Trim screw assembly and machining device

Abstract

The present invention provides a fine adjustment screw assembly and a processing device that appropriately measure a load applied to a processing tool for grinding a grinding tool. The fine adjustment screw assembly is configured to link a first member and a second member at a distance apart, is capable of adjusting a distance between the first member and the second member, and is capable of detecting a load applied to the second member. The fine adjustment screw assembly includes a first external thread capable of being screwed into a first internal thread formed in the first member, a second external thread disposed separately from the first external thread on an extension line of an axial direction of the first external thread, capable of being screwed into a second internal thread formed in the second member, the second internal thread having a different pitch from a pitch of the first internal thread, a linking portion linking the first external thread and the second external thread that are separate from each other into one body, and a load sensor housed inside the linking portion to which a compression load is applied.

Description

TECHNICAL FIELD

[0001] The present application relates to a fine adjustment screw assembly and a processing device. BACKGROUND

[0002] In a grinding device that grinds a workpiece held by a holding surface of a chuck table by a plurality of ring-shaped grinding stones installed in a grinding unit, the chuck table and the grinding unit are arranged so that the grinding stones pass through the center of the workpiece.

[0003] Grinding processing of the workpiece held by the holding surface is performed in a radius region from the center of the workpiece to the outer periphery. In the radius region, the holding surface and the lower surface of the grinding stone are parallel to each other. In addition, based on a measurement result of the thickness of the workpiece after grinding, the parallelism of the holding surface and the lower surface of the grinding stone is adjusted. Therefore, there is an inclination adjustment mechanism for adjusting the parallelism of the holding surface and the lower surface of the grinding stone.

[0004] The inclination adjustment mechanism is supported by a spindle support base and inclines a spindle unit that rotates the grinding stone. Alternatively, the inclination adjustment mechanism is supported by a device base and inclines a chuck shaft unit that rotates the chuck table.

[0005] In recent years, it is required to shorten the grinding time of the workpiece. Therefore, during grinding processing, the grinding stone is pressed against the workpiece with a large load. However, when the load is too large, it is difficult to make the thickness of the workpiece after grinding uniform due to crushing of a belt provided between the workpiece and the holding surface, or the like.

[0006] Therefore, by controlling the load based on a measurement result of the load during grinding processing, the uniformity of the thickness of the wafer after grinding is achieved. In relation to this, in order to measure the load, as disclosed in Patent Literature 1, a load sensor is sandwiched between the device base and the chuck shaft unit or between the spindle support base and the spindle unit (between components).

[0007] Patent Literature 1: Japanese Patent Application Laid-Open (kokai) No. 2003-326456

[0008] Patent Literature 2: Japanese Patent Application Laid-Open (kokai) No. 2013-119123

[0009] However, in the structure described in Patent Literature 1, when the inclination of the chuck shaft unit or the spindle unit is changed by the inclination adjustment mechanism, the distance between the components sandwiching the load sensor changes. At this time, when the distance between the components sandwiching the load sensor expands, there is a case where the load is difficult to apply to the load sensor and the load is difficult to measure by the load sensor. SUMMARY

[0010] Therefore, the object of the present invention is to provide a machining apparatus that, during machining, can properly measure the load applied to the machining tool even after tilting adjustments have been made to adjust the parallelism between the holding surface of the chuck table and the lower surface of the machining tool.

[0011] According to one aspect of the invention, a fine-tuning screw assembly is provided, which is configured to connect a first component and a second component at a distance, capable of adjusting the distance between the first component and the second component, and capable of detecting a load applied to the second component, wherein the fine-tuning screw assembly has: a first external thread that can be screwed into a first internal thread formed in the first component; a second external thread that is disposed separately from the first external thread on an axial extension of the first external thread and capable of being screwed into a second internal thread formed in the second component, the second internal thread having a pitch different from that of the first internal thread; a connecting portion that connects the mutually separated first external thread and the second external thread into one unit; and a load sensor that is subjected to a compressive load and is housed inside the connecting portion.

[0012] According to another aspect of the present invention, a processing apparatus is provided, comprising: a holding unit that holds a workpiece by means of a holding surface; a processing unit including a spindle and a processing tool mounted on the spindle; a vertical movement mechanism that moves a support housing supporting the processing unit in a vertical direction perpendicular to the holding surface; and a processing unit tilt adjustment mechanism that adjusts the tilt of the processing unit relative to the holding unit, the processing unit tilt adjustment mechanism being composed of a fine-tuning screw assembly configured to connect a first component and a second component at a spaced interval, capable of adjusting the distance between the first component and the second component. The fine-tuning screw assembly includes: a first external thread that can be screwed into a first internal thread formed in the first component; a second external thread that is separately disposed from the first external thread on the axial extension of the first external thread and can be screwed into a second internal thread formed in the second component, the second internal thread having a pitch different from the first internal thread; a connecting portion that connects the separate first external thread and the second external thread into one unit; and a load sensor that is subjected to a compressive load and housed inside the connecting portion. The first component is constituted by the support housing, and the second component is constituted by the processing unit.

[0013] According to another aspect of the present invention, a processing apparatus is provided, comprising: a holding unit that holds a workpiece via a holding surface; a base that supports the holding unit; a processing unit including a spindle and a processing tool mounted on the spindle; a vertical movement mechanism that moves a support housing supporting the processing tool in a vertical direction perpendicular to the holding surface; and a holding unit tilt adjustment mechanism that adjusts the tilt of the holding unit relative to the processing unit, the holding unit tilt adjustment mechanism being composed of a fine-tuning screw assembly configured to hold a first component and a second component spaced apart, capable of adjusting the tilt of the first component relative to the workpiece. The fine-tuning screw assembly includes: a first external thread that can be screwed into a first internal thread formed on the first component; a second external thread that is separately disposed from the first external thread on the axial extension of the first external thread and can be screwed into a second internal thread formed on the second component, the second internal thread having a pitch different from the pitch of the first internal thread; a connecting portion that connects the mutually separated first external thread and the second external thread into one unit; and a load sensor that is subjected to a compressive load and is housed inside the connecting portion. The first component is constituted by the base, and the second component is constituted by the retaining unit.

[0014] According to the present invention, the fine-tuning screw assembly is capable of adjusting the distance between the first component and the second component, and is capable of detecting the load applied to the second component.

[0015] According to the processing apparatus of the present invention, the tilt between the retaining unit and the processing unit can be easily adjusted by rotating the fine-tuning screw assembly. This allows for simple adjustment of the parallelism between the retaining surface of the retaining unit and the processing tool of the processing unit. Attached Figure Description

[0016] Figure 1 This is a perspective view showing the structure of the grinding device.

[0017] Figure 2 This is a partial cross-sectional view showing the structure of the grinding device.

[0018] Figure 3 This is a cross-sectional view showing the structure of the fine-tuning screw.

[0019] Figure 4 This is an explanatory diagram showing the tilt adjustment mechanism of the retaining unit and the structure in its vicinity.

[0020] Figure 5 This is an explanatory diagram showing the tilt adjustment mechanism of the processing unit and the structures nearby.

[0021] Label Explanation

[0022] 1: Grinding device; 10: Main housing; 11: Column; 30: Holding unit; 31: Chuck table; 32: Holding surface; 302: Internal thread of holding unit; 33: Support component; 34: Rotation mechanism; 301: Table center axis; 303: Opening; 40: Y-axis moving mechanism; 45: Y-axis moving table; 452: Internal thread of table; 453: Opening; 50: Grinding feed mechanism; 56: Support housing; 561: Base plate; 562: Internal thread of support housing; 70: Grinding unit; 71: Spindle housing; 7 2: Spindle; 73: Rotary motor; 74: Wheel mounting base; 75: Grinding wheel; 76: Grinding wheel base; 77: Grinding tool; 701: Spindle rotation axis; 712: Grinding unit internal thread; 35: Holding unit tilt adjustment mechanism; 78: Machining unit tilt adjustment mechanism; 81: Screw body; 82: Opening; 83: First external thread; 84: Load sensor storage part; 89: Load sensor; 85: Second external thread; 87: Connecting part; 100: Wafer; 101: Front side; 104: Back side; 105: Protective belt. Detailed Implementation

[0023] like Figure 1 As shown, the grinding apparatus 1 of this embodiment is an apparatus for grinding a wafer 100, which is a workpiece, and has a cuboid main housing 10 and an upwardly extending column 11.

[0024] Wafer 100 is, for example, a circular semiconductor wafer. Figure 1 In this process, multiple devices are formed on the front side 101 of the wafer 100 facing downwards, and are protected by a protective tape 105. The back side 104 of the wafer 100 becomes the surface to be processed by grinding.

[0025] An opening 13 is provided on the upper surface of the main housing 10. Furthermore, a holding unit 30 is disposed within the opening 13. The holding unit 30 includes: a chuck stage 31 having a holding surface 32 for holding the wafer 100; and a support member 33 for supporting the chuck stage 31. Figure 2 As shown, the support component 33 and the chuck table 31 are fastened by screws 37.

[0026] Figure 1 The holding surface 32 of the chuck stage 31 shown is connected to the attraction source (not shown), and the wafer 100 is attracted and held through the protective strip 105. That is, the holding unit 30 holds the wafer 100 through the holding surface 32 of the chuck stage 31.

[0027] Furthermore, with the wafer 100 held by the holding surface 32, the chuck stage 31 can be rotated via the rotating mechanism 34 located below, with the stage center axis 301 (refer to) extending along the Z-axis direction through the center of the holding surface 32. Figure 2 The wafer 100 is held by the holding surface 32 and rotates around the center of the holding surface 32.

[0028] like Figure 1 As shown, a cover plate 39 is provided around the chuck worktable 31. Furthermore, a corrugated cover 12 that extends and retracts along the Y-axis is connected to the cover plate 39. Moreover, a Y-axis moving mechanism 40 is provided below the holding unit 30.

[0029] The Y-axis moving mechanism 40 is an example of a horizontal moving mechanism. The Y-axis moving mechanism 40 moves the holding unit 30 and the grinding unit 70 relative to each other along the Y-axis direction, which is parallel to the holding surface 32. In this embodiment, the Y-axis moving mechanism 40 is configured to move the holding unit 30 relative to the grinding unit 70 along the Y-axis direction. Alternatively, the horizontal moving mechanism could also be a rotary table with multiple holding units 30.

[0030] The Y-axis moving mechanism 40 includes: a pair of Y-axis guide rails 42 parallel to the Y-axis direction; a Y-axis moving table 45 that slides on the Y-axis guide rails 42; a Y-axis ball screw 43 parallel to the Y-axis guide rails 42; a Y-axis servo motor 44 connected to one end of the Y-axis ball screw 43; and a holding table 41 that holds them.

[0031] The Y-axis movable worktable 45 is slidably mounted on the Y-axis guide rail 42. A nut portion 451 is fixed to the lower surface of the Y-axis movable worktable 45 (see reference). Figure 2 A Y-axis ball screw 43 is screwed into the nut portion 451. A Y-axis servo motor 44 is connected to one end of the Y-axis ball screw 43.

[0032] like Figure 1 As shown, in the Y-axis moving mechanism 40, the Y-axis ball screw 43 is rotated by the Y-axis servo motor 44, and the Y-axis moving table 45 moves along the Y-axis guide rail 42 in the Y-axis direction. A support member 33 for the holding unit 30 is mounted on the Y-axis moving table 45. Therefore, as the Y-axis moving table 45 moves along the Y-axis direction, the holding unit 30, including the chuck table 31, moves along the Y-axis direction. Thus, the Y-axis moving table 45 is an example of a base supporting the holding unit 30.

[0033] In this embodiment, generally speaking, the holding unit 30 moves along the Y-axis between the wafer placement position for placing the wafer 100 in front of the holding surface 32 (-Y direction side) and the grinding area behind (+Y direction side) where the wafer 100 is ground, via the Y-axis moving mechanism 40.

[0034] In addition, such as Figure 1 As shown, a column 11 is erected at the rear (+Y direction side) of the main housing 10. A grinding unit 70 and a grinding feed mechanism 50 for grinding the wafer 100 are provided on the front surface of the column 11.

[0035] The grinding feed mechanism 50 moves the holding unit 30 and the grinding unit 70 relative to each other along the Z-axis direction (grinding feed direction) perpendicular to the holding surface 32. In this embodiment, the grinding feed mechanism 50 is configured to move the grinding unit 70 relative to the holding unit 30 along the Z-axis direction.

[0036] The grinding feed mechanism 50 includes: a pair of Z-axis guide rails 51 parallel to the Z-axis direction; a Z-axis moving plate 53 sliding on the Z-axis guide rails 51; a Z-axis ball screw 52 parallel to the Z-axis guide rails 51; a Z-axis servo motor 54; and a support housing 56 mounted on the front surface (front) of the Z-axis moving plate 53. The support housing 56 supports the grinding unit 70.

[0037] The Z-axis moving plate 53 is slidably mounted on the Z-axis guide rail 51. A nut portion 501 is fixed to the rear surface (back side) of the Z-axis moving plate 53 (see reference). Figure 2 A Z-axis ball screw 52 is screwed into the nut portion 501. A Z-axis servo motor 54 is connected to one end of the Z-axis ball screw 52.

[0038] In the grinding feed mechanism 50, the Z-axis ball screw 52 is rotated by the Z-axis servo motor 54, and the Z-axis moving plate 53 moves along the Z-axis guide rail 51 in the Z-axis direction. Consequently, the support housing 56 mounted on the Z-axis moving plate 53 and the grinding unit 70 supported by the support housing 56 also move together with the Z-axis moving plate 53 in the Z-axis direction. Thus, the grinding feed mechanism 50 is an example of a vertical movement mechanism that moves the support housing 56, which supports the grinding unit 70 (which is the machining unit), in a vertical direction perpendicular to the holding surface 32.

[0039] Grinding unit 70 is an example of a machining unit. For example... Figure 1As shown, the grinding unit 70 includes: a spindle housing 71 fixed to a support housing 56; a spindle 72 rotatably held in the spindle housing 71; a rotary motor 73 that drives the spindle 72 to rotate; a wheel mount 74 mounted on the lower end of the spindle 72; and a grinding wheel 75 supported by the wheel mount 74.

[0040] The spindle housing 71 is held in the support housing 56 in a manner that extends along the Z-axis. The spindle 72 extends along the Z-axis in a manner that is perpendicular to the holding surface 32 of the chuck table 31 and is supported by the spindle housing 71 to be rotatable.

[0041] A rotary motor 73 is connected to the upper end of the main shaft 72. Through this rotary motor 73, the main shaft 72 rotates about a main shaft rotation axis 701 (refer to...) extending along the Z-axis direction. Figure 2 Rotate around ) as the center.

[0042] The wheel mounting base 74 is formed in the shape of a circular plate and is fixed to the lower end (front end) of the spindle 72. The wheel mounting base 74 supports the grinding wheel 75.

[0043] The grinding wheel 75 is formed to have a diameter approximately the same as that of the wheel mounting base 74. The grinding wheel 75 includes an annular grinding wheel base 76 made of a metal material such as aluminum alloy. On the lower surface of the grinding wheel base 76, a plurality of grinding tools 77 are fixed in a ring arrangement around its entire circumference. The annularly arranged grinding tools 77 are rotated about a central axis via a spindle 72, the wheel mounting base 74, and the grinding wheel base 76 by a rotary motor 73, grinding the back surface 104 of the wafer 100 held by the chuck stage 31 located in the grinding area. The grinding tools 77 are an example of machining tools. Thus, the grinding unit 70 has a spindle 72 configured to mount the grinding tools 77 as machining tools and to rotate the grinding tools 77.

[0044] In addition, such as Figure 1 As shown, a thickness measuring unit 60 is provided on the side of the opening 13 of the main housing 10. The thickness measuring unit 60 is capable of measuring the thickness of the wafer 100 held by the holding surface 32 in a contact manner.

[0045] That is, the thickness measuring unit 60 contacts the first contact 61 and the second contact 62 with the holding surface 32 of the chuck stage 31 and the wafer 100, respectively. Thus, the thickness measuring unit 60 can measure the height of the holding surface 32 of the chuck stage 31 and the height of the wafer 100. Alternatively, the thickness measuring unit 60 may use a non-contact distance measuring device (e.g., a laser distance measuring device) instead of the first contact 61 and the second contact 62.

[0046] In addition, such as Figure 1As shown, a linear scale 65 for measuring the height position of the grinding unit 70 is provided on the column 11. The linear scale 65 includes: a reading unit 66, which is disposed on the Z-axis moving plate 53 and moves together with the Z-axis moving plate 53 in the Z-axis direction; and a scale part 67, which is disposed on the surface of the Z-axis guide rail 51. The reading unit 66 can detect the height position of the grinding unit 70, which moves by the grinding feed mechanism 50, by reading the scale of the scale part 67.

[0047] In addition, such as Figure 2 As shown, the holding unit 30 has a holding unit tilt adjustment mechanism 35. In this embodiment, the support member 33 of the holding unit 30 is mounted on the Y-axis moving stage 45 by means of the holding unit tilt adjustment mechanism 35 and a fixed connecting member (not shown). That is, in this embodiment, the Y-axis moving stage 45 supports the holding unit 30 by means of the holding unit tilt adjustment mechanism 35 and the fixed connecting member.

[0048] The retaining unit tilt adjustment mechanism 35 is a fine-tuning screw assembly that connects the Y-axis moving worktable 45 and the retaining unit 30. In this embodiment, one fixed connecting component and two retaining unit tilt adjustment mechanisms 35 are provided, for example, at equal intervals of 120 degrees along a circumferential direction centered on the worktable central axis 301 between the Y-axis moving worktable 45 and the retaining unit 30.

[0049] The fixed connection component is configured to connect the Y-axis moving stage 45 and the holding unit 30 at a fixed interval at the location where the fixed connection component is provided.

[0050] On the other hand, the holding unit tilt adjustment mechanism 35 is also provided to connect the Y-axis moving worktable 45 and the holding unit 30 at a distance. However, the holding unit tilt adjustment mechanism 35 can adjust the distance between the Y-axis moving worktable 45 and the holding unit 30 at the location where the holding unit tilt adjustment mechanism 35 is provided.

[0051] Through the function of the holding unit tilt adjustment mechanism 35, the holding unit tilt adjustment mechanism 35 can change the tilt of the holding unit 30 on the Y-axis moving worktable 45 (the tilt of the worktable center axis 301). Therefore, the holding unit tilt adjustment mechanism 35 can adjust the tilt of the holding unit 30 relative to the grinding unit 70 located above the holding unit 30 during grinding. Thus, for example, the parallelism between the holding surface 32 of the holding unit 30 and the lower surface of the grinding wheel 77 of the grinding unit 70 can be adjusted.

[0052] In addition, during grinding, the holding unit tilt adjustment mechanism 35 also functions as a load detection unit for detecting the load applied to the holding surface 32 of the chuck table 31 in the direction perpendicular to the holding surface 32 (Z-axis direction) (i.e., the load applied to the holding unit 30).

[0053] Here, the detailed structure of the tilt adjustment mechanism 35 is explained. For example... Figure 3 As shown, the tilt adjustment mechanism 35 of the holding unit includes a cylindrical screw body 81 and a load sensor (force sensor) 89 housed in the screw body.

[0054] The screw body 81 has a first external thread 83 and a second external thread 85 on its outer periphery. The first external thread 83 has a first pitch, and the second external thread 85 has a second pitch different from the first pitch. The second external thread 85 is disposed separately from the first external thread 83 on the axial extension line (the length direction of the screw body 81) of the first external thread 83 of the screw body 81. In addition, the screw body 81 has a connecting portion 87 that connects the mutually separate first external thread 83 and second external thread 85.

[0055] like Figure 4 As shown, the first external thread 83 of the screw body 81 can be screwed into the internal thread 452 formed in the Y-axis moving worktable 45, which is the first component. The internal thread 452 is an example of the first internal thread and has the same first pitch as the first external thread 83. Alternatively, a nut can be provided that can be screwed into the first external thread 83, and the first external thread 83 screwed into the internal thread 452 of the worktable of the first component can be fastened by the nut.

[0056] Furthermore, the second external thread 85 can be screwed into the retaining unit internal thread 302 formed in the support member 33 of the retaining unit 30, which is the second component. The retaining unit internal thread 302 is an example of the second internal thread, having a second pitch that is different from the first pitch of the worktable internal thread 452 and the same as the second external thread 85. Alternatively, a nut that can be screwed into the second external thread 85 may be provided, and the second external thread 85 screwed into the retaining unit internal thread 302 of the second component may be secured by the nut.

[0057] While adjusting the tilt of the holding unit 30 relative to the grinding unit 70, the operator rotates the screw body 81 of one or both holding unit tilt adjustment mechanisms 35. When the screw body 81 rotates, the first external thread 83 moves within the internal thread 452 of the worktable, and the second external thread 85 moves within the internal thread 302 of the holding unit. Therefore, the Y-axis moving worktable 45 and holding unit 30 move relative to the screw body 81.

[0058] Here, as described above, the first pitch of the internal thread 452 of the worktable and the second pitch of the internal thread 302 of the retaining unit are different. Therefore, when the screw body 81 of the retaining unit tilt adjustment mechanism 35 is rotated, the movement distance of the Y-axis moving worktable 45 relative to the screw body 81 and the movement distance of the retaining unit 30 relative to the screw body 81 are different. Therefore, the operator can increase or decrease the distance between the Y-axis moving worktable 45 and the retaining unit 30 at the location where the retaining unit tilt adjustment mechanism 35 is provided by changing the rotation direction of the screw body 81.

[0059] In this way, by rotating one or both of the retaining unit tilt adjustment mechanisms 35 that connect the Y-axis moving table 45 and the retaining unit 30, the operator can change the distance between the Y-axis moving table 45 and the retaining unit 30 at the location where the retaining unit tilt adjustment mechanism 35 is provided. As a result, the operator can adjust the tilt of the retaining unit 30 relative to the grinding unit 70 by changing the tilt of the retaining unit 30 on the Y-axis moving table 45.

[0060] In addition, in this embodiment, in order to arrange the holding unit tilt adjustment mechanism 35 between the Y-axis moving worktable 45 and the holding unit 30, and in order to rotate the screw body 81 of the holding unit tilt adjustment mechanism 35, an opening 303 is provided on the holding unit 30 for exposing one end of the screw body 81 (see reference). Figure 4 Furthermore, an opening 453 is provided on the Y-axis moving worktable 45 to expose the other end of the screw body 81. A head 811 is provided at the other end of the screw body 81 for a tool such as a wrench to be engaged. The operator inserts the tool into the opening 453 and operates the head 811 at the other end of the screw body 81, thereby rotating the screw body 81.

[0061] In addition, such as Figure 3 As shown, in the retaining unit tilt adjustment mechanism 35, an opening 82 is provided at the end of the screw body 81 on the side of the second external thread 85. Furthermore, a load sensor storage part 84 for storing the load sensor 89 is provided inside the connecting part 87 deep within the opening 82.

[0062] like Figure 3 As shown by the middle arrow 401, the load sensor 89 is introduced into the screw body 81 through the opening 82, and is housed in the load sensor housing 84 inside the connecting portion 87 after being subjected to a compressive load. Thus, the load sensor 89 can measure the load applied to the retaining unit tilt adjustment mechanism 35 (screw body 81) along the Z-axis direction, which is the length direction of the screw body 81, i.e., the load applied to the retaining unit 30.

[0063] In addition, such as Figure 2 As shown, the grinding unit 70 has a machining unit tilt adjustment mechanism 78. In this embodiment, the spindle housing 71 of the grinding unit 70 is mounted on the base plate 561 of the support housing 56 by means of the machining unit tilt adjustment mechanism 78 and a fixed connecting member (not shown). That is, in this embodiment, the support housing 56 supports the grinding unit 70 by means of the machining unit tilt adjustment mechanism 78 and the fixed connecting member.

[0064] The machining unit tilt adjustment mechanism 78 is a fine-tuning screw assembly connecting the support housing 56 and the grinding unit 70. In this embodiment, one fixed connecting component and two machining unit tilt adjustment mechanisms 78 are provided, for example, at equal intervals of 120 degrees along a circumferential direction centered on the spindle rotation axis 701 between the support housing 56 and the grinding unit 70.

[0065] The fixed connecting component is configured to connect the support housing 56 and the grinding unit 70 at a fixed interval at the location where the fixed connecting component is provided.

[0066] On the other hand, the machining unit tilt adjustment mechanism 78 is also provided to connect the support housing 56 and the grinding unit 70 at a distance. However, the machining unit tilt adjustment mechanism 78 can adjust the distance between the support housing 56 and the grinding unit 70 at the location where the machining unit tilt adjustment mechanism 78 is provided.

[0067] Through the function of the machining unit tilt adjustment mechanism 78, the tilt of the grinding unit 70 relative to the support housing 56 (the tilt of the spindle 72 (spindle rotation axis 701)) can be changed. Therefore, the machining unit tilt adjustment mechanism 78 can adjust the tilt of the grinding unit 70 relative to the holding unit 30 located below the grinding unit 70 during grinding. Thus, for example, the parallelism between the holding surface 32 of the holding unit 30 and the lower surface of the grinding tool 77 of the grinding unit 70 can be adjusted.

[0068] The processing unit tilt adjustment mechanism 78 is equipped with and used Figure 3 The fine-tuning screw shown has the same structure as the tilt adjustment mechanism 35 of the holding unit. The tilt adjustment mechanism 78 of the processing unit has: a screw body 81 having a first external thread 83, a second external thread 85 and a connecting portion 87; and a load sensor 89 housed in the screw body 81.

[0069] Therefore, as Figure 5As shown, the first external thread 83 of the screw body 81 can be screwed into the support housing internal thread 562 formed in the base plate 561 of the support housing 56, which is the first component. The support housing internal thread 562 is an example of the first internal thread and has the same first pitch as the first external thread 83. Alternatively, a nut can be provided that can be screwed into the first external thread 83, and the first external thread 83 screwed into the support housing internal thread 562 of the first component can be fastened by the nut.

[0070] Furthermore, the second external thread 85 can be screwed into the grinding unit internal thread 712 formed in the spindle housing 71 of the grinding unit 70, which is the second component. The grinding unit internal thread 712 is an example of the second internal thread, having a second pitch that is different from the first pitch of the support housing internal thread 562 and the same as the second external thread 85. Alternatively, a nut can be provided that can be screwed into the second external thread 85, and the second external thread 85 screwed into the grinding unit internal thread 712 can be secured by the nut.

[0071] While adjusting the tilt of the grinding unit 70 relative to the holding unit 30, the operator rotates the screw body 81 of one or both machining unit tilt adjustment mechanisms 78. When the screw body 81 is rotated, the first external thread 83 moves within the internal thread 562 of the support housing, and the second external thread 85 moves within the internal thread 712 of the grinding unit. Therefore, the support housing 56 and the grinding unit 70 move relative to the screw body 81.

[0072] Here, the first pitch of the inner thread 562 of the support housing and the second pitch of the inner thread 712 of the grinding unit are different. Therefore, when the screw body 81 of the machining unit tilt adjustment mechanism 78 is rotated, the movement distance of the support housing 56 relative to the screw body 81 and the movement distance of the grinding unit 70 relative to the screw body 81 are different. Therefore, the operator can change the distance between the support housing 56 where the machining unit tilt adjustment mechanism 78 is located and the grinding unit 70 (the distance between the base plate 561 of the support housing 56 and the spindle housing 71 of the grinding unit 70) by changing the rotation direction of the screw body 81.

[0073] In this way, by rotating one or both of the machining unit tilt adjustment mechanisms 78 that connect the support housing 56 and the grinding unit 70, the operator can change the distance between the support housing 56 and the grinding unit 70 at the location where the machining unit tilt adjustment mechanism 78 is provided. As a result, the operator can adjust the tilt of the grinding unit 70 relative to the holding unit 30 by changing the tilt of the grinding unit 70 on the support housing 56.

[0074] Additionally, in this case, the other end of the screw body 81 extends from below the base plate 561 of the support housing 56, i.e., from the base plate 561 and the wheel mounting seat 74 (see reference).Figure 2 The gap between the screw body 81 and the head 811 is exposed. The operator inserts a tool into the gap and operates the head 811 at the other end of the screw body 81, thereby enabling the screw body 81 to rotate.

[0075] Additionally, in the machining unit tilt adjustment mechanism 78, a load sensor housing 84 (see reference) is also included, where a compressive load is applied to house the load sensor 89 inside the connecting portion 87 of the screw body 81. Figure 3 In the load cell, a compressive load is applied, causing the external thread formed on the upper part of the load sensor 89 to be screwed into the internal thread formed on the upper part of the load sensor housing 84. This presses the front end of the load sensor 89 against the bottom surface of the load sensor housing 84, thereby compressing the piezoelectric element located at the center of the extension direction of the load sensor 89 and applying a predetermined load. As a result, the load sensor 89 can measure the load applied to the machining unit tilt adjustment mechanism 78 (screw body 81) along the Z-axis direction, which is the length direction of the screw body 81, i.e., the load applied to the grinding unit 70.

[0076] Furthermore, the load sensor 89 can measure the load due to the elongation of the load sensor 89 and the positive load due to the further compression of the load sensor 89. Additionally, the load sensor 89 can perform measurements based on the extension and retraction of the adjusting screw, which refers to compressing the adjusting screw through a machining load or stretching the adjusting screw without directly applying a machining load.

[0077] As described above, in this embodiment, the tilt between the holding unit 30 and the grinding unit 70 can be easily adjusted by rotating either the holding unit tilt adjustment mechanism 35 or the machining unit tilt adjustment mechanism 78. This allows for simple adjustment of the parallelism between the holding surface 32 of the holding unit 30 and the lower surface of the grinding tool 77 of the grinding unit 70. Furthermore, the holding unit tilt adjustment mechanism 35 and the machining unit tilt adjustment mechanism 78 can respectively measure the load applied to the holding unit 30 and the grinding unit 70 using internal load sensors 89.

[0078] Here, the holding unit tilt adjustment mechanism 35 is a fine-tuning screw that engages with both the Y-axis moving table 45 and the holding unit 30. Similarly, the machining unit tilt adjustment mechanism 78 is a fine-tuning screw that engages with both the support housing 56 and the grinding unit 70. Therefore, even if the distance between the components connected to the holding unit 30 and the grinding unit 70 is increased in order to adjust the tilt between them, the holding unit tilt adjustment mechanism 35 and the machining unit tilt adjustment mechanism 78 are not easily separated from these components.

[0079] Therefore, in this embodiment, it is possible to suppress situations where it is difficult to apply load to the load sensor 89 of the holding unit tilt adjustment mechanism 35 and the machining unit tilt adjustment mechanism 78. Therefore, even after adjusting the tilt between the holding unit 30 and the grinding unit 70, it is possible to properly measure the load applied to the holding unit 30 or the grinding unit 70.

[0080] Therefore, in this embodiment, by temporarily stopping the grinding process to adjust the tilt between the holding unit 30 and the grinding unit 70, and measuring the load applied to the holding unit 30 or the grinding unit 70 during the tilt adjustment, it is easy to make the load before the tilt adjustment the same as the load after the tilt adjustment, thus suppressing thickness defects after the tilt adjustment.

[0081] In this embodiment, the operator uses a tool to rotate the screw body 81 of the holding unit tilt adjustment mechanism 35 and the processing unit tilt adjustment mechanism 78. Alternatively, a drive source such as an electric motor can be used to rotate the screw body 81.

[0082] Furthermore, in this embodiment, the holding unit 30 has two holding unit tilt adjustment mechanisms 35, and the grinding unit 70 has two processing unit tilt adjustment mechanisms 78. Relatedly, as long as the tilt between the holding unit 30 and the grinding unit 70 can be appropriately adjusted, the number of holding unit tilt adjustment mechanisms 35 and processing unit tilt adjustment mechanisms 78 can also be three or more.

[0083] In this embodiment, the holding unit 30 has a holding unit tilt adjustment mechanism 35, which adjusts the tilt of the holding unit 30 relative to the grinding unit 70 and measures the load applied to the holding unit 30. Furthermore, the grinding unit 70 has a machining unit tilt adjustment mechanism 78, which adjusts the tilt of the grinding unit 70 relative to the holding unit 30 and measures the load applied to the grinding unit 70. Alternatively, the grinding apparatus 1 can be configured to have only one of the holding unit tilt adjustment mechanism 35 or the machining unit tilt adjustment mechanism 78. In this configuration, the tilt between the holding unit 30 and the grinding unit 70 can also be adjusted. Additionally, load measurement can be performed efficiently.

[0084] In addition, in the example shown in this embodiment, the grinding apparatus 1 is configured to perform plunge grinding on the wafer 100 by means of a grinding unit 70 equipped with a grinding wheel 77 arranged in a ring. Alternatively, the grinding apparatus 1 may perform plunge grinding on the workpiece held on the holding surface 32 of the holding unit 30 by means of a grinding unit 70 equipped with a grinding wheel 77 arranged in a ring.

[0085] Alternatively, the grinding device 1 may be configured to have a turning unit as a machining unit, which is equipped with a single pointcutting tool. The tilt between the turning unit and the holding unit 30 is changed by the holding unit tilt adjustment mechanism 35 and / or the machining unit tilt adjustment mechanism 78, and the load applied to the holding unit 30 and / or the turning unit is measured.

[0086] Alternatively, the grinding apparatus 1 may be configured as a grinding unit having a grinding unit with a disc-shaped or ring-shaped grinding pad as a processing tool, and the tilt between the grinding unit and the holding unit 30 may be changed by the holding unit tilt adjustment mechanism 35 and / or the processing unit tilt adjustment mechanism 78, and the load applied to the holding unit 30 and / or the grinding unit may be measured.

[0087] In addition, in this embodiment, by Figure 3 The tilt adjustment mechanism 35 of the holding unit, which is composed of fine-tuning screws, connects the Y-axis moving worktable 45, which is the first component, and the holding unit 30, which is the second component. In addition, the tilt adjustment mechanism 78 of the machining unit, which is composed of fine-tuning screws, connects the support housing 56, which is the first component, and the grinding unit 70, which is the second component.

[0088] Relatedly, the first component associated with the fine-tuning screw is not limited to the Y-axis moving stage 45 and the support housing 56, and the second component is not limited to the holding unit 30 and the grinding unit 70. Regardless of the type of the first and second components, the fine-tuning screw can adjust the distance between the first and second components by connecting them with a gap, and can detect the load applied to the second component.

Claims

1. A fine adjustment screw assembly configured to link first and second members apart at a distance, capable of changing an inclination of the second member by adjusting a distance between the first and second members, and capable of detecting a load applied to the second member, wherein the fine adjustment screw assembly has: a first external thread capable of being screwed into a first internal thread formed in the first member; a second external thread disposed separately from the first external thread on an extension line of an axial direction of the first external thread, capable of being screwed into a second internal thread formed in the second member, the second internal thread having a different pitch from a pitch of the first internal thread; a linking portion linking the first and second external threads, which are separate from each other, into one body; and a load sensor housed inside the linking portion by a compression load.

2. A processing apparatus, wherein the processing apparatus has: a holding unit which holds a workpiece by a holding surface; a processing unit which includes a spindle and a processing tool mounted to the spindle; an up-and-down moving mechanism which moves a support housing which supports the processing unit in an up-and-down direction perpendicular to the holding surface; and a processing unit inclination adjusting mechanism which adjusts an inclination of the processing unit with respect to the holding unit, the processing unit inclination adjusting mechanism is configured by a fine adjustment screw assembly configured to link first and second members apart at a distance, capable of changing an inclination of the second member by adjusting a distance between the first and second members, and capable of detecting a load applied to the second member, the fine adjustment screw assembly includes: a first external thread capable of being screwed into a first internal thread formed in the first member; a second external thread disposed separately from the first external thread on an extension line of an axial direction of the first external thread, capable of being screwed into a second internal thread formed in the second member, the second internal thread having a different pitch from a pitch of the first internal thread; a linking portion linking the first and second external threads, which are separate from each other, into one body; and a load sensor housed inside the linking portion by a compression load, the first member is configured by the support housing, and the second member is configured by the processing unit.

3. A processing apparatus, wherein the processing apparatus has: a holding unit which holds a workpiece by a holding surface; a base which supports the holding unit; a processing unit which includes a spindle and a processing tool mounted to the spindle; an up-and-down moving mechanism which moves a support housing which supports the processing tool in an up-and-down direction perpendicular to the holding surface; and a holding unit inclination adjusting mechanism which adjusts an inclination of the holding unit with respect to the processing unit, the holding unit inclination adjusting mechanism is configured by a fine adjustment screw assembly configured to link first and second members apart at a distance, capable of changing an inclination of the second member by adjusting a distance between the first and second members, and capable of detecting a load applied to the second member, the fine adjustment screw assembly includes: a first external thread capable of being screwed into a first internal thread formed in the first member; a second external thread disposed separately from the first external thread on an extension line of an axial direction of the first external thread, capable of being screwed into a second internal thread formed in the second member, the second internal thread having a different pitch from a pitch of the first internal thread; a linking portion linking the first and second external threads, which are separate from each other, into one body; and a load sensor housed inside the linking portion by a compression load. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a second external thread disposed separately from the first external thread on an axial extension line of the first external thread, capable of being screwed into a second internal thread formed in the second member, the second internal thread having a different pitch from the pitch of the first internal thread; a connecting portion that connects the first external thread and the second external thread, which are separate from each other, into one body; and a load sensor housed inside the connecting portion by a compression load, the first member is constituted by the abutment, and the second member is constituted by the holding unit.

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