Magnetic chuck

Abstract

The present invention relates to a magnetic chuck. The magnetic chuck according to an embodiment of the present invention includes: an adsorption rubber having a plurality of individual holes penetrating from a contact surface for a semiconductor chip, which is one surface, to the other surface; and a metal plate having a common hole penetrating from one surface to the other surface to provide a common passage connected to each individual hole, and laminated on the adsorption rubber.

Description

Technical Field

[0001] The present invention relates to a magnetic collet, and more particularly, to a magnetic collet applicable to a collet holder having a flat contact surface. Background Art

[0002] Generally, in the assembly process of semiconductor packaging, after separating semiconductor chips (or also referred to as "dies") from a wafer, the process of attaching them to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive or the like is called a chip attachment process. Since this is the first step in productizing by separately separating a plurality of chips formed on the wafer, in order to perform the chip attachment process, a process of cutting the wafer in units of individual chips to separate them is first performed.

[0003] Thus, the assembly process of semiconductor chip packaging requires a process of cutting a wafer on which a plurality of chips are formed in units of individual chips, a chip attachment process of bonding the cut individual chips to the package body, and a process of picking up the cut individual chips and transferring them to the assembly part of the package body. At this time, the part that directly contacts the chip to pick up the semiconductor chip transfer device that picks up and transfers the semiconductor chips cut from the wafer is called a collet.

[0004] A semiconductor chip transfer device including such a collet can be used not only in the above-mentioned assembly process of semiconductor packaging but also in a visual inspection process for checking whether the surface of the semiconductor chip is in good condition such as breakage, cracks, and defects.

[0005] Generally, a semiconductor chip transfer device includes: a vacuum application tube configured with holes for sucking air to provide a vacuum suction force to the semiconductor chip; a collet holder connected to the vacuum application tube and having holes exposed on the bottom surface; and a collet having holes communicating with the holes and having a stretchable adsorption rubber inserted and bonded to the bottom surface of the collet holder.

[0006] In particular, in Korean Registered Utility Model Publication No. 20-0414775, a semiconductor chip transfer device is proposed that is configured to be able to bond a collet in which a metal plate is bonded to an adsorption rubber to a collet holder by applying a magnetic force to the collet holder. Generally, a collet used for such a semiconductor chip transfer device is called a "magnetic collet".

[0007] Figure 1 Show the existing magnetic collet 10 and collet holder 20.

[0008] Refer to Figure 1, for the existing collet holder 20, the holder hole 22 that is connected to the vacuum application tube and sucks air is exposed on its bottom surface 21, that is, the contact surface 21 that contacts the collet 10. At this time, the magnetic collet 10 combined with the adsorption rubber 11 and the metal plate 12 is combined with the contact surface 21 of the collet holder 20. In particular, the collet holder 20 includes a common groove 23 on the contact surface 21 in addition to the holder hole 22. That is, the common groove 23 has a structure formed on the contact surface 21 of the collet holder 20 to connect (communicate) with a plurality of holes of the magnetic collet 10 to provide a common passage for the plurality of holes.

[0009] Therefore, for the existing magnetic collet 10, only when the common groove 23 is provided on the contact surface 21 of the collet holder 20, the vacuum suction force acts normally through the respective holes, whereby the semiconductor chip can be attached, and thus the semiconductor chip can be transferred. That is, there is a problem that the existing magnetic collet 10 cannot be applied to the collet holder 20 having a flat contact surface 21 without the common groove 23 provided on the contact surface 21.

[0010] On the other hand, in order to transfer the semiconductor chip, the contact surface of the adsorption rubber of the existing magnetic collet that contacts the semiconductor chip has a flat structure. Therefore, for the existing magnetic collet, all regions of the contact surface of the adsorption rubber maintain the same separation distance with respect to the semiconductor chip as the transfer object, and approach the semiconductor chip in a manner of gradually reducing the separation distance.

[0011] If one region of the contact surface of the adsorption rubber deviates from this holding condition and approaches the semiconductor chip first, there will be problems such as adsorbing on the adsorption rubber with the position of the semiconductor chip changed, or affecting the position change of adjacent semiconductors. And this holding condition requires more delicate position adjustment technology for the magnetic collet, so there is a problem of increasing the manufacturing cost of the transfer device.

[0012] Moreover, for the existing magnetic collet, the surfaces where the adsorption rubber and the metal plate are in contact with each other do not have an additional structure for fastening, so there is a structure in which the adsorption rubber and the metal plate are attached using an adhesive or the like. As a result, when it is necessary to replace the magnetic collet in response to the sizes of various semiconductor chips, there is a problem that only the entire magnetic collet to which the adsorption rubber and the metal plate are attached can be replaced.

[0013] Prior Art Documents

[0014] (Patent Document 1) KR20-0414775Y Summary of the Invention

[0015] In order to solve the problems of the prior art as described above, an object of the present invention is to provide a magnetic chuck that does not provide a common groove on the contact surface of the collet holder, and can also function to transfer semiconductor chips even when the contact surface is flat.

[0016] Moreover, another object of the present invention is to provide a magnetic chuck in which the contact surface in contact with the semiconductor chip is formed in a shape that can reduce the influence on the position change of the semiconductor chip.

[0017] Furthermore, still another object of the present invention is to provide a magnetic chuck having a structure capable of replacing the adsorption rubber and the metal plate.

[0018] However, the technical problems to be solved by the present invention are not limited to the foregoing technical problems, and those skilled in the art can clearly understand other technical problems not mentioned based on the following description.

[0019] The magnetic chuck according to an embodiment of the present invention for solving the above-described technical problems includes: an adsorption rubber having a plurality of individual holes penetrating from the contact surface for the semiconductor chip as one surface to the other surface; and a metal plate having common holes penetrating from one surface to the other surface to provide common channels connected to the respective individual holes, and laminated on the adsorption rubber.

[0020] In the present invention configured as described above, the vacuum suction force from the chuck holder hole can be dispersed to each individual hole through the common hole and function, so that without providing an additional common groove on the contact surface of the chuck holder, it can also function to transfer semiconductor chips even when the contact surface is flat.

[0021] Moreover, in the present invention, the contact surface of the adsorption rubber in contact with the semiconductor chip is formed in an arc shape with a protruding central portion, and the central portion always comes into contact with the semiconductor chip to be transferred first. Therefore, the semiconductor chip to be transferred can be more stably attached, and it can be directly transferred without changing the position, and the influence on the position change of adjacent semiconductor chips can also be reduced.

[0022] Furthermore, the present invention has a structure capable of replacing the adsorption rubber and the metal plate. When it is necessary to replace the magnetic chuck to cope with the sizes of various semiconductor chips, it is not necessary to replace the entire magnetic chuck fastened by the adsorption rubber and the metal plate, but only the adsorption rubber needs to be replaced.

[0023] The effects that can be obtained in the present invention are not limited to the foregoing effects, and those skilled in the art can clearly understand other effects not mentioned based on the following description. Description of the Drawings

[0024] Figure 1Show the existing magnetic chuck 10 and chuck holder 20.

[0025] Figure 2 Is a perspective view of the magnetic chuck 100 according to the first embodiment of the present invention.

[0026] Figure 3 Is a perspective view of the adsorption rubber 110 of the magnetic chuck 100 according to the first embodiment of the present invention as viewed from the upper side.

[0027] Figure 4 Is a perspective view of the adsorption rubber 110 of the magnetic chuck 100 according to the first embodiment of the present invention as viewed from the lower side.

[0028] Figure 5 Is a perspective view of the metal plate 120 of the magnetic chuck 100 according to the first embodiment of the present invention as viewed from the upper side.

[0029] Figure 6 Is a bottom view of the magnetic chuck 100 according to the first embodiment of the present invention.

[0030] Figure 7 Is a side view of the magnetic chuck 100 according to the first embodiment of the present invention in the long axis length direction.

[0031] Figure 8 Is Figure 2 The sectional view taken along line A-A of

[0032] Figure 9 Show the semiconductor chip transfer device according to the first embodiment of the present invention.

[0033] Figure 10 Is a perspective view of the magnetic chuck 100 according to the second embodiment of the present invention.

[0034] Figure 11 Is a perspective view of the adsorption rubber 110 of the magnetic chuck 100 according to the second embodiment of the present invention as viewed from the upper side.

[0035] Figure 12 Is a bottom view of the adsorption rubber 110 of the magnetic chuck 100 according to the second embodiment of the present invention.

[0036] Figure 13 Is a perspective view of the metal plate 120 of the magnetic chuck 100 according to the second embodiment of the present invention as viewed from the upper side.

[0037] Figure 14 Is a bottom view of the magnetic chuck 100 according to the second embodiment of the present invention.

[0038] Figure 15 Is a side view of the magnetic chuck 100 according to the second embodiment of the present invention in the long axis length direction.

[0039] Figure 16 is Figure 10 a sectional view taken along line A-A of

[0040] Figure 17 a side view of the magnetic chuck 100 in the direction of the minor axis length according to the second embodiment of the present invention.

[0041] Figure 18 is Figure 10 a sectional view taken along line B-B of

[0042] Figure 19 shows a semiconductor chip transfer device according to the second embodiment of the present invention.

[0043] Figure 20 shows the transfer process of the semiconductor chip D performed by the semiconductor chip transfer device according to the second embodiment of the present invention.

[0044] Figure 21 is a perspective view of the magnetic chuck 100 according to the third embodiment of the present invention.

[0045] Figure 22 is a perspective view of the adsorption rubber 110 of the magnetic chuck 100 according to the third embodiment of the present invention as viewed from above.

[0046] Figure 23 is a perspective view of the adsorption rubber 110 of the magnetic chuck 100 according to the third embodiment of the present invention as viewed from below.

[0047] Figure 24 is a perspective view of the metal plate 120 of the magnetic chuck 100 according to the third embodiment of the present invention as viewed from above.

[0048] Figure 25 is a perspective view of the magnetic chuck 100 according to the third embodiment of the present invention as viewed from below.

[0049] Figure 26 is a side view of the magnetic chuck 100 in the direction of the major axis length according to the third embodiment of the present invention.

[0050] Figure 27 is Figure 21 a sectional view taken along line A-A of

[0051] Figure 28 is a side view of the magnetic chuck 100 in the direction of the minor axis length according to the third embodiment of the present invention. Figure 29 is Figure 21 a sectional view taken along line B-B of

[0052] Figure 30 shows a semiconductor chip transfer device according to the third embodiment of the present invention.

[0053] Description of reference numerals

[0054] 10, 100, 100', 100'': Magnetic chucks

[0055] 11, 110, 110', 110'': Adsorbing rubbers

[0056] 20, 200, 200', 200'': Chuck holders

[0057] 21, 210, 210', 210'': Bottom surface (contact surface)

[0058] 22, 220, 220', 220'': Holder holes

[0059] 23, 115, 116', 116'', 117'': Common grooves

[0060] 111, 111', 112', 111'', 113'': Protrusions

[0061] 112, 113', 112'': Rubber bases

[0062] 113, 114, 114', 115', 114'', 115'': Individual holes

[0063] 12, 120, 120', 120'': Metal plates

[0064] 121, 121', 121'': Metal bases 122, 122': Common holes

[0065] 122a: First hole 122b: First hole

[0066] 123', 123'': Alignment holes 200': Chuck holder

[0067] 122'': Insertion hole D: Semiconductor chip

[0068] S: Substrate Detailed implementation manners

[0069] The object, means and effects of the present invention can become more clear through the following detailed description related to the drawings. Therefore, those skilled in the art can easily implement the technical idea of the present invention. And when it is considered that the specific description of the related conventional technology may unnecessarily obscure the gist of the present invention during the description of the present invention, the detailed description thereof will be omitted.

[0070] The terms used in this specification are for describing embodiments and do not limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated otherwise in the context. In this specification, terms such as "comprising", "including", "configured with", or "having" do not exclude the existence or addition of one or more other structural elements other than the recited structural elements.

[0071] In this specification, terms such as "or", "at least one" represent one of the words listed together, or may represent a combination of two or more. For example, "A or B", "at least one of A and B" may include only one of A or B, or may include both A and B.

[0072] In this specification, with respect to the description based on "for example", information such as the indication of the recited characteristics, variables, or values may not be exactly consistent, and has the effect of being deformed due to allowable errors, measurement errors, limits of measurement accuracy, and other well-known factors. Therefore, it does not limit the implementation modes of the invention according to various embodiments of the present invention.

[0073] In this specification, when it is described that a certain structural element is "connected" or "contacted" with another structural element, it should be understood that not only can it be directly connected or contacted with the other structural element, but also other structural elements may be arranged in the middle. In contrast, when it is described that a certain structural element is "directly connected" or "directly contacted" with another structural element, it should be understood that no other structural elements are arranged in the middle.

[0074] In this specification, when it is described that a certain structural element is "above" or "abuts" another structural element, it should be understood that not only can it directly abut or be connected above the other structural element, but also another structural element may be arranged in the middle. In contrast, when it is described that a certain structural element is "directly above" or "directly abuts" another structural element, it should be understood that no other structural element is arranged in the middle. Other expressions for describing the relationship between structural elements, such as "between ~" and "directly between ~", are also interpreted in the same way.

[0075] In this specification, terms such as "first", "second", etc. may be used to describe various structural elements, but these structural elements are not limited to the above terms. Also, the above terms should not be construed as limiting the order of each structural element, but may be used to distinguish one structural element from another. For example, the "first structural element" may be named the "second structural element", and similarly, the "second structural element" may be named the "first structural element".

[0076] Unless otherwise defined, all terms used in this specification are used in the sense commonly understood by those skilled in the art. And, unless specifically defined otherwise, terms defined in commonly used dictionaries will not be interpreted in an overly ideal or excessive manner.

[0077] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

[0078] <First Embodiment>

[0079] Figure 2 is a perspective view of a magnetic chuck 100 according to the first embodiment of the present invention, Figure 9 showing a semiconductor chip transfer device according to the first embodiment of the present invention.

[0080] The semiconductor chip transfer device according to the first embodiment of the present invention is a device for picking up and transferring semiconductor chips cut from a wafer, as Figure 2 and Figure 9 shown, includes a magnetic chuck 100 and a chuck holder 200. The semiconductor chip transfer device according to the first embodiment as described above can be used not only in the assembly process for semiconductor packaging but also in a visual inspection process for checking whether the appearance states such as surface breakage, cracks, and defects of semiconductor chips are good.

[0081] The chuck holder 200 is a structure for fastening the magnetic chuck 100 and called a shank, and a chuck holder hole 220 is formed in the bottom surface (i.e., the contact surface) 210 in contact with the magnetic chuck (100). At this time, the passage of the chuck holder hole 220 is connected to a vacuum application pipe for sucking air, so as to provide a vacuum suction force to the semiconductor chip, and the chuck holder hole 220 is exposed on the contact surface 210 of the chuck holder 200.

[0082] The chuck holder 200 includes a structure having magnetism (hereinafter, referred to as a "magnetic part"). Such a magnetic part can be formed by magnets having various types and sizes. Therefore, the magnetic chuck 100 having the metal plate 120 can be attached and coupled to the chuck holder 200 by the magnetic force of the gravitational force acting between the metal plate 120 and the magnetic part of the chuck holder 200.

[0083] The collet holder 200 may further include a fixing portion for more firmly fixing the magnetic collet 100 attached to the collet holder 200. For example, the fixing portion may include an elastic body that provides an elastic force at least from two directions toward the central portion on the contact surface 210 and a movable body that is connected to each elastic body and functions to provide an elastic action toward the central portion while being movable, but is not limited thereto. That is, the adsorption rubber 110 of the magnetic collet 100 described later, particularly the rubber base 112, may be further fixed between the movable bodies by an elastic force.

[0084] Figure 3 and Figure 4 are perspective views of the adsorption rubber 110 of the magnetic collet 100 according to the first embodiment of the present invention, respectively, as viewed from the upper side and the lower side. Figure 5 is a perspective view of the metal plate 120 of the magnetic collet 100 according to the first embodiment of the present invention, as viewed from the upper side. And, Figure 6 is a bottom view of the magnetic collet 100 according to the first embodiment of the present invention. Figure 7 is a side view of the magnetic collet 100 in the longitudinal length direction according to the first embodiment of the present invention. Figure 8 is Figure 2 a cross-sectional view taken along line A-A of

[0085] The magnetic collet 100, as a structure for picking up semiconductor chips, as Figures 2 to 9 shown, includes an adsorption rubber 110 and a metal plate 120. That is, the magnetic collet 100 can pick up a semiconductor chip by adsorbing it using the vacuum suction force supplied through the collet hole 220.

[0086] The adsorption rubber 110, as a structure including a rubber resin material, directly contacts the semiconductor chip. Such an adsorption rubber 110 may include a rubber base 112 in a plate form, a protrusion 111 protruding from one surface of the rubber base 112, and a plurality of individual holes 113, 114. At this time, one surface of the protrusion 111 may function as a contact surface for the semiconductor chip, and the other surface of the rubber base 112 may function as a contact surface for the metal plate 120. For example, the protrusion 111 and the rubber base 112 may be formed by a molding process or the like, and may be formed of the same material and integrally formed, but are not limited thereto.

[0087] Each of the individual holes 113, 114 may be formed to penetrate from one surface of the protrusion 111 to the other surface of the rubber base 112. That is, each of the individual holes 113, 114 may include a first opening 113 formed on one surface of the protrusion 111 and a second opening 114 formed on the other surface of the rubber base 112, and the channels of the first opening 113 and the second opening 114 may be connected to each other.

[0088] In particular, preferably, in each individual hole 113, 114, the area of the first opening 113 formed on one side of the protrusion 111 is smaller than the area of the second opening 114 formed on the other side of the rubber base 112, so that the vacuum suction force acting on one side of the protrusion 111 can be further strengthened. For example, the first opening 113 may be a polygonal shape with a smaller area, and the second opening 114 may be a circular shape with a larger area, but it is not limited thereto.

[0089] The metal plate 120 is a structure including a metal material. That is, one side of the metal plate 120 is in contact and bonded to the other side of the rubber base 112 of the adsorption rubber 110, and the other side can be attached and bonded to the chuck holder 200 by the magnetic force of the magnetic part of the chuck holder 200 according to the material characteristics.

[0090] The metal plate 120 includes a common hole 122 formed in the metal base 121 in the form of a plate. At this time, the common hole 122, as a structure penetrating from one side to the other side of the metal base 121, is connected (communicated) to each individual hole 113, 114 of the adsorption rubber 110 to provide a common passage therefor. Therefore, the vacuum suction force from the chuck hole 220 of the chuck holder 200 can be dispersed to each individual hole 113, 114 through the common hole 122 to act. As a result, in the present invention, without providing an additional common groove on the contact surface 210 of the chuck holder 200, even when the contact surface 210 is flat, it can also function to transfer the semiconductor chip.

[0091] Moreover, the adsorption rubber 110 may further include a common groove 115. At this time, the common groove 115, as a structure recessed in the direction of the other side on one side of the protrusion 111, is connected (communicated) to each individual hole 113, 114 to provide a common passage therefor. Such a common groove 115 can limit the range of the vacuum suction force acting in each individual hole 113, 114 while further increasing the strength. However, preferably, in order to further strengthen the vacuum suction force acting on one side of the protrusion 111, the channel diameter of the common groove 115 is smaller than the channel diameter of the common hole 122 described later. At this time, preferably, in order to suck and attach the semiconductor chip, the range formed by each individual hole 113, 114 and the common groove 115 is smaller than the area of the semiconductor chip. For example, the common groove 115 may have a formation range in the shape of a polygonal ring such as a quadrilateral, but it is not limited thereto.

[0092] In particular, preferably, in order to more effectively attach the semiconductor chip, the individual holes 113, 114 of the adsorption rubber 110 are arranged in at least two columns along the direction from the first side on one side of the protrusion 111 to the second side as the corresponding side. That is, referring to Figure 6, the vertical line portion on the left side can be the direction of the first side, and the vertical line portion on the right side can be the direction of the second side. At this time, in each individual hole 113, 114, the shape of the opening 113 of the protrusion 111 can be formed long along the direction from the first side toward the second side. This is to match the direction of the common suction force acting in each individual hole 113, 114 according to the arrangement direction.

[0093] Moreover, the common hole 122 of the metal plate 120 can include an H shape formed by two first holes 122a separated from each other and a second hole 122b connecting each first hole 122a. At this time, the individual holes 113, 114 of the adsorption rubber 110 are arranged in columns at positions corresponding to each first hole 122a of the metal plate 120. Of course, different from what is shown in Figure 6 , the individual holes 113, 114 of one or more adsorption rubbers 110 can also be arranged at positions corresponding to the second hole 122b of the metal plate 120. In particular, such an H-shaped common hole 122 and the arrangement of the individual holes 113, 114 based on the common hole 122 can limit the common connection channel between them to a specific range, thereby further increasing the vacuum suction force.

[0094] <Second Embodiment>

[0095] Figure 10 is a perspective view of the magnetic chuck 100' according to the second embodiment of the present invention, Figure 19 showing a semiconductor chip D transfer device according to the second embodiment of the present invention. And FIG. 20 shows the transfer process of the semiconductor chip D performed by the semiconductor chip D transfer device according to the second embodiment of the present invention.

[0096] The semiconductor chip transfer device according to the second embodiment of the present invention is a device for picking up and transferring a semiconductor chip (or also referred to as "die") D cut from a wafer, as shown in Figure 10 , Figure 19 and FIG. 20, and includes a magnetic chuck 100' and a chuck holder 200'. The semiconductor chip transfer device according to the second embodiment of the present invention as described above can be used not only in the assembly process for semiconductor packaging but also in a visual inspection process for checking whether the appearance of the semiconductor chip D, such as surface breakage, cracks, defects, etc., is good.

[0097] The chuck holder 200' is a structure for fastening the magnetic chuck 100' and is called a shank. A chuck hole 220' is formed on the bottom surface (i.e., the contact surface) 210' that contacts the magnetic chuck 100'. At this time, the passage of the chuck hole 220' is connected to a vacuum application pipe that sucks in air, so as to provide a vacuum suction force to the semiconductor chip D, and the chuck hole 220' is exposed on the contact surface 210' of the chuck holder 200'.

[0098] The chuck holder 200' includes a structure having magnetic force (hereinafter, referred to as a "magnetic part"). Such a magnetic part can be formed by magnets having various types and sizes. Therefore, the magnetic chuck 100' having the metal plate 120' can be attached and coupled to the chuck holder 200' by the magnetic force of the gravitational force acting between the metal plate 120' and the magnetic part of the chuck holder 200'.

[0099] The chuck holder 200' may further include a fixing part for more firmly fixing the magnetic chuck 100' attached and coupled to the chuck holder 200'. For example, the fixing part may include, but is not limited to, an elastic body that provides an elastic force at least from two directions toward the central part on the contact surface 210' and a movable body that is connected to each elastic body and functions to provide an elastic action toward the central part while being movable. That is, the adsorption rubber 110' of the magnetic chuck 100' described later, especially the rubber base 113', can be further fixed between the movable bodies by an elastic force.

[0100] Figure 11 and Figure 12 are a perspective view and a bottom view of the adsorption rubber 110' of the magnetic chuck 100' according to the second embodiment of the present invention, respectively, when viewed from above. Figure 13 and Figure 14 are a perspective view and a bottom view of the metal plate 120' of the magnetic chuck 100' according to the second embodiment of the present invention, respectively, when viewed from above. And Figure 15 is a side view of the magnetic chuck 100' in the long-axis length direction according to the second embodiment of the present invention, Figure 16 is Figure 10 a cross-sectional view taken along line A-A of Figure 17 is a side view of the magnetic chuck 100' in the short-axis length direction according to the second embodiment of the present invention, Figure 18 is Figure 10 a cross-sectional view taken along line B-B of

[0101] The magnetic chuck 100' is a structure for picking up the semiconductor chip D, as Figures 10 to 2As shown in 0, it includes an adsorption rubber 110' and a metal plate 120'. That is, the magnetic chuck 100' can pick up the semiconductor chip D by using the vacuum suction force supplied through the chuck hole 220'. Of course, the magnetic chuck 100' can include the structure of the magnetic chuck 100 according to the above first embodiment.

[0102] The adsorption rubber 110' is a structure including a rubber resin material and is in direct contact with the semiconductor chip D. Such an adsorption rubber 110' can include a rubber base 113' in the form of a plate, a first protrusion 112' protruding from one side of the rubber base 113', a second protrusion 111' protruding from one side of the first protrusion 112', and a plurality of individual holes 114', 115'. At this time, one side of the second protrusion 111' can function as a contact surface for the semiconductor chip D, and the other side of the rubber base 113' can function as a contact surface for the metal plate 120'. For example, the second protrusion 111' and the rubber base 113' can be formed by a molding process or the like, and can be formed of the same material and integrally formed, but are not limited thereto. Also, the adsorption rubber 110' can also be in a form in which the first protrusion 112' is omitted and the second protrusion 111' protrudes from one side of the rubber base 113'.

[0103] Preferably, the surface of the second protrusion 111' that is in direct contact with the semiconductor chip D is formed in an arc shape. At this time, the arc shape is curved, and it can also be a shape in which the height is higher (i.e., the thickness becomes thicker or more protruding) toward the central part of the surface of the second protrusion 111'. That is, the arc shape can be a shape in which the height is lower (i.e., the thickness becomes thinner or protrudes slightly) from the central part of the surface of the second protrusion 111' toward the first side and the second side that are located on both sides. At this time, referring to Figure 14 , the vertical line part on the left can be the direction of the first side, and the vertical line part on the right can be the direction of the second side.

[0104] In this way, the surface of the second protrusion 111' has an arc shape. As shown in FIG. 20, in the present invention, when approaching the semiconductor chip D as the transfer object, the central part, which is the most protruding part in the arc shape, can first contact the semiconductor chip D. In this state, if the vacuum suction force acts, the semiconductor chip D can be attached to the surface of the second protrusion 111' in a bent state according to the arc shape and be transferred. Therefore, in the present invention, the central part always first contacts the semiconductor chip D as the transfer object, and thus, it can be more stably attached to the second protrusion 111' without changing the position. That is, in the present invention, the semiconductor chip D can be directly transferred to the substrate S or the like without changing the position of the semiconductor chip D as the transfer object, and the influence on the position change of adjacent semiconductor chips can also be reduced.

[0105] Each individual hole 114', 115' can be formed to penetrate from one side of the second protrusion 111' to the other side of the rubber base 113'. That is, each individual hole 114', 115' can include a first opening 114' formed on one side of the second protrusion 111' and a second opening 115' formed on the other side of the rubber base 113', and the channels of the first opening 114' and the second opening 115' can be connected to each other.

[0106] Preferably, in each individual hole 114', 115', the area of the first opening 114' formed on one side of the second protrusion 111' is smaller than the area of the second opening 115' formed on the other side of the rubber base 113', so that the vacuum suction force acting on one side of the second protrusion 111' can be further enhanced. For example, the first opening 114' can be a polygon shape with a smaller area, and the second opening 115' can be a circular shape with a larger area, but it is not limited thereto.

[0107] The metal plate 120' is a structure including a metal material. That is, one side of the metal plate 120' is in contact and bonded to the other side of the rubber base 113' of the adsorption rubber 110', and the other side can be attached and bonded to the chuck gripper 200' by the magnetic force of the magnetic part of the chuck gripper 200' according to the material characteristics.

[0108] The metal plate 120' includes a common hole 122' formed in the metal base 121' in a plate form. At this time, the common hole 122', as a structure penetrating from one side of the metal base 121' to the other side, is connected (communicated) to each individual hole 114', 115' of the adsorption rubber 110' to provide a common channel for them. Therefore, the vacuum suction force from the chuck hole 220' of the chuck gripper 200' can act by being dispersed to each individual hole 114', 115' through the common hole 122'. As a result, in the present invention, without providing an additional common groove on the contact surface 210' of the chuck gripper 200', it can also play a role in transferring the semiconductor chip D when the contact surface 210' is flat.

[0109] Further, the adsorption rubber 110' may further include a common groove 116'. At this time, the common groove 116' is formed by being recessed in one surface direction of the second protrusion 111', and is connected (communicated) to each individual hole 114', 115' to provide a common passage therefor. Such a common groove 116' can limit the range of the vacuum suction force acting in each individual hole 114', 115' while further increasing the strength. However, preferably, in order to further strengthen the vacuum suction force acting on one surface of the second protrusion 111', the channel diameter of the common groove 116' is smaller than the channel diameter of the common hole 122' described later. At this time, preferably, in order to suck and attach the semiconductor chip D, the range formed by each individual hole 114', 115' and the common groove 116' is smaller than the area of the semiconductor chip D. For example, the common groove 116' may have a formation range in a polygonal ring shape such as a quadrilateral, but is not limited thereto.

[0110] In particular, preferably, in order to more effectively attach the semiconductor chip D, the individual holes 114', 115' of the adsorption rubber 110' are arranged in at least two columns along the direction from the first side of one surface of the second protrusion 111' to the second side as the corresponding side. At this time, in each individual hole 114', 115', the opening 114' shape of the second protrusion 111' may be formed long along the direction from the first side to the second side. This is to match the direction of the common suction force acting in each individual hole 114', 115' according to the arrangement direction.

[0111] Further, the common hole 122' of the metal plate 120' may include an H shape formed by two first holes separated from each other and a second hole connecting each first hole. That is, referring to Figure 14 , the portions of the common hole 122' that are separated from each other and extend horizontally on the upper side and the lower side may be the first holes, and the portion of the common hole 122' that connects each first hole and extends vertically may be the second hole. At this time, the individual holes 114', 115' of the adsorption rubber 110' are arranged in columns at positions corresponding to each first hole of the metal plate 120'. Of course, as Figure 14 shown differently, the individual holes 114', 115' of one or more adsorption rubbers 110' may also be arranged at positions corresponding to the second hole of the metal plate 120'. In particular, such an H-shaped common hole 122' and the arrangement of the individual holes 114', 115' based on the common hole 122' can limit their common connection channel to a specific range, thereby further increasing the vacuum suction force. This can solve the problems of the existing magnetic chucks as described below.

[0112] That is, the existing magnetic chuck does not have such a common hole 122'. Therefore, the chuck holder 200' needs to include a common groove that functions as the common hole 122' in the contact surface 210'. That is, there is a problem that the existing magnetic chuck cannot be applied to the chuck holder 200' that has a flat contact surface without providing a common groove in the contact surface 210'.

[0113] In addition, the metal plate 120' may further include an alignment hole 123' that penetrates through one surface and the other surface in a manner that enables alignment of the bonding position. For example, the alignment hole 123' may have a shape similar to that of the metal base 131', but is not limited thereto.

[0114] <Third Embodiment>

[0115] Figure 21 is a perspective view of a magnetic chuck 100” according to the third embodiment of the present invention, Figure 30 showing a semiconductor chip transfer device according to the third embodiment of the present invention.

[0116] The semiconductor chip transfer device according to the third embodiment of the present invention is a device for picking up and transferring semiconductor chips cut from a wafer, as Figure 21 and Figure 30 shown, includes a magnetic chuck 100” and a chuck holder 200”. The semiconductor chip transfer device according to the third embodiment of the present invention as described above can be used not only in the assembly process for semiconductor packaging but also in a visual inspection process for checking the appearance of the semiconductor chip, such as surface breakage, cracks, defects, etc.

[0117] The chuck holder 200” is a structure for fastening the magnetic chuck 100” and called a shank. A chuck hole 220” is formed in the bottom surface (i.e., the contact surface) 210” that contacts the magnetic chuck 100”. At this time, the passage of the chuck hole 220” is connected to a vacuum application tube that sucks in air to provide a vacuum suction force to the semiconductor chip, and the chuck hole 220” is exposed on the contact surface 210” of the chuck holder 200”.

[0118] The chuck holder 200” includes a structure having magnetism (hereinafter, referred to as a “magnetic part”). Such a magnetic part can be formed by magnets having various types and sizes. Therefore, the magnetic chuck 100” having the metal plate 120” can be attached and bonded to the chuck holder 200” by the magnetic force of the gravitational force acting between the metal plate 120” and the magnetic part of the chuck holder 200”.

[0119] The "collet chuck 200" may also include a fixing portion for more firmly fixing the magnetic chuck 100" attached to the collet chuck 200". For example, the fixing portion may include an elastic body that provides an elastic force at least from two directions toward the central portion on the contact surface 210" and a movable body that is connected to each elastic body to exert an elastic action toward the central portion and is movable, but is not limited thereto. That is, the adsorption rubber 110" of the magnetic chuck 100" described later, especially the rubber base 112", can be further fixed between the movable bodies by an elastic force.

[0120] Figure 22 and Figure 23 are perspective views of the adsorption rubber 110" of the magnetic chuck 100" according to the third embodiment of the present invention, respectively, viewed from the upper side and the lower side. Figure 24 is a perspective view of the metal plate 120" of the magnetic chuck 100" according to the third embodiment of the present invention, viewed from the upper side. Figure 25 is a perspective view of the magnetic chuck 100" according to the third embodiment of the present invention, viewed from the lower side. And, Figure 26 is a side view of the magnetic chuck 100" according to the third embodiment of the present invention in the major axis length direction. Figure 27 is Figure 21 a cross-sectional view taken along line A-A of Figure 28 is a side view of the magnetic chuck 100" according to the third embodiment of the present invention in the minor axis length direction. Figure 29 is Figure 21 a cross-sectional view taken along line B-B of

[0121] The magnetic chuck 100", as a structure for picking up semiconductor chips, as Figures 21 to 30 shown, includes an adsorption rubber 110" and a metal plate 120". That is, the magnetic chuck 100" can pick up a semiconductor chip by adsorbing it using the vacuum suction force supplied through the chuck hole 220". Of course, the magnetic chuck 100" has the structure of the magnetic chuck 100 according to the first embodiment described above, but may include the structure of the magnetic chuck 100' according to the second embodiment described above.

[0122] The "adsorption rubber 110" is a structure including a rubber resin material and is in direct contact with the semiconductor chip. This "adsorption rubber 110" may include a rubber base 112" in the form of a plate, a first protrusion 111" protruding from one side of the rubber base 112", a second protrusion 113" protruding from the other side of the rubber base 112", and a plurality of individual holes 114", 115". At this time, one side of the first protrusion 111" may function as a contact surface for the semiconductor chip, the other side of the rubber base 112" may function as a contact surface for the metal plate 120", and the second protrusion 113" may function as an insertion part for the metal plate 120". For example, the first protrusion 111", the rubber base 112", and the second protrusion 113" may be formed by a molding process or the like, and may be formed of the same material and integrally formed, but are not limited thereto.

[0123] Each of the individual holes 114", 115" may be formed to penetrate from one side of the first protrusion 111" to the other side of the second protrusion 113". That is, each of the individual holes 114", 115" may include a first opening 114" formed on one side of the first protrusion 111" and a second opening 115" formed on the other side of the second protrusion 113", and the channels of the first opening 114" and the second opening 115" may be connected to each other.

[0124] In particular, preferably, in each of the individual holes 114", 115", the area of the first opening 114" formed on one side of the first protrusion 111" is smaller than the area of the second opening 115" formed on the other side of the second protrusion 113", so that the vacuum suction force acting on one side of the first protrusion 111" can be further strengthened. For example, the first opening 114" may be a polygon shape with a smaller area, and the second opening 115" may be a circular shape with a larger area, but is not limited thereto.

[0125] Moreover, preferably, in order to more effectively attach the semiconductor chip, the individual holes 114", 115" of the adsorption rubber 110" are arranged in at least two columns along the direction from the first side on one side of the first protrusion 111" to the second side as the corresponding side. That is, referring to Figure 22 , one side in the short axis direction of the adsorption rubber 110" may be the direction of the first side, and the other side in the short axis direction of the adsorption rubber 110" may be the direction of the second side. At this time, in each of the individual holes 114", 115", the shape of the opening 114" of the first protrusion 111" may be formed long along the direction from the first side to the second side. This is to match the direction of the common suction force acting in each of the individual holes 114", 115" according to the arrangement direction.

[0126] Further, the adsorption rubber 110” may also include a first common groove 117” and a second common groove 116”.

[0127] The first common groove 117” is formed by being recessed in one surface direction on the other surface of the second protrusion 113”, and is connected (communicated) to each of the individual holes 114”, 115” to provide a common passage therefor. Thus, the vacuum suction force from the chuck holder hole 220” of the chuck holder 200” can be dispersed to each of the individual holes 114”, 115” through the first common groove 117” to exert its function. As a result, in the present invention, without providing an additional common groove on the contact surface 210” of the chuck holder 200”, even when the contact surface 210” is flat, the function of transferring the semiconductor chip can be achieved. At this time, the upper surface inside the first common groove 117” has the same height as the other surface of the rubber base 112”, but is not limited thereto, and may also have a height higher or lower than the other surface of the rubber base 112”.

[0128] The first common groove 117” can limit the range of the vacuum suction force acting in each of the individual holes 114”, 115” while further increasing the strength. However, preferably, in order to further strengthen the vacuum suction force acting on one surface of the first protrusion 111”, the channel diameter of the second common groove 116” is smaller than the channel diameter of the first common groove 117”. In particular, the first common groove 117” may include an H shape formed by two first grooves separated from each other and a second groove connecting the respective first grooves. At this time, the individual holes 114”, 115” of the adsorption rubber 110” may be arranged in columns at positions corresponding to the respective first grooves. Of course, differently from what is shown as Figure 23 above, one or more individual holes 114”, 115” of the adsorption rubber 110” may also be arranged at positions corresponding to the second groove. In particular, such an H-shaped first common groove 117” and the arrangement of the individual holes 114”, 115” based on the first common groove 117” can limit their common connection passage to a specific range, thereby further increasing the vacuum suction force.

[0129] The second common groove 116” is formed by being recessed in the other surface direction on one surface of the first protrusion 111”, and is connected (communicated) to each of the individual holes 114”, 115” to provide a common passage therefor. Such a second common groove 116” can limit the range of the vacuum suction force acting in each of the individual holes 114”, 115” while further increasing the strength. At this time, preferably, in order to suck and attach the semiconductor chip, the range formed by each of the individual holes 114”, 115”, the first common groove 117” and the second common groove 116” is smaller than the area of the semiconductor chip. For example, the second common groove 116” may have a formation range in a polygonal ring shape such as a quadrilateral, but is not limited thereto.

[0130] The "metal plate 120" is a structure made of a metal material. That is, one side of the metal plate 120 is in contact and bonded with the other side of the rubber base 112 of the adsorption rubber 110, and the other side can be attached and bonded to the chuck holder 200 by the magnetic force of the magnetic part of the chuck holder 200 according to the material characteristics.

[0131] The metal plate 120 includes an insertion hole 122 formed in the metal base 121 in the form of a plate. At this time, the insertion hole 122 is a structure that penetrates from one side of the metal base 121 to the other side, and can be formed in a shape corresponding to the second protrusion 113 of the adsorption rubber 110. That is, the second protrusion 113 of the adsorption rubber 110 is inserted into the insertion hole 122, so that the adsorption rubber 110 and the metal plate 120 can be fastened. Therefore, the present invention has a structure capable of replacing the adsorption rubber 110 and the metal plate 120. Of course, the adsorption rubber 110 and the metal plate 120 can also be bonded by an adhesive when being fastened.

[0132] In addition, the metal plate 120 may further include an alignment hole 123 that penetrates one side and the other side in a manner that can achieve alignment of the bonding position. For example, the alignment hole 123 may have a shape similar to that of the metal base 131, but is not limited thereto.

[0133] In the present invention configured as described above, the vacuum suction force from the chuck holder hole of the chuck holder can be dispersed to each individual hole through the common hole and thus function. Therefore, without providing an additional common groove on the contact surface of the chuck holder, when the contact surface is flat, it can also play a role in transferring the semiconductor chip. And in the present invention, the contact surface of the adsorption rubber in contact with the semiconductor chip D is formed into an arc shape with a protruding central part, and the central part always contacts the semiconductor chip D to be transferred first. Therefore, the semiconductor chip D to be transferred can be more stably attached, and can be directly transferred without changing the position, and the influence on the position change of adjacent semiconductor chips can also be reduced. And the present invention has a structure capable of replacing the adsorption rubber and the metal plate. When it is necessary to replace the magnetic chuck to cope with the sizes of various semiconductor chips, there is no need to replace the entire magnetic chuck fastened by the adsorption rubber and the metal plate, but only the adsorption rubber needs to be replaced.

[0134] Although specific embodiments are described in the detailed description of the present invention, various modifications can be made without departing from the scope of the present invention. Therefore, the scope of the present invention is not limited to the described embodiments, and the scope of the present invention should be determined according to the recited claims and the content equivalent to the claims.

Claims

1. A magnetic chuck, characterized in that, comprising: An adsorption rubber having a plurality of individual holes penetrating from the contact surface for the semiconductor chip, which is one side, to the protruding portion formed on the other side; and A metal plate having an insertion hole into which the protruding portion of the adsorption rubber is inserted and fastened, and thus laminated on the adsorption rubber, wherein the adsorption rubber includes a rubber base in the form of a plate, a first protruding portion protruding from one side of the rubber base, and a second protruding portion protruding from the other side of the rubber base. One side of the first protruding portion functions as the contact surface for the semiconductor chip, the other side of the rubber base functions as the contact surface for the metal plate, and the second protruding portion functions as the insertion portion for the metal plate, wherein each individual hole is formed to penetrate from the one side of the first protruding portion to the other side of the second protruding portion. In each individual hole, the area of the first opening formed on the one side of the first protruding portion is smaller than the area of the second opening formed on the other side of the second protruding portion, wherein the first common groove is a structure recessed in one side direction on the other side of the second protruding portion, and is connected to each individual hole to provide a common channel therefor. The second common groove is a structure recessed in the other side direction on the one side of the first protruding portion, and is connected to each individual hole to provide a common channel therefor, wherein the channel diameter of the second common groove is smaller than the channel diameter of the first common groove, wherein the first common groove includes an H shape formed by two first grooves separated from each other and a second groove connecting each first groove. The individual holes of the adsorption rubber are arranged in columns at positions corresponding to each first groove, wherein the metal plate further includes alignment holes penetrating through one side and the other side in a manner capable of achieving combined position alignment.

2. The magnetic chuck according to claim 1, characterized in that, The above-mentioned plurality of individual holes are arranged in at least two columns along the direction from the first side to the second side of the contact surface.

3. The magnetic chuck according to claim 1, characterized in that, The contact surface of the above-mentioned adsorption rubber for the semiconductor chip is formed in an arc shape.

4. The magnetic chuck according to claim 3, characterized in that, The above-mentioned arc shape is a shape in which the thickness is thicker towards the center portion of the contact surface.

5. The magnetic chuck according to claim 3, characterized in that, The above-mentioned arc shape is a shape in which the thickness is thinner from the center portion of the contact surface towards the first side and the second side, which are the sides located on both sides.

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