Electronic packaging

Abstract

The present invention relates to an electronic package and its substrate structure. The electronic package of the present invention is used to mount an electronic component on a substrate structure, wherein a plurality of second electrical contact pads of the substrate structure are arranged along the contours of the first electrical contact pads. This allows one side of the electronic component to be electrically connected to one of the second electrical contact pads of an appropriate voltage value, as required, while the other side is electrically connected to the first electrical contact pad. This eliminates the need to develop multiple substrates of different specifications, thereby reducing process time and cost.

Description

Technical Field

[0001] The present invention relates to a packaging substrate, and in particular to an electronic packaging component with a special wiring design and a substrate structure thereof. Background Art

[0002] With the rapid development of the electronics industry, most electronic products are moving towards miniaturization and high speed. In particular, the development of the communications industry has been widely integrated into various electronic products, such as cell phones and laptops.

[0003] Currently, mobile communication devices often incorporate passive components, such as capacitors, on their packaging substrates. These components act as DC blocks to protect against electrostatic discharge (ESD), preventing sudden high-voltage static damage to the circuits. Specifically, conventional packaging substrates include a contact set comprising a power pad and a ground pad, which electrically connect the positive and negative electrodes of the passive component.

[0004] However, in the same type of mobile communication device, different passive components are configured according to different functional requirements. In this case, the contact group of the packaging substrate cannot meet the voltage requirements required by various passive components. Therefore, for the same type of mobile communication device, it is necessary to develop packaging substrates with different voltage specifications, which increases the time and cost of manufacturing the packaging substrates.

[0005] In addition, if Figure 1 As shown, although some industry insiders have formed multiple groups of contact groups 10 with different voltages (including a power pad 10b and a ground pad 10a) on the packaging substrate 1 to electrically connect passive components to the contact groups 10 that meet the voltage requirements as needed, additional layout space needs to be added on the existing packaging substrate 1 to configure the multiple groups of contact groups 10, resulting in a significant increase in the layout area of ​​the packaging substrate 1, making it difficult to meet the requirements of miniaturization.

[0006] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the Invention

[0007] In view of the various defects of the above-mentioned prior art, the present invention provides a substrate structure, comprising: a board body; at least one first electrical contact pad, which is arranged on the board body; and a plurality of second electrical contact pads, which are arranged on the board body and arranged along the contour of the first electrical contact pad, so that one of the at least one first electrical contact pad cooperates with one of the plurality of second electrical contact pads to form a contact group.

[0008] In the aforementioned substrate structure, the board has a circuit layer for electrically connecting the at least one first electrical contact pad and / or the plurality of second electrical contact pads.

[0009] In the aforementioned substrate structure, the plurality of second electrical contact pads are symmetrically located on two opposite sides of the at least one first electrical contact pad.

[0010] In the aforementioned substrate structure, the plurality of second electrical contact pads are symmetrically located at any four positions of the at least one first electrical contact pad.

[0011] In the aforementioned substrate structure, the plurality of second electrical contact pads are power contacts. For example, the voltage values ​​of at least two of the plurality of second electrical contact pads are different.

[0012] In the aforementioned substrate structure, the at least one first electrical contact pad is a grounding contact.

[0013] The present invention further provides an electronic package, comprising: the aforementioned substrate structure; and an electronic component disposed on the substrate and electrically connected to one of the at least one first electrical contact pad and one of the plurality of second electrical contact pads.

[0014] The aforementioned electronic package also includes a semiconductor chip disposed on the substrate structure.

[0015] In the aforementioned electronic package, the electronic component is a passive component.

[0016] From the above, it can be seen that the electronic package and its substrate structure of the present invention are mainly arranged by arranging multiple second electrical contact pads along the periphery (contour) of the at least one first electrical contact pad, so that one of the at least one first electrical contact pad can cooperate with the multiple second electrical contact pads to form a contact group, so that one side of the electronic component (such as the power supply end) can be electrically connected to one of the second electrical contact pads with a suitable voltage value as required, and the other side is electrically connected to the at least one first electrical contact pad. Therefore, compared with the prior art, when the substrate structure of the present invention is used to manufacture the electronic package, there is no need to additionally manufacture multiple packaging substrates of different specifications, thereby reducing the time and cost of manufacturing the packaging substrate.

[0017] In addition, when there are multiple first electrical contact pads, they can form multiple contact points with the corresponding second electrical contact pads.

[0018] In addition, by designing that multiple second electrical contact pads are arranged along the contour of the first electrical contact pad, only at least one first electrical contact pad needs to be arranged on the board to correspond to different electronic components. Therefore, compared with the multiple contact groups of the existing packaging substrate, the substrate structure of the present invention can effectively reduce the layout area of ​​the board to meet the needs of miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a top plan view schematic diagram of an existing packaging substrate.

[0020] Figure 2 It is a top plan view schematic diagram of the substrate structure of the present invention.

[0021] Figure 3 Schematic cross-sectional view of the electronic package of the present invention.

[0022] Description of Reference Numerals

[0023] 1 Package substrate

[0024] 10 contact groups

[0025] 10a grounding pad

[0026] 10b power pad

[0027] 2 Substrate structure

[0028] 20 plate body

[0029] 200 circuit layer

[0030] 21 first electrical contact pad

[0031] 22a, 22b, 22c, 22d second electrical contact pads

[0032] 3 Electronic packaging

[0033] 30 electronic components

[0034] 301 grounding electrode

[0035] 302 Power supply electrode. DETAILED DESCRIPTION

[0036] The following describes the embodiments of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0037] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose that can be achieved by the present invention. At the same time, terms such as "first", "second", "upper", and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0038] Figure 2 FIG. 2 is a schematic top view of the substrate structure 2 of the present invention. Figure 2 As shown, the substrate structure 2 includes: a board 20 , at least one first electrical contact pad 21 disposed on the board 20 , and a plurality of second electrical contact pads 22 a , 22 b , 22 c , and 22 d disposed on the board 20 .

[0039] The board 20 has at least one circuit layer 200 (eg, a circuit layer 200 configured to electrically connect the at least one first electrical contact pad 21 and / or the plurality of second electrical contact pads 22a, 22b, 22c, 22d). Figure 3 shown).

[0040] In this embodiment, the board 20 is a packaging substrate having a core layer and a circuit structure or a coreless packaging substrate, which forms a circuit layer 200 on a dielectric material, such as a fan-out redistribution layer (RDL), and the dielectric material is polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0041] The at least one first electrical contact pad 21 is a grounding contact and is rectangular in shape. It should be understood that the shape of the at least one first electrical contact pad 21 can be designed according to needs and is not particularly limited.

[0042] The multiple second electrical contact pads 22a, 22b, 22c, and 22d are power contacts, which are arranged along the periphery of the at least one first electrical contact pad 21, so that the at least one first electrical contact pad 21 (ground contact) is combined with one of the multiple second electrical contact pads 22a, 22b, 22c, and 22d (power contacts) to form a contact group.

[0043] In this embodiment, the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are symmetrically located on opposite sides of the at least one first electrical contact pad 21. For example, the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are symmetrically located in four directions: top, bottom, left, and right of the at least one first electrical contact pad 21. Specifically, the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are four in number and symmetrically surround the at least one first electrical contact pad 21 with the at least one first electrical contact pad 21 as the center, so that the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are arranged in a cross shape with the at least one first electrical contact pad 21.

[0044] Furthermore, the voltage values ​​of at least two of the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are different. For example, the voltage values ​​of each of the four second electrical contact pads 22a, 22b, 22c, and 22d are different.

[0045] Figure 3 FIG. 3 is a cross-sectional view of the electronic package 3 of the present invention. Figure 3 As shown, the electronic package 3 includes a substrate structure 2 and an electronic component 30 disposed on the substrate 20 .

[0046] The electronic component 30 is a passive component, such as a capacitor, a resistor, an inductor, or other types, which is electrically connected to one of the plurality of second electrical contact pads 22 a , 22 b , 22 c , 22 d and the at least one first electrical contact pad 21 .

[0047] In addition, the electronic package 3 may also be configured with semiconductor chips such as control chips, logic chips, functional chips or other chips (not shown) on the substrate structure 2, and a packaging layer (not shown) may be formed on the substrate structure 2 to cover the electronic component 30 and the semiconductor chip.

[0048] In summary, the electronic package 3 of the present invention utilizes the design of the substrate structure 2 to arrange the plurality of second electrical contact pads 22a, 22b, 22c, and 22d along the periphery (contour) of the at least one first electrical contact pad 21. At least one ground pad can be combined with the plurality of power pads to form a contact group. Consequently, one side of the electronic component 30 (e.g., the power electrode 302) can be electrically connected to one of the plurality of second electrical contact pads 22a, 22b, 22c, and 22d of appropriate voltage, as required, while the other side of the electronic component 30 (e.g., the ground electrode 301) is electrically connected to the at least one first electrical contact pad 21. Therefore, when using the substrate structure 2 of the present invention to manufacture the electronic package 3, there is no need to develop multiple different package substrates of different specifications to accommodate electronic components 30 with various voltage requirements. Compared to the prior art, the present invention can effectively reduce the time and cost of manufacturing the substrate structure 2.

[0049] Furthermore, the present invention utilizes a design in which multiple second electrical contact pads 22a, 22b, 22c, and 22d are arranged along the periphery (contour) of the at least one first electrical contact pad 21. Therefore, corresponding to different electronic components 30, only at least one first electrical contact pad 21 needs to be arranged on the board 20. Therefore, compared to the multiple contact groups of existing packaging substrates, the substrate structure 2 of the present invention can effectively reduce the layout area of ​​the board 20 to meet the requirements of miniaturization.

[0050] In addition, when there are multiple first electrical contact pads 21 , multiple contact points can be formed with the corresponding second electrical contact pads 22 a , 22 b , 22 c , and 22 d .

[0051] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Any person skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. An electronic package, characterized in that: include: Substrate structure, including: plate body; a single grounding contact disposed on the board; and four first, second, third, and fourth power contacts having different voltage values, disposed on the board and arranged along a periphery of the single ground contact, wherein the first, second, third, and fourth power contacts have different first, second, third, and fourth voltage values, respectively, and the single ground contact and one of the first, second, third, and fourth power contacts having the first, second, third, and third voltage values ​​form a contact group; and A passive component having a single ground electrode and a single power electrode is arranged on the board, wherein the single ground electrode of the passive component is electrically connected to the single ground contact of the substrate structure, and the single power electrode of the passive component is electrically connected to one of the first power contact with the first voltage value, the second power contact with the second voltage value, the third power contact with the third voltage value, and the fourth power contact with the fourth voltage value of the substrate structure.

2. The electronic package according to claim 1, wherein: The board has a circuit layer for electrically connecting the single grounding contact and / or the first power contact to the fourth power contact.

3. The electronic package according to claim 1, wherein: The first power contact to the fourth power contact are symmetrically located on two opposite sides of the single ground contact.

4. The electronic package according to claim 1, wherein: The first power contact to the fourth power contact are symmetrically located at four directions of the single ground contact.

5. The electronic package according to claim 1, wherein: The electronic package also includes a semiconductor chip disposed on the substrate structure.

6. The electronic package according to claim 1, wherein: The passive component is a capacitor, a resistor or an inductor.

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