Sensor devices, input devices, and electronic devices

Abstract

According to an embodiment of the present disclosure, the sensor device includes: a plurality of capacitive detection electrode parts; a reference electrode layer arranged at a position opposite to each detection electrode part; and a pressing transmission layer, which locally deforms a position on the reference electrode layer opposite to the detection electrode part according to pressure from the outside.

Description

Technical Field

[0001] The present disclosure relates to a sensor device that detects a pressure from a user, and to an input device and an electronic device including the sensor device. Background Art

[0002] In recent years, electronic devices capable of detecting a pressure on the surface of a housing have been proposed. For example, as one of such electronic devices, Patent Document 1 proposes an electronic device in which a film-shaped sensor device is provided on the inner side surface of a housing.

[0003] Citation List

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2016 / 143241 Summary of the invention

[0006] Incidentally, the housing and front panel of an electronic device generally have high rigidity. Therefore, a sensor device with good sensitivity is desired. Therefore, it is desirable to provide a sensor device that can detect a press on the surface of the housing or the front panel with good sensitivity, and to provide an input device and an electronic device including the sensor device.

[0007] According to one embodiment of the present disclosure, a sensor device includes: a plurality of capacitive detection electrode parts; a reference electrode layer arranged at a position opposite to each detection electrode part; and a pressure transmission layer so that a position in the reference electrode layer opposite to each detection electrode part is locally deformed in response to external pressure.

[0008] An input device according to an embodiment of the present disclosure includes: a sensor unit that generates a detection signal in response to a pressure from the outside; and a signal processor that controls the sensor unit and processes the detection signal generated by the sensor unit. The sensor unit includes: a plurality of capacitive detection electrode portions, wherein the plurality of detection electrode portions generate detection signals; a reference electrode layer that is arranged at a position opposite to each detection electrode portion; and a pressure transmission layer that causes a position in the reference electrode layer that is opposite to each detection electrode portion to be locally deformed in response to the pressure.

[0009] An electronic device according to an embodiment of the present disclosure includes: a functional unit having a predetermined function; a sensor unit generating a detection signal in response to external pressure; and a signal processor controlling the sensor unit and controlling the functional unit based on the detection signal generated by the sensor unit. The sensor unit includes: a plurality of capacitive detection electrode portions, wherein the plurality of detection electrode portions generate detection signals; a reference electrode layer arranged at a position opposite to each detection electrode portion; and a pressure transmission layer, causing a position in the reference electrode layer opposite to each detection electrode portion to be locally deformed in response to the pressure.

[0010] In a sensor device, an input device, and an electronic device according to an embodiment of the present disclosure, a pressure transmission layer is provided, which causes a position in the reference electrode layer that is opposite to each detection electrode portion to be locally deformed in response to a pressure from the outside. Therefore, a small displacement caused by the pressure from the outside is transmitted to the reference electrode layer via the pressure transmission layer, thereby causing a position in the reference electrode layer that is opposite to each detection electrode portion to be locally deformed. The local deformation of the reference electrode layer changes the capacitance generated between the reference electrode layer and the detection electrode portion, and the change in capacitance is detected by the detection electrode portion. Therefore, in the present disclosure, a small displacement caused by the pressure from the outside is converted into a local displacement of the reference electrode layer by the pressure transmission layer. Therefore, even in the case where the displacement caused by the pressure from the outside is very small, the displacement can be detected. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a diagram showing a perspective configuration example of an electronic device according to the first embodiment of the present disclosure.

[0012] Figure 2 It is shown along Figure 1 FIG. 2 is a diagram of a cross-sectional configuration example taken along line AA of FIG.

[0013] Figure 3 It is shown Figure 1 A diagram of an example of functional blocks of an electronic device.

[0014] Figure 4 It is shown Figure 2 FIG. 1 is a diagram showing an example of the upper surface structure of a pressure sensitive sensor.

[0015] Figure 5 It shows that when Figure 4 A diagram showing an example of the top surface structure when the bumps and the reference electrode layer are removed from a pressure sensitive sensor.

[0016] Figure 6 It shows that when Figure 5 A diagram showing an example of the top surface structure of a pressure sensitive sensor when the bumps and a portion of the FPC are removed.

[0017] Figure 7 It is shown Figure 2 FIG. 1 is a diagram showing an example of the lower surface structure of a pressure sensitive sensor.

[0018] Figure 8 It is shown Figure 2 The pressure sensor in Figure 4 A diagram showing an example of a cross-sectional structure of a portion corresponding to line AA.

[0019] Fig. 9 It is shown Figure 6 A diagram showing an example of the structure of a detection electrode portion.

[0020] Fig.10 It is shown Figure 6 A diagram showing an example of the structure of a detection electrode portion.

[0021] Fig.11 It is shown Figure 2 FIG. 1 is a diagram showing an example of a state in which a pressure-sensitive sensor is deformed by external pressure.

[0022] Fig.12 It is shown Figure 8 A diagram of an example of the relationship between the displacement of a reference electrode layer and the output in a pressure sensitive sensor.

[0023] Fig.13 It is shown Figure 8 A diagram of an example of the relationship between the displacement of a reference electrode layer in a pressure-sensitive sensor and the slope of an output.

[0024] Fig.14 It is shown Figure 2 The pressure sensor in Figure 4 A diagram of a modified example of a cross-sectional configuration of a portion corresponding to line AA.

[0025] Fig.15 It is shown Figure 2 The pressure sensor in Figure 4 A diagram of a modified example of a cross-sectional configuration of a portion corresponding to line AA.

[0026] Fig.16 It is shown Figure 2 The pressure sensor in Figure 4 A diagram of a modified example of a cross-sectional configuration of a portion corresponding to line AA.

[0027] Fig.17 It is shown Fig.16 A diagram of an example of the relationship between the displacement of a reference electrode layer and the output in a pressure sensitive sensor.

[0028] Fig.18 It is shown Fig.16A diagram of an example of the relationship between the displacement of a reference electrode layer in a pressure-sensitive sensor and the slope of an output.

[0029] Fig.19 is a diagram showing a perspective configuration example of an electronic device according to a second embodiment of the present disclosure.

[0030] Fig. 20 It is shown along Fig.19 FIG. 2 is a diagram of a cross-sectional configuration example taken along line AA of FIG.

[0031] Fig.21 It is shown along Fig.19 FIG. 2 is a diagram showing an example of a cross-sectional configuration taken along line BB of FIG.

[0032] Fig. 22 It is shown Fig.19 A diagram of an example of functional blocks of an electronic device.

[0033] Fig.23 It is shown Fig. 20 and Fig.21 FIG. 1 is a diagram showing an example of the upper surface structure of a pressure sensitive sensor.

[0034] Fig.24 It shows that when Fig.23 A diagram showing an example of the top surface structure when the bumps and the reference electrode layer are removed from a pressure sensitive sensor.

[0035] Fig.25 It shows that when Fig.24 A diagram showing an example of the top surface structure of a pressure sensitive sensor when the bumps and a portion of the FPC are removed.

[0036] Fig.26 It is shown Fig. 20 and Fig.21 FIG. 1 is a diagram showing an example of the lower surface structure of a pressure sensitive sensor.

[0037] Fig. 27 It is shown Fig.21 The pressure sensor in Fig.23 A diagram showing an example of a cross-sectional structure of a portion corresponding to line AA.

[0038] Fig.28 It is shown Fig. 27 A diagram showing an example of the structure of a detection electrode portion.

[0039] Fig.29 It is shown Fig. 20 and Fig.21 FIG. 1 is a diagram showing an example of a state in which a pressure-sensitive sensor is deformed by external pressure.

[0040] Fig.30 It is shown Fig. 20 and Fig.21The pressure sensor in Fig.23 A diagram showing an example of a cross-sectional structure of a portion corresponding to line AA.

[0041] Fig.31 It is shown Fig. 20 and Fig.21 The pressure sensor in Fig.23 A diagram showing an example of a cross-sectional structure of a portion corresponding to line AA.

[0042] Fig.32 It is shown Fig. 20 and Fig.21 The pressure sensor in Fig.23 A diagram showing an example of a cross-sectional structure of a portion corresponding to line AA. DETAILED DESCRIPTION

[0043] Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0044] It is desirable that a pressure-sensitive sensor to be mounted on an electronic device such as a smart phone detects with high sensitivity a minute displacement of an external body when a user presses a housing or a front panel as the external body with, for example, a finger. In addition, in the housing in the above-mentioned electronic device, there is only a small amount of gap (void). Therefore, it is desirable to provide a pressure-sensitive sensor in a small gap in the housing while compensating for the tolerance of each component in the housing in the above-mentioned electronic device. Therefore, the present disclosure proposes a pressure-sensitive sensor that makes it possible to obtain a higher sensitivity while compensating for the tolerance of each component in the housing in the above-mentioned electronic device.

[0045] <1. First Embodiment>

[0046] [structure]

[0047] An electronic device 100 according to a first embodiment of the present disclosure will be described. Figure 1 A perspective configuration example of the electronic device 100 according to the present embodiment is shown. Figure 2 Shown along Figure 1 The electronic device 100 is a smart phone. The electronic device 100 includes a housing 110 as an external body, a frame 130 provided on the housing 110 , and a front panel 120 provided on the frame 130 .

[0048] The housing 110, the frame 130, and the front panel 120 have, for example, a rectangular shape extending in a predetermined direction. For example, two side surfaces (the right side surface 110R and the left side surface 110L) in the horizontal direction of the housing 110 extend in the vertical direction of the housing 110, and two side surfaces in the vertical direction of the housing 110 extend in the horizontal direction of the housing 110. In addition, for example, two side surfaces in the horizontal direction of the frame 130 extend in the vertical direction of the frame 130, and two side surfaces in the vertical direction of the frame 130 extend in the horizontal direction of the frame 130. In addition, for example, two side surfaces in the horizontal direction of the front panel 120 extend in the vertical direction of the front panel 120, and two side surfaces in the vertical direction of the front panel 120 extend in the horizontal direction of the front panel 120. In the front panel 120, the surfaces of the two end portions (the right end portion 120R and the left end portion 120L) in the horizontal direction are shaped to be smoothly connected to the side surfaces (the right side surface 110R and the left side surface 110L) of the housing 110. For example, both ends (right end portion 120R and left end portion 120L) in the horizontal direction of the front panel 120 are bent toward the housing 110 side.

[0049] The housing 110 includes, for example, metal, polymer resin or wood. Examples of metals used for the housing 110 include simple substances such as aluminum, titanium, zinc, nickel, magnesium, copper or iron, and alloys containing two or more of these metals. Specific examples of alloys used for the housing 110 include stainless steel (stainless steel: SUS), aluminum alloys, magnesium alloys and titanium alloys. Examples of polymer resins used for the housing 110 include copolymerized synthetic resins (ABS resins) of acrylonitrile, butadiene and styrene, polycarbonate (PC) resins and PC-ABS alloy resins.

[0050] The front panel 120 includes, for example, a front glass plate 121 constituting a picture display surface of the electronic device 100 and a display panel 122 in contact with the back of the front glass plate 121. The display panel 122 corresponds to a specific example of a "functional unit" of the present disclosure. The front glass plate 121 protects the display panel 122 from impacts from the outside and is composed of, for example, a tempered glass plate. The display panel 122 displays pictures under the control of a controller 152 described later, and includes, for example, an organic EL (electroluminescent) panel or a liquid crystal panel. The display panel 122 is a curved panel in which the middle is flat and the ends in the horizontal direction are curved.

[0051] The electronic device 100 further includes a pressure-sensitive sensor 140, a mounting substrate 150, and a battery 160. The pressure-sensitive sensor 140 corresponds to a specific example of a "sensor device" or a "sensor unit" of the present disclosure. The mounting substrate 150 corresponds to a specific example of a "signal processor" of the present disclosure. A module including the pressure-sensitive sensor 140 and the mounting substrate 150 corresponds to a specific example of an "input device" of the present disclosure. The pressure-sensitive sensor 140, the mounting substrate 150, and the battery 160 are housed in the housing 110, for example, in a space surrounded by the front panel 120 and the housing 110. The pressure-sensitive sensor 140 generates a detection signal Sig in response to a pressure from the outside. The pressure-sensitive sensor 140 is attached to the back surface 120S of the front panel 120 (specifically, the back surface of the display panel 122). The surface of the pressure-sensitive sensor 140 on the opposite side to the surface attached to the front panel 120 faces the gap G1 inside the electronic device 100, and does not contact the mounting substrate 150 or the battery 160. That is, there is a gap G1 between the mounting substrate 150 and the battery 160 and the pressure sensitive sensor 140. That is, the pressure sensitive sensor 140 is only attached to the back surface 120S and is not sandwiched by the front panel 120 and the mounting substrate 150 and the battery 160 in the vertical direction. In addition, the pressure sensitive sensor 140 has a thickness that allows the gap G1 in the electronic device 100 to compensate for the tolerance of each component in the electronic device 100. That is, the thickness of the pressure sensitive sensor 140 does not affect the tolerance of each component in the electronic device 100.

[0052] The battery 160 supplies power to the mounting substrate 150. The battery 160 includes, for example, a secondary battery and a charge-discharge control circuit that controls the charge and discharge of the secondary battery. The mounting substrate 150 is composed of a printed wiring substrate and various chips, modular components, etc. mounted on the printed wiring substrate. For example, Figure 3 As shown in FIG. 1 , a CPU 151, controllers 152 and 153, a camera 154, a wireless communicator 155, an antenna 156, a sound processor 157, a speaker 158, a microphone 159, and the like are mounted on a printed wiring substrate.

[0053] The CPU 151 controls various components in the electronic device 100. The CPU 151 controls, for example, the camera 154, the wireless communicator 155, the sound processor 157, and the battery 160. For example, the CPU 151 also controls picture display to be performed on the display panel 122 via the controller 152. For example, the CPU 151 also controls the pressure-sensitive sensor 140 via the controller 153, and acquires the detection signal Sig generated by the pressure-sensitive sensor 140 via the controller 153. For example, the CPU 151 also controls various components (functional units having predetermined functions) in the electronic device 100 based on the detection signal Sig obtained via the controller 153.

[0054] For example, in the case where it is detected based on the detection signal Sig that a predetermined position of the front panel 120 is strongly pressed, the CPU 151 issues a command to the controller 152 to display an enlarged picture at the position where the front panel 120 is strongly pressed. For example, in the case where it is detected based on the detection signal Sig that the position of the end of the pressed front panel 120 changes in the longitudinal direction of the front panel 120, the CPU 151 outputs a predetermined command based on the change amount and change direction of the pressed position to a predetermined component (a functional unit having a predetermined function) in the electronic device 100.

[0055] The controller 152 controls picture display to be performed on the display panel 122 according to the control of the CPU 151. The controller 153 controls the pressure-sensitive sensor 140 according to the control of the CPU 151, processes the detection signal Sig generated by the pressure-sensitive sensor 140, and outputs the processed detection signal Sig to the CPU 151. The camera 154 includes, for example, a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide semiconductor) image sensor, etc. The camera 154 performs imaging according to the control of the CPU 151 and outputs image data obtained by imaging to the CPU 151.

[0056] For example, the wireless communicator 155 performs wireless communication with a base station of a mobile phone via the antenna 156. The wireless communicator 155 includes, for example, a baseband unit, an RF (radio frequency) front end unit, etc. The sound processor 157 generates a sound signal according to the control of the CPU 151, outputs the generated sound signal to the speaker 158, and outputs the sound signal input from the microphone 159 to the CPU 151. The CPU 151 controls various components (functional units having predetermined functions) in the electronic device 100 based on the sound signal input from the sound processor 157.

[0057] Next, the configuration of the pressure sensitive sensor 140 will be described in detail.

[0058] Figure 4 An upper surface configuration example of the pressure sensitive sensor 140 is shown. Figure 5 An upper surface configuration example when a bump 141 described later and a reference electrode layer 142 described later are removed from the pressure sensitive sensor 140 is shown. Figure 6 An upper surface configuration example when a bump 143 described later and a part of an FPC 144 described later are removed from the pressure sensitive sensor 140 is shown. Figure 7 An example of the lower surface configuration of the pressure sensitive sensor 140 is shown. Figure 8 The pressure sensitive sensor 140 is shown Figure 4 An example of a cross-sectional structure of a portion corresponding to line AA.

[0059] The pressure-sensitive sensor 140 has, for example, a plurality of bumps 141, a reference electrode layer 142, a plurality of bumps 143, an FPC 144, an adhesive layer 146, and a reference electrode layer 147 in order from the front panel 120 side. The FPC 144 is provided with a plurality of capacitive detection electrode portions 145. In the pressure-sensitive sensor 140, the plurality of bumps 141 and the plurality of bumps 143 provided above and below the reference electrode layer 142 serve as a pressure transmission layer 148 that locally deforms the positions of the reference electrode layer 142 that are opposed to the respective detection electrode portions 145 in response to the pressure from the front panel 120.

[0060] Each bump 141 is provided on the opposite side of the reference electrode layer 142 from each bump 143 and at a position opposite to each detection electrode portion 145. Each bump 143 is provided in a layer between the FPC 144 and the reference electrode layer 142 and around a position opposite to each detection electrode portion 145. Each bump 143 forms a gap G2 at a position opposite to each detection electrode portion 145. The height of each bump 143 is lower than the height of each bump 141. Both bumps 141 and 143 are formed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film, for example.

[0061] A plurality of bumps 141 are regularly arranged on the surface of the reference electrode layer 142 on the opposite side to each bump 143 with a predetermined gap therebetween. At a position opposite to both ends (the right end 120R and the left end 120L) of the front panel 120, for example, a plurality of bumps 141 (141a) are arranged in a row in the longitudinal direction of the front panel 120. Each bump 141a has, for example, a rectangular planar structure extending in the longitudinal direction of the front panel 120. At a position inserted between both ends (the right end 120R and the left end 120L) of the front panel 120, for example, a plurality of bumps 141 (141b) are arranged in a matrix in the longitudinal direction and the short side direction of the front panel 120. Each bump 141b has, for example, a square planar structure.

[0062] A plurality of bumps 143 are regularly arranged on the surface of the reference electrode layer 142 on the FPC 144 side with a predetermined gap (gap G2) therebetween. At positions near the two ends (right end 120R and left end 120L) of the front panel 120, for example, a plurality of bumps 143 (143a) are arranged in a row in the longitudinal direction of the front panel 120. At positions interposed between the two ends (right end 120R and left end 120L) of the front panel 120, for example, a plurality of bumps 143 (143b) are arranged in a matrix in the longitudinal direction and the short side direction of the front panel 120. Each bump 141b has a planar configuration of, for example, a square.

[0063] In the region between the two protrusions 143b that are opposed to each other in the longitudinal direction of the front panel 120, a plurality of protrusions 143 (143c) extend, for example, from the left end portion 120L to the right end portion 120R of the front panel 120. Each of the protrusions 143c has, for example, a quadrilateral planar configuration extending in the short-side direction of the front panel 120. In each of a position opposed to the upper end portion of the front panel 120 and a position opposed to the lower end portion of the front panel 120, the protrusion 143 (143d) extends, for example, from the left end portion 120L to the right end portion 120R of the front panel 120. Each of the protrusions 143d has, for example, a quadrilateral planar configuration extending in the short-side direction of the front panel 120.

[0064] The reference electrode layer 142 is provided at a position opposite to a position other than a terminal 144A (described later) in the FPC 144, and has a sheet-like shape. The reference electrode layer 142 has a lower rigidity than that of the FPC 144, and is composed of a metal film or a conductive fiber. Examples of metal films include SUS sheets. Examples of conductive fibers include conductive cloth and conductive woven cloth. The reference electrode layer 142 is a so-called ground electrode, and has a ground potential.

[0065] The reference electrode layer 142 may be composed of, for example, an inorganic conductive layer including an inorganic-based conductive material, an organic conductive layer including an organic-based conductive material, and an inorganic-organic conductive layer including both an inorganic-based conductive material and an organic-based conductive material. The inorganic-based conductive material and the organic-based conductive material may be particles.

[0066] Examples of inorganic-based conductive materials include metals and metal oxides. Here, metals are defined as including metalloids. Examples of metals include metals such as aluminum, copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony or lead, and alloys containing two or more of these metals. Examples of metal oxides include indium tin oxide (ITO), zinc oxide, indium oxide, tin oxide with antimony added, tin oxide with fluorine added, zinc oxide with aluminum added, zinc oxide with gallium added, zinc oxide with silicon added, zinc oxide-tin oxide system, indium oxide-tin oxide system and zinc oxide-indium oxide-magnesium oxide system.

[0067] Examples of organic-based conductive materials include carbon materials and conductive polymers. Examples of carbon materials include carbon black, carbon fibers, fullerenes, graphene, carbon nanotubes, carbon microcoils, and nanocarbons. Examples of conductive polymers include substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and (co)polymers comprising one or two selected from these materials.

[0068] The FPC 144 is a flexible substrate having higher rigidity than the reference electrode layer 142, and supports each detection electrode portion 145. The FPC 144 is composed of a flexible resin substrate. Examples of materials for the resin substrate of the FPC 144 include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), acrylic resin (PMMA), polyimide (PI), triacetyl cellulose (TAC), polyester, polyamide (PA), aramid, polyethylene (PE), polyacrylate, polyether sulfone, polysulfone, polypropylene (PP), diacetyl cellulose, polyvinyl chloride, epoxy resin, urea resin, polyurethane resin, melanin resin, and cycloolefin polymer (COP) or norbornene-based thermoplastic resin.

[0069] In the FPC 144, a plurality of detection electrode portions 145 are regularly arranged with a predetermined gap therebetween. At positions opposite to the two ends (the right end 120R and the left end 120L) of the front panel 120, a plurality of detection electrode portions 145 (145a) are arranged side by side, for example, along the edge in the horizontal direction of the front panel 120. Each detection electrode portion 145a has, for example, a rectangular planar structure extending along the edge in the horizontal direction of the front panel 120. Each detection electrode portion 145a is configured to be able to form capacitive coupling. Each detection electrode portion 145a is, for example, composed of Fig. 9 It is composed of a comb-tooth-shaped first electrode portion 145A and a comb-tooth-shaped second electrode portion 145B that are opposed to each other in a plane parallel to the reference electrode layer 142 as shown in the figure, and detects the capacitance corresponding to the distance from the reference electrode layer 142.

[0070] At a position inserted between the two ends (right end 120R and left end 120L) of the front panel 120, for example, a plurality of detection electrode portions 145 (145b) are arranged in a matrix in the longitudinal direction and the short side direction of the front panel 120. Each detection electrode portion 145b has a planar configuration of, for example, a square. Each detection electrode portion 145b is configured to be able to form capacitive coupling. Each detection electrode portion 145b is composed of, for example, Fig.10 The sensor is composed of a comb-tooth-shaped first electrode portion 145A and a comb-tooth-shaped second electrode portion 145B that are opposed to each other in a plane parallel to the reference electrode layer 142 as shown in the figure, and detects capacitance corresponding to the distance from the reference electrode layer 142. The first electrode portion 145A and the second electrode portion 145B are arranged so that the comb teeth of the first electrode portion 145A and the comb teeth of the second electrode portion 145B are meshed with each other.

[0071] FPC 144 also includes terminal 144A, multiple wirings 149A, multiple wirings 149B and wiring 149C. Terminal 144A is coupled to a connector provided at a printed wiring substrate of mounting substrate 150. One end of each of multiple wirings 149A, multiple wirings 149B and wiring 149C is arranged at terminal 144A. Under the assumption that multiple detection electrode portions 145 arranged side by side in the longitudinal direction of front panel 120 form a single group (first group), multiple wirings 149A are allocated one by one for each first group. Each wiring 149A is coupled to the first electrode portion 145A of detection electrode portion 145. Under the assumption that multiple detection electrode portions 145 arranged side by side in the short side direction of front panel 120 form a single group (second group), multiple wirings 149B are allocated one by one for each second group. Each wiring 149B is coupled to the second electrode portion 145B of detection electrode portion 145. Wiring 149C is coupled to reference electrode layers 142 and 147 .

[0072] The reference electrode layer 147 is attached to the FPC 144 via the adhesive layer 146. The adhesive layer 146 is composed of, for example, a double-sided adhesive sheet in which adhesive layers are provided on both sides of a resin film. The reference electrode layer 147 is provided at a position opposite to a position other than the terminal 144A in the FPC 144, and has a sheet shape. The reference electrode layer 142 is composed of, for example, an electromagnetic shielding film in which a metal film and a resin layer are stacked. As the material of the reference electrode layer 147, the material used for the reference electrode layer 142 can be used. The reference electrode layer 147 is a so-called ground electrode, and has a ground potential.

[0073] As described above, the reference electrode layers 142 and 147 are arranged to sandwich the plurality of detection electrode portions 145. Therefore, the reference electrode layers 142 and 147 each have a function of suppressing external noise (external electric field) from entering each detection electrode portion 145.

[0074] Next, press detection by the pressure sensitive sensor 140 will be described.

[0075] First, the CPU 151 controls the pressure-sensitive sensor 140 via the controller 153. At this time, the controller 153 performs matrix driving on the plurality of detection electrode portions 145 provided in the pressure-sensitive sensor 140 via the plurality of wirings 149A and 149B. The controller 153 acquires the detection signal Sig generated by each detection electrode portion 145 through the matrix driving, and outputs the acquired detection signal Sig to the CPU 151. The CPU 151 performs control corresponding to the pressed position based on the input detection signal Sig of each detection electrode portion 145.

[0076] For example, Fig.11As shown in , it is assumed that the front panel 120 is pressed by the user. At this time, the front panel 120 is slightly bent by the pressure from the user. The bending of the front panel 120 causes one or more bumps 141 of the pressing transmission layer 148 to be recessed, and the recessed one or more bumps 141 recess the reference electrode layer 142. At this time, a plurality of bumps 143 located below the reference electrode layer 142 support the part of the reference electrode layer 142 that is not opposite to each bump 141. Therefore, a part of the reference electrode layer 142 that is opposite to the recessed one or more bumps 141 is locally bent. The local bending of the reference electrode layer 142 narrows the gap G2 between the detection electrode portion 145 and the reference electrode layer 142, thereby allowing the capacitance occurring between the detection electrode portion 145 and the reference electrode layer 142 to change in response to the change (displacement D) of the gap G2. The output V (detection signal Sig) of the pressure-sensitive sensor 140 changes in response to the amount of change in capacitance (displacement D of the gap G2). The output V of the pressure sensitive sensor 140 is, for example, Fig.12 At this time, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 is, for example, Fig.13 The changes are shown by the solid line in .

[0077] Ideally, the output V of the pressure sensitive sensor 140 changes linearly in a predetermined region α of the displacement D, as shown in FIG. Fig.12 In addition, ideally, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 has a constant value at a predetermined region α of the displacement D, as shown in FIG. Fig.13 In the case where the output V of the pressure-sensitive sensor 140 and the slope (ΔV / ΔD) of the output V are set ideally, the operation load is 1 when the displacement D during installation is within the predetermined area α due to the tolerance of the front panel 120 .

[0078] The operation load refers to (the maximum value of the slope (ΔV / ΔD) of the output V) / (the minimum value of the slope (ΔV / ΔD) of the output V). In the above example, the operation load is 30 / 30=1. When the operation load is 1, the pressing force of the front panel 120 required by the user to open the application is constant regardless of the position, and the operation feeling felt by the user is constant regardless of the position. In addition, in this case, the size of the area α becomes the tolerance compensation width of the pressure-sensitive sensor 140, which is larger than the tolerance of the front panel 120.

[0079] In fact, the output V of the pressure sensor 140 is nonlinear, for example, Fig.12 As shown by the solid line in FIG. 1 , the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 has a peak value, as shown in FIG. Fig.13As shown by the solid line in . In this case, when there is a displacement D at the installation at a maximum position of 112 μm (position A) due to the tolerance of the front panel 120, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 at position A is half (e.g., 45 [ / μm]) of the peak value (e.g., 90 [ / μm]). At this time, the operating load is 90 / 45=2, and the tolerance compensation of the pressure-sensitive sensor 140 has the following value: Fig.13 In addition, when there is a position (position B) where the displacement D during installation is 90 μm due to the tolerance of the front panel 120, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 at position B is 1 / 4 (e.g., 22.5 [ / μm]) of the peak value (e.g., 90 [ / μm]). At this time, the operating load is 90 / 22.5 = 4.

[0080] The operating load at a position where the displacement D is 112 μm is twice the operating load at a position where the displacement D is 122 μm. In this case, in order to achieve the same change in the sensor output value, the user will feel that the difference in the operating load is twice. In addition, the operating load at a position where the displacement D is 90 μm is four times the operating load at a position where the displacement D is 122 μm. In this case, in order to achieve the same change in the sensor output value, the user will feel that the difference in the operating load is four times. If the operating loads between the displacements differ too much, the user may feel uncomfortable. Therefore, the ratio (Max / Min) between the maximum value Max of the operating load and the minimum value Min of the operating load is defined. In order to prevent the user from feeling uncomfortable with the operating load, it is preferred that Max / Min is as small as possible, preferably less than 2.5, more preferably less than 2.0, and ideally less than 1.5.

[0081] Note that the minimum value Min of the operating load is a value corresponding to the maximum value among the values ​​of the slope (ΔV / ΔD) of the sensor output value. This is because the operating load is inversely proportional to the value of the slope (ΔV / ΔD) of the output V. The maximum value Max of the operating load is a value corresponding to 1 / 2 of the maximum value among the values ​​of the slope (ΔV / ΔD) of the output V. If the SN ratio is about 10 / μm (SN ratio>about 25 / 2.5μm), the controller 153 can sufficiently distinguish the sensor output from the noise. Therefore, the pressure-sensitive sensor 140 preferably has a sensitivity that allows the controller 153 to detect the sensor output when the position to which the pressure-sensitive sensor 140 is attached (e.g., the front panel 120) is deformed by 2.5μm.

[0082] [Effect]

[0083] Next, effects of the electronic device 100 according to the present embodiment will be described.

[0084] It is conceivable that, with the aid of a pressure-sensitive sensor, the displacement of the front panel of an electronic device is detected by attaching the pressure-sensitive sensor to the back of the front panel of the electronic device. However, the front panel of the electronic device generally has a high rigidity. Therefore, the pressure-sensitive sensor needs to detect a small displacement of the front panel of the electronic device. In addition, the tolerances of various components inside the electronic device and tolerance compensation such as changes in the installation of the pressure-sensitive sensor become a trade-off with the sensor sensitivity, and the sensor sensitivity may become insufficient. In addition, problems such as making the intensity of pressure sensing different at multiple levels or suppressing changes in the set force may arise in actual use, and the performance of the electronic device on which the pressure-sensitive sensor is mounted may deteriorate.

[0085] In the present embodiment, a pressure transmission layer 148 is provided, which causes the position of the reference electrode layer 142 opposite to each detection electrode portion 145 to be locally deformed in response to the pressure from the outside. Therefore, the small displacement caused by the pressure from the outside is transmitted to the reference electrode layer 142 via the pressure transmission layer 148, thereby causing the position of the reference electrode layer 142 opposite to each detection electrode portion 145 to be locally deformed. The local deformation of the reference electrode layer 142 changes the capacitance generated between the reference electrode layer 142 and the detection electrode portion 145, and the change in capacitance is detected by the detection electrode portion 145. Therefore, in the embodiment, the small displacement caused by the pressure from the outside is converted into a local displacement of the reference electrode layer 142 by the pressure transmission layer 148. Therefore, even in the case where the displacement caused by the pressure from the outside is small, the displacement can be detected.

[0086] Furthermore, in the present embodiment, the FPC 144 supporting each detection electrode portion 145 has a higher rigidity than the reference electrode layer 142. In other words, the reference electrode layer 142 is softer than the FPC 144. The reference electrode layer 142 is composed of, for example, a metal film or a conductive fiber. Therefore, a small displacement caused by external pressure is transmitted to the reference electrode layer 142 via the pressure transmission layer 148, thereby locally deforming the position of the reference electrode layer 142 opposite to each detection electrode portion 145. Therefore, even in the case where the displacement caused by external pressure is small, the displacement can be detected.

[0087] Furthermore, in the present embodiment, each detection electrode portion 145 is composed of a comb-tooth-shaped first electrode portion 145A and a comb-tooth-shaped second electrode portion 145B that are opposed to each other on a plane parallel to the reference electrode layer 142, and detects capacitance corresponding to the distance from the reference electrode layer 142. Therefore, for example, compared with a case where the first electrode portion 145A and the second electrode portion 145B are arranged to be opposed to each other in the thickness direction, leakage of the electric field becomes larger, and a change in capacitance corresponding to the distance from the reference electrode layer 142 becomes larger. Therefore, even in the case where displacement caused by pressing from the outside is small, the displacement can be detected.

[0088] In addition, in the present embodiment, a plurality of bumps 141 and a plurality of bumps 143 are provided above and below the reference electrode layer 142. Therefore, compared with the case where a plurality of bumps 143 are provided only below the reference electrode layer 142, displacement caused by external pressure can be transmitted to the reference electrode layer 142. Therefore, even in the case where the displacement caused by external pressure is small, the displacement can be detected.

[0089] Furthermore, in the present embodiment, the height of each bump 143 is lower than the height of each bump 141. Therefore, the local displacement of the reference electrode layer 142 can be effectively detected compared to the case where the height of each bump 143 is higher than the height of each bump 141. Therefore, even in the case where the displacement caused by the external pressure is small, the displacement can be detected.

[0090] In addition, in this embodiment, each bump 141 and each bump 143 are formed of a double-sided adhesive sheet having adhesive layers on both sides of a resin film. Therefore, local displacement of the reference electrode layer 142 can be effectively generated without damaging the reference electrode layer 142.

[0091] In addition, in the present embodiment, the surface of the pressure-sensitive sensor 140 on the side of the pressure transmission layer 148 is attached to the back side of the display panel 122 (the back side 120S of the front panel 120). Therefore, the pressure-sensitive sensor 140 is used as a touch sensor. In addition, the surface of the pressure-sensitive sensor 140 on the opposite side of the pressure transmission layer 148 faces the gap G1 inside the electronic device 100. That is, the pressure-sensitive sensor 140 is only attached to the back side 120S and is not sandwiched by the front panel 120, the mounting substrate 150, and the battery 160 in the vertical direction. Therefore, for the pressure-sensitive sensor 140, only the deformation caused by the tolerance of the front panel 120 needs to be considered, and the deformation caused by the tolerance of the mounting substrate 150 or the battery 160 does not need to be considered. Therefore, the difficulty of designing the pressure-sensitive sensor 140 can be reduced.

[0092] In addition, in the present embodiment, the display panel 122 is a curved panel in which the middle is flat and the ends are curved. In addition, at a position opposite to the curved portion of the display panel 122, a plurality of detection electrode portions 145a are arranged side by side along the edge of the display panel 122. Therefore, for example, in the case where the user changes the position pressed along the edge of the display panel 122, the CPU 151 can output a command based on the amount of change and the direction of change of the pressed position to a predetermined component (a functional unit having a predetermined function) in the electronic device 100.

[0093] <2. Modification example>

[0094] Next, a modified example of the pressure-sensitive sensor 140 according to the above embodiment will be described.

[0095] [Modification Example A]

[0096] Fig.14 A modified example of the cross-sectional configuration of the pressure-sensitive sensor 140 is shown. In the pressure-sensitive sensor 140 according to the above embodiment, each bump 141 may be configured to include, for example, a porous layer 141B. Each bump 141 is a stacked body in which, for example, adhesive layers 141A and 141C are provided on both sides of the porous layer 141B. An example of the porous layer 141B includes a sponge. Even in this case, a small displacement caused by pressing from the outside can be detected as in the above embodiment.

[0097] [Modified Example B]

[0098] Fig.15 A modified example of the cross-sectional configuration of the pressure-sensitive sensor 140 is shown. In the pressure-sensitive sensor 140 according to the above embodiment, a sheet-like elastic layer 149x may be provided instead of the plurality of bumps 141. The elastic layer 149x is provided on the opposite side of the reference electrode layer 142 from the bumps 143, and has a lower rigidity than the FPC 144. The elastic layer 149x may include, for example, a porous layer 149B. The elastic layer 149x is a stacked body in which, for example, adhesion layers 149A and 149C are provided on both sides of the porous layer 149B. Examples of the porous layer 149B include sponges. In this modified example, the height of each bump 143 is lower than the thickness of the elastic layer 149x.

[0099] In the present modified example, when the front panel 120 is slightly bent by pressure from the user, the bending of the front panel 120 causes the elastic layer 149x of the pressure transmission layer 148 to be recessed, and the recessed elastic layer 149x causes the reference electrode layer 142 to be recessed. At this time, the plurality of bumps 143 located below the reference electrode layer 142 are regularly arranged across the gap G2. Therefore, a portion of the reference electrode layer 142 that is opposite to the gap G2 is locally bent. The local bending of the reference electrode layer 142 narrows the gap G2 between the detection electrode portion 145 and the reference electrode layer 142, thereby allowing the capacitance occurring between the detection electrode portion 145 and the reference electrode layer 142 to change in response to a change in the gap G2 (displacement D). The output V (detection signal Sig) of the pressure-sensitive sensor 140 changes in response to the amount of change in capacitance (displacement D of the gap G2). The output V of the pressure-sensitive sensor 140 is, for example, Fig.12 At this time, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 is, for example, Fig.13 Therefore, as in the above embodiment, it is possible to detect a small displacement caused by external pressure.

[0100] In addition, in the present modification example, each bump 143 is formed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film. Therefore, local displacement of the reference electrode layer 142 can be effectively generated without damaging the reference electrode layer 142.

[0101] Furthermore, in the present modification example, the height of each bump 143 is lower than the thickness of the elastic layer 149x. Therefore, compared with the case where the height of each bump 143 is higher than the thickness of the elastic layer 149x, it is possible to effectively detect the local displacement of the reference electrode layer 142. Therefore, even in the case where the displacement caused by the external pressure is minute, the displacement can be detected.

[0102] [Modified Example C]

[0103] Fig.16 1 shows a modified example of the cross-sectional configuration of the pressure-sensitive sensor 140. In the above modified example C, the reference electrode layer 142 may have a bent portion 142A protruding toward the detection electrode portion 145 at a position opposite to each detection electrode portion 145 (i.e., a position opposite to the gap G2). In this case, the gap G2 has been displaced by the protruding amount of the bent portion 142A (e.g., 100 μm). Therefore, for example, Fig.17 and Fig.18As shown in , the output V of the pressure-sensitive sensor 140 and the slope (ΔV / ΔD) of the output V start from a value of the protrusion amount (e.g., 100 μm) of the offset bent portion 142A. As a result, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 140 reaches a peak value by slight pressing, compared with the case where the bent portion 142A is not provided. Therefore, in this modified example, compared with the above embodiment and its modified example, a minute displacement caused by pressing from the outside can be detected with higher accuracy.

[0104] <2. Second Embodiment>

[0105] [structure]

[0106] An electronic device 200 according to a second embodiment of the present disclosure will be described. Fig.19 A perspective configuration example of the electronic device 200 according to the present embodiment is shown. Fig. 20 Shown along Fig.19 The electronic device 200 is a smart phone. The electronic device 200 includes a housing 210 as an external body, a frame 230 provided on the housing 210, and a front panel 220 provided on the frame 230.

[0107] The housing 210, the frame 230 and the front panel 220 have, for example, a rectangular shape extending in a predetermined direction. For example, two side surfaces (side surfaces 210R and 210L) in the horizontal direction of the housing 210 extend in the longitudinal direction of the housing 210, and two side surfaces in the vertical direction of the housing 210 extend in the short side direction of the housing 210. In addition, for example, two side surfaces in the horizontal direction of the frame 230 extend in the longitudinal direction of the frame 230, and two side surfaces in the vertical direction of the frame 230 extend in the short side direction of the frame 230. In addition, for example, two side surfaces in the horizontal direction of the front panel 220 extend in the longitudinal direction of the front panel 220, and two side surfaces in the vertical direction of the front panel 220 extend in the short side direction of the front panel 220. Two end portions (right end portion 220R and left end portion 220L) in the horizontal direction of the front panel 220 are supported by portions (side wall portions) of the housing 210 constituting the side surfaces 210R and 210L.

[0108] The housing 210 includes, for example, metal, polymer resin or wood. Examples of metals used for the housing 210 include simple substances such as aluminum, titanium, zinc, nickel, magnesium, copper or iron, and alloys containing two or more of these metals. Specific examples of alloys used for the housing 210 include stainless steel (SUS), aluminum alloys, magnesium alloys and titanium alloys. Examples of polymer resins used for the housing 210 include copolymerized synthetic resins (ABS resins) of acrylonitrile, butadiene and styrene, polycarbonate (PC) resins and PC-ABS alloy resins.

[0109] The front panel 220 includes, for example, a front glass plate 221 constituting a picture display surface of the electronic device 200 and a display panel 222 in contact with the back of the front glass plate 221. The display panel 222 corresponds to a specific example of a "functional unit" of the present disclosure. The front glass plate 121 protects the display panel 222 from external impacts and is composed of, for example, a tempered glass plate. The display panel 222 displays pictures under the control of a controller 252 described later, and includes, for example, an organic EL panel or a liquid crystal panel. The display panel 222 also includes a touch sensor that, for example, generates a touch signal based on a touch operation of the picture display surface of the electronic device 200. The touch sensor is, for example, a capacitive type.

[0110] The electronic device 200 further includes two pressure-sensitive sensors 240, a mounting substrate 250, and a battery 260. The pressure-sensitive sensor 240 corresponds to a specific example of a "sensor device" of the present disclosure. The mounting substrate 250 corresponds to a specific example of a "signal processor" of the present disclosure. A module including the pressure-sensitive sensor 240 and the mounting substrate 250 corresponds to a specific example of an "input device" of the present disclosure. The two pressure-sensitive sensors 240, the mounting substrate 250, and the battery 260 are housed in the housing 210, for example, in a space surrounded by the front panel 220 and the housing 210. One of the pressure-sensitive sensors 240 is attached to an inner side surface 211R of the housing 210. The inner side surface 211R is an inner surface opposite to the side surface 210R of the side wall of the housing 210. The other pressure-sensitive sensor 240 is attached to an inner side surface 211L of the housing 210. The inner side surface 211L is an inner surface opposite to the side surface 210L of the side wall of the housing 210. In each pressure-sensitive sensor 240, the surface opposite to the side attached to the housing 210 faces the gap G3 inside the electronic device 200, and does not contact the mounting substrate 250 or the battery 260. That is, the gap G3 exists between the mounting substrate 250 and the battery 260 and each pressure-sensitive sensor 240. That is, each pressure-sensitive sensor 240 is attached only to the inner side surfaces 211R and 211L, and is not sandwiched by the front panel 220, the mounting substrate 250, and the battery 260 in the vertical direction. In addition, each pressure-sensitive sensor 240 has a thickness that allows the gap G3 in the electronic device 200 to compensate for the tolerance of each component in the electronic device 200. That is, the thickness of each pressure-sensitive sensor 240 does not affect the tolerance of each component in the electronic device 200.

[0111] The battery 260 supplies power to the mounting substrate 250. The battery 260 includes, for example, a secondary battery and a charge-discharge control circuit that controls the charge and discharge of the secondary battery. The mounting substrate 250 is composed of a printed wiring substrate and various chips, modular components, etc. mounted on the printed wiring substrate. For example, Fig. 22As shown in FIG. 2 , a CPU 251 , controllers 252 and 253 , a camera 254 , a wireless communicator 255 , an antenna 256 , a sound processor 257 , a speaker 258 , a microphone 259 , and the like are mounted on a printed wiring substrate.

[0112] The CPU 251 controls various components in the electronic device 200. The CPU 251 controls, for example, the camera 254, the wireless communicator 255, the sound processor 257, and the battery 260. The CPU 251 also controls, for example, picture display to be performed on the display panel 222 via the controller 252. For example, the CPU 251 also controls each pressure-sensitive sensor 240 via the controller 253, and acquires the detection signal Sig generated by each pressure-sensitive sensor 240 via the controller 253. For example, the CPU 251 also controls various components (functional units having predetermined functions) in the electronic device 200 based on the detection signal Sig obtained via the controller 253.

[0113] For example, when it is detected based on the detection signal Sig that the position of the side 210R or the side 210L of the pressing shell 210 changes in the longitudinal direction of the side 210R or the side 210L, the CPU 251 outputs a predetermined command based on the change amount and change direction of the pressing position to a predetermined component (a functional unit with a predetermined function) in the electronic device 200.

[0114] The controller 252 controls picture display to be performed on the display panel 222 according to the control of the CPU 251. The controller 253 controls the pressure-sensitive sensor 240 according to the control of the CPU 251, processes the detection signal Sig generated by the pressure-sensitive sensor 240, and outputs the processed detection signal Sig to the CPU 251. The camera 254 includes, for example, a CCD image sensor, a CMOS image sensor, etc. The camera 254 performs imaging according to the control of the CPU 251 and outputs image data obtained by imaging to the CPU 251.

[0115] The wireless communicator 255 performs wireless communication with a base station of a mobile phone, for example, via the antenna 256. The wireless communicator 255 includes, for example, a baseband unit, an RF (radio frequency) front end unit, etc. The sound processor 257 generates a sound signal according to the control of the CPU 251, outputs the generated sound signal to the speaker 258, and outputs the sound signal input from the microphone 259 to the CPU 251. The CPU 251 controls various components (functional units having predetermined functions) in the electronic device 200 based on the sound signal input from the sound processor 257.

[0116] Next, the configuration of the pressure sensitive sensor 240 will be described in detail.

[0117] Fig.23An example of the upper surface configuration of the pressure sensitive sensor 240 is shown. Fig.24 An upper surface configuration example when a bump 241 described later and a reference electrode layer 242 described later are removed from the pressure sensitive sensor 240 is shown. Fig.25 An upper surface configuration example when a bump 243 described later and a part of an FPC 244 described later are removed from the pressure sensitive sensor 240 is shown. Fig.26 An example of the lower surface configuration of the pressure sensitive sensor 240 is shown. Fig. 27 The pressure sensitive sensor 240 is shown Fig.23 An example of a cross-sectional structure of a portion corresponding to line AA.

[0118] The pressure-sensitive sensor 240 has, for example, a plurality of bumps 241, a reference electrode layer 242, a plurality of bumps 243, an FPC 244, an adhesive layer 246, and a reference electrode layer 247 in order from the front panel 220 side. The FPC 244 is provided with a plurality of capacitive detection electrode portions 245. In the pressure-sensitive sensor 240, the plurality of bumps 241 and the plurality of bumps 243 provided above and below the reference electrode layer 242 serve as a pressure transmission layer 248 that locally deforms the positions of the reference electrode layer 242 that are opposed to the respective detection electrode portions 245 in response to the pressure from the front panel 220.

[0119] Each bump 241 is provided on the opposite side of the reference electrode layer 242 from each bump 243 and at a position opposite to each detection electrode portion 245. Each bump 243 is provided in a layer between the FPC 244 and the reference electrode layer 242 and around a position opposite to each detection electrode portion 245. Each bump 243 forms a gap G4 at a position opposite to each detection electrode portion 245. The height of each bump 243 is lower than the height of each bump 241. Both the bumps 241 and 243 are formed of a double-sided adhesive sheet in which adhesive layers are provided on both sides of a resin layer, for example.

[0120] The plurality of bumps 241 are regularly arranged at predetermined intervals on the surface of the reference electrode layer 242 on the opposite side to the respective bumps 243. For example, the plurality of bumps 241 are arranged in a row in the longitudinal direction of the side surfaces 210R and 210L. Each bump 241 has, for example, a rectangular planar configuration extending in the longitudinal direction of the side surfaces 210R and 210L.

[0121] A plurality of bumps 243 are regularly arranged with predetermined gaps (gap G4) on the surface of the reference electrode layer 242 on the FPC 244 side. For example, at both ends on the right and left sides of the FPC 244, a plurality of bumps 243 (243a) are arranged in a row in the longitudinal direction of both side surfaces (side surfaces 210R and 210L) in the horizontal direction of the housing 210.

[0122] In the region between the two protrusions 243a opposed to each other in the longitudinal direction of the FPC 244, a plurality of protrusions 243 (243b) extend, for example, from the left end portion to the right end portion of the FPC 244. Each of the protrusions 243b has, for example, a quadrilateral plane configuration extending in the short-side direction of the FPC 244. In each of a position opposed to the upper end portion of the FPC 244 and a position opposed to the lower end portion of the FPC 244, a protrusion 243 (243c) extends, for example, from the left end portion to the right end portion of the FPC 244. Each of the protrusions 243c has, for example, a quadrilateral plane configuration extending in the short-side direction of the FPC 244.

[0123] The reference electrode layer 242 is provided at a position opposite to the position other than the terminal 244A (described later) in the FPC 244, and has a sheet shape. The reference electrode layer 242 has lower rigidity than the FPC 244, and is composed of a metal film or a conductive fiber. Examples of metal films include SUS sheets. Examples of conductive fibers include conductive cloth and conductive woven cloth. The reference electrode layer 242 is a so-called ground electrode, and has a ground potential.

[0124] The reference electrode layer 242 can be composed of, for example, an inorganic conductive layer containing an inorganic conductive material, an organic conductive layer containing an organic conductive material, and an inorganic-organic conductive layer containing an inorganic conductive material and an organic conductive material. The inorganic conductive material and the organic conductive material can be particles. As the inorganic conductive material and the organic conductive material, materials similar to the inorganic conductive material and the organic conductive material used for the reference electrode layer 142 can be used. The FPC 244 has a higher rigidity than the reference electrode layer 242, and supports each detection electrode portion 245. The FPC 244 is composed of a flexible resin substrate. Examples of materials for the resin substrate of the FPC 244 include materials for the FPC 144.

[0125] In the FPC 244, a plurality of detection electrode portions 245 are regularly arranged with predetermined gaps therebetween. The plurality of detection electrode portions 245 are arranged side by side, for example, in the extending direction of the inner side surfaces 211R and 211L of the housing 210. Each detection electrode portion 245 has, for example, a rectangular planar structure extending in the extending direction of the inner side surfaces 211R and 211L of the housing 210. Each detection electrode portion 245 is configured to be able to form capacitive coupling. Each detection electrode portion 245 is, for example, composed of Fig.28 The sensor is composed of a comb-tooth-shaped first electrode portion 245A and a comb-tooth-shaped second electrode portion 245B that are opposed to each other on a plane parallel to the reference electrode layer 242 as shown in the figure, and detects capacitance corresponding to the distance from the reference electrode layer 242.

[0126] FPC 244 also includes terminal 244A, wiring 249A, multiple wirings 249B and wiring 249C. Terminal 244A is coupled to a connector provided at a printed wiring substrate of mounting substrate 250. One end of each of wiring 249A, multiple wirings 249B and wiring 249C is arranged at terminal 244A. Wiring 249A is coupled to each detection electrode portion 245. Wiring 249A is coupled to a first electrode portion 245A of each detection electrode portion 245. Multiple wirings 249B are allocated one by one for each detection electrode portion 245. Each wiring 249B is coupled to a second electrode portion 245B of the detection electrode portion 245. Wiring 249C is coupled to reference electrode layers 242 and 247.

[0127] The reference electrode layer 247 is attached to the FPC 244 via the adhesive layer 246. The adhesive layer 246 is composed of a double-sided adhesive sheet in which adhesive layers are provided on both sides of a resin film, for example. The reference electrode layer 247 is provided at a position opposite to a position other than the terminal 244A in the FPC 244, and has a sheet shape. The reference electrode layer 242 is composed of, for example, an electromagnetic shielding film in which a metal film and a resin layer are stacked. As the material of the reference electrode layer 247, the material used as the reference electrode layer 242 can be used. The reference electrode layer 247 is a so-called ground electrode, and has a ground potential.

[0128] As described above, the reference electrode layers 242 and 247 are arranged to sandwich the plurality of detection electrode portions 245. Therefore, the reference electrode layers 242 and 247 each have a function of suppressing external noise (external electric field) from entering each detection electrode portion 245.

[0129] Next, press detection performed in the pressure sensitive sensor 240 will be described.

[0130] First, the CPU 251 controls the pressure-sensitive sensor 240 via the controller 253. At this time, the controller 253 sequentially drives the plurality of detection electrode portions 245 provided in the pressure-sensitive sensor 240 via the plurality of wirings 249A and 249B. The controller 253 acquires the detection signal Sig generated by each detection electrode portion 245 by sequential driving, and outputs the acquired detection signal Sig to the CPU 251. The CPU 251 performs control corresponding to the pressed position based on the input detection signal Sig of each detection electrode portion 245.

[0131] For example, Fig.29As shown in , it is assumed that the side 210R or the side 210L of the housing 210 is pressed by the user. At this time, the side 210R or the side 210L of the housing 210 is slightly bent by the user's pressing. The bending of the side 210R or the side 210L of the housing 210 causes one or more bumps 241 of the pressing transmission layer 248 to be recessed, and the recessed one or more bumps 241 recess the reference electrode layer 242. At this time, the plurality of bumps 243 located below the reference electrode layer 242 support the portion of the reference electrode layer 242 that is not opposite to each bump 241. Therefore, a portion of the reference electrode layer 242 that is opposite to the recessed one or more bumps 241 is locally bent. The local bending of the reference electrode layer 242 narrows the gap G4 between the detection electrode portion 245 and the reference electrode layer 242, thereby allowing the capacitance occurring between the detection electrode portion 245 and the reference electrode layer 242 to change in response to the change (displacement D) of the gap G4. The output V (detection signal Sig) of the pressure-sensitive sensor 240 changes in response to the amount of change in capacitance (displacement D of the gap G4). The output V of the pressure-sensitive sensor 240 is, for example, Fig.12 At this time, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 is, for example, Fig.13 The changes are shown by the solid line in .

[0132] Ideally, the output V of the pressure sensitive sensor 240 changes linearly in a predetermined region α of the displacement D, as shown in FIG. Fig.12 In addition, ideally, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 has a constant value at a predetermined region α of the displacement D, as shown in FIG. Fig.13 As shown by the dotted line in . When the output V of the pressure-sensitive sensor 240 and the slope of the output V (ΔV / ΔD) are ideally set, when the displacement D during installation is within the predetermined range α due to the tolerance of the side 210R or the side 210L of the shell 210, the operating load is 1. When the operating load is 1, the pressing force of the side 210R or the side 210L of the shell 210 required for the user to open the application is constant regardless of the position, and the operating feeling felt by the user is constant regardless of the position. In addition, in this case, the size of the area α becomes the tolerance compensation width of the pressure-sensitive sensor 240, which is larger than the tolerance of the side 210R or the side 210L of the shell 210.

[0133] In fact, the output V of the pressure sensor 240 is nonlinear, for example, Fig.12 As shown by the solid line in FIG. 1 , the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 has a peak value, as shown in FIG. Fig.13As shown by the solid line in . In this case, when there is a position (position A) where the displacement D during installation is at most 112 μm due to the tolerance of the side 210R or the side 210L of the housing 210, the value of the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 at position A is half (e.g., 45[ / μm]) of the peak value (e.g., 90[ / [μm]). At this time, the operating load is 90 / 45=2. In addition, when there is a position (position B) where the displacement D during installation is 90 μm due to the tolerance of the housing 210, the value of the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 at position B is 1 / 4 (e.g., 22.5[ / μm]) of the peak value (e.g., 90[ / μm]). At this time, the operating load is 90 / 22.5=4.

[0134] The operating load at a position where the displacement D is 112 μm is twice the operating load at a position where the displacement D is 122 μm. In this case, in order to achieve the same change in the sensor output value, the user will feel that the difference in the operating load is twice. In addition, the operating load at a position where the displacement D is 90 μm is four times the operating load at a position where the displacement D is 122 μm. In this case, in order to achieve the same change in the sensor output value, the user will feel that the difference in the operating load is four times. If the operating loads between the displacements differ too much, the user may feel uncomfortable. Therefore, the ratio (Max / Min) between the maximum value Max of the operating load and the minimum value Min of the operating load is defined. In order to prevent the user from feeling uncomfortable with the operating load, it is preferred that Max / Min is as small as possible, preferably less than 2.5, more preferably less than 2.0, and ideally less than 1.5.

[0135] Note that the minimum value Min of the operating load is a value corresponding to the maximum value among the values ​​of the slope (ΔV / ΔD) of the sensor output value. This is because the operating load is inversely proportional to the value of the slope (ΔV / ΔD) of the output V. The maximum value Max of the operating load is a value corresponding to 1 / 2 of the maximum value among the values ​​of the slope (ΔV / ΔD) of the output V. If the SN ratio is approximately 10 / μm (SN ratio > approximately 25 / 2.5μm), the controller 253 can sufficiently distinguish the sensor output from the noise. Therefore, the pressure-sensitive sensor 240 preferably has a sensitivity that allows the controller 253 to detect the sensor output when the position to which the pressure-sensitive sensor 240 is attached (e.g., the housing 210) is deformed by 2.5μm.

[0136] [Effect]

[0137] Next, effects of the electronic device 200 according to the present embodiment will be described.

[0138] It is conceivable that by attaching a pressure-sensitive sensor to the back of the housing of an electronic device, the displacement of the housing of the electronic device can be detected by means of the pressure-sensitive sensor. However, the housing of the electronic device generally has a high rigidity. Therefore, the pressure-sensitive sensor needs to detect a small displacement of the housing of the electronic device.

[0139] In the present embodiment, a pressure transmission layer 248 is provided, which causes the position of the reference electrode layer 242 opposite to each detection electrode portion 245 to be locally deformed in response to the pressure from the outside. Therefore, the small displacement caused by the pressure from the outside is transmitted to the reference electrode layer 242 via the pressure transmission layer 248, thereby causing the position of the reference electrode layer 242 opposite to each detection electrode portion 245 to be locally deformed. The local deformation of the reference electrode layer 242 changes the capacitance generated between the reference electrode layer 242 and the detection electrode portion 245, and the change in capacitance is detected by the detection electrode portion 245. Therefore, in the present embodiment, the small displacement caused by the pressure from the outside is converted into a local displacement of the reference electrode layer 242 by the pressure transmission layer 248. Therefore, even in the case where the displacement caused by the pressure from the outside is small, the displacement can be detected.

[0140] Furthermore, in the present embodiment, the FPC 244 supporting each detection electrode portion 245 has a higher rigidity than the reference electrode layer 242. In other words, the reference electrode layer 242 is softer than the FPC 244. The reference electrode layer 242 is composed of, for example, a metal film or a conductive fiber. Therefore, a small displacement caused by external pressure is transmitted to the reference electrode layer 242 via the pressure transmission layer 248, thereby locally deforming the position of the reference electrode layer 242 opposite to each detection electrode portion 245. Therefore, even in the case where the displacement caused by external pressure is small, the displacement can be detected.

[0141] Furthermore, in the present embodiment, each detection electrode portion 245 is composed of a comb-tooth-shaped first electrode portion 245A and a comb-tooth-shaped second electrode portion 245B that are opposed to each other in a plane parallel to the reference electrode layer 242, and detects capacitance corresponding to the distance from the reference electrode layer 242. Therefore, for example, compared with the case where the first electrode portion 245A and the second electrode portion 245B are arranged to be opposed to each other in the thickness direction, leakage of the electric field becomes larger, and a change in capacitance corresponding to the distance from the reference electrode layer 242 becomes larger. Therefore, even in the case where displacement caused by pressing from the outside is small, the displacement can be detected.

[0142] In addition, in the present embodiment, a plurality of bumps 241 and a plurality of bumps 243 are provided above and below the reference electrode layer 242. Therefore, compared with the case where a plurality of bumps 243 are provided only below the reference electrode layer 242, displacement caused by external pressure can be transmitted to the reference electrode layer 242. Therefore, even in the case where the displacement caused by external pressure is small, the displacement can be detected.

[0143] Furthermore, in the present embodiment, the height of each bump 243 is lower than the height of each bump 241. Therefore, it is possible to effectively detect the local displacement of the reference electrode layer 242, compared with the case where the height of each bump 243 is higher than the height of each bump 241. Therefore, even in the case where the displacement caused by external pressure is small, the displacement can be detected.

[0144] In addition, in this embodiment, each bump 241 and each bump 243 are formed by a double-sided adhesive sheet having adhesive layers on both sides of a resin film. Therefore, local displacement of the reference electrode layer 242 can be effectively generated without damaging the reference electrode layer 242.

[0145] Furthermore, in the present embodiment, the surface of the pressure-sensitive sensor 240 on the side of the pressure transmission layer 148 is attached to the inner side surface 211R or 211L of the housing 210. Furthermore, the surface of the pressure-sensitive sensor 140 on the opposite side to the pressure transmission layer 148 faces the gap G3 inside the electronic device 100. That is, the pressure-sensitive sensor 140 is only attached to the inner side surface 211R or 211L of the housing 210 and is not sandwiched by the housing 210 and the frame 230. Therefore, for the pressure-sensitive sensor 240, only the deformation caused by the tolerance of the inner side surfaces 211R and 211L of the housing 210 needs to be considered, and the deformation caused by the tolerance of the frame 230 does not need to be considered. Therefore, the difficulty of designing the pressure-sensitive sensor 240 can be reduced.

[0146] Furthermore, in the present embodiment, the plurality of detection electrode portions 245 are arranged side by side in the extending direction of the inner side surfaces 211R and 211L of the housing 210. Therefore, for example, in the case where the user changes the position pressed along the inner side surface 211R or 211L of the housing 210, the CPU 251 can output a command based on the amount of change and the direction of change of the pressed position to a predetermined component (a functional unit having a predetermined function) in the electronic device 100.

[0147] <4. Modification Example>

[0148] Next, a modified example of the pressure-sensitive sensor 240 according to the above second embodiment will be described.

[0149] [Modification Example D]

[0150] Fig.30 A modified example of the cross-sectional configuration of the pressure-sensitive sensor 240 is shown. In the pressure-sensitive sensor 240 according to the second embodiment above, each bump 241 may include, for example, a porous layer 241B. Each bump 241 is, for example, a stacked body in which adhesive layers 241A and 241C are provided on both sides of the porous layer 241B. An example of the porous layer 241B includes a sponge. Even in this case, a small displacement caused by pressing from the outside can be detected as in the above embodiment.

[0151] [Modification Example E]

[0152] Fig.31 A modified example of the cross-sectional configuration of the pressure-sensitive sensor 240 is shown. In the pressure-sensitive sensor 240 according to the above embodiment, a sheet-like elastic layer 249 may be provided instead of the plurality of bumps 241. The elastic layer 249 is provided on the opposite side of the reference electrode layer 242 from the bumps 243, and has a lower rigidity than the FPC 244. The elastic layer 249 may include, for example, a porous layer 249B. The elastic layer 249 is, for example, a stacked body in which adhesion layers 249A and 249C are provided on both sides of the porous layer 249B. Examples of the porous layer 249B include sponges. In this modified example, the height of each bump 243 is lower than the thickness of the elastic layer 249.

[0153] In the present modified example, when the front panel 220 is slightly bent by the user's pressure, the bending of the front panel 220 causes the elastic layer 249 of the pressure transmission layer 248 to be recessed, and the recessed elastic layer 249 causes the reference electrode layer 242 to be recessed. At this time, the plurality of bumps 243 located below the reference electrode layer 242 are regularly arranged across the gap G4. Therefore, a portion of the reference electrode layer 242 that is opposite to the gap G4 is locally bent. The local bending of the reference electrode layer 242 narrows the gap G4 between the detection electrode portion 245 and the reference electrode layer 242, thereby allowing the capacitance occurring between the detection electrode portion 245 and the reference electrode layer 242 to change in response to the change in the gap G4 (displacement D). The output V (detection signal Sig) of the pressure-sensitive sensor 240 changes in response to the amount of change in capacitance (displacement D of the gap G4). The output V of the pressure-sensitive sensor 240 is, for example, Fig.12 At this time, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 is, for example, Fig.13 Therefore, as in the above embodiment, it is possible to detect a small displacement caused by external pressure.

[0154] In addition, in this modification example, each bump 243 is formed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film. Therefore, local displacement of the reference electrode layer 242 can be effectively generated without damaging the reference electrode layer 242.

[0155] Furthermore, in the present modification example, the height of each bump 243 is lower than the thickness of the elastic layer 249. Therefore, it is possible to effectively detect the local displacement of the reference electrode layer 242, compared with the case where the height of each bump 243 is higher than the thickness of the elastic layer 249. Therefore, even in the case where the displacement caused by the pressing from the outside is minute, the displacement can be detected.

[0156] [Modified Example F]

[0157] Fig.32 FIG. 2 shows a modified example of the cross-sectional configuration of the pressure-sensitive sensor 240. In the above modified example F, the reference electrode layer 242 may have a curved portion 242A protruding toward the detection electrode portion 245 at a position opposite to each detection electrode portion 245 (i.e., a position opposite to the gap G4). In this case, the gap G4 has been displaced by the protruding amount of the curved portion 242A (e.g., 100 μm). Therefore, for example, Fig.17 and Fig.18 As shown in , the output V of the pressure-sensitive sensor 240 and the slope (ΔV / ΔD) of the output V start from a value of the protrusion amount (e.g., 100 μm) of the offset bent portion 242A. As a result, the slope (ΔV / ΔD) of the output V of the pressure-sensitive sensor 240 reaches a peak value by slight pressing, compared to the case where the bent portion 242A is not provided. Therefore, in this modified example, compared with the above embodiment and its modified example, a minute displacement caused by pressing from the outside can be detected with higher accuracy.

[0158] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above embodiments, and various modifications may be made. It should be noted that the effects described in this specification are merely examples. The effects of the present disclosure are not limited to the effects described in this specification. The present disclosure may have effects other than those described in this specification.

[0159] For example, the present disclosure can also be configured as follows.

[0160] (1) A sensor device comprising:

[0161] A plurality of capacitive detection electrode portions;

[0162] a reference electrode layer disposed at a position opposing each detection electrode portion; and

[0163] The transmission layer is pressed, so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to the external pressure.

[0164] (2) The sensor device according to (1), further including a flexible substrate having higher rigidity than the reference electrode layer and supporting each detection electrode portion.

[0165] (3) The sensor device according to (1) or (2), wherein the reference electrode layer is formed of a metal thin film or a conductive fiber.

[0166] (4) A sensor device according to any one of (1) to (3), wherein each of the detection electrode portions is composed of a comb-tooth-shaped first electrode portion and a comb-tooth-shaped second electrode portion opposite to each other in a plane parallel to the reference electrode layer, and detects a capacitance corresponding to the distance from the reference electrode layer.

[0167] (5) The sensor device according to any one of (1) to (4), wherein the pressure transmission layer includes:

[0168] a first bump disposed in a layer between the flexible substrate and the reference electrode layer and disposed around a position opposed to each detection electrode portion, the first bump forming a gap at a position opposed to each detection electrode portion; and

[0169] The second bump is provided at a position on the opposite side of the reference electrode layer from the first bump and facing each detection electrode portion.

[0170] (6) The sensor device according to (5), wherein a height of the second bump is lower than a height of the first bump.

[0171] (7) The sensor device according to (5) or (6), wherein the first bump and the second bump are each formed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film.

[0172] (8) The sensor device according to (5) or (6), wherein

[0173] The first bump is formed of a double-sided adhesive sheet having adhesive layers on both sides of a resin film, and

[0174] The second bump includes a porous layer.

[0175] (9) The sensor device according to (2), wherein the pressure transmission layer includes:

[0176] a bump provided in a layer between the flexible substrate and the reference electrode layer and provided around a position opposed to each detection electrode portion, the bump forming a gap at a position opposed to each detection electrode portion; and

[0177] The elastic layer is provided on the side of the reference electrode layer opposite to the bump and has a lower rigidity than the flexible substrate.

[0178] (10) The sensor device according to (9), wherein

[0179] The bump is composed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film, and

[0180] The elastic layer includes a porous layer.

[0181] (11) The sensor device according to (9) or (10), wherein a height of the bump is lower than a thickness of the elastic layer.

[0182] (12) The sensor device according to any one of (9) to (11), wherein the reference electrode layer has a bent portion protruding toward one side of the detection electrode portion at a position facing each detection electrode portion.

[0183] (13) An input device comprising:

[0184] a sensor unit that generates a detection signal in response to a press from the outside; and

[0185] a signal processor, controlling the sensor unit and processing the detection signal generated by the sensor unit, wherein

[0186] The sensor unit includes

[0187] a plurality of capacitive detection electrode portions, wherein the plurality of detection electrode portions generate the detection signal;

[0188] a reference electrode layer disposed at a position opposite to each detection electrode portion, and

[0189] The transmission layer is pressed, so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to the pressing.

[0190] (14) An electronic device comprising:

[0191] A functional unit having a predetermined function;

[0192] a sensor unit that generates a detection signal in response to a press from the outside; and

[0193] a signal processor that controls the sensor unit and controls the functional unit based on the detection signal generated by the sensor unit, wherein

[0194] The sensor unit includes

[0195] a plurality of capacitive detection electrode portions, wherein the plurality of detection electrode portions generate the detection signal;

[0196] a reference electrode layer disposed at a position opposite to each detection electrode portion, and

[0197] The transmission layer is pressed, so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to the pressing.

[0198] (15) The electronic device according to (14), wherein

[0199] The functional unit is a display panel, and

[0200] In the sensor unit, a surface on the pressure transmission layer side is attached to a back surface of the functional unit, and a surface of the sensor unit opposite to the pressure transmission layer faces a gap inside the electronic device.

[0201] (16) The electronic device according to (15), wherein

[0202] The display panel is a curved panel in which the middle is flat and the ends are curved, and

[0203] The plurality of detection electrode portions are arranged side by side along an edge of the display panel at a position opposing a curved portion of the display panel.

[0204] (17) The electronic device according to (14), further comprising a housing that accommodates the functional unit, the sensor unit, and the signal processor, wherein

[0205] In the sensor unit, a surface on the pressure transmission layer side is attached to an inner side surface of the housing, and a surface of the sensor unit opposite to the pressure transmission layer faces a gap inside the electronic device.

[0206] (18) The electronic device according to (17), wherein the plurality of detection electrode portions are arranged side by side in an extending direction of the inner side surface.

[0207] In a sensor device, an input device, and an electronic device according to an embodiment of the present disclosure, a small displacement caused by a pressure from the outside is converted into a local displacement of a reference electrode layer by a pressure transmission layer. Therefore, even in the case where the displacement caused by the pressure from the outside is small, the displacement can be detected. Therefore, a pressure on the surface of the housing or the front panel can be detected with good sensitivity. Note that the effects of the present disclosure are not necessarily limited to the effects described here, and any effect described in this specification can be achieved.

[0208] This application claims the benefit of Japanese Priority Patent Application JP2019-003526 filed in the Japan Patent Office on January 11, 2019, the entire contents of which are hereby incorporated by reference.

[0209] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.

Claims

1. A sensor device, comprising: A plurality of detection electrode portions of a capacitive type; A reference electrode layer is arranged at a position opposite to each detection electrode portion; pressing the transmission layer so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to external pressure; as well as a flexible substrate having higher rigidity than the reference electrode layer and supporting the plurality of detection electrode portions, Wherein, the pressing transmission layer comprises: a bump provided in a layer between the flexible substrate and the reference electrode layer and provided around a position opposed to each detection electrode portion, the bump forming a gap at a position opposed to each detection electrode portion; and an elastic layer disposed on the side of the reference electrode layer opposite to the bump and having lower rigidity than the flexible substrate, The reference electrode layer has a bent portion protruding toward one side of the detection electrode portion at a position opposite to each detection electrode portion.

2. The sensor device according to claim 1, wherein: The reference electrode layer is composed of a metal film or conductive fibers.

3. The sensor device according to claim 1, wherein: Each of the detection electrode portions is composed of a comb-teeth-shaped first electrode portion and a comb-teeth-shaped second electrode portion that are opposed to each other in a plane parallel to the reference electrode layer, and detects a capacitance corresponding to a distance from the reference electrode layer.

4. The sensor device according to claim 1, wherein: The compression transmission layer comprises: a first bump disposed in a layer between the flexible substrate and the reference electrode layer and disposed around a position opposed to each detection electrode portion, the first bump forming a gap at a position opposed to each detection electrode portion; and The second bump is provided at a position on the opposite side of the reference electrode layer from the first bump and facing each detection electrode portion.

5. The sensor device according to claim 4, wherein: The height of the second bump is lower than that of the first bump.

6. The sensor device according to claim 5, wherein: The first bump and the second bump are both formed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film.

7. The sensor device according to claim 5, wherein The first bump is formed of a double-sided adhesive sheet having adhesive layers on both sides of a resin film, and The second bump includes a porous layer.

8. The sensor device according to claim 1, wherein The bump is composed of a double-sided adhesive sheet having adhesive layers provided on both sides of a resin film, and The elastic layer includes a porous layer.

9. The sensor device according to claim 8, wherein: The height of the protrusion is smaller than the thickness of the elastic layer.

10. An input device, comprising: a sensor unit that generates a detection signal in response to a pressure from the outside; and a signal processor, controlling the sensor unit and processing the detection signal generated by the sensor unit, wherein The sensor unit includes a plurality of capacitive detection electrode portions, the plurality of detection electrode portions generating the detection signal, The reference electrode layer is arranged at a position opposite to each detection electrode portion. pressing the transmission layer so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to the pressing; and a flexible substrate having higher rigidity than the reference electrode layer and supporting the plurality of detection electrode portions, Wherein, the pressing transmission layer comprises: a bump provided in a layer between the flexible substrate and the reference electrode layer and provided around a position opposed to each detection electrode portion, the bump forming a gap at a position opposed to each detection electrode portion; and an elastic layer disposed on the side of the reference electrode layer opposite to the bump and having lower rigidity than the flexible substrate, The reference electrode layer has a bent portion protruding toward one side of the detection electrode portion at a position opposite to each detection electrode portion.

11. An electronic device, comprising: A functional unit having a predetermined function; a sensor unit that generates a detection signal in response to a pressure from the outside; and a signal processor that controls the sensor unit and controls the functional unit based on the detection signal generated by the sensor unit, wherein The sensor unit includes a plurality of capacitive detection electrode portions, the plurality of detection electrode portions generating the detection signal, The reference electrode layer is arranged at a position opposite to each detection electrode portion. pressing the transmission layer so that the position of the reference electrode layer facing each detection electrode portion is locally deformed in response to the pressing; and a flexible substrate having higher rigidity than the reference electrode layer and supporting the plurality of detection electrode portions, Wherein, the pressing transmission layer comprises: a bump provided in a layer between the flexible substrate and the reference electrode layer and provided around a position opposed to each detection electrode portion, the bump forming a gap at a position opposed to each detection electrode portion; and an elastic layer disposed on the side of the reference electrode layer opposite to the bump and having lower rigidity than the flexible substrate, The reference electrode layer has a bent portion protruding toward one side of the detection electrode portion at a position opposite to each detection electrode portion.

12. The electronic device according to claim 11, wherein The functional unit is a display panel, and In the sensor unit, a surface on the pressure transmission layer side is attached to a back surface of the functional unit, and a surface of the sensor unit opposite to the pressure transmission layer faces a gap inside the electronic device.

13. The electronic device according to claim 12, wherein The display panel is a curved panel in which the middle is flat and the ends are curved, and The plurality of detection electrode portions are arranged side by side along an edge of the display panel at a position opposing a curved portion of the display panel.

14. The electronic device according to claim 11, further comprising a housing, the housing accommodating the functional unit, the sensor unit and the signal processor, wherein In the sensor unit, a surface on the pressure transmission layer side is attached to an inner side surface of the housing, and a surface of the sensor unit opposite to the pressure transmission layer faces a gap inside the electronic device.

15. The electronic device according to claim 14, wherein: The plurality of detection electrode portions are arranged side by side in the extending direction of the inner side surface.

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