Slurry dispensing platform and complete machine for round tube wire bonding process

Abstract

The present invention provides a dispensing platform and a complete machine for the round tube wire bonding process. The dispensing platform includes a sensor clamping module and a moving assembly. The sensor clamping module is arranged on the moving assembly and is used to move the sensor clamping module to a specified position. The sensor clamping module includes a module base, a semicircular clamping movable mold, a semicircular clamping fixed mold and a slide rail. The slide rail is arranged on the module base, and the semicircular clamping movable mold is slidably arranged on the slide rail. The semicircular clamping movable mold slides along the slide rail and is assembled with the semicircular clamping fixed mold to form a ceramic tube clamping groove for clamping semiconductor ceramic tubes. The complete machine includes an automatic dispensing device, an automatic wire feeding device and an automatic wire cutting device. The dispensing platform and the complete machine of the present invention can realize the automation of the dispensing, wire cutting and wire bonding processes of ceramic tubes during the production process of semiconductor ceramic sensors.

Description

Technical Field

[0001] The invention belongs to the field of sensor manufacturing, and in particular relates to a slurry dot platform and a complete machine for a round tube wire bonding process. Background Art

[0002] The wire is the core component of the semiconductor ceramic tube and plays a role in the conduction of the sensor.

[0003] In the production of semiconductor ceramic tubes, slurry application, wire cutting, and wire bonding are the most critical steps. Due to the unique nature of the process, this process is always produced entirely by hand: Slurry application (conductive slurry) is done with a fine brush and applied; wire cutting manually determines wire length and uses scissors to cut multiple wires simultaneously; and the wire bonding process involves a second manual slurry application.

[0004] However, the fully manual mode has drawbacks such as complex operation, low efficiency, and high operator skill requirements. Furthermore, manual wire cutting can result in uneven precious metal wire lengths, resulting in a low pass rate and waste of precious metal materials. Manual slurry application can also result in inconsistent slurry dot sizes, leading to poor sensor consistency and compromising overall performance.

[0005] In order to solve the above problems, people have been seeking a more ideal technical solution. Summary of the Invention

[0006] The purpose of the present invention is to provide a slurry dot platform and a complete machine for a round tube wire bonding process in view of the deficiencies in the prior art.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is:

[0008] The first aspect of the present invention provides a slurry dosing platform for a round tube wire bonding process, comprising a sensor clamping module and a movable assembly; the sensor clamping module is arranged on the movable assembly, and is used to move the sensor clamping module to a specified position; the sensor clamping module comprises a module base, a semicircular clamping movable mold, a semicircular clamping fixed mold and a slide rail; the slide rail is arranged on the module base, and the semicircular clamping movable mold is slidably arranged on the slide rail, and the semicircular clamping movable mold slides along the slide rail and is assembled with the semicircular clamping fixed mold to form a ceramic tube clamping groove for clamping a semiconductor ceramic tube; the ceramic tube clamping groove is designed to reserve a certain slurry dosing height position when clamping the semiconductor ceramic tube.

[0009] Based on the above, the sensor clamping module also includes a clamping adjustment component; the clamping adjustment component includes a clamping spring and an adjustable tightening wheel; the clamping spring and the adjustable tightening wheel are arranged on the module base through a support plate, and the support plate is arranged on one side of the semicircular clamping movable mold, and the force of the clamping spring is parallel to the sliding direction of the semicircular clamping movable mold on the slide rail; when the adjustable tightening wheel is rotated, the semicircular clamping movable mold approaches or moves away from the semicircular clamping fixed mold under the action of the clamping spring force, so as to adjust the clamping force between the ceramic tube clamping groove and the semiconductor ceramic tube.

[0010] Based on the above, a ceramic tube positioning block is provided at one end of the ceramic tube clamping groove close to the slurry point position.

[0011] The second aspect of the present invention provides a complete machine for a round tube wire bonding process, comprising:

[0012] The automatic slurry dotting device includes a slurry dotting platform for clamping and moving the ceramic tube and an automatic slurry dotting mechanism for automatically dispensing slurry; the slurry dotting platform adopts the slurry dotting platform used for the round tube wire bonding process; the slurry dotting direction of the automatic slurry dotting mechanism is arranged above the position on the slurry dotting platform where the ceramic tube needs to be dotted;

[0013] The automatic wire feeding device includes a wire clamping assembly, a wire feeding drive assembly for controlling the wire clamping assembly to clamp or release the wire, and a moving assembly for driving the wire clamping assembly and the wire feeding drive assembly to move the wire to the position where the ceramic tube needs to be slurried;

[0014] The automatic wire cutting device is arranged between the slurry dispensing platform and the automatic wire feeding device, and includes a wire cutting component and a wire cutting drive component connected to the wire cutting component and used to drive the wire cutting component to cut the wire.

[0015] Based on the above, it also includes a visual positioning device, which is used to take pictures of the positions of the ceramic tubes on the dispensing platform where dispensing is required to be performed for position image recognition.

[0016] Based on the above, it also includes a quality inspection device for checking the pulping results each time the machine is shut down and restarted. If the pulping results do not meet the requirements, the feedback is sent to the automatic pulping device to adjust the automatic pulping mechanism; if the pulping results meet the requirements, normal production begins.

[0017] Based on the above, the automatic wire feeding device includes a first wire feeding mechanism and a second wire feeding mechanism. The wire output position of the first wire feeding mechanism, the wire output position of the second wire feeding mechanism, the first designated position and the second designated position are in the same horizontal plane. The first wire feeding mechanism is used to transport the wire from the initial position to the first designated position, and the second wire feeding mechanism transports the wire from the first designated position to the second designated position. The second designated position is the position where the ceramic tube needs to be slurried.

[0018] Based on the above, the automatic wire cutting device further includes an adjustable connecting assembly for driving the wire cutting assembly to move forward and backward in the horizontal direction or move up and down in the vertical direction.

[0019] Based on the above, the automatic slurry dispensing mechanism includes a slurry dispensing component and a displacement component; the slurry dispensing component includes a storage section for storing conductive slurry and a slurry dispensing needle, and the storage section and the slurry dispensing needle are connected; the slurry dispensing component is arranged on the displacement component to drive the slurry outlet of the slurry dispensing needle of the slurry dispensing component away from or move to the position where the ceramic tube needs to be slurried.

[0020] Based on the above, the whole machine further includes an operation display device, which includes a touch screen and operation buttons for inputting and displaying operation parameters.

[0021] Compared with the existing technology, the present invention has outstanding substantial features and significant progress. Specifically, the slurry dispensing platform and the complete machine of the present invention can realize the automation of the slurry dispensing, wire cutting and wire gluing processes of ceramic tubes in the production process of semiconductor ceramic sensors, which not only greatly improves production efficiency and reduces production costs, but also the ceramic tubes after wire gluing have excellent consistency and high pass rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the pulping platform of the present invention.

[0023] Figure 2 It is a schematic diagram of the exploded structure of the sensor clamping module of the present invention.

[0024] Figure 3 It is a structural schematic diagram of the sensor clamping module of the present invention.

[0025] Figure 4 It is a structural schematic diagram of the whole machine of the present invention.

[0026] Figure 5 It is a flowchart of the working process of the whole machine of the present invention.

[0027] Figure 6 It is a structural schematic diagram of the automatic wire feeding device of the present invention.

[0028] Figure 7It is a structural schematic diagram of the two-stage automatic wire feeding device of the present invention.

[0029] Figure 8 It is a structural schematic diagram of the automatic pulping mechanism of the present invention.

[0030] Figure 9 It is a side structural schematic diagram of the automatic wire cutting device of the present invention.

[0031] Figure 10 It is another side structural schematic diagram of the automatic wire cutting device of the present invention.

[0032] Figure 11 It is a schematic diagram of the wire feeding process of the two-stage automatic wire feeding device of the present invention. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described in detail below through specific implementation methods.

[0034] Example 1

[0035] like Figure 1 、 Figure 2 and Figure 3 As shown, this embodiment provides a dispensing platform for a round tube wire bonding process, comprising a sensor clamping module 111 and a moving component 112; the sensor clamping module 111 is arranged on the moving component 112, and is used to move the sensor clamping module 111 to a specified position;

[0036] Specifically, the sensor clamping module 111 includes a module base 1111, a semicircular clamping movable mold 1112, a semicircular clamping fixed mold 1113 and a slide rail 1114; the slide rail 1114 is arranged on the module base 1111, and the semicircular clamping movable mold 1112 is slidably arranged on the slide rail 1114. The semicircular clamping movable mold 1112 slides along the slide rail 1114 and is assembled with the semicircular clamping fixed mold 1113 to form a ceramic tube clamping groove 1115 for clamping the semiconductor ceramic tube; the ceramic tube clamping groove 1115 is designed to reserve a certain slurry point height position when clamping the semiconductor ceramic tube.

[0037] Preferably, the sensor clamping module 111 further includes a clamping adjustment component; the clamping adjustment component includes a clamping spring 1116 and an adjustable tightening wheel 1117; the clamping spring 1116 and the adjustable tightening wheel 1117 are arranged on the module base 1111 through a support plate 1118, and the support plate 1118 is arranged on one side of the semicircular clamping movable mold 1112, and the force of the clamping spring 1116 is parallel to the sliding direction of the semicircular clamping movable mold 1112 on the slide rail 1114; when the adjustable tightening wheel 1117 is rotated, the semicircular clamping movable mold 1112 approaches or moves away from the semicircular clamping fixed mold 1113 under the action of the clamping spring 1116, so as to adjust the clamping force between the ceramic tube clamping groove 1115 and the semiconductor ceramic tube;

[0038] It is understandable that the ceramic tube clamping groove 1115 is formed by the semicircular clamping movable mold 1112 sliding along the slide rail 1114 and being assembled with the semicircular clamping fixed mold 1113, so that the ceramic tube clamping groove 1115 can be applied to ceramic tubes of various sizes and types. In addition, due to the fragile nature of the ceramic tube itself, it is easy to break due to uneven force or overpressure during the processing process. Through the coordinated use of the slide rail 1114, the adjustable tightening wheel 1117 and the clamping spring 1116, the ceramic tube can be clamped while protecting it from being crushed.

[0039] In practice, multiple ceramic tubes can be placed end-to-end on a fixed rod and then placed in the ceramic tube clamping groove. A ceramic tube positioning block is provided at one end of the ceramic tube clamping groove near the slurry application location. After slurry application on one ceramic tube is completed, the moving assembly 112 moves the tube to the next ceramic tube; a single-axis robot can be used for this moving assembly to ensure precise positioning.

[0040] It should be noted that the slurry dispensing platform described in this embodiment is not limited to the clamping and fixing of ceramic tubes, but is also applicable to the clamping and fixing of other round tubes.

[0041] Example 2

[0042] like Figure 4 As shown, this embodiment provides a complete machine for a round tube wire bonding process, comprising:

[0043] An automatic dosing device 1 includes a dosing platform for clamping and moving a ceramic tube and an automatic dosing mechanism for automatically dosing the slurry; the dosing platform is the dosing platform described in Example 1; the dosing direction of the automatic dosing mechanism corresponds to the position on the dosing platform above the position where the ceramic tube needs to be dosed;

[0044] The automatic wire feeding device 2 includes a wire clamping assembly 21, a wire feeding drive assembly 22 for controlling the wire clamping assembly to clamp or release the wire, and a moving assembly 23 for driving the wire clamping assembly 21 and the wire feeding drive assembly 22 to move the wire to the position where the slurry needs to be applied to the ceramic tube;

[0045] An automatic wire cutting device 3 is provided between the slurry dispensing platform and the automatic wire feeding device, and comprises a wire cutting assembly and a wire cutting drive assembly connected to the wire cutting assembly and used to drive the wire cutting assembly to cut the wire;

[0046] A visual positioning device 4, which is used to take a picture of the position of the ceramic tube on the dispensing platform where dispensing is required, and perform position image recognition;

[0047] An operation display device 5, comprising a touch screen and operation buttons for inputting and displaying operation parameters;

[0048] The quality inspection device 6 is used to check the pulping result every time the machine is shut down and restarted. If the pulping result does not meet the requirements, it will be fed back to the automatic pulping device to adjust the automatic pulping mechanism; if the pulping result meets the requirements, normal production will begin.

[0049] like Figure 5 As shown, the working process of the whole machine of this embodiment for round tube wire bonding process is as follows:

[0050] Positioning step: Use the visual positioning device to determine the position of the ceramic tube where the slurry needs to be applied;

[0051] Wire feeding step: After the ceramic tube is clamped and fixed in the ceramic tube clamping groove of the slurry dotting platform, the moving component of the automatic wire feeding device sends the wire to the position of the ceramic tube where the slurry dotting is required according to the position information fed back by the visual positioning device;

[0052] Dotting steps: the automatic dotting mechanism of the automatic dotting device dots the ceramic tube on which the silk thread is placed;

[0053] Wire cutting step: After the slurry is applied, the wire cutting component of the automatic wire cutting device cuts the wire;

[0054] When one ceramic tube completes the steps of positioning, wire feeding, slurry doping and wire cutting, the slurry doping platform is moved to continue the steps of positioning, wire feeding, slurry doping and wire cutting for the next ceramic tube to ensure the continuity of the wire sticking process.

[0055] It also includes a quality inspection step: since the slurry at the outlet of the automatic slurry dispensing mechanism comes into contact with the air after shutdown, it may solidify or thicken after a period of time, thereby affecting the slurry dispensing result. Therefore, the slurry dispensing result needs to be checked each time the machine is shut down and restarted. The quality inspection device 6 can be achieved by manually checking the slurry dispensing result using an electron microscope. If the slurry dispensing result does not meet the requirements, the automatic slurry dispensing mechanism is adjusted in time; if the slurry dispensing result meets the requirements, normal production can be started. The accuracy of the slurry provided by the automatic slurry dispensing mechanism can be adjusted by adjusting the slurry dispensing pressure, slurry dispensing air pressure and slurry dispensing time through the operation buttons of the operation display device 5. The accuracy is how many grams are dispensed each time; the touch screen of the operation display device 5 can be used to adjust the recognition and positioning parameters of the visual positioning device 4, and can also be used to display electron microscope images during quality inspection to facilitate quality inspection of the slurry dispensing results.

[0056] When designing the whole machine:

[0057] Visual positioning device

[0058] The visual positioning device 4 can use a positioning camera, which takes a photo of the ceramic tube on the slurry dotting platform, identifies the position of the ceramic tube based on a machine vision method, and feeds back the coordinates to the automatic wire feeding device and the automatic slurry dotting device for position adjustment after coordinate conversion.

[0059] Automatic wire feeding device

[0060] like Figure 6 As shown, the wire feeding drive assembly 22 is located below the wire clamping assembly 21, and the shifting assembly 23 is located below the wire feeding drive assembly 22. After the ceramic tube is on the operating surface, based on the position information fed back by the visual positioning device 4, the wire feeding drive assembly 22 drives the wire clamping assembly 21 to clamp the wire, and the shifting assembly 23 is actuated, thereby driving the wire clamping assembly 21 and the wire feeding drive assembly 22 to shift the wire a specified distance, so that the end of the wire moves to the specified position (the position where the ceramic tube needs to be slurried), completing the automatic wire feeding process and greatly improving the wire feeding efficiency.

[0061] In this embodiment, the wire feeding drive assembly 23 is a wire clamping cylinder or other driving device that can provide clamping power for the wire clamping assembly 21, and the shifting assembly 23 adopts a micro precision module or other driving device that can provide forward and backward movement power for the wire clamping assembly 21 and the wire feeding drive assembly 22.

[0062] Furthermore, in order to keep the wire straight during the wire feeding process, avoid wire bending, and ensure the accuracy of the wire sticking position, the automatic wire feeding device also includes a wire guide assembly, which has a wire guide hole. The wire guide hole of the wire guide assembly is on the same horizontal plane as the wire outlet position of the wire clamping assembly. In particular, the wire outlet position of the wire feeding mechanism is provided with a wire protection block. The wire protection block is made of a soft material, such as silicone, to prevent the wire from being damaged during the clamping process.

[0063] Since the sizes of semiconductor ceramic tubes are different, the heights of the wire feeding operating surfaces of semiconductor ceramic tubes of different sizes are different. Therefore, it is necessary to fine-tune the height positions of the wire clamping assembly, the wire feeding drive assembly and the shift assembly to facilitate the processing of materials of different external sizes and make the use of the wire feeding mechanism wider. Figure 7 As shown, in other embodiments, the automatic wire feeding device may further include a height adjustment component 24, which is connected to the shift component 23 and is used to drive the wire clamping component 21, the wire feeding drive component 22 and the shift component 23 to move up and down, thereby adjusting the height of the wire. Specifically, the height adjustment component 24 is located below the wire clamping component 21, the wire feeding drive component 22 and the shift component 23, and the height adjustment component 24 adopts a Z-direction manual fine-tuning slide or other driving device that can adjust the height of the wire feeding mechanism.

[0064] Automatic pulping mechanism

[0065] like Figure 8 As shown, the automatic slurry dispensing mechanism includes a slurry dispensing component 121 and a displacement component 122; the slurry dispensing component includes a storage section 1211 for storing conductive slurry and a slurry dispensing needle 1212, and the storage section 1211 and the slurry dispensing needle 1212 are connected; the slurry dispensing component 121 is arranged on the displacement component 122 to drive the slurry outlet of the slurry dispensing needle 1212 of the slurry dispensing component 121 to move away from or to the position where the ceramic tube needs to be slurried.

[0066] It can be understood that the position where the ceramic tube needs to be doped is the position where the wire to be bonded is located. When the slurry outlet of the doping needle 1212 moves to this position, the conductive slurry is applied to this position, thereby bonding the wire to be bonded to the designated ceramic tube, completing the doping process; the slurry points dotted by the doping equipment are smaller and fuller than those done manually, and can save more conductive slurry while meeting the process requirements.

[0067] Specifically, the displacement component 122 uses an up and down sliding cylinder or an electric screw micro module to provide up and down movement power for the paddle assembly.

[0068] It should be noted that the use of the dispensing component 121 with the dispensing needle 1212 and the storage section 1211 eliminates the dipping step during manual dispensing, and the storage section 1211 has the advantages of convenient slurry addition and accommodating more conductive slurry, thereby reducing the frequency of adding conductive slurry, extending the time for the conductive slurry to become viscous, improving the utilization rate of a single gram of conductive slurry, and effectively saving the use of precious metal slurry and reducing the waste of precious metal materials.

[0069] Furthermore, the automatic dosing mechanism also includes a dosing support frame 123, which is located below the displacement component 122 to support the dosing component 121 and the displacement component 122, and prevent the dosing needle 1212 from touching other devices when moving up and down.

[0070] Automatic wire cutting device

[0071] It can be understood that after the silk thread is bonded to the designated position of the ceramic tube through the slurry dot step, Figure 9 As shown, the wire cutting drive component 32 of the automatic wire cutting device 3 drives the wire cutting component 31 to cut the wire at a specified position to complete the wire cutting process. The wire cutting component 31 can ensure that the length of the cut wire is consistent, thereby improving the utilization rate of raw materials.

[0072] like Figure 10 As shown, specifically, the wire cutting assembly 31 comprises a first scissor blade and a second scissor blade forming a scissor-type wire cutting structure, wherein the wire thread is positioned between the first and second scissor blades, and the wire cutting drive assembly 32 drives the first and second scissor blades of the wire cutting assembly 31 to operate, thereby cutting the wire thread. In other embodiments, the wire cutting assembly 31 may also comprise a guillotine-type wire cutting structure comprising a wire cutter and a shearing seat, wherein the wire thread is positioned between the wire cutter and the shearing seat, and the wire cutter is driven downward to cut the wire thread using the pressure of the wire cutter.

[0073] The wire cutting drive assembly 32 can be an electric clamping assembly, a pneumatic clamping assembly, or a mechanical clamping assembly. The wire cutting drive assembly 32 provides fast and precise power to the shear blades of the wire cutting assembly, controlling the opening and closing of the wire cutting assembly. In particular, the electric clamping assembly can use an electric gripper, the pneumatic clamping assembly can use a pneumatic gripper, and the mechanical clamping assembly can use an industrial robot gripper, also known as a mechanical gripping mechanism.

[0074] Example 3

[0075] The difference between this embodiment and embodiment 2 is that: Figure 7As shown, the automatic wire feeding device is configured as a two-stage wire feeding process device, including a first wire feeding mechanism and a second wire feeding mechanism; the first wire feeding mechanism and the second wire feeding mechanism both include a wire clamping component 21, a wire feeding drive component 22 and a shifting component 23, the wire feeding drive component 22 is connected to the wire clamping component 21, and is used to drive the wire clamping component 21 to clamp or release the wire, and the shifting component 23 is connected to the wire feeding drive component 22, and is used to displace the wire a specified distance; the wire output position of the first wire feeding mechanism and the wire output position of the second wire feeding mechanism are in the same horizontal plane, the first wire feeding mechanism is used to displace the wire from the initial position by a specified distance, and the second wire feeding mechanism is used to displace the wire after being displaced by the first wire feeding mechanism to the position where the ceramic tube needs to be slurried.

[0076] like Figure 11 As shown, it can be understood that the first wire feeding mechanism clamps the wire and displaces the wire by a specified distance. After it is in place, the first wire feeding mechanism releases the wire; the second wire feeding mechanism clamps the wire and displaces the wire by a specified distance again to prepare for the wire cutting operation; after the wire cutting is completed, the second wire feeding mechanism releases the wire and retreats together with the first wire feeding mechanism. Preferably, the specified distance that the second wire feeding mechanism displaces the wire is consistent with the specified distance that the first wire feeding mechanism displaces the wire. In particular, by adjusting the starting position and the end position of the shifting component of the first wire feeding mechanism, the specified distance that the first wire feeding mechanism displaces the wire can be adjusted; by adjusting the starting position and the end position of the shifting component of the second wire feeding mechanism, the specified distance that the second wire feeding mechanism displaces the wire can be adjusted.

[0077] It should be noted that the two-stage wire feeding device, consisting of the first wire feeding mechanism and the second wire feeding mechanism, is divided into two stages when feeding the wire. After the first wire feeding mechanism feeds the wire, it ensures that the end of the wire is above the ceramic tube where slurry needs to be applied. After the second wire feeding mechanism feeds the wire, it continues the first displacement and shifts the wire a specified distance to ensure that the middle position of the fed wire (the middle position between the wire cutting position and the wire end) is above the ceramic tube where slurry needs to be applied, thereby ensuring that the wire length at both ends of the slurry application position, centered on the ceramic tube, is consistent. The designed two-stage wire feeding device can ensure that the wire maintains its linearity during the wire feeding process, thereby ensuring the accuracy of the wire sticking position and the consistency of the wire feeding length, improving the utilization rate of single-gram wire and saving raw materials.

[0078] Preferably, the wire outlet position of the first wire feeding mechanism and the wire outlet position of the second wire feeding mechanism are provided with wire protection blocks, and the wire protection blocks are made of soft materials, such as rubber, etc., to avoid damage to the wire when clamping the wire.

[0079] Preferably, the wire feeding drive assembly 22 can be a clamping cylinder or other driving device that can provide clamping power to the wire clamping assembly; the shifting assembly 23 can adopt a micro precision module or other driving device that can provide forward and backward moving power to the wire clamping assembly 21 and the wire feeding drive assembly 22, so that the control accuracy is higher and more stable.

[0080] Example 4

[0081] The difference between this embodiment and embodiment 3 is that this embodiment provides a specific wire guide assembly for a two-stage automatic wire feeding device, such as Figure 7 As shown:

[0082] The wire guide assembly of the first wire feeding mechanism includes a first wire guide portion 251 and a second wire guide portion, the first wire guide portion 251 is located between the two clamping portions of the wire clamping assembly 21 of the first wire feeding mechanism, and the second wire guide portion is arranged at the wire outlet position of the wire clamping assembly of the first wire feeding mechanism; the first wire guide portion 251 and the second wire guide portion are both provided with wire guide holes, and the wire guide hole of the first wire guide portion, the wire outlet position of the wire clamping assembly 21 of the first wire feeding mechanism and the wire guide hole of the second wire guide portion are in the same horizontal plane, thereby ensuring that the wire is in a straight state in the first wire feeding mechanism, thereby ensuring that the middle position between the wire cutting position and the wire end is above the ceramic tube where slurry needs to be applied, thereby ensuring the accuracy of the wire sticking position;

[0083] The wire guide assembly of the second wire feeding mechanism includes a third wire guide part, a fourth wire guide part 254 and a fifth wire guide part 255. The fourth wire guide part 254 is located between the third wire guide part and the wire clamping assembly 21 of the second wire feeding mechanism, and the fifth wire guide part 255 is located between the two clamping parts of the wire clamping assembly 21 of the second wire feeding mechanism; the third wire guide part, the fourth wire guide part 254 and the fifth wire guide part 255 are all provided with wire guide holes, and the wire guide holes of the third wire guide part, the fourth wire guide part 254, the fifth wire guide part 255 and the wire outlet position of the wire clamping assembly 21 of the second wire feeding mechanism are in the same horizontal plane, thereby ensuring that the wire is in a straight state in the second wire feeding mechanism, thereby ensuring the accuracy of the wire sticking position.

[0084] Furthermore, the second wire guiding part includes a first wire guide porcelain nozzle 2521 and a first mounting plate 2522, the first wire guide porcelain nozzle 2521 is arranged through the first mounting plate 2522, and the first mounting plate 2522 is connected to the wire feeding drive assembly 22 of the first wire feeding mechanism; the third wire guiding part includes a second wire guide porcelain nozzle 2531 and a second mounting plate 2532, the second mounting plate 2532 is located at the lower side of the wire clamping assembly 21 of the second wire feeding mechanism, and the second wire guide porcelain nozzle 2531 is arranged through the second mounting plate 2532; the setting of the first wire guide porcelain nozzle 2521 and the second wire guide porcelain nozzle 2531 can avoid the generation of static electricity while maintaining the straightness of the wire.

[0085] Example 5

[0086] The difference between this embodiment and embodiment 2 is that this embodiment provides a specific displacement component for the automatic pulping mechanism, such as Figure 8 As shown:

[0087] The shifting component 122 includes a first shifting component 1221 and a second shifting component 1222. The first shifting component 1221 is connected to the slurry dosing component and is used to drive the slurry dosing component to move up and down, so that the slurry outlet of the slurry dosing needle 1212 is away from or moved to a first slurry dosing position (the position where the ceramic tube needs to be dosed) to realize the slurry dosing operation; the second shifting component 1222 is connected to the first shifting component 1221 and is used to drive the first shifting component 1221 and the slurry dosing component 121 to move parallel to each other, so that the slurry outlet of the slurry dosing needle 1212 is away from or moved to a second slurry dosing position, and the second slurry dosing position is located directly above the first slurry dosing position.

[0088] It can be understood that the second slurry dotting position is the position where the slurry outlet of the slurry dotting needle 1212 is away from the first slurry dotting position, and the second slurry dotting position and the first slurry dotting position are on the same vertical plane; when slurry dotting is required, the second shifting component 1222 first drives the slurry outlet of the slurry dotting needle 1212 to move to the second slurry dotting position, and then the first shifting component 1221 drives the slurry outlet of the slurry dotting needle 1212 away from or to the first slurry dotting position for slurry dotting; after all the slurry dotting processes are completed, the first shifting component 1221 drives the slurry outlet of the slurry dotting needle 1212 to move to the second slurry dotting position, and the second shifting component 1222 drives the slurry outlet of the slurry dotting needle 1212 away from the second slurry dotting position.

[0089] Specifically, the second shifting component 1222 adopts an electric screw micro module or a movable slide cylinder to provide forward and backward movement power in the Y direction for the first shifting component 1221 and the paddle-dotting component 121, wherein the Y direction is perpendicular to the plane where the second paddle-dotting position and the first paddle-dotting position are located.

[0090] Since the sizes of ceramic tubes are different, the first slurry dotting positions of ceramic tubes of different sizes are different. Therefore, it is necessary to fine-tune the height position and left and right position of the slurry dotting component 121 to facilitate the processing of materials of different external dimensions, so that the slurry dotting equipment can be used in a wider range of applications. Specifically, a fine-tuning component 1223 is provided between the second shift component 1222 and the first shift component 1221, and the fine-tuning component 1223 is used to drive the slurry dotting component 121 to move along the X direction or along the Z direction. The fine-tuning component 1223 can adopt an XZ bidirectional manual fine-tuning slide to drive the slurry dotting component 121 to move through the first shift component 1221, and then fine-tune the slurry dotting component 121. In addition, the fine-tuning component 1223 can also fine-tune the slurry dotting component 121 to adapt to changes in the position of the silk thread or the ceramic tube.

[0091] Example 6

[0092] The difference between this embodiment and embodiment 5 is that the conductive paste has a certain viscosity, and the wire to be bonded is an extremely thin wire. After the conductive paste is applied to the first paste-dispensing position, when the paste outlet of the paste-dispensing needle is away from the first paste-dispensing position, the conductive paste has not yet solidified, and the wire to be bonded is easily moved by the conductive paste at the paste outlet of the paste-dispensing needle, thereby affecting the wire-wetting effect. Therefore, this embodiment provides an automatic paste-dispensing mechanism with a wire pressing component. Figure 8 As shown, the wire pressing assembly 124 is located on the side of the slurry dispensing assembly 121, and is used to prevent the wire to be bonded from being driven by the conductive slurry at the slurry outlet of the slurry dispensing needle 1212. It can ensure that the wire to be bonded is not driven by the conductive slurry when the slurry dispensing needle 1212 rises, and can also ensure that the wire to be bonded is not damaged, thereby improving the slurry dispensing effect.

[0093] Specifically, the wire pressing assembly 124 includes a wire pressing block and an elastic component. The wire pressing block is located on the side wall of the slurry dotting assembly, the elastic component is located at the lower part of the wire pressing block, and the bottom of the elastic component is lower than the slurry outlet of the slurry dotting needle 1212, so as to ensure that when the slurry dotting needle 1212 descends, the elastic component first approaches the operating surface (the plane where the first slurry dotting position is located) and pre-generates a downward pressing force on the wire to be bonded. When the slurry dotting needle 1212 rises, the elastic component leaves the operating surface (the plane where the first slurry dotting position is located) and maintains the downward pressing force on the wire to be bonded, thereby preventing the wire to be bonded from being driven by the conductive slurry.

[0094] In order to ensure that the wires to be bonded are not damaged, the elastic component is made of a material with moderate hardness or softness, such as pressed wire cotton or pressed wire rubber.

[0095] Furthermore, the lower part of the wire pressing block is a "7"-shaped structure, the elastic component is located on one side of the "7"-shaped structure, and the slurry dispensing needle is located on the other side of the "7"-shaped structure; it can be understood that the slurry dispensing needle 1212 and the elastic component are located on both sides of the "7"-shaped structure, thereby avoiding the elastic component of the wire pressing assembly from touching the conductive material, so that the wire pressing operation and the slurry dispensing operation do not affect each other.

[0096] Example 7

[0097] The difference between this embodiment and embodiment 1 is that: due to the different sizes of ceramic tubes, the heights of the wire cutting operation surfaces of ceramic tubes of different sizes are different. Therefore, it is necessary to fine-tune the height position and front-back position of the wire cutting assembly 31 and the wire cutting drive assembly 32 to facilitate the processing of materials of different external dimensions, so that the scope of use of the wire cutting equipment is wider. In addition, after the blade in a fixed position is worn, if the fixed position is continued to be used for wire cutting operations, it is easy to cause problems such as the wire not being cut, the wire being placed being messed up, or the wire cross section being damaged. Therefore, this embodiment provides an automatic wire cutting device with an adjustable connecting assembly, which is used to drive the wire cutting assembly to move forward and backward in the horizontal direction or up and down in the vertical direction, which can effectively improve the qualified rate of wire cutting, ensure that the wire being placed will not be messed up, and ensure that the wire cross section will not be damaged after wire cutting.

[0098] like Figure 9 and Figure 10 As shown, the adjustable connection assembly includes a first position adjustment assembly 331 and a second position adjustment assembly 332 .

[0099] The first position adjustment component 331 is connected to the wire cutting drive component 32, and is used to drive the wire cutting drive component 32 to move up and down or left and right, thereby driving the wire cutting component 31 to move up and down or left and right, as shown in the attached figure. Figure 2 and attached Figure 3 As shown, it is used to achieve fine-tuning of the height and left-right position of the wire cutting assembly 31 and the wire cutting drive assembly 32. Specifically, the first position adjustment assembly 331 is located below the wire cutting drive assembly 32. The first position adjustment assembly 331 can adopt a manual fine-tuning slide or other driving device that can achieve the above functions. When the size of the ceramic tube to be processed changes, the processing accuracy or the installation accuracy are insufficient, it plays a role in fine-tuning the distance.

[0100] Furthermore, a fixing plate 333 is provided between the first position adjustment assembly 331 and the wire-cutting drive assembly 32. The fixing plate 333 serves as a fixing seat for the wire-cutting drive assembly 32. The first position adjustment assembly 331 is located below the fixing plate 333, and the wire-cutting drive assembly 32 is located on the side of the fixing plate 333. This facilitates the wire-cutting operation while achieving a distance fine-tuning function. The fixing plate 333 includes an L-shaped connecting plate and connecting ribs. The short plate of the L-shaped connecting plate is fixedly connected to the wire-cutting drive assembly 32, and the long plate of the L-shaped connecting plate is fixedly connected to the first position adjustment assembly 331. The connecting ribs are fixed between the short and long plates of the L-shaped connecting plate for stable support.

[0101] The second position adjustment component 332 is arranged between the wire cutting component 31 and the wire cutting drive component 32, and is used to drive the wire cutting component 31 to move back and forth in the horizontal direction to ensure that the placed wires are not disturbed and to ensure that the wire cross section will not be damaged after wire cutting. The second position adjustment component 332 includes a first fixing member and a second fixing member, the first fixing member is provided with a plurality of first adjustment holes, and the second fixing member is provided with a plurality of second adjustment holes corresponding to the first adjustment holes; the wire cutting component 31 is connected to the first adjustment hole and the second adjustment hole respectively. Specifically, a plurality of first adjustment holes are arranged at equal intervals on the first fixing member, and a plurality of second adjustment holes are arranged at equal intervals on the second fixing member, and the first adjustment holes and the second adjustment holes are arranged correspondingly one by one up and down.

[0102] It can be understood that after the scissors blades fixed in one position are worn, the front and rear positions of the wire cutting assembly 31 can be adjusted by fixing the wire cutting assembly 31 on different adjustment holes, thereby increasing the service life of a single set of blades.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention. They should all be included in the scope of the technical solution for protection of the present invention.

Claims

1. A complete machine for round tube wire bonding process, characterized in that: include: An automatic slurry dispensing device, comprising a slurry dispensing platform for clamping and moving the ceramic tube and an automatic slurry dispensing mechanism for automatically dispensing slurry; The dispensing platform includes a sensor clamping module and a moving component; The sensor clamping module is arranged on the moving assembly and is used to move the sensor clamping module to a specified position; The sensor clamping module includes a module base, a semicircular clamping movable mold, a semicircular clamping fixed mold and a slide rail; The slide rail is arranged on the module base, the semicircular clamping movable mold is slidably arranged on the slide rail, the semicircular clamping movable mold slides along the slide rail and is assembled with the semicircular clamping fixed mold to form a ceramic tube clamping groove for clamping the semiconductor ceramic tube; The ceramic tube clamping groove is designed to reserve a certain slurry dot height position when clamping the semiconductor ceramic tube; The automatic slurry dispensing mechanism is arranged in a direction corresponding to the position where the ceramic tube on the slurry dispensing platform needs to be dispensed; The automatic wire feeding device includes a wire clamping assembly, a wire feeding drive assembly for controlling the wire clamping assembly to clamp or release the wire, and a moving assembly for driving the wire clamping assembly and the wire feeding drive assembly to move the wire to the position where the ceramic tube needs to be slurried; The automatic wire feeding device includes a first wire feeding mechanism and a second wire feeding mechanism, wherein the wire outlet position of the first wire feeding mechanism, the wire outlet position of the second wire feeding mechanism, the first designated position, and the second designated position are located in the same horizontal plane, the first wire feeding mechanism is used to feed the wire from the initial position to the first designated position, and the second wire feeding mechanism is used to feed the wire from the first designated position to the second designated position, and the second designated position is the position where the ceramic tube needs to be slurryed; An automatic wire cutting device is provided between the slurry dispensing platform and the automatic wire feeding device, and comprises a wire cutting assembly and a wire cutting drive assembly connected to the wire cutting assembly and used to drive the wire cutting assembly to cut the wire thread; The automatic wire cutting device further comprises an adjustable connecting assembly for driving the wire cutting assembly to move forward and backward in a horizontal direction or move up and down in a vertical direction.

2. The complete machine for round tube wire bonding process according to claim 1, characterized in that: The sensor clamping module further includes a clamping adjustment component; the clamping adjustment component includes a clamping spring and an adjustable tightening wheel; The clamping spring and the adjustable tightening wheel are arranged on the die base via a support plate, the support plate is arranged on one side of the semicircular clamping movable die, and the force of the clamping spring is parallel to the sliding direction of the semicircular clamping movable die on the slide rail; When the adjustable tightening wheel is rotated, the semicircular clamping movable mold approaches or moves away from the semicircular clamping fixed mold under the action of the clamping spring, so as to adjust the clamping force between the ceramic tube clamping groove and the semiconductor ceramic tube.

3. The complete machine for round tube wire bonding process according to claim 1, characterized in that: A ceramic tube positioning block is provided at one end of the ceramic tube clamping groove close to the slurry point position.

4. The complete machine for round tube wire bonding process according to claim 1, characterized in that: It also includes a visual positioning device, which is used to take pictures of the positions of the ceramic tubes on the dispensing platform where dispensing is required to be performed for position image recognition.

5. The complete machine for round tube wire bonding process according to claim 1, characterized in that: It also includes a quality inspection device for checking the pulping result each time the machine is shut down and restarted. If the pulping result does not meet the requirements, the feedback is sent to the automatic pulping device to adjust the automatic pulping mechanism; if the pulping result meets the requirements, normal production begins.

6. The complete machine for round tube wire bonding process according to claim 1, characterized in that: The automatic paddle mechanism includes a paddle assembly and a displacement assembly; The dispensing assembly includes a material storage section for storing the conductive paste and a dispensing needle, wherein the material storage section and the dispensing needle are in communication; The slurry dispensing assembly is arranged on the displacement assembly to drive the slurry outlet of the slurry dispensing needle of the slurry dispensing assembly to move away from or to a position where the ceramic tube needs to be slurried.

7. The complete machine for round tube wire bonding process according to claim 1, characterized in that: The whole machine also includes an operation display device, which includes a touch screen and operation buttons for inputting and displaying operation parameters.

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