Wiring circuit board support assembly

Abstract

The present invention provides a wiring circuit substrate support assembly. An assembly sheet (1) includes: a suspension substrate (2) with a circuit; a frame (3) that supports the suspension substrate (2) with a circuit; and a connection portion (4) that is formed of a resin material and connects the suspension substrate with a circuit and the frame. The suspension substrate with a circuit includes a first metal support layer (20), a base insulating layer (21), and a conductor layer (22). The frame is formed by a second metal support layer (50) that is arranged at a distance relative to the first metal support layer (20). The connection portion (4) includes: a first portion (55A) that is arranged on the first metal support layer (20) and extends in the width direction; a second portion (55B) that is arranged on the second metal support layer (50) and extends in the width direction; and a first connecting portion (55C) that connects a portion of the first portion in the width direction with a portion of the second portion in the width direction.

Description

Technical Field

[0001] The present invention relates to a wiring circuit substrate supporting assembly. Background Art

[0002] Wiring circuit boards are used in various industrial products such as electronic and electrical equipment. As such wiring circuit boards, for example, a flexible printed circuit board with a reinforcement layer including a metal supporting layer as a reinforcement layer, a suspension board with a circuit including a metal supporting layer as a suspension (spring) layer, and the like are known.

[0003] In the manufacturing process of such a wiring circuit substrate, first, a wiring circuit substrate support assembly in which the wiring circuit substrate is supported by a frame is prepared, and then the wiring circuit substrate is cut from the wiring circuit substrate support assembly. In such a wiring circuit substrate support assembly, the frame is usually made of the same metal as the metal supporting layer of the wiring circuit substrate, and the frame and the metal supporting layer are integrally connected. Therefore, there is a case where cutting of the connection portion between the wiring circuit substrate and the frame becomes complicated.

[0004] Therefore, studies have been conducted to connect the printed circuit board and the housing using a material different from the metal supporting layer.

[0005] For example, a suspension substrate assembly sheet with circuits is proposed, which includes a plurality of suspension substrates with circuits, a frame body that supports the plurality of suspension substrates with circuits, and a connecting support portion that connects the plurality of suspension substrates with circuits and the frame body, wherein the connecting support portion is formed of a resin material, and the suspension substrate assembly sheet with circuits has a rectangular shape when viewed from above (for example, see Patent Document 1). Figure 4 ).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2019-79584 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] However, when the suspension-board-with-circuit assembly sheet described in Patent Document 1 is conveyed, load stress acts on the suspension-board-with-circuit assembly sheet, and the connection support portion may be separated from the metal supporting layer and / or the frame.

[0011] The present invention provides a wiring circuit board support assembly capable of suppressing separation of a connection portion from a first metal supporting layer and / or a second metal supporting layer.

[0012] Solutions for solving problems

[0013] The present invention [1] includes a wiring circuit substrate support assembly, wherein the wiring circuit substrate support assembly includes: a wiring circuit substrate extending in a predetermined direction; a frame supporting the wiring circuit substrate; and a connecting portion connecting the wiring circuit substrate and the frame, the connecting portion being formed of a resin material, the wiring circuit substrate including: a first metal supporting layer; an insulating layer disposed on one side in a thickness direction of the first metal supporting layer; and a conductor layer disposed on one side in the thickness direction of the insulating layer, the frame being formed by a conductor layer spaced apart from the first metal supporting layer. The connecting portion is composed of a second metal supporting layer arranged at intervals, and the connecting portion includes: a first portion, which is arranged on a side surface in the thickness direction of the first metal supporting layer and extends in a width direction orthogonal to the length direction of the wiring circuit substrate; a second portion, which is arranged on a side surface in the thickness direction of the second metal supporting layer and extends in the width direction, and the second portion is arranged at an interval with respect to the first portion in the length direction; and a first connecting portion, which connects a part of the first portion in the width direction and a part of the second portion in the width direction.

[0014] With such a structure, the connection portion includes: a first portion, which is arranged on one side surface in the thickness direction of the first metal supporting layer and extends in the width direction; a second portion, which is arranged on one side surface in the thickness direction of the second metal supporting layer and extends in the width direction; and a first connecting portion, which connects a portion in the width direction of the first portion and a portion in the width direction of the second portion. Therefore, when viewed from the thickness direction, the connection portion has an H shape.

[0015] As a result, compared with the case where the connecting portion has a rectangular shape when viewed from the thickness direction, when load stress acts on the wiring circuit substrate supporting assembly, the connecting portion can be prevented from peeling off from the first metal supporting layer and / or the second metal supporting layer. Thus, the frame can stably support the wiring circuit substrate.

[0016] The present invention [2] includes the wiring circuit substrate support assembly described in [1] above, wherein the wiring circuit substrate support assembly also includes a first reinforcement portion, which is arranged on the surface of the first connecting portion and is used to reinforce the first connecting portion, and the first reinforcement portion includes two or more resin layers stacked in the thickness direction, and / or a metal component made of the same metal as the conductor layer.

[0017] With such a structure, the first reinforcing portion is arranged on the surface of the first connecting portion. Furthermore, the first reinforcing portion includes two or more resin layers stacked in the thickness direction, and / or a metal member made of the same metal as the conductor layer. Therefore, the first connecting portion can be reinforced. As a result, when load stress acts on the wiring circuit substrate support assembly, damage to the first connecting portion can be suppressed.

[0018] The present invention [3] includes the wired circuit board support assembly described in the above [2], wherein the first reinforcing portion is formed of two or more resin layers stacked in the thickness direction.

[0019] With such a structure, since the first reinforcing portion is composed of two or more resin layers, the first reinforcing portion and the first connecting portion can be cut smoothly, and the printed circuit board can be separated from the frame smoothly, compared with the case where the first reinforcing portion includes a metal member.

[0020] The present invention [4] includes a wiring circuit substrate support assembly as described in any one of [1] to [3] above, wherein the wiring circuit substrate support assembly includes: a plurality of wiring circuit substrates, which are arranged at intervals from each other; a second connecting portion, in adjacent wiring circuit substrates among the plurality of wiring circuit substrates, the second connecting portion connects a portion of the insulating layer of one wiring circuit substrate with a portion of the insulating layer of another wiring circuit substrate, the second connecting portion being formed of a resin material; and a second reinforcing portion, which reinforces the second connecting portion, the second reinforcing portion being arranged on the surface of the second connecting portion and comprising two or more resin layers stacked in the thickness direction, and / or a metal component made of the same metal as the conductor layer.

[0021] With such a structure, the second connecting portion connects adjacent wiring circuit substrates among the plurality of wiring circuit substrates. Therefore, when load stress acts on the wiring circuit substrate supporting assembly, deformation of the wiring circuit substrate supporting assembly can be suppressed, and peeling of the connecting portion from the first metal supporting layer and / or the second metal supporting layer can be stably suppressed.

[0022] In addition, the second reinforcing portion is arranged on the surface of the second connecting portion. Furthermore, the second connecting portion includes two or more resin layers and / or metal components stacked in the thickness direction. Therefore, the second connecting portion can be fully reinforced. As a result, when load stress acts on the wiring circuit substrate support assembly, damage to the second connecting portion can be suppressed.

[0023] Effects of the Invention

[0024] According to the wired circuit board supporting assembly of the present invention, it is possible to suppress the connection portion from being peeled off from the first metal supporting layer and / or the second metal supporting layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A plan view showing an assembly sheet as one embodiment of the wired circuit board supporting assembly of the present invention.

[0026] Figure 2 express Figure 1 An enlarged view of the suspension substrate with circuitry is shown.

[0027] Figure 3 express Figure 2 A cross-sectional view taken along line AA of the suspension substrate with circuit shown.

[0028] Figure 4 express Figure 2 A BB cross-sectional view of the first connecting portion shown.

[0029] Figure 5 express Figure 2 A CC sectional view of the second connecting portion shown.

[0030] Figure 6 express Figure 2 A DD cross-sectional view of the second connecting portion is shown.

[0031] Fig. 7A A plan view showing a first modification example of the first reinforcement portion (including a form of a first reinforcement wiring).

[0032] Figure 7B express Fig. 7A The BB section view is shown.

[0033] Figure 7C A cross-sectional view taken along the line BB shows a second modified example of the first reinforcement portion (a form including the first reinforcement wiring and the second reinforcement resin layer).

[0034] Fig. 8A A cross-sectional view taken along the line DD shows a first modified example of the second reinforcement portion (including a form of the second reinforcement wiring).

[0035] Figure 8B A cross-sectional view taken along the line DD shows a second modified example of the second reinforcement portion (a form including a second reinforcement wiring and a fourth reinforcement resin layer).

[0036] Description of Reference Numerals

[0037] 1. Assembly sheet; 2. Suspension substrate with circuit; 3. Frame; 4. Connecting portion; 5. First reinforcing portion; 6. Second connecting portion; 7. Second reinforcing portion; 20. First metal supporting layer; 21. Base insulating layer; 22. Conductive layer; 50. Second metal supporting layer; 55. First connecting portion; 55A. First part; 55B. Second part; 55C. First connecting portion; 56. Second connecting portion; 56A. First part; 56B. Second part; 56C. First connecting portion; 57. First connection reinforcing portion; 58. Second connection reinforcing portion. DETAILED DESCRIPTION

[0038] Reference Figure 1 to Figure 6 An assembly sheet 1 as one embodiment of the wired circuit board supporting member of the present invention will be described.

[0039] like Figure 1 As shown, the assembly sheet 1 includes a plurality of suspension substrates with circuits 2 as an example of a wiring circuit substrate, a frame 3, a plurality of connecting portions 4, a plurality of first reinforcing portions 5, a plurality of second connecting portions 6, and a plurality of second reinforcing portions 7. Figure 1 In the figure, for the sake of convenience, the number of the plurality of suspension boards with circuits 2 is three, but the number of the suspension boards with circuits 2 is not particularly limited.

[0040] 1. Suspension substrate with circuit

[0041] The suspension board with circuit 2 has a substantially flat belt shape extending in a predetermined direction.

[0042] exist Figure 1 In the figure, the thickness direction of the paper is the thickness direction of the suspension substrate 2 with circuit (the first direction), the front side of the paper is one side of the thickness direction (one side of the first direction), and the depth side of the paper is the other side of the thickness direction (the other side of the first direction).

[0043] exist Figure 1 In the figure, the up and down direction of the paper is the length direction of the suspension substrate 2 with circuit (the second direction orthogonal to the first direction), the upper side of the paper is one side of the length direction (one side of the second direction), and the lower side of the paper is the other side of the length direction (the other side of the second direction).

[0044] exist Figure 1 In the figure, the left-right direction of the paper is the width direction of the suspension board with circuit 2 (the third direction orthogonal to both the first direction and the second direction), the right side of the paper is one side of the width direction (one side of the third direction), and the left side of the paper is the other side of the width direction (the other side of the third direction). Specifically, the direction is based on the direction arrows recorded in each figure.

[0045] In addition, hereinafter, unless otherwise specified, the thickness direction of the suspension board with circuit 2 is referred to as the thickness direction, the length direction of the suspension board with circuit 2 is referred to as the length direction, and the width direction of the suspension board with circuit 2 is referred to as the width direction. In addition, the length direction is orthogonal to the thickness direction, and the width direction is orthogonal to both the length direction and the thickness direction.

[0046] The plurality of suspension boards with circuits 2 are arranged at intervals from each other in the width direction.

[0047] like Figure 2 and Figure 3 As shown, the suspension board with circuit 2 includes, in order from the other side in the thickness direction toward the one side in the thickness direction, a first metal supporting layer 20, a base insulating layer 21 as an example of an insulating layer, a conductor layer 22, and a cover insulating layer 23 (see Figure 3 ).

[0048] like Figure 2 As shown in FIG. 1 , the first metal supporting layer 20 is a metal supporting body that supports the conductor layer 22 and extends in the longitudinal direction. Figure 2 In FIG. 1 , for convenience, the first metal supporting layer 20 is indicated by solid lines and dotted lines, the base insulating layer 21 is indicated by a solid line, the conductor layer 22 is indicated by a bold line, and the cover insulating layer 23 is omitted.

[0049] The first metal supporting layer 20 includes a gimbal portion 24 and a main body portion 25 .

[0050] The suspension part 24 is located at one end portion in the longitudinal direction of the first metal supporting layer 20. The suspension part 24 includes a frame part 26 and a stage 27.

[0051] When viewed from the thickness direction, the frame 26 has a rectangular frame shape and defines an opening 28. The frame 26 surrounds the stage 27. The frame 26 has one end 26A in the length direction, the other end 26B in the length direction, one end 26C in the width direction, and the other end 26D in the width direction. The one end 26A in the length direction is located at one side in the length direction with respect to the stage 27 at a distance. The one end 26A in the length direction extends in the width direction. The other end 26B in the length direction is located at the other side in the length direction with respect to the stage 27 at a distance. The other end 26B in the length direction extends in the width direction. The one end 26C in the width direction is located at one side in the width direction with respect to the stage 27 at a distance. The one end 26C in the width direction extends in the length direction. The one end 26C in the width direction connects one end in the width direction of the one end 26A in the length direction and one end in the width direction of the other end 26B in the length direction. The other end 26D in the width direction is located at the other side in the width direction with respect to the stage 27 at a distance. The other widthwise end portion 26D extends in the longitudinal direction and connects the other widthwise end portion of the one longitudinal end portion 26A and the other widthwise end portion of the other longitudinal end portion 26B.

[0052] The stage 27 can carry the slider 11. The stage 27 is disposed in the opening 28 at a distance from the frame 26. The stage 27 has a rectangular shape when viewed from the thickness direction.

[0053] The main body 25 is a portion supported by a load arm (not shown). The main body 25 is located on the other side of the suspension 24 in the longitudinal direction. The main body 25 has a flat belt shape extending in the longitudinal direction. The main body 25 is continuous with the other end 26B of the frame 26 in the longitudinal direction.

[0054] Examples of the material of the first metal supporting layer 20 include metal materials such as stainless steel. The thickness of the first metal supporting layer 20 is not particularly limited, and is, for example, 10 μm to 35 μm.

[0055] like Figure 3 As shown, the base insulating layer 21 is arranged on one side in the thickness direction of the first metal supporting layer 20, specifically, on the surface of one side in the thickness direction of the first metal supporting layer 20. The base insulating layer 21 has a predetermined pattern corresponding to the conductor layer 22. The base insulating layer 21 is located between the first metal supporting layer 20 and the conductor layer 22 in the thickness direction.

[0056] like Figure 2 As shown, the base insulating layer 21 includes a stage base 29 , a frame base 30 , a first main body base 31 , and a second main body base 32 .

[0057] The stage base 29 is located on the stage 27. The stage base 29 has a rectangular shape when viewed from the thickness direction.

[0058] The frame base 30 is located on one side in the length direction relative to the stage base 29. When viewed from the thickness direction, the frame base 30 overlaps with one end 26A of the frame portion 26 in the length direction and one end of the opening 28 in the length direction. One end of the frame base 30 in the length direction is located on one end 26A of the frame portion 26 in the length direction. When viewed from the thickness direction, the frame base 30 has a rectangular shape extending in the width direction. The dimension of the frame base 30 in the width direction is larger than the dimension of the stage base 29 in the width direction. The end of one side in the length direction of the stage base 29 is connected to the frame base 30. The end of one side in the width direction of the frame base 30 is located on one side of the width direction than the stage base 29. The end of the other side in the width direction of the frame base 30 is located on the other side of the width direction than the stage base 29.

[0059] The first main body base 31 and the second main body base 32 are arranged at a distance from each other in the width direction. The first main body base 31 is located on one side in the width direction relative to the stage base 29. The first main body base 31 has a flat belt shape extending in the longitudinal direction. The first main body base 31 has a first unsupported portion 31A and a first supported portion 31B.

[0060] The first unsupported portion 31A is located at one end portion in the length direction of the first main body base 31. When viewed from the thickness direction, the first unsupported portion 31A overlaps with the opening 28. Therefore, the first unsupported portion 31A is not supported by the first metal supporting layer 20. The end portion in the length direction of the first unsupported portion 31A is connected to the end portion in the width direction of the other end portion in the length direction of the frame body base 30.

[0061] The first supported portion 31B is located on the other side of the first unsupported portion 31A in the longitudinal direction. The first supported portion 31B is located on the main body 25. Therefore, the first supported portion 31B is supported by the main body 25. An end portion on one side in the longitudinal direction of the first supported portion 31B is connected to an end portion on the other side in the longitudinal direction of the first unsupported portion 31A.

[0062] The second main body base 32 is located on the other side in the width direction relative to the stage base 29. The second main body base 32 has a flat belt shape extending in the longitudinal direction. The second main body base 32 has a second unsupported portion 32A and a second supported portion 32B.

[0063] The second unsupported portion 32A is located at an end portion on one side in the longitudinal direction of the second main body base 32. When viewed from the thickness direction, the second unsupported portion 32A overlaps with the opening 28. Therefore, the second unsupported portion 32A is not supported by the first metal supporting layer 20. The end portion on one side in the longitudinal direction of the second unsupported portion 32A is connected to the end portion on the other side in the longitudinal direction of the frame body base 30, which is located on the other side in the width direction. The second unsupported portion 32A is located on the other side in the width direction with a gap with respect to the first unsupported portion 31A.

[0064] The second supported portion 32B is located on the other side in the length direction of the second unsupported portion 32A. The second supported portion 32B is located on the main body 25. Therefore, the second supported portion 32B is supported by the main body 25. The second supported portion 32B is located on the other side in the width direction with a gap relative to the first supported portion 31B. The end of one side in the length direction of the second supported portion 32B is connected to the end of the other side in the length direction of the second unsupported portion 32A.

[0065] Examples of the material of the base insulating layer 21 include synthetic resins such as polyimide resins.

[0066] The thickness of the base insulating layer 21 is not particularly limited, and is, for example, 1 μm or more and 1000 μm or less.

[0067] like Figure 3 As shown, the conductor layer 22 is arranged on one side in the thickness direction of the base insulating layer 21 , specifically, on the surface of one side in the thickness direction of the base insulating layer 21 .

[0068] like Figure 2 As shown, the conductor layer 22 includes a plurality of slider connection terminals 40 , a plurality of external connection terminals 41 , and a plurality of wirings 42 .

[0069] When the slider 11 is mounted on the suspension board with circuit 2 , the plurality of slider connection terminals 40 are electrically connected to the slider 11 via a bonding material (for example, solder).

[0070] The plurality of slider connection terminals 40 are located at one end portion in the longitudinal direction of the suspension board with circuit 2 . The plurality of slider connection terminals 40 are arranged on the stage base 29 .

[0071] The plurality of sled connection terminals 40 are arranged at intervals from each other in the width direction. Specifically, the plurality of sled connection terminals 40 are four sled connection terminals 40. In addition, the number of sled connection terminals 40 is four for the sake of convenience in the present embodiment, but there is no particular limitation. The plurality of sled connection terminals 40 include a plurality of first sled connection terminals 40A and a plurality of second sled connection terminals 40B. The plurality of first sled connection terminals 40A and the plurality of second sled connection terminals 40B are arranged at intervals from each other in the width direction. Specifically, the plurality of first sled connection terminals 40A are two first sled connection terminals 40A. Specifically, the plurality of second sled connection terminals 40B are two second sled connection terminals 40B. In addition, in the present embodiment, the number of the first sled connection terminals 40A and the number of the second sled connection terminals 40B are two for the sake of convenience, but there is no particular limitation. The plurality of first slider connection terminals 40A are located on one side in the width direction, and the plurality of second slider connection terminals 40B are located on the other side in the width direction.

[0072] In a state where the main body 25 is supported by a load arm (not shown), the plurality of external connection terminals 41 are electrically connected to an external substrate (not shown).

[0073] The plurality of external connection terminals 41 are located at the end portion on the other side in the longitudinal direction of the suspension board with circuit 2. The external connection terminals 41 are provided in the same number as the plurality of slider connection terminals 40. The plurality of external connection terminals 41 include a plurality of first external connection terminals 41A and a plurality of second external connection terminals 41B. The plurality of first external connection terminals 41A and the plurality of second external connection terminals 41B are provided at intervals from each other in the width direction. The first external connection terminals 41A are provided in the same number as the first slider connection terminals 40A. The second external connection terminals 41B are provided in the same number as the second slider connection terminals 40B. The plurality of first external connection terminals 41A are located on one side in the width direction, and the plurality of second external connection terminals 41B are located on the other side in the width direction. The plurality of first external connection terminals 41A are arranged at the end portion on the other side in the longitudinal direction of the first support portion 31B. The plurality of second external connection terminals 41B are arranged at the end portion on the other side in the longitudinal direction of the second support portion 32B.

[0074] The plurality of wirings 42 electrically connect the plurality of slider connection terminals 40 and the plurality of external connection terminals 41. The plurality of wirings 42 include a plurality of first wirings 42A and a plurality of second wirings 42B. The plurality of first wirings 42A and the plurality of second wirings 42B are arranged at intervals from each other in the width direction. The plurality of first wirings 42A are located on one side in the width direction, and the plurality of second wirings 42B are located on the other side in the width direction.

[0075] The plurality of first wirings 42A electrically connect the plurality of first slider connection terminals 40A and the plurality of first external connection terminals 41A. The first wirings 42A run from the first slider connection terminals 40A, sequentially through the stage base 29 and the first main body base 31, and are connected to the first external connection terminals 41A.

[0076] The second wirings 42B electrically connect the second slider connection terminals 40B and the second external connection terminals 41B. The second wirings 42B run from the second slider connection terminals 40B, sequentially pass over the stage base 29 and the second main body base 32, and are connected to the second external connection terminals 41B.

[0077] Examples of the material of the conductor layer 22 include conductor materials such as copper. The thickness of the conductor layer 22 is, for example, 1 μm or more, preferably 3 μm or more, and, for example, 20 μm or less, preferably 12 μm or less.

[0078] like Figure 3 As shown, the insulating cover layer 23 is arranged on one side in the thickness direction of the insulating base layer 21 , specifically, on one surface in the thickness direction of the insulating base layer 21 , so as to cover the conductive layer 22 .

[0079] The cover insulating layer 23 has a pattern shape that exposes the plurality of slider connection terminals 40 and the plurality of external connection terminals 41 and covers the plurality of wirings 42 .

[0080] Examples of the material of the insulating cover layer 23 include synthetic resins such as polyimide resins. The insulating cover layer 23 has a thickness of, for example, 1 μm or more, preferably 2 μm or more, and, for example, 10 μm or less, preferably 8 μm or less.

[0081] 2.Frame

[0082] like Figure 1 As shown, the frame body 3 collectively supports a plurality of suspension boards with circuits 2. The frame body 3 is composed of a second metal supporting layer 50. The second metal supporting layer 50 is formed of the same material as that of the first metal supporting layer 20 described above.

[0083] The second metal supporting layer 50 has a rectangular frame shape when viewed in the thickness direction, and surrounds the plurality of suspension boards with circuits 2. The second metal supporting layer 50 is disposed with respect to the plurality of first metal supporting layers 20 at intervals.

[0084] The second metal supporting layer 50 includes two first horizontal stripes 51 and two second horizontal stripes 52 .

[0085] The two first horizontal bars 51 are arranged at intervals from each other in the width direction so as to sandwich the plurality of suspension boards with circuits 2. The first horizontal bars 51 are arranged at intervals with respect to the suspension boards with circuits 2 located at the ends in the width direction among the plurality of suspension boards with circuits 2. When viewed in the thickness direction, the first horizontal bars 51 have a rectangular shape extending in the length direction.

[0086] The two second horizontal bars 52 are arranged at intervals in the longitudinal direction so as to sandwich the plurality of suspension boards with circuits 2. The second horizontal bars 52 are arranged at intervals in the longitudinal direction relative to the plurality of suspension boards with circuits 2. The ends of the second horizontal bars 52 in the width direction are connected to the first horizontal bars 51.

[0087] like Figure 2 As shown, among the two second horizontal bars 52, the second horizontal bar 52 located on one side in the longitudinal direction is referred to as the second horizontal bar 52A on one side, and the second horizontal bar 52 located on the other side in the longitudinal direction is referred to as the second horizontal bar 52B on the other side. The second horizontal bar 52A on one side is arranged at one side in the longitudinal direction with a gap relative to the frame portion 26. The second horizontal bar 52B on the other side is arranged at the other side in the longitudinal direction with a gap relative to the main body portion 25.

[0088] 3. Connection

[0089] The connection portion 4 connects the suspension substrate with circuit 2 and the frame 3. A plurality of connection portions 4 are provided for one suspension substrate with circuit 2. In the present embodiment, for convenience, four connection portions 4 are provided for one suspension substrate with circuit 2, but there is no particular limitation. The connection portion 4 is formed of a resin material. Specifically, the connection portion 4 is formed of the same resin material as the base insulating layer 21.

[0090] The plurality of connection parts 4 include a plurality of first connection parts 55 and a plurality of second connection parts 56 .

[0091] The plurality of first connection parts 55 connect the frame part 26 and the second horizontal bar 52A on one side. The plurality of first connection parts 55 are arranged at intervals in the width direction. Specifically, the plurality of first connection parts 55 are two first connection parts 55.

[0092] The first connection portion 55 has an H-shape when viewed from the thickness direction. The first connection portion 55 has a first portion 55A, a second portion 55B, and a first connecting portion 55C.

[0093] The first portion 55A is disposed on one side surface in the thickness direction of the first metal supporting layer 20. Specifically, the first portion 55A is disposed on one end portion 26A in the length direction of the frame portion 26. The first portion 55A is disposed at a distance in the width direction relative to the frame base 30. The first portion 55A may also be connected to the frame base 30. When viewed from the thickness direction, the first portion 55A has a rectangular shape extending in the width direction.

[0094] The second portion 55B is disposed on one side in the thickness direction of the second metal supporting layer 50. Specifically, the second portion 55B is disposed on the second horizontal bar 52A on one side. The second portion 55B is disposed on one side in the length direction at a distance from the first portion 55A. When viewed from the thickness direction, the second portion 55B has a rectangular shape extending in the width direction.

[0095] The first connecting portion 55C connects a portion of the first portion 55A in the width direction and a portion of the second portion 55B in the width direction. More specifically, the first connecting portion 55C connects a central portion of the first portion 55A in the width direction and a central portion of the second portion 55B in the width direction. When viewed from the thickness direction, the first connecting portion 55C has a rectangular shape extending in the longitudinal direction. The dimension of the first connecting portion 55C in the width direction is shorter than the dimension of the first portion 55A in the width direction and the dimension of the second portion 55B in the width direction.

[0096] The plurality of second connection parts 56 connect the main body 25 and the second horizontal bar 52B on the other side. The plurality of second connection parts 56 are arranged at intervals in the width direction. Specifically, the plurality of second connection parts 56 are two second connection parts 56.

[0097] The second connection portion 56 has an H shape when viewed from the thickness direction. The second connection portion 56 has the same structure as the first connection portion 55. Specifically, the second connection portion 56 has a first portion 56A, a second portion 56B, and a first connecting portion 56C.

[0098] The first portion 56A is disposed on one side surface in the thickness direction of the first metal supporting layer 20. Specifically, the first portion 56A is disposed on the other end portion of the main body portion 25 in the longitudinal direction.

[0099] The first portion 56A on one side in the width direction among the plurality of first portions 56A is located on the other side in the length direction relative to the first body base 31 and is connected to the first body base 31. The first portion 56A may be arranged at a distance from the first body base 31.

[0100] The first portion 56A on the other side in the width direction among the plurality of first portions 56A is located on the other side in the length direction relative to the second body base 32 and is connected to the second body base 32. The first portion 56A may be arranged at a distance from the second body base 32.

[0101] The second portion 56B is disposed on one side in the thickness direction of the second metal supporting layer 50. Specifically, the second portion 56B is disposed on the second horizontal bar 52B on the other side. The second portion 56B is disposed on the other side in the length direction with a gap relative to the first portion 56A. When viewed from the thickness direction, the second portion 56B has a rectangular shape extending in the width direction.

[0102] The first connecting portion 56C connects a portion of the first portion 56A in the width direction and a portion of the second portion 56B in the width direction. More specifically, the first connecting portion 56C connects a central portion of the first portion 56A in the width direction and a central portion of the second portion 56B in the width direction. When viewed from the thickness direction, the first connecting portion 56C has a rectangular shape extending in the longitudinal direction. The dimension of the first connecting portion 56C in the width direction is shorter than the dimension of the first portion 56A in the width direction and the dimension of the second portion 56B in the width direction.

[0103] 4. The first reinforcement part

[0104] The plurality of first reinforcement parts 5 correspond to the plurality of connection parts 4 and are provided in the same number as the connection parts 4. The plurality of first reinforcement parts 5 include a plurality of first connection reinforcement parts 57 and a plurality of second connection reinforcement parts 58.

[0105] The first connection reinforcement portion 57 reinforces the first connection portion 55C of the first connection portion 55. Figure 4 As shown in FIG. 1 , the first connection reinforcement portion 57 is disposed on the surface of the first connection portion 55C. More specifically, the first connection reinforcement portion 57 is disposed on the surface of one side in the thickness direction of the first connection portion 55C.

[0106] In the present embodiment, the first connection reinforcement portion 57 is composed of two or more resin layers stacked in the thickness direction. Specifically, the first connection reinforcement portion 57 includes a first reinforcement resin layer 57A and a second reinforcement resin layer 57B.

[0107] The first reinforcing resin layer 57A is disposed on one surface of the first connecting portion 55 in the thickness direction. The first reinforcing resin layer 57A has the same outer shape as the first connecting portion 55, and has an H shape when viewed from the thickness direction. The first reinforcing resin layer 57A is formed of a resin material. Specifically, the first reinforcing resin layer 57A is formed of the same resin material as the above-mentioned cover insulating layer 23.

[0108] The second reinforcing resin layer 57B is disposed on one surface of the first reinforcing resin layer 57A in the thickness direction. When viewed from the thickness direction, the second reinforcing resin layer 57B has a rectangular shape extending in the longitudinal direction (see Figure 2 ). When viewed from the thickness direction, the central portion of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the first connecting portion 55C. When viewed from the thickness direction, one end of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the second portion 55B. When viewed from the thickness direction, the other end of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the first portion 55A. The second reinforcing resin layer 57B is formed of a resin material.

[0109] like Figure 2 As shown, the plurality of second connection reinforcement parts 58 reinforce the first connection part 56C of the second connection part 56. The second connection reinforcement parts 58 are arranged on the surface of the first connection part 56C. More specifically, the second connection reinforcement parts 58 are arranged on one surface of the first connection part 56C in the thickness direction.

[0110] like Figure 5 As shown, in this embodiment, the second connection reinforcement portion 58 is composed of two or more resin layers stacked in the thickness direction. Specifically, the second connection reinforcement portion 58 includes a third reinforcement resin layer 58A and a fourth reinforcement resin layer 58B.

[0111] The third reinforcing resin layer 58A is disposed on one surface of the second connecting portion 56 in the thickness direction. The third reinforcing resin layer 58A has the same outer shape as the second connecting portion 56, and has an H shape when viewed from the thickness direction. The third reinforcing resin layer 58A is formed of a resin material. Specifically, the third reinforcing resin layer 58A is formed of the same resin material as the above-mentioned cover insulating layer 23.

[0112] The fourth reinforcing resin layer 58B is disposed on one surface of the third reinforcing resin layer 58A in the thickness direction. When viewed from the thickness direction, the fourth reinforcing resin layer 58B has a rectangular shape extending in the longitudinal direction (see Figure 2 ). When viewed from the thickness direction, the central portion of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the first connecting portion 56C. When viewed from the thickness direction, the end portion of one side of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the first portion 56A. When viewed from the thickness direction, the end portion of the other side of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the second portion 56B. The fourth reinforcing resin layer 58B is formed of a resin material. In detail, the fourth reinforcing resin layer 58B is formed of the same resin material as the second reinforcing resin layer 57B described above.

[0113] 5. Second connection

[0114] like Figure 1 As shown, one second connection portion 6 is provided between each of the adjacent suspension substrates with circuits 2. Therefore, when the number of the plurality of suspension substrates with circuits 2 is n, the number of the second connection portions 6 is (n-1). The second connection portion 6 is formed of a resin material. Specifically, the second connection portion 6 is formed of the same resin material as the base insulating layer 21.

[0115] In mutually adjacent suspension boards with circuits 2 among the plurality of suspension boards with circuits 2 , the second connecting portion 6 connects a portion of the base insulating layer 21 of one suspension board with circuit 2 with a portion of the base insulating layer 21 of another suspension board with circuit 2 .

[0116] In more detail, the second connecting portion 6 connects a portion of the second supporting portion 32B of the suspension substrate 2 with circuit on one side in the width direction of the adjacent suspension substrates 2 with circuit and a portion of the first supporting portion 31B of the suspension substrate 2 with circuit on the other side in the width direction.

[0117] When viewed from the thickness direction, the second connection portion 6 has a rectangular shape extending in the width direction. When viewed from the thickness direction, the second connection portion 6, the portion of the second supported portion 32B continuous with the second connection portion 6, and the portion of the first supported portion 31B continuous with the second connection portion 6 have an H shape.

[0118] 6. Second reinforcement part

[0119] The second reinforcement portion 7 reinforces the second connection portion 6. The plurality of second reinforcement portions 7 corresponds to the plurality of second connection portions 6, and the same number as the second connection portions 6 is provided.

[0120] like Figure 6 As shown, in this embodiment, the second reinforcing portion 7 is composed of two or more resin layers stacked in the thickness direction. Specifically, the second reinforcing portion 7 includes a fifth reinforcing resin layer 7A and a sixth reinforcing resin layer 7B.

[0121] The fifth reinforcing resin layer 7A is disposed on one surface of the second connecting portion 6 in the thickness direction. The fifth reinforcing resin layer 7A has the same outer shape as the second connecting portion 6, and has a rectangular shape extending in the width direction when viewed from the thickness direction. The fifth reinforcing resin layer 7A is formed of a resin material. Specifically, the fifth reinforcing resin layer 7A is formed of the same resin material as the above-mentioned cover insulating layer 23.

[0122] The sixth reinforcing resin layer 7B is disposed on one surface of the fifth reinforcing resin layer 7A in the thickness direction. When viewed from the thickness direction, the sixth reinforcing resin layer 7B has a rectangular shape extending in the width direction (see Figure 1). When viewed from the thickness direction, the sixth reinforcing resin layer 7B overlaps the second connecting portion 6. The sixth reinforcing resin layer 7B is formed of a resin material. Specifically, the sixth reinforcing resin layer 7B is formed of the same resin material as the second reinforcing resin layer 57B and the fourth reinforcing resin layer 58B.

[0123] like Figure 2 As shown in the figure, in the assembly sheet 1, the first connecting portion 55 includes a first portion 55A, a second portion 55B, and a first connecting portion 55C. The first portion 55A is arranged on one side surface in the thickness direction of the frame portion 26 and extends in the width direction. The second portion 55B is arranged on one side surface in the thickness direction of the second horizontal strip 52A on one side and extends in the width direction. The first connecting portion 55C connects a portion in the width direction of the first portion 55A and a portion in the width direction of the second portion 55B. Therefore, when viewed from the thickness direction, the first connecting portion 55 has an H shape.

[0124] As a result, compared with the case where the first connection portion 55 has a rectangular shape when viewed from the thickness direction, when load stress acts on the assembly sheet 1, it is possible to suppress the first connection portion 55 from being peeled off from the first metal supporting layer 20 and / or the second metal supporting layer 50. Thus, the frame 3 can stably support the suspension board with circuit 2.

[0125] In addition, if Figure 4 As shown in FIG. 1 , the first connection reinforcement portion 57 is disposed on the surface of the first connection portion 55C. Furthermore, the first connection reinforcement portion 57 is composed of two or more resin layers (the first reinforcement resin layer 57A and the second reinforcement resin layer 57B) stacked in the thickness direction. Therefore, the first connection portion 55C can be reinforced. As a result, when a load stress acts on the assembly sheet 1, damage to the first connection portion 55C can be suppressed.

[0126] Furthermore, since the first connection reinforcement portion 57 is composed of two or more resin layers, the first connection reinforcement portion 57 and the first connecting portion 55C can be smoothly cut during the manufacturing process of the suspension substrate with circuit 2, and the suspension substrate with circuit 2 can be smoothly cut off from the frame 3.

[0127] In addition, if Figure 1 As shown, the second connecting portion 6 connects the mutually adjacent suspension boards with circuits 2 among the plurality of suspension boards with circuits 2. Therefore, when a load stress acts on the assembly sheet 1, deformation of the assembly sheet 1 can be suppressed, and separation of the connecting portion 4 from the first metal supporting layer 20 and / or the second metal supporting layer 50 can be stably suppressed.

[0128] In addition, the second reinforcing portion 7 is arranged on the surface of the second connecting portion 6. Furthermore, the second reinforcing portion 7 is composed of two or more resin layers (the fifth reinforcing resin layer 7A and the sixth reinforcing resin layer 7B) stacked in the thickness direction. Therefore, the second connecting portion 6 can be sufficiently reinforced. As a result, when a load stress acts on the assembly sheet 1, damage to the second connecting portion 6 can be suppressed.

[0129] Furthermore, since the second reinforcing portion 7 is composed of two or more resin layers, the second reinforcing portion 7 and the second connecting portion 6 can be smoothly cut during the manufacturing process of the suspension substrate with circuit 2, and the suspension substrates with circuit 2 adjacent to each other can be smoothly cut apart.

[0130] <Modification>

[0131] In the above-mentioned embodiment, the first reinforcing portion 5 is composed of two or more resin layers stacked in the thickness direction, but the first reinforcing portion is not limited thereto. Fig. 7A and Figure 7B As shown in FIG. 1 , the first reinforcing portion 8 includes a first reinforcing wiring 8A as an example of a metal member and a first reinforcing resin layer 8B. Fig. 7A and Figure 7B In the figure, for the sake of convenience, the first reinforcement portion 8 is shown to reinforce the first connection portion 55C of the first connection portion 55, but the first reinforcement portion 8 may also reinforce the first connection portion 56C of the second connection portion 56.

[0132] The first reinforcing wiring 8A is arranged on the surface of one side in the thickness direction of the first connecting portion 55C. The first reinforcing wiring 8A extends in the longitudinal direction. The first reinforcing wiring 8A is made of the same metal as the conductor layer 22. The first reinforcing resin layer 8B is arranged on the surface of one side in the thickness direction of the first connecting portion 55 so as to cover the first reinforcing wiring 8A. The first reinforcing resin layer 8B has the same outer shape as the first connecting portion 55, and has an H shape when viewed from the thickness direction.

[0133] In addition, if Figure 7C As shown, the first reinforcing portion 8 may further include a second reinforcing resin layer 8C. The second reinforcing resin layer 8C is disposed on a surface on one side in the thickness direction of the first reinforcing resin layer 8B. When viewed from the thickness direction, the second reinforcing resin layer 8C has a rectangular shape extending in the length direction. When viewed from the thickness direction, the second reinforcing resin layer 8C overlaps with the first reinforcing wiring 8A. The second reinforcing resin layer 8C is formed of a resin material.

[0134] In the above-mentioned embodiment, the second reinforcing portion 7 is composed of two or more resin layers stacked in the thickness direction, but the second reinforcing portion is not limited thereto. Fig. 8AAs shown, the second reinforcing portion 9 includes a second reinforcing wiring 9A as an example of a metal member and a third reinforcing resin layer 9B.

[0135] The second reinforcing wiring 9A is arranged on the surface of one side in the thickness direction of the second connecting portion 6. The second reinforcing wiring 9A extends in the width direction. The second reinforcing wiring 9A is made of the same metal as the conductor layer 22. The third reinforcing resin layer 9B is arranged on the surface of one side in the thickness direction of the second connecting portion 6 so as to cover the second reinforcing wiring 9A. The third reinforcing resin layer 9B has the same outer shape as the second connecting portion 6, and has a rectangular shape extending in the width direction when viewed from the thickness direction.

[0136] In addition, if Figure 8B As shown, the second reinforcing portion 9 may further include a fourth reinforcing resin layer 9C. The fourth reinforcing resin layer 9C is disposed on a surface of one side in the thickness direction of the third reinforcing resin layer 9B. When viewed from the thickness direction, the fourth reinforcing resin layer 9C has a rectangular shape extending in the width direction. When viewed from the thickness direction, the fourth reinforcing resin layer 9C overlaps with the second reinforcing wiring 9A. The fourth reinforcing resin layer 9C is formed of a resin material.

[0137] In the above embodiment, the assembly sheet 1 includes a plurality of suspension boards with circuits 2, but the wiring circuit board support assembly of the present invention is not limited thereto. The wiring circuit board support assembly may also include one suspension board with circuits 2, a frame 3 supporting the one suspension board with circuits 2, and a connection portion 4 connecting the suspension board with circuits 2 and the frame 3.

[0138] In the above embodiment, the assembly sheet 1 includes the second connecting portion 6 and the second reinforcing portion 7, but the wired circuit board support assembly of the present invention is not limited thereto. The wired circuit board support assembly may not include the second connecting portion 6 and the second reinforcing portion 7.

[0139] In the above embodiment, the suspension board 2 with circuit is cited as an example of the wiring circuit board, but the wiring circuit board is not limited to the suspension board with circuit 2. The wiring circuit board may be a flexible printed circuit board with a reinforcement layer including the first metal supporting layer 20 as a reinforcement layer.

[0140] Such a modified example can also achieve the same effects as those of the above-described embodiment. In addition, the above-described embodiment and modified examples can be combined as appropriate.

[0141] In addition, the above invention is provided as an exemplary embodiment of the present invention, but this is only an example and the present invention should not be interpreted as being limitative. Modifications of the present invention that are obvious to those skilled in the art are included in the above claims.

Claims

1. A wiring circuit substrate support assembly, characterized in that: The wiring circuit substrate support assembly comprises: a wiring circuit substrate extending in a predetermined direction; a frame that supports the wiring circuit substrate; and a connecting portion connecting the wiring circuit substrate and the frame, the connecting portion being formed of a resin material, The wiring circuit substrate comprises: A first metal support layer; an insulating layer disposed on one side in the thickness direction of the first metal supporting layer; and a conductor layer disposed on one side of the insulating layer in the thickness direction, The frame body is composed of a second metal supporting layer arranged at a distance from the first metal supporting layer. The connecting portion comprises: a first portion disposed on one side surface in the thickness direction of the first metal supporting layer and extending in a width direction orthogonal to the length direction of the wiring circuit substrate; a second portion disposed on one side surface in the thickness direction of the second metal supporting layer and extending in the width direction, the second portion being disposed at a distance from the first portion in the length direction; and A first connecting portion connects a portion of the first portion in the width direction and a portion of the second portion in the width direction.

2. The wiring circuit board support assembly according to claim 1, characterized in that: The wiring circuit substrate support assembly further includes a first reinforcing portion, which is disposed on a surface of the first connecting portion and is used to reinforce the first connecting portion. The first reinforcing portion includes two or more resin layers stacked in the thickness direction and / or a metal member made of the same metal as the conductive layer.

3. The wiring circuit board support assembly according to claim 2, characterized in that: The first reinforcing portion is composed of two or more resin layers stacked in the thickness direction.

4. The wiring circuit board support assembly according to any one of claims 1 to 3, characterized in that: The wiring circuit substrate support assembly comprises: A plurality of the wiring circuit substrates are arranged at intervals from each other; a second connecting portion, which connects a portion of the insulating layer of one wiring circuit substrate and a portion of the insulating layer of another wiring circuit substrate in adjacent wiring circuit substrates among the plurality of wiring circuit substrates, the second connecting portion being formed of a resin material; and a second reinforcing portion, which reinforces the second connecting portion, The second reinforcing portion is disposed on the surface of the second connecting portion and includes two or more resin layers stacked in the thickness direction and / or a metal member made of the same metal as the conductor layer.

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