Parts replacement method

Abstract

The present invention provides a component replacement method, which can shorten the stop period of a processing device accompanied by the replacement of consumable parts. The first calculation step estimates the replacement period of the consumable parts of the processing device. The determination step determines the moment after the processing of the substrate performed by the processing device in the period before the replacement period is finally completed as the replaceable time of the consumable parts. The second calculation step estimates the first movement time required for the component conveying device to move to the position of the processing device where the consumable parts need to be replaced. The third calculation step estimates the first preparation time required for preparing until the component conveying device, which has moved to the position of the processing device where the consumable parts need to be replaced, is in a state where the consumable parts can be replaced. The sending step sends a replacement instruction to the component conveying device at a moment before the moment that is earlier than the replaceable time by the total amount of the first movement time and the first preparation time, to instruct the component conveying device to replace the consumable parts.

Description

Technical Field

[0001] Various aspects and embodiments of the present invention are directed to a component replacement method. Background Art

[0002] Inside the processing device that processes substrates, there are consumable components that are consumed as the substrates are processed. When the consumption of these consumable components exceeds a predetermined amount, they are replaced with the consumable components that were previously used. During the replacement of consumable components, substrate processing in the processing device is stopped, and the processing device container is opened to the atmosphere. The used consumable components are manually removed and the consumable components that were previously used are installed. The container is then closed, the interior is evacuated, and substrate processing is resumed.

[0003] As described above, when replacing consumable parts, the interior of the processing device is exposed to the atmosphere, so the processing device must be evacuated after the consumable parts are replaced, which increases the processing downtime. In addition, some consumable parts are large, so manual replacement may take time.

[0004] In order to avoid this situation, a replacement station is known that has consumable parts before use and a replacement processing unit for replacing the consumable parts (for example, refer to the following patent document 1). In such a replacement station, the processing device is connected to the replacement station, and the shut-off valve between the processing device and the replacement station is opened after the replacement station is evacuated. Then, the used consumable parts are taken out from the processing device by the replacement processing unit in the replacement station and replaced with the consumable parts before use carried in the replacement station. In this way, the consumable parts can be replaced without opening the interior of the processing device to the atmosphere, which can shorten the processing stop time. In addition, since the consumable parts are replaced by the replacement processing unit without manual work, the consumable parts can be replaced in a short time.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2017-85072. Summary of the Invention

[0008] Problems to be solved by the invention

[0009] The present invention provides a parts replacement method capable of shortening the downtime period of a processing device associated with the replacement of consumable parts.

[0010] Technical means to solve the problem

[0011] One aspect of the present invention is a component replacement method in a processing system, wherein the processing system includes a processing device for processing substrates, a component transport device for transporting consumable components installed in the processing device, and a control device for controlling the processing device and the component transport device. In this method, the control device performs a first calculation step, a determination step, a second calculation step, a third calculation step, and a transmission step. In the first calculation step, a replacement time for the consumable components of the processing device is calculated. In the determination step, the time at which substrate processing by the processing device during the period before the replacement time is finally completed is determined as the time at which the consumable components can be replaced. In the second calculation step, a first movement time required for the component transport device to move to the position of the processing device where the consumable components need to be replaced is calculated. In the third calculation step, a first preparation time required to prepare the component transport device, which has moved to the position of the processing device where the consumable components need to be replaced, for replacement of the consumable components is calculated. In the transmission step, a replacement instruction is transmitted to the component transport device at a time before the time at which the replacement time is earlier than the time at which the consumable components need to be replaced by the sum of the first movement time and the first preparation time, thereby instructing the component transport device to replace the consumable components.

[0012] Effects of the Invention

[0013] According to various aspects and embodiments of the present invention, it is possible to shorten the downtime period of a processing device associated with replacement of consumable parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a system configuration diagram showing an example of a processing system according to one embodiment of the present invention.

[0015] Figure 2 This is a diagram showing an example of a processing device according to the first embodiment.

[0016] Figure 3 This is a diagram showing an example of the upper surface of the lower electrode.

[0017] Figure 4 This is a diagram showing an example of the lower surface of the edge ring.

[0018] Figure 5 It is an enlarged view showing an example of the shape of the opening of the recessed portion.

[0019] Figure 6 It is an enlarged cross-sectional view showing an example of the shapes of the concave portion and the convex portion.

[0020] Figure 7 It is an enlarged cross-sectional view showing another example of the shapes of the concave portion and the convex portion.

[0021] Figure 8 It is an enlarged cross-sectional view showing another example of the shapes of the concave portion and the convex portion.

[0022] Figure 9 This is a diagram showing an example of the component conveying device according to the first embodiment.

[0023] Figure 10 This is a diagram showing an example of how a wafer cassette is taken out.

[0024] Figure 11 This is an enlarged cross-sectional view showing an example of a connection portion between the processing apparatus and the component conveying apparatus according to the first embodiment.

[0025] Figure 12 This is an enlarged cross-sectional view showing an example of a connection portion between the processing apparatus and the component conveying apparatus according to the first embodiment.

[0026] Figure 13 This is a block diagram showing an example of a control device.

[0027] Figure 14 This is a diagram showing an example of a reservation table.

[0028] Figure 15 This is a diagram for explaining an example of the replacement timing of the edge ring.

[0029] Figure 16 This is a flowchart showing an example of processing by the control device when moving the component transport device to the position of the processing device to be replaced with the consumable component.

[0030] Figure 17 This is a flowchart showing an example of processing by the control device when controlling a processing device as a replacement target for consumable parts and a parts transport device connected to the processing device.

[0031] Figure 18 This is a flowchart showing an example of processing of the component conveying device.

[0032] Figure 19 This is a diagram showing an example of a processing device according to the second embodiment.

[0033] Figure 20 This is a diagram showing an example of a component conveying device according to a second embodiment.

[0034] Figure 21 This is an enlarged cross-sectional view showing an example of a connection portion between a processing apparatus and a component conveying apparatus according to a second embodiment.

[0035] Figure 22 This is a diagram for explaining an example of the replacement timing of consumable parts according to the third embodiment.

[0036] Figure 23 This is a diagram for explaining an example of a method for replacing an edge ring according to the fourth embodiment.

[0037] Figure 24 It is a diagram showing an example of a component conveying device according to a fifth embodiment.

[0038] Description of Reference Signs

[0039] W substrate

[0040] 10 Processing System

[0041] 20 Control device

[0042] 210 Reservation Form

[0043] 30 Processing Components

[0044] 31 Vacuum conveying chamber

[0045] 32 Load lock chamber

[0046] 33 Atmospheric transport room

[0047] 40 Processing device

[0048] 41 Chamber

[0049] 42 Support

[0050] 421 lower electrode

[0051] 4214 convex part

[0052] 422 Electrostatic Chuck

[0053] 423 Edge Ring

[0054] 4230 concave part

[0055] 43 Upper electrode showerhead assembly

[0056] 44 Gas supply unit

[0057] 45 RF power supply unit

[0058] 46 Exhaust System

[0059] 50 parts transport device

[0060] 51 containers

[0061] 52 Wafer Box

[0062] 53 Robotic Arm

[0063] 530 end effector

[0064] 54 Mobile Mechanism

[0065] 553 Sensor

[0066] 554 Exhaust

[0067] 56 Cleaning Agency

[0068] 57 Position deviation detection sensor DETAILED DESCRIPTION

[0069] Hereinafter, embodiments of the component replacement method will be described in detail based on the drawings. However, the disclosed component replacement method is not limited to the following embodiments.

[0070] However, even if it is time to replace a consumable component, if substrate processing is in progress within the processing device, the process must be completed. If processing ends after the consumable component replacement period, the consumable component will be replaced after the replacement period. On the other hand, if the consumable component is transported to the vicinity of the processing device after processing has ended in order to replace the consumable component, it takes time until the consumable component can actually be replaced, thus prolonging the processing device's downtime.

[0071] Therefore, the present invention provides a method for shortening the downtime period of a processing apparatus accompanying replacement of consumable parts.

[0072] (First embodiment)

[0073] [Structure of the processing system 10]

[0074] Figure 1 1 is a system configuration diagram illustrating an example of a processing system 10 according to one embodiment of the present invention. In one embodiment, the processing system 10 includes a control device 20, a plurality of processing modules 30, and a plurality of component transport devices 50. The control device 20 communicates with each processing module 30 and each component transport device 50 and controls each processing module 30 and each component transport device 50.

[0075] Each processing module 30 includes a vacuum transfer chamber 31, multiple processing apparatuses 40-1 to 40-6, multiple load lock chambers 32, and an atmospheric transfer chamber 33. Hereinafter, the multiple processing apparatuses 40-1 to 40-6 are collectively referred to as processing apparatus 40 without distinction.

[0076] Multiple processing devices 40 and multiple load lock chambers 32 are connected to the vacuum transfer chamber 31. In this embodiment, six processing devices 40 are connected to the vacuum transfer chamber 31, but five or fewer processing devices 40, or seven or more processing devices 40, may also be connected to the vacuum transfer chamber 31. Furthermore, in this embodiment, two load lock chambers 32 are connected to the vacuum transfer chamber 31, but one load lock chamber 32, or three or more load lock chambers 32, may also be connected to the vacuum transfer chamber 31.

[0077] Each processing unit 40 performs processes such as etching or film formation on a substrate in a low-pressure environment. Consumable components are installed within each processing unit 40 according to the processing performed on the substrate. Each processing unit 40 is separated from the vacuum transfer chamber 31 by a gate 400. Furthermore, each processing unit 40 is provided with a gate 401 for removing used consumable components and for importing them before use. Each processing unit 40 may perform the same process in the manufacturing process, or different processes.

[0078] Each load lock chamber 32 has gates 320 and 321 that switch the internal pressure from a predetermined vacuum level to atmospheric pressure, or vice versa. The load lock chamber 32 is separated from the vacuum transfer chamber 31 by the gate 320. Furthermore, the load lock chamber 32 is separated from the atmospheric transfer chamber 33 by the gate 321.

[0079] A robot arm 310 is positioned within the vacuum transfer chamber 31. The vacuum transfer chamber 31 is maintained at a predetermined vacuum level. In this embodiment, the robot arm 310 removes a substrate before processing from the load lock chamber 32, which has been depressurized to a predetermined vacuum level, and transfers it to any processing device 40. Furthermore, the robot arm 310 removes a processed substrate from a processing device 40 and transfers it to another processing device 40 or to the load lock chamber 32.

[0080] The load lock chamber 32 is connected to an atmospheric transfer chamber 33. A robot arm 330 is provided in the atmospheric transfer chamber 33. In addition, a plurality of load ports 331 are provided in the atmospheric transfer chamber 33, and the plurality of load ports 331 are connected to containers (for example, FOUP: Front Opening Unified Pod) that can accommodate a plurality of substrates before or after processing. The robot arm 330 takes out a substrate before processing from the container connected to the load port 331 and transfers it to the load lock chamber 32. In addition, the robot arm 330 takes out a processed substrate from the load lock chamber 32 and transfers it to the container connected to the load port 331. In addition, an alignment mechanism is provided in the atmospheric transfer chamber 33, which adjusts the direction of the substrate taken out from the container connected to the load port 331.

[0081] Each component transport device 50 has a robotic arm for handling consumable components before use. Based on instructions from the control device 20, it moves to the location of the processing device 40 containing the consumable components that need to be replaced. Furthermore, the component transport device 50 is connected to the processing device 40 containing the consumable components that need to be replaced via a gate 401. After the interior of the component transport device 50 is evacuated, the gate 401 is opened, and the robotic arm replaces the used consumable components with the unused consumable components.

[0082] [Structure of Processing Device 40]

[0083] Figure 2 1 is a diagram showing an example of a processing apparatus 40 according to the first embodiment. In this embodiment, the processing apparatus 40 includes a chamber 41 , a gas supply unit 44 , an RF (Radio Frequency) power supply unit 45 , and an exhaust system 46 .

[0084] The chamber 41 includes a support portion 42 and an upper electrode showerhead assembly 43. The support portion 42 is disposed in the lower region of the processing space 41s in the chamber 41. The upper electrode showerhead assembly 43 is disposed above the support portion 42 and functions as part of the ceiling of the chamber 41.

[0085] The support portion 42 is configured to support the substrate W in the processing space 41s. In this embodiment, the support portion 42 includes a lower electrode 421 and an electrostatic chuck 422. The lower electrode 421 is an example of a base component. The electrostatic chuck 422 is arranged on the lower electrode 421 and is configured to support the substrate W by the upper surface of the electrostatic chuck 422. An edge ring 423 is provided on the upper surface of the peripheral edge portion of the lower electrode 421. The edge ring 423 is configured to surround the electrostatic chuck 422 and the substrate W on the upper surface of the peripheral edge portion of the lower electrode 421. The upper surface of the electrostatic chuck 422 is an example of a loading surface. The support portion 42 is an example of a loading platform. The edge ring 423 is an example of a consumable component.

[0086] Through holes for passing lift pins 47 are formed in the bottom of the chamber 41, the lower electrode 421, and the electrostatic chuck 422. The lift pins 47 are raised and lowered by a drive unit 470 when loading and unloading substrates W. This allows substrates W loaded into the chamber 41 to be received by the robot arm 310 and placed on the electrostatic chuck 422. After processing, the processed substrates W are delivered to the robot arm 310 and unloaded from the chamber 41.

[0087] Furthermore, through-holes for the passage of lift pins 48 are formed in the bottom of the chamber 41 and the lower electrode 421. The lift pins 48 are raised and lowered by the drive unit 480 when the edge ring 423 is replaced. This allows the used edge ring 423 to be delivered to the robot arm of the component transport device 50 and transported out of the chamber 41, and the unused edge ring 423 to be received by the robot arm of the component transport device 50 and placed on the lower electrode 421.

[0088] Figure 3 This figure shows an example of the top surface of lower electrode 421. Region 4210 of the top surface of lower electrode 421 (the surface on which electrostatic chuck 422 is disposed) includes multiple through-holes 4211 for passage of lift pins 47, and electrostatic chuck 422 is disposed thereon. Region 4212 surrounding region 4210 includes multiple through-holes 4213 for passage of lift pins 48, and multiple protrusions 4214 for positioning edge ring 423, for placement of edge ring 423. In this embodiment, multiple protrusions 4214 are arranged on a circle centered on the central axis X of substrate W placed on electrostatic chuck 422.

[0089] Figure 4 This figure shows an example of the lower surface of edge ring 423. Multiple recesses 4230 are provided on the lower surface of edge ring 423 (the surface in contact with lower electrode 421). In this embodiment, multiple recesses 4230 are arranged on a circle centered on the central axis X of substrate W placed on electrostatic chuck 422. In this embodiment, three recesses 4230 are formed on the lower surface of edge ring 423. Furthermore, if multiple recesses 4230 are formed on the lower surface of edge ring 423, two or more recesses may be formed.

[0090] Figure 5 : is an enlarged view showing an example of the shape of the opening of the recess 4230. In this embodiment, the shape of the opening of the recess 4230 is, for example Figure 5 The recess 4230 is shaped like an elongated hole, having a width ΔW1 in the circumferential direction of a circle centered on the central axis X and a width ΔW2 in the radial direction of the circle centered on the central axis X. The width ΔW1 is the width of the protrusion 4214 in the circumferential direction of the circle centered on the central axis X plus a design gap. The width ΔW2 is wider than the width ΔW1. In this embodiment, the recess 4230 is arranged in the edge ring 423 so that the major axis of the opening is along the radial direction of the circle centered on the central axis X.

[0091] Thus, by placing edge ring 423 on lower electrode 421 with protrusion 4214 inserted into recess 4230, the center axis of edge ring 423 can be substantially aligned with the center axis X of substrate W placed on electrostatic chuck 422. Furthermore, even if edge ring 423 thermally expands during processing of substrate W, deviation between the center axis of edge ring 423 and the center axis X of substrate W placed on electrostatic chuck 422 can be suppressed.

[0092] In addition, in the opening portion of the recess 4230, for example Figure 6 The arrangement shown is provided with an inclined portion. Figure 6 This is an enlarged cross-sectional view showing an example of the shapes of recess 4230 and protrusion 4214. Recess 4230 is provided with a first sidewall portion 4230a extending in the depth direction of recess 4230, and a first inclined portion 4230b whose width increases as it progresses from first sidewall portion 4230a toward the opening of recess 4230. Consequently, when edge ring 423 is placed on lower electrode 421, even if the position of recess 4230 and protrusion 4214 is slightly offset, edge ring 423 can be placed on lower electrode 421 with protrusion 4214 inserted into recess 4230. Consequently, the central axis of edge ring 423 can be easily aligned with the central axis X of substrate W placed on electrostatic chuck 422.

[0093] In addition, for example Figure 7 As shown, the inclination may also be formed on the side of the protrusion 4214 . Figure 7 4 is an enlarged cross-sectional view showing another example of the shape of the concave portion 4230 and the convex portion 4214. The convex portion 4214 of the lower electrode 421 is provided with: a second side wall portion 4214b extending from the base of the convex portion 4214 in the direction of the convex portion 4214; and a second inclined portion 4214a whose width narrows as it moves from the second side wall portion 4214b toward the front end of the convex portion 4214. In addition, for example, Figure 8 As shown, the inclination may also be formed in both the concave portion 4230 and the convex portion 4214 . Figure 8 It is an enlarged cross-sectional view showing another example of the shapes of the concave portion 4230 and the convex portion 4214 .

[0094] Furthermore, in this embodiment, the convex portion 4214 is provided on the lower electrode 421, and the concave portion 4230 is provided on the edge ring 423. However, the technology of the present invention is not limited to this. Alternatively, the concave portion may be provided on the lower electrode 421 and the convex portion may be provided on the edge ring 423, as long as the concave portion is provided on one of the lower electrode 421 and the convex portion is provided on the other.

[0095] In this embodiment, the opening of the recess 4230 provided in the edge ring 423 is shaped as an elongated hole, but the technology of the present invention is not limited to this. For example, the opening of the recess 4230 provided in the edge ring 423 may be shaped as a groove extending radially about a circle centered on the central axis X. In this case, the protrusion 4214 of the lower electrode 421 may be a protrusion extending radially about a circle centered on the central axis X, and the protrusion may have a shape corresponding to the shape of the opening of the recess 4230.

[0096] return Figure 2 The description continues. The upper electrode shower head assembly 43 is configured to be able to supply one or more gases from the gas supply part 44 into the processing space 41s. In the present embodiment, the upper electrode shower head assembly 43 includes an electrode support part 43d and an upper electrode 43e. The electrode support part 43d has a gas inlet 43a and a gas diffusion chamber 43b, and supports the upper electrode 43e on the lower surface. The gas supply part 44 and the gas diffusion chamber 43b are fluidically connected via the gas inlet 43a. A plurality of gas outlets 43c are formed in the electrode support part 43d and the upper electrode 43e, and the gas diffusion chamber 43b and the processing space 41s are fluidically connected via the plurality of gas outlets 43c. In the present embodiment, the upper electrode shower head assembly 43 is configured to be able to supply one or more gases from the gas inlet 43a via the gas diffusion chamber 43b and the plurality of gas outlets 43c into the processing space 41s.

[0097] The gas supply unit 44 includes multiple gas sources 440a to 440c, multiple flow controllers 441a to 441c, and multiple valves 442a to 442c. Gas source 440a is, for example, a source of process gas, gas source 440b is, for example, a source of cleaning gas, and gas source 440c is, for example, a source of inert gas. In this embodiment, the inert gas is, for example, nitrogen gas. Flow controllers 441a to 441c can include, for example, mass flow controllers or pressure-controlled flow controllers. Furthermore, the gas supply unit 44 can include one or more flow modulation devices for modulating or pulsing the flow of one or more process gases.

[0098] The RF power supply unit 45 is configured to supply RF power, for example, one or more RF powers, to one or more electrodes, such as the lower electrode 421, the upper electrode showerhead assembly 43, or both the lower electrode 421 and the upper electrode showerhead assembly 43. In this embodiment, the RF power supply unit 45 includes two RF generators 450a and 450b and two matching circuits 451a and 451b. The RF power supply unit 45 in this embodiment is configured to supply first RF power from the RF generator 450a to the lower electrode 421 via the matching circuit 451a. The RF spectrum encompasses a portion of the electromagnetic spectrum within the range of 3 Hz to 3000 GHz. For electromagnetic material processes such as semiconductor processes, the frequency of the RF spectrum used for plasma generation is preferably within the range of 100 kHz to 3 GHz, and more preferably within the range of 200 kHz to 150 MHz. For example, the frequency of the first RF power may be within the range of 27 MHz to 100 MHz.

[0099] Furthermore, the RF power supply unit 45 in this embodiment is configured to supply the second RF power from the RF generator 450b to the lower electrode 421 via the matching circuit 451b. For example, the frequency of the second RF power can be within the range of 400 kHz to 13.56 MHz. Alternatively, the RF power supply unit 45 may include a DC (direct current) pulse generator in place of the RF generator 450b.

[0100] Moreover, although not shown in the figure, other embodiments are considered here. For example, in the RF power supply unit 45 of the alternative embodiment, it can also be configured so that the RF generation unit supplies the first RF power to the lower electrode 421, and another RF generation unit supplies the second RF power to the lower electrode 421. Furthermore, it can also be configured so that another RF generation unit supplies the third RF power to the upper electrode shower head assembly 43. In addition, in another alternative embodiment, a DC voltage can also be applied to the upper electrode shower head assembly 43. In addition, further, in various embodiments, the amplitude of more than one RF power (i.e., the first RF power, the second RF power, etc.) can also be pulsed or modulated. Amplitude modulation can also include pulsing the amplitude of the RF power between the on state and the off state, or between multiple different on states. In addition, the phase matching of the RF power can be controlled, and the phase matching of the amplitude modulation of multiple RF powers can be synchronized or asynchronous.

[0101] The exhaust system 46 is connected to the exhaust port 41e provided at the bottom of the chamber 41, for example, via a pressure control valve 460. The pressure control valve 460 is an example of a second pressure control unit. The exhaust system 46 may include a pressure valve, a turbomolecular pump, a preliminary exhaust pump, or a vacuum pump composed of a combination thereof. A pipe 462 is connected between the pressure control valve 460 and the exhaust system 46 via a valve 461a. The pipe 462 is connected to the space outside the gate 401. The gas exhausted through the exhaust system 46 is exhausted from the exhaust pump of the exhaust system 46 to an exhaust gas treatment system that processes the exhaust gas. In addition, the pipe 462 is connected to the exhaust pump of the exhaust system 46 via a valve 461b.

[0102] [Component Conveying Device 50]

[0103] Figure 9 This figure shows an example of a component transport device 50 according to the first embodiment. The component transport device includes a container 51, a wafer cassette 52, multiple robot arms 53a-53b, and a moving mechanism 54. The container 51 has an opening 511 connected to the processing device 40, a shutter 512 for opening and closing the opening 511, and a lid 510. The container 51 houses the wafer cassette 52 and the multiple robot arms 53a-53b. The shutter 512 is an example of an opening and closing door. In the following, the multiple robot arms 53a-53b are collectively referred to as robot arms 53 without distinguishing between them.

[0104] The wafer box 52 stores a plurality of edge rings 423 before use. The wafer box 52 is an example of a component storage unit. In addition, the wafer box 52 also stores used edge rings 423 that have been replaced with the edge rings 423 before use. The wafer box 52 is placed on a loading table 521, and the loading table 521 can be raised and lowered by a driving unit 522. Thus, each robot arm 53 can take out the edge rings 423 stored in the wafer box 52 in an upper and lower arrangement from the wafer box 52. In the case where all the edge rings 423 in the wafer box 52 have become used edge rings 423, for example, Figure 10 As shown, the cover 510 is opened, the wafer cassette 52 is taken out from the container 51, and replaced with the wafer cassette 52 containing the plurality of edge rings 423 before use. Figure 10 This is a diagram showing an example of how the wafer cassette 52 is taken out.

[0105] The robot arm 53a has an end effector 530a at its distal end, and uses the end effector 530a to remove the edge ring 423 before use from the wafer cassette 52. Furthermore, the robot arm 53b can deliver the edge ring 423 after use from the processing device 40 through the opening 511 and store it in the wafer cassette 52. Furthermore, the robot arm 53a can deliver the edge ring 423 before use into the processing device 40 through the opening 511. In the following, when the end effectors 530a and 530b are collectively referred to without distinction, they are referred to as the end effector 530.

[0106] As described above, in this embodiment, the end effector 530a for transporting the edge ring 423 before use and the end effector 530b for transporting the edge ring 423 after use are independently provided. This prevents the edge ring 423 before use from being contaminated by reaction byproducts, etc., that have been peeled off from the edge ring 423 after use.

[0107] In this embodiment, the end effector 530a for transporting the edge ring 423 before use and the end effector 530b for transporting the edge ring 423 after use are each moved by a separate robotic arm. However, the technology of the present invention is not limited to this. As long as the end effector for transporting the edge ring 423 before use and the end effector for transporting the edge ring 423 after use are separately provided, both end effectors may be provided at the front end of a single robotic arm.

[0108] In this embodiment, the end effector 530b of the robot arm 53b supports the lower surface of the edge ring 423 when the used edge ring 423 is conveyed from the processing apparatus 40. This prevents reaction byproducts and the like adhering to the edge ring 423 from adhering to the end effector 530a.

[0109] Furthermore, in this embodiment, the robot arm 53a sequentially removes the unused edge rings 423, which are arranged vertically within the wafer cassette 52, from the bottom. Furthermore, in this embodiment, the robot arm 53b removes the unused edge rings 423 and stores the used edge rings 423 in the storage area of ​​the empty wafer cassette 52. As a result, the unused edge rings 423 are stored above the used edge rings 423 within the wafer cassette 52. This prevents reaction byproducts, etc., that have been peeled off from the used edge rings 423 from falling and adhering to the unused edge rings 423.

[0110] Furthermore, a space for storing edge rings 423 may be defined within the wafer cassette 52 for each stored edge ring 423. This prevents reaction byproducts and the like that have been peeled off from the used edge rings 423 from falling and adhering to the unused edge rings 423, regardless of where the used edge rings 423 are stored within the wafer cassette 52.

[0111] The moving mechanism 54 includes a main body 540 and wheels 541. The main body 540 is equipped with a power source such as a battery, a power source, and a steering mechanism. The wheels 541 are rotated by the power source within the main body 540, thereby moving the component transport device 50 in a direction controlled by the steering mechanism within the main body 540. Furthermore, the moving mechanism 54 may also use methods other than the wheels 541, such as a walking type, as long as it can move the component transport device 50.

[0112] The component transport device 50 also includes a communication unit 550, a control unit 551, a storage unit 552, a sensor 553, and an exhaust device 554. The exhaust device 554 is an example of a first pressure control unit. The communication unit 550 is, for example, a wireless communication circuit, and wirelessly communicates with the control unit 20. The sensor 553 senses the surroundings of the component transport device 50 and outputs the sensed results to the control unit 551. In this embodiment, the sensor 553 is, for example, an image sensor, which captures an image of the surroundings of the component transport device 50 and outputs the image to the control unit 551. The sensor 553 is an example of a first sensor.

[0113] The exhaust device 554 is connected to the space within the container 51 via a valve 556a and a pipe 555. The exhaust device 554 draws gas from the space within the container 51 via the valve 556a and the pipe 555, and discharges the drawn gas to the exterior of the component transport device 50 via an exhaust pump 557. This allows the interior of the container 51 to be depressurized to a predetermined vacuum level, thereby reducing moisture and other substances adhering to the edge ring 423 before use. Furthermore, since the pressure within the container 51 can be lower than the pressure within the processing device 40, when the component transport device 50 is connected to the processing device 40 and the gate 512 is opened, gas can flow from the processing device 40 into the container 51. This prevents particles within the container 51 from entering the processing device 40.

[0114] The pipe 555 is connected to the exhaust pump 557 via the valve 556b. When the wafer cassette 52 is replaced, for example, the valve 556b is opened and the space in the container 51 is returned to atmospheric pressure.

[0115] The storage unit 552 is a ROM (Read Only Memory), an HDD (Hard Disk Drive), or an SSD (Solid State Drive), and stores data and programs used by the control unit 551. The control unit 551 is a processor such as a CPU (Central Processing Unit) or a DSP (Digital Signal Processor), and controls the entire component transport device 50 by reading and executing the programs in the storage unit 552.

[0116] The control unit 551 controls the moving mechanism 54 using, for example, the sensing result of the sensor 553 , thereby moving the component transport device 50 to the position of the processing device 40 instructed by the control device 20 .

[0117] Furthermore, a cleaning mechanism 56 for cleaning the end effector 530b of the robot arm 53b is provided within the container 51. The cleaning mechanism 56 cleans the end effector 530b used to transport the used edge ring 423 using, for example, high-pressure gas purge or dry ice blasting. By cleaning the end effector 530b after transporting the used edge ring 423, particles adhering to the end effector 530b from the used edge ring 423 can be prevented from scattering into the space within the container 51.

[0118] Furthermore, a positional deviation detection sensor 57 is provided near the opening 511 of the container 51 to detect positional deviation of the edge ring 423 when the edge ring 423 passes through the opening 511 before use. Alternatively, the positional deviation detection sensor 57 may be provided near the gate 401 of the processing apparatus 40. The positional deviation detection sensor 57 is an example of a second sensor. In this embodiment, the positional deviation detection sensor 57 is, for example, a light shielding sensor. The positional deviation of the edge ring 423 detected by the positional deviation detection sensor 57 is input to the control unit 551. The control unit 551 controls the robot arm 53a to correct the deviation detected by the positional deviation detection sensor 57, thereby adjusting the position of the edge ring 423. Furthermore, the control unit 551 controls the robot arm 53a to place the adjusted edge ring 423 on the lift pins 48 protruding from the lower electrode 421. Thus, when the lift pins 48 descend, the protrusions 4214 of the lower electrode 421 can be inserted into the recesses 4230 of the edge ring 423 , and the edge ring 423 can be accurately positioned in a predetermined position within the processing apparatus 40 .

[0119] [Connection between the Processing Device 40 and the Component Conveying Device 50]

[0120] Figure 11 and Figure 12This is an enlarged cross-sectional view showing an example of a connection portion between the processing device 40 and the component transport device 50 of the first embodiment. In this embodiment, a convex portion 410 is provided on the side of the chamber 41 of the processing device 40 connected to the component transport device 50. In addition, a concave portion 513 having a shape corresponding to the convex portion 410 is provided on the side of the container 51 of the component transport device 50 connected to the processing device 40. When the convex portion 410 and the concave portion 513 are connected to the processing device 40 and the component transport device 50, for example, Figure 12 As shown, the alignment of the processing device 40 and the component conveying device 50 is supported by fitting.

[0121] In addition, a sealing member 514 such as an O-ring is arranged on the side of the container 51 of the component conveying device 50 so as to surround the opening 511. This improves the airtightness of the space 60 surrounded by the chamber 41, the gate 401, the container 51, and the gate 512. After the processing device 40 is connected to the component conveying device 50, the gas in the space 60 is exhausted via the pipe 462, thereby reducing the pressure in the space 60 to a predetermined vacuum level. Due to the reduced pressure in the space 60, the connection between the processing device 40 and the component conveying device 50 becomes more secure. In addition, when the connection between the processing device 40 and the component conveying device 50 is released, the valve 461b of the processing device 40 is opened to restore the atmospheric pressure in the space 60.

[0122] Furthermore, it is preferable that the convex portion 410 and the concave portion 513 be provided with inclined portions like the convex portion 4214 of the lower electrode 421 and the concave portion 4230 of the edge ring 423 .

[0123] [Structure of Control Device 20]

[0124] Figure 13 This is a block diagram showing an example of a control device 20. The control device 20 includes a storage unit 21, a control unit 22, a wireless communication unit 23, and a wired communication unit 24. The wireless communication unit 23 is, for example, a wireless communication circuit, and wirelessly communicates with each component transport device 50 via an antenna 25. The wired communication unit 24 is, for example, a NIC (Network Interface Card), and communicates with each processing unit 30. Furthermore, the control device 20 can also wirelessly communicate with each processing unit 30.

[0125] The storage unit 21 is a ROM, HDD or SSD, etc., and stores data or programs used by the control unit 22. For example, the storage unit 21 stores Figure 14 The reservation table 210 is shown.

[0126] Figure 14This figure shows an example of a reservation table 210. The reservation table 210 stores a component ID, a processing device ID, a replacement date and time, an RF cumulative time, a next replacement period, and a component transport device ID. The component ID is information that identifies each edge ring 423. The processing device ID is information that identifies the processing device 40 on which the edge ring 423 identified by the corresponding component ID is mounted. The replacement date and time is the date and time when the edge ring 423 was replaced. The RF cumulative time is information that indicates the cumulative time of processing performed in the processing device 40 using RF power. The next replacement period is the date and time when the edge ring 423 is next replaced. The component transport device ID is information that identifies the component transport device 50 for which the edge ring 423 identified by the corresponding component ID is scheduled for replacement.

[0127] The control unit 22 is a processor such as a CPU or a DSP, and controls the entire control device 20 by reading and executing the program in the storage unit 21 .

[0128] [Replacement time for consumable parts]

[0129] Figure 15 This diagram illustrates an example of the timing for replacing the edge ring 423. The control unit 22 of the control device 20 estimates the replacement time t1 for each edge ring 423 and registers the estimated replacement time t1 in the "Next Replacement Time" column of the schedule table 210. If substrate W is not processed after the edge ring 423 is replaced, the control device 20 registers the standard replacement time t1 calculated based on the "Replacement Date and Time" of the edge ring 423 in the "Next Replacement Time" column.

[0130] On the other hand, if substrate W has already been processed after edge ring 423 has been replaced, control device 20 registers the replacement time t1 estimated based on the "replacement date and time" and "RF cumulative time" of edge ring 423 in the "next replacement time" column. Control unit 22, for example, estimates the date and time when the "RF cumulative time" reaches a predetermined value based on the trend of changes in the "RF cumulative time" since the "replacement date and time" and registers the estimated date and time in the "next replacement time" column. Control unit 22 updates the "next replacement time" each time the "RF cumulative time" is updated, for example. The step of estimating the replacement time of edge ring 423 is an example of the first estimation step.

[0131] In this embodiment, the control unit 22 estimates the replacement time t1 of the edge ring 423 based on the "accumulated RF time," but the technology of the present invention is not limited to this. For example, the control unit 22 may estimate the replacement time t1 of the edge ring 423 based on at least one of the "accumulated RF time," "accumulated RF power," "accumulated recipe time," "changes in the weight of consumable components," and "changes in the size of consumable components." "Accumulated RF power" refers to the product of the processing time using RF power in the processing device 40 multiplied by the power value, while "accumulated recipe time" refers to the accumulated time of a specific processing recipe that consumes particularly high amounts of consumable components.

[0132] Furthermore, the control unit 22 determines the time t2 at which processing of the substrates W in the processing apparatus 40 finally ends, before the "next replacement time," for each edge ring 423. In this embodiment, the control unit 22 determines the end of processing for each batch of substrates W. This prevents significant changes in the processing environment within a batch. Alternatively, the control unit 22 may determine the end of processing for each substrate W, as another example.

[0133] After the process ends at time t2, processing apparatus 40 prepares for edge ring 423 replacement during a preparation time ΔT1. Preparation time ΔT1 is the time required for gas exchange within processing apparatus 40, pressure adjustment within processing apparatus 40, and temperature stabilization of edge ring 423. Control unit 22 determines time t3, which is the time after preparation time ΔT1 has elapsed from time t2, as the time at which edge ring 423 can be replaced. The step of determining the time at which edge ring 423 can be replaced is an example of a determination step.

[0134] At the replaceable time t3, in order to replace the edge ring 423, after the component transport device 50 is connected to the processing device 40, preparation for replacing the edge ring 423 is required. The preparation time ΔT2 is the space 60 between the gate 401 and the gate 512 (refer to Figure 12 ) is the time required to reduce the pressure to the predetermined pressure. The control unit 22 estimates the preparation time ΔT2. The preparation time ΔT2 is an example of the first preparation time. The step of estimating the preparation time ΔT2 is an example of the third estimation step.

[0135] In order to complete preparations for replacing the edge ring 423 at the replaceable time t3, it is necessary to complete movement of the component transport device 50 to the position of the processing device 40 at time t4, which is earlier than the replaceable time t3 by the preparation time ΔT2. The movement time ΔT3 is the time required for the component transport device 50 to move to the position of the processing device 40 where the edge ring 423 needs to be replaced. The control unit 22 estimates the movement time ΔT3. The movement time ΔT3 is an example of the first movement time. The step of estimating the movement time ΔT3 is an example of the second estimation step. The component transport device 50 only needs to start moving before time t5, which is earlier than time t4 by the movement time ΔT3. The control unit 22 manages the positions of each processing device 40 and the positions of each component transport device 50 and can estimate the time required for each component transport device 50 to move to the position of each processing device 40.

[0136] The control unit 22 sets the time t before the time t5 which is the sum of the preparation time ΔT2 and the movement time ΔT3 before the replacement possible time t3. p , a replacement instruction is sent to the component transport device 50, thereby instructing the component transport device 50 to replace the edge ring 423. The step of sending the replacement instruction is an example of the sending step.

[0137] Furthermore, in order to replace the edge ring 423 at the replaceable time t3, the pressure within the component transport device 50 must be reduced to a predetermined pressure. The pressure adjustment time ΔT4 is the time required for the pressure within the container 51 to be reduced to the predetermined pressure. Therefore, the component transport device 50 must begin adjusting the pressure within the component transport device 50 before time t6, which is earlier than the replaceable time t3 by the pressure adjustment time ΔT4.

[0138] Here, if the edge ring 423 is not replaced immediately after the wafer cassette 52 is replaced, the pressure within the component transport device 50 becomes higher than the predetermined pressure, and the pressure adjustment time ΔT4 becomes longer. On the other hand, if the edge ring 423 is replaced immediately after the component transport device 50 is replaced, the pressure within the component transport device 50 becomes closer to the predetermined pressure, and the pressure adjustment time ΔT4 becomes shorter. Therefore, the relationship between times t5 and t6 varies depending on the state of the component transport device 50.

[0139] Based on the above, it is necessary to instruct the component transport device 50 to replace the edge ring 423 of the processing device 40 before the time t5 or t6 that is earlier than the replacement time of the edge ring 423. Therefore, the control unit 22 instructs the component transport device 50 to replace the edge ring 423 at a time t6 that is earlier than the replacement time of the edge ring 423 by a time ΔT0. P , and at a time earlier than time t5 and t6, that is, time t P, the component transport device 50 is instructed to replace the edge ring 423 of the processing device 40. This can shorten the stop period of the processing device 40 during the replacement of the edge ring 423, and can suppress the reduction in production efficiency associated with the replacement of the edge ring 423.

[0140] [Processing by the Control Device 20]

[0141] Figure 16 This is a flowchart showing an example of processing of the control device 20 when moving the component transport device 50 to the position of the processing device 40 to be replaced with the consumable component. Figure 16 The processing shown is realized by the control unit 22 of the control device 20 executing a program read from the storage unit 21. The control device 20 controls the plurality of processing devices 40 and the component transport device 50.

[0142] First, the control unit 22 refers to the schedule table 210 to identify edge rings 423 that are not scheduled for replacement (S100). For example, the control unit 22 identifies edge rings 423 with component IDs not associated with component transporter IDs as edge rings that are not scheduled for replacement. The control unit 22 then determines whether any of the identified edge rings 423 are due for replacement between the current time and the scheduled time ΔT0 (S101). If no edge ring 423 is due for replacement between the current time and the time ΔT0 (S101: No), the control unit 22 repeats the process shown in step S100.

[0143] On the other hand, if an edge ring 423 whose replacement time has come within the time ΔT0 from the current time is present ( S101 : YES), the control unit 22 determines the movement start time ( S102 ). The movement start time is the earlier time between time t5 and time t6 .

[0144] Next, the control unit 22 selects a component transport device 50 that is closest to the processing device 40 requiring replacement of the edge ring 423 (S103). In step S103, not only the linear distance between the processing device 40 and the component transport device 50 is considered, but also the length of the path the component transport device 50 would take when moving to the location of the processing device 40. The control unit 22 then references the reservation table 210 in the storage unit 21 to determine whether the component transport device ID of the component transport device 50 selected in step S103 is registered in the reservation table 210 (S104).

[0145] If the component transport device ID is not registered in the reservation table 210 (S104: No), the control unit 22 executes the next process. Specifically, the control unit 22 associates the component ID of the edge ring 423 determined to be due for replacement within time ΔT0 in step S101 and registers the component transport device ID of the selected component transport device 50 in the reservation table 210 (S106). This schedules the selected component transport device 50 for replacement of the edge ring 423 determined to be due for replacement within time ΔT0 in step S101.

[0146] Next, the control unit 22 transmits a replacement instruction to the selected component transport device 50, instructing the replacement of the edge ring 423 (S107). The replacement instruction includes information such as the position information of the processing device 40 required for replacing the edge ring 423 and the component ID of the edge ring 423. The control unit 22 then performs the process shown in step S100 again.

[0147] On the other hand, if the component transport device ID is already registered in the reservation table 210 (S104: Yes), that is, if the component transport device 50 selected in step S103 has already been reserved, the control unit 22 performs the next process. Specifically, the control unit 22 extracts the "next replacement time" associated with the component transport device ID determined to be registered in the reservation table 210 in step S104 from the reservation table 210. If the component transport device ID is associated with multiple "next replacement times," the control unit 22 extracts the latest "next replacement time."

[0148] The control unit 22 then determines whether the movement start time determined in step S102 is later than the extracted "next replacement time" (S105). If the movement start time is later than the "next replacement time" (S105: Yes), the component transport device 50 can replace the edge ring 423 after the scheduled replacement of the edge ring 423 is completed. Therefore, the control unit 22 performs the process shown in step S106.

[0149] On the other hand, if the movement start time is earlier than the "next replacement time" (S105: No), the selected component transport device 50 cannot start moving toward the processing device 40 having the edge ring 423 that needs to be replaced until the replacement of the other edge rings 423 is completed. Therefore, the control unit 22 instructs the component transport device 50 that is next closest to the processing device 40 that needs to replace the edge ring 423 among the other component transport devices 50 to replace the edge ring 423.

[0150] For example, the control unit 22 determines whether there are other unselected component transport devices 50 (S108). If there are other unselected component transport devices 50 (S108: Yes), the control unit 22 selects the component transport device 50 that is closest to the processing device 40 that requires replacement of the edge ring 423 (S109). The control unit 22 then performs the process shown in step S104 again.

[0151] On the other hand, if all the component transport devices 50 have been selected (S108: No), the control unit 22 refers to the reservation table 210 and selects the component transport device 50 that has completed the replacement of the edge ring 423 the earliest (S110). Then, the control unit 22 performs the process shown in step S106.

[0152] Figure 17 This is a flowchart showing an example of processing by the control device 20 when controlling the processing device 40 as a replacement target for consumable parts and the parts transport device 50 connected to the processing device 40 . Figure 17 , the processing of the control device 20 when controlling one processing device 40 as a replacement target of consumable parts and one component transport device 50 connected to the processing device 40 is exemplified. In addition, the processing of the control device 20 when controlling other processing devices 40 as replacement targets of consumable parts and other component transport devices 50 connected to the processing device 40 is also exemplified. Figure 17 The illustrated flowchart is implemented in the same manner. Figure 17 The processing shown is realized by the control unit 22 of the control device 20 executing a program read from the storage unit 21. The control device 20 controls the plurality of processing devices 40 and the component conveying device 50.

[0153] First, the control unit 22 determines whether or not a process using RF power is being performed in the processing device 40 (S120). If a process using RF power is not being performed (S120: No), the control unit 22 performs the process shown in step S120 again.

[0154] On the other hand, if processing using RF power is performed (S120: YES), the control unit 22 updates the "RF cumulative time" associated with the processing device ID of the processing device 40 that performed the processing using RF power in the reservation table 210 (S121). Furthermore, the control unit 22 calculates the "next replacement time" for the edge ring 423 for which the "RF cumulative time" has been updated, and updates the "next replacement time" associated with the "component ID" of the edge ring 423 according to the calculated "next replacement time" (S122). Thus, the "next replacement time" corresponding to the edge ring 423 is updated based on the actual processing time using RF power.

[0155] Next, the control unit 22 determines whether the processing of the last batch of consumable parts before the replacement time has been completed based on the updated "next replacement time" (S123). If the processing of the last batch of consumable parts before the replacement time has not been completed in the processing device 40 (S123: No), the control unit 22 performs the process shown in step S120 again.

[0156] On the other hand, if the processing of the last batch before the replacement time of the consumable parts in the processing device 40 has been completed (S123: YES), the control unit 22 controls the processing device 40 for which the processing of the batch has been completed to clean the interior of the chamber 41 (S124). This can remove reaction byproducts and the like adhering to the edge ring 423 after use, and suppress the scattering of reaction byproducts and the like when the edge ring 423 is transported.

[0157] Alternatively, the cleaning in step S124 may be performed after edge ring 423 is lifted by lift pins 48 and moved so as to be separated from lower electrode 421 to which edge ring 423 is attached. This allows the removal of reaction byproducts and the like adhering not only to the top surface of edge ring 423 but also to the side surfaces of edge ring 423 and the top surface of lower electrode 421 to which edge ring 423 is attached.

[0158] Next, the pressure in the chamber 41 of the processing apparatus 40 after the batch processing is completed is adjusted (S125). In step S125, the gas in the chamber 41 is exhausted and an inert gas is supplied to the chamber 41. Then, the pressure in the chamber 41 is controlled to a predetermined pressure P1.

[0159] Next, the control unit 22 determines whether a connection notification is received from the component conveying device 50 (S126). Figure 16 In the illustrated process, one component transport device 50 moves to the position of the processing device 40 to be replaced with the consumable component. If no connection notification is received from the component transport device 50 (S126: No), the control unit 22 executes the process shown in step S126 again.

[0160] On the other hand, if a connection notification is received from the component transport device 50 (S126: YES), the control unit 22 controls the exhaust system 46 and valve 461a of the processing device 40 to exhaust the gas in the space 60 at the connection point between the processing device 40 and the component transport device 50 (S127). As a result, the pressure in the space 60 at the connection point between the processing device 40 and the component transport device 50 is reduced to a predetermined pressure P2. In this embodiment, pressure P2 is lower than pressure P1. The control unit 22 then transmits a gate opening request to the component transport device 50 from which the connection notification was sent, requesting the opening of the gate 512 of the component transport device 50 (S128).

[0161] Next, the control unit 22 determines whether a gate opening notification indicating that the gate 512 has been opened has been received from the component transport device 50 (S129). If no gate opening notification has been received (S129: No), the control unit 22 performs the process shown in step S129 again.

[0162] On the other hand, if the gate opening notification has been received (S129: YES), the control unit 22 controls the processing device 40 to lift the edge ring 423 using the lifting pins 48 and open the gate 401 (S130). The control unit 22 also transmits a replacement start instruction to the component transport device 50 to start replacement of the edge ring 423 (S131).

[0163] Furthermore, after the replacement start instruction is issued in step S131, the edge ring 423 is replaced by the component transport device 50. At this time, the control unit 22 controls the processing device 40 so that the interior of the chamber 41 of the processing device 40 is cleaned between the time the used edge ring 423 is transported out and the time the unused edge ring 423 is transported in. This allows the removal of reaction byproducts and the like that have fallen into the processing device 40 after the used edge ring 423 is removed during the transport of the unused edge ring 423 before the unused edge ring 423 is transported in.

[0164] Next, the control unit 22 determines whether or not a replacement completion notification has been received from the component transport device 50 (S132). If a replacement completion notification has not been received from the component transport device 50 (S132: No), the control unit 22 performs the process shown in step S132 again.

[0165] On the other hand, when receiving a replacement completion notification from the component conveying device 50 (S132: Yes), the control unit 22 controls the processing device 40 to close the gate 401 (S133). In addition, the control unit 22 sends a replacement confirmation notification to the component conveying device 50 (S134). In addition, the control unit 22 stops exhausting the gas in the space 60 of the connection portion between the processing device 40 and the component conveying device 50 by controlling the exhaust system 46 and the valve 461a of the processing device 40 (S135). In addition, the control unit 22 returns the space 60 of the connection portion between the processing device 40 and the component conveying device 50 to atmospheric pressure by opening the valve 461b of the processing device 40.

[0166] Next, the control unit 22 deletes the record containing the "component ID" of the replaced edge ring 423 in the reservation table 210. Furthermore, the control unit 22 creates a new record containing the "component ID" of the unused edge ring 423 that was replaced with the used edge ring 423 in the reservation table 210 (S136). In this newly created record, the identification information of the processing device 40 whose edge ring 423 was replaced is entered in the "Processing Device ID" column, the current date and time is entered in the "Replacement Date and Time" column, and 0 is entered in the "RF Accumulated Time" column. Furthermore, the "Component Transport Device ID" column is left blank.

[0167] Then, the control unit 22 estimates the replacement time of the replaced edge ring 423 before use, and registers the estimated replacement time in the "next RF cumulative time" of the newly created record (S137). Then, the control unit 22 performs the process shown in step S120 again.

[0168] [Processing of the Component Conveying Device 50]

[0169] Figure 18 This is a flowchart showing an example of the processing of the component conveying device 50. Figure 18 The processing shown is realized by the control unit 551 executing the program read from the storage unit 552. Figure 18 Different from the process illustrated in , the control unit 551 receives a replacement instruction via the communication unit 550 and stores the received replacement instruction in the storage unit 552.

[0170] First, the control unit 551 refers to the storage unit 552 to determine whether there is an unprocessed replacement instruction (S200). If there is no unprocessed replacement instruction (S200: No), the control unit 551 performs the process shown in step S200 again.

[0171] If there is an unprocessed replacement instruction (S200: Yes), the control unit 551 starts moving the component transport device 50 to the position of the processing device 40 corresponding to the position information included in the replacement instruction (S201). Step S201 is an example of a start step. The control unit 551 controls the moving mechanism 54 based on the sensing results of the sensor 553, for example, to move the component transport device 50 to the position of the processing device 40 corresponding to the position information included in the replacement instruction. The control unit 551 also controls the exhaust device 554 and valve 556 to start exhausting the gas in the container 51 of the component transport device 50, thereby starting to adjust the pressure in the container 51 (S202).

[0172] Next, the control unit 551 determines whether the component transport device 50 is connected to the processing device 40 (S203) based on the detection result of the sensor 553. If the component transport device 50 is not connected to the processing device 40 (S203: No), the control unit 551 performs the process shown in step S203 again.

[0173] On the other hand, if the component transport device 50 is already connected to the processing device 40 (S203: YES), the control unit 551 transmits a connection notification to the control device 20 via the communication unit 550 (S204). The control unit 551 then controls the robot arm 53a to remove the edge ring 423 before use from the wafer cassette 52 (S205).

[0174] Next, the control unit 551 determines whether a gate opening request has been received from the control device 20 via the communication unit 550 (S206). If the gate opening request has not been received (S206: No), the control unit 551 performs the process shown in step S206 again.

[0175] On the other hand, when the gate opening request is received (S206: YES), the control unit 551 determines whether the pressure P in the container 51 of the component transport device 50 has reached the predetermined pressure P2 (S207). The pressure P2 is adjusted by the space 60 of the connection portion (refer to Figure 12 ) is the same pressure P2. If the pressure P does not reach the pressure P2 (S207: No), the control unit 551 performs the process shown in step S207 again. Step S207 is an example of a preparation step.

[0176] During replacement of the edge ring 423, the pressure in the chamber 41 of the processing apparatus 40 is controlled to P1, while the pressure in the space 60 connecting the processing apparatus 40 and the component transport apparatus 50 and in the container 51 of the component transport apparatus 50 are controlled to P2, which is lower than P1. Consequently, when the gate 401 of the processing apparatus 40 and the gate 512 of the component transport apparatus 50 are opened, a flow of gas is generated from the chamber 41 of the processing apparatus 40 into the container 51 of the component transport apparatus 50. This prevents particles in the component transport apparatus 50 from entering the processing apparatus 40.

[0177] Furthermore, if the difference between the pressure P1 in the processing device 40 and the pressure P2 in the connection portion between the processing device 40 and the component transport device 50 is too small, particles in the component transport device 50 may intrude into the processing device 40. On the other hand, if the difference between the pressure P1 and the pressure P2 is too large, particles in the component transport device 50 may be swept up. Therefore, the difference between the pressure P1 and the pressure P2 is preferably 10 Pa or more. 4 Pa.

[0178] If the pressure P reaches pressure P2 (S207: YES), the control unit 551 opens the gate 512 (S208). Furthermore, the control unit 551 determines whether a replacement start instruction has been received from the control device 20 via the communication unit 550 (S209). If no replacement start instruction has been received (S209: NO), the control unit 551 performs the process shown in step S209 again.

[0179] On the other hand, if a replacement start instruction has been received (S209: YES), the control unit 551 controls the robot arm 53b so that the end effector 530b is inserted into the processing device 40 and receives the used edge ring 423 lifted by the lift pins 48 (S210). Furthermore, the control unit 551 controls the robot arm 53b so that the end effector 530b is retracted into the component transport device 50 and the used edge ring 423 is stored in the wafer cassette 52. Step S210 is an example of a storage step.

[0180] Next, the control unit 551 controls the robot arm 53a to insert the end effector 530a carrying the unused edge ring 423 into the processing device 40 and transfer the unused edge ring 423 to the lift pins 48 (S211). The control unit 551 then controls the robot arm 53a to retract the end effector 530a into the component transport device 50. The unused edge ring 423 is lowered by the lift pins 48 and placed on the lower electrode 421. Step S211 is an example of a transfer step.

[0181] Next, the control unit 551 closes the shutter 512 (S212). Step S212 is an example of a closing step. Furthermore, the control unit 551 transmits a replacement completion notification to the control device 20 via the communication unit 550 (S213).

[0182] Next, the control unit 551 controls the robot arm 53b to move the end effector 530b to the vicinity of the cleaning mechanism 56, and controls the cleaning mechanism 56 to clean the end effector 530b (S214).

[0183] Next, the control unit 551 determines whether a replacement confirmation notification has been received from the control device 20 via the communication unit 550 (S215). If the replacement confirmation notification has not been received (S215: No), the control unit 551 performs the process shown in step S215 again.

[0184] On the other hand, when the replacement confirmation notification is received (S215: YES), the control unit 551 determines whether any unused edge ring 423 remains in the wafer cassette 52 (S216). The control unit 551 determines whether any unused edge ring 423 remains in the wafer cassette 52 based on, for example, the number of edge rings 423 stored in the wafer cassette 52 and the number of replacements.

[0185] If unused edge rings 423 remain in the wafer cassette 52 (S216: Yes), the control unit 551 performs the process shown in step S200 again. On the other hand, if unused edge rings 423 do not remain in the wafer cassette 52 (S216: No), the control unit 551 controls the moving mechanism 54 to move the component transport device 50 to the replacement location for the wafer cassette 52. The wafer cassette 52 in the component transport device 50 is then replaced with the wafer cassette 52 containing the unused edge rings 423 (S217). The control unit 551 then performs the process shown in step S200 again.

[0186] Furthermore, in this embodiment, if no unused edge rings 423 remain in the wafer cassette 52, the component transport device 50 moves to the wafer cassette 52 replacement location to replace the wafer cassette 52. However, the technology of the present invention is not limited to this. For example, an AGV (Automated Guided Vehicle) or the like can transport the wafer cassette 52 containing the unused edge rings 423 to the location of the component transport device 50 to replace the wafer cassette 52.

[0187] Furthermore, when the wafer cassette 52 is replaced, the pressure inside the container 51 of the component transport device 50 reaches atmospheric pressure, and it takes time to reduce the pressure to the pressure P2 required for replacing the edge ring 423. Therefore, when replacing the wafer cassette 52, the control unit 551 preferably controls the exhaust device 554 to exhaust the gas inside the container 51 and reduce the pressure inside the container 51 to the pressure P2 required for replacing the edge ring 423. This allows the component transport device 50 to more quickly begin replacing the edge ring 423 upon receiving a replacement instruction from the control device 20.

[0188] The first embodiment has been described above. As described above, the replacement method of this embodiment is a component replacement method in a processing system 10, which includes: a processing device 40 that processes a substrate W; a component transport device 50 that transports consumable components set in the processing device 40; and a processing assembly 30 that controls the processing device 40 and the component transport device 50, wherein the control device 20 implements a first calculation step, a determination step, a second calculation step, a third calculation step, and a sending step. In the first calculation step, the replacement period of the consumable components of the processing device 40 is calculated. In the determination step, during the period before the replacement period, the time after the processing of the substrate W by the processing device 40 is finally completed is determined as the time when the consumable components can be replaced. In the second calculation step, the first movement time required for the component transport device 50 to move to the position of the processing device 40 where the consumable components need to be replaced is calculated. In the third calculation step, the first preparation time required for the component transport device 50, which has moved to the position of the processing device 40 where the consumable components need to be replaced, to prepare for the replacement of the consumable components is calculated. In the sending step, a replacement instruction is sent to the component transport device 50 at a time prior to the replacement possible time by the sum of the first movement time and the first preparation time, thereby instructing the component transport device 50 to replace the consumable component. This can shorten the downtime period of the processing device 40 associated with the replacement of the consumable component.

[0189] In the above embodiment, the component transport device 50 includes a container 51, a wafer cassette 52, a robot 53, a moving mechanism 54, a communication unit 550, and a control unit 551. The wafer cassette 52 can store both pre- and post-use consumable components. The container 51 has an opening 511 connected to the processing device 40 and a shutter 512 for opening and closing the opening 511, and stores the wafer cassette 52. The robot 53 can remove post-use consumable components from the processing device 40 through the opening 511 and store them in the wafer cassette 52. Furthermore, the robot 53 can remove pre-use consumable components from the wafer cassette 52 and then transport them into the processing device 40 through the opening 511. The moving mechanism 54 has a power source and moves the component transport device 50. The communication unit 550 wirelessly communicates with the control unit 20. The control unit 551 performs a start step, a preparation step, a storage step, a transfer step, and a closing step. In the start step, when a replacement instruction is sent from the control device 20, the moving mechanism 54 is used to start moving the component transport device 50 to the position of the processing device 40 where the consumable component needs to be replaced. In the preparation step, after moving to the position of the processing device 40 where the consumable component needs to be replaced, preparations are made until the consumable component is ready for replacement. In the storage step, when replacement is ready, the gate 512 is opened, and the used consumable component is delivered from the processing device 40 through the opening 511 and stored in the wafer cassette 52. In the delivery step, the consumable component before use is removed from the wafer cassette 52 and delivered to the processing device 40 through the opening 511. In the closing step, the gate 512 is closed. This makes it possible to easily replace the consumable component.

[0190] Furthermore, in the above-described embodiment, the component transport device 50 includes an exhaust device 554 for controlling the pressure within the container 51. Furthermore, the processing device 40 includes a pressure control valve 460 for controlling the pressure in the chamber 41 defining the processing space 41s within the processing device 40. At the time of replacement, the control device 20 controls the component transport device 50 and the processing device 40 so that the pressure within the chamber 41 is higher than the pressure within the container 51. This prevents particles within the component transport device 50 from entering the processing device 40 during replacement of consumable components.

[0191] In the above embodiment, the control device 20 controls the component conveying device 50 and the processing device 40 so that the pressure difference between the pressure in the container 51 and the pressure in the chamber 41 becomes 10 Pa or more. 4 The pressure difference is within a range of Pa or less. This can suppress the intrusion of particles from the component transport device 50 into the processing device 40 and the scattering of particles within the component transport device 50 during replacement of consumable components.

[0192] Furthermore, in the above-described embodiment, the control device 20 estimates the replacement time of consumable components based on at least one of the following: the accumulated RF time, the accumulated RF power, the accumulated regimen time, the change in the weight of the consumable components, and the change in the size of the consumable components. This allows for highly accurate estimation of the replacement time of consumable components.

[0193] Furthermore, in the above-described embodiment, the processing system 10 includes multiple component transport devices 50. The control device 20 transmits the replacement instruction to the component transport device 50 closest to the processing device 40 where the consumable component needs to be replaced. This shortens the travel distance of the component transport device 50, enabling more rapid replacement of consumable components.

[0194] Furthermore, in the above-described embodiment, the control device 20 controls the processing device 40 so that the used consumable parts are cleaned before being discharged from the processing device 40. This removes reaction byproducts adhering to the used consumable parts and suppresses the scattering of reaction byproducts when the used consumable parts are discharged.

[0195] Furthermore, in the above-described embodiment, the control device 20 controls the processing device 40 to move the used consumable components so that they are separated from the base component on which they are mounted, and then clean the used consumable components. This allows the removal of reaction byproducts not only on the top surface of the consumable components but also on the side surfaces of the consumable components and the surface of the base component on which the consumable components are mounted.

[0196] Furthermore, in the above-described embodiment, the control device 20 controls the processing device 40 so that the area within the processing device 40 where the used consumables were placed is cleaned from the time the used consumables are discharged from the processing device 40 until the time the used consumables are fed into the processing device 40. Thus, when the used consumables are discharged, reaction byproducts and the like that have fallen into the processing device 40 after being separated from the consumables can be removed before the used consumables are fed into the processing device 40.

[0197] (Second embodiment)

[0198] In the first embodiment, an exhaust device 554 is provided in the component conveying device 50, and the gas in the component conveying device 50 is exhausted to the outside of the component conveying device 50 through the exhaust device 554, thereby reducing the pressure in the component conveying device 50. In contrast, in this embodiment, when the component conveying device 50 is connected to the processing device 40, the gas in the component conveying device 50 is exhausted through the exhaust system 46 of the processing device 40. As a result, the exhaust device 554 is not required in the component conveying device 50, and the component conveying device 50 can be miniaturized. In addition, the system structure of the processing system 10 of this embodiment is different from that of the processing system 10 using Figure 1 The system configuration of the processing system 10 of the first embodiment described above is the same, and therefore description thereof will be omitted.

[0199] [Structure of Processing Device 40]

[0200] Figure 19 1 is a diagram showing an example of a processing device 40 according to the second embodiment. Figure 19 In the Figure 2 The same reference numerals as those in the Figure 2 The structures are the same or have the same functions, so the description is omitted.

[0201] The pipe 462 connected between the pressure control valve 460 and the exhaust system 46 branches into a pipe 462a and a pipe 462b. By opening the valve 461a, the gas can be exhausted by the exhaust system 46 via the pipes 462a and 462b.

[0202] Furthermore, a pipe 443 is provided on the side of chamber 41 on the side where gate 401 is provided. Pipe 443 is connected to valves 442a to 442c via valve 442d. By closing valves 442a and 442b and opening valves 442c and 442d, an inert gas at a flow rate controlled by flow controller 441c can be supplied into pipe 443.

[0203] [Structure of the Component Conveying Device 50]

[0204] Figure 20 1 is a diagram showing an example of a component conveying device 50 according to the second embodiment. Figure 20 Marked with Figure 9 Structures with the same reference numerals as Figure 9 The structures are the same or have the same functions, so the description is omitted.

[0205] The pipe 555 is disposed between the side surface of the container 51 on the side where the gate 512 is provided and the space within the container 51. The pipe 555 is provided with a valve 556. In this embodiment, the exhaust device 554 is not provided in the component conveying device 50. The pipe 555 is an example of an exhaust pump.

[0206] Moreover, a pipe 560 is provided on the side surface of the container 51 on the side where the shutter 512 is provided. The pipe 560 is connected to the cleaning mechanism 56. The pipe 560 is provided with a valve 561.

[0207] [Connection between the Processing Device 40 and the Component Conveying Device 50]

[0208] Figure 21 1 is an enlarged cross-sectional view showing an example of a connection portion between the processing device 40 and the component conveying device 50 of the second embodiment. Figure 21 Marked with Figure 11 The same reference numerals as those in the Figure 11 The structures are the same or have the same functions, so the description is omitted.

[0209] The opening 462c of the pipe 462b and the opening 555a of the pipe 555 are formed at opposing positions when the processing device 40 is connected to the component transport device 50. Furthermore, a sealing member 516, such as an O-ring, is disposed on the side of the container 51 of the component transport device 50 so as to surround the opening 555a. Thus, when the processing device 40 and the component transport device 50 are connected, the pipe 462b and the pipe 555 are in airtight communication.

[0210] After the processing apparatus 40 is connected to the component transport apparatus 50, the valve 461a of the processing apparatus 40 is opened, and the gas is exhausted by the exhaust system 46. As a result, the gas in the container 51 of the component transport apparatus 50 can be exhausted through the pipe 462b and the pipe 555. Thus, even if the exhaust device 554 is not provided in the component transport apparatus 50, the pressure in the container 51 can be reduced, and the component transport apparatus 50 can be miniaturized.

[0211] Furthermore, the opening 443a of the pipe 443 and the opening 560a of the pipe 560 are formed at opposing positions when the processing device 40 is connected to the component transport device 50. Furthermore, a sealing member 515, such as an O-ring, is disposed on the side of the container 51 of the component transport device 50 so as to surround the opening 560a. Thus, when the processing device 40 and the component transport device 50 are connected, the pipe 443 and the pipe 560 are in airtight communication.

[0212] After the edge ring 423 is replaced, while the processing device 40 is connected to the component transport device 50, valves 442a and 442b of the processing device 40 are closed, valves 442c and 442d are opened, and valve 561 of the component transport device 50 is opened. This allows inert gas to be supplied to the cleaning mechanism 56 of the component transport device 50. The cleaning mechanism 56 cleans the end effector 530b by high-pressure gas purging using the inert gas supplied via the pipe 560. This eliminates the need for an inert gas supply source within the component transport device 50, allowing the component transport device 50 to be miniaturized.

[0213] (Third embodiment)

[0214] Unlike the component transport device 50 in the first and second embodiments, which replaces a single consumable component, the edge ring 423, the component transport device 50 in this embodiment replaces multiple types of consumable components. Examples of these multiple types of consumable components include the edge ring 423 and the upper electrode 43e.

[0215] The wafer cassette 52 stores multiple types of consumable components, both before and after use. In this embodiment, a storage space for each type of consumable component is defined within the wafer cassette 52. This prevents reaction byproducts, etc., from adhering to a specific type of used consumable component and depositing them onto other types of unused consumable components within the wafer cassette 52, even when replacement of a specific type of consumable component is frequent. Furthermore, each type of consumable component is stored in a separate wafer cassette 52, and the component transport device 50 can accommodate a separate wafer cassette 52 for each type.

[0216] Here, different types of consumables may have different replacement cycles. Therefore, the replacement schedules for different types of consumables often differ. In these cases, processing may be stopped to replace a consumable, and then, after resuming processing, it may be stopped again within a short period of time to replace another consumable. In this case, if the replacement schedules for multiple consumables are close, replacing them during the processing stoppage can shorten the processing stoppage time and improve production efficiency.

[0217] Figure 22 This is an explanatory diagram for explaining an example of the replacement timing of consumable parts in the third embodiment. short The replacement period t of the first consumable part s , and longer replacement cycle LT long The replacement period t of the second consumable part lThe time difference ΔLT is greater than the replacement period LT short In the case of short, during the replacement period t s Replace both the first consumable component and the second consumable component. Replacement cycle LT short is an example of the first replacement cycle, the replacement cycle LT long This is an example of the second replacement cycle.

[0218] For example, the control device 20 sets the replacement period t of the first consumable component. s The time difference ΔLT between the replacement time t1 of the second consumable component and the replacement cycle LT short In the case of a short period, the first consumable component replacement period t s The replacement instruction also includes an instruction to replace the second consumable component. This can shorten the processing downtime and improve production efficiency.

[0219] Furthermore, when replacing different types of consumables during a single processing stop, it is preferred to replace the consumables mounted higher than those mounted lower. For example, the control device 20 instructs the component transport device 50 to replace the first or second consumable that is mounted higher within the processing device 40 first. This prevents reaction byproducts, etc., that have been removed from the used consumables from falling onto the replaced consumables when the used consumables are transported.

[0220] (Fourth embodiment)

[0221] The component transport device 50 in the first to third embodiments is connected to the processing device 40 whose consumable parts need to be replaced, and the consumable parts in the processing device 40 are replaced. In contrast, the component transport device 50 in this embodiment, when the replacement time of consumable parts in multiple processing devices 40 is relatively close, remains connected to one processing device 40 and replaces the consumable parts in the other processing devices 40 via the vacuum transfer chamber 31. This shortens the downtime of the processing system 10 associated with the replacement of consumable parts.

[0222] Figure 23 This is a diagram for explaining an example of a replacement method of the edge ring 423 according to the fourth embodiment. Figure 23 4 shows an example in which the edge ring 423 of the processing apparatus 40-1 and the edge ring 423 of the processing apparatus 40-2 are replaced via the processing apparatus 40-1. The processing apparatus 40-1 is an example of a first processing apparatus, and the processing apparatus 40-2 is an example of a second processing apparatus.

[0223] In this embodiment, the control device 20 estimates the travel time required for the component transport device 50 to move from the position of the processing device 40-1 to the position of the processing device 40-2 based on the position information of the processing device 40-1 and the information on the movable path of the component transport device 50. The travel time required for the component transport device 50 to move from the position of the processing device 40-1 to the position of the processing device 40-2 is an example of the second travel time.

[0224] Furthermore, the control device 20 estimates the preparation time required for the component transport device 50, which has been moved to the position of the processing device 40-2, to be ready for replacement of the edge ring 423 in the processing device 40-2. The preparation time required for the component transport device 50, which has been moved to the position of the processing device 40-2, to be ready for replacement of the edge ring 423 in the processing device 40-2 is an example of the second preparation time.

[0225] Furthermore, the control device 20 estimates the replacement time required to replace the edge ring 423 within the processing device 40-1 and the processing device 40-2 via the vacuum transfer chamber 31. If the total of the estimated travel time and setup time is longer than the estimated replacement time, the control device 20 instructs the component transport device 50 to replace the edge ring 423 within the processing device 40-2 via the processing device 40-1 and the vacuum transfer chamber 31. This shortens the downtime of the processing system 10 associated with the replacement of consumable components.

[0226] In addition, Figure 23 In the example shown, edge ring 423 within processing unit 40-2, which is located opposite processing unit 40-1 across vacuum transfer chamber 31, is replaced via processing unit 40-1 and vacuum transfer chamber 31. However, the technology of the present invention is not limited to this. For example, the processing unit 40 in which edge ring 423 is replaced via processing unit 40-1 and vacuum transfer chamber 31 may be a processing unit 40 other than processing unit 40-2, such as processing unit 40-4.

[0227] Furthermore, when replacing edge rings 423 of other processing apparatuses 40 via a processing apparatus 40, it is preferred that edge rings 423 of the other processing apparatuses 40 be replaced before edge rings 423 of the processing apparatus 40 connected to the component transport apparatus 50. For example, if the total of the estimated travel time and setup time is longer than the estimated replacement time, the control apparatus 20 instructs the component transport apparatus 50 to replace edge rings 423 of processing apparatus 40-2 before edge rings 423 of processing apparatus 40-1. This prevents reaction byproducts, etc., that have been detached from used edge rings 423 transported from other processing apparatuses 40 from falling onto unused edge rings 423 attached to the processing apparatus 40 connected to the component transport apparatus 50.

[0228] (Fifth embodiment)

[0229] In the component transport device 50 of the first to fourth embodiments, the gas within the container 51 housing the wafer cassette 52 and the robot arm 53 is exhausted and reduced in pressure when replacing consumable components. In contrast, in this embodiment, the space housing the robot arm 53 and the space housing the wafer cassette 52 within the container 51 are hermetically separated by a gate, and the gas within the space housing the robot arm 53 is exhausted. This reduces the space that is depressurized during consumable component replacement, shortening the time required to reduce the pressure to the desired level.

[0230] Figure 24 1 is a diagram showing an example of a component conveying device 50 according to a fifth embodiment. Figure 24 Marked with Figure 9 Structures with the same reference numerals as Figure 9 The structures are the same or have the same functions, so the description is omitted.

[0231] Within container 51, space 51a housing robotic arms 53a and 53b is airtightly separated from space 51b housing wafer cassette 52 by gate 517. To replace edge ring 423, gate 517 is opened, and robotic arm 53a removes the unused edge ring 423 from wafer cassette 52. After robotic arm 53a retreats into space 51a, gate 517 is closed. Furthermore, gas within space 51a is exhausted by exhaust device 554. Closing gate 517 reduces the space exhausted by exhaust device 554, shortening the time required to reduce pressure to a predetermined level. Within container 51, space 51a separated by gates 512 and 517 is an example of a load lock chamber.

[0232] After the pressure in space 51a is reduced to a predetermined level, gate 512 is opened to replace edge ring 423. After edge ring 423 replacement is complete and gate 512 is closed, atmospheric pressure is restored in space 51a and gate 517 is opened. The used edge ring 423 is then stored in wafer cassette 52 by robot arm 53b.

[0233] After the robot arm 53b retreats into the space 51a, the shutter 517 is closed again. The exhaust device 554 then exhausts the gas in the space 51a, and the cleaning mechanism 56 cleans the end effector 530b. Closing the shutter 517 while the end effector 530b is being cleaned prevents particles scattered during cleaning from adhering to the unused edge ring 423 stored in the wafer cassette 52.

[0234] [other]

[0235] In addition, the technology disclosed in the present invention is not limited to the above-mentioned embodiment, and various modifications are possible within the scope of the gist of the invention.

[0236] For example, in the first and third to fifth embodiments described above, the component transport device 50 begins exhausting the interior of the container 51 after receiving a replacement instruction from the control device 20. However, the technology of the present invention is not limited to this. For example, the component transport device 50 may control the pressure within the container 51 so that the pressure within the container 51 reaches a predetermined pressure P2 before receiving a replacement instruction. This allows the component transport device 50 to more quickly begin replacing consumable components upon receiving a replacement instruction from the control device 20.

[0237] In the first and third to fifth embodiments described above, the gas exhausted by the exhaust device 554 is discharged to the exterior of the component conveying device 50 via the exhaust pump 557. However, the technology of the present invention is not limited to this. For example, the exhaust pump 557 may be connected to a device for processing exhaust gas located outside the component conveying device 50 via a flexible hose. This facilitates the recovery and utilization of the gas exhausted from the component conveying device 50.

[0238] Furthermore, in the first and third to fifth embodiments described above, the interior of the container 51 of the component conveying device 50 is connected to an exhaust device provided outside the component conveying device 50 via a flexible hose, and the gas within the container 51 can be exhausted by the exhaust device. This eliminates the need for an exhaust device 554 within the component conveying device 50, allowing the component conveying device 50 to be miniaturized.

[0239] Furthermore, in the second embodiment described above, the gas within the container 51 of the component transport device 50 is exhausted via the exhaust system 46 of the processing device 40. However, the technology of the present invention is not limited to this. For example, when the processing device 40 is connected to the component transport device 50, the exhaust pump 557 of the component transport device 50 may be connected to the exhaust pump of the exhaust system 46. In this case, the gas exhausted by the exhaust device 554 of the component transport device 50 is exhausted by the exhaust pump of the exhaust system 46. This facilitates the recycling of the gas exhausted from the component transport device 50.

[0240] In the fifth embodiment, the gas in the space 51a defined by the gates 512 and 517 can be exhausted through the exhaust system 46 in the processing device 40 after the processing device 40 is connected to the component conveying device 50, as shown in the second embodiment.

[0241] In addition, in each of the above-mentioned embodiments, the control device 20 controls each processing device 40 and each component conveying device 50 regarding the replacement of consumable parts, but the technology of the present invention is not limited to this. For example, the control function regarding the replacement of consumable parts can also be implemented by any component conveying device 50 among the multiple component conveying devices 50 as a representative component conveying device 50. In this case, the representative component conveying device 50 controls each processing device 40 regarding the replacement of consumable parts and manages the status thereof via the control device 20. In addition, the representative component conveying device 50 can also communicate directly with each other component conveying device 50 without going through the control device 20, thereby controlling each other component conveying device 50 and managing the status thereof.

[0242] In the above-described embodiment, the same parts conveying device 50 conveys used consumable parts from the processing device 40 and conveys unused consumable parts into the processing device 40. However, the technology of the present invention is not limited to this. For example, a parts conveying device 50 for conveying used consumable parts from the processing device 40 and a parts conveying device 50 for conveying unused consumable parts into the processing device 40 may be separately prepared. Thus, since both unused and used consumable parts are not stored in the parts conveying device 50, it is possible to prevent the unused edge ring 423 from being contaminated by reaction byproducts, etc., which are peeled off from the used edge ring 423.

[0243] In this case, the component transport device 50 that delivers pre-used consumable components to the processing device 40 can also be connected to the vacuum transport chamber 31 or the atmospheric transport chamber 33. The component transport device 50 connected to the vacuum transport chamber 31 delivers the pre-used consumable components to the robot arm 310 in the vacuum transport chamber 31. The robot arm 310 delivers the received pre-used consumable components to the processing device 40 where the consumable components need to be replaced. Alternatively, the component transport device 50 connected to the atmospheric transport chamber 33 delivers the pre-used consumable components to the robot arm 330 in the atmospheric transport chamber 33. The robot arm 330 delivers the pre-used consumable components to the load lock chamber 32. The pre-used consumable components delivered to the load lock chamber 32 are then transported by the robot arm 310 in the vacuum transport chamber 31 to the processing device 40 where the consumable components need to be replaced. When the component transport device 50 is connected to the atmospheric transport chamber 33, an exhaust system is not required within the component transport device 50 that transports the pre-used consumable components, allowing the component transport device 50 to be more compact.

[0244] Furthermore, in each of the above-described embodiments, when the component transport device 50 is connected to the processing device 40 , the battery in the moving mechanism 54 can be charged by the power supply from the processing device 40 .

[0245] Furthermore, in each of the above-described embodiments, the component transport device 50 controls the moving mechanism 54 using the sensing results of the sensor 553, thereby autonomously moving the component transport device 50 to the position of the processing device 40 instructed by the control device 20. However, the technology of the present invention is not limited to this. For example, the component transport device 50 may be moved by a user's manipulation. In this case, the component transport device 50 can notify the user by displaying the position of the processing device 40 instructed by the control device 20 and its movement path on a display device or the like.

[0246] Furthermore, all of the embodiments disclosed herein are illustrative and should not be construed as limiting. In practice, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above can be omitted, replaced, or modified in a variety of forms without departing from the scope of the accompanying claims and their intended meaning.

Claims

1. A method for replacing components in a processing system, characterized in that: The processing system has: a plurality of processing devices for processing substrates; a plurality of processing components, each comprising a plurality of the processing devices; a component transport device configured to be movable to each of the processing devices in each of the plurality of processing modules to transport consumable components disposed in the processing device; and a control device for controlling the processing device and the component transport device, In the component replacement method, the control device is caused to perform the following steps: A first estimating step is to estimate a replacement period t1 of consumable components of the processing device; a determining step of determining a time when the processing of the substrate by the processing device during a period before the replacement period is finally completed as a time when the consumable component can be replaced; a second estimating step of estimating a first moving time required for the component transport device to move to a position of the processing device where the consumable component needs to be replaced; a third estimating step of estimating a first preparation time required for preparing the consumable component until the component transport device, which has been moved to a position of the processing device where the consumable component needs to be replaced, is in a state where the consumable component can be replaced; The step of transmitting a replacement instruction to the component transport device at a time before the replaceable time by a total of the first moving time and the first preparation time, thereby instructing the component transport device to replace the consumable component.

2. The component replacement method according to claim 1, wherein: The component conveying device comprises: a component storage portion for storing consumable components before use and after use; a first container for storing the component storage portion, the first container having an opening connected to the processing device and an opening and closing door for opening and closing the opening; a robot arm capable of delivering the used consumable components from the processing device through the opening and storing them in the component storage portion, and capable of taking out the unused consumable components from the component storage portion and delivering them into the processing device through the opening; a moving mechanism having a power source and capable of moving the component transport device; a communication unit for wirelessly communicating with the control device; and Control Department, The control unit performs the following steps: When the replacement instruction is issued from the control device, the moving mechanism is controlled to start moving the component transport device to a position of the processing device where the consumable component needs to be replaced; After moving to a position of the processing device where the consumable component needs to be replaced, a preparation step is performed until the consumable component is in a state where it can be replaced; a storage step of opening the door at the replaceable time, sending the used consumable component from the processing device through the opening, and storing it in the component storage portion; A step of taking the consumable parts before use out of the parts storage portion and feeding them into the processing device through the opening; and A closing step of closing the opening and closing door.

3. The component replacement method according to claim 2, wherein: The component transport device includes a first pressure control unit that controls the pressure in the first container. The processing device includes a second pressure control unit for controlling the pressure in a second container defining a processing space in the processing device. The control device controls the component transport device and the processing device at the replaceable timing so that the pressure in the second container is higher than the pressure in the first container.

4. The component replacement method according to claim 3, wherein: The control device controls the component transport device and the processing device so that the pressure difference between the pressure in the first container and the pressure in the second container becomes 10 Pa or more. 4 The pressure difference is within the range of Pa or less.

5. The component replacement method according to any one of claims 1 to 4, characterized in that: The control device estimates the replacement period based on at least any one of the RF cumulative time, the RF cumulative electric power, the scheme cumulative time, the change in the weight of the consumable part and the change in the size of the consumable part, wherein the RF cumulative time is the cumulative time of the processing performed in the processing device using RF electric power, the RF cumulative electric power is the product value of the processing time and the electric power performed in the processing device using RF electric power, and the scheme cumulative time is the cumulative time of a specific processing scheme in which the consumption of the consumable part is particularly high.

6. The component replacement method according to any one of claims 1 to 4, wherein: The consumable parts include: a first consumable part to be replaced in a first replacement cycle; and a second consumable part to be replaced in a second replacement cycle longer than the first replacement cycle, The control device also instructs replacement of the second consumable component in the replacement instruction based on the replacement period of the first consumable component when the time difference between the replacement period of the first consumable component and the replacement period of the second consumable component is shorter than the first replacement cycle.

7. The component replacement method according to claim 6, wherein: The control device issues an instruction to the component transport device so that the consumable component disposed at a higher position in the processing device among the first consumable component and the second consumable component is replaced first.

8. The component replacement method according to any one of claims 1 to 4, wherein: The processing system includes a plurality of the component transport devices, The control device sends the replacement instruction to the component transport device closest to the processing device where the consumable component needs to be replaced.

9. The component replacement method according to any one of claims 1 to 4, wherein: The processing system comprises: a first processing device; a second processing device; and a transport chamber connected to the first processing device and the second processing device, respectively; The control device instructs the component conveying device to replace the consumable parts in the second processing device via the first processing device and the conveying chamber when the total time of the second movement time and the second preparation time is longer than the replacement time when the consumable parts in the second processing device are replaced via the first processing device and the conveying chamber, wherein the second movement time is the time required for the component conveying device to move from the position of the first processing device to the position of the second processing device, and the second preparation time is the time required to prepare until the component conveying device that has moved to the position of the second processing device is in a state where the consumable parts in the second processing device can be replaced.

10. The component replacement method according to claim 9, wherein: When the total of the second movement time and the second preparation time is longer than the replacement time, the control device instructs the component transport device to replace the consumable components in the second processing device before the consumable components in the first processing device.

11. The component replacement method according to any one of claims 1 to 4, wherein: The control device controls the processing device so that the used consumable parts are cleaned before being sent out from the processing device.

12. The component replacement method according to claim 11, wherein: The control device controls the processing device so that the used consumable component is moved and separated from the base unit on which the used consumable component is mounted, and then the used consumable component is cleaned.

13. The component replacement method according to any one of claims 1 to 4, characterized in that: The control device controls the processing device so that the area in the processing device where the used consumable parts are arranged is cleaned from the time when the used consumable parts are sent out from the processing device until the unused consumable parts are sent into the processing device.

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