Audio device with sealing member and internal heat sink

Abstract

Various embodiments of the present invention include audio devices and components of such devices. Certain embodiments include audio devices having sealing members for providing a substantially water-tight seal. Certain other embodiments include audio devices having internal heat sinks for transferring heat away from device components such as control modules.

Description

Technical Field

[0001] The present disclosure generally relates to audio devices. More particularly, the present disclosure relates to audio devices having a sealing member and a heat sink located inside a device body. Background Art

[0002] There is a growing demand for audio devices, such as portable audio devices, with increased capabilities. However, as device capabilities increase, it becomes more difficult to effectively transfer heat away from the electronic components in these devices. Additionally, it is difficult to design environmental protection for many portable devices without sacrificing one or more performance capabilities. Summary of the invention

[0003] All examples and features mentioned below can be combined in any technically possible way.

[0004] Various embodiments include audio devices and components of such devices. Certain embodiments include audio devices having a sealing member for providing a substantially water-tight seal. Certain other embodiments include audio devices having an internal heat sink for transferring heat away from device components such as a control module.

[0005] In a particular aspect, an audio device includes: a body defining a sound box, the body having a narrow slot extending around its outer surface; a cover covering the body; and a sealing member extending completely around the outer surface of the body in the narrow slot, the sealing member providing a substantially water-resistant seal between the body and the cover.

[0006] In another specific aspect, the audio device includes: a body defining: a speaker cabinet, and an electronics compartment located above the speaker cabinet; a control module located in the electronics compartment; a group of passive radiators sealing the lower portion of the speaker cabinet; and a heat sink sealing the upper end of the speaker cabinet.

[0007] In another specific aspect, the audio device includes: a body defining: a speaker and an electronics compartment located above the speaker, wherein the body includes a narrow slot extending around its outer surface; a sealing member extending completely around the outer surface of the body in the narrow slot; a control module located in the electronics compartment; a group of passive radiators sealing the lower portion of the speaker; and a heat sink sealing the upper end of the speaker.

[0008] Implementations may include one or any combination of the following features.

[0009] In some cases, the cover is coupled to the body by at least one snap-fit ​​coupling, and the sealing member inhibits a load on the at least one snap-fit ​​coupling.

[0010] In certain aspects, the slot extends circumferentially around the outer surface of the body, and the sealing member includes an O-ring sized to fill the slot.

[0011] In some implementations, the enclosure is sealed at a lower end by the transducer, at a lower portion by a set of passive radiators, and at an upper end by a heat sink.

[0012] In some aspects, the audio device further includes at least one microphone mounted in the body above the heat sink, wherein the sealing member acoustically isolates the at least one microphone from the transducer and the set of passive radiators.

[0013] In certain instances, the sealing member aligns the cover with the body, and the substantially water-tight seal is capable of achieving at least IPX7 level of liquid intrusion protection.

[0014] In certain aspects, the sealing member provides impact protection for components housed in the body.

[0015] In certain aspects, the heat sink is configured to transfer heat from the control module to the speaker enclosure.

[0016] In some cases, during operation of the acoustic device, air moved by the set of passive radiators within the enclosure helps transfer heat away from the control module.

[0017] In certain implementations, the body includes a slot between the speaker enclosure and the electronics compartment, and the heat sink is positioned below the control module within the slot.

[0018] In some aspects, the audio device further includes: a cover surrounding the control module; and a thermal interface material between the cover and the heat sink.

[0019] In certain instances, the audio device further comprises a plastic housing surrounding the heat sink, wherein the heat sink comprises metal.

[0020] In certain implementations, a heat sink extends laterally into the cavity in the body for transferring a portion of the heat from the control module to the cavity.

[0021] In some aspects, the acoustic device comprises a portable acoustic device, and the control module comprises a chipset configured for both Wi-Fi communications and Bluetooth communications.

[0022] In certain aspects, the audio device further includes a printed circuit board located over the control module.

[0023] In some cases, the speaker enclosure is airtight.

[0024] Two or more features described in this disclosure, including those described in this Summary, can be combined to form implementations not specifically described herein.

[0025] The details of one or more implementations are discussed in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent in the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A side perspective view of an audio device according to various implementations is shown.

[0027] Figure 2 According to various specific implementations Figure 1 A cross-sectional view of the base of an audio device.

[0028] Figure 3 Shows Figure 2 A portion of a cross section of a base of an audio device.

[0029] Figure 4 Shows Figure 3 A close-up cross-section of the interface between the body and cover of an audio device is shown.

[0030] Figure 5 Shown separately Figure 1 A three-dimensional perspective view of the main body of the audio device.

[0031] Figure 6 Shows Figure 1 An exploded perspective view of a portion of the base of an audio device.

[0032] It should be noted that the drawings of various embodiments are not necessarily drawn to scale. The drawings are intended only to illustrate typical aspects of the present disclosure and therefore should not be considered to limit the scope of the embodiments. In the drawings, similar numbers represent similar elements between the drawings. DETAILED DESCRIPTION

[0033] The present disclosure is based, at least in part, on the recognition that a sealing member may be advantageously incorporated into an audio device. The present disclosure is based, at least in part, on the recognition that an internal heat sink may be advantageously incorporated into an audio device. The sealing member may provide environmental and impact protection as well as enhanced acoustic performance. The internal heat sink may enhance device performance and longevity without sacrificing acoustic performance.

[0034] For purposes of explanation, components generally labeled in the drawings are considered to be substantially equivalent components, and redundant discussion of those components is omitted for the sake of clarity.

[0035] As described herein, as the capabilities of these devices increase, it becomes more difficult to effectively transfer heat away from the electronic components in audio devices. For example, as portable audio devices increase communication and connectivity capabilities, it becomes increasingly important to transfer heat away from the electronic components in these devices. In addition, as described herein, it is difficult to design environmental and impact protection for many portable devices without sacrificing one or more performance capabilities. In contrast to conventional audio devices, various embodiments have an internal heat sink that is configured to seal the speaker enclosure and transfer heat from the control module. In addition, in contrast to conventional audio devices, various embodiments include a sealing member that provides a substantially water-resistant seal between the body and cover of the audio device. The sealing member may also provide impact protection and acoustic isolation for the audio device, thereby extending the service life and improving device performance.

[0036] Figure 1 A side perspective view of an audio device 10 is shown according to various implementations. In some cases, the audio device 10 comprises a portable audio device, such as a tabletop or handheld speaker having the capability for both hard-wired and battery-powered operation. The audio device 10 has a base 20, and in this exemplary implementation, a handle 30 is connected to the base 20 (e.g., to enable transportation of the audio device 10). The base 20 may contain speaker components, such as one or more transducers, resonators, a digital signal processor (DSP), and associated control circuitry, as described herein. The base 20 may also include a speaker grille 40 that is disposed on a Figure 1 , is shown in the exemplary depiction in FIG as extending around the lower portion of the base 20. In some cases, the base 20 includes a button 50 located on its upper face 60 for activating functions of the audio device 10, such as playback functions, volume control, device pairing, etc. In some cases, the button 50 can include a light ring extending around the face 60.

[0037] Figure 2 A cross-sectional view of the base 20 of the audio device 10 is shown according to various implementations. Figure 3 Shows Figure 2 As shown in these figures, in Figure 2 , the base 20 of the audio device 10 may include a body 70 that defines a sound box 80. The sound box 80 is discussed in more detail with reference to additional features of the audio device 10. The body 70 may be formed of a metal, plastic, or composite material that is molded, three-dimensionally printed, or otherwise conventionally manufactured to assume the shapes shown herein.

[0038] Figure 2 and Figure 3Also shown is a cover 90 covering the body 70. Like the body 70, the cover 90 may be formed of a metal, plastic, or composite material that is molded, three-dimensionally printed, or otherwise conventionally manufactured to assume the shapes shown herein. The cover 90 is sized to fit tightly (i.e., conformably) over the body 70 and couple with the body 70 as described herein.

[0039] In some specific implementations, the cover 90 covers a portion of the body 70, for example, along the sidewall 100 of the body 70 and over a portion 110 of the upper surface 120 of the body 70. In some cases, the cover 90 extends along the sidewall 100 of the body 70 for at least a portion of the axial length of the speaker 80. In a specific implementation, the cover 90 extends along the sidewall 100 and is connected by at least one snap-fit ​​connector (e.g., a male / female snap connector) 130 ( Figure 2 ) is coupled to the body 70. In some exemplary cases, the snap-fit ​​coupling 130 includes a male coupling 135A on the body 70 and a female coupling 135B on the cover 90, or vice versa.

[0040] Figure 2 and Figure 3 Both show a slot 140 extending around an outer surface 150 of the body 70 (eg, around the side wall 100). The slot 140 is Figure 3 In various implementations, the slot 140 extends circumferentially around the outer surface 150 of the body 70. According to some implementations, the slot 140 extends circumferentially around the entire outer surface 150 of the body 70, thereby forming a continuous passage. Figure 4 An additional cross section is shown in close-up of the interface between the body 70 and the cover 90 showing the slot 140 in greater detail.

[0041] Continue to refer Figure 3 and Figure 4 , the audio device 10 may also include a sealing member 160 extending completely around the outer surface 150 of the body 70 in the slot 140. That is, the sealing member 160 is configured to reside (e.g., rest) in the slot 140 and extend completely around the outer surface 150 of the body 70. In certain cases, the sealing member 160 includes a gasket, a flexible wipe, a foam, a silicone-based component, and / or an adhesive. Regardless of the material type, the size of the sealing member 160 can be set to fill or substantially fill the slot 140 to provide a seal, as described herein. In some specific cases, the sealing member 160 includes an O-ring sized to fill the slot 140. In some cases, the O-ring can provide a relatively inexpensive but effective radial seal around the outer surface 150 of the body 70.

[0042] The size of the sealing member 160 can also be set so that when the cover 90 is placed on the body 70, the sealing member 160 contacts the inner surface 170 of the cover 90. The sealing member 160 can be formed of rubber, plastic, or a composite material that can compress and seal the space 180 between the outer surface 150 of the body 70 and the inner surface 170 of the adjacent slot 140 of the cover 90. In various specific implementations, the sealing member 160 can provide a substantial water-resistant seal between the body 70 and the cover 90 (e.g., across the space 180). That is, when the cover 90 is installed on the body 70, the sealing member 160 can be compressed (flexed) to provide a seal between the body 70 and the cover 90, which achieves at least IPX4 level liquid intrusion protection (as defined by the international protection level certification standard set forth by the International Electrotechnical Commission (IEC)). In these cases, the water-resistant seal provides liquid intrusion protection for the electronic components in the body 70, making them immune to the effects of splashing external liquids. In other specific cases, the sealing member 160 can provide a seal between the body 70 and the cover 90 that achieves at least IPX5 level of liquid ingress protection. In these cases, the water-resistant seal provides liquid ingress protection for the electronic components in the body 70, protecting them from sprayed external liquids (such as water sprayed from a nozzle). In more specific cases, the sealing member 160 can provide a seal between the body 70 and the cover 90 that achieves at least IPX7 level of liquid ingress protection. In these cases, when the audio device 10 is immersed in one (1) meter or less of liquid (e.g., water), the water-resistant seal prevents external liquid from penetrating the electronic components in the body 70 for up to 30 minutes.

[0043] In addition, special reference Figure 2 , when the body 70 and the cover 90 are coupled (e.g., via one or more snap-fit ​​couplings 130), the sealing member 160 can suppress the load on the snap-fit ​​coupling 130. That is, the sealing member 160 is positioned to contact both the body 70 and the cover 90 when positioned in the slot 140. Because the snap-fit ​​couplings 130 are mated under pressure (e.g., buckling), the sealing member 160 can suppress the load applied to the corresponding snap-fit ​​coupling 130. This can help extend the useful life of the body 70 and / or the cover 90.

[0044] In addition to reducing the load on the snap-fit ​​connection 130, the sealing member 160 can also be configured to align the cover 90 with the body 70. That is, manufacturing deviations, wear over time, and / or environmental conditions (e.g., humidity, temperature, etc.) of the cover 90 and / or the body 70 can cause the cover 90 to not be perfectly aligned with the body 70. Because the audio device 10 is configured for portable use and is water-resistant, it may be beneficial for the cover 90 to fit tightly over the body 70. The sealing member 160 protruding from the narrow slot 140 can help align the cover 90 with the body 70. That is, the sealing member 160 provides additional contact points for the cover 90 to help stabilize the cover 90 in a desired position over the body 70.

[0045] The sealing member 160 may also provide impact protection for components housed in the body 70 (e.g., one or more transducers, microphones, passive radiators, control circuits (e.g., one or more printed circuit boards or PCBs), etc.). As described herein, the sealing member 160 is formed of a compressible material such as rubber, plastic, or a composite material, and is configured to flex when the cover 90 is fitted over the body 70. That is, the sealing member 160 may form a mass-spring system with the cover 90 such that when the cover 90 is impacted (e.g., by being dropped or otherwise struck), the sealing member 160 flexes to absorb at least a portion of the impact. Thus, when such an impact occurs, the sealing member 160 reduces the load carried by the cover 90 (and therefore the body 70).

[0046] Figure 2 and Figure 3 Additional features of the audio device 10 are shown, including a key 50 mounted in the body 70 ( Figure 1 ) is provided with a microphone 185 on a base 190 of the key 50. These microphones 185 can be mounted in the base 190 through a slot and can be exposed to the microphone cavity 200 in the main body 70. When the cover 90 is connected to the main body 70, the microphone cavity 200 is connected to the microphone opening 210 in the cover 90. The microphone 185 is configured to detect ambient acoustic signals near the audio device 10. In some cases, the microphone 185 is protected by a waterproof mesh on its back. The base 190 of the key 50 is covered with an interface 220, which may include one or more interface controls, such as an actuatable button or a touch screen for controlling the functions of the audio device 10.

[0047] The audio device 10 may also include an electronics compartment 230 that covers the sound box 80 and is located below the base 190 of the button 50. The electronics compartment 230 may include a printed circuit board (PCB) 240 connected to the button 50 by one or more connectors 245. The PCB 240 is also connected to a control module 250 located below the PCB 240. In various specific implementations, the control module 250 includes a chipset configured for both Wi-Fi communication and Bluetooth communication. That is, the control module 250 allows the audio device 10 to communicate with other devices in the network via Wi-Fi and / or to communicate directly with other devices via Bluetooth connection (or any variant / version of Bluetooth, such as BLE). Many conventional audio devices (e.g., portable speakers) do not have this communication capability. More specifically, many conventional audio devices are designed to have Bluetooth connection capabilities, but do not have Wi-Fi connection capabilities. Partly due to its communication capabilities, the control module 250 in the audio device 10 carries a significant thermal load during operation.

[0048] like Figure 2 As shown, in various embodiments, the control module 250 is located above the speaker box 80 in the audio device 10. The speaker box 80 is a cavity within the body 70, which can be Figure 5 The individual bodies 70 are seen in a perspective view. Figure 5 2 shows a three-dimensional space in the sound box 80 defined by the body 70. The body 70 may include one or more slots 260 for receiving the passive radiator 270, wherein the passive radiator 270 is disposed in a space between the two adjacent slots 260. Figure 2 In some cases, a group of passive radiators 270 (eg, three passive radiators) are arranged around the speaker 80. Figure 2 (and continue to refer to Figure 5 ), in some cases, the passive radiator 270 seals the narrow slot 260 in the lower portion 280 of the sound box 80, while the driver (i.e., transducer) 290 seals the opening 300 at the lower end 310 of the sound box 80. Figure 6 An exploded view of the base 20 is shown, which further illustrates the location of the passive radiator 270 within the body 70 .

[0049] Continue to refer Figure 2In various implementations, the sealing member 160 acoustically isolates the microphone 185 from the driver 290 and the passive radiator 270 positioned around the sound box 80. That is, during audio playback from the driver 290, the passive radiator 270 is positioned to radiate in the sound box 80. Therefore, the body 70 is subjected to acoustic vibrations, such as during audio playback or in any case where the passive radiator 270 radiates. When the body 70 vibrates, the microphone 185 may not accurately detect ambient acoustic signals. Because the sealing member 160 helps to suppress vibrations between the body 70 and the cover 90, the sealing member 160 can help to acoustically isolate the microphone 185 from the driver 290 and the passive radiator 270.

[0050] Figure 2 Also shown is a heat sink 320 (also at an upper end 330 (opposite to the lower end 310) of the sealed speaker enclosure 80. Figure 5 330 is shown in FIG. 3 ). In various implementations, the heat sink 320, the passive radiator 270, and the driver 290 together seal the enclosure 80 such that the enclosure 80 is airtight (and does not include any ports). In various implementations, the heat sink 320 is located below the control module 250 and comprises a metal or alloy having sufficient thermal conductivity to transfer heat from the overlying control module 250 to the enclosure 80. The heat sink 320 is positioned relative to the control module 250 at Figure 6 is further shown in the exploded view of FIG.

[0051] Continue to refer Figure 2 and Figure 3 In some cases, the control module 250 is surrounded by a cover (e.g., a metal such as stainless steel), and a thermal interface material (e.g., a thermally conductive gel) is located between the cover of the control module 250 and the heat sink 320. As described herein, the heat sink 320 is configured to transfer heat from the control module 250 to the speaker enclosure 80 via conduction and convection cooling. That is, heat from the control module 250 is drawn toward the heat sink 320 and then directed through the heat sink 320, which is correspondingly cooled by the movement of air over its lower surface. The convection cooling of the heat sink 320 (via the movement of air in the speaker enclosure 80) can maintain a temperature difference between the control module 250 and the heat sink 320, so that during operation, the heat sink 320 draws heat from the control module 250 into the speaker enclosure 80.

[0052] In some cases, the heat sink 320 is located in the slot 340 between the speaker box 80 and the electronics compartment 230. The heat sink 320 can take any shape that can seal the slot 340, such as a rectangular or circular cross-sectional shape. In various specific implementations, the heat sink 320 has a thickness of about 1 mm-3 mm, and in certain cases, is about 2 mm thick. In some cases, the heat sink 320 extends laterally (e.g., radially) beyond the overlying control module 250, so that the heat sink 320 has a greater length (or, width or diameter, depending on its shape) than the control module 250. In some cases (not shown), the heat sink 320 may extend laterally to a cavity in the body 70 for transferring a portion of the heat from the control module 250 to the cavity. In these cases, the heat sink 320 may have at least one lateral extension that contacts a cavity in the body 70 that is different from the speaker box 80.

[0053] As mentioned in this article, continue to refer to Figure 2 and Figure 3 , the heat sink 320 is configured to transfer heat from the control module 250 to the speaker enclosure 80. In certain instances, during operation of the audio device 10, air moving through a set of passive radiators 270 within the speaker enclosure 80 helps transfer heat away from the control module 250. That is, when the passive radiators 270 move due to the acoustic output of the driver 290, the movement causes turbulence in the air within the sealed speaker enclosure 80. This movement of air in the speaker enclosure 80 can help transfer heat away from the control module 250 via the heat sink 320.

[0054] As described herein, during use, the communication capabilities of the control module 250 cause the control module 250 to generate a significant amount of heat. However, given the central location of the control module 250 within the main body 70, preventing the control module 250 (and nearby components in the electronics compartment 230) from overheating presents a challenge. As also described herein, the heat sink 320 addresses this challenge by transferring heat from the control module 250 to the speaker enclosure 80, which is sealed within the interior of the main body 70. With the heat sink 320 in place as a wall of the speaker enclosure 80, the heat sink 320 can effectively transfer heat away from the control module 250 without being thermally coupled to locations external to the main body 70. Although top-down heat transfer is less efficient than bottom-up heat transfer, the proximity of the heat sink 320 to both the control module 250 and the speaker enclosure 80 enables the heat sink 320 to effectively cool the control module 250.

[0055] It should be understood that the relative proportions, sizes, and shapes of the audio device 10 and its components and features as shown in the figures included herein may be merely examples of such physical properties of these components. That is, these proportions, shapes, and sizes may be modified to suit various products according to various specific implementations. For example, although a speaker having a substantially tubular (or circular cross-section) shape may be shown according to a particular specific implementation, it should be understood that the speaker may also take other three-dimensional shapes in order to provide the acoustic functions described herein.

[0056] In various embodiments, the components described as being "coupled" to each other may be joined along one or more interfaces. In some embodiments, these interfaces may include joints between different components, and in other cases, these interfaces may include solid and / or integrally formed interconnects. That is, in some cases, the components "coupled" to each other may be formed simultaneously to define a single continuous member. However, in other embodiments, these coupling components may be formed as separate components and subsequently joined by known processes (e.g., welding, fastening, ultrasonic welding, bonding). In various embodiments, the electronic components described as being "coupled" may be linked via conventional hardwires and / or wireless devices so that these electronic components can transmit data to each other. In addition, subcomponents within a given component may be considered to be linked via conventional paths, which may not necessarily be shown.

[0057] A number of implementations have been described. However, it should be understood that additional modifications may be made without departing from the scope of the inventive concepts described herein, and therefore, other implementations are within the scope of the claims.

Claims

1. An audio device, comprising: a body defining a sound box, the body including a slot extending around an outer surface thereof; a cover, the cover covering the main body; a sealing member extending completely around the outer surface of the body in the slot, the sealing member providing a substantially water-tight seal between the body and the cover; as well as A transducer seals the lower end of the sound box.

2. The audio device of claim 1, wherein the cover is coupled to the body by at least one snap-fit ​​coupling, and wherein the sealing member inhibits loads on the at least one snap-fit ​​coupling.

3. The audio device of claim 1, wherein the groove extends circumferentially around the outer surface of the body, and wherein the sealing member comprises an O-ring sized to fill the slot.

4. The audio device of claim 1, wherein the enclosure is sealed at a lower portion by a set of passive radiators and at an upper end by a heat sink.

5. The audio device of claim 4, further comprising at least one microphone mounted in the body above the heat sink, wherein the sealing member acoustically isolates the at least one microphone from the transducer and the set of passive radiators.

6. The audio device of claim 1, wherein the sealing member aligns the cover with the body, and wherein the substantially water-tight seal enables at least IPX7 level of liquid intrusion protection.

7. The audio device of claim 1, wherein the sealing member provides impact protection for components housed in the body.

8. An audio device comprising: a main body, the main body defining: a sound box and an electronics compartment located above the sound box; a control module, the control module being located in the electronics compartment; a set of passive radiators, the set of passive radiators sealing a lower portion of the sound box; and A heat sink seals an upper end of the speaker enclosure, wherein the heat sink is configured to transfer heat from the control module to the speaker enclosure.

9. The audio device of claim 8, wherein during operation of the audio device, air moved through the set of passive radiators within the enclosure helps transfer heat away from the control module.

10. The audio device of claim 8, wherein the body includes a slot between the speaker enclosure and the electronics compartment, and wherein the heat sink is located below the control module within the slot.

11. The audio device of claim 8, further comprising: a cover member surrounding the control module; and A thermal interface material is disposed between the cover and the heat sink.

12. The audio device of claim 8, further comprising a plastic housing surrounding the heat sink, wherein the heat sink comprises metal.

13. The audio device of claim 8, wherein the heat sink extends laterally to a cavity in the body for transferring a portion of the heat from the control module to the cavity.

14. The audio device of claim 8, wherein the audio device comprises a portable acoustic device, and wherein the control module comprises a chipset configured for both Wi-Fi communications and Bluetooth communications.

15. The audio device of claim 8, further comprising a printed circuit board located on the control module.

16. The audio device of claim 8, wherein the enclosure is airtight.

17. An audio device comprising: a body defining: a sound box and an electronics compartment located above the sound box, wherein the body includes a slot extending around an outer surface thereof; a sealing member extending completely around the outer surface of the body in the slot; a control module, the control module being located in the electronics compartment; a set of passive radiators, the set of passive radiators sealing a lower portion of the sound box; a heat sink that seals an upper end of the speaker enclosure; and A transducer seals the lower end of the sound box.

18. The audio device of claim 17, wherein the heat sink is configured to transfer heat from the control module to the speaker enclosure.

19. The audio device of claim 17, further comprising a cover covering the body, wherein the sealing member provides a substantially water-tight seal between the body and the cover.

20. The audio device of claim 17, further comprising: at least one microphone, the at least one microphone mounted above the heat sink proximate the electronics compartment; and Wherein the sealing member acoustically isolates the at least one microphone from the transducer and the set of passive radiators.

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