Audio module and terminal device

Abstract

The present disclosure relates to an audio module and a terminal device. The audio module at least includes: a first audio component having a groove on an outer surface for outputting an audio signal when the audio module is in a speaker mode; and a second audio component installed in the groove for outputting the audio signal when the audio module is in a receiver mode. Wherein, the power of the first audio component for outputting the audio signal is greater than the power of the second audio component for outputting the audio signal. Through the embodiments of the present disclosure, it is possible to make the audio effect output by the audio module better.

Description

Technical Field

[0001] The present disclosure relates to the technical field of audio processing, and particularly to an audio module and a terminal device. Background Art

[0002] With the continuous development of terminal devices, the functions of terminal devices such as mobile phones are becoming more and more abundant. In particular, the function of the audio module in a mobile phone to output an audio signal brings convenience in communication and an auditory enjoyment to people's daily lives. However, existing mobile phones use the same audio component to output audio signals in both the speaker mode and the earpiece mode, resulting in a problem of poor audio output effect. Summary of the Invention

[0003] The present disclosure provides an audio module and a terminal device.

[0004] In a first aspect of an embodiment of the present disclosure, an audio module is provided, which is applied to a terminal device. The audio module at least includes:

[0005] A first audio component, having a groove on its outer surface, for outputting an audio signal when the audio module is in the speaker mode;

[0006] A second audio component, installed in the groove, for outputting the audio signal when the audio module is in the earpiece mode;

[0007] Wherein, the power of the first audio component to output the audio signal is greater than the power of the second audio component to output the audio signal.

[0008] In some embodiments, the groove is located on a first surface of the first audio component;

[0009] A first connection interface and a second connection interface are provided on a second surface of the first audio component; the second surface is the opposite surface of the first surface; the first connection interface is used to transmit the audio signal to the first audio component;

[0010] A first conductive contact is provided in the groove, and the first conductive contact is electrically connected to the second connection interface;

[0011] The second audio component includes:

[0012] A second conductive contact, located on an outer surface of the second audio component in contact with the groove, and when the second audio component is located in the groove, the first conductive contact is in contact with the second conductive contact to form an electrical connection, and the electrical connection is used to transmit the audio signal provided by the second connection interface to the second audio component.

[0013] In some embodiments, the audio module further includes:

[0014] A third audio component, which is arranged at an interval from the first audio component and is configured to output the same audio signal as the first audio component when the audio module is in the speaker mode.

[0015] In some embodiments, the audio module further includes:

[0016] An adhesive component, which is located at the bottom of the groove and is configured to fix the second audio component in the groove.

[0017] In a second aspect of the embodiments of the present disclosure, there is provided a terminal device, including:

[0018] A device housing;

[0019] An audio module, including the audio module in any of the above embodiments, which is located in the device housing;

[0020] A processing module, which is located in the device housing and is connected to the audio module, and is configured to provide an audio signal to the audio module when the audio module is in the speaker mode; and provide the audio signal to the audio module when the audio module is in the earphone mode.

[0021] In some embodiments, the second audio component of the audio module includes: a first sound outlet hole, which is located on the outer surface of the second audio component;

[0022] The terminal device further includes:

[0023] A second sound outlet hole, which is located on the device housing;

[0024] An audio transmission channel, which is respectively communicated with the first sound outlet hole and the second sound outlet hole;

[0025] Wherein, the first sound outlet hole is configured to output the audio signal output by the second audio component to the audio transmission channel, and the second sound outlet hole is configured to transmit the audio signal in the audio transmission channel to the outside of the device housing.

[0026] In some embodiments, the terminal device further includes:

[0027] A printed circuit board, which is located in the device housing and is provided with a first through hole, and the first through hole is aligned and communicated with the first sound outlet hole;

[0028] A middle frame, which is located in the device housing and is provided with a second through hole, and the second through hole is aligned and communicated with the first through hole;

[0029] A connection channel, which is respectively communicated with the second through hole and the second sound outlet hole;

[0030] Wherein, the first through hole, the second through hole and the connection channel together constitute the audio transmission channel.

[0031] In some embodiments, the area of the printed circuit board occupied by the first through hole is smaller than the projected area of the second audio component projected onto the printed circuit board.

[0032] In some embodiments, the terminal device further includes:

[0033] A first sealing module, located between the second audio component and the printed circuit board, for sealing the first connection between the first through hole and the first sound outlet hole, and preventing the audio signal from being transmitted to the outside of the terminal device through the first connection.

[0034] In some embodiments, the terminal device further includes:

[0035] A second sealing module, located between the middle frame and the printed circuit board, for sealing the second connection between the second through hole and the first through hole, and preventing the audio signal from being transmitted to the outside of the terminal device through the second connection.

[0036] In some embodiments, the terminal device further includes:

[0037] A transmitting module, located between the second audio component and the device housing, for transmitting an infrared signal outward;

[0038] An infrared hole, both located on the first surface of the device housing with the second sound outlet hole, for transmitting the infrared signal to the outside of the terminal device.

[0039] In some embodiments, the first surface includes a first side edge and a second side edge disposed opposite to the first side edge;

[0040] The second sound outlet hole is located on the first side edge;

[0041] The infrared hole is located between the first side edge and the second side edge.

[0042] In some embodiments, the terminal device further includes:

[0043] A third sound outlet hole, located between the first side edge and the second side edge and spaced from the infrared hole, for transmitting the audio signal of the first audio component in the audio module to the outside of the device housing.

[0044] In some embodiments, the terminal device further includes:

[0045] The fourth sound hole is located on the second surface of the device housing and is used to transmit the audio signal of the third audio component in the audio module to the outside of the device housing; wherein, the second surface and the first surface are two opposite surfaces of the device housing.

[0046] In some embodiments, the processing module is respectively connected to the first connection interface and the second connection interface of the first audio component in the audio module, and is specifically configured to provide an audio signal to the audio module through the first connection interface when the audio module is in the speaker mode; and provide the audio signal to the audio module through the second connection interface when the audio module is in the earpiece mode.

[0047] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

[0048] The audio module includes a first audio component and a second audio component. The first audio component outputs an audio signal in the speaker mode, and the second audio component outputs an audio signal in the earpiece mode. The first audio component and the second audio component are two independent audio components. That is to say, the audio module uses audio components with different powers to output audio signals in different modes. Compared with using the same audio component to output audio signals in different modes, it can make the audio component match the output mode, meet the characteristics of outputting audio in different modes, and make the audio output effect of the audio module better.

[0049] In order to reduce the phenomena such as large area occupied by the separated independent audio components in the mobile terminal and cumbersome installation. The embodiments of the present disclosure adopt an integrated design of the first audio component and the second audio component, and the second audio component is arranged in the groove on the outer surface of the first audio component, rather than arranging the second audio component and the first audio component side by side on the printed circuit board of the terminal device. On the one hand, it can reduce the space occupied by the second audio component on the printed circuit board. On the other hand, compared with assembling a single audio component, it can increase the size of the assembled audio component, making the installation and positioning of the audio module more convenient.

[0050] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0052] Figure 1 is a schematic diagram of an audio module shown according to an exemplary embodiment Figure 1 .

[0053] Figure 2 Schematic diagram of an audio module shown according to an exemplary embodiment Figure 2 .

[0054] Figure 3 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 1 .

[0055] Figure 4 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 2 .

[0056] Figure 5 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 3 .

[0057] Figure 6 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 4 .

[0058] Figure 7 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 5 .

[0059] Figure 8 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 6 .

[0060] Figure 9 Schematic diagram of the structure of a terminal device shown according to an exemplary embodiment Figure 7 .

[0061] Figure 10 Block diagram of a terminal device shown according to an exemplary embodiment Detailed implementation manners

[0062] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present invention. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0063] Figure 1 Schematic diagram of the structure of an audio module shown according to an exemplary embodiment Figure 1 . As Figure 1 shown, the audio module at least includes:

[0064] The first audio component 101 has a groove on its outer surface for outputting an audio signal when the audio module is in the speaker mode;

[0065] The second audio component 102 is installed in the groove for outputting the audio signal when the audio module is in the receiver mode;

[0066] Wherein, the power of the first audio component for outputting the audio signal is greater than the power of the second audio component for outputting the audio signal.

[0067] In the embodiments of the present disclosure, the audio module is used to output an audio signal so that the user can hear the sound. For example, when listening to music, the audio module can be used to output the audio signal; when making a call or listening to voice, the audio module can be used to output the audio signal.

[0068] Both the above-mentioned first audio component and the second audio component are transducer devices for converting an electrical signal into an audio signal. The transducer device can generate a driving force under the action of a magnetic field by a magnet to make the vibrating diaphragm vibrate and generate sound, or utilize the piezoelectric effect generated by a piezoelectric material under the action of an electric field to make the vibrating diaphragm vibrate and generate sound.

[0069] Exemplarily, both the first audio component and the second audio component include but are not limited to an electro-dynamic audio component, an electromagnetic audio component or a piezoelectric audio component.

[0070] In the embodiments of the present disclosure, the size of the first audio component is larger than the size of the second audio component, and a groove for accommodating the second audio component can be provided on the outer surface of the first audio component. The groove can be provided on the outer surface of the first audio component where a magnetic field or an electric field is generated. Thus, compared with providing the groove on the outer surface of the sound cavity of the first audio component, the influence of the vibration of the vibrating diaphragm in the first audio component on the second audio component in the groove can be reduced, so that the second audio component can reduce the generation of noise.

[0071] It should be noted that the shape of the groove can be set according to the shape of the second audio component. For example, when the shape of the second audio component is rectangular, the shape of the groove can be set to be rectangular; when the shape of the second audio component is circular, the shape of the groove can be set to be circular, which is not limited in the embodiments of the present disclosure.

[0072] Of course, the size of the groove can also be set according to the size of the second audio component so that the second audio component can be better placed in the groove. For example, the size of the groove can be set to be larger than or equal to the size of the second audio component.

[0073] The above earpiece mode and speaker mode are different output modes for the audio module to output audio signals. When the distance between the user and the terminal device is within the first distance range, the audio module can output audio signals in the earpiece mode; when the distance between the user and the terminal device is within the second distance range, the audio module can output audio signals in the speaker mode; wherein, the distance within the first distance range is less than the distance within the second distance range.

[0074] In the embodiments of the present disclosure, the power of the audio signals output by the first audio component is greater than the power of the audio signals output by the second audio component. That is to say, the loudness of the audio signals output by the first audio component in the speaker mode is greater than the loudness of the audio signals output by the second audio component in the earpiece mode. Thus, in the speaker mode, the user can obtain the audio signals within the first range, and in the earpiece mode, the user can hear the audio signals obtained within the second distance range.

[0075] It should be noted that during the use of the audio module, the first audio component can be applied to scenarios where a large loudness of audio signals needs to be output. For example, in scenarios where the alarm of the terminal device rings, the incoming call music of the terminal device rings, or the terminal device plays videos, music, etc.

[0076] The above second audio component can be applied to scenarios where a small loudness of audio signals needs to be output. For example, in scenarios where the terminal device uses social software such as WeChat and QQ for voice playback or answering incoming calls.

[0077] In the embodiments of the present disclosure, the audio module includes a first audio component and a second audio component. The first audio component outputs audio signals in the speaker mode, and the second audio component outputs audio signals in the earpiece mode. That is to say, the audio module uses audio components with different powers to output audio signals in different modes. Compared with using the same audio component to output audio signals in different modes, it can make the audio component match the output mode, meet the characteristics of audio output in different modes, and make the audio output effect of the audio module better. At the same time, the embodiments of the present disclosure adopt an integrated design of the first audio component and the second audio component, and the second audio component is arranged in the groove on the outer surface of the first audio component, rather than arranging the second audio component and the first audio component side by side on the printed circuit board of the terminal device. On the one hand, it can reduce the space occupied by the second audio component on the printed circuit board. On the other hand, compared with assembling a single audio component, it can increase the size of the assembled audio component, making the installation and positioning of the audio module more convenient.

[0078] In some embodiments, the audio module further includes:

[0079] A third audio component, which is spaced apart from the first audio component, is configured to output the same audio signal as the first audio component when the terminal device is in the speaker mode.

[0080] In the embodiments of the present disclosure, both the third audio component and the first audio component output audio signals in the speaker mode. In this way, the two audio components arranged at intervals output audio signals simultaneously. On the one hand, it can increase the loudness of the audio signals output by the audio module and meet the user's need to hear sounds from a long distance. On the other hand, it enables the user to perceive sounds in two directions and achieve a stereo effect.

[0081] In some other embodiments, the audio output direction of the first audio component is opposite to that of the third audio component. For example, when the audio module is applied to a terminal device such as a mobile phone, the audio output direction of the first audio component can be towards the top of the mobile phone, and the audio output direction of the third audio component can be towards the bottom of the mobile phone. In this way, during the process of the user using the mobile phone to output audio signals, the audio signals output by the first audio component and the third audio component on the mobile phone can propagate to the user from two different directions, thereby enabling the user to perceive a better stereo effect.

[0082] In some embodiments, as Figure 2 shown, the audio module further includes:

[0083] An adhesive component 103, located at the bottom of the groove 104, is configured to fix the second audio component 102 in the groove 104.

[0084] In the embodiments of the present disclosure, using the adhesive component to fix the second audio component in the groove can reliably fix the second audio component on the first audio component and reduce the situation where the second audio component falls out of the groove on the first audio component.

[0085] Exemplarily, the adhesive component includes but is not limited to double-sided tape.

[0086] In some embodiments, the groove is located on the first surface of the first audio component;

[0087] A first connection interface and a second connection interface are provided on the second surface of the first audio component; the second surface is the opposite surface of the first surface; the first connection interface is configured to transmit the audio signal to the first audio component;

[0088] The groove has a first conductive contact, and the first conductive contact is electrically connected to the second connection interface;

[0089] The second audio component includes:

[0090] A second conductive contact is located on the outer surface where the second audio component contacts the groove. When the second audio component is located within the groove, the first conductive contact contacts the second conductive contact to form an electrical connection for transmitting the audio signal provided by the second connection interface to the second audio component.

[0091] That is to say, the second audio component obtains the audio signal through the electrical loop formed by the connection between the second connection interface, the first conductive contact, and the second conductive contact. When the audio module is in the speaker mode, the first connection interface transmits the audio signal to the first audio component; when the audio module is in the earpiece mode, the second connection interface transmits the audio signal to the second audio component. In this way, it is possible to output the audio signal from the second audio component when the second audio component is superimposed on the first audio component.

[0092] In the embodiment of the present disclosure, a groove is provided on the first surface, a second connection interface is provided on the second surface, and an electrical connection is established between the second connection interface and the first conductive contact within the groove. The first surface and the second surface are opposite surfaces. In this way, the length of the signal transmission between the second connection interface and the first conductive contact can be shortened, and the signal transmission efficiency can be improved.

[0093] It should be noted that the first conductive contact can be provided on the side wall within the groove or on the area outside the bonding component at the bottom of the groove. The embodiment of the present disclosure does not limit this.

[0094] In the embodiment of the present disclosure, both the first conductive contact and the second conductive contact are conductive contacts formed of materials such as metal or alloy.

[0095] Exemplarily, both the first conductive contact and the second conductive contact can be installed on the first audio component and the second audio component by the Laser-Direct-structuring (LDS) process.

[0096] The embodiment of the present disclosure also proposes a terminal device. Figure 3 It is a schematic structural diagram of a terminal device shown according to an exemplary embodiment. Figure 1 As Figure 3 shown, the terminal device at least includes:

[0097] A device housing 11;

[0098] An audio module 12, including the audio module in any of the above embodiments, is located within the device housing;

[0099] A processing module, located within the device housing and connected to the audio module, is configured to provide an audio signal to the audio module when the audio module is in the speaker mode; and to provide the audio signal to the audio module when the audio module is in the earpiece mode.

[0100] The above-mentioned terminal device can be a wearable electronic device or a mobile terminal. The mobile terminal includes a mobile phone, a notebook, and a tablet computer. The wearable electronic device includes a smart watch. The embodiments of the present disclosure are not limited thereto.

[0101] The above-mentioned device housing can enclose an accommodation space, which can be used not only to accommodate the audio module, but also to accommodate other modules within the terminal device, such as a processing module, an image acquisition module, or a transmission module for emitting infrared rays. The embodiments of the present disclosure are not limited thereto.

[0102] Exemplarily, the material of the device housing includes, but is not limited to, plastic, metal material, or alloy material.

[0103] In the embodiments of the present disclosure, the audio module in the terminal device outputs an audio signal using audio components with different powers in different modes. Compared with using the same audio component to output an audio signal in different modes, it can make the audio components in the terminal device match the output mode, meet the characteristics of outputting audio in different modes, and make the audio output effect of the audio module better. At the same time, in order to reduce the problems such as the large area occupied by the separate independent audio components in the mobile terminal and the cumbersome installation, the embodiments of the present disclosure adopt an integrated design of the first audio component and the second audio component, and the second audio component is arranged in the groove on the outer surface of the first audio component, rather than arranging the second audio component and the first audio component side by side on the printed circuit board of the terminal device. On the one hand, it can reduce the space occupied by the second audio component on the printed circuit board. On the other hand, compared with assembling a single audio component, it can increase the size of the assembled audio component, making the installation and positioning of the audio module more convenient.

[0104] In some embodiments, as Figure 4 shown, the second audio component of the audio module includes: a first sound outlet hole 14, located on the outer surface of the second audio component;

[0105] The terminal device further includes:

[0106] a second sound outlet hole 15, located on the device housing;

[0107] an audio transmission channel 16, communicating with the first sound outlet hole and the second sound outlet hole respectively;

[0108] Wherein, the first sound outlet hole is configured to output the audio signal output by the second audio component to the audio transmission channel, and the second sound outlet hole is configured to transmit the audio signal in the audio transmission channel to the outside of the device housing.

[0109] In the embodiments of the present disclosure, the first sound outlet hole outputs the audio signal generated by the second audio component to the outside of the second audio component, and the second sound outlet hole transmits the audio signal in the audio transmission channel to the outside of the device housing. In this way, the audio signal generated by the second audio component can be output to the outside of the terminal device through the first sound outlet hole, the audio transmission channel, and the second sound outlet hole, so that the user can obtain the audio signal generated by the second audio component when approaching the device housing.

[0110] The above-mentioned audio transmission channel is respectively connected to the first sound outlet hole and the second sound outlet hole, so that the audio signal can be transmitted to the second sound outlet hole through the audio transmission channel. It should be noted that the audio transmission channel can be a straight-through channel or a bent channel, and the embodiments of the present disclosure do not limit this.

[0111] Of course, the length of the audio transmission channel can be set according to actual needs. For example, it can be set to 10 millimeters, 12 millimeters, or 14 millimeters, and the embodiments of the present disclosure do not limit this.

[0112] In some embodiments, as Figure 5 and Figure 6 shown, the terminal device further includes:

[0113] A printed circuit board 17, located inside the device housing and provided with a first through hole 18, the first through hole 18 being aligned and communicated with the first sound outlet hole 14;

[0114] A middle frame 19, located inside the device housing and provided with a second through hole 20, the second through hole 20 being aligned and communicated with the first through hole 18;

[0115] A connection channel, respectively connected to the second through hole and the second sound outlet hole;

[0116] Wherein, the first through hole, the second through hole, and the connection channel together constitute the audio transmission channel 14.

[0117] The above-mentioned printed circuit board is a carrier board for various components in the terminal device, and the wires that can be arranged inside it can connect various components on the printed circuit board.

[0118] In the embodiments of the present disclosure, the first sound outlet is connected to the first through hole, the first through hole is connected to the second through hole, the second through hole is connected to the connection channel, and the connection channel is connected to the second sound outlet. In this way, the audio signal output from the first sound outlet can be transmitted to the second sound outlet through the audio transmission channel jointly formed by the first through hole, the second through hole and the connection channel.

[0119] It should be noted that the shape and size of the first through hole need to be adapted to the first sound outlet and the second through hole respectively, the size and shape of the second through hole need to be matched with the first through hole and the connection channel respectively, and the connection channel needs to be matched with the second sound outlet. Only in this way can the audio transmission channel better transmit the audio signal.

[0120] In the embodiments of the present disclosure, the audio signal generated by the second audio component needs to be first transmitted to the first through hole on the printed circuit board through the first sound outlet; then the audio signal is transmitted to the second through hole in the middle frame through the first through hole; then it is transmitted to the connection channel through the second through hole, and finally it is transmitted to the second sound outlet on the device housing through the connection channel. It can be seen that in the embodiments of the present disclosure, the first sound outlet faces the printed circuit board, not directly towards the device housing.

[0121] That is to say, the audio signal in the embodiments of the present disclosure needs to pass through the first through hole of the printed circuit board and the second through hole of the middle frame before it can be transmitted outside the device housing. It adopts a bent audio transmission channel, rather than a straight-through audio transmission channel, which makes the audio transmission channel in the embodiments of the present disclosure longer. In this way, the attenuation length of the noise caused by the vibration of the components in the terminal device can be increased, more noise in the terminal device can be attenuated, and the audio output effect of the terminal device can be improved.

[0122] In some other embodiments, the terminal device further includes: a first sealing module, located between the second audio component and the printed circuit board, for sealing the first connection between the first through hole and the first sound outlet to prevent the audio signal from being transmitted to the outside of the terminal device from the first connection.

[0123] In some other embodiments, the terminal device further includes: a second sealing module, located between the middle frame and the printed circuit board, for sealing the second connection between the second through hole and the first through hole to prevent the audio signal from being transmitted to the outside of the terminal device from the second connection.

[0124] Exemplarily, both the first sealing module and the second sealing module include, but are not limited to, a sealing module formed by foam.

[0125] In some embodiments, the area of the printed circuit board occupied by the first through hole is smaller than the projected area of the second audio component projected onto the printed circuit board.

[0126] That is to say, the area of the first through-hole required for the second audio component to transmit the audio signal occupies less area of the printed circuit board than the area where the second audio component is directly disposed on the printed circuit board. As Figure 7 shown, in the prior art, the second audio component is directly disposed at the position 01 of the printed circuit board 17, which has the problem of large occupation of the printed circuit board area. Based on this, the embodiment of the present disclosure proposes to dispose the second audio component on the first audio component, and only need to set the first through-hole on the printed circuit board to achieve the output of the audio. In this way, it is possible to reduce the large-area hollowing of the printed circuit board caused by the setting of the second audio component, ensure the integrity of the printed circuit board, and also provide the possibility of reserving more routing space for the printed circuit board.

[0127] Exemplarily, the area of the printed circuit board occupied by the first through-hole can be set according to actual needs. For example, the area of the printed circuit board occupied by the first through-hole can be set to be half or a quarter of the projected area, which is not limited in the embodiment of the present disclosure.

[0128] In some embodiments, the terminal device further includes:

[0129] a transmitting module, located between the second audio component and the device housing, for transmitting an infrared signal outward;

[0130] an infrared hole, both located on the first surface of the device housing with the second sound outlet hole, for transmitting the infrared signal to the outside of the terminal device.

[0131] The infrared signal transmitted by the above-mentioned transmitting module is used to remotely control an external device, and the external device includes but is not limited to an air conditioner and a television. For example, the air conditioner can be turned on and off by transmitting an infrared signal to the air conditioner; different playback channels of the television can be switched by transmitting an infrared signal to the television.

[0132] In the embodiment of the present disclosure, the terminal device further includes an infrared transmission channel. The transmitting module transmits the infrared signal to the infrared hole through the infrared transmission channel, and further makes the infrared hole serve as an output channel to output the infrared signal outside the device housing. The shape of the infrared hole can be set according to actual needs. For example, the shape of the infrared hole can be set to be circular or elliptical, which is not limited in the embodiment of the present disclosure.

[0133] As Figure 8 shown, the infrared transmission channel 22 of the transmitting module in the terminal device can directly transmit the infrared signal to the infrared hole. The audio transmission channel 21 in the embodiment of the present disclosure is located directly behind the infrared transmission channel, and it cannot use a straight-through channel to directly transmit the audio signal outside the device housing 11, but uses a bent channel to bypass the infrared transmission channel 22 to transmit the audio signal outside the device housing 11.

[0134] Thus, compared with the straight-through channel, the bent channel adopted in the embodiments of the present disclosure can make the length of the audio transmission channel longer, increase the attenuation length of the noise caused by the vibration of the components in the terminal device, and further make more noise attenuated in the terminal device, improving the audio output effect of the terminal device.

[0135] In some embodiments, as Figure 9 shown, the first surface 11a includes a first side edge and a second side edge opposite to the first side edge;

[0136] The second sound outlet hole 15 is located on the first side edge;

[0137] The infrared hole 24 is located between the first side edge and the second side edge.

[0138] In other embodiments, as Figure 9 shown, the terminal device further includes:

[0139] A third sound outlet hole 23, located between the first side edge and the second side edge and spaced from the infrared hole, for transmitting the audio signal of the first audio component in the audio module to the outside of the device housing.

[0140] It should be noted that in the embodiments of the present disclosure, the third sound outlet hole, the second sound outlet hole and the infrared hole are all located on the first surface of the device housing. Exemplarily, the first surface can be the surface where the top of the terminal device is located, and the infrared hole can be arranged at the central position of the first surface.

[0141] In the embodiments of the present disclosure, the first side edge can be the side edge where the user is close to the terminal device. Thus, through the second sound outlet hole on the first side edge, the user can hear the sound more clearly in the earpiece mode.

[0142] In some embodiments, the terminal device further includes:

[0143] A fourth sound outlet hole, located on the second surface of the device housing, for transmitting the audio signal of the third audio component in the audio module to the outside of the device housing; wherein, the second surface and the first surface are two opposite surfaces of the device housing.

[0144] The above-mentioned first surface can be the surface where the top of the terminal device is located, and the second surface can be the surface where the bottom of the terminal device is located. The embodiments of the present disclosure do not make limitations.

[0145] In the embodiments of the present disclosure, the second sound outlet of the first audio component and the fourth sound outlet of the third audio component are respectively located on two relatively arranged surfaces within the device housing. In this way, when the audio module of the terminal device is in the speaker mode, the two relatively arranged surfaces of the device housing of the terminal device simultaneously output audio signals outward, enabling the audio signals to propagate to the user from two different directions, and thus enabling the user to perceive a better stereo effect.

[0146] In some embodiments, the processing module is respectively connected to the first connection interface and the second connection interface of the first audio component in the audio module, and is specifically configured to provide an audio signal to the audio module through the first connection interface when the audio module is in the speaker mode; and provide the audio signal to the audio module through the second connection interface when the audio module is in the earphone mode.

[0147] That is to say, in different audio output modes, the processing module outputs audio signals to different connection interfaces of the audio module respectively, so that the terminal device can output different audio signals in different audio output modes, meeting the requirements of different scenarios of the terminal device.

[0148] It should be noted that "first", "second", "third" and "fourth" in the embodiments of the present disclosure are only for convenience of expression and distinction, and have no other specific meanings.

[0149] Figure 10 is a block diagram of a terminal device shown according to an exemplary embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0150] Referring to Figure 10 , the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0151] The processing component 802 generally controls the overall operation of the terminal device, such as operations associated with display, telephone call, data communication, camera operation, and recording operation. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0152] The memory 804 is configured to store various types of data to support the operation of the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phone book data, messages, pictures, videos, and the like. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0153] The power component 806 provides power to the various components of the terminal device. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the terminal device.

[0154] The multimedia component 808 includes a screen that provides an output interface between the terminal device and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can not only sense the boundaries of the touch or swipe actions, but also detect the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the terminal device is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each of the front camera and the rear camera can be a fixed optical lens system or have a focal length and optical zoom capabilities.

[0155] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC) that is configured to receive external audio signals when the terminal device is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 further includes a speaker for outputting audio signals.

[0156] The I / O interface 812 provides an interface between the processing component 802 and a peripheral interface module, which can be a keyboard, a click wheel, buttons, etc. These buttons can include, but are not limited to: a home button, a volume button, a power button, and a lock button.

[0157] The sensor assembly 814 includes one or more sensors for providing status assessments in various aspects for the terminal device. For example, the sensor assembly 814 can detect the on / off state of the terminal device, the relative positioning of components, such as the display and keypad of the terminal device. The sensor assembly 814 can also detect changes in the position of the terminal device or a component of the terminal device, the presence or absence of user contact with the terminal device, the orientation or acceleration / deceleration of the terminal device, and the temperature change of the terminal device. The sensor assembly 814 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 can also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 can also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0158] The communication component 816 is configured to facilitate communication between the terminal device and other devices in a wired or wireless manner. The terminal device can access a wireless network based on communication standards, such as WiFi, 2G, or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0159] In an exemplary embodiment, the terminal device can be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above method.

[0160] Those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include known common knowledge or conventional technical means in the technical field not disclosed in this disclosure. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of the present invention are pointed out by the following claims.

[0161] It should be understood that the present invention is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is only limited by the appended claims.

Claims

1. An audio module, characterized in that, applied to a terminal device, the audio module at least includes: A first audio component, the outer surface of which has a groove for outputting an audio signal when the audio module is in the speaker mode; the groove is arranged at a position on the outer surface of the first audio component where a magnetic field or an electric field is generated within the first audio component; A second audio component, installed in the groove for outputting the audio signal when the audio module is in the earphone mode; wherein, the power of the audio signal output by the first audio component is greater than the power of the audio signal output by the second audio component.

2. The audio module according to claim 1, characterized in that, the audio module further includes: A third audio component, arranged at an interval from the first audio component, for outputting the same audio signal as the first audio component when the audio module is in the speaker mode.

3. The audio module according to claim 1 or 2, characterized in that, the audio module further includes: An adhesive component, located at the bottom of the groove for fixing the second audio component in the groove.

4. The audio module according to claim 1 or 2, characterized in that, the groove is located on the first surface of the first audio component; A first connection interface and a second connection interface are arranged on the second surface of the first audio component; the second surface is the opposite surface of the first surface; the first connection interface is used for transmitting the audio signal to the first audio component; A first conductive contact is arranged in the groove, and the first conductive contact is electrically connected to the second connection interface; The second audio component includes: A second conductive contact, located on the outer surface of the second audio component in contact with the groove, and when the second audio component is located in the groove, the first conductive contact is in contact with the second conductive contact to form an electrical connection, and the electrical connection is used for transmitting the audio signal provided by the second connection interface to the second audio component.

5. A terminal device, characterized in that, the terminal device includes: A device housing; An audio module, including the audio module according to any one of claims 1 to 4, located within the device housing; A processing module, located within the device housing and connected to the audio module, for providing an audio signal to the audio module when the audio module is in the speaker mode; and providing the audio signal to the audio module when the audio module is in the earphone mode.

6. The terminal device according to claim 5, characterized in that, the second audio component of the audio module includes: a first sound outlet hole, located on the outer surface of the second audio component; the terminal device further includes: A second sound outlet hole, located on the device housing; An audio transmission channel, respectively communicating with the first sound outlet hole and the second sound outlet hole; wherein, the first sound outlet hole is used for outputting the audio signal output by the second audio component to the audio transmission channel, and the second sound outlet hole is used for transmitting the audio signal in the audio transmission channel to the outside of the device housing.

7. The terminal device according to claim 6, It is characterized in that the terminal device further includes: a printed circuit board, located inside the device housing and provided with a first through hole, the first through hole being aligned and communicated with the first sound outlet hole; a middle frame, located inside the device housing and provided with a second through hole, the second through hole being aligned and communicated with the first through hole; a connection channel, respectively communicated with the second through hole and the second sound outlet hole; wherein, the first through hole, the second through hole and the connection channel together constitute the audio transmission channel.

8. The terminal device according to claim 7, It is characterized in that the area of the printed circuit board occupied by the first through hole is smaller than the projected area of the second audio component projected onto the printed circuit board.

9. The terminal device according to claim 7, It is characterized in that the terminal device further includes: a first sealing module, located between the second audio component and the printed circuit board, for sealing the first connection between the first through hole and the first sound outlet hole to prevent the audio signal from being transmitted to the outside of the terminal device from the first connection.

10. The terminal device according to claim 7, It is characterized in that the terminal device further includes: a second sealing module, located between the middle frame and the printed circuit board, for sealing the second connection between the second through hole and the first through hole to prevent the audio signal from being transmitted to the outside of the terminal device from the second connection.

11. The terminal device according to claim 6, It is characterized in that the terminal device further includes: a transmitting module, located between the second audio component and the device housing, for transmitting an infrared signal outward; an infrared hole, both located on the first surface of the device housing with the second sound outlet hole, for transmitting the infrared signal to the outside of the terminal device.

12. The terminal device according to claim 11, It is characterized in that the first surface includes a first side edge and a second side edge arranged opposite to the first side edge; the second sound outlet hole is located on the first side edge; the infrared hole is located between the first side edge and the second side edge.

13. The terminal device according to claim 12, It is characterized in that the terminal device further includes: a third sound outlet hole, located between the first side edge and the second side edge and arranged at an interval from the infrared hole, for outputting the audio signal of the first audio component in the audio module to the outside of the device housing.

14. The terminal device according to claim 11, It is characterized in that the terminal device further includes: a fourth sound outlet hole, located on the second surface of the device housing, for outputting the audio signal of the third audio component in the audio module to the outside of the device housing; wherein, the second surface and the first surface are two relatively arranged surfaces of the device housing.

15. The terminal device according to claim 5, It is characterized in that The processing module is respectively connected to a first connection interface and a second connection interface of a first audio component in the audio module, and is specifically configured to provide an audio signal to the audio module through the first connection interface when the audio module is in the speaker mode; and provide the audio signal to the audio module through the second connection interface when the audio module is in the earpiece mode.

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