Electrically functionalized circuit board core material

By embedding electronic components in the circuit board core and using lamination technology to form electrical connections, the problems of high manufacturing cost and difficult quality control in the existing technology are solved, realizing efficient manufacturing and volume utilization of circuit boards.

CN113225914BActive Publication Date: 2025-10-24KEMET ELECTRONICS CORP
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Patent Information

Application Number
CN202110156254.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-02-04
Filing Date
2021-02-04
Publication Date
2025-10-24
Estimated Expiration
2041-02-04

AI Technical Summary

Technical Problem

Existing technologies make it difficult to economically manufacture embedded functional components in circuit boards without the need for through-holes, leading to increased manufacturing costs and difficulties in quality control.

Method used

Electronic components are embedded in a bag-like structure with a prepreg layer using lamination technology, and electrical connections are formed through the cladding, avoiding the formation of through-holes. Electrical contact between the electronic components and the cladding is achieved through the curing process of the prepreg and the cladding.

Benefits of technology

It achieves improved volumetric efficiency of circuit boards, reduces manufacturing steps and costs, while maintaining the reliability and flexibility of electrical connections, and is suitable for the manufacture of single-layer or multi-layer circuit boards.

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Abstract

An improved circuit board core and method of manufacturing the same are provided, wherein the circuit board core is particularly suitable for use in a circuit board. The circuit board core includes a laminate. The laminate includes a prepreg layer and a first clad layer positioned on the prepreg layer, wherein the prepreg layer includes a pocket. An electronic component is positioned in the pocket, wherein the electronic component includes a first external terminal and a second external terminal. The first external terminal is laminated to the first clad layer and in electrical contact with the first clad layer, and the second external terminal is in electrical contact with a conductor.
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Citation Information

Patent Citations

  • Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive

    US20080030929A1

  • Method of manufacturing printed wiring board with built-in electronic component

    US20090205859A1