the first sample and the second sample.

[0082] The leveling method of the present application moves a mobile platform toward a fixing device until the first sample and the second sample are completely fitted together. When the first sample and the second sample are completely fitted together, the two first samples and the second sample are in a parallel state. The second sample is then fixed by the fixing device, thereby ensuring the parallelism between the first sample and the second sample, so as to conduct a near-field thermal radiation experiment. Since the above-mentioned leveling is achieved by the contact between the first sample and the second sample, the nanometer-level parallelism between the first sample and the second sample can be guaranteed, thereby ensuring the subsequent detection accuracy.

[0083] In one embodiment of the present application, the following steps are included before step S30:

[0084] Step S31, injecting curing glue with a viscosity of 15000cps to 50000cps onto the step surface.

[0085] Step S50 specifically includes the following steps:

[0086] Step S51, controlling the curing device to apply curing conditions to the curing adhesive.

[0087] In one specific embodiment of the present application, the curing adhesive is a light curing adhesive, and the curing device is a curing light source, which is used to irradiate light to the light curing adhesive. In another specific embodiment of the present application, the curing adhesive is a heat curing adhesive, and the curing device is a heating device, which is used to heat the heat curing adhesive.

[0088] The curing glue is set between the second sample and the stepped surface. When the first sample and the second sample are completely attached, the distance of the gap between the second sample and the stepped surface will change. Due to the fluidity of the curing glue, the curing glue will fill the partially changed gap distance. Then, the curing device applies curing conditions to the curing glue to cure the curing glue to ensure the parallelism between the first sample and the second sample. The viscosity of the curing glue is within the range of 15000cps to 50000cps. While ensuring that the curing glue has fluidity, the uncured curing glue can ensure effective support for the second sample, thereby ensuring the parallelism between the first sample and the second sample after the curing glue is cured.

[0089] In one embodiment of the present application, step S50 specifically includes the following steps:

[0090] Step S51, injecting curing glue between the second sample and the stepped surface.

[0091] Step S52, controlling the curing device to apply curing conditions to the curing adhesive.

[0092] When the first sample and the second sample are completely fitted together, the distance of the gap between the second sample and the step surface will change, and the glue injection device injects curing glue into the gap between the second sample and the step surface. Due to the fluidity of the curing glue, the curing glue will fill the gap between the second sample and the step surface. Then, the curing device applies curing conditions to the curing glue to cure the curing glue, thereby ensuring the parallelism between the first sample and the second sample.

[0093] In a specific embodiment of the present application, the curing adhesive is a light-curing adhesive, and the curing device is a curing light source, which is used to irradiate light to the light-curing adhesive.

[0094] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present application. In the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0095] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A near-field thermal radiation experimental device, characterized in that: include: A housing having a receiving cavity; A bracket, wherein the bracket is arranged in the accommodating cavity; A vacuum device, which is fixed to the housing and is used to control the vacuum degree in the accommodating chamber; A movable platform, the movable platform is arranged on the bracket and can move relative to the bracket, and the movable platform is used to support the first sample; A fixed platform, the fixed platform is arranged above the moving platform, the fixed platform is provided with a stepped hole penetrating the fixed platform, and the stepped surface of the stepped hole is used to support the second sample; as well as A fixing device, the fixing device is arranged on the fixing platform and is used to fix the second sample and the first sample after they are completely attached to each other; The fixing device comprises: curing glue, the curing glue is arranged on the step surface, and the viscosity of the curing glue is 15000cps to 50000cps; and a curing device, the curing device being disposed on the fixed platform and being used for applying curing conditions to the curing adhesive; The curing adhesive is a light-curing adhesive, and the curing device is a curing light source, and the curing light source is used to irradiate light to the light-curing adhesive; The fixing device comprises: a clamping device, which is arranged on the fixing platform and is used to clamp the second sample; and a first controller, the first controller being connected to the clamping device and controlling the clamping device to clamp the second sample; A laser emitting device, the laser emitting device is disposed on the fixed platform and is used to emit laser light toward the second sample; a laser receiving device, the laser receiving device being disposed on the fixed platform and configured to receive the laser reflected by the second sample and send an electrical signal; and A second controller is connected to the laser receiving device and the mobile platform, and is used for controlling the mobile platform to stop moving according to the electrical signal.

2. A leveling method for a near-field thermal radiation experimental device, characterized in that: The steps include: mounting a first sample on a moving platform; Mounting the second sample on the stepped surface of the stepped hole on the fixture, with the second sample protruding out of the stepped hole; Controlling the movable platform to move toward the fixing device until the first sample is completely attached to the second sample; controlling the fixing device to fix the second sample on the fixing platform; Controlling the movement of the mobile platform to adjust the distance between the first sample and the second sample; The fixing device comprises: a curing glue, the curing glue is arranged on the step surface, and the viscosity of the curing glue is 15000cps to 50000cps; as well as a curing device, the curing device being disposed on the fixed platform and being used for applying curing conditions to the curing adhesive; The curing adhesive is a light-curing adhesive, and the curing device is a curing light source, and the curing light source is used to irradiate light to the light-curing adhesive; The following steps are included before the step of mounting the second sample on the stepped surface of the stepped hole on the fixture: Inject curing glue with a viscosity of 15000cps to 50000cps on the step surface; The step of controlling the fixing device to fix the second sample on the fixing platform specifically includes the following steps: controlling the curing device to apply curing conditions to the curing adhesive; The step of controlling the fixing device to fix the second sample on the fixing platform specifically includes the following steps: injecting curing glue between the second sample and the stepped surface; The curing device is controlled to apply curing conditions to the curing adhesive.

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