A frame-type encapsulation structure with an antenna column and a preparation method thereof

Abstract

An embodiment of the present invention discloses a frame-type encapsulation structure with antenna columns and a preparation method thereof. The encapsulation structure includes: an encapsulation frame; an antenna, which is fixed on the encapsulation frame and located in the area surrounded by the encapsulation frame; a metal strip, which includes a first antenna column and a second antenna column formed by stamping. The first antenna column is electrically connected to the first end of the antenna, and the second antenna column is electrically connected to the second end of the antenna; a plastic encapsulant for overall encapsulation, which includes a first opening and a second opening. The first opening exposes the end of the first antenna column far from the antenna, and the second opening exposes the end of the second antenna column far from the antenna. The technical solution provided by the embodiment of the present invention can realize the installation of the encapsulated antenna through the independent and exposed antenna columns, and directly make the antenna inside the encapsulation, reducing the overall volume of the product and improving the integration degree of the product.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of antennas, and particularly to a frame-type packaging structure with an antenna column and a preparation method thereof. Background Art

[0002] With the popularization of high-tech electronic products and the increase of people's demands, especially to meet the needs of mobility, most high-tech electronic products have added wireless communication functions.

[0003] Existing antenna structures usually directly fabricate the antenna on the surface of the circuit board, which is separated from the packaging. However, directly fabricating the antenna on the surface of the circuit board will occupy additional circuit board area and has poor integration. For various high-tech electronic products, if the antenna is directly fabricated on the surface of the circuit board, a circuit board with a larger area will be required, which will also make the high-tech electronic products occupy a larger volume and increase the product cost, which is contrary to people's demands for miniaturization and portability of high-tech electronic products. Summary of the Invention

[0004] Embodiments of the present invention provide a frame-type packaging structure with an antenna column and a preparation method thereof to reduce the circuit board area, shrink the overall volume of the product, and improve the integration of the product.

[0005] In a first aspect, embodiments of the present invention provide a frame-type packaging structure with an antenna column, including:

[0006] A packaging frame;

[0007] An antenna, which is fixed on the packaging frame and located in the area surrounded by the packaging frame;

[0008] A metal strip, which includes a first antenna column and a second antenna column formed by stamping. The first antenna column is electrically connected to the first end of the antenna, and the second antenna column is electrically connected to the second end of the antenna;

[0009] A plastic encapsulant for overall encapsulation, which includes a first opening and a second opening. The first opening exposes the end of the first antenna column far from the antenna, and the second opening exposes the end of the second antenna column far from the antenna.

[0010] Optionally, the packaging frame includes a first packaging frame segment and a second packaging frame segment truncated by a first punching area and a second punching area; the first end of the metal strip is connected to the first packaging frame segment, and the second end of the metal strip is connected to the second packaging frame segment;

[0011] The first antenna column is electrically connected to the first end of the antenna through the first segment of the encapsulation frame; the second antenna column is electrically connected to the second end of the antenna through the second segment of the encapsulation frame.

[0012] Optionally, the encapsulation frame includes a first segment of the encapsulation frame and a second segment of the encapsulation frame formed by truncating through a first punching area and a second punching area; there is a third punching area between the first end of the metal strip and the first segment of the encapsulation frame, and there is a fourth punching area between the second end of the metal strip and the second segment of the encapsulation frame;

[0013] The first end of the antenna is connected to the first segment of the encapsulation frame through a first pad, and the first antenna column is connected to the first segment of the encapsulation frame through the second pad; the second antenna column is directly electrically connected to the second end of the antenna.

[0014] Optionally, the bottom of the plastic package exposes the first pad and the second pad.

[0015] Optionally, the frame-type package structure with antenna columns further includes:

[0016] A frame carrier and internal electronic devices disposed on the frame carrier; wherein, the internal electronic devices include chips.

[0017] Optionally, the frame-type package structure with antenna columns further includes:

[0018] A plurality of frame pads, and the internal electronic devices are connected to the frame pads through metal leads; the bottom of the plastic package exposes the frame pads.

[0019] Optionally, the frame pads, the first pad, and / or the second pad exposed at the bottom of the plastic package are electrically connected to a PCB adapter board.

[0020] Optionally, the metal strip further includes at least two third antenna columns formed by stamping, and at least two of the third antenna columns are connected to the first segment of the encapsulation frame.

[0021] In a second aspect, an embodiment of the present invention provides a method for manufacturing a frame-type package structure with antenna columns, including:

[0022] Providing an encapsulation frame;

[0023] Forming an antenna on the encapsulation frame, and the antenna is located in the area surrounded by the encapsulation frame;

[0024] Form a metal strip, the metal strip including a first antenna column and a second antenna column formed by stamping, the first antenna column being electrically connected to the first end of the antenna, and the second antenna column being electrically connected to the second end of the antenna;

[0025] Form a plastic encapsulant for overall encapsulation, the plastic encapsulant including a first opening and a second opening, the first opening exposing one end of the first antenna column away from the antenna, and the second opening exposing one end of the second antenna column away from the antenna.

[0026] Optionally, forming the first antenna column and the second antenna column includes:

[0027] Stamp a metal strip through a mold to form a three-dimensional metal strip with a protruding portion;

[0028] After forming the plastic encapsulant for overall encapsulation, grind the plastic encapsulant by grinding to expose the protruding portion of the three-dimensional metal strip;

[0029] Continue to grind and remove the cross beam of the protruding portion by grinding to form the first antenna column and the second antenna column.

[0030] An embodiment of the present invention provides a frame-type encapsulation structure with antenna columns and a preparation method thereof. The frame-type encapsulation structure with antenna columns includes: an encapsulation frame; an antenna, the antenna being fixed on the encapsulation frame and located in the area surrounded by the encapsulation frame; a metal strip, the metal strip including a first antenna column and a second antenna column formed by stamping, the first antenna column being electrically connected to the first end of the antenna, and the second antenna column being electrically connected to the second end of the antenna; a plastic encapsulant for overall encapsulation, the plastic encapsulant including a first opening and a second opening, the first opening exposing one end of the first antenna column away from the antenna, and the second opening exposing one end of the second antenna column away from the antenna. The technical solution provided by the embodiment of the present invention stamps the metal strip on the frame into a first antenna column and a second antenna column by stamping and other methods. The first antenna column is electrically connected to the first end of the antenna, and the second antenna column is electrically connected to the second end of the antenna. After the plastic encapsulation process, the plastic encapsulant includes a first opening and a second opening. The first opening exposes one end of the first antenna column away from the antenna, and the second opening exposes one end of the second antenna column away from the antenna. The antenna columns are independent and exposed, enabling the installation of the encapsulated antenna, and directly making the antenna inside the encapsulation, reducing the overall volume of the product and improving the integration of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is an internal structure schematic diagram of a frame-type encapsulation structure with antenna columns provided by an embodiment of the present invention;

[0032] Figure 2It is a schematic external structure diagram of a frame-type packaging structure with an antenna column provided by an embodiment of the present invention;

[0033] Figure 3 It is a top view of the top of the external structure of a frame-type packaging structure with an antenna column provided by an embodiment of the present invention;

[0034] Figure 4 It is a schematic structure diagram of the internal structure of a frame-type packaging structure with an antenna column before stamping provided by an embodiment of the present invention;

[0035] Figure 5 It is a schematic structure diagram of the internal structure of a frame-type packaging structure with an antenna column during stamping provided by an embodiment of the present invention;

[0036] Figure 6 It is a schematic structure diagram of the internal structure of a frame-type packaging structure with an antenna column after stamping provided by an embodiment of the present invention;

[0037] Figure 7 It is a top view of the internal structure of a frame-type packaging structure with an antenna column after stamping provided by an embodiment of the present invention;

[0038] Figure 8 It is a schematic diagram of the internal structure of another frame-type packaging structure with an antenna column provided by an embodiment of the present invention;

[0039] Figure 9 It is a schematic structure diagram of the internal structure of another frame-type packaging structure with an antenna column before stamping provided by an embodiment of the present invention;

[0040] Figure 10 It is a schematic structure diagram of the internal structure of another frame-type packaging structure with an antenna column after stamping provided by an embodiment of the present invention;

[0041] Figure 11 It is a top view of the bottom of the external structure of a frame-type packaging structure with an antenna column provided by an embodiment of the present invention;

[0042] Figure 12 It is a flowchart of a preparation method of a frame-type packaging structure with an antenna column provided by an embodiment of the present invention. Detailed implementation manners

[0043] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all structures.

[0044] As described in the background art, with the popularization of high-tech electronic products and the increasing demands of people, especially to meet the needs of mobility, most high-tech electronic products have added wireless communication functions. Devices need to be equipped with antennas to achieve wireless communication functions. An antenna is a component in a radio device used to transmit or receive electromagnetic waves. An antenna can effectively radiate / receive signals from other devices in a communication network. The antenna converts the guided wave propagating on the transmission line into an electromagnetic wave propagating in an unbounded medium (usually free space), or performs the reverse conversion. Engineering systems such as radio communication, broadcasting, television, radar, navigation, electronic countermeasures, remote sensing, and radio astronomy, which use electromagnetic waves to transmit information, all rely on antennas to work. In addition, in terms of transmitting energy with electromagnetic waves, non-signal energy radiation also requires an antenna. Generally, an antenna has reversibility, that is, the same antenna can be used as both a transmitting antenna and a receiving antenna. The basic characteristic parameters of the same antenna as a transmitter or receiver are the same.

[0045] The existing antenna structure usually directly fabricates the antenna on the surface of the circuit board, which is separate from the package. However, directly fabricating the antenna on the surface of the circuit board will cause the antenna to occupy additional circuit board area and have poor integration. For various high-tech electronic products, if the antenna is directly fabricated on the surface of the circuit board, a circuit board with a larger area will be required, which will also make the high-tech electronic products occupy a larger volume and increase the product cost, which goes against people's demands for miniaturization and portability of high-tech electronic products.

[0046] In view of this, first, an embodiment of the present invention provides a frame-type package structure with antenna columns. Figure 1 FIG. is a schematic internal structure diagram of a frame-type package structure with antenna columns provided by an embodiment of the present invention; Figure 2 FIG. is a schematic external structure diagram of a frame-type package structure with antenna columns provided by an embodiment of the present invention; Figure 3 FIG. is a top view of the top of the external structure of a frame-type package structure with antenna columns provided by an embodiment of the present invention. Refer to Figures 1-3 , the package structure includes:

[0047] A package frame 10;

[0048] An antenna 20, which is fixed on the package frame 10 and is located in the area surrounded by the package frame 10;

[0049] A metal strip 30, the metal strip 30 includes a first antenna column 31 and a second antenna column 32 formed by stamping. The first antenna column 31 is electrically connected to the first end of the antenna 20, and the second antenna column 32 is electrically connected to the second end of the antenna 20;

[0050] The plastic encapsulation body 40 for overall encapsulation, the plastic encapsulation body 40 includes a first opening and a second opening, the first opening exposes one end of the first antenna post 31 far from the antenna, and the second opening exposes one end of the second antenna post 32 far from the antenna.

[0051] Specifically, the material of the encapsulation frame 10 can be a metal material, and the structure of the encapsulation frame 10 can be a polygonal structure, a circular structure or an elliptical structure ( Figure 1 exemplarily showing that the antenna pattern is a polygonal structure). The metal encapsulation frame 10 can function to conduct and transmit electrical signals. In addition, during the process of preparing the frame-type encapsulation structure with antenna posts, the encapsulation frame 10 can also function to fix the internal components of the encapsulation. The antenna 20 is fixed on the encapsulation frame 10 and is located in the area surrounded by the encapsulation frame 10. The material of the antenna 20 includes metal materials with good electrical conductivity such as a copper layer, an aluminum layer, a gold layer, a silver layer, etc. The antenna 20 has an antenna pattern, and the antenna pattern can include an I-shaped, a loop-shaped or a serpentine-shaped, etc. ( Figure 1 exemplarily showing that the antenna pattern is a serpentine shape), and the pattern of the antenna 20 can be determined according to the frequency, i.e., the wavelength, of the signal to be transmitted or received.

[0052] Next to the frame carrier of the frame-type encapsulation, a metal strip 30 with a suitable width is made by means of etching or the like. The metal strip 30 is used to form the first antenna post 31 and the second antenna post 32 by stamping. The first antenna post 31 is electrically connected to the first end of the antenna, and the second antenna post 32 is electrically connected to the second end of the antenna. The whole encapsulation is plastic encapsulated using a traditional plastic encapsulation process to form the plastic encapsulation body 40 for overall encapsulation. The plastic encapsulation body 40 functions to protect the antenna 20. The material of the plastic encapsulation body 40 includes one or a combination of polyimide, silica gel and epoxy resin. The plastic encapsulation body 40 includes a first opening and a second opening. The first opening exposes one end of the first antenna post 31 far from the antenna 20, and the second opening exposes one end of the second antenna post 32 far from the antenna 20. The excess plastic encapsulation material can be removed by means of grinding or the like to expose the upper surface of the antenna post. Or a small amount of plastic encapsulation material is reserved to form a body plastic encapsulation, directly exposing the upper surface of the antenna post. The antenna posts are independent and exposed, enabling the installation of the encapsulated antenna.

[0053] Among them, the formation process of the first antenna post 31 and the second antenna post 32 can be to use a stamping die to stamp the metal strip 30, and directly form metal posts along the stamping direction (refer to Figure 1 ). Figure 4 is a schematic structural diagram of the internal structure of a frame-type encapsulation structure with antenna posts provided by an embodiment of the present invention before stamping; Figure 5 is a schematic structural diagram of the internal structure of a frame-type encapsulation structure with antenna posts provided by an embodiment of the present invention during stamping; Figure 6It is a schematic structural view after stamping of the internal structure of a frame-type encapsulation structure with antenna columns provided by an embodiment of the present invention. Refer to Figures 4-6 , the forming process of the first antenna column 31 and the second antenna column 32 can also be to form a three-dimensional metal strip with a protruding part by stamping a metal strip 30 with a mold; after forming a plastic encapsulation body 40 for overall encapsulation, grind the plastic encapsulation body 40 by grinding to expose the protruding part of the three-dimensional metal strip 30; continue to grind and remove the cross beam 301 of the protruding part by grinding to form the first antenna column 31 and the second antenna column 32. Figure 7 It is a top view after stamping of the internal structure of a frame-type encapsulation structure with antenna columns provided by an embodiment of the present invention. Refer to Figure 7 , a three-dimensional metal strip 30 with a protruding part is formed by stamping a metal strip 30 with a mold, and independent metal columns have not been formed yet.

[0054] An embodiment of the present invention provides a frame-type encapsulation structure with antenna columns, wherein the frame-type encapsulation structure with antenna columns includes: an encapsulation frame; an antenna, the antenna is fixed on the encapsulation frame and is located in the area surrounded by the encapsulation frame; a metal strip, the metal strip includes a first antenna column and a second antenna column formed by stamping, the first antenna column is electrically connected to the first end of the antenna, and the second antenna column is electrically connected to the second end of the antenna; a plastic encapsulation body for overall encapsulation, the plastic encapsulation body includes a first opening and a second opening, the first opening exposes the end of the first antenna column far from the antenna, and the second opening exposes the end of the second antenna column far from the antenna. The antenna columns are independent and exposed, which can realize the installation of the encapsulated antenna, and the antenna is directly made inside the encapsulation, reducing the overall volume of the product and improving the integration of the product.

[0055] Optionally, refer to Figure 1 , the encapsulation frame includes a first encapsulation frame segment 11 and a second encapsulation frame segment 12 truncated by a first punching area 13 and a second punching area 14; the first end of the metal strip 30 is connected to the first encapsulation frame segment 11, and the second end of the metal strip 30 is connected to the second encapsulation frame segment 12;

[0056] The first antenna column 31 is electrically connected to the first end of the antenna 20 through the first encapsulation frame segment 11; the second antenna column 32 is electrically connected to the second end of the antenna 20 through the second encapsulation frame segment 12.

[0057] Specifically, the first punching area 13 and the second punching area 14 can be formed by stamping with a stamping die. The process of forming the first punching area 13 and the second punching area 14 by stamping the encapsulation frame with a stamping die can occur simultaneously with the process of forming the first antenna column 31 and the second antenna column 32 by stamping the metal strip 30 with a stamping die, so as to improve the preparation efficiency of the encapsulation structure. The first punching area 13 and the second punching area 14 divide the encapsulation frame into a first encapsulation frame segment 11 and a second encapsulation frame segment 12. The first end of the metal strip 30 is connected to the first encapsulation frame segment 11, and the second end of the metal strip 30 is connected to the second encapsulation frame segment 12. Therefore, the first antenna column 31 is electrically connected to the first encapsulation frame segment 11, and the second antenna column 32 is electrically connected to the second encapsulation frame segment 12. The first encapsulation frame segment 11 is also electrically connected to the first end of the antenna 20, and the second encapsulation frame segment 12 is also electrically connected to the second end of the antenna 20. Thus, the first antenna column 31 is electrically connected to the first end of the antenna 20 through the first encapsulation frame segment 11; the second antenna column 32 is electrically connected to the second end of the antenna 20 through the second encapsulation frame segment 12. The antenna 20 can achieve signal transmission with the external circuit of the encapsulation structure through the first antenna column 31 and the second antenna column. The first punching area 13 and the second punching area 14 punch the encapsulation frame into two parts, which can disconnect the circuit and prevent short circuit.

[0058] Optionally, Figure 8 is a schematic internal structure diagram of another frame-type encapsulation structure with antenna columns provided by an embodiment of the present invention. Refer to Figure 8 , the encapsulation frame includes a first encapsulation frame segment 11 and a second encapsulation frame segment 12 truncated by a first punching area 13 and a second punching area 14; there is a third punching area 34 between the first end of the metal strip 30 and the first encapsulation frame segment 11, and there is a fourth punching area 35 between the second end of the metal strip 30 and the second encapsulation frame segment 12;

[0059] The first end of the antenna 20 is connected to the first encapsulation frame segment 11 through a first pad 51, and the first antenna column 31 is connected to the first encapsulation frame segment 11 through a second pad 52; the second antenna column 32 is directly electrically connected to the second end of the antenna 20.

[0060] Specifically, the first punching area 13 and the second punching area 14 can be formed by stamping with a stamping die. Similarly, the third punching area 34 and the fourth punching area 35 can be formed by stamping with a stamping die. The process of forming the first punching area 13 and the second punching area 14 by stamping the encapsulation frame with a stamping die, the process of forming the third punching area 34 and the fourth punching area 35 by stamping the encapsulation frame with a stamping die, and the process of forming the first antenna column 31 and the second antenna column 32 by stamping the metal strip 30 with a stamping die can occur simultaneously to improve the preparation efficiency of the encapsulation structure. The first punching area 13 and the second punching area 14 divide the encapsulation frame into a first encapsulation frame segment 11 and a second encapsulation frame segment 12. There is a third punching area 34 between the first end of the metal strip 30 and the first encapsulation frame segment 11, and there is a fourth punching area 35 between the second end of the metal strip 30 and the second encapsulation frame segment 12, that is, the first end of the metal strip 30 is disconnected from the first encapsulation frame segment 11, and the second end of the metal strip 30 is disconnected from the second encapsulation frame segment 12. The first pad 51 and the second pad 52 are added inside the encapsulation structure. The first end of the antenna 20 is connected to the first encapsulation frame segment 11 through the first pad 51, and the first antenna column 31 is connected to the first encapsulation frame segment 11 through the second pad 52, so as to realize the conduction between the first end of the antenna 20 and the first antenna column 31. The second antenna column 32 is directly electrically connected to the second end of the antenna 20. The antenna 20 can realize signal transmission between the first antenna column 31 and the second antenna column 31 and the external circuit of the encapsulation structure. The first punching area 13 and the second punching area 14 punch the encapsulation frame into two parts, which can disconnect the circuit and prevent short circuit.

[0061] Optionally, the bottom of the plastic package 40 can expose the first pad 51 and the second pad 52. The antenna 20 can also realize signal transmission between the first pad 51 and the second pad 52 and the external circuit of the encapsulation structure. Among them, the first antenna column 31 and the second antenna column 32 protrude from one side of the upper surface of the plastic package 40, and the first pad 51 and the second pad 52 protrude from one side of the lower surface of the plastic package 40.

[0062] Optionally, referring to Figure 8 , the frame-type encapsulation structure with antenna columns further includes a frame carrier 60 and internal electronic devices 70 arranged on the frame carrier 60; among them, the internal electronic devices 70 include chips. It also includes a plurality of frame pads 53, and the internal electronic devices 70 are connected to the frame pads 53 through metal leads; the bottom of the plastic package 40 exposes the frame pads 53.

[0063] Specifically, the frame-type packaging structure with antenna columns may further include internal electronic devices 70, which may include, for example, control chips. The internal electronic devices 70 are disposed on the frame carrier 60, and the frame carrier 60 may be a substrate for carrying the internal electronic devices 70. The frame-type packaging structure with antenna columns further includes a plurality of frame pads 53, and the internal electronic devices 70 are connected to the frame pads 53 through metal leads. The number of the frame pads 53 is not limited herein.

[0064] Figure 9 FIG. 4 is a schematic structural diagram of the internal structure of another frame-type packaging structure with antenna columns provided by an embodiment of the present invention before stamping. Refer to Figure 9 , the frame carrier 70, the frame pads 53, and the metal strip 30 are fixed on the packaging frame 10. In the preparation process of the frame-type packaging structure with antenna columns, if it is necessary to transfer to another preparation device or position, the frame carrier 70, the frame pads 53, and the metal strip 30 are fixed on the packaging frame 10, which can ensure that the arrangement modes of the internal electronic devices 70, the frame pads 53, and the metal strip 30 on the frame carrier 60 remain unchanged. This avoids the situation where, if the frame carrier and the frame pads 53 are not fixed to the packaging frame 10, during the transfer process, it is necessary to re-arrange the internal electronic devices 70 and the frame pads 53 on the frame carrier 60 again, simplifying the preparation process of the frame-type packaging structure with antenna columns.

[0065] Figure 10 FIG. 10 is a schematic structural diagram of the internal structure of another frame-type packaging structure with antenna columns provided by an embodiment of the present invention after stamping. Refer to Figure 10 , in the later stage of the preparation of the frame-type packaging structure with antenna columns, it is necessary to cut off the frame pads 53 from the packaging frame 10 and cut off the frame carrier 60 from the packaging frame 10 to prevent short circuits. The metal strip 30 is stamped by a mold to form an antenna column or a three-dimensional metal strip with a protrusion ( Figure 10 Exemplarily, it shows that the metal strip 30 is stamped by a mold to form a three-dimensional metal strip 30 with a protrusion and is not directly cut off). The process of cutting off the frame pads 53 from the packaging frame 10 and the process of cutting off the frame carrier 60 from the packaging frame 10 may occur simultaneously with the above process of forming, for example, the first cut-off area 13, so as to further simplify the preparation process of the packaging structure. In addition, preparing the internal electronic devices 70 and the antenna 20 in the same package can reduce the area of the PCB board, reduce the product cost, and at the same time, can reduce the signal transmission distance and reduce the signal loss during the transmission process.

[0066] Optionally, Figure 11 FIG. 19 is a bottom view of the external structure of a frame-type packaging structure with antenna columns provided by an embodiment of the present invention. Refer to Figure 11, the bottom of the plastic package 40 can expose the frame pad 53. Signal transmission can be achieved between the external circuits of the internal electronic devices within the package structure through the frame pad 53. The connection between the internal electronic devices within the package structure and the antenna from outside the package structure can also be achieved through the frame pad 53 and the first pad 51 and / or the second pad 52. The first pad 51, the second pad 52, and the frame pad 53 are exposed from the same side of the plastic package. Optionally, the frame pad 53, the first pad 51, and / or the second pad 52 exposed at the bottom of the plastic package can be electrically connected to the PCB adapter board.

[0067] Optionally, referring to Figure 1 and Figure 8 , the metal strip 30 further includes at least two third antenna posts 33 formed by stamping, and the at least two third antenna posts 33 are connected to the second package frame segment 12 of the package frame.

[0068] Exemplarily, referring to Figure 6 , in combination with Figure 1 and Figure 8 , the mold 80 for forming the antenna posts, for example, has two rectangular parallelepiped protrusions 81. The two protrusions 81 are spaced apart and are in the same row. When the upper and lower molds stamp the metal strip 30, under the action of the two protrusions 81 on the lower mold 80, the metal strip 30 can be stamped into an I-shaped three-dimensional metal strip 30. After the plastic package is formed, the plastic package is ground to expose the protruding part of the three-dimensional metal strip; the cross beam of the protruding part is further ground and removed by grinding, and the first antenna post 31, the second antenna post 32, and the two third antenna posts 33 located between the first antenna post 31 and the second antenna post 32 can be formed. The two third antenna posts 33 can be connected to the second package frame segment 12 of the package frame to transmit the internal signals of the package structure outward or transmit the external signals into the package structure.

[0069] The frame-type package structure with antenna posts provided by the embodiment of the present invention directly stamps the metal strip on the package frame into a bow-shaped structure by stamping or other means. After the die bonding and plastic packaging processes, the product is ground until the bow-shaped antenna cross beam is completely removed and the antenna posts are independent and exposed for installing the package antenna. The antenna is directly made inside the package, which reduces the signal transmission distance and significantly reduces the area of the PCB board while reducing the product cost.

[0070] The embodiment of the present invention also provides a preparation method for a frame-type package structure with antenna posts, Figure 12 is a flowchart of the preparation method for a frame-type package structure with antenna posts provided by the embodiment of the present invention. Referring to Figure 12 , the preparation method includes:

[0071] S110. Provide a packaging frame.

[0072] Specifically, the material of the packaging frame can be a metal material, and the structure of the packaging frame can be a polygonal structure, a circular structure or an elliptical structure. The packaging frame of the metal frame can play a role in conducting and transmitting electrical signals. In addition, during the process of preparing the frame-type packaging structure with antenna posts, the packaging frame can also play a role in fixing the internal components of the package.

[0073] S120. Form an antenna on the packaging frame, and the antenna is located in the area surrounded by the packaging frame.

[0074] Specifically, the antenna is fixed on the packaging frame and is located in the area surrounded by the packaging frame. The material of the antenna includes metal materials with good electrical conductivity such as copper layer, aluminum layer, gold layer, silver layer, etc. The antenna has an antenna pattern, and the antenna pattern can include an I-shaped, a loop-shaped or a serpentine shape, etc. The pattern of the antenna can be determined according to the frequency (i.e., wavelength) of the signal transmitted or received.

[0075] S130. Form metal strips, which include a first antenna post and a second antenna post formed by stamping. The first antenna post is electrically connected to the first end of the antenna, and the second antenna post is electrically connected to the second end of the antenna.

[0076] Specifically, beside the frame carrier of the frame-type package, a metal strip with a suitable width is made by means of etching, etc. The metal strip is used to form a first antenna post and a second antenna post by stamping. The first antenna post is electrically connected to the first end of the antenna, and the second antenna post is electrically connected to the second end of the antenna. Among them, the formation process of the first antenna post and the second antenna post can be to use a stamping die to stamp the metal strip, and directly form metal posts along the stamping direction.

[0077] S140. Form a plastic package for overall packaging. The plastic package includes a first opening and a second opening. The first opening exposes one end of the first antenna post away from the antenna, and the second opening exposes one end of the second antenna post away from the antenna.

[0078] Specifically, use the traditional plastic packaging process to package the whole package to form a plastic package for overall packaging. The plastic package plays a role in protecting the antenna. The material of the plastic package includes one or a combination of polyimide, silica gel and epoxy resin. The plastic package includes a first opening and a second opening. The first opening exposes one end of the first antenna post away from the antenna, and the second opening exposes one end of the second antenna post away from the antenna. The excess plastic packaging material can be removed by means of grinding, etc., so that the upper surface of the antenna post is exposed. Or reserve a small amount of plastic packaging material to form a body plastic package, and directly expose the upper surface of the antenna post. The antenna posts are independent and exposed, and the installation of the packaged antenna can be realized.

[0079] Optionally, the forming process of the first antenna column and the second antenna column can also be to form a three-dimensional metal strip with a protruding part by stamping a metal strip with a mold; after forming a plastic package body for overall encapsulation, grind the plastic package body by grinding to expose the protruding part of the three-dimensional metal strip; continue to grind and remove the cross beam of the protruding part by grinding to form the first antenna column and the second antenna column. The preparation method of the frame-type encapsulation structure with antenna columns provided by the embodiments of the present invention directly stamps the metal strip on the encapsulation frame into a bow-shaped structure by means of stamping or the like. After the die bonding and plastic encapsulation processes, the product is ground until the bow-shaped antenna cross beam is completely removed and the antenna columns are independent and exposed for installing the encapsulated antenna. The antenna is directly made in the encapsulation, which reduces the signal transmission distance and significantly reduces the area of the PCB board while reducing the product cost.

[0080] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A frame-type encapsulation structure with an antenna post, characterized in that, it includes: an encapsulation frame; an antenna, the antenna is fixed on the encapsulation frame and is located in the area surrounded by the encapsulation frame; a metal strip, the metal strip includes a first antenna post and a second antenna post formed by stamping, the first antenna post is electrically connected to the first end of the antenna, and the second antenna post is electrically connected to the second end of the antenna; a plastic package for overall encapsulation, the plastic package includes a first opening and a second opening, the first opening exposes one end of the first antenna post away from the antenna, and the second opening exposes one end of the second antenna post away from the antenna; wherein, the metal strip is formed into a three-dimensional metal strip with a protruding part by die stamping. After forming the plastic package for overall encapsulation, the plastic package is ground to expose the protruding part of the three-dimensional metal strip; then continue to grind and remove the cross beam of the protruding part by grinding to form the first antenna post and the second antenna post; the encapsulation frame includes a first encapsulation frame segment and a second encapsulation frame segment truncated by a first punching area and a second punching area; the first end of the metal strip is connected to the first encapsulation frame segment, and the second end of the metal strip is connected to the second encapsulation frame segment; the first antenna post is electrically connected to the first end of the antenna through the first encapsulation frame segment, and the second antenna post is electrically connected to the second end of the antenna through the second encapsulation frame segment; the metal strip further includes at least two third antenna posts formed by stamping, and at least two of the third antenna posts are connected to the second encapsulation frame segment of the encapsulation frame.

2. The frame-type encapsulation structure with an antenna post according to claim 1, characterized in that, the encapsulation frame includes a first encapsulation frame segment and a second encapsulation frame segment truncated by a first punching area and a second punching area; there is a third punching area between the first end of the metal strip and the first encapsulation frame segment, and there is a fourth punching area between the second end of the metal strip and the second encapsulation frame segment; the first end of the antenna is connected to the first encapsulation frame segment through a first pad, and the first antenna post is connected to the first encapsulation frame segment through a second pad; the second antenna post is directly electrically connected to the second end of the antenna.

3. The frame-type encapsulation structure with an antenna post according to claim 2, characterized in that, the bottom of the plastic package exposes the first pad and the second pad.

4. The frame-type encapsulation structure with an antenna post according to claim 3, characterized in that, it further includes: a frame carrier and internal electronic devices arranged on the frame carrier; wherein, the internal electronic devices include chips.

5. The frame-type encapsulation structure with an antenna post according to claim 4, characterized in that, it further includes: a plurality of frame pads, the internal electronic devices are connected to the frame pads through metal leads; the bottom of the plastic package exposes the frame pads.

6. The frame-type encapsulation structure with an antenna post according to claim 5, wherein, the frame pads, the first pad and / or the second pad exposed at the bottom of the plastic package are electrically connected to the PCB adapter board.

7. A method for manufacturing a frame-type encapsulation structure with an antenna post, wherein, it includes: providing an encapsulation frame; forming an antenna on the encapsulation frame, and the antenna is located in the area surrounded by the encapsulation frame; forming a metal strip, the metal strip includes a first antenna post and a second antenna post formed by stamping, the first antenna post is electrically connected to the first end of the antenna, and the second antenna post is electrically connected to the second end of the antenna; forming a plastic package for overall encapsulation, the plastic package includes a first opening and a second opening, the first opening exposes one end of the first antenna post away from the antenna, and the second opening exposes one end of the second antenna post away from the antenna; wherein, forming the first antenna post and the second antenna post includes: forming a three-dimensional metal strip with a protrusion by stamping a metal strip with a mold; after forming the plastic package for overall encapsulation, grinding the plastic package to expose the protrusion of the three-dimensional metal strip; continuing to grind and remove the cross beam of the protrusion to form the first antenna post and the second antenna post; wherein, the encapsulation frame includes a first encapsulation frame segment and a second encapsulation frame segment formed by truncating through a first punching area and a second punching area; the first end of the metal strip is connected to the first encapsulation frame segment, and the second end of the metal strip is connected to the second encapsulation frame segment; the first antenna post is electrically connected to the first end of the antenna through the first encapsulation frame segment, and the second antenna post is electrically connected to the second end of the antenna through the second encapsulation frame segment.

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